CN120813472A - 层叠压电体及其制造方法 - Google Patents

层叠压电体及其制造方法

Info

Publication number
CN120813472A
CN120813472A CN202480015424.7A CN202480015424A CN120813472A CN 120813472 A CN120813472 A CN 120813472A CN 202480015424 A CN202480015424 A CN 202480015424A CN 120813472 A CN120813472 A CN 120813472A
Authority
CN
China
Prior art keywords
piezoelectric body
laminated piezoelectric
film
piezoelectric
hard coat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480015424.7A
Other languages
English (en)
Chinese (zh)
Inventor
今治诚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kureha Corp
Original Assignee
Kureha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kureha Corp filed Critical Kureha Corp
Publication of CN120813472A publication Critical patent/CN120813472A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
    • H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/098—Forming organic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
CN202480015424.7A 2023-03-24 2024-03-21 层叠压电体及其制造方法 Pending CN120813472A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023048031 2023-03-24
JP2023-048031 2023-03-24
PCT/JP2024/010932 WO2024203685A1 (ja) 2023-03-24 2024-03-21 積層圧電体及びその製造方法

Publications (1)

Publication Number Publication Date
CN120813472A true CN120813472A (zh) 2025-10-17

Family

ID=92905015

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480015424.7A Pending CN120813472A (zh) 2023-03-24 2024-03-21 层叠压电体及其制造方法

Country Status (5)

Country Link
EP (1) EP4691758A1 (https=)
JP (1) JPWO2024203685A1 (https=)
CN (1) CN120813472A (https=)
TW (1) TWI889249B (https=)
WO (1) WO2024203685A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010026938A (ja) 2008-07-23 2010-02-04 Daikin Ind Ltd タッチパネル
EP3216596A1 (en) 2014-12-17 2017-09-13 Mitsui Chemicals, Inc. Laminated body
JP7050469B2 (ja) * 2017-11-21 2022-04-08 日東電工株式会社 圧電フィルムおよび圧電センサ
KR20220140840A (ko) * 2020-04-02 2022-10-18 가부시끼가이샤 구레하 적층 필름, 그의 제조 방법 및 이용
EP4238763A4 (en) * 2020-10-30 2024-04-10 Kureha Corporation Piezoelectric film, touch panel, and piezoelectric film manufacturing method
JP2023048031A (ja) 2021-09-27 2023-04-06 Toto株式会社 衛生陶器
KR102814226B1 (ko) * 2021-10-22 2025-05-28 가부시끼가이샤 구레하 투명 도전 압전 필름, 디바이스 및 투명 도전 압전 필름의 제조방법

Also Published As

Publication number Publication date
JPWO2024203685A1 (https=) 2024-10-03
TW202506427A (zh) 2025-02-16
EP4691758A1 (en) 2026-02-11
WO2024203685A1 (ja) 2024-10-03
TWI889249B (zh) 2025-07-01

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