CN121175767A - 磁性浆料、电路部件、电路部件的制造方法 - Google Patents

磁性浆料、电路部件、电路部件的制造方法

Info

Publication number
CN121175767A
CN121175767A CN202480028485.7A CN202480028485A CN121175767A CN 121175767 A CN121175767 A CN 121175767A CN 202480028485 A CN202480028485 A CN 202480028485A CN 121175767 A CN121175767 A CN 121175767A
Authority
CN
China
Prior art keywords
magnetic
slurry
peak
mass
magnetic powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480028485.7A
Other languages
English (en)
Chinese (zh)
Inventor
米仓元气
有福征宏
浦岛航介
根本广明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN121175767A publication Critical patent/CN121175767A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Soft Magnetic Materials (AREA)
CN202480028485.7A 2023-05-26 2024-04-10 磁性浆料、电路部件、电路部件的制造方法 Pending CN121175767A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023086804 2023-05-26
JP2023-086804 2023-05-26
PCT/JP2024/014583 WO2024247505A1 (ja) 2023-05-26 2024-04-10 磁性ペースト、回路部材、回路部材の製造方法

Publications (1)

Publication Number Publication Date
CN121175767A true CN121175767A (zh) 2025-12-19

Family

ID=93657737

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480028485.7A Pending CN121175767A (zh) 2023-05-26 2024-04-10 磁性浆料、电路部件、电路部件的制造方法

Country Status (4)

Country Link
JP (1) JPWO2024247505A1 (https=)
CN (1) CN121175767A (https=)
TW (1) TW202447655A (https=)
WO (1) WO2024247505A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7463736B2 (ja) * 2020-01-24 2024-04-09 味の素株式会社 樹脂組成物
JP7700054B2 (ja) * 2020-02-05 2025-06-30 富士フイルム株式会社 磁性粒子含有組成物、磁性粒子含有膜及び電子部品
JP2022064864A (ja) * 2020-10-14 2022-04-26 味の素株式会社 磁性ペースト
JPWO2022202220A1 (https=) * 2021-03-26 2022-09-29

Also Published As

Publication number Publication date
TW202447655A (zh) 2024-12-01
JPWO2024247505A1 (https=) 2024-12-05
WO2024247505A1 (ja) 2024-12-05

Similar Documents

Publication Publication Date Title
TWI793282B (zh) 通孔用填充糊
CN113165063B (zh) 磁性糊料
JP7740262B2 (ja) ペースト
CN111937501A (zh) 固化性树脂组合物、其固化物和印刷电路板
TWI850353B (zh) 樹脂組成物
CN117120553B (zh) 固化性树脂组合物
TWI858040B (zh) 包含磁性粉體之樹脂組成物
CN112992455B (zh) 磁性糊料
KR20220036876A (ko) 수지 조성물
CN121175767A (zh) 磁性浆料、电路部件、电路部件的制造方法
CN121175766A (zh) 磁性浆料、电路部件、电路部件的制造方法
CN118599261A (zh) 树脂组合物
JP2017101140A (ja) 樹脂組成物および該樹脂組成物からなる層を有する半導体装置
JP2005320479A (ja) 液状エポキシ樹脂組成物
WO2025110186A1 (ja) 磁性組成物、磁性膜、積層体及び回路部材
WO2025110184A1 (ja) 磁性組成物、磁性膜、積層体及び回路部材
WO2025110185A1 (ja) 磁性組成物、磁性膜、積層体及び回路部材
JP6006539B2 (ja) 回路基板及び電子部品搭載基板
CN118725516A (zh) 固化性树脂组合物和使用固化性树脂组合物的印刷布线基板的制造方法
JP2022166615A (ja) 配線基板の製造方法
JP2025087510A (ja) 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含むプリント配線板
WO2025205013A1 (ja) 磁性ペースト、回路部材及び回路部材の製造方法
JP2022146468A (ja) 造粒粉末、及びボンド磁石の製造方法
CN118599260A (zh) 树脂组合物
CN118633132A (zh) 磁性糊料

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination