CN120551915B - A double-sided grinding device for a semiconductor heating plate and a grinding process thereof - Google Patents

Abstract

The invention discloses a double-sided polishing device and a polishing process of a semiconductor heating plate, comprising a box shell, wherein an intermittent blanking mechanism is arranged on the box shell, the intermittent blanking mechanism comprises a flip plate rotatably connected to one side of the shell of the box body, a storage box is arranged below the flip plate, and a blanking component is arranged in the storage box. Through putting into the unloading subassembly in the storage box with the heating disk body, make the whole neat pile up neatly of heating disk body of placing in the storage box, carry to abrasive band first and abrasive band second through pushing away the intermittent promotion heating disk body of material pushing component and polish, can realize continuous material loading and polish, need not to wait for the manual work to replace single panel, thereby reduce manual operation's cost, when the heating disk body removes between abrasive band first and abrasive band second, can polish the front and back of heating disk body simultaneously, can effectively improve roughness and surface finish, ensure machining precision, improve machining efficiency, ensure the processingquality uniformity simultaneously.

Description

Two-sided grinding device and technology for tray body of semiconductor heating tray

Technical Field

The invention relates to the technical field of heating plate polishing, in particular to a plate body double-sided polishing device of a semiconductor heating plate and a polishing process of the device.

Background

Sanding is a surface modification technique, generally referred to as a process for modifying the physical properties of a material surface by friction with a roughened object (sandpaper containing particles of higher hardness, etc.), primarily for the purpose of achieving a specific surface roughness.

According to the double-sided polishing device for the brake disc disclosed in the Chinese patent CN116967867B, through structural designs such as polishing discs and the like which are symmetrically arranged in a polishing area in a main body frame, the brake disc is rapidly and efficiently polished, the polishing and the detection can be simultaneously carried out while the polishing is carried out through the structural designs of supporting rods, rollers and the like in a detection area, the polishing and the detection are not needed to be interrupted, the polishing work efficiency of the brake disc is improved to the greatest extent, and the structural design of the semi-enclosed type brake disc in the scheme can be used for sufficiently collecting the fragments generated by polishing, does not need to clean the fragments, and can further improve the polishing work efficiency of the brake disc.

When the disc double-sided polishing device is used, a worker is required to put the disc into the polishing groove, the position of the polishing disc is manually adjusted according to the size of the disc, the disc can be sufficiently polished, in the process, the disc is required to be manually replaced and adjusted, after one disc is polished, the disc is required to be taken down through the same step, and the disc to be processed is reloaded through the same step.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a disc body double-sided polishing device of a semiconductor heating disc, which has the advantages of automatic feeding of the heating disc and the like, and solves the problem of slow efficiency of manually installing the disc body.

The invention provides a technical scheme that the two-sided polishing device for the heating disc bodies of the semiconductor heating disc comprises a box shell, wherein an intermittent blanking mechanism is arranged on the box shell and comprises a flip plate rotationally connected to one side of the box shell, a storage box is arranged below the flip plate, a blanking component is arranged in the storage box, heating disc bodies are stacked in the blanking component and used for stacking the heating disc bodies of different sizes, the heating disc bodies can be evenly subjected to blanking, a pushing component is arranged below the heating disc bodies, a feeding bottom plate is connected below the pushing component in a sliding mode and used for continuously pushing the heating disc bodies to polish, the intermittent blanking of the intermittent blanking mechanism is enabled to be limited by the heating disc bodies in the blanking component, a high-efficiency polishing mechanism is fixedly arranged on one side of the blanking mechanism and comprises a lower roller set rotationally connected to the inner wall of the box shell, the lower roller set is further connected to the lower roller set, the abrasive belt is further arranged on the lower roller set, the abrasive belt is further in the abrasive belt set, and the abrasive belt is further arranged between the two roller set and the abrasive belt set is used for driving the two-up, and the abrasive belt set is used for cleaning the abrasive belt set and is used for driving the two-up and the roller set to be well arranged.

As a preferable scheme of the disc body double-sided polishing device of the semiconductor heating disc, the blanking component comprises two arc-shaped frames which are connected in the storage box in a sliding mode, the arc-shaped frames are distributed on two sides of the storage box, one sides of the two arc-shaped frames are fixedly provided with adjusting elastic pieces, one ends of the adjusting elastic pieces are fixedly arranged on the inner wall of the storage box, one sides of the two arc-shaped frames are fixedly connected with limiting sliding columns, the limiting sliding columns are connected on the storage box in a sliding mode, limiting is conducted on the arc-shaped frames, shaking is prevented when the arc-shaped frames move, and the arc-shaped frames on the two sides can clamp heating disc bodies with different sizes.

As a preferable scheme of the disc body double-sided polishing device of the semiconductor heating disc, the pushing component comprises two fixing frames fixedly connected to the inner wall of the shell of the box body, the two fixing frames are respectively arranged on two sides of the shell of the box body, the reciprocating screw rods are rotationally connected to the fixing frames, the sliding sleeve is connected to the reciprocating screw rods in a sliding manner, a limiting sliding groove is formed in one side of the fixing frames, and the upper surface of the fixing frames is fixedly connected with the bottom end of the storage box.

As a preferable scheme of the tray body double-sided polishing device of the semiconductor heating tray, one side of the sliding sleeve is fixedly connected with the sliding block, the sliding block is in sliding connection with the limiting sliding groove, the lower surface of the sliding sleeve is fixedly connected with the movable inclined block, one side of the sliding block is fixedly connected with the pushing plate, the pushing plate slides between the fixing frames on two sides, the heating tray body can be pushed to move in the sliding process of the pushing plate, the upper surface of the feeding bottom plate is in sliding connection with the containing box, and the containing box can limit the heating tray bodies stacked in the arc-shaped frame.

As a preferable scheme of the tray body double-sided polishing device of the semiconductor heating tray, limit grooves are formed in two sides of the storage box, the shape of each limit groove is matched with that of a sliding block, a folding spring plate is fixedly arranged at one end of the storage box, the other end of the folding spring plate is fixedly arranged on the inner wall of a box shell, a motor is fixedly connected to one end of the reciprocating screw rod, and the motor is fixedly arranged on the inner wall of the box shell.

As a preferable scheme of the disc body double-sided polishing device of the semiconductor heating disc, the tightening assembly comprises a mounting frame fixedly mounted in a box body shell, the inner wall of the mounting frame is clamped with one end of the mounting frame, the inner wall of the mounting frame is slidably connected with an L-shaped sliding plate, the upper surface of the L-shaped sliding plate is fixedly connected with a lifting rod, and the top end of the lifting rod is sleeved with a reset spring.

As a preferable scheme of the disc body double-sided polishing device of the semiconductor heating disc, the top end of the lifting rod is fixedly connected with the lower pressing plate, the upper surface of the lower pressing plate is fixedly connected with the supporting frame, the supporting frame is rotatably connected with the coordinated rotating roller, the surface of the coordinated rotating roller is in contact with the abrasive belt, the rotating roller group is arranged in the lower pressing plate, and the surface of the rotating roller group is in contact with the abrasive belt.

As a preferable scheme of the disc body double-sided polishing device of the semiconductor heating disc, one side of the L-shaped sliding plate is fixedly connected with a T-shaped sliding block, the inner wall of the mounting frame is provided with a lifting sliding groove, the T-shaped sliding block is slidably connected in the lifting sliding groove, the cleaning assembly comprises a cleaning scraping plate fixedly arranged on the mounting frame, the surface of the first abrasive belt passes along the mounting frame, and a discharging through hole is formed between the second abrasive belt and the feeding bottom plate.

As a preferable scheme of the tray body double-sided polishing device of the semiconductor heating tray, a collecting box is arranged below the discharging through hole and fixedly arranged in a box body shell, a rack is fixedly arranged on one side of the L-shaped sliding plate, a driving gear is meshed with one side of the rack and is rotatably connected to the mounting frame, a rotating rod is fixedly connected to the driving gear, a cleaning brush is fixedly arranged at the top end of the rotating rod, and the collecting box is arranged on one side of the cleaning brush.

In order to achieve the above purpose, the invention provides a polishing process, which comprises the following steps:

Firstly, through opening the flip board of box shell one side, put into the unloading subassembly in the storage box with the heating disk body, make the whole neat pile up neatly of heating disk body of placing in the storage box, the heating disk body that promotes the pile up neatly through pushing away material subassembly intermittent type nature removes in the high-efficient grinding machanism of one side and polishes, when the heating disk body removes to between abrasive band one and the abrasive band two, through setting up synchronous gear in the side of lower roller group and last roller group, drive abrasive band one and abrasive band two and inwards rotate simultaneously and carry out two-sided polishing to the heating disk body in centre, pushing away the material subassembly and can drive tightening assembly and carry out work when driving the heating disk body and moving, tightening assembly can promote abrasive band one and downwards remove, apply pressure to the heating disk body that is in between abrasive band one and abrasive band two, make its two-sided more even of polishing, abrasive band one and abrasive band two produce the piece can fly to the abrasive band two-sided and pile up, the piece that stacks up, the piece that produces is handled through the clean subassembly of abrasive band two below.

Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:

1. Through putting into the unloading subassembly in the storage box with the heating disk body, make the whole neat pile up neatly of heating disk body of placing in the storage box, carry to abrasive band first and abrasive band second through pushing away the intermittent promotion heating disk body of material pushing component and polish, can realize continuous material loading and polish, need not to wait for the manual work to replace single panel, thereby reduce manual operation's cost, when the heating disk body removes between abrasive band first and abrasive band second, can polish the front and back of heating disk body simultaneously, can effectively improve roughness and surface finish, ensure machining precision, improve machining efficiency, ensure the processingquality uniformity simultaneously.

2. The material pushing plate pushes the heating disc body to move for polishing, the pressure applied to the storage box gradually disappears, the compressed folding elastic sheet moves on the feeding bottom plate along with the material pushing plate under the reaction force, after the storage box moves to completely shield the bottom end of the arc-shaped frame, the material pushing plate can be pulled out from the storage box to continue to move, the storage box can limit the heating disc body stacked in the arc-shaped frame, automatic conveying and polishing of materials can be achieved through a continuous intermittent material pushing mode, the working efficiency is improved, the manual intervention time is reduced, the material pushing device is suitable for batch production, and the consistency of the quality of finished products is improved.

3. The lower surface of the abrasive belt I is pushed to gradually bulge through the lower pressure plate, pressure is applied to the heating disc body between the abrasive belt I and the abrasive belt II, the contact force between the abrasive belt I and the heating disc body can be enhanced by applying pressure, the grinding efficiency is higher, uneven parts of the surface of a material can be removed more quickly, the L-shaped sliding plate can drive a driving gear meshed with one side to rotate when the lifting driving rack moves, the cleaning brush is knocked on the collecting box, chips on the cleaning brush are enabled to shake down in the collecting box, the cleaning brush is enabled to incline and no longer contact with the abrasive belt II, unnecessary friction is reduced, the abrasive belt is further protected, the dust and the chips on the brush can shake down by collision, impurities are prevented from accumulating on the surface of the brush, and therefore the cleanliness and the cleaning capability of the cleaning brush are maintained.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic view of a three-dimensional overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the case housing of the present invention;

FIG. 3 is a schematic diagram of the structure of the intermittent feeding mechanism of the present invention;

fig. 4 is a schematic diagram of an enlarged part structure of an intermittent blanking mechanism a of the present invention;

FIG. 5 is a schematic view of the structure of the pushing assembly of the present invention;

FIG. 6 is an enlarged schematic view of the structure of the pushing assembly B according to the present invention;

FIG. 7 is a schematic view of the structure of the pushing plate of the present invention;

FIG. 8 is a schematic view of the structure of the efficient polishing mechanism of the present invention;

FIG. 9 is a schematic view of the structure of the tightening assembly of the present invention;

FIG. 10 is a schematic view of the structure of the cleaning assembly of the present invention.

100, A box shell, 200, an intermittent blanking mechanism, 201, a flip plate, 202, a storage box, 203, a heating disc, 204, a loading bottom plate, 205, an arc-shaped frame, 206, an adjusting spring plate, 207, a limiting slide column, 208, a fixing frame, 209, a reciprocating screw rod, 210, a sliding sleeve, 211, a limiting slide groove, 212, a sliding block, 213, a moving inclined block, 214, a pushing plate, 215, a storage box, 216, a limiting groove, 217, a folding spring plate, 218, a motor, 300, a high-efficiency polishing mechanism, 301, a lower roller group, 302, an upper roller group, 303, a first abrasive belt, 304, a second abrasive belt, 305, a blanking bottom plate, 306, a mounting frame, 307, an L-shaped slide plate, 308, a lifting rod, 309, a return spring, a lower pressing plate, 311, a supporting frame, 312, a coordinated rotary roller, 313, a rotary roller group, 314, a T-shaped slide block, 315, a lifting slide groove, 316, a cleaning scraper, 317, a discharging through hole, 318, a collecting box, 319, a rack, 320, a driving gear, 321, a rotary brush and a cleaning brush.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

The invention is further described below with reference to examples.

Example 1

Referring to fig. 1-3 and 5, in a first embodiment of the present invention, a device for polishing two sides of a semiconductor heating tray is provided, which comprises a box body housing 100, an intermittent discharging mechanism 200 is installed on the box body housing 100, the intermittent discharging mechanism 200 comprises a flip plate 201 rotatably connected to one side of the box body housing 100, a storage box 202 is arranged below the flip plate 201, a discharging component is arranged in the storage box 202, heating trays 203 are piled in the discharging component, the heating trays 203 with different sizes are piled, so that the heating trays 203 can be evenly discharged, a pushing component is arranged below the heating trays 203, a feeding bottom plate 204 is slidably connected below the pushing component, and is used for continuously pushing the heating trays 203 to polish, and limiting the heating trays 203 piled in the discharging component, so that the intermittent discharging is performed;

One side of the intermittent blanking mechanism 200 is fixedly provided with the efficient polishing mechanism 300, the efficient polishing mechanism 300 comprises a lower roller set 301 rotationally connected to the inner wall of the box body shell 100, an upper roller set 302 is rotationally connected to the upper roller set 301, an abrasive belt I303 is sleeved on the upper roller set 302, an abrasive belt II 304 is sleeved on the lower roller set 301, a pushing component can push the heating disc 203 to pass through between the abrasive belt I303 and the abrasive belt II 304 and polish the two sides of the heating disc 203, a tightening component is arranged in the abrasive belt I303 and used for pushing the abrasive belt I303 to press down, pressure is applied to the middle heating disc 203, the two sides of the heating disc 203 are better in polishing effect, a cleaning component is arranged below the abrasive belt II 304 and used for cleaning the slag accumulated on the surface of the abrasive belt II 304, and the pushing component drives the polished heating disc 203 to move to the blanking bottom plate 305 and discharge.

Specifically, the turnover cover plate 201 at one side of the box body shell 100 is opened, the heating disc 203 is placed in the blanking assembly in the storage box 202, the placed heating disc 203 is completely and orderly piled in the storage box 202, the heating disc 203 which is piled is intermittently pushed by the pushing assembly to move into the efficient polishing mechanism 300 at one side for polishing, when the heating disc 203 moves between the first abrasive belt 303 and the second abrasive belt 304, the first abrasive belt 303 and the second abrasive belt 304 are driven to simultaneously rotate inwards to polish the middle heating disc 203 in double sides by arranging the synchronous gears at the side surfaces of the lower roller group 301 and the upper roller group 302, the tightening assembly is driven to work while the pushing assembly is driven to move the heating disc 203 again, the tightening assembly is pushed to downwards move the first abrasive belt 303, the heating disc 203 which is positioned between the first abrasive belt 303 and the second abrasive belt 304 is stressed to make the double-sided polishing more uniform, the middle heating disc 203 is polished by the first abrasive belt 303 and the second abrasive belt 304, the generated fragments 304 fly onto the second abrasive belt 304, and the accumulated fragments are processed by the cleaning assembly under the abrasive belt.

Through putting the heating plate 203 into the unloading subassembly in the storage box 202, make the whole neat pile up neatly of heating plate 203 of placing in the storage box 202, carry the abrasive band between first 303 and the abrasive band second 304 through pushing away the intermittent promotion heating plate 203 of material subassembly and polish, can realize continuous material loading and polish, need not to wait for the manual replacement single panel, thereby reduce the cost of manual operation, when the heating plate 203 removes between abrasive band first 303 and the abrasive band second 304, can polish the positive and negative of heating plate 203 simultaneously, can effectively improve roughness and surface finish, ensure machining precision, improve machining efficiency, ensure the processingquality uniformity simultaneously.

Example two

Referring to fig. 3-7, for a second embodiment of the present invention, a disc dual-sided polishing device for a semiconductor heating disc is provided, wherein a blanking component includes two arc frames 205 slidably connected in a storage box 202, the two arc frames 205 are distributed on two sides of the storage box 202, one sides of the two arc frames 205 are fixedly provided with adjusting elastic pieces 206, one ends of the adjusting elastic pieces 206 are fixedly installed on an inner wall of the storage box 202, one sides of the two arc frames 205 are fixedly connected with limiting sliding columns 207, the limiting sliding columns 207 are slidably connected on the storage box 202, limit the arc frames 205, shake is prevented when the arc frames 205 move, and the arc frames 205 on two sides can clamp heating disc 203 with different sizes.

The pushing assembly comprises fixing frames 208 fixedly connected to the inner wall of the box body shell 100, two fixing frames 208 are arranged on two sides of the box body shell 100 respectively, a reciprocating screw rod 209 is connected to the fixing frames 208 in a rotating mode, a sliding sleeve 210 is connected to the reciprocating screw rod 209 in a sliding mode, a limiting sliding groove 211 is formed in one side of the fixing frames 208, and the upper surface of the fixing frames 208 is fixedly connected with the bottom end of the storage box 202.

One side fixedly connected with sliding block 212 of sliding sleeve 210, sliding block 212 sliding connection is in spacing spout 211, and sliding sleeve 210's lower fixed surface is connected with removes sloping block 213, and sliding sleeve 212's one side fixedly connected with pushes away flitch 214, and push away flitch 214 and slide between the mount 208 of both sides, and the gliding in-process of flitch 214 can promote heating disk 203 and remove, and the upper surface sliding connection of loading bottom plate 204 has containing box 215, and containing box 215 can carry out spacingly to the heating disk 203 of pile up neatly in arc frame 205.

Limiting grooves 216 are formed in two sides of the storage box 215, the shape of the limiting grooves 216 is matched with that of the sliding blocks 212, a folding elastic sheet 217 is fixedly installed at one end of the storage box 215, the other end of the folding elastic sheet 217 is fixedly installed on the inner wall of the box body housing 100, a motor 218 is fixedly connected to one end of the reciprocating screw rod 209, and the motor 218 is fixedly installed on the inner wall of the box body housing 100.

Specifically, in the initial stage, the folding shrapnel 217 is in a compressed state, the stripper plate 214 is sleeved in the storage box 215, the sliding blocks 212 are engaged in the limit grooves 216 on the two sides, at this time, the arc grooves of the stripper plate 214 are just aligned with the arc frames 205 above, the heating disc 203 stacked in the arc frames 205 can fall into the stripper plate 214, the arc frames 205 in the storage box 202 are pushed away to the two sides through pushing the arc frames 205, the arc frames 205 can squeeze the regulating shrapnel 206 between the storage box 202 and the arc frames 205 during sliding, the limit sliding column 207 extends outwards along the limit holes on the storage box 202, the heating disc 203 is placed between the arc frames 205 on the two sides for stacking, the output end of the motor 218 drives the reciprocating screw 209 to rotate on the fixed frame 208, the sliding sleeve 210 sleeved on the reciprocating screw 209 can slide along the track, the sliding sleeve 210 drives the pushing plate 214 to move between the fixed frames 208 through the sliding blocks 212 on one side of the sliding sleeve 210, the sliding block 212 moves the stripper plate 214 to slide along the sliding sleeve 214, the sliding plate 215 moves along the lower end of the fixed frame 215, and simultaneously moves along the limit groove 215, the lower end of the sliding plate 215 moves along the lower end of the fixed frame 215, the lower end of the sliding plate 215 is completely along the limit groove 215, the limit groove 215 is completely moves along the limit groove 215, simultaneously, the lower end of the sliding plate 215 is completely moves along the limit groove 215, and moves along the lower end of the sliding plate 215, simultaneously moves along the lower end of the sliding plate 215, and moves along the sliding sleeve 204, and moves along the sliding sleeve 214, and moves along the sliding sleeve 205, and moves along the sliding sleeve on the sliding sleeve 205, moving ramp 213 under sliding sleeve 210 pushes tightening assembly within belt one 303 to apply pressure to heating plate 203.

Example III

Referring to fig. 3, 4 and 8-10, in a third embodiment of the present invention, a device for polishing two sides of a tray body of a semiconductor heating tray is provided, wherein a tightening assembly includes a mounting frame 306 fixedly installed in a housing 100 of a box body, an inner wall of the mounting frame 306 is clamped with one end of the mounting frame 208, an L-shaped sliding plate 307 is slidably connected to an inner wall of the mounting frame 306, a lifting rod 308 is fixedly connected to an upper surface of the L-shaped sliding plate 307, and a return spring 309 is sleeved at a top end of the lifting rod 308.

The top of lifting rod 308 is fixedly connected with holding down plate 310, and holding down plate 310's upper surface fixedly connected with support frame 311, rotation is connected with coordination roller 312 on the support frame 311, and coordination roller 312's surface keeps contact with abrasive band one 303, arranges the roller group 313 in the holding down plate 310, and the surface of roller group 313 keeps contact with abrasive band one 303.

One side fixedly connected with T type slider 314 of L type slide 307, lift spout 315 has been seted up to the inner wall of mounting bracket 306, and T type slider 314 sliding connection is in lift spout 315, and cleaning assembly includes the cleaning blade 316 of fixed mounting on mount 208, and the surface of abrasive band one 303 can pass through along mounting bracket 306, has the discharge through-hole 317 between abrasive band two 304 and the material loading bottom plate 204.

The collecting box 318 is arranged below the discharging through hole 317, the collecting box 318 is fixedly arranged in the box body housing 100, a rack 319 is fixedly arranged on one side of the L-shaped sliding plate 307, a driving gear 320 is meshed on one side of the rack 319, the driving gear 320 is rotationally connected to the mounting frame 306, a rotating rod 321 is fixedly connected to the driving gear 320, a cleaning brush 322 is fixedly arranged at the top end of the rotating rod 321, and the collecting box 318 is arranged on one side of the cleaning brush 322.

Specifically, when the moving ramp 213 is still located at the side of the L-shaped slide 307 initially, and the return spring 309 is not pressed, the lower platen 310 at the top end of the lifting rod 308 can be lifted up, so that the two cooperating rolls 312 on the supporting frame 311 jack up and tighten the loose first abrasive belt 303, the first abrasive belt 303 above the upper roll set 302 is in a convex tightening state, the first abrasive belt 303 below the upper roll set 302 is in a horizontal tightening state, the T-shaped slider 314 at the side of the L-shaped slide 307 is located at the top end of the lifting chute 315, when the pushing plate 214 pushes the heating disc 203 to move between the first abrasive belt 303 and the second abrasive belt 304, the moving ramp 213 below the sliding sleeve 210 gradually slides to the top surface of the L-shaped slide 307 along the inner wall of the supporting frame 306, so that the T-shaped slider 314 at the side of the L-shaped slide 307 moves to the bottom end in the lifting chute 315, while the L-shaped slide plate 307 moves downwards along the lifting sliding groove 315, the lower pressing plate 310 at the top end is driven by the lifting rod 308 to descend, the reset spring 309 at the top end of the lifting rod 308 is gradually extruded, the lower pressing plate 310 simultaneously drives the coordination rotating roller 312 on the supporting frame 311 to move, the lower pressing plate 310 pushes the lower surface of the abrasive belt one 303 to gradually bulge while the coordination rotating roller 312 descends gradually, the top surface of the coordination rotating roller 312 finally descends to be horizontal with the upper roller set 302, the abrasive belt one 303 is finally in a state that the upper surface is flat and the lower surface is bulged, pressure is applied to the heating disc 203 between the abrasive belt one 303 and the abrasive belt two 304, meanwhile, the L-shaped slide plate 307 drives the rack 319 to move while descending, the rack 319 drives the driving gear 320 meshed on one side to rotate while moving, so that the inclined rotating rod 321 rotates, the rotating rod 321 drives the cleaning brush 322 to rotate to be vertical to the surface of the second abrasive belt 304, so that the chips accumulated on the second abrasive belt 304 can be cleaned, meanwhile, the mounting frame 306 on the lifting rod 308 can scrape off the chips attached to the first abrasive belt 303, the chips are conveyed into the collecting tank 318 from the discharging through hole 317 through the rotation of the second abrasive belt 304, when the inclined block 213 moves to pass through the top surface of the L-shaped sliding plate 307, the pushing plate 214 pushes the heating disc 203 to push out to the blanking bottom plate 305 from one side of the high-efficiency polishing mechanism 300, the compressed reset spring 309 pushes the lower pressing plate 310 at the top end of the lifting rod 308 to be lifted to be in an initial state under the counter force, the step is opposite to the step, the chips attached to the first abrasive belt 303 are shaken off while the first abrasive belt 303 is fast tensioned, the L-shaped sliding plate 307 drives the driving gear 320 meshed on one side to rotate when the rack 319 is lifted, the cleaning brush 322 is knocked on the collecting tank 318, the chips on the cleaning brush 322 are shaken off into the collecting tank 318, the cleaning brush 322 is not in the heating tank 322, the cleaning brush 322 is not in contact with the second abrasive belt 304, and the quality of the second abrasive belt 203 is improved.

Example IV

Referring to fig. 1-3 and 5, for a fourth embodiment of the present invention, a polishing process is provided, comprising the steps of:

Firstly, the turnover cover plate 201 on one side of the box body shell 100 is opened, the heating disc 203 is placed into the blanking component in the storage box 202, the placed heating disc 203 is completely and orderly piled in the storage box 202, the heating disc 203 which is piled is intermittently pushed by the pushing component to move into the efficient polishing mechanism 300 on one side for polishing, when the heating disc 203 moves between the first abrasive belt 303 and the second abrasive belt 304, the synchronous gears are arranged on the side surfaces of the lower roller group 301 and the upper roller group 302, the first abrasive belt 303 and the second abrasive belt 304 are driven to simultaneously rotate inwards to polish the middle heating disc 203 in double surfaces, the pushing component drives the heating disc 203 to move, the tightening component is driven to work, the tightening component pushes the first abrasive belt 303 to move downwards, the heating disc 203 which is positioned between the first abrasive belt 303 and the second abrasive belt 304 is stressed, so that the double surfaces of the heating disc 203 are more uniform, when the heating disc 203 which is positioned between the first abrasive belt 303 and the second abrasive belt 304 polishes, chips are generated, the chips can fly onto the second abrasive belt 304, and the chips generated by the second abrasive belt 304 are piled up, and the chips generated by the second abrasive belt 304 are cleaned by the cleaning component.

Although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the foregoing embodiments may be modified or equivalents may be substituted for some of the features thereof, and that the modification or substitution does not depart from the spirit and scope of the embodiments.

Claims (7)

1. The tray body double-sided polishing device of the semiconductor heating tray comprises a box body shell and is characterized in that an intermittent discharging mechanism is arranged on the box body shell and comprises a flip plate rotatably connected to one side of the box body shell, a storage box is arranged below the flip plate, a discharging component is arranged in the storage box, heating tray bodies with different sizes are stacked in the discharging component and can be uniformly discharged, a pushing component is arranged below the heating tray bodies, a feeding bottom plate is slidably connected below the pushing component and is used for continuously pushing the heating tray bodies to polish, and the heating tray bodies stacked in the discharging component are limited to enable the heating tray bodies to be intermittently discharged;

One side of the intermittent blanking mechanism is fixedly provided with a high-efficiency polishing mechanism, the high-efficiency polishing mechanism comprises a lower roller set which is rotationally connected to the inner wall of the box body shell, an upper roller set is rotationally connected to the upper roller set, an abrasive belt I is sleeved on the upper roller set, an abrasive belt II is sleeved on the lower roller set, a pushing component can push a heating disc body to pass through between the abrasive belt I and the abrasive belt II and polish the two sides of the heating disc body, a tightening component is arranged in the abrasive belt I and used for pushing the abrasive belt to press down, pressure is applied to the middle heating disc body, the double-side polishing effect of the heating disc body is better, a cleaning component is arranged below the abrasive belt II and used for cleaning the slag accumulated on the surface of the abrasive belt II, and the pushing component drives the polished heating disc body to move to a blanking bottom plate to be discharged;

The tightening assembly comprises a mounting frame fixedly mounted in the casing of the box body, the inner wall of the mounting frame is clamped with one end of the mounting frame, the inner wall of the mounting frame is slidably connected with an L-shaped sliding plate, the upper surface of the L-shaped sliding plate is fixedly connected with a lifting rod, and the top end of the lifting rod is sleeved with a reset spring;

The top end of the lifting rod is fixedly connected with a lower pressing plate, the upper surface of the lower pressing plate is fixedly connected with a supporting frame, a coordinated rotating roller is rotationally connected on the supporting frame, the surface of the coordinated rotating roller is in keeping contact with the abrasive belt, a rotating roller group is arranged in the lower pressing plate, and the surface of the rotating roller group is in keeping contact with the abrasive belt;

One side fixedly connected with T type slider of L type slide, the lifting chute has been seted up to the inner wall of mounting bracket, T type slider sliding connection in lifting chute, and cleaning assembly includes the cleaning scraper blade of fixed mounting on the mount, and abrasive band one's surface can pass through along the mounting bracket, has the row material through-hole between abrasive band two and the loading bottom plate.

2. The device for polishing the two sides of the tray body of the semiconductor heating tray according to claim 1, wherein the blanking assembly comprises two arc-shaped frames which are connected in the storage box in a sliding mode, the two arc-shaped frames are distributed on two sides of the storage box, one sides of the two arc-shaped frames are fixedly provided with adjusting elastic pieces, one ends of the adjusting elastic pieces are fixedly arranged on the inner wall of the storage box, one sides of the two arc-shaped frames are fixedly connected with limiting sliding columns, the limiting sliding columns are connected onto the storage box in a sliding mode, limiting is conducted on the arc-shaped frames, shaking is prevented when the arc-shaped frames move, and the arc-shaped frames on the two sides can clamp heating tray bodies with different sizes.

3. The device for polishing the two sides of the tray body of the semiconductor heating tray according to claim 1, wherein the pushing assembly comprises two fixing frames fixedly connected to the inner wall of the housing of the box body, the two fixing frames are respectively arranged on two sides of the housing of the box body, the reciprocating screw rods are rotationally connected to the fixing frames, the sliding sleeve is slidingly connected to the reciprocating screw rods, a limiting sliding groove is formed in one side of the fixing frames, and the upper surface of the fixing frames is fixedly connected with the bottom end of the storage box.

4. The device for polishing the two sides of the tray body of the semiconductor heating tray according to claim 3, wherein one side of the sliding sleeve is fixedly connected with a sliding block, the sliding block is slidably connected in the limiting sliding groove, the lower surface of the sliding sleeve is fixedly connected with a movable inclined block, one side of the sliding block is fixedly connected with a pushing plate, the pushing plate slides between fixing frames on two sides, the heating tray body can be pushed to move in the sliding process of the pushing plate, the upper surface of the feeding bottom plate is slidably connected with a containing box, and the containing box can limit the heating tray bodies stacked in the arc-shaped frame.

5. The device for polishing both sides of a semiconductor heating plate according to claim 4, wherein the two sides of the storage box are provided with limit grooves, the shape of the limit grooves is matched with that of the sliding block, one end of the storage box is fixedly provided with a folding spring plate, the other end of the folding spring plate is fixedly arranged on the inner wall of the shell of the box body, one end of the reciprocating screw rod is fixedly connected with a motor, and the motor is fixedly arranged on the inner wall of the shell of the box body.

6. The device for polishing the two sides of the tray body of the semiconductor heating tray according to claim 1, wherein a collecting box is arranged below the discharging through hole and fixedly arranged in the casing of the tray body, a rack is fixedly arranged on one side of the L-shaped sliding plate, a driving gear is meshed on one side of the rack, the driving gear is rotationally connected to the mounting frame, a rotating rod is fixedly connected to the driving gear, a cleaning brush is fixedly arranged at the top end of the rotating rod, and the collecting box is arranged on one side of the cleaning brush.

7. A polishing process using the semiconductor heating plate body double-sided polishing apparatus as set forth in any one of claims 1 to 6, comprising the steps of:

Firstly, through opening the flip board of box shell one side, put into the unloading subassembly in the storage box with the heating disk body, make the whole neat pile up neatly of heating disk body of placing in the storage box, the heating disk body that promotes the pile up neatly through pushing away material subassembly intermittent type nature removes in the high-efficient grinding machanism of one side and polishes, when the heating disk body removes to between abrasive band one and the abrasive band two, through setting up synchronous gear in the side of lower roller group and last roller group, drive abrasive band one and abrasive band two and inwards rotate simultaneously and carry out two-sided polishing to the heating disk body in centre, pushing away the material subassembly and can drive tightening assembly and carry out work when driving the heating disk body and moving, tightening assembly can promote abrasive band one and downwards remove, apply pressure to the heating disk body that is in between abrasive band one and abrasive band two, make its two-sided more even of polishing, abrasive band one and abrasive band two produce the piece can fly to the abrasive band two-sided and pile up, the piece that stacks up, the piece that produces is handled through the clean subassembly of abrasive band two below.