CN120358666B - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipmentInfo
- Publication number
- CN120358666B CN120358666B CN202510855028.1A CN202510855028A CN120358666B CN 120358666 B CN120358666 B CN 120358666B CN 202510855028 A CN202510855028 A CN 202510855028A CN 120358666 B CN120358666 B CN 120358666B
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- China
- Prior art keywords
- chip
- liquid cooling
- circuit board
- cooling channels
- board assembly
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K1/184—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components inserted in holes through the PCBs and wherein terminals of the components are connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本申请提供了一种电路板组件和电子设备，包括板材主体和至少一个芯片，板材主体包括相对的第一表面和第二表面，第一表面上包括至少一个芯片区，每个芯片设置在对应的芯片区上，其核心区的电源引脚通过对应芯片区内的过孔扇出。板材主体内设有多个与芯片相对应的液冷通道，并以利用填充在液冷通道内的冷却介质快速吸收芯片产生的热量。本申请解决了高功率芯片相关电路板组件和电子设备高集成度与散热设计难以兼容的问题，提升了电路板组件和电子设备的集成度及小型化，进一步降低了生产成本。
The present application provides a circuit board assembly and electronic device, comprising a board body and at least one chip. The board body comprises a first surface and a second surface relative to each other. The first surface comprises at least one chip area. Each chip is disposed on a corresponding chip area, and the power pins of its core area fan out through vias within the corresponding chip area. The board body is provided with a plurality of liquid cooling channels corresponding to the chips, and utilizes a cooling medium filled in the liquid cooling channels to quickly absorb the heat generated by the chips. The present application solves the problem of high integration and heat dissipation design difficulties in high-power chip-related circuit board assemblies and electronic devices, thereby improving the integration and miniaturization of circuit board assemblies and electronic devices and further reducing production costs.
Description
Technical Field
The present application relates to the field of heat dissipation technologies, and in particular, to a circuit board assembly and an electronic device.
Background
With the development of electronic devices toward high performance and high integration, thermal management of PCBs (Printed Circuit Boar, printed circuit boards) is increasingly problematic in application scenarios such as AI servers, data centers, and the like. The heat dissipation of the traditional printed circuit board assembly mainly depends on surface cooling fins or metal substrates for heat dissipation, or a fan module is arranged, air cooling heat dissipation is carried out by blowing air to the printed circuit board assembly through the fan module, or a metal cooling plate is arranged above a high-power chip (such as a CPU (Central processing Unit), a GPU (graphic processing Unit) and a power MOSFET), and heat is taken away by flowing cooling liquid in a cooling plate liquid flow channel.
However, these existing heat dissipation methods have obvious limitations. For example, the problems of single heat dissipation path, complex structure and large occupied space are existed, and the compactness of the electronic device structure and the high efficiency of heat dissipation efficiency are difficult to be considered, which is not beneficial to the miniaturization and high-density integrated design of the electronic equipment such as a server.
Disclosure of Invention
The present disclosure provides a circuit board assembly and an electronic device, and is mainly aimed at realizing the use requirements of compactness and heat dissipation efficiency of the circuit board assembly.
To achieve the above object, an embodiment of a first aspect of the present application provides a circuit board assembly, including:
A sheet body comprising opposing first and second surfaces, the first surface comprising a plurality of chip regions thereon, each chip region comprising a plurality of vias extending from the first surface to one side of the second surface, the vias being filled with metal connections;
A sheet body comprising opposing first and second surfaces, the first surface comprising at least one chip region thereon, each chip region comprising a plurality of vias extending from the first surface to one side of the second surface, the vias being filled with metal connections;
The chip comprises at least one chip, at least one power supply pin, at least one power supply circuit and at least one power supply circuit, wherein the chip is arranged on a chip area;
The plate comprises a plate body, wherein a plurality of liquid cooling channels corresponding to the chips are arranged in the plate body, the liquid cooling channels are mutually spaced in a first direction and extend along a second direction and penetrate through the plate body, the first direction is orthogonal to the second direction, and an orthogonal plane is parallel to the first surface.
Optionally, the diameters and/or the numbers of the liquid cooling channels corresponding to the chips with different power thresholds are different.
Optionally, the power pins of the chips with different power thresholds have different apertures corresponding to the vias of the fan-out.
Optionally, the via hole includes at least one of a through hole and a blind hole.
Optionally, the vertical projection of the blind hole on the first surface is completely or partially overlapped with the vertical projection of the liquid cooling channel on the first surface, and the vertical projection of the through hole on the first surface is not overlapped with the vertical projection of the liquid cooling channel on the first surface.
Optionally, the chip comprises at least one of a first chip, a second chip and a third chip with power thresholds sequentially increased, wherein,
The apertures of the through holes corresponding to fan-out of the first chip, the second chip and the third chip are sequentially increased;
And/or the diameters of the liquid cooling channels corresponding to the first chip, the second chip and the third chip are sequentially increased;
And/or the number of the liquid cooling channels corresponding to the first chip, the second chip and the third chip is increased in sequence.
Optionally, the aperture range of the power pin of the first chip in the via hole corresponding to the fan-out of the chip area is 0.2 mm-0.25 mm;
and/or the aperture range of the power pin of the second chip in the through hole corresponding to the fan-out of the chip area is 0.25 mm-0.3 mm;
and/or the aperture range of the through hole of the power pin of the third chip corresponding to the fan-out in the chip area is 0.3 mm-0.35 mm.
Optionally, the number of the liquid cooling channels corresponding to the first chip is 2-3, and the diameter of each liquid cooling channel is 1 mm-1.3 mm;
And/or the number of the liquid cooling channels corresponding to the second chip is 2-3, and the diameter of each liquid cooling channel is 1.3-1.7 mm;
And/or the number of the liquid cooling channels corresponding to the third chip is not less than 3, and the diameter of each liquid cooling channel is 1.7 mm-2 mm.
Optionally, the spacing of the centers of adjacent liquid channels in the first direction is not less than 4mm.
Optionally, the two ends of the plurality of liquid cooling channels in the second direction respectively penetrate through the plate main body and extend to a side far away from the plate main body by a first preset length, and the range of the first preset length is not less than 100 mm.
Optionally, the two sides of the plate main body along the second direction further respectively include a liquid inlet pipeline and a liquid outlet pipeline extending along the first direction, the liquid inlet pipeline is communicated with the inlet end of each liquid cooling channel, and the liquid outlet pipeline is communicated with the outlet end of each liquid cooling channel.
To achieve the above object, an embodiment of a second aspect of the present application provides an electronic device, including a circuit board assembly according to any one of the above aspects.
The circuit board assembly and the electronic equipment provided by the application at least have the following excellent effects:
The application provides a circuit board assembly and electronic equipment, which comprises a board main body and at least one chip, wherein the board main body comprises a first surface and a second surface which are opposite, the first surface comprises at least one chip area, each chip is arranged on the corresponding chip area, and a power pin of the core area passes through Kong Shanchu in the corresponding chip area. The plate main body is internally provided with a plurality of liquid cooling channels corresponding to the chips, and the cooling medium filled in the liquid cooling channels is utilized to quickly absorb heat generated by the chips. Compared with the prior art, the application removes the requirement of installing an air-cooled radiator, a fan module or a liquid-cooled cold plate outside the circuit board assembly, reduces the assembly size of the whole machine body, improves the integration level and miniaturization of the circuit board assembly and the electronic equipment, further reduces the production cost of the circuit board assembly and the electronic equipment, and solves the technical problem that the high integration level and the heat dissipation design of the high-power chip related electronic equipment are difficult to be compatible.
Additional aspects and advantages of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic top view of a circuit board assembly according to an embodiment of the present application;
fig. 2 is a schematic perspective view of a circuit board assembly according to an embodiment of the present application;
FIG. 3 is a schematic longitudinal cross-sectional view of a circuit board assembly taken along line AA in FIG. 2;
FIG. 4 is a schematic longitudinal cross-sectional view of another circuit board assembly taken along line AA in FIG. 2;
Fig. 5 is a schematic top view of another circuit board assembly according to an embodiment of the application.
Fig. 6 is a schematic diagram of an integrated liquid cooling assembly according to an embodiment of the application.
100 Plate main body, 101 chip area, 110 via hole, 120 liquid cooling channel, 130 liquid inlet channel, 140 liquid outlet channel, 200 power chip, 201 core area, 210 first chip, 220 second chip and 230 third chip.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application.
Along with the development of electronic equipment towards high performance and high integration, the heat dissipation design of the circuit board assembly is a key link for ensuring the operation performance, reliability and service life of a high-power chip, especially in a high-power density scene (such as an AI server, a data center and the like), the power of a semiconductor chip is higher and the power of the semiconductor chip is smaller, so that the heat dissipation requirement of the semiconductor chip and an electronic product is difficult to meet due to the traditional circuit board assembly structure, and the application requirement of the electronic equipment in the high-power density scene is limited.
The existing circuit board assembly mainly relies on surface radiating fins or metal base plates to radiate heat, or a fan module is arranged on the outer side of the circuit board assembly, air cooling and radiating are carried out by blowing air to the circuit board assembly through the fan module, or a metal cold plate is arranged above a high-power chip, and heat is taken away through flowing of cooling liquid in a liquid flow channel in the cold plate. However, these existing heat dissipation methods have obvious limitations. Firstly, the heat dissipation method of relying on the surface heat dissipation sheet or the metal substrate for heat dissipation is generally relatively single in heat dissipation path, so that heat cannot be rapidly diffused easily, and the problem of low heat dissipation efficiency exists. Secondly, the heat efficiency of conventional air-cooled heat dissipation is relatively limited, and the fan noise is larger, so that the fan occupies a larger space of the whole system and is greatly influenced by the environment. In addition, the liquid cooling cold plate heat dissipation method is generally high in cost, the whole machine heat dissipation system is complex, heat dissipation requirements of the whole plate among various power chips cannot be met, and meanwhile the risk of leakage of heat conduction liquid exists.
That is, the heat dissipation design of the current circuit board assembly structure often has difficulty in considering the compactness of the electronic device structure and the high efficiency of the heat dissipation efficiency, which is not beneficial to the miniaturization and high-density integration design of the electronic devices such as the server. Therefore, the heat dissipation problem of high power chips (such as DCDC power conversion chips, LDO linear regulator chips, CPU chips, GPU chips, power MOSFETs, etc.) has become an important point and difficulty in the current structural design research of circuit board assemblies.
Based on the problems, the application provides the circuit board assembly and the electronic equipment, which can be used for adjusting the sizes of the fan-out through holes of the power pins of the chips on the panel main body according to the heat dissipation requirements of the chips with different power thresholds on the circuit board assembly, so as to meet the heat dissipation requirements of the chips with different power thresholds. Meanwhile, according to the chips with different power thresholds, liquid cooling channels with different sizes and/or numbers are correspondingly arranged in the circuit board assembly.
In addition, compared with the prior art, the circuit board assembly and the electronic equipment provided by the application have the advantages that the installation requirements of an external air-cooled radiator and a fan or a liquid-cooled cold plate of the circuit board are eliminated in the whole assembly process, the assembly size of the whole body is reduced, the integration level of the circuit board assembly and the electronic equipment is improved, the miniaturization of the circuit board assembly and the electronic equipment is promoted, the production cost of the circuit board assembly and the electronic equipment is further reduced, and the technical problem that the high integration level and the heat dissipation design of the current high-power chip and the related electronic equipment are difficult to be compatible is solved.
According to one aspect of the present application, there is provided a circuit board assembly, as shown in fig. 1, including a board body 100 and at least one chip 200. The board body 100 includes a first surface and a second surface opposite to each other, the first surface includes at least chip regions 101, each chip region 101 further includes a plurality of vias 110 extending from the first surface to one side of the second surface, and the vias 110 are filled with metal connection portions (not shown). Each chip 200 is disposed on the first surface and on the corresponding chip area 101, and the core area 201 is provided with power pins disposed in an array, the power pins pass through the through Kong Shanchu in the corresponding chip area, and the power pins of the chips 200 with different power thresholds have different apertures corresponding to the fanout through holes.
The board body 100 is typically made by laminating a plurality of circuit board layers, each of which has a plurality of wires thereon to communicate with a plurality of circuits to form a plurality of network structures including conductive layers connected to the vias. The chip 200 is disposed on the board main body 100, and the power pins thereof are communicated with the through holes on the board main body 100, so that the conductive layer can supply power to the chip 200 through the through holes, and the chip 200 can work to generate heat.
It will be appreciated that, since the power of the chip 200 is positively correlated with the heat generated by the corresponding power, the heat generated by the chips 200 with different power thresholds at the unit time is different, and the larger the power of the chip 200, the more heat is generated per unit time. Therefore, according to the actual power threshold of the chip 200, the aperture of the via hole 110 in the different chip areas 101 is adapted to the actual power threshold of the chip 200, and the apertures of the fan-out via holes 110 corresponding to the power pins of the chip 200 with different power thresholds are made to be different, so that the heat dissipation requirements of the chip 200 with different power thresholds are met.
Since the inside of each via hole 110 is filled with a conductive metal connection part, for example, a plating filling process is adopted, the inside of the via hole 110 is fully filled to form solid metal copper, and the metal connection part formed by the solid metal copper can enable the power pin of the chip 200 to be electrically connected with the conductive layer of the plate body 100 through the via hole 110, and enable the chip 200 to conduct electricity and generate heat. Meanwhile, heat generated by the operation of the chip 200 can be quickly transferred into the plate body 100 or the second surface of the plate body 100 through the solid metal copper in the via hole 110, so that heat accumulation between the chip 200 and the first surface does not occur. The larger the aperture of the via hole 110, the larger the size of the solid metal copper filled in the via hole 110, the stronger the heat conduction capability of the chip 200, and the heat dissipation requirement of the chip 200 is ensured.
It should be noted that, the solid metal copper filled in the via hole 110 is used as a metal connection portion as described above by way of example only, and in other embodiments, the metal connection portion may be another metal or an alloy thereof with excellent conductive and heat dissipation capabilities, including but not limited to gold, silver, aluminum, platinum, tin, and other metal simple substances or alloys.
In order to facilitate better export of heat generated by the chip 200 by the via hole 110, in the design process of the circuit board assembly, the fan-out of the power pins of the chip 200 may also use a hole-in-disc process, so that the power pins of the chip 200 may directly transmit heat to other areas of the board main body 100 through the metal connection portion in the via hole 110, thereby further improving the heat dissipation efficiency of the chip 200.
As shown in fig. 1 to 3, a plurality of liquid cooling channels 120 corresponding to each chip 200 are further disposed on a side, close to the first surface, of the plate main body 100, and a cooling medium flowing in a directional manner is injected into each liquid cooling channel 120, so that the cooling medium continuously transfers heat from the chips 200 to the interior of the plate main body 100to be led out, the heat dissipation effect of the chips is better improved, and the electronic equipment has better electrical stability. The cooling medium may include, but is not limited to, cooling water, cooling oil or liquid refrigerant with a low temperature (for example, 1 ℃ to 5 ℃), and the specific type of the cooling medium in the embodiment of the present application may not be limited.
For convenience of description, one side in the horizontal direction on the first surface of the panel body 100 may be set as a first direction, and one side in the vertical direction on the first surface may be set as a second direction, the first direction being orthogonal to the second direction, and the orthogonal plane being parallel to the first surface.
Therefore, in the present application, the plurality of liquid cooling channels 120 extending in the second direction and penetrating through the plate main body 100 are disposed in the plate main body 100 in the corresponding range of each chip area 101, so as to increase the contact area between the liquid cooling channels 120 and the plate main body 100, so that when the heat generated by the chips 200 mounted on each chip area 101 is transferred to the plate main body 100, the heat can be quickly absorbed and exported by the cooling medium injected into the liquid cooling channels 120 for directional flow, thereby also ensuring the stability of the internal temperature of the plate main body 100.
In order to improve the heat conduction efficiency of the liquid cooling channel 120 in the plate body 100, the liquid cooling channel 120 is disposed in the plate body 100 at a position near the first surface of the plate body 100, so that the liquid cooling channel 120 is closer to the chip 200 mounted on the corresponding chip area 101. Meanwhile, on the premise of ensuring that the thickness of the plate main body 100 is constant, the larger the diameter of the liquid cooling channel 120 is, the larger the number of the liquid cooling channels is arranged in the corresponding range of the chip area 101, the stronger the heat conducting capacity of the liquid cooling channels to the chip 200 is, and the heat dissipation requirement of the chip 200 can be ensured.
In order to facilitate that heat generated by the chip 200 can be better absorbed and exported by the liquid cooling channels 120, the application also adapts the diameter and the number of each liquid cooling channel 120 corresponding to different chips to the actual power threshold of the chip 200 according to the actual power threshold of the chip 200, and makes the diameters of the liquid cooling channels 120 corresponding to different chips 200 different, the number of the liquid cooling channels 120 is the same or different, for example, the number of the liquid cooling channels 120 is adaptively increased along with the increase of the power threshold of the chip 200, so as to meet the heat dissipation requirement of different chips 200.
As an example, as shown in fig. 1 to 4, the chips 200 with different power thresholds include at least one of a first chip 210, a second chip 220, and a third chip 230. The power threshold of the first chip 210 is 20W to 50W, the power threshold of the second chip 220 is 50W to 100W, and the power threshold of the third chip 230 is greater than 100W.
As shown in fig. 1, since the power thresholds of the first chip 210, the second chip 220 and the third chip 230 are sequentially increased, and the power of the chip 200 is positively correlated with the heat generated by the corresponding chip 200, the apertures of the through holes 110 corresponding to the fan-out of the power pins of the first chip 210, the second chip 220 and the third chip 230 are sequentially increased. For example, the aperture range of the power pin of the first chip 210 corresponding to the fanout via 110 is 0.2 mm-0.25 mm, preferably 0.2mm, the aperture range of the power pin of the second chip 220 corresponding to the fanout via 110 is 0.25 mm-0.3 mm, preferably 0.25mm, and the aperture range of the power pin of the third chip 230 corresponding to the fanout via 110 is 0.3 mm-0.35 mm, preferably 0.3mm.
Similarly, as shown in fig. 1 and 3, since the power thresholds of the first chip 210, the second chip 220 and the third chip 230 are sequentially increased, and the power of the chip 200 is positively correlated with the heat generated by the corresponding chips 200, the number and/or the diameter of the liquid cooling channels 120 correspondingly arranged with respect to the first chip 210, the second chip 220 and the third chip 230 are different. For example, the number of liquid cooling channels 120 corresponding to the first chip 210 is 2 to 3, and the diameter of each liquid cooling channel 120 ranges from 1mm to 1.3mm, preferably 1mm, the number of liquid cooling channels 120 corresponding to the second chip 220 ranges from 2 to 3, and the diameter of each liquid cooling channel 120 ranges from 1.3mm to 1.7mm, preferably 1.5mm, and the number of liquid cooling channels 120 corresponding to the third chip 230 ranges from 1.7mm to 2mm, preferably 2mm.
As shown in fig. 1,3 and 4, in order to further improve the heat dissipation capability to the first, second and third chips 210, 220 and 230, the apertures of the power supply pins of the first, second and third chips 210, 220 and 230, which fan out the via holes 110, are sequentially increased while the number and/or diameter of the liquid cooling channels 120, which are correspondingly provided in the plate body 100, are set to be sequentially increased. Therefore, the solid copper metal connection parts in the different through holes 110 rapidly conduct out the heat generated by the corresponding power devices, and continuously transfer the heat to the inside of the plate main body 100, and the liquid cooling channels 120 in the corresponding position areas further absorb and conduct out the heat transferred to the inside of the plate main body through the cooling medium directionally moving in the corresponding position areas, so that the continuous stability of the temperature inside the plate main body 100 is also ensured.
That is, the above-mentioned heat dissipation method of arranging the liquid cooling channel 120 in the board main body 100 and the above-mentioned heat dissipation method of performing differential design on the sizes of the power supply pins of the chip 200 on the board main body, the two heat dissipation methods can be applied to the circuit board assembly independently, so as to improve the heat dissipation efficiency of the chip 200, and the two heat dissipation methods can be combined with each other to further enhance the heat dissipation effect of the chip 200.
Meanwhile, according to the application, the liquid cooling channel 120 is arranged in the plate main body 100, and/or the sizes of the through holes 110 of the fan-out holes 110 of the internal power supply pins of the chip 200 on the plate main body 100 are designed in a targeted manner, so that the overall heat dissipation effect of the circuit board assembly can be greatly improved, namely, the fan module is not required to be arranged outside the circuit board assembly for air cooling heat dissipation, the size of the electronic equipment is prevented from being increased, and the miniaturization and the compact design of the circuit board assembly and the corresponding electronic equipment are facilitated.
Because the liquid cooling channels 120 are embedded in the plate main body 100, the number and the diameter of the liquid cooling channels 120 corresponding to each chip area 101 need to be limited to a certain extent, the arrangement mode of too dense liquid cooling channels 120 will affect the normal fan-out of the power supply or signal wiring of the chip 200, and the liquid cooling channels 120 with too large diameter also can cause the thickness of the plate main body 100 to increase, or cause the plate main body 100 to be difficult to press fit, so that the production yield of the plate main body 100 is reduced.
Therefore, the outer diameter of the liquid cooling channel 120 can be set to be not more than 2mm, so that the thickness of the finished product of the plate main body 100 can be about 3mm, and the purposes of improving the production yield of the plate main body 100 and reducing the production cost are achieved. Meanwhile, the wall thickness of the liquid cooling channel 120 can be set to be 0.3mm, and the design can prevent the liquid cooling channel 120 from being broken and the plate main body 100 from swelling due to overlarge liquid cooling channel 120 when the liquid cooling medium flows in the subsequent liquid cooling channel 120.
In addition, the number of the liquid cooling channels 120 corresponding to the chip area 101 may be flexibly set according to the spacing distance between the adjacent liquid cooling channels 120 in the first direction, for example, the center-to-center spacing between the adjacent liquid cooling channels 120 in the first direction is set to be not less than 4mm, so as to ensure electrical connection or signal connection between the chip 200 and the plate main body 100.
It should be noted that, the above arrangement manner of the different apertures of the via holes 110 in the range of the chip area 101 is only for the fan-out power via holes corresponding to the power pins of the chip 200, but not for other signal via holes except for the power pins of the chip 200. That is, the apertures of the signal vias in the chip region 101 corresponding to the signal regions outside the power pins of the chip 200 remain unchanged, for example, all fan-out traces with 0.2mm signal vias.
Since the liquid cooling channel 120 penetrates through the plate main body 100 along the second direction and corresponds to the setting position of the chip area 101 in the direction perpendicular to the first surface, the drilling position of a part of the via holes 110 may overlap with the setting position of the cooling night branching pipe, if the drilling depth of the via holes 110 is not limited, the liquid cooling channel 120 embedded in the plate main body 100 in advance will be chiseled through in the process of drilling the via holes 110, so that the cooling medium in the liquid cooling channel 120 leaks in the application process of the subsequent circuit board assembly, or the via holes 110 contact with the pipe body or the cooling medium of the liquid cooling channel 120 to cause the short circuit risk of the chip 200.
Thus, depending on the location of the liquid cooling channels 120, the actual type of vias 110 within each chip area 101 may include blind vias. Since the vertical projection of the power pins of the chip 200 in the direction perpendicular to the first surface may overlap with the vertical projection of the liquid cooling channels 120 on the first surface completely or partially, the partial power pins need to be fanned out with blind holes having a relatively shallow depth. Wherein, the blind hole can adopt a depth control drilling process for precisely controlling the depth of the blind hole, and the drilling is performed at the position corresponding to the first surface, so as to avoid the blind hole penetrating the liquid cooling channel 120. Correspondingly, the vertical projection of the blind hole in the direction perpendicular to the first surface is also fully or partially overlapped with the vertical projection of the liquid cooling channel 120 on the first surface.
Depending on the location of the liquid cooling channels 120, the actual type of vias 110 within each chip area 101 also includes vias. Since the vertical projection of the through hole in the direction perpendicular to the first surface is not overlapped with the vertical projection of the liquid cooling channel 120 on the first surface, the through hole can extend from the first surface to the second surface of the plate body 100, so as to vertically penetrate the plate body 100. Therefore, the heat emitted by the chip 200 can be conducted to the second surface of the plate main body 100 through the metal connection part filled in the through hole and is exposed to the outside air, which is more beneficial to convection heat dissipation with the air.
Further, a heat conducting copper sheet (not shown in the drawing) is further disposed on the second surface corresponding to the position of the chip area 101, and the heat conducting copper sheet contacts with the bottom of the through hole, so that the heat generated by the subsequent chip 200 can be conducted to the heat conducting copper sheet through the metal connection portion filled in the through hole, and the heat is conducted to the air through the heat conducting copper sheet with a larger surface area, so that the heat dissipation efficiency of the through hole 110 to the chip is further improved.
In addition, since the plate body 100 is generally formed by laminating a plurality of circuit boards, in the process of designing and manufacturing the plate body 100, the liquid cooling channels 120 with different sizes need to be laminated between two opposite circuit boards according to the designed coordinate positions, so that different chip areas 101 of the laminated plate body 100 can correspond to the liquid cooling channels 120 with different sizes.
Before the liquid cooling channel 120 is pressed together with the circuit board and formed into the board main body 100, the interfaces at two ends of the liquid cooling channel 120 are required to be closed, so as to avoid the problems of blockage of the liquid cooling channel 120 caused by chemical liquid entering the liquid cooling channel 120 in the processes of etching, electroplating and the like in the manufacturing process of the PCB board card. After the liquid cooling channels 120 are electrically pressed together with the circuit board to form the board main body 100, the board main body 100 is drilled with the through holes 110 according to the designed coordinate positions.
Further, as shown in fig. 5, the two sides of the plate main body 100 along the second direction further include a liquid inlet pipe 130 and a liquid outlet pipe 140 extending along the first direction, the liquid inlet pipe 130 is communicated with the inlet end of each liquid cooling channel 120, the liquid outlet pipe 140 is communicated with the outlet end of each liquid cooling channel 120, and the liquid cooling medium can flow into each liquid cooling channel 120 through the liquid inlet pipe 130 in sequence and flow out through the liquid outlet pipe 140, so that the cooling medium can flow in the liquid cooling channels 120 in a directional manner, and the heat transferred into the plate main body 100 is rapidly led out.
In order to ensure the normal connection between the inlet end of the liquid cooling channel 120 and the liquid inlet pipe 130 and between the outlet end of the liquid cooling channel 120 and the liquid outlet pipe 140, each liquid cooling channel 120 should also extend a first predetermined length to a side far from the plate body 100 after extending through the plate body 100 along the two ends of the second direction, so that the liquid inlet pipe 130 and the liquid outlet pipe 140 can be connected with the inlet end and the outlet end of each liquid cooling channel 120, respectively.
For example, the inlet end and the outlet end of each liquid cooling channel 120 extend to a predetermined length ranging from 80mm to 120mm toward the side far from the plate main body 100.
As an example, a brazing process may be used to weld the inlet and outlet ends of each liquid cooling channel 120 of different tube diameters in communication with the liquid inlet tube 130 and the liquid outlet tube 140. The welding temperature of the brazing process is 700-750 ℃ which exceeds the welding temperature of wave soldering or reflow soldering of other devices on the circuit board assembly. Therefore, in order to prevent the liquid cooling channels 120 from falling off the devices on the circuit board assembly during the welding process with the liquid inlet channels 130 and the liquid outlet channels 140, the circuit board assembly should preferably weld the liquid inlet channels 130 and the liquid outlet channels 140 with the liquid cooling channels 120 during the manufacturing process, and then weld other devices on the circuit board assembly.
Meanwhile, in order to meet the total flow requirement of the liquid cooling medium in the liquid cooling channel 120 in the plate main body 100, and simultaneously, in order to facilitate the minimization of the system assembly thickness of the subsequent circuit board assembly, and also to consider the compactness of the circuit board assembly, the outer diameter sizes of the liquid inlet pipe 130 and the liquid outlet pipe 140 arranged at two ends of the plate main body 100 along the second direction need to be larger than the plate thickness of the plate main body 100, and simultaneously, smaller than the sum of the thickness of the plate main body 100 and the maximum thickness (height) of the device connected to the plate main body 100.
As an example, when the thickness of the plate body 100 is 3mm and the maximum thickness (height) of the devices on the plate body 100 is 4mm, the outer diameter sizes of the liquid inlet pipe 130 and the liquid outlet pipe 140 are in the range of 3mm to 7mm.
As an example, as shown in fig. 5 and 6, in order to save the subsequent welding process of the liquid inlet pipe 130 and the liquid outlet pipe 140, the liquid inlet pipe 130, the liquid outlet pipe 140 and the liquid cooling channels 120 with different pipe diameters can be directly designed and manufactured into an integral liquid cooling assembly according to the design requirement of the circuit board assembly, then the liquid cooling assembly is integrally pressed inside the plate main body 100, and finally the plate main body 100 corresponding to the liquid inlet pipe 130 and the liquid outlet pipe 140 is milled by adopting a milling cutter to expose the liquid inlet pipe 130 and the liquid outlet pipe 140. The design does not affect the subsequent welding assembly of other devices on the circuit board assembly, reduces one-step welding procedures, and can achieve the purpose of reducing the manufacturing cost of the circuit board assembly.
It should be noted that, in the above example, the liquid cooling assembly with the integrity requires that the outer diameters of the liquid inlet pipe 130 and the liquid outlet pipe 140 are not larger than the thickness of the plate body 100, so as to avoid the situation that the plate body 100 is difficult to be pressed, or avoid deformation of the liquid inlet pipe 130 and the liquid outlet pipe 140 during pressing. Meanwhile, the smaller outer diameter sizes of the liquid inlet pipe 130 and the liquid outlet pipe 140 may cause a risk of insufficient total flow of liquid cooling medium in the liquid cooling assembly or thicker design of the circuit board.
Therefore, if the liquid cooling medium flow rate of the liquid cooling medium in the liquid inlet pipe 130 and the liquid outlet pipe 140 is smaller than the sum of the liquid cooling medium flow rates of all the liquid cooling channels 120 in the circuit board, the liquid inlet pipe 130 and the liquid outlet pipe 140 can be further designed to have oval or rectangular interface, and the total liquid cooling medium flow rate of the liquid inlet pipe 130 and the liquid outlet manifold satisfies the sum of the liquid cooling medium flow rates of all the liquid cooling channels 120 in the circuit board, i.e. the inner diameter cross-sectional area of the liquid inlet manifold and/or the liquid outlet pipe 140 is not lower than the sum of the inner diameter cross-sectional areas of each liquid cooling channel 120 in the plate main body 100.
The second aspect of the present application also provides an electronic device, including a circuit board assembly according to any of the above embodiments.
In summary, the present application provides a circuit board assembly and an electronic device, including a board main body 100 and at least one chip 200, where the board main body 100 includes a first surface and a second surface opposite to each other, the first surface includes at least one chip area 101, each chip area 101 includes a plurality of vias 110 extending from the first surface to one side of the second surface, metal connection portions are filled in the vias, each chip 200 corresponds to each chip area 101 of the first surface one by one, and a power pin of each chip 200 is fanned out through the via 110 in the corresponding chip area 101. The application adjusts the sizes of the power fan through holes 110 in the chip area on the panel main body 100 based on different power thresholds of different chips 200 in a targeted manner, so that the power pins of the chips 200 with different power thresholds correspond to different apertures of the fan-out through holes 110, thereby meeting the heat dissipation requirements of the power chips 200 with different power thresholds and improving the running stability of the power chips 200 and corresponding electronic equipment.
Meanwhile, according to the power chip 200 with different power thresholds, the circuit board assembly and the electronic device provided by the application are provided with the liquid cooling channels 120 with different sizes and/or different numbers at preset coordinate positions in the plate main body 100, and the setting positions of the liquid cooling channels 120 correspond to the setting positions of the corresponding power chip 200, so that the cooling medium filled in the liquid cooling channels 120 can be used for rapidly absorbing heat generated by the power chip 200. In addition, the cooling medium is set to flow in a directional manner in the liquid cooling channel 120 so as to continuously absorb the heat generated by the heat power chip 200, and the heat dissipation and cooling effect on the power chip 200 can be further improved.
Compared with the prior art, the circuit board assembly and the electronic equipment provided by the application remove the requirement of installing the air-cooled radiator, the fan module or the liquid-cooled cold plate outside the circuit board assembly, so that the assembly size of the whole machine main body is reduced, the integration level and miniaturization of the circuit board assembly and the electronic equipment are improved, the production cost of the circuit board assembly and the electronic equipment is further reduced, and the technical problem that the high integration level and the heat dissipation design of the high-power chip related electronic equipment are difficult to be compatible is solved.
In the foregoing description of embodiments, reference has been made to the terms "one embodiment," "some embodiments," "example," "a particular example," or "some examples," etc., meaning that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Claims (10)
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| CN202510855028.1A CN120358666B (en) | 2025-06-24 | 2025-06-24 | Circuit board assembly and electronic equipment |
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| WO2024187842A1 (en) * | 2023-03-10 | 2024-09-19 | 华为数字能源技术有限公司 | Circuit board, circuit board assembly, and electronic device |
| WO2025021092A1 (en) * | 2023-07-25 | 2025-01-30 | 华为技术有限公司 | Circuit board, circuit board assembly, and computer device |
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| CN115494923A (en) * | 2022-09-16 | 2022-12-20 | 天津商业大学 | Single-tier server-grade full liquid cooling |
| CN116647978A (en) * | 2023-05-11 | 2023-08-25 | 苏州浪潮智能科技有限公司 | Circuit board assembly and processing method thereof, power chip assembly and electronic equipment |
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| WO2024187842A1 (en) * | 2023-03-10 | 2024-09-19 | 华为数字能源技术有限公司 | Circuit board, circuit board assembly, and electronic device |
| WO2025021092A1 (en) * | 2023-07-25 | 2025-01-30 | 华为技术有限公司 | Circuit board, circuit board assembly, and computer device |
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