CN120629862A - Signal acquisition device and semiconductor testing equipment - Google Patents

Abstract

The present application relates to the field of semiconductor testing technology and provides a signal acquisition device and semiconductor testing equipment. The signal acquisition device includes a test circuit board, a carrier, and an acquisition assembly. The carrier is provided with a bearing portion for limiting the position of the module under test; the acquisition assembly includes a first acquisition probe and a second acquisition probe, both of which include a crimping end and a transmission end. The two transmission ends are connected in parallel to the test circuit board, and the ends of the two crimping ends are arranged relative to each other. The signal acquisition device provided by the present application forms a double protection by crimping the first and second acquisition probes arranged oppositely and spaced apart to the opposite side walls of the pin, thereby reducing the risk of misjudgment caused by poor contact between the probe and the pin.

Description

Signal acquisition device and semiconductor test equipment

Technical Field

The present application relates to the field of semiconductor testing technologies, and in particular, to a signal acquisition device and a semiconductor testing apparatus.

Background

IGBT (Insulated Gate Bipolar Transistor) Chinese fully called insulated gate bipolar transistor is a high-performance composite fully controlled power semiconductor device. When the IGBT test is carried out, the probes are in contact conduction with pins of the IGBT so as to collect electric signals and further meet the reactive aging test.

However, since the reactive aging test of the IGBT is generally performed under a high temperature and high humidity environment, the oxidation reaction of the pins on the IGBT is easy to occur, and an oxide layer is attached to the surfaces of the pins. Due to the existence of the oxide layer, the contact between the probe and the pin is poor, and the risk of misjudgment is caused.

Disclosure of Invention

Based on this, it is necessary to provide a signal acquisition device, through the relative and interval arrangement first collection probe and second collection probe respectively with pin relative both sides wall press fit to form dual protection, and then reduced the misjudgement risk that leads to because of probe and pin poor contact.

The signal acquisition device comprises a test circuit board, a carrying disc and an acquisition assembly, wherein the carrying disc is provided with a carrying part for limiting a tested module, the acquisition assembly comprises a first acquisition probe and a second acquisition probe, the first acquisition probe and the second acquisition probe comprise a crimping end and a transmission end, the two transmission ends are connected in parallel with the test circuit board, and the end parts of the two crimping ends are oppositely arranged.

It can be understood that, because the two transmission ends are connected in parallel to the test circuit board, namely, the first acquisition probe and the second acquisition probe are connected in parallel to the test circuit board, the first acquisition probe and the second acquisition probe can be oppositely arranged through the corresponding crimping ends respectively, so that the two opposite side walls of the pin can be in crimping fit respectively, and the detection signal can be transmitted to the test circuit board through the transmission ends. Such setting is equivalent to utilizing first collection probe and second collection probe to form dual protection, even if one of them collection probe and the poor problem of contact appear in pin, also can pass through another collection probe transmission collection signal, reduces erroneous judgement risk.

In some of these embodiments, at least one of the crimp ends is provided with a piercing portion.

In some embodiments, the collection assembly further comprises a conducting structure, and the transmission end of the first collection probe and/or the transmission end of the second collection probe are/is connected with the conducting structure and connected with the test circuit board through the conducting structure.

In some embodiments, the conducting structure comprises a conducting strip and a conducting probe, wherein the conducting strip is arranged on the carrier disc and can be connected with the first collecting probe or the second collecting probe in a conducting manner, one end of the conducting probe is connected with the test circuit board, and the other end of the conducting probe can be in press fit with the conducting strip.

In some of these embodiments, the diameter of the pass-through probe is greater than the diameter of the first acquisition probe and the diameter of the second acquisition probe.

In some embodiments, the end part of the conducting probe, which faces the conducting strip, is provided with a plurality of signal acquisition parts which are arranged at intervals along the circumferential direction of the conducting probe.

In some embodiments, the carrier plate is provided with an assembly groove near the bearing part, the conducting bar is at least partially accommodated in the assembly groove, and the collecting assembly further comprises a fastening structure connected to the conducting bar and the carrier plate and used for locking the conducting bar to the carrier plate.

In some embodiments, the collection assemblies are provided with a plurality of groups and are arranged at intervals along a first direction, and the first direction is the arrangement direction of pins on the tested module.

In some embodiments, the carrier plate is provided with a plurality of terminal support blocks at the edge of the carrying part, and the plurality of terminal support blocks are arranged at intervals along the circumferential direction of the carrying part.

The application also provides semiconductor test equipment for testing the semiconductor power module, which comprises an upper computer and the signal acquisition device, wherein a test circuit board in the signal acquisition device is electrically connected with the upper computer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic diagram of a part of a signal acquisition device carrying a module under test according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a signal acquisition device according to an embodiment of the present application;

FIG. 3 is a partial cross-sectional view of a signal acquisition device according to an embodiment of the present application;

FIG. 4 is an enlarged view of a portion of FIG. 3 at A;

FIG. 5 is a partial cross-sectional view of a signal acquisition device carrying a module under test according to an embodiment of the present application;

FIG. 6 is a partial enlarged view at B in FIG. 5;

FIG. 7 is a schematic diagram of a signal acquisition device according to another embodiment of the present application;

fig. 8 is a partial enlarged view at C in fig. 7.

The device comprises the following components of 10, a carrying disc, 20, a collecting assembly, 21, a first collecting probe, 22, a second collecting probe, 23, a conducting structure, 24, a fastening structure, 100, a signal collecting device, 101, a carrying part, 102, an assembling groove, 103, a gasket, 104, a partition board, 105, a terminal supporting block, 200, a tested module, 201, a crimping end, 202, a transmission end, 203, a penetrating part, 210, a terminal, 211, a positive terminal, 212, a negative terminal, 213, a three-phase terminal, 220, a pin, 221, a pin top, 222, a pin bottom, 231, a conducting strip, 232, a conducting probe, 241, a pressing plate, 242, a fastening piece, 243, a locating pin, 1011, a through hole, 1012, a carrying table, 1051, a positive terminal supporting block, 1052, a negative terminal supporting block, 1053, a three-phase terminal supporting block, 2011, a first crimping end, 2012, a second crimping end, 2021, a first transmission end, 2, a second transmission end, 2321 and a signal collecting part.

Detailed Description

In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and the like are used in the description of the present application for the purpose of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" on a second feature may be that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through intermedial media. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used in the description of the present application includes any and all combinations of one or more of the associated listed items.

With the increasing demand for semiconductor power modules, the variety of semiconductor power modules is also increasing. In view of the safety of use of the semiconductor power module, a plating process is generally performed on the pins. However, it is the provision of the plating layer that results in poor solderability of the pins. For example, some coatings may have components that segregate during the heat treatment prior to welding, or the weld cross-section may form an intermetallic layer that is too thick or brittle, severely affecting the mechanical strength and reliability of the weld. Meanwhile, the plating layer can also cause the resistance to be obviously increased when the pins are contacted with an external connector, a PCB bonding pad or a busbar, and extra power loss and heat are generated. Moreover, if the plating layer is uneven, local oxidation occurs on the pins, and then a local overheating problem occurs. In addition, the plating requires more complex electroplating processes and more stringent process requirements, and there is also a certain requirement on material properties, which in turn leads to increased plating costs.

Although the above problems exist in the whole plating treatment of the pins, if bare copper is directly used as the pins, when the reactive aging test is performed on the semiconductor power module, the reactive aging test needs to be performed in a high-temperature and high-humidity environment, so that oxidation reaction is easily generated on the surfaces of the bare copper, and an oxide layer is attached to the surfaces of the pins. Due to the existence of the oxide layer, the contact between the probe and the pin is poor, so that misjudgment risks are caused, and the testing precision is seriously affected.

In view of this, an embodiment of the present application provides a signal acquisition device, in which a first acquisition probe and a second acquisition probe, which are arranged oppositely and at intervals, are respectively press-fitted with opposite side walls of a pin, so as to form dual protection, thereby reducing the risk of misjudgment caused by poor contact between the probe and the pin. The signal acquisition device is described in detail below.

Referring to fig. 1-6, an exemplary signal acquisition device 100 includes a test circuit board, a carrier platter 10, and an acquisition assembly 20. The carrier tray 10 is provided with a carrying portion 101 for limiting the module 200 to be tested. The collection assembly 20 includes a first collection probe 21 and a second collection probe 22, both of which include crimp ends 201 and transmission ends 202, the two transmission ends 202 being connected in parallel to the test circuit board, the ends of the two crimp ends 201 being disposed opposite each other.

The first collecting probe 21 corresponds to a first press-connection end 2011 and a first transmission end 2021, the second collecting probe 22 corresponds to a second press-connection end 2012 and a second transmission end 2022, the first transmission end 2021 and the second transmission end 2022 are electrically connected to the test circuit board, and the first press-connection end 2011 and the second press-connection end 2012 are used for contacting the pin 220. During testing, the first compression end 2011 and the second compression end 2012 can collect electrical signals on the pins 220 and transmit to the test circuit board via the first transmission end 2021 and the second transmission end 2022, respectively. Since the first transmission end 2021 and the second transmission end 2022 are both connected in parallel to the test circuit board, it is equivalent to that the first acquisition probe 21 and the second acquisition probe 22 are connected in parallel to the test circuit board, so that the test circuit board can receive two test signals, and any bad contact of one path of the test signals does not affect the other path of the test signals. Moreover, since the end of the first crimp end 2011 and the end of the second crimp end 2012 are disposed opposite to each other, they can be press-fitted to opposite side walls of the pin 220 of the module under test 200. For example, the lead 220 has a first side wall and a second side wall disposed opposite to each other in the thickness direction thereof, the first crimp end 2011 is press-fitted to the first side wall, and the second crimp end 2012 is press-fitted to the second side wall.

That is, the first and second collection probes 21 and 22 collect test signals from two different sidewalls of the pin 220, respectively, and transmit the test signals to the test circuit board, which can determine the performance of the tested module 200 according to the two test signals. That is, the first collecting probe 21 and the second collecting probe 22 are used to collect signals from two surfaces of the same pin, so as to form double protection, if the contact is good, the two signals collected theoretically are the same, but if one of the two signals is in poor contact with the pin 220, the corresponding test signal cannot be received or the test signal is wrong, the test judgment can be performed based on the test signal of the other one, and the risk of test failure or misjudgment caused by the poor contact between one of the two probes and the pin is effectively avoided. In addition, the bearing part 101 on the carrier disc 10 can accurately limit the tested module 200, so that the stability and accuracy of the tested module 200 in the testing process are ensured, and the testing efficiency and accuracy are further effectively improved.

When the signal acquisition device 100 is used in the reactive aging test of a semiconductor power module, the semiconductor power module is placed and limited on the bearing part 101, the first acquisition probe 21 and the second acquisition probe 22 are respectively in press fit with two opposite side walls on the pin 220 along the vertical direction, and the two side walls are respectively a pin top 221 and a pin bottom 222. If the oxide layer appears on the top 221 of the pin, the test signal collected by the collection probe matched with the bottom 222 of the pin can be used for judging, so that the risk of misjudgment is reduced.

In the reactive aging test of the semiconductor power module, the carrier plate 10 is usually carried on a water cooling plate to dissipate heat generated in the test process of the semiconductor power module, reduce faults caused by overheating, and maintain the semiconductor power module undamaged. Thus, the bottom of the leads 222 is more susceptible to oxidation than the top of the leads 221. Therefore, a plating layer can be arranged at the bottom 222 of the pin, and bare copper at the top 221 of the pin is reserved, so that the semiconductor power module is convenient to weld, transmit electric signals and the like in the subsequent use process.

Referring to fig. 5 and 6, therefore, during testing of the semiconductor power module, one of the first and second collection probes 21 and 22 can be press-fit with the plating layer of the bottom portion 222 of the lead to collect one test signal, and the other one can be press-fit with the bare copper of the top portion 221 of the lead to collect another test signal. At this time, if the oxide layer appears on the top 221 of the pin to affect the testing accuracy, the testing signal corresponding to the bottom 222 of the pin can be used to reduce the risk of erroneous judgment.

As shown in fig. 3-6, in some specific embodiments, the thickness direction of the carrier platter 10 is the Z-axis direction, i.e., the vertical direction. The first collecting probe 21 and the second collecting probe 22 are oppositely and alternately arranged along the thickness direction of the carrier disc 10, so that the end parts of the corresponding crimping ends 201 are oppositely arranged, and the respective test signal collection is realized. At this time, the first transmission end 2021 is located at an end of the first crimp end 2011 facing away from the second crimp end 2012, and the second transmission end 2022 is located at an end of the second crimp end 2012 facing away from the first crimp end 2011.

For example, the first acquisition probe 21 is located above the second acquisition probe 22, and the first acquisition probe 21 is also movable in the Z-axis direction relative to the second acquisition probe 22. Before collection, the first collection probe 21 is spaced apart from the second collection probe 22 along the Z-axis direction, so that the module to be tested 200 is advantageously placed on the carrier plate 10. When the tested module 200 is limited on the bearing part 101, the bottom 222 of the pin of the tested module 200 contacts with the second collecting probe 22, and the second collecting probe 22 moves downwards along the Z-axis direction to be close to the top 221 of the pin.

Alternatively, both the first pick probe 21 and the second pick probe 22 may be moved in the Z-axis direction relative to the carrier plate 10 to move closer to or farther from the pin top 221 and the pin bottom 222. This is by way of example only.

Referring to fig. 3-6, in some embodiments, at least one crimp end 201 is provided with a piercing portion 203.

For example, it may be that the first pick probe 21 is press fit with the pin top 221 through the first press fit end 2011 and the second pick probe 22 is press fit with the pin bottom 222 through the second press fit end 2012. The end of the first crimp end 2011 is provided with a piercing portion 203, so that the piercing portion 203 is convenient to pierce the oxide layer of the top 221 of the pin, and then the oxide layer is in direct contact with the bare copper. Meanwhile, since the bottom 222 of the pin is provided with the plating layer, the second press-connection end 2012 does not need to be provided with the piercing part 203, and the second press-connection end 2012 is directly press-connected with the plating layer, so that the test signal collection can be satisfied, the plating layer can not be damaged, and the bottom 222 of the pin is prevented from being oxidized in the test process. Wherein, the tip of second crimping end 2012 is the sphere setting, and the surface is smooth, reduces the wearing and tearing to the cladding material.

Alternatively, the end of the first compression joint end 2011 and the end of the second compression joint end 2012 are both provided with piercing portions 203, and at this time, the two piercing portions 203 can pierce through the oxide layers on the pins 220 of the tested module 200 respectively, so as to ensure normal collection of the test signals.

Wherein, the piercing part 203 comprises a plurality of conical spines which are arranged at intervals along the circumferential direction of the crimping end 201, so as to improve the piercing effect.

As shown in fig. 1 and 2, in some embodiments, the collection assemblies 20 are provided with multiple groups and are arranged at intervals along a first direction, where the first direction is the direction in which the pins 220 on the tested module 200 are arranged. It will be appreciated that the module under test 200 is typically provided with a plurality of pins 220 spaced apart, each pin 220 being usable for reactive burn-in testing. Therefore, with the plurality of groups of collection assemblies 20 arranged along the arrangement direction of the pins 220 of the tested module 200, each pin 220 can be tested, or alternatively, can be in press fit with some pins 220 to realize testing.

As shown in fig. 1 and 2, in some specific embodiments, the carrier tray 10 is provided with a plurality of carrying portions 101 arranged at intervals or adjacently along the first direction, and each carrying portion 101 corresponds to a limited one of the tested modules 200. The bearing part 101 includes a through hole 1011 and a bearing table 1012 disposed at a hole wall of the through hole 1011, wherein an upper surface of the bearing table 1012 is lower than an upper surface of the carrier tray 10, and the bearing table 1012 and the hole wall of the through hole 1011 together enclose a slot body for limiting the tested module 200. The through holes 1011 corresponding to the respective bearing portions 101 may be independently provided, or may be formed by communicating adjacent sides of any two adjacent through holes 1011. The upper surface of the bearing table 1012 corresponding to each bearing part 101 is provided with a gasket 103 so as to reduce the abrasion when the tested module 200 is lapped. The gasket 103 may be a rubber gasket, a silicone gasket, or the like.

The projection of the carrier tray 10 along the Z-axis direction is rectangular, the width direction of the carrier tray 10 is along the Y-axis direction, and the length direction of the carrier tray 10 is along the X-axis direction, that is, the pin 220 arrangement direction described above.

Wherein, each bearing part 101 is correspondingly provided with a plurality of groups of acquisition assemblies 20 which are arranged at intervals along the first direction.

That is, the carrier tray 10 is provided with a plurality of carrying portions 101 arranged at intervals or adjacently along the first direction, and each carrying portion 101 is correspondingly provided with a plurality of groups of collecting assemblies 20 arranged at intervals along the first direction. Therefore, the simultaneous crimping test of the pins 220 of the tested modules 200 can be satisfied, and the test efficiency is improved.

Referring to fig. 1 to 4, in some embodiments, the collecting assembly 20 further includes a conducting structure 23, and the transmitting end 202 of the first collecting probe 21 and/or the second collecting probe 22 is connected to the conducting structure 23 and is connected to the test circuit board through the conducting structure 23. That is, the first collecting probe 21 and the second collecting probe 22 do not need to be directly connected to the test circuit board, but pass through the conductive structures 23 connected at the respective corresponding transmission ends 202, so as to meet the connection with the test circuit board. By such an arrangement, the structures of the first acquisition probe 21 and the second acquisition probe 22 can be simplified, for example, only columnar structures are required to be formed, and the manufacturing cost is reduced. Meanwhile, the assembling flexibility of the collecting assembly 20 is improved regardless of the setting positions of the first collecting probe 21 and the second collecting probe 22.

In actual use, the test circuit board is supported by the base and mounted above the carrier plate 10, and at this time, the first collecting probe 21 and the second collecting probe 22 are arranged oppositely, so that the second collecting probe 22 cannot be directly connected with the test circuit board. At this time, the conductive structure 23 may be utilized as a relay for the connection between the second acquisition probe 22 and the test circuit board. When the collection assembly 20 is provided with a plurality of groups, the second collection probes 22 in each group are correspondingly connected with the conducting structures 23.

Alternatively, the first acquisition probe may be connected to the test circuit board via the conductive structure 23 when the test circuit board is disposed adjacent to the second acquisition probe 22.

The conductive structures 23 may be one or more conductive elements, such as conductive strips, conductive posts, or conductive springs, etc., that are capable of effectively transmitting the electrical signals of the first and/or second acquisition probes 21, 22 to the test circuit board.

With continued reference to fig. 1-4, in some embodiments, the conductive structure 23 includes a conductive strip 231 and a conductive probe 232, where the conductive strip 231 is disposed on the carrier plate 10 and is electrically connected to the first collecting probe 21 or the second collecting probe 22, and one end of the conductive probe 232 is connected to the test circuit board, and the other end of the conductive probe 232 can be press-fit with the conductive strip 231.

Wherein the conductive strip 231 is an elongated strip-like structure made of conductive material, such as an elongated strip-like sheet. The conductive strip 231 is laid and fixed on the carrier plate 10 to ensure reliability and stability of press-fit with the conductive probe 232. The conductive strip 231 can be reliably electrically connected with the first collecting probe 21 or the second collecting probe 22 by welding, riveting or other conductive connection modes, so that the electric signals received by the collecting probes can be smoothly transmitted to the conductive strip 231. One end of the conductive probe 232 is secured to the test circuit board, such as by soldering or other structure, and the other end is in press fit with the conductive strip 231.

In actual use, the first collecting probe 21 and the conducting probe 232 are both fixed on the test circuit board, the second collecting probe 22 and the conducting strip 231 are both fixed on the carrier tray 10, and the conducting strip 231 is connected with the second transmitting end 2022 of the second collecting probe 22. When testing is required, the base carrying the test circuit board moves downwards along the Z-axis direction, and the first collection probe 21 and the conduction probe 232 are synchronously moved, so that the first collection probe 21 is in press fit with the top 221 of the pin, and the conduction probe 232 is in press fit with the conduction strip 231. The electrical signals collected by the first collection probe 21 are directly transmitted to the test circuit board, and the electrical signals collected by the second collection probe 22 are transmitted to the test circuit board through the cooperation of the conducting strip 231 and the conducting probe 232.

That is, the electrical signal transmission path of the second acquisition probe 22 arranged in the Z-axis direction may be transferred to the horizontal direction by the conductive strip 231, for example, when the length of the conductive strip 231 extends in the Y-axis direction, the electrical signal transmission path may be transferred to the Y-axis direction. And, with the arrangement of the conductive probes 232 along the Z-axis direction, the electrical signal transmission path in the Y-axis direction is transferred to the Z-axis direction, and then transferred to the upper test circuit board. Therefore, by changing and optimizing the electric signal transmission path to avoid interference with other structures, the requirements of signal acquisition and processing under different complex test scenes can be met. In addition, the electric signal transmission can be satisfied only by the cooperation of the conducting strip 231 and the conducting probe 232, and the structure is simple and the manufacture and the maintenance are easy.

As shown in fig. 4, in some embodiments, the diameter of the pass-through probe 232 is greater than the diameter of the first acquisition probe 21 and the diameter of the second acquisition probe 22. It will be appreciated that since the first and second pick probes 21 and 22 also need to be in direct contact with the module under test 200 during testing, their diameters can be set relatively small to make sufficient contact with the pins 220 and avoid damage to the pins 220. For the conducting probe 232, it is only used for electric signal transmission and is not in direct contact with the tested module 200, so that the diameter can be properly increased, the sufficient contact with the conducting strip 231 is ensured, and the connection stability and the conductivity with the conducting strip 231 are improved.

The conductive bar 231 is made of copper, such as pure copper, beryllium copper, or the like, and is surface-treated to form a plating layer, such as nickel plating, silver plating, or gold plating, on the surface, so that the occurrence of an oxide layer is prevented as much as possible. Meanwhile, the conducting probe 232 may be a probe head of 1.5mm, but may also be 1.6mm, 1.8mm, etc., which is only exemplified here.

Further, beryllium copper spring may also be used for the second acquisition probe 22. Since the second collection probe 22 is connected to the conductive strip 231, it is only necessary to ensure reliable contact with the bottom 222 of the lead and to transmit the electrical signal to the conductive strip 231.

As shown in fig. 4, further, the end of the conducting probe 232 facing the conducting bar 231 is provided with a plurality of signal acquisition parts 2321 arranged at intervals along the circumferential direction thereof. By the arrangement, the contact area of signal acquisition is increased, the efficiency and accuracy of signal acquisition are improved, the crimping pressure is dispersed to a certain extent, the conducting strip 231 is protected from excessive abrasion, and the service life is prolonged.

Referring to fig. 3,4, 7 and 8, in some embodiments, the carrier plate 10 is provided with a mounting groove 102 near the carrying portion 101, and the conducting bar 231 is at least partially accommodated in the mounting groove 102. That is, the setting of the assembly slot 102 is utilized to play a limiting role in the assembly of the conducting strip 231, so that risks such as shaking and offset of the conducting strip 231 in the crimping test are avoided as much as possible, and stability and accuracy of signal transmission are ensured. The groove wall of the assembly groove 102 may be provided with a structure for limiting the conducting bar 231 in a protruding manner or a recessed manner, so as to improve the assembly reliability.

As shown in fig. 7 and 8, in some embodiments, the fitting groove 102 is provided near the edge of the bearing portion 101. When the collection assembly 20 is provided with a plurality of groups, the carrier plate 10 is provided with a plurality of assembly grooves 102 which are arranged at intervals along the X-axis direction, and a partition plate 104 is arranged between any two adjacent assembly grooves 102 so as to avoid the mutual contact of any two adjacent conducting bars 231. Of course, the carrier tray 10 may be provided with a plurality of partitions 104 spaced apart in the X-axis direction at positions where the conducting bars 231 are mounted, and an assembly groove 102 may be defined between any two adjacent partitions 104.

With continued reference to fig. 3,4, 7 and 8, the collection assembly 20 further includes a fastening structure 24, and the fastening structure 24 is connected to the conducting bar 231 and the carrier plate 10 for locking the conducting bar 231 to the carrier plate 10. That is, on the basis of the foregoing assembly groove 102, the fastening structure 24 is further configured to form dual fixing, so as to further increase the fixing reliability of the conducting strip 231 relative to the carrier disc 10, so that the conducting strip 231 can still maintain the continuity and stability of signal transmission when being subjected to external interference such as vibration and impact, and improve the reliability and accuracy of the test.

In some specific embodiments, the fastening structure 24 includes a pressing plate 241 and a fastening member 242, where the pressing plate 241 is pressed on one side of the conducting bar 231 protruding from the corresponding assembly slot 102 in each conducting structure 23, and the fastening member 242 is connected to the carrier tray 10 through the pressing plate 241. The fastening piece 242 does not need to be in direct contact with the conducting bar 231, but the pressure of the pressing plate 241 when locked relative to the carrier plate 10 is limited to the conducting bar 231, so that the protection of the conducting bar 231 is improved on the basis of meeting the fastening of the conducting bar 231. Moreover, the press plate 241 is in surface contact with the conducting strip 231 to limit the pressure, so that the assembling position of the conducting strip 231 can be conveniently adjusted, and the fastener 242 is only required to be unscrewed when the adjustment is needed. In addition, the arrangement of the pressing plate 241 can properly buffer the conducting bar 231 to prevent damage caused by excessive tightening when the conducting bar 231 is ensured to be limited by pressure connection.

When each bearing portion 101 corresponds to multiple groups of collecting assemblies 20, the conducting bars 231 in each group of collecting assemblies 20 can be limited by being pressed by the same pressing plate 241, so that the structure is simplified.

The fastening piece 242 can be reliably connected with the carrier plate 10 by adopting a screw, so that signal transmission cannot be influenced by loosening in long-term use. The fastening structure 24 further includes a positioning pin 243, and the positioning pin 243 is used for positioning the conducting bar 231 on the carrier disc 10, so as to further improve assembly reliability.

As shown in fig. 4, in still other specific embodiments, an end portion of the conducting bar 231, which faces away from the conducting probe 232 along the Y-axis direction, is provided with an assembly through hole, the conducting bar 231 can be sleeved on the corresponding second collecting probe 22 through the assembly through hole, and the bottom of the second collecting probe 22 is fixedly arranged on the carrier disc 10 through a screw, so as to ensure connection reliability.

Referring to fig. 1,2 and 7, in some embodiments, the carrier plate 10 is provided with a plurality of terminal support blocks 105 at the edge of the carrier portion 101, and the plurality of terminal support blocks 105 are arranged at intervals along the circumferential direction of the carrier portion 101.

It can be appreciated that the tested module 200 includes a main body (not shown in the figure) and a terminal 210, where the main body is supported and limited by the supporting portion 101, and the terminal 210 can be supported on the terminal supporting block 105, so as to ensure the limiting reliability of the tested module 200, and avoid deformation of the terminal 210 during the crimping process. The terminals 210 include a positive electrode terminal 211, a negative electrode terminal 212, and a three-phase terminal 213, the positive electrode terminal 211 corresponds to a positive electrode terminal support block 1051, the negative electrode terminal 212 corresponds to a negative electrode terminal support block 1052, and the three-phase terminal 213 corresponds to a three-phase terminal support block 1053. Each terminal support block 105 is fixedly connected with the carrier plate 10 through a screw, and the height difference of the terminal 210 can be compensated by additionally arranging the cushion sheet 103 on the terminal support block 105.

Referring to fig. 1 to 6, the present application further provides a semiconductor testing device for testing a semiconductor power module, which includes an upper computer and the signal acquisition device 100, wherein a testing circuit board in the signal acquisition device 100 is electrically connected with the upper computer. The first collection probe 21 is in press fit with the top 221 of the pin to collect one test signal and transmit the test signal to the test circuit board, the second collection probe 22 is in press fit with the bottom 222 of the pin to collect another test signal and transmit the test signal to the test circuit board through the conducting structure 23, and the test circuit board can feed back a signal for reactive aging test to the upper computer after collecting at least one of the two test signals.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be determined from the following claims.

Claims (10)

1. A signal acquisition device, comprising:

Testing the circuit board;

the carrying disc (10) is provided with a carrying part (101) for limiting the tested module (200);

the collection assembly (20) comprises a first collection probe (21) and a second collection probe (22), wherein the first collection probe and the second collection probe comprise a crimping end (201) and a transmission end (202), the two transmission ends (202) are connected in parallel with the test circuit board, and the ends of the crimping ends (201) are oppositely arranged.

2. Signal acquisition device according to claim 1, characterized in that at least one of the crimp ends (201) is provided with a piercing (203).

3. Signal acquisition device according to claim 1, characterized in that the acquisition assembly (20) further comprises a conducting structure (23), the conducting structure (23) being connected to the transmission end (202) of the first acquisition probe (21) and/or the second acquisition probe (22) and being connected to the test circuit board by the conducting structure (23).

4. A signal acquisition device according to claim 3, characterized in that the conducting structure (23) comprises:

A conducting bar (231) arranged on the carrying disc (10) and electrically connected with the first collecting probe (21) or the second collecting probe (22);

And one end of the conduction probe (232) is connected to the test circuit board, and the other end of the conduction probe can be in press fit with the conduction strip (231).

5. The signal acquisition device according to claim 4, characterized in that the diameter of the conducting probe (232) is larger than the diameter of the first acquisition probe (21) and the diameter of the second acquisition probe (22).

6. The signal acquisition device according to claim 4, wherein the end of the conducting probe (232) facing the conducting strip (231) is provided with a plurality of signal acquisition parts (2321) arranged at intervals along the circumferential direction thereof.

7. The signal acquisition device according to claim 4, wherein the carrier disc (10) is provided with an assembly groove (102) near the bearing part (101), and the conducting strip (231) is at least partially accommodated in the assembly groove (102);

The collection assembly (20) further comprises a fastening structure (24), wherein the fastening structure (24) is connected to the conducting strip (231) and the carrier plate (10) and is used for locking the conducting strip (231) to the carrier plate (10).

8. A signal acquisition device according to claim 1 or claim 3, wherein the acquisition assembly (20) is provided with a plurality of groups and is arranged at intervals along a first direction, the first direction being the direction in which pins on the module to be tested are arranged.

9. The signal acquisition device according to claim 1, wherein the carrier plate (10) is provided with a plurality of terminal support blocks (105) at the edge of the carrying part (101), and the plurality of terminal support blocks (105) are arranged at intervals along the circumferential direction of the carrying part (101).

10. A semiconductor testing device for testing a semiconductor power module, comprising an upper computer and the signal acquisition device of any one of claims 1 to 9, wherein a test circuit board in the signal acquisition device is electrically connected with the upper computer.