CN120404763B - Wafer overturning detection device - Google Patents
Wafer overturning detection deviceInfo
- Publication number
- CN120404763B CN120404763B CN202510916199.0A CN202510916199A CN120404763B CN 120404763 B CN120404763 B CN 120404763B CN 202510916199 A CN202510916199 A CN 202510916199A CN 120404763 B CN120404763 B CN 120404763B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/22—Devices influencing the relative position or the attitude of articles during transit by conveyors
- B65G47/24—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
- B65G47/248—Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles by turning over or inverting them
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- H10P74/203—
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- H10P74/23—
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Textile Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本申请公开一种晶圆翻转检测装置，包括抓取机构、翻转机构和检测机构。抓取机构包括两个机械臂。翻转机构包括翻转平台和翻转电机。翻转平台固定连接于翻转电机的输出轴，翻转电机的输出轴沿第一方向延伸。检测机构包括相机、承载组件、第一光源组件、第二光源组件和移动组件；检测机构在第二方向上位于翻转机构一侧；承载组件包括安装板和多个承载块；安装板设有通孔，多个承载块在通孔的周向上间隔设置；承载块位于伸出位置时，承载块至通孔中心的最小距离小于待测晶圆的半径；当有承载块位于缩进位置时，至少有三个承载块位于伸出位置；移动组件与安装板相连。该晶圆翻转检测装置能实现无遮挡的检测，能提高检测效率且能避免成本过高。
The present application discloses a wafer flip detection device, comprising a gripping mechanism, a flipping mechanism and a detection mechanism. The gripping mechanism comprises two robotic arms. The flipping mechanism comprises a flipping platform and a flipping motor. The flipping platform is fixedly connected to the output shaft of the flipping motor, and the output shaft of the flipping motor extends along a first direction. The detection mechanism comprises a camera, a carrying assembly, a first light source assembly, a second light source assembly and a moving assembly; the detection mechanism is located on one side of the flipping mechanism in the second direction; the carrying assembly comprises a mounting plate and a plurality of carrying blocks; the mounting plate is provided with a through hole, and the plurality of carrying blocks are spaced apart in the circumferential direction of the through hole; when the carrying block is in the extended position, the minimum distance from the carrying block to the center of the through hole is less than the radius of the wafer to be tested; when a carrying block is in the retracted position, at least three carrying blocks are in the extended position; the moving assembly is connected to the mounting plate. The wafer flip detection device can realize unobstructed detection, improve detection efficiency and avoid excessive costs.
Description
Technical Field
The present disclosure relates to wafer detection technology, and in particular, to a wafer overturn detecting device.
Background
Wafer refers to a circular silicon wafer or substrate, also known as a silicon wafer or liner, used in semiconductor processing. It is the basic material for manufacturing integrated circuits, wafers are generally made of monocrystalline silicon materials, the surface is very flat, the process of manufacturing wafers is called wafer manufacturing or semiconductor manufacturing, and involves a plurality of process steps, such as wafer growth, dicing, polishing and cleaning, on which the various components and layers of the integrated circuits can be manufactured by photolithography, thin film deposition, ion implantation, diffusion and metal deposition, etc., and on which a plurality of chips can be manufactured, each chip being used as an independent IC product by dicing and packaging, wafer manufacturing is a critical step in the semiconductor industry, affecting the quality, efficiency and cost of the integrated circuits, and after wafer manufacturing is completed, inspection of the wafer is required. Wafer inspection is a core link for ensuring the quality and yield of chips in semiconductor manufacturing, and relates to multidimensional technologies such as physical defect identification, dimension measurement, electrical property test and the like.
In the prior art, when detecting the wafer, the wafer needs to be clamped or supported, so that the wafer is at least partially shielded, the shielded part cannot be accurately detected, the detection efficiency is reduced, the detection effect is affected, and the outflow of defective products is possibly caused. In addition, because the requirements are different, some wafers need to be detected on two sides, some wafers only need to be detected on one side, and cameras required by high-precision detection are high in price, and meanwhile, the cost is excessively high when the cameras are arranged on the two sides.
Disclosure of Invention
In view of the shortcomings of the prior art, an object of the present disclosure is to provide a wafer overturning detection device, which can realize detection without shielding, can improve detection efficiency, and can avoid excessive cost.
In order to achieve the above object, an embodiment of the present disclosure provides a wafer overturn detecting device, including:
The grabbing mechanism comprises two mechanical arms, and the mechanical arms are used for grabbing and moving the wafer to be detected;
The overturning mechanism is positioned at one side of the grabbing mechanism in the first direction and comprises an overturning platform and an overturning motor, wherein the overturning platform is fixedly connected to an output shaft of the overturning motor, and the output shaft of the overturning motor extends along the first direction;
The detection mechanism is arranged on the same side of the grabbing mechanism and comprises a camera, a bearing assembly, a first light source assembly, a second light source assembly and a moving assembly, the detection mechanism is arranged on one side of the overturning mechanism in a second direction, the first direction is perpendicular to the second direction, the camera is fixedly arranged, the bearing assembly is arranged below the camera and comprises a horizontally arranged mounting plate and a plurality of bearing blocks which are movably arranged on the mounting plate, the mounting plate is provided with through holes, the bearing blocks are arranged at intervals in the circumferential direction of the through holes, the moving direction of the bearing blocks is parallel to the radial direction of the through holes, the bearing blocks are provided with an extending position and a retracting position, the minimum distance from the bearing blocks to the center of the through holes is smaller than the radius of a wafer to be detected when the bearing blocks are located at the retracting position, the minimum distance from the bearing blocks to the center of the through holes is larger than the radius of the wafer to be detected when the bearing blocks are located at the retracting position, and the bearing blocks are arranged at least in the three positions, and the bearing blocks can be respectively connected with the first light source assembly and the second light source assembly in the extending direction and the second direction when the bearing assembly is located at the extending position and the second light source assembly.
As a preferable implementation mode, one side of the bearing block, which is away from the center of the through hole, is fixedly connected with a connecting block, the mounting plate is fixedly connected with a fixed block and a guide piece, the guide piece radially extends along the through hole, the connecting block is slidably connected with the guide piece, a spring is arranged between the connecting block and the fixed block, a limiting piece is fixedly arranged on the connecting block and extends along a direction perpendicular to the radial direction of the through hole, the mounting plate is fixedly connected with a vertically extending rotating shaft, the rotating shaft is rotatably connected with a connecting rod, one end of the connecting rod is abutted against one side of the limiting piece, which is close to the bearing block, and the other end of the connecting rod is fixedly connected with the output end of the first driving piece.
As a preferable implementation mode, the number of the bearing blocks is six, the six bearing blocks are uniformly distributed in the circumferential direction of the through hole at intervals and are symmetrically arranged in the first direction and the second direction, and the moving directions of the output ends of the plurality of first driving pieces are parallel to the second direction.
As a preferred embodiment, the mounting plate is provided with an opening at one side in the first direction, the opening communicating with the through hole.
As a preferred embodiment, the detection mechanism further comprises a first fixed plate horizontally arranged and a support frame fixedly connected above the first fixed plate, the camera is fixedly connected to the support frame, the bearing assembly is slidably connected to the first fixed plate through the moving assembly, and the moving assembly comprises:
The two first sliding rails are fixedly connected to the upper surface of the first fixing plate and extend along the first direction;
the connecting plates are connected to the two first sliding rails in a sliding manner;
the second driving piece is connected with the connecting plate and is used for driving the connecting plate to move along the first direction;
the second sliding rail is fixedly connected to the upper surface of the connecting plate and extends along the second direction; the mounting plate is connected to the second sliding rail in a sliding manner;
and the third driving piece is connected with the mounting plate and is used for driving the mounting plate to move along the second direction.
As an optimal implementation mode, the first light source component is connected to the support frame through a first adjustable support, the second light source component is connected to the first fixed plate through a second adjustable support, and light rays irradiated on the upper surface of the wafer to be tested by the first light source component are staggered with light rays irradiated on the lower surface of the wafer to be tested by the second light source component.
As a preferable implementation mode, the turnover mechanism further comprises a second fixing plate which is horizontally arranged and aligned with the first fixing plate, and the fixed end of the turnover motor is fixedly connected to the upper surface of the second fixing plate.
As a preferred implementation mode, the second fixing plate is further provided with a position correction assembly, and the position correction assembly comprises a rotary table for bearing a wafer to be tested and a rotary motor connected to the rotary table, wherein the rotary table is horizontally arranged and is used for driving the rotary table to rotate around the vertical direction.
The second fixing plate is fixedly provided with a plurality of support columns, the tops of the support columns are connected with protection plates which are horizontally arranged, and the protection plates are located between the overturning platform and the position correction assembly.
As a preferable implementation mode, the bottom of the grabbing mechanism is connected to a third sliding rail, the third sliding rail extends along the second direction, and grabbing planes of the two mechanical arms are located at different heights.
Advantageous effects
The wafer overturning detection device provided by the embodiment is provided with a detection mechanism comprising a camera, a bearing component, a first light source component, a second light source component and a moving component, wherein the upper side and the lower side of a wafer to be detected on the bearing component can be polished through the first light source component above the bearing component and the second light source component below the bearing component, so that images shot by the camera are clearer, and the detection accuracy is improved. The moving assembly drives the bearing assembly to move in the first direction and the second direction, so that different parts of the wafer to be tested sequentially pass through the bottom of the camera, and photographing detection of all positions on one surface of the wafer to be tested is realized.
When the position where the wafer to be tested is contacted with the bearing block is moved to the position right below the camera, the bearing block moves to the retracted position along the radial direction from the extended position, so that the position is changed from the contact bearing state to the separation state with the wafer to be tested, the bearing part can not block the second light source assembly, the camera can shoot clear images of the wafer to be tested, which are not shielded under the irradiation of the first light source assembly and the second light source assembly, and therefore the detection without shielding is realized, and the detection accuracy is improved.
Meanwhile, as the plurality of bearing blocks are configured in such a way that when the bearing blocks are located at the retracted positions, at least three bearing blocks are located at the extended positions, even if part of the bearing blocks are located at the retracted positions for shooting the non-shielding images, the other at least three bearing blocks located at the extended positions can realize stable bearing of the wafer to be detected, so that the sustainable detection process is ensured, and the detection efficiency is improved.
In addition, the wafer overturning detection device is provided with a grabbing mechanism and an overturning mechanism, the wafer to be detected on the other side of the wafer to be detected can be overturned through the overturning mechanism according to requirements, and the wafer to be detected is moved to the overturning mechanism or the detection mechanism through the grabbing mechanism, so that the cost overhigh caused by the arrangement of two cameras is avoided. The grabbing mechanism comprises two mechanical arms, so that the waiting time of the detecting mechanism can be greatly shortened, after one wafer is detected, one mechanical arm takes out the wafer, and the other mechanical arm can immediately place the next wafer to be detected on the bearing assembly, so that the detecting efficiency is improved.
Specific embodiments of the invention are disclosed in detail below with reference to the following description and drawings, indicating the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the invention are not limited in scope thereby.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments.
It should be emphasized that the term "comprises/comprising" when used herein is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic perspective view of a wafer overturn detecting device according to the present embodiment;
fig. 2 is a schematic structural view of a grabbing mechanism provided in the present embodiment;
Fig. 3 is a schematic structural diagram of a turnover mechanism provided in the present embodiment;
fig. 4 is a schematic structural diagram of a detection mechanism provided in the present embodiment;
Fig. 5 is a schematic structural diagram of a carrier assembly according to the present embodiment;
FIG. 6 is a top view of a carrier assembly according to the present embodiment;
fig. 7 is a schematic structural diagram between a bearing block and a first driving member according to the present embodiment;
Fig. 8 is a schematic structural diagram of a moving assembly according to the present embodiment.
Reference numerals illustrate:
1. a grabbing mechanism; 11, a mechanical arm 12 and a third sliding rail;
2. A turnover mechanism; 21 parts of a turnover platform, 22 parts of a turnover motor, 23 parts of a second fixing plate, 24 parts of a position correction assembly, 241 parts of a turntable, 25 parts of a support column, 26 parts of a protection plate;
3. Detection mechanism, 31, camera, 32, bearing component, 321, mounting plate, 3211, through hole, 3212, opening, 322, bearing block, 3221, bearing surface, 3222, inclined plane, 323, connecting block, 324, fixed block, 325, guide, 326, spring, 327, limit piece, 328, rotating shaft, 329, connecting rod, 3210, first driving piece, 33, first light source component, 331, first adjustable bracket, 34, second light source component, 341, second adjustable bracket, 35, moving component, 351, first slide rail, 352, connecting plate, 353, second driving piece, 354, second slide rail, 355, third driving piece, 356, middle plate, 36, first fixed plate, 37, support frame;
10. the wafer to be tested, F, radial, X, first direction, Y, second direction, Z, vertical direction.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, shall fall within the scope of the invention.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Please refer to fig. 1 to 8. The embodiment of the application provides a wafer overturning detection device which comprises a grabbing mechanism 1, an overturning mechanism 2 and a detection mechanism 3.
As shown in fig. 1, the gripping mechanism 1 includes two mechanical arms 11, and the mechanical arms 11 are used for gripping and moving a wafer 10 to be tested. The tilting mechanism 2 is located on one side of the gripping mechanism 1 in the first direction X, and includes a tilting platform 21 and a tilting motor 22. The turnover platform 21 is fixedly connected to an output shaft of the turnover motor 22, and the output shaft of the turnover motor 22 extends along the first direction X. The turnover platform 21 is horizontally arranged, and the turnover motor 22 is used for driving the turnover platform 21 to rotate 180 degrees so as to enable the front surface of the wafer 10 to be tested to face upwards or the back surface of the wafer to be tested to face upwards. The detection mechanism 3 and the turnover mechanism 2 are positioned on the same side of the grabbing mechanism 1. The detection means 3 is located on one side of the tilting means 2 in the second direction Y. The first direction X and the second direction Y are two directions which are vertical in the horizontal plane, and the first direction X and the second direction Y are both vertical to the vertical direction Z.
As shown in fig. 4 to 8, the detection mechanism 3 includes a camera 31, a carriage assembly 32, a first light source assembly 33, a second light source assembly 34, and a moving assembly 35. The camera 31 is fixedly provided. The carrier assembly 32 is used for carrying the wafer 10 to be tested. The bearing assembly 32 is disposed below the camera 31. As shown in fig. 5, the carrier assembly 32 includes a horizontally disposed mounting plate 321, and a plurality of carrier blocks 322 movably disposed on the mounting plate 321. The mounting plate 321 is provided with through holes 3211, and a plurality of carrier blocks 322 are provided at intervals in the circumferential direction of the through holes 3211. The direction of movement of the bearing blocks 322 is parallel to the radial direction F of the through-hole 3211. The carrier block 322 has an extended position and a retracted position. When the carrier block 322 is in the extended position, the minimum distance from the carrier block 322 to the center of the through hole 3211 is smaller than the radius of the wafer 10 to be tested, and the carrier block 322 can carry the wafer 10 to be tested. When the carrier block 322 is in the retracted position, the minimum distance from the carrier block 322 to the center of the through hole 3211 is greater than the radius of the wafer 10 to be tested, and the carrier block 322 is separated from the wafer 10 to be tested. The plurality of carrier blocks 322 are configured such that when the carrier blocks 322 are in the retracted position, at least three of the carrier blocks 322 are in the extended position. The first light source assembly 33 and the second light source assembly 34 are disposed above and below the carrier assembly 32, respectively. The moving assembly 35 is connected to the mounting plate 321 and can drive the carrying assembly 32 to move in the first direction X and the second direction Y.
The wafer overturning detection device provided by the embodiment is provided with the detection mechanism 3 comprising the camera 31, the bearing component 32, the first light source component 33, the second light source component 34 and the moving component 35, and the upper side and the lower side of the wafer 10 to be detected on the bearing component 32 can be polished through the first light source component 33 above the bearing component 32 and the second light source component 34 below the bearing component 32, so that the image shot by the camera 31 is clearer, and the detection accuracy is improved. The moving component 35 drives the bearing component 32 to move in the first direction X and the second direction Y, so that different parts of the wafer 10 to be tested can sequentially pass through the bottom of the camera 31, and photographing detection of all positions on one surface of the wafer 10 to be tested is realized.
When the position where the wafer 10 to be tested contacts the carrier block 322 is moved to the position directly under the camera 31, the carrier block 322 moves from the extended position to the retracted position along the radial direction F, so that the contact carrier state with the wafer 10 to be tested is changed to the separated state, the carrier part does not block the second light source assembly 34, and the camera 31 can shoot clear images of the wafer 10 to be tested without shielding under the irradiation of the first light source assembly 33 and the second light source assembly 34, thereby realizing the detection without shielding and improving the accuracy of the detection.
Meanwhile, since the plurality of carrier blocks 322 are configured such that at least three carrier blocks 322 are located at the extended position when the carrier blocks 322 are located at the retracted position, even if part of the carrier blocks 322 are located at the retracted position for capturing the unoccluded image, the other at least three carrier blocks 322 located at the extended position can realize stable carrying of the wafer 10 to be tested, thereby ensuring sustainable detection process and improving detection efficiency.
In addition, the wafer overturning detection device is provided with a grabbing mechanism 1 and an overturning mechanism 2, and can overturn the wafer 10 to be detected on the other surface to be detected through the overturning mechanism 2 according to requirements, and the wafer 10 to be detected is moved to the overturning mechanism 2 or the detection mechanism 3 through the grabbing mechanism 1, so that the cost caused by arranging two cameras 31 is avoided being too high. The grabbing mechanism 1 comprises two mechanical arms 11, so that the waiting time of the detecting mechanism 3 can be greatly shortened, after one wafer is detected, one mechanical arm 11 is taken out, and the other mechanical arm 11 can immediately place the next wafer 10 to be detected on the bearing component 32, so that the detecting efficiency is improved.
In this embodiment, as shown in fig. 7, a connecting block 323 is fixedly connected to a side of the bearing block 322 facing away from the center of the through hole 3211, a fixing block 324 and a guide 325 are fixedly connected to the mounting plate 321, and the guide 325 extends along the radial direction F of the through hole 3211. The connection block 323 is slidably connected to the guide 325. A spring 326 is provided between the connecting block 323 and the fixing block 324, and the bearing block 322 is in an extended position under the action of the spring 326. The connecting block 323 is driven by an external force, so that the connecting block 323 moves along the guide 325 in a direction away from the center of the through hole 3211, and the spring 326 is compressed, thereby allowing the carrier block 322 to be in the retracted position. When the external force is removed, the compressed springs 326 return, and the carrier blocks 322 return to the extended position under the urging of the springs 326.
Specifically, the connecting block 323 is fixedly provided with a limiting member 327, and the limiting member 327 extends along a direction perpendicular to the radial direction F of the through hole 3211. A vertically extending spindle 328 is fixedly connected to the mounting plate 321. A link 329 is rotatably connected to the shaft 328, and the shaft 328 is located approximately at the center of the link 329, and the link 329 is rotatable about the shaft 328. One end of the connecting rod 329 is abutted against one side of the limiting piece 327, which is close to the bearing block 322, and the other end of the connecting rod 329 is fixedly connected to the output end of the first driving piece 3210. The first driving member 3210 is configured to drive one end of the link 329 to move, so that the link 329 rotates, and the end of the link 329 abutting against the limiting member 327 moves correspondingly, so as to apply an external force to the connection block 323, thereby moving the bearing block 322 from the extended position to the retracted position. By driving the carrier block 322 by means of the first driving member 3210 and the link 329, the space on the mounting plate 321 may be reasonably utilized. Preferably, the first driver 3210 employs an air cylinder.
The plurality of first driving members 3210 may be electrically connected to the controller, the controller is electrically connected to the moving assembly 35, when the moving assembly 35 drives the carrier assembly 32 to move, the first driving member 3210 corresponding to the carrier block 322 is started when the position of the wafer 10 to be tested contacting the carrier block 322 is located under the camera 31, so that the carrier block 322 is retracted and separated from the wafer 10 to be tested, when the position of the wafer 10 to be tested contacting the carrier block 322 is not located under the camera 31, the first driving member 3210 is reset, the acting force of the connecting rod 329 on the limiting member 327 is relieved, and the carrier block 322 is restored to the extended position under the restoring force of the spring 326.
In this embodiment, an opening 3212 is disposed at one side of the mounting plate 321 in the first direction X, the opening 3212 is communicated with the through hole 3211, and the opening 3212 can reserve enough feeding space for the mechanical arm 11, so that the mechanical arm 11 can move the wafer 10 to be tested to the through hole 3211 and place the wafer on the plurality of carrier blocks 322.
Specifically, the number of carrier blocks 322 is at least four. In a preferred embodiment, the number of carrier blocks 322 is six, and when one of the carrier blocks 322 is moved to the retracted position just under the camera 31, the remaining five carrier blocks 322 can stably support the wafer 10 to be tested.
As shown in fig. 6, six bearing blocks 322 are uniformly distributed at intervals in the circumferential direction of the through hole 3211 and are symmetrically arranged in both the first direction X and the second direction Y. Since the opening 3212 is located at one side of the mounting board 321 in the first direction X, there are two bearing blocks 322 located at both ends of the diameter of the through hole 3211 extending in the second direction Y, respectively, and two bearing blocks 322 located at both sides of the opening 3212. The included angle between the connecting line of two adjacent bearing blocks 322 and the center of the through hole 3211 is 60 degrees.
Preferably, the moving directions of the output ends of the first driving members 3210 are parallel to the second direction Y, so as to facilitate layout and control of the first driving members 3210.
As shown in fig. 7, a bottom of the carrier block 322 is provided with a carrier plane 3221 for carrying the wafer 10 to be tested, the carrier planes 3221 are horizontally arranged, and the carrier planes 3221 of the plurality of carrier blocks 322 are located in the same plane. One end of the supporting surface 3221 facing the center of the through hole 3211 is connected with an inclined surface 3222, the inclined surface 3222 is not higher than the supporting surface 3221, and the inclined surface 3222 can avoid the right-angle edge of the supporting surface 3221 from scratching and damaging the wafer 10 to be tested.
In the present embodiment, as shown in fig. 4, the detection mechanism 3 further includes a first fixing plate 36 disposed horizontally, and a supporting frame 37 fixedly connected to the upper side of the first fixing plate 36. The detection mechanism 3 may be mounted to a specific work surface by a first fixing plate 36. The camera 31 is fixedly connected to the supporting frame 37, so that vibration caused by movement can be avoided, and the detection accuracy is ensured. The carrier assembly 32 is slidably coupled to the first fixed plate 36 by a moving assembly 35.
Specifically, as shown in fig. 8, the moving assembly 35 includes two first slide rails 351, a connection plate 352, a second driving member 353, a second slide rail 354, and a third driving member 355. Two first slide rails 351 are fixedly connected to the upper surface of the first fixing plate 36. The first slide rail 351 extends along a first direction X. The two first sliding rails 351 are disposed at intervals in the second direction Y. The connection plate 352 is slidably connected to two first slide rails 351. The second driving member 353 is connected to the connecting plate 352 for driving the connecting plate 352 to move along the first direction X. The second sliding rail 354 is fixedly connected to the upper surface of the connecting plate 352. The second sliding rail 354 extends along the second direction Y. The mounting plate 321 is slidably coupled to the second slide rail 354 by an intermediate plate 356. The third driving member 355 is connected to the mounting plate 321, and is configured to drive the middle plate 356 to move the mounting plate 321 along the second direction Y.
In the present embodiment, the first light source assembly 33 is connected to the support frame 37 through the first adjustable bracket 331. By adjusting the angle between the first adjustable bracket 331 and the horizontal plane, the angle of the first light source assembly 33 can be adjusted. The second light source assembly 34 is connected to the first fixing plate 36 through a second adjustable bracket 341. The angle of the second light source assembly 34 can be adjusted by adjusting the angle of the second adjustable bracket 341 with the horizontal plane.
Preferably, the light rays of the first light source assembly 33 irradiating the upper surface of the wafer 10 to be tested are staggered with the light rays of the second light source assembly 34 irradiating the lower surface of the wafer 10 to be tested, namely, the two light source assemblies are positioned on different vertical planes, so that the irradiation light of the two light source assemblies cannot interfere, the definition of the image shot by the camera 31 can be ensured, and the inspection accuracy is improved.
In this embodiment, as shown in fig. 3, the tilting mechanism 2 further includes a second fixing plate 23 disposed horizontally, and the second fixing plate 23 is disposed in alignment with the first fixing plate 36. Preferably, the second fixing plate 23 is fixedly connected with the first fixing plate 36, which makes the whole device more compact and shortens the moving distance of the mechanical arm 11. The fixed end of the turnover motor 22 is fixedly connected to the upper surface of the second fixing plate 23.
Preferably, the second fixing plate 23 is further provided with a position correction assembly 24, which includes a turntable 241 for carrying the wafer 10 to be tested, and a rotating motor connected to the turntable 241. The turntable 241 is horizontally arranged, and the rotating motor is used for driving the turntable 241 to rotate around the vertical direction Z, so that the wafer 10 to be measured can be adjusted to a required position in the horizontal plane.
Specifically, the position correction assembly 24 is located below the overturning platform 21, so that the device structure is more compact, and the moving distance of the mechanical arm 11 is shortened. The second fixed plate 23 is last to be fixedly provided with a plurality of support columns 25, and the top of support column 25 is connected with the guard plate 26 that the level set up, and guard plate 26 is located between upset platform 21 and the position correction subassembly 24, can prevent that upset platform 21 from inefficacy leading to the wafer to drop on the position correction subassembly 24.
As shown in fig. 2, the bottom of the grabbing mechanism 1 is connected to a third slide rail 12, and the third slide rail 12 extends along the second direction Y, so that the grabbing mechanism 1 can move back and forth between the turning mechanism 2 and the detecting mechanism 3. The two mechanical arms 11 can be connected to the same vertical track or to different vertical tracks to realize lifting. The grabbing planes of the two mechanical arms 11 are located at different heights, so that interference is avoided.
In a specific application scenario, if only the front surface of the wafer needs to be detected, the mechanical arm 11 moves the wafer 10 to be detected to the position correction component 24, after the position correction is completed, the mechanical arm 11 moves the wafer 10 to be detected to the carrying component 32 for wafer detection, and after the detection is completed, the mechanical arm 11 takes away the wafer.
If only the back surface of the wafer needs to be detected, the mechanical arm 11 moves the wafer 10 to be detected to the overturning platform 21, after the overturning of the wafer is completed, the mechanical arm 11 moves the wafer 10 to be detected to the position correcting component 24, after the position correction is completed, the mechanical arm 11 moves the wafer 10 to be detected to the bearing component 32 for detecting the wafer, and after the detection is completed, the mechanical arm 11 takes away the wafer.
If the front and back sides of the wafer need to be detected, the mechanical arm 11 moves the wafer 10 to be detected to the position correction component 24, after the position correction is completed, the mechanical arm 11 moves the wafer 10 to be detected to the bearing component 32 for wafer detection, after the detection is completed, the mechanical arm 11 moves the wafer to the overturning platform 21, after the overturning of the wafer is completed, the mechanical arm 11 moves the wafer 10 to be detected to the bearing component 32 for wafer detection, and after the detection is completed, the mechanical arm 11 takes away the wafer.
It should be noted that, in the description of the present specification, the terms "first," "second," and the like are used for descriptive purposes only and to distinguish between similar objects, and there is no order of preference therebetween, nor should it be construed as indicating or implying relative importance. In addition, in the description of the present specification, unless otherwise indicated, the meaning of "a plurality" is two or more.
Any numerical value recited herein includes all values of the lower and upper values that are incremented by one unit from the lower value to the upper value, as long as there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of components or the value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, then the purpose is to explicitly list such values as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. in this specification as well. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be explicitly recited in this description, and all possible combinations of values recited between the lowest value and the highest value are believed to be explicitly stated in the description in a similar manner.
Unless otherwise indicated, all ranges include endpoints and all numbers between endpoints. "about" or "approximately" as used with a range is applicable to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30," including at least the indicated endpoints.
All articles and references, including patent applications and publications, disclosed herein are incorporated by reference for all purposes. The term "consisting essentially of" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not substantially affect the essential novel features of the combination. The use of the terms "comprises" or "comprising" to describe combinations of elements, components, or steps herein also contemplates embodiments consisting essentially of such elements, components, or steps. By using the term "may" herein, it is intended that any attribute described as "may" be included is optional.
Multiple elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, component, section or step is not intended to exclude other elements, components, sections or steps.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated herein by reference for the purpose of completeness. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to forego such subject matter, nor should the inventors regard such subject matter as not be considered to be part of the disclosed subject matter.
Claims (9)
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| TW202335119A (en) * | 2022-02-21 | 2023-09-01 | 晟耀光電科技股份有限公司 | A wafer multi directional flip detection machine |
| CN119852237A (en) * | 2025-03-21 | 2025-04-18 | 杭州光研科技有限公司 | Wafer bearing device, detection equipment and detection method |
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| TW202335119A (en) * | 2022-02-21 | 2023-09-01 | 晟耀光電科技股份有限公司 | A wafer multi directional flip detection machine |
| CN119852237A (en) * | 2025-03-21 | 2025-04-18 | 杭州光研科技有限公司 | Wafer bearing device, detection equipment and detection method |
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