CN120498236B - Intelligent bidirectional inverter - Google Patents
Intelligent bidirectional inverterInfo
- Publication number
- CN120498236B CN120498236B CN202510976342.5A CN202510976342A CN120498236B CN 120498236 B CN120498236 B CN 120498236B CN 202510976342 A CN202510976342 A CN 202510976342A CN 120498236 B CN120498236 B CN 120498236B
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- air
- housing
- air flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of inverter heat dissipation, in particular to an intelligent bidirectional inverter. The technical problem to be solved is that the electronic component blocks airflow to dissipate heat and the welding protrusion on the circuit board blocks the water cooling equipment from attaching. The invention has the technical scheme that the heat dissipation device comprises a base, a shell and the like, wherein the shell is fixedly arranged on the base, and the top of the shell is concave-convex and is used for accelerating the heat dissipation in the shell. According to the invention, the air deflector and the inclined radiating strips are arranged, the air flow absorbs heat of the circuit board in the flowing process and contacts the inclined radiating strips, so that the inclined radiating strips absorb the heat of the air flow and transmit the heat to the shell through the air deflector, the shell dissipates the heat to the outside, and meanwhile, the air deflector and the inclined radiating strips guide the air flow, so that the flow speed of the air flow is increased, the heat absorption of the air flow is reduced, the local air cooling effect of the circuit board is prevented from being deteriorated, the air flow can effectively absorb the heat, and the heat dissipation efficiency of the circuit board is further improved, and the service life of the circuit board is prolonged.
Description
Technical Field
The invention relates to the technical field of inverter heat dissipation, in particular to an intelligent bidirectional inverter.
Background
The inverter is an electrical device for converting direct current into alternating current and regulating voltage, is widely applied to the scene of needing alternating current power supply, the inverter is used as a high-power electrical appliance, higher heat is often generated in the use process, the working efficiency and the service life of internal electronic elements can be reduced when the temperature of the inverter is increased, for the existing cooling technology, complicated electronic elements on a circuit board can obstruct airflow, so that heat is accumulated on the circuit board, a plurality of welding protrusions are formed on the circuit board, and water cooling equipment cannot be attached to the circuit board for cooling.
Disclosure of Invention
In order to overcome the defects that an electronic element blocks airflow to dissipate heat and a welding protrusion on a circuit board blocks water cooling equipment from attaching, the intelligent bidirectional inverter with high-efficiency heat dissipation is provided.
The technical scheme of the invention is that the intelligent bidirectional inverter comprises:
a base;
The shell is fixedly arranged on the base, the top of the shell is concave-convex and is used for accelerating heat dissipation in the shell;
the circuit board is arranged on the base through bolts and is positioned in the shell;
The air suction fan and the exhaust fan are respectively positioned at two sides of the base, the air suction fan is used for sucking external air flow into the shell, and the exhaust fan is used for guiding the air flow in the shell to be exhausted, so that the air suction fan and the exhaust fan form air flow with stable flow direction in the shell;
the air cooling strengthening unit is positioned at the top end of the inside of the shell and used for strengthening air flow formed by the suction fan and the exhaust fan in the shell and improving the heat dissipation efficiency of the air flow to the circuit board;
the water cooling strengthening unit is positioned at the top of the base and is used for further absorbing heat generated by the circuit board, so that the heat dissipation efficiency of the circuit board is improved.
Further, the air cooling strengthening unit comprises:
the air deflector is arranged at the top end of the inside of the shell, the bottom of the air deflector is an inclined plane, and the inclined plane faces the suction fan.
Further, the air cooling strengthening unit further comprises:
The inclined radiating strips are linearly and uniformly distributed at the bottom of the air deflector and used for guiding the flow direction of air flow in the shell in the flowing process and absorbing the heat of the air flow through the surface of the air deflector, and the heat is transferred to the shell through the air deflector, so that the shell dissipates the heat to the outside through the concave-convex surface at the top of the air deflector, and the heat absorption efficiency of the circuit board by the air flow is improved.
Further, the air cooling strengthening unit further comprises:
The heat conducting cotton is arranged between the inclined radiating strip and the circuit board, has higher heat conducting coefficient and is used for transferring heat of the circuit board.
Further, the heat conduction cotton is of a porous structure, a plurality of large vent holes and small vent holes are formed in the surface of the heat conduction cotton, the small vent holes are distributed around the large vent holes, and the small vent holes are communicated with the large vent holes through the porous structure of the heat conduction cotton.
Further, the air cooling strengthening unit further comprises:
The air limiting plates are arranged on two sides of the heat conducting cotton in a rectangular distribution mode and fixedly connected with the shell.
Further, the water-cooling strengthening unit comprises:
the water pump is arranged at the top of the base;
The heat conducting pipe is arranged at the top of the base, is positioned below the circuit board, is filled with cooling liquid and is communicated with the water pump;
And the reflux radiating pipe is communicated with and arranged on the water pump, so that the water pump, the heat conducting pipe and the reflux radiating pipe form a cooling liquid circulation loop.
Further, the water cooling strengthening unit further comprises:
The pipe network is arranged between the heat conducting pipe and the circuit board, is contacted with the heat conducting pipe and the circuit board and is used for transferring heat of the circuit board.
Furthermore, the pipe network consists of a plurality of metal pipes, and air flow holes are formed in the positions of the axes of the metal pipes and are used for transferring heat of the circuit board.
Further, the water cooling strengthening unit further comprises:
the porous capillary layer is arranged on the top surface inside the heat conducting pipe and is provided with a porous structure for accelerating the heat absorption of the cooling liquid.
The air flow heat dissipation device has the beneficial effects that 1, the air flow absorbs heat of the circuit board and contacts the inclined heat dissipation strip in the flowing process by arranging the air guide plate and the inclined heat dissipation strip, so that the inclined heat dissipation strip absorbs the heat of the air flow through the surface of the air flow heat dissipation strip, the air flow is emitted to the outside through the top of the air flow heat dissipation strip, meanwhile, the air flow is guided by the air guide plate and the inclined heat dissipation strip, the flowing sectional area of the air flow is gradually reduced, the pressure and the flow speed of the air flow are increased, the heat absorption of the air flow to the air flow is reduced, the local air cooling effect of the circuit board is prevented from being deteriorated due to excessive heat absorption of the air flow before the air flow passes through the circuit board, the heat from the circuit board can be always and effectively absorbed when the air flow flows above the circuit board, and the heat dissipation efficiency of the circuit board is further improved, and the service life of the circuit board is prolonged.
2. According to the invention, the heat conducting cotton is arranged, when the circuit board works, the circuit board can transfer heat to the heat conducting cotton, so that the heat conducting cotton can transfer heat to the air deflector through the inclined radiating strips, the shell can radiate the heat, the preliminary radiation of the heat of the circuit board is realized, and meanwhile, the large vent holes and the small vent holes on the heat conducting cotton can radiate the heat of the heat conducting cotton to the air and are blown away by the air flow, so that the radiation of the heat of the circuit board is accelerated, and the service life of the circuit board is prolonged.
3. According to the invention, the porous capillary layer is arranged, so that the porous capillary layer can quickly absorb the heat of the heat conduction pipe through the porous structure, the porous structure of the porous capillary layer can make the flow path of the cooling liquid more complex, so that the cooling liquid forms turbulence when flowing, and the heat exchange of the cooling liquid is quickened through the self-collision of the turbulence, so that the cooling liquid can absorb the heat from the circuit board more efficiently in the flowing process, the heat dissipation efficiency of the circuit board is further improved, and the service life of the circuit board is prolonged.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of the housing of the present invention;
FIG. 3 is an overall exploded view of the present invention;
FIG. 4 is an exploded view of the air-cooled reinforcement unit of the present invention;
FIG. 5 is a schematic view of the structure of the air deflector of the present invention;
FIG. 6 is a schematic view of the structure of the suction fan and the exhaust fan of the present invention;
FIG. 7 is a schematic view of a heat pipe according to the present invention;
FIG. 8 is a schematic drawing showing a heat pipe and a pipe network according to the present invention in section.
The air-cooling heat-dissipating device comprises a 1-base, a 2-shell, a 3-circuit board, a 4-suction fan, a 401-exhaust fan, a 5-air-cooling strengthening unit, 501-air deflectors, 5011-inclined heat-dissipating strips, 502-heat-conducting cotton, 5021-large vent holes, 5022-small vent holes, 503-air-limiting plates, 6-water-cooling strengthening units, 601-water pumps, 602-heat-conducting pipes, 603-backflow heat-dissipating pipes, 604-pipe networks, 6041-air flow holes and 605-porous capillary layers.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Example 1
An intelligent bidirectional inverter, as shown in fig. 1-3, comprises a base 1, a housing 2, a circuit board 3, an induced draft fan 4 and an exhaust fan 401, wherein the housing 2 is fixedly installed on the base 1, the top of the housing 2 is concave-convex, the inside heat dissipation of the housing 2 is accelerated, the circuit board 3 is installed on the base 1 through bolts, the circuit board 3 is located inside the housing 2, the induced draft fan 4 and the exhaust fan 401 are respectively installed on two sides of the base 1, the induced draft fan 4 is used for sucking external air into the housing 2, the exhaust fan 401 is used for guiding the air flow inside the housing 2 to be exhausted, so that the induced draft fan 4 and the exhaust fan 401 form stable air flow in the housing 2, and therefore, when the circuit board 3 dissipates heat, the air flow can efficiently absorb the heat of the circuit board 3 and exhaust the housing 2, the intelligent bidirectional inverter further comprises an air-cooling strengthening unit 5 and a water-cooling strengthening unit 6, wherein the air-cooling strengthening unit 5 is located at the top inside the housing 2 and used for strengthening the air flow formed in the housing 2, the efficiency of the circuit board 3 is improved, the water-cooling unit 6 is located at the top of the base 1 and used for further absorbing the heat generated by the circuit board 3.
As shown in fig. 4-5, the air cooling strengthening unit 5 includes an air deflector 501, the top end of the interior of the housing 2 is fixedly connected with the air deflector 501, the bottom of the air deflector 501 is an inclined plane, and the inclined plane faces the air suction fan 4, so that when the air flow formed by the air suction fan 4 and the exhaust fan 401 passes through the air deflector 501, the air flow can be gradually compressed along the inclined plane of the bottom of the air deflector 501, thereby gradually accelerating the flow of the air flow, and reducing the interference of the temperature gradual rise of the air flow on the subsequent heat dissipation of the circuit board 3 in the heat absorption process.
As shown in fig. 4 to 5, the air cooling strengthening unit 5 further includes inclined heat dissipating strips 5011, where the inclined heat dissipating strips 5011 are uniformly distributed at the bottom of the air guide plate 501 linearly, so as to guide the flow direction of the air flow in the housing 2 in the flowing process, and absorb the heat of the air flow through the surface of the air guide plate, and the heat is transferred to the housing 2 through the air guide plate 501, so that the housing 2 dissipates the heat to the outside through the concave-convex surface at the top of the air guide plate, thereby improving the efficiency of absorbing the heat of the circuit board 3 by the air flow.
As shown in fig. 4-5, the air cooling strengthening unit 5 further includes a heat conducting sponge 502, where the heat conducting sponge 502 is disposed between the oblique heat dissipating strip 5011 and the circuit board 3, and the heat conducting sponge 502 has a high heat conductivity coefficient, so that heat of the circuit board 3 can be quickly absorbed by the heat conducting sponge 502 and transferred to the heat conducting sponge 502, thereby increasing the heat dissipation speed between the circuit board 3 and the heat conducting sponge 502 and effectively improving the heat dissipation efficiency of the circuit board 3.
As shown in fig. 5, the heat conducting sponge 502 is of a porous structure, and the surface of the heat conducting sponge 502 is provided with a plurality of large vent holes 5021 and small vent holes 5022, wherein the small vent holes 5022 are distributed around the large vent holes 5021, and the small vent holes 5022 are communicated with the large vent holes 5021 through the porous structure of the heat conducting sponge 502, heat of the heat conducting sponge 502 can be emitted at the large vent holes 5021 and the small vent holes 5022 and absorbed by the air flow, the air flow can effectively take away the heat from the circuit board 3 through the large vent holes 5021 and the small vent holes 5022, so that the heat dissipation efficiency of the circuit board 3 is improved, the large vent holes 5021 can quickly pass through the air flow, the air flow at the small vent holes 5022 and the large vent holes 5021 can be quickly discharged out of the heat conducting sponge 502, the small vent holes 5022 can limit the flow speed of the air flow through the apertures, the air flow is more uniform at the small vent holes 5022, the air flow is more stable at the small vent holes 5022, and the heat absorption of the heat conducting sponge 502 and the circuit board 3 are prevented from being locally overheated.
As shown in fig. 4 and fig. 6, the air cooling strengthening unit 5 further includes a limited air plate 503, the limited air plate 503 is fixedly connected to two sides of the heat conducting sponge 502 in a rectangular distribution, and the limited air plate 503 is fixedly connected to the housing 2, so that the heat accumulating of the heat conducting sponge 502 caused by the air flow bypassing the heat conducting sponge 502 is prevented, and the stability of the heat conducting sponge 502 in the heat scattering process of the circuit board 3 is ensured.
As shown in fig. 6-7, the water cooling strengthening unit 6 includes a water pump 601, a heat conducting pipe 602 and a reflux heat dissipating pipe 603, wherein the two water pumps 601 are installed at the top of the base 1, the heat conducting pipe 602 is located below the circuit board 3, the heat conducting pipe 602 is filled with cooling liquid, the heat conducting pipe 602 is communicated with the two water pumps 601, one water pump 601 pushes the cooling liquid in the heat conducting pipe 602, the other water pump 601 pumps the cooling liquid in the heat conducting pipe 602, so that the flow of the cooling liquid in the heat conducting pipe 602 is accelerated, and the reflux heat dissipating pipe 603 is communicated between the two water pumps 601, so that the water pumps 601, the heat conducting pipe 602 and the reflux heat dissipating pipe 603 form a cooling liquid circulation loop.
As shown in fig. 6-7, the water cooling strengthening unit 6 further includes a pipe network 604, where the pipe network 604 is installed at the top of the heat conducting pipe 602, and the top of the pipe network 604 contacts with the circuit board 3, so that heat of the circuit board 3 can be transferred to the heat conducting pipe 602 through the pipe network 604, and the pipe network 604 can adapt to welding protrusions formed by welding electronic components on the circuit board 3 in the heat transfer process.
As shown in fig. 8, the pipe network 604 is composed of a plurality of metal pipes, the axial center of each metal pipe is provided with an air flow hole 6041, heat is transferred to the pipe network 604 through the circuit board 3, so that the heat at the top of the air flow hole 6041 of each metal pipe is higher, the heat at the bottom of the air flow hole 6041 is lower, the air temperature at the top of the air flow hole 6041 is higher than that at the bottom of the air flow hole 6041, the density of the air at the top of the air flow hole 6041 is reduced due to heat absorption, the volume is increased, the air at the top of the air flow hole 6041 of each metal pipe overflows from two ends of the air flow hole 6041, the air flows out of the casing 2 along with the air flow in the casing 2, the air pressure at the top of the air flow hole 6041 is reduced, the air at the bottom of the air flow hole 6041 flows upwards through air pressure difference, and external air enters the air flow hole 6041, so that the external air supplements the air overflowed from the air flow hole 6041, and the heat dissipation efficiency of the circuit board 3 is improved.
As shown in fig. 8, the water cooling strengthening unit 6 further includes a porous capillary layer 605, the top surface inside the heat conducting tube 602 is provided with the porous capillary layer 605, the contact area between the porous capillary layer 605 and the cooling liquid is greatly increased by the porous structure, when the heat of the heat conducting tube 602 is transferred to the cooling liquid by the porous capillary layer 605, the cooling liquid can effectively absorb the heat of the porous capillary layer 605, and when the cooling liquid passes through the porous capillary layer 605, the porous structure of the porous capillary layer 605 can make the flow path of the cooling liquid more complex, so that the cooling liquid is disturbed when flowing, and the heat is absorbed more easily.
When the circuit board 3 works, the electronic components of the circuit board 3 can generate heat, the heat is accumulated at the circuit board 3 to reduce the working efficiency and the service life of the electronic components, and when severe, the current on the circuit board 3 can protect and disconnect the current of the circuit board 3 to stop the equipment, so as to improve the heat dissipation efficiency of the circuit board 3 and reduce the heat accumulation problem caused by the shape of the circuit board 3.
When the circuit board 3 works, because the heat conducting cotton 502 has higher heat conductivity coefficient, the electronic element on the circuit board 3 can transfer heat to the heat conducting cotton 502, the heat conducting cotton 502 transfers heat to the inclined heat radiation strip 5011 at the top of the heat conducting cotton, the inclined heat radiation strip 5011 transfers heat to the shell 2 through the air deflector 501, the shell 2 radiates heat to the outside through the concave-convex surface at the top of the shell, thus realizing preliminary radiation of the heat of the circuit board 3, meanwhile, the staff starts the suction fan 4 and the exhaust fan 401, the suction fan 4 sucks the outside air into the shell 2, the exhaust fan 401 discharges the air in the shell 2, the ambient air pressure of the exhaust fan 401 is reduced, the outside air sucked by the suction fan 4 flows to the exhaust fan 401 through the air pressure difference in the shell 2, the air flow is guided into the large 5021 and the small 5022 of the heat conducting cotton 502, the heat conducting sponge 502 radiates the absorbed heat to the air at the large vent hole 5021 and the small vent hole 5022, so that the air at the large vent hole 5021 and the small vent hole 5022 absorbs the heat to be hot air, the air flow is mixed with the hot air through the large vent hole 5021 and the small vent hole 5022, and is enabled to contact the inclined heat radiation strip 5011 in the flowing process, the heat absorbed by the inclined heat radiation strip 5011 through the self surface is transferred to the shell 2 through the air deflector 501, the shell 2 radiates the heat to the outside through the self top, thereby the air flow can always effectively absorb the heat from the circuit board 3 when flowing above the circuit board 3, the heat radiation efficiency of the circuit board 3 is prevented from being reduced, the air flow is discharged out of the shell 2 through the exhaust fan 401 after passing through the large vent hole 5021 and the small vent hole 5022, and the temperature of the air flow is notably increased continuously in the flowing heat absorption process, so that the heat absorption efficiency of the air flow is reduced, the excessive heat of air current absorption can lead to circuit board 3 local heat to be difficult to distribute, to this, when air current flows in big air vent 5021 and little air vent 5022 department, can be guided by aviation baffle 501 and oblique heat dissipation strip 5011, lead to the flow cross-section of air current to reduce gradually, and then increase the pressure and the velocity of flow of air current, the air current velocity of flow becomes fast can avoid the excessive absorption to heat, prevent that the air current from absorbing excessive heat before passing circuit board 3 from interfering with the heat dissipation of circuit board 3, thereby realize the effective dissipation of circuit board 3 heat, and prevent the interference of circuit board 3 high temperature to operating condition, and then improved circuit board 3's life.
When the circuit board 3 radiates heat through air flow, a worker starts the water pump 601 to enable the water pump 601 to drive the cooling liquid in the heat conducting pipe 602 to flow, the cooling liquid in the heat conducting pipe 602 enters the reflux heat radiating pipe 603 through the water pump 601 to radiate heat, meanwhile, the cooling liquid in the reflux heat radiating pipe 603 is driven by the water pump 601 to flow back into the heat conducting pipe 602 to realize the circulation flow of the cooling liquid, when the circuit board 3 radiates heat, the heat of the circuit board 3 is transferred to the heat conducting pipe 602 through the pipe network 604 contacted with the bottom of the circuit board 3, so that the heat conducting pipe 602 absorbs the heat and is transferred to the Kong Maoxi layers 605, on one hand, because the porous capillary layer 605 has a porous structure, the contact area between the porous capillary layer 605 and the cooling liquid can be greatly increased, the heat of the heat conducting pipe 602 is quickly transferred to the cooling liquid through the porous structure of the porous capillary layer 605, so that the cooling liquid absorbs the heat, on the other hand, the porous structure of the porous capillary layer 605 can make the flow path of the cooling liquid become more complex, so that the cooling liquid is disturbed and forms turbulence when flowing, the heat exchange between the cooling liquid and the porous capillary layer 605 can be accelerated by self-collision of the turbulence, so that the cooling liquid can absorb the heat from the circuit board 3 more efficiently in the flowing process, the heat dissipation efficiency of the circuit board 3 is improved, and the service life of the circuit board 3 is further prolonged, and it is noted that, because the heat dissipation of the circuit board 3 is to transfer the heat from the circuit board 3 to the pipe network 604, the pipe network 604 further transfers the heat to the heat pipe 602, the pipe network 604 can generate a temperature gradient, that is, the temperature of the pipe network 604 near the top of the circuit board 3 is higher, the temperature of the pipe network 604 near the bottom of the heat pipe 602 is lower, and the air at the top of the air flow hole 6041 absorbs the heat at the top of the pipe network 604 so that the density is smaller, the volume becomes larger, make the air at air hole 6041 top spill over from air hole 6041 both ends, the crisscross many metal pipes of pipe network 604 makes pipe network 604 can the heat of circuit board 3 that makes a large tracts of land evenly absorb, and then make the air hole 6041 top of many metal pipes spill over the air after the heat absorption simultaneously, and the air after the heat absorption rises through self density, and the air current that flows in circuit board 3 department takes place to mix, the gas after mixing is discharged outside casing 2 through exhaust fan 401, along with the outflow of air at air hole 6041 top, air pressure at air hole 6041 top diminishes thereupon, the air at air hole 6041 bottom upwards flows through the atmospheric pressure difference, and make external air follow air flow entering air hole 6041, thereby make external air supply to air hole 6041 overflow, and limit the air flow direction of air in the casing 2, and the porous structure of heat conduction cotton 502 possesses dustproof dust absorption's function, thereby the pipe network that exists can be blocked by dust in the air current 502, prevent to get into the many metal pipes of 604, and then the air hole 603 of air hole 6041 is continued to flow, the efficiency of heat dissipation circuit board is improved, and the heat dissipation efficiency of air hole 6041 is continued to flow, further improved, the circuit board's heat has been improved, and the heat of air hole 603 has been continued to flow in the air hole 6041.
While the disclosure has been described with respect to only a limited number of embodiments, those skilled in the art, having benefit of this disclosure, will appreciate that various other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510976342.5A CN120498236B (en) | 2025-07-16 | 2025-07-16 | Intelligent bidirectional inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510976342.5A CN120498236B (en) | 2025-07-16 | 2025-07-16 | Intelligent bidirectional inverter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN120498236A CN120498236A (en) | 2025-08-15 |
| CN120498236B true CN120498236B (en) | 2025-09-30 |
Family
ID=96668065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202510976342.5A Active CN120498236B (en) | 2025-07-16 | 2025-07-16 | Intelligent bidirectional inverter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN120498236B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208908414U (en) * | 2018-11-27 | 2019-05-28 | 江西省珠峰机电设备有限公司 | A kind of energy saving frequency converter rapid heat radiation device |
| CN111371331A (en) * | 2018-12-26 | 2020-07-03 | 李恒营 | Photovoltaic equipment inverter heat dissipation device convenient to disassemble and assemble |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205283674U (en) * | 2015-12-23 | 2016-06-01 | 安徽广播影视职业技术学院 | Heat dissipation type non -linear editing equipment |
| CN109347752A (en) * | 2018-11-15 | 2019-02-15 | 江苏德联达智能科技有限公司 | A kind of router from heat dissipation |
| CN111327208B (en) * | 2018-12-14 | 2022-06-03 | 台达电子工业股份有限公司 | Inverter device with heat dissipation mechanism |
| CN212034657U (en) * | 2020-06-22 | 2020-11-27 | 深圳市鸿富诚屏蔽材料有限公司 | Integrated uniform temperature plate radiator |
-
2025
- 2025-07-16 CN CN202510976342.5A patent/CN120498236B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208908414U (en) * | 2018-11-27 | 2019-05-28 | 江西省珠峰机电设备有限公司 | A kind of energy saving frequency converter rapid heat radiation device |
| CN111371331A (en) * | 2018-12-26 | 2020-07-03 | 李恒营 | Photovoltaic equipment inverter heat dissipation device convenient to disassemble and assemble |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120498236A (en) | 2025-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP4386516A1 (en) | Heat dissipation device and server | |
| KR100939992B1 (en) | Cooling device for electric and electronic equipment and electric and electronic equipment equipped with it | |
| CN120498236A (en) | Intelligent bidirectional inverter | |
| CN220984570U (en) | A high-efficiency heat dissipation device for fuel cell | |
| CN216852949U (en) | Radiating fin | |
| CN220156945U (en) | Radiating assembly, electric control box and air conditioner | |
| CN112490206B (en) | Heat dissipation structure of switch tube, converter and air conditioner | |
| CN211656745U (en) | An electronic device cooling base | |
| WO2023169313A1 (en) | Heat dissipation device for electronic apparatus and electronic apparatus | |
| CN216775393U (en) | Air-cooled heat dissipation device and intensive chip system | |
| TWM635625U (en) | Air guiding device and ocp network card | |
| CN210986781U (en) | Forced air cooling system | |
| CN209914352U (en) | Radiating fin and radiating device using same | |
| CN208040510U (en) | engine cooling device | |
| CN223784615U (en) | A heat dissipation system and projection device | |
| CN223182523U (en) | Heat dissipation assembly and power conversion equipment with same | |
| CN223123433U (en) | Heat dissipating device and electronic equipment | |
| CN115515365A (en) | Integrated high-power heat dissipation module | |
| CN223584541U (en) | Energy storage devices | |
| CN223488637U (en) | Power conversion module and power conversion device | |
| CN220307674U (en) | Water cooling structure of power supply module | |
| CN223613387U (en) | A liquid crystal television with efficient heat dissipation function | |
| CN224068665U (en) | High-efficient heat dissipation optical transmitter and receiver | |
| CN223040395U (en) | A dust-proof industrial power supply | |
| CN216477586U (en) | Fast engine cylinder body dispels heat |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |