CN1213642C - Interlayer connecting method and apparatus - Google Patents
Interlayer connecting method and apparatus Download PDFInfo
- Publication number
- CN1213642C CN1213642C CN 02102247 CN02102247A CN1213642C CN 1213642 C CN1213642 C CN 1213642C CN 02102247 CN02102247 CN 02102247 CN 02102247 A CN02102247 A CN 02102247A CN 1213642 C CN1213642 C CN 1213642C
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- base plate
- metal liner
- printed circuit
- circuit board
- liner base
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Abstract
The present invention relates to a method and an apparatus for connecting a metal substrate board and a printed circuit board layer. The connecting method comprises the following steps: treating the surface of the metal substrate board before welding; putting the metal substrate board in a tray; then, positioning the printed circuit board and the metal substrate board through contraposition; pressing the printed circuit board; welding the printed circuit board and the metal substrate board by a welding apparatus; finally, cleaning the printed circuit board and the metal substrate board after welding and detecting welding quality. The apparatus comprises a tray, a pressing device and two rapid clamping devices, wherein the tray is used for placing the metal substrate board and the printed circuit board, the pressing device is used for pressing the printed circuit board, and the two rapid clamping devices are buckled with the tray and the pressing device and enable the pressing device to generate pressing force. The present invention enables the printed circuit board and the metal substrate board to be firmly and tightly connected and ensures good earthing and heat dissipation performance and reliability, and a micro strip circuit has low consumption. The clamping devices can ensure that the printed circuit board can be better combined with the metal substrate board in the process of welding between layers. Therefore, quality problems, such as unqualified welding, etc. are prevented, welding efficiency is improved, and welding cost is reduced.
Description
Technical field
The present invention relates to the interconnection technique of printed circuit board (PCB) and metallic plate in the electric equipment products, be specifically related to the method for attachment of metal liner base plate and printed circuit board (PCB) interlayer in a kind of circuit assembly technology, and be used for the equipment of described method of attachment.
Background technology
In the prior art, be ground connection and the heat dispersion that satisfies the power amplification veneer, a certain thickness metal liner base plate is fixed in requirement in the bottom surface of printed circuit board (PCB), make and form continuous ground connection between metal liner base plate and printed circuit board (PCB) (the being called for short PCB) ground plane, to reach good heat radiation and ground connection effect, satisfy the power amplifier performance requirement.
Industry has many measures and method for solving the ground connection and the heat dissipation problem of power amplifier printed circuit board (PCB) at present, and it is wherein a kind of adopting the method for screw printed circuit board (PCB) and metal liner base plate, and there is following shortcoming in this method:
(1) causes the consistency of radio-frequency (RF) power amplification circuit poor, reduce the power amplifier performance;
(2) strengthened the loss of microstrip circuit, the power amplifier performance is reduced;
(3) circuit ground and dispel the heat badly reduces the power amplifier performance;
(4) by a large amount of screws ground connection is installed, causes the size of printed circuit board (PCB) and power amplifier to strengthen;
(5) too much power amplifier is debugged and the screw installation procedure, causes production efficiency to reduce.
For solving the above weak point of screw fixation method, the external another kind of mode that generally adopts at present is that electrically and thermally conductive adhesive is bonding, promptly will be bonded together between printed circuit board (PCB) and the metal liner base plate with electrically and thermally conductive adhesive, no matter the bonding mode of electrically and thermally conductive adhesive is from the production efficiency aspect, still from ground connection heat dispersion aspect, mode than screw has all had improvement largely, but still has the following shortcoming that is difficult to overcome:
(1) loss of microstrip circuit is bigger, causes the power amplifier performance to be difficult to meet the demands;
(2) circuit ground and heat dispersion are undesirable, cause the power amplifier performance to be difficult to meet the demands;
(3) conducting resinl at high temperature uses for a long time, and its reliability is relatively poor;
(4) electrically and thermally conductive adhesive costs an arm and a leg, and has increased the production and processing cost.
Summary of the invention
The technical problem that the present invention will solve is, the method of attachment of a kind of metal liner base plate and printed circuit board (PCB) interlayer is provided, it is more firm tight to make the metal liner base plate combine with the interlayer of printed circuit board (PCB), can form continuous ground connection between metal liner base plate and the PCB ground level, to realize good heat radiation and ground connection effect, satisfy the power amplifier performance requirement;
Another technical problem that the present invention will solve is, a kind of welding equipment that uses with realizing above-mentioned method of attachment is provided, and can guarantee welding quality, improves welding efficiency, reduces welding cost.
Technical scheme provided by the invention is, a kind of metal liner base plate and the method for attachment of printed circuit board (PCB) interlayer are provided, and adopts the mode of welding to connect, and may further comprise the steps:
Pre-treatment is welded on metal liner base plate surface;
The metal liner base plate is placed pallet;
Again printed circuit board (PCB) and the contraposition of metal liner base plate are placed;
Printed circuit board (PCB) is exerted pressure;
Adopt welding equipment to weld; Clean and detect welding quality after the welding.
Welding equipment provided by the invention, comprise the pallet, the quick-gripping device that are used to place metal liner base plate and printed circuit board (PCB), it is characterized in that, comprise that also described quick-gripping device and described pallet and device for exerting are interlockingly connected to the device for exerting of printed circuit board (PCB) pressurization.
Employing interlayer solder technology realization metal liner base plate is connected with printed circuit board (PCB), has compared following advantage with other method of attachment:
(1) good ground connection heat dispersion and reliability have been guaranteed in firmly interlayer combination closely;
(2) loss of microstrip circuit is little, makes the power amplifier function admirable;
(3) need not equipment is carried out any technological transformation and investment, production efficiency height and integrated cost are low.
Can guarantee when carrying out the interlayer welding, can make printed circuit board (PCB) better with the matching used welding equipment of method of attachment, prevent and weld quality problems such as not in place, improve welding efficiency, reduce welding cost with combining of metal liner base plate.
Description of drawings
Fig. 1 is the metal liner base plate and structural representation after printed circuit board (PCB) is connected;
Fig. 2 is the structural representation of metal liner base plate;
Fig. 3 is the device structure schematic diagram of the present invention's use in method of attachment;
Fig. 4, Fig. 5 look and the side-looking structural representation for the master of device for exerting in the equipment shown in Figure 3;
Fig. 6, Fig. 7 are the plan structure schematic diagram of supporting bracket and guide plate in the device for exerting shown in Figure 4;
Fig. 8, Fig. 9, Figure 10, Figure 11 are the structural representation of alignment pin, stay pipe, briquetting and pad in the device for exerting shown in Figure 4;
Figure 12, Figure 13, Figure 14 for the master of pallet in the device structure shown in Figure 3 look with A-A, B-B to the TV structure schematic diagram;
Figure 15, Figure 16 look and the side-looking structural representation for the master of quick-gripping device in the equipment shown in Figure 3;
Figure 17 carries out the schematic diagram of interlayer welding for the present invention adopts the hot plate stove.
Embodiment
In the prior art, SMT is a kind of interconnected technology of circuit assembly, is usually used in the surface mount of components and parts.With the realization metal liner base plate of interlayer welding manner and being connected of printed circuit board (PCB) be reference to SMT thought, concrete way is: realize interconnected between the ground plane of printed circuit board (PCB) 2 and the metal liner base plate 4 with the high temperature tin cream, adopt the normal temperature tin cream to carry out the assembling of printed circuit board surface components and parts 1 then, structural representation after being illustrated in figure 1 as metal liner base plate 4 and printed circuit board (PCB) 2 being connected, wherein scolder 3 can be the high temperature tin cream of coating, perhaps typographic high temperature scolding tin also can be the prefabricated solder sheet for preparing with high-temperature solder in advance.
The structure of the welding equipment that provided by the invention and method of attachment is used as shown in Figure 3, in equipment, be provided with the pallet 7 that is used to place metal liner base plate 4 and printed circuit board (PCB) 2, device for exerting 6 to printed circuit board (PCB) 2 pressurizations, be interlockingly connected with pallet 7 and device for exerting 6, make device for exerting 6 produce two quick-gripping devices 5 of exerting pressure.
As Fig. 4, shown in Figure 5, device for exerting 6 adopts spring pressing formula structures, and its benefit is: can equalizing pressure and the gas that produces when discharging welding.This device for exerting comprises the support base plate 63 that be arranged in parallel, guide plate 61, supporting the corresponding respectively a plurality of equally distributed pads hole 631 that is provided with on base plate 63 and the guide plate 61,611, air-vent 634,613, support structure such as Fig. 6 of base plate 63 and guide plate 61, shown in Figure 7, on the periphery that supports base plate 63 and guide plate 61, be provided with location hole 632,612, in pad hole 611, be provided with the pad 64 that is set in these two holes in 631, the structure of pad 64 as shown in figure 11, on pad 64, be provided with fastener 642, and on the pad 64 between this fastener 642 and the guide plate 61, be arranged with spring 641, fastener hole 632 places on the dual-side that supports seat board 63 are provided with briquetting 65, the structure of briquetting 65 as shown in figure 10, on briquetting 65, be provided with clamping slot 651 and the connecting hole 652 suitable with quick-gripping device 5, be provided with stay pipe 62 at all the other fastener hole places, the structure of stay pipe 62 as shown in Figure 9, on support base plate 63, also be provided with registration holes 633, in registration holes 633, be provided with alignment pin 635 as shown in Figure 8.Because spring 641 fastens between the fastener 642 and guide plate 61 of pad 64, so pad 64 can be adjusted pressure automatically.
In above-mentioned device for exerting, pad 64 adopts metal material to make; That guide plate 61 plays is fastening, 64 motions of restriction pad and ventilative effect, and guide plate 61 adopts metal materials to make, and black oxidation is carried out on its surface handle.
Support base plate 63 and play the role of fastening, can limit pad 64 motions, be convenient to printed substrate location and ventilative effect, the material that supports base plate 63 can adopt metal material to make, and the surface is carried out black oxidation and handled.
Pad hole 611,631 and air-vent 613,634 adopt the staggered mode of matrix form to be provided with, as Fig. 6, shown in Figure 7; Be arranged on two location holes 633 that support on the base plate 63, can select to determine its position according to the location hole on the metal liner base plate 41,42;
The manufacturing materials of alignment pin 635 is a metal material, and it is fastening that upper part adopts screw thread and nut form to carry out, and the trip bolt that connects usefulness is a sunk screw.
The manufacturing materials of stay pipe 62 is a metal material, and the surface is carried out black oxidation and handled.
Because device for exerting 6 has adopted spring pressing formula, when therefore this device for exerting 6 places on the printed circuit board (PCB) 2, be directly to apply pressure to printed circuit board (PCB) 2 by pad 64, more owing on the pad 64 spring 641 is arranged, so because the elastic reaction of spring 641, the compression point of 64 pairs of printed circuit board (PCB)s 2 of pad can be adjusted pressure automatically; In welding process, if printed circuit board (PCB) 2 certain part are owing to distortion when tilting upward, the pad 64 that can promote to exert pressure moves up, and pad 64 move up can compression spring 641, so exerting pressure of pad 64 will become big, this part of exerting pressure on the printed circuit board (PCB) 2 is flattened.Secondly do not have direct contact print circuit board 2 owing to support base plate 63,, guarantee welding quality so when welding, can discharge gas.
The structure of pallet 7 such as Figure 12,13, shown in 14, be provided with square bearer 71, be provided with the metal backing holder limit 78 that falls in the square bearer 71, on two diagonal angles on holder limit, be provided with alignment pin 72, be convenient to the location of metal liner base plate 4, the outside on two vertical limits of framework 71 is arranged with two projections 73,74,75,76, the open slot 741 that is provided with in the projection and asks the limit to parallel, 751, be convenient to be connected with quick-gripping device 5, vertically also being provided with at least one and the parallel screw in holder limit on the limit, be provided with in the screw and can withstand on the trip bolt 77 that is positioned at metal liner base plate 4 sides on the holder limit.
The structure of quick-gripping device 5 such as Figure 15, shown in 16, be provided with supporting seat 51, supporting seat 51 is provided with symmetrically arranged pin-and-hole, on pin-and-hole, be provided with supporting seat 51 hinged pressure head 54 and connecting rod 52, constitute one four connecting rod clamping device with connecting rod 52 and pressure head 54 hinged operating grips 53 respectively, be provided with the supporting seat limit 511 that to insert in the tray openings groove in the bottom of supporting seat 51,512, and the end pressure head 54 of operating grip 53 can insert in the briquetting clamping slot 651 in the device for exerting, after quick-gripping device 5 and pallet 7 and device for exerting 6 snappings are good, when pressing handle 53 1 ends, pressure head 54 can make the pad 64 in the device for exerting 6 produce downward pressure, can make printed circuit board (PCB) 2 be close on the metal liner base plate 4, guarantee welding reliability.
Metal liner base plate 4 can select for use metal material to make, for solving the solderability problem of metal liner base plate 4, can carry out surperficial solderability to it handles, for ease of locating with printed circuit board (PCB) and welding equipment, be equipped with two location holes 41,42,43,44 thereon on the following diagonal, as shown in Figure 2.
When the operation welding equipment welds, earlier metal liner base plate 4 is placed on according to the location hole mode in the pallet 7 of equipment, fastening with trip bolt; At metal liner base plate 4 surface seal tin; Printed circuit board (PCB) 2 also is placed on the metal liner base plate 4 according to the location hole mode; The mode of device for exerting 6 according to location hole is placed on the printed circuit board (PCB) 2, exerts pressure at device for exerting 6 and pallet 7 both sides with quick-gripping device 5; Crossing reflow ovens welds; Welded back clamper for disassembling (comprising device for exerting, pallet, quick-gripping device etc.); Welding the back with ultrasonic drilling machine cleans; Detect welding quality.
By method of attachment provided by the invention, can adopt following technological process to realize:
Face of weld to metal liner base plate 4 welds pre-treatment earlier; Metal liner base plate 4 and printed circuit board (PCB) 2 contrapositions are stacked, and place pallet 7 simultaneously; Adopt welding equipment provided by the invention that printed circuit board (PCB) 2 is exerted pressure; Weld by reflow soldering equipment; After the reflow soldering metal liner base plate 4 and printed circuit are cleaned 2, remove residual scaling powder in surface and the hole; Interlayer solder bond rate between printed circuit board (PCB) 2 and the metal liner base plate 4 is detected, guarantee the ground connection heat dispersion that metal underboarding 4 and printed circuit board (PCB) 2 are good.
Above-mentioned metal liner base plate surface is carried out in the operation of pre-welding treatment, comprise the solderability processing, printing the high temperature tin cream on the solder side of metal liner base plate 4.
Metal liner base plate 4 surfaces are carried out in the pre-welding treatment operation, can also be after the solderability processing is carried out on metal liner base plate 4 surfaces, to realize being welded to connect in the method for scalding scolding tin on the solder side, on the two sides of metal liner base plate 4 location hole are set respectively.
In above-mentioned welding method, can also adopt the method for placing the scolding tin prefabricated film to realize at the solder side of metal liner base plate 4, its step is for after putting into pallet 7 with metal liner base plate 4, after placing the scolding tin prefabricated film on its solder side, place printed circuit board (PCB) 2 again and be welded to connect.
In above-mentioned welding method, except that adopting reflow ovens, can also adopt hot plate stove 8 as shown in figure 17 to weld.
The present invention can be used as the solution of any high power device ground connection heat dissipation problem in the circuit assembly industry.Adopt interlayer solder technology processing metal substrate printed circuitry plate, when improving power amplifier performance and veneer reliability, also cost-saved, raise the efficiency.
Claims (9)
1, the interlayer connecting method of a kind of metal liner base plate and printed circuit board (PCB) is that the method for welding between the bottom surface of printed circuit board (PCB) and the metal liner base plate is interconnected, may further comprise the steps:
Pre-treatment is welded on metal liner base plate surface;
Metal liner base plate and printed circuit board (PCB) contraposition being stacked, and place pallet simultaneously, is to connect by screw between described pallet and the metal liner base plate, just pallet can be separated with the metal liner base plate after promptly connecting between complete layer;
Printed circuit board (PCB) is exerted pressure;
Adopt reflow ovens to weld.
2, according to described metal liner base plate of claim 1 and the method for attachment of printed circuit board (PCB) interlayer, it is characterized in that, described metal liner base plate surface is carried out may further comprise the steps in the pre-welding treatment step: solderability is carried out on metal liner base plate surface handle; Printing the high temperature tin cream on the solder side.
3, according to described metal liner base plate of claim 1 and the method for attachment of printed circuit board (PCB) interlayer, it is characterized in that, describedly the pre-welding treatment step is carried out on metal liner base plate surface may further comprise the steps: solderability is carried out on metal liner base plate surface handle, place the scolding tin prefabricated film at the solder side of metal liner base plate.
4, according to described metal liner base plate of claim 1 and the method for attachment of printed circuit board (PCB) interlayer, it is characterized in that, describedly the pre-welding treatment step is carried out on metal liner base plate surface may further comprise the steps: solderability is carried out on metal liner base plate surface handle; Scalding scolding tin on the solder side.
5, a kind of equipment that is used for the interlayer welding, comprise the pallet that is used to place metal liner base plate and printed circuit board (PCB), quick-gripping device, it is characterized in that, also comprise device for exerting to the printed circuit board (PCB) pressurization, described quick-gripping device respectively with described pallet and device for exerting snapping, be to connect between described pallet and the metal liner base plate by screw, just pallet can be separated with the metal liner base plate after promptly between complete layer, connecting.
6, according to the described equipment that is used for the interlayer welding of claim 5, it is characterized in that, described pallet comprises and is provided with the metal liner base plate holder limit that falls in square bearer, the described square bearer, on two diagonal angles on holder limit, be provided with alignment pin, the outside on two vertical limits of described tank bracket is arranged with two projections, be provided with the open slot that parallels with described holder limit in the described projection, on described vertical limit, also be provided with at least one and the parallel screw in described holder limit, be provided with the trip bolt that can withstand on the metal liner base plate side that is positioned on the described holder limit in the described screw.
7, according to the described equipment that is used for the interlayer welding of claim 5, it is characterized in that, described device for exerting is a kind of spring pressing formula device for exerting, comprise upper and lower parallel guide plate and support base plate, put between this guide plate and this support base plate briquetting and a plurality of perpendicular to this support base plate is arranged, and the pad of this guide plate and this support base plate is stretched out at its two ends respectively, and this pad is provided with fastener, is with spring on this pad between this fastener and the described guide plate.
8, according to the described equipment that is used for the interlayer welding of claim 7, it is characterized in that, on described briquetting, be provided with the clamping slot suitable, on the periphery of described guide plate and support base plate, be provided with stay pipe, also be provided with location hole on the described support base plate with quick-gripping device.
9, according to the described equipment that is used for the interlayer welding of claim 5, it is characterized in that, described quick-gripping device comprise supporting seat, with hinged pressure head and the connecting rod of described supporting seat, constitute one four connecting rod clamping device with described connecting rod and the hinged operating grip of pressure head respectively, be provided with the supporting seat limit that to insert in the tray openings groove in the bottom of described supporting seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02102247 CN1213642C (en) | 2002-01-26 | 2002-01-26 | Interlayer connecting method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02102247 CN1213642C (en) | 2002-01-26 | 2002-01-26 | Interlayer connecting method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1436033A CN1436033A (en) | 2003-08-13 |
| CN1213642C true CN1213642C (en) | 2005-08-03 |
Family
ID=27627498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02102247 Expired - Lifetime CN1213642C (en) | 2002-01-26 | 2002-01-26 | Interlayer connecting method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1213642C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102837099A (en) * | 2011-06-21 | 2012-12-26 | 北京同方吉兆科技有限公司 | Assembly device for welding circuit board and heat sinking base plate and welding method thereof |
| CN103096640B (en) * | 2011-11-03 | 2015-10-28 | 深南电路有限公司 | A kind of processing method of metal base circuit board and processing print tin tool thereof |
| CN103567683A (en) * | 2012-07-18 | 2014-02-12 | 西安永电电气有限责任公司 | Positioning tool for chip welding |
| CN105880823B (en) * | 2016-05-30 | 2018-07-27 | 重庆航伟光电科技有限公司 | Optical fiber welding 4PIN heating platens |
| CN105855782B (en) * | 2016-06-03 | 2018-11-09 | 上海福宇龙汽车科技有限公司 | A kind of turnover welding fixture |
| CN107971602B (en) * | 2017-12-28 | 2023-09-12 | 北京北广科技股份有限公司 | Metal substrate circuit board welding tool and application method thereof |
| CN110605452B (en) * | 2018-09-30 | 2021-09-03 | 中航光电科技股份有限公司 | Radio frequency contact piece reflow soldering frock |
| CN109640532A (en) * | 2019-01-29 | 2019-04-16 | 深圳光韵达光电科技股份有限公司 | A kind of FPC jig production method |
-
2002
- 2002-01-26 CN CN 02102247 patent/CN1213642C/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| CN1436033A (en) | 2003-08-13 |
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Effective date of registration: 20210429 Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee after: Honor Device Co.,Ltd. Address before: 518057 No. 1, FA FA Road, Nanshan District science and Technology Park, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |
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Granted publication date: 20050803 |