CN121444663A - 功率模块及其制造方法以及电力变换装置 - Google Patents

功率模块及其制造方法以及电力变换装置

Info

Publication number
CN121444663A
CN121444663A CN202380099867.4A CN202380099867A CN121444663A CN 121444663 A CN121444663 A CN 121444663A CN 202380099867 A CN202380099867 A CN 202380099867A CN 121444663 A CN121444663 A CN 121444663A
Authority
CN
China
Prior art keywords
conductive
pattern
conductive pattern
terminal
power module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380099867.4A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤悠策
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN121444663A publication Critical patent/CN121444663A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Inverter Devices (AREA)
CN202380099867.4A 2023-07-03 2023-07-03 功率模块及其制造方法以及电力变换装置 Pending CN121444663A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/024607 WO2025009015A1 (ja) 2023-07-03 2023-07-03 パワーモジュール及びその製造方法並びに電力変換装置

Publications (1)

Publication Number Publication Date
CN121444663A true CN121444663A (zh) 2026-01-30

Family

ID=94171879

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380099867.4A Pending CN121444663A (zh) 2023-07-03 2023-07-03 功率模块及其制造方法以及电力变换装置

Country Status (4)

Country Link
JP (1) JPWO2025009015A1 (https=)
CN (1) CN121444663A (https=)
DE (1) DE112023006608T5 (https=)
WO (1) WO2025009015A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469840B2 (ja) 2000-02-22 2003-11-25 株式会社三社電機製作所 半導体装置
JP5204744B2 (ja) * 2009-11-26 2013-06-05 三菱電機株式会社 電力用半導体装置
JP4870204B2 (ja) * 2009-12-17 2012-02-08 三菱電機株式会社 パワー半導体モジュール
JP2020178003A (ja) * 2019-04-17 2020-10-29 三菱電機株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
JP7574753B2 (ja) * 2021-07-05 2024-10-29 三菱電機株式会社 半導体装置および半導体装置の製造方法

Also Published As

Publication number Publication date
DE112023006608T5 (de) 2026-04-23
JPWO2025009015A1 (https=) 2025-01-09
WO2025009015A1 (ja) 2025-01-09

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