CN120353320A - Heat abstractor and server - Google Patents

Abstract

The present invention discloses a heat dissipation device and a server, and relates to the technical field of servers. The heat dissipation device comprises: a mounting assembly, a fixing assembly, a first heat dissipation assembly and a second heat dissipation assembly. The mounting assembly is formed with a mounting groove, and the mounting groove is suitable for fixing a server unit. The fixing assembly is arranged on the upper part of the mounting assembly. The first heat dissipation assembly is arranged above the fixing assembly. The first heat dissipation assembly has a heat sink group and a liquid cooling channel, and the liquid cooling channel is located in the heat sink group. The second heat dissipation assembly is arranged on the side of the first heat dissipation assembly away from the server unit. The second heat dissipation assembly is formed with an air cooling channel, and at least part of the heat sink group is located in the air cooling channel, and part of the liquid cooling channel is located in the air cooling channel. The heat dissipation device according to the present invention utilizes a combination of air cooling and liquid cooling to meet the heat dissipation requirements in a high-density computing environment, and the overall structure of the heat dissipation device is simple and easy to assemble and maintain.

Description

Heat abstractor and server

Technical Field

The present invention relates to the field of servers, and in particular, to a heat dissipation device and a server.

Background

In the related art, it is pointed out that a hard disk storage server generates a lot of heat during operation, and the liquid cooling heat dissipation technology of the hard disk storage server is specially used for rapidly discharging the heat. Compared with the conventional air cooling method, the liquid cooling method has higher heat conduction efficiency, can better take away heat to cool the server, and ensures that the server is kept at the optimal working temperature. This technique is particularly useful in high density computing environments, such as data centers or supercomputers. However, the conventional liquid cooling system has a few problems. The traditional liquid cooling system cannot provide enough cooling capacity in a high-density computing environment, a direct radiating structure does not exist outside a server body, devices are overheated, performance and service life are further affected, and the traditional liquid cooling system is complex to install and difficult to maintain.

Disclosure of Invention

The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the heat dissipating device which can more effectively control the temperature of the server unit, can reduce the problems of performance degradation and shortened hardware service life caused by overheating, meets the heat dissipating requirement in a high-density computing environment, and has a simple integral structure and is convenient to assemble and maintain.

The invention further provides a server.

The heat dissipation device is used for dissipating heat of a server unit and comprises a mounting assembly, a fixing assembly, a first heat dissipation assembly and a second heat dissipation assembly, wherein the mounting assembly is provided with a mounting groove, the mounting groove is suitable for fixing the server unit, the fixing assembly is arranged on the upper portion of the mounting assembly, the first heat dissipation assembly is arranged above the fixing assembly and is provided with a heat dissipation fin group and a liquid cooling runner, the liquid cooling runner is arranged in the heat dissipation fin group, the second heat dissipation assembly is arranged on one side, away from the server unit, of the first heat dissipation assembly, an air cooling runner is formed on the second heat dissipation assembly, at least part of the heat dissipation fin group is arranged in the air cooling runner, and part of the liquid cooling runner is arranged in the air cooling runner.

According to the heat dissipating device, the first heat dissipating component and the second heat dissipating component are arranged, the first heat dissipating component is provided with the liquid cooling flow channel, the second heat dissipating component is provided with the air cooling flow channel, at least part of the first heat dissipating component is positioned in the air cooling flow channel, and therefore the mode of combining air cooling and liquid cooling is utilized, heat can be quickly conducted out through liquid, air flow can be used for further cooling, or the heat can be selectively used between liquid cooling and air cooling, so that the temperature can be controlled more effectively, the problems of performance degradation and hardware service life shortening caused by overheating can be reduced, the heat dissipating requirement under a high-density computing environment is met, and the heat dissipating device is simple in integral structure and convenient to assemble and maintain.

In some possible embodiments of the present invention, the heat dissipation fin group has a channel formed therein, and the first heat dissipation component includes a liquid cooling tube, and the liquid cooling flow channel is formed in the liquid cooling tube, and at least part of the liquid cooling tube is located in the channel.

In the technical scheme, the liquid cooling pipes are integrated in the radiating fin group, so that the liquid cooling pipes are tightly combined with the radiating fin group, the assembly compactness of the radiating device is improved, the space volume of the radiating device is saved, the cooling liquid flows in the liquid cooling pipes, the cooling liquid absorbs and takes away heat, the heat exchange efficiency is ensured, and the heat conduction efficiency is improved.

In some possible embodiments of the present invention, the fin group includes a plurality of heat dissipation single sheets, the plurality of heat dissipation single sheets are arranged in a thickness direction thereof, through holes are formed on each heat dissipation single sheet, each through hole is communicated in the thickness direction of the heat dissipation single sheet to define the channel, the channel includes a first through section and a second through section, the first through section and the second through section extend in the thickness direction of the heat dissipation single sheet, and the first through section and the second through section are arranged at intervals.

In the above technical scheme, through setting up the fin group that a plurality of heat dissipation singlechips are constituteed, increased radiating area, improved the efficiency of heat conduction, be convenient for modularization manufacturing and change, a plurality of heat dissipation singlechips are piled up together along its thickness direction, all be formed with the through-hole on every heat dissipation singlechips, the through-hole provides location space for the interlude of liquid cooling pipe, the through-hole on a plurality of heat dissipation singlechips aligns after piling up, thereby form continuous passageway, the passageway is used for holding the liquid cooling pipe, the passageway includes first section and second section, the flow direction of coolant liquid has been led, the condition emergence of coolant liquid short circuit has been avoided, the heat transfer homogeneity has been improved.

In some possible embodiments of the present invention, the liquid cooling pipe has a first pipe section, a second pipe section and a third pipe section that are sequentially connected, where the first pipe section and the third pipe section are parallel and spaced apart in a radial direction, the second pipe section extends along an arc, the first pipe section is located in the first through section, and the third pipe section is located in the second through section.

In the technical scheme, the first pipe section and the third pipe section which are arranged in parallel at intervals and the second pipe section which is connected between the first pipe section and the third pipe section are arranged, so that the distance of the liquid cooling flow channel is prolonged under the condition that the space volume is not changed, the cooling path is increased, the heat exchange efficiency is improved, and the compactness and the reliability of the heat dissipation device are enhanced.

In some possible embodiments of the present invention, the first heat dissipating component includes a mounting frame connected between the heat dissipating fin set and the second heat dissipating component, the mounting frame is formed with a first connection portion, the heat dissipating fin set is formed with a second connection portion, and the mounting frame and the heat dissipating fin set are connected in a matching manner with the second connection portion through the first connection portion.

In the above technical scheme, the connection between the mounting frame and the radiating fin group is realized through the cooperation of the first connecting part and the second connecting part, so that the radiating fin group can be more firmly connected with the mounting frame, the occurrence of the falling condition of the radiating fin group is avoided, and meanwhile, the assembly and the maintenance are convenient.

In some possible embodiments of the present invention, the second heat dissipation component includes a fixing frame and a fan, the fan is disposed in the fixing frame, the fixing frame is formed with a third connection portion, the mounting frame is formed with a fourth connection portion, and the mounting frame and the fixing frame are cooperatively connected with the fourth connection portion through the third connection portion.

In the technical scheme, the connection between the fixed frame and the mounting frame is realized through the cooperation of the third connecting part and the fourth connecting part, so that the fixed frame and the mounting frame can be stably connected, the condition that the fixed frame and the mounting frame are separated from each other is avoided, the connection stability of the fixed frame and the mounting frame is improved, and the assembly difficulty of the mounting frame and the fixed frame is reduced.

In some possible embodiments of the present invention, a mounting bar is disposed in the fixing frame, the mounting bar is detachably connected to the fixing frame, and the fan is disposed on the mounting bar.

In the technical scheme, the installation strip is connected in the fixed frame and provides an assembly position for the fan, the installation strip is used for bearing the fan or other air-cooled elements, the installation strip is detachably connected with the fixed frame, the fan can be conveniently disassembled and assembled to maintain, replace or clean the fan, maintainability of the heat radiating device is improved, and the installation strip can be adapted to fan models with different sizes, air volumes and rotating speeds.

In some possible embodiments of the present invention, the fixing assembly includes a first bearing plate and a second bearing plate, the first bearing plate is disposed at the bottom of the fin group, the second bearing plate is disposed at two sides of the first bearing plate in the thickness direction of the fin group, the first bearing plate is connected to the second bearing plate, and the second bearing plate is connected to the fin group.

In the above technical scheme, through setting up first loading board and second loading board and played the effect of jointly assuming support, location, connection fin group, guaranteed fixed subassembly's structural stability, first loading board is located the below of fin group for the support is connected the fin group, and the second loading board distributes in the both sides of first loading board, can link to each other through modes such as welding, fastener connection, joint between first loading board and the second loading board, has realized the effective fixed and the protection to the fin group.

In some possible embodiments of the present invention, the first bearing plate is formed with a fifth connection portion, the second bearing plate is formed with a sixth connection portion, and the first bearing plate and the second bearing plate are cooperatively connected with the sixth connection portion through the fifth connection portion.

In the technical scheme, the connection between the first bearing plate and the second bearing plate is realized through the cooperation of the fifth connecting part and the sixth connecting part, so that the first bearing plate and the second bearing plate can be stably connected, the condition that the first bearing plate and the second bearing plate are separated from each other is avoided, and the connection stability of the first bearing plate and the second bearing plate is improved.

In some possible embodiments of the present invention, the second carrier plate is provided with a limiting member, and the limiting member is located at two sides of the fin group in the thickness direction thereof.

In the technical scheme, the radiating fin group is positioned between the limiting pieces, and the limiting pieces are used for positioning and fixing the radiating fin group, so that the radiating fin group is prevented from shifting or loosening after being installed, the stability and the reliability of the radiating device are improved, meanwhile, the vibration resistance of the radiating fin group is improved, the radiating fin group is convenient to assemble during assembly, and the assembly precision and the assembly efficiency are improved.

In some possible embodiments of the present invention, the first heat dissipation assembly further includes a limiting seat, wherein a limiting groove is formed on the limiting seat, and at least part of the first pipe section and at least part of the second pipe section are located in the limiting groove.

In the technical scheme, the limiting seat is matched with the liquid cooling pipe, so that the liquid cooling pipe is ensured to keep a stable position after being assembled, the limiting groove on the limiting seat limits the liquid cooling pipe, the liquid cooling pipe is prevented from shifting, vibrating or deforming in the operation process, the effect of supporting the liquid cooling pipe is achieved, the stress concentration of the liquid cooling pipe is reduced, and the fatigue fracture risk is reduced.

In some possible embodiments of the invention, the mounting assembly includes a mounting member and an adjustment member, the mounting slot being formed in the mounting member, the adjustment member being coupled to the mounting member to secure the server unit.

In the technical scheme, the positioning and bearing of the server unit are realized by the mounting assembly through the mounting groove on the mounting piece, the clamping force is applied to the server unit through the adjusting piece, the mounting assembly is applicable to server units with various specifications and sizes, the suitability of the heat radiating device is improved, and the mounting assembly is simple in structure and convenient to assemble and maintain.

In some possible embodiments of the invention, the adjusting member is screwed to the mounting member, and a surface of the adjusting member facing the mounting groove is formed as an adjusting surface, and the adjusting surface is adapted to be in abutting connection with the server unit.

In the above technical scheme, the adjusting piece is connected with the mounting piece through threaded engagement, an adjusting surface is formed on the adjusting piece, and the adjusting surface is abutted with the server unit, so that the server unit is stably clamped between the adjusting pieces.

The server according to the second aspect of the invention comprises a server unit and a heat sink according to the first aspect of the invention, the server unit being adapted to be arranged on the heat sink.

According to the server, the heat dissipation device of the first aspect of the invention is arranged, so that the same technical effects are achieved, namely, the first heat dissipation component is provided with the liquid cooling flow channel, the second heat dissipation component is provided with the air cooling flow channel, at least part of the first heat dissipation component is positioned in the air cooling flow channel, the mode of combining air cooling and liquid cooling is utilized, heat can be quickly conducted out through liquid, further cooling can be achieved through air flow, or the temperature can be selectively controlled between the liquid cooling and the air cooling, the temperature can be effectively controlled, the problems of performance degradation and hardware service life shortening caused by overheating can be reduced, the heat dissipation device is particularly suitable for heat dissipation requirements in a high-density computing environment, and the whole structure of the heat dissipation device is simple and convenient to assemble and maintain.

In some possible embodiments of the present invention, the server unit includes a housing, and the housing has a heat dissipation portion formed thereon, and the heat dissipation portion is formed on two opposite side walls of the housing.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

For a clearer description of embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described, it being apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic diagram of a heat dissipating device according to an embodiment of the present invention;

FIG. 2 is a schematic view of the heat sink shown in FIG. 1 from another perspective;

FIG. 3 is a schematic diagram illustrating an assembly of the heat dissipating device and the server unit shown in FIG. 1;

FIG. 4 is a schematic structural view of the first heat dissipating assembly shown in FIG. 1;

FIG. 5 is an exploded view of the mounting assembly shown in FIG. 1;

fig. 6 is an exploded view of the first and second heat dissipating assemblies shown in fig. 1.

Wherein the above figures include the following reference numerals:

100. A heat sink;

1. Mounting components, 11, mounting parts, 111, mounting grooves, 12, adjusting parts, 13 and protective pads;

2. A fixing assembly; 21, a first bearing plate, 211, a third connecting hole, 22, a second bearing plate, 221, a fourth connecting hole, 222 and a limiting piece;

3. a first heat dissipation assembly;

31. Fin group 311, channel 3111, first through section 3112, second through section 312, connecting protrusion;

32. Liquid cooling pipe 321, first pipe section 322, second pipe section 323, third pipe section 324 and sealing joint;

33. The device comprises a mounting frame, 331 connecting grooves, 332 second connecting holes, 34 limiting seats;

4. a second heat dissipation assembly;

41. Fixing frame 411, first connecting hole 412, mounting bar 42 and fan;

5. A fastener;

200. Server unit, 201, shell, 202 and heat dissipation part.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without making any inventive effort are within the scope of the present invention.

It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention. The terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intermediate medium, or communicate between the two elements. The terms "parallel", "perpendicular", "equal" include the stated case as well as the case similar to the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the range of acceptable deviation of approximately parallel may be, for example, within 5 ° of deviation, and "perpendicular" includes absolute perpendicular and approximately perpendicular, where the range of acceptable deviation of approximately perpendicular may also be, for example, within 5 ° of deviation. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, the terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting of the invention, and the terms "comprising" and "having" and any variations thereof in the description of the invention and the claims and the above description of the drawings are intended to cover non-exclusive inclusions.

In the description of embodiments of the present invention, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more unless explicitly defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the description of the embodiment of the present invention, the term "and/or" is merely an association relationship describing the association object, and indicates that three relationships may exist, for example, a and/or B, and may indicate that a exists alone, while a and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In describing embodiments of the present invention, the term "plurality" refers to more than two (including two).

In the related art, it is pointed out that a hard disk storage server generates a lot of heat during operation, and the liquid cooling heat dissipation technology of the hard disk storage server is specially used for rapidly discharging the heat. Compared with the conventional air cooling method, the liquid cooling method has higher heat conduction efficiency, can better take away heat to cool the server, and ensures that the server is kept at the optimal working temperature. This technique is particularly useful in high density computing environments, such as data centers or supercomputers. However, the conventional liquid cooling system has a few problems. The traditional liquid cooling system cannot provide enough cooling capacity in a high-density computing environment, a direct radiating structure does not exist outside a server body, devices are overheated, performance and service life are further affected, and the traditional liquid cooling system is complex to install and difficult to maintain. Therefore, how to improve the heat dissipation effect of the server is an urgent problem to be solved.

Based on the above-mentioned considerations, the inventors have conducted intensive studies to design a heat dissipating device in order to improve the heat dissipating effect of a server, and a heat dissipating device according to an embodiment of the first aspect of the present invention is described below with reference to fig. 1 to 6.

The heat dissipating device 100 according to the embodiment of the first aspect of the present invention includes a mounting assembly 1, a fixing assembly 2, a first heat dissipating assembly 3, and a second heat dissipating assembly 4.

Specifically, the mounting assembly 1 is formed with a mounting groove 111, the mounting groove 111 is suitable for fixing the server unit 200, the fixing assembly 2 is arranged on the upper portion of the mounting assembly 1, the first heat dissipation assembly 3 is arranged above the fixing assembly 2, the first heat dissipation assembly 3 is provided with a heat dissipation fin group 31 and a liquid cooling runner, the liquid cooling runner is arranged in the heat dissipation fin group 31, the second heat dissipation assembly 4 is arranged on one side of the first heat dissipation assembly 3, which faces away from the server unit 200, the second heat dissipation assembly 4 is formed with an air cooling runner, at least part of the heat dissipation fin group 31 is arranged in the air cooling runner, and part of the liquid cooling runner is arranged in the air cooling runner.

It will be appreciated that the mounting assembly 1 has a mounting groove 111 for firmly mounting the server unit 200, ensuring that the server unit 200 can be firmly integrated into the heat sink 100, the fixing assembly 2 is located at the upper portion of the mounting assembly 1 and is used for mounting the first heat dissipation assembly 3, providing a mounting position for the first heat dissipation assembly 3, ensuring that the first heat dissipation assembly 3 can be stably and safely assembled at a proper position, the first heat dissipation assembly 3 comprises a heat dissipation fin group 31 and a liquid cooling runner, the liquid cooling runner is arranged in the heat dissipation fin group 31, liquid flows in the liquid cooling runner, and brings heat out of the heat sink 100 after absorbing heat, thereby achieving a cooling effect, the liquid cooling runner is directly contacted with the heat dissipation fin group 31, thus effectively taking heat away from the heat dissipation fin group 31, maintaining the server unit 200 at a lower working temperature, the second heat dissipation assembly 4 is located at one side of the first heat dissipation assembly 3, and the second heat dissipation assembly 4 is formed with a cold runner, the effect is further enhanced by arranging the cold runner, in particular, at least part of the heat dissipation fin group 31 and at least part of the liquid cooling runner can be located in the heat dissipation fin group 100, thereby increasing the cooling efficiency of the whole heat dissipation device.

Referring to fig. 1 to 3, the installation assembly 1 has an installation groove 111, the server unit 200 is located in the installation groove 111, the installation assembly 1 can firmly connect the server unit 200 with the heat dissipating device 100, the fixing assembly 2 is connected above the installation assembly 1, the first heat dissipating assembly 3 is connected above the fixing assembly 2, the first heat dissipating assembly 3 has a heat dissipating fin set 31 and a liquid cooling channel, a liquid flows in the liquid cooling channel, the liquid can absorb heat of the server unit 200 and take away the heat, so that the server unit 200 is always at a proper working temperature, the second heat dissipating assembly 4 is connected above the first heat dissipating assembly 3, an air cooling channel is formed on the second heat dissipating assembly 4, at least part of the heat dissipating fin set 31 is located in the air cooling channel, so that the air flow can take away the temperature of the heat dissipating fin set 31, and at least part of the liquid cooling channel is also located in the air cooling channel, so that the air flow can take away the temperature of the liquid cooling channel while taking away the heat of the heat dissipating fin set 31.

When the heat dissipating device 100 works, when the server unit 200 needs to cool down, the first heat dissipating component 3 and/or the second heat dissipating component 4 can be turned on according to the actual temperature of the server unit 200, that is, when the temperature of the server unit 200 is higher, the first heat dissipating component 3 or the second heat dissipating component 4 can be turned on selectively, and when the temperature of the server unit 200 reaches the threshold value, the first heat dissipating component 3 and the second heat dissipating component 4 can be turned on simultaneously, thereby not only reducing the resource waste, but also providing better heat dissipating effect.

According to the heat dissipating device 100 of the embodiment of the invention, by arranging the first heat dissipating component 3 and the second heat dissipating component 4, the first heat dissipating component 3 is provided with the liquid cooling flow channel, the second heat dissipating component 4 is provided with the air cooling flow channel, at least part of the first heat dissipating component 3 is positioned in the air cooling flow channel, and thus, the heat can be quickly conducted out through the liquid, and can be further cooled by means of air flow, or can be selectively cooled by the air flow, so that the temperature can be more effectively controlled, the problems of performance degradation and hardware life shortening caused by overheating can be reduced, the heat dissipating requirement in a high-density computing environment can be met, and the heat dissipating device 100 has a simple overall structure and is convenient to assemble and maintain.

In any embodiment of the present invention, the heat dissipation fin group 31 has a channel 311 formed therein, the first heat dissipation component 3 includes a liquid cooling tube 32, a liquid cooling flow channel is formed in the liquid cooling tube 32, and at least a portion of the liquid cooling tube 32 is located in the channel 311. It can be appreciated that the channel 311 in the fin group 31 is configured to accommodate the liquid cooling tube 32, the liquid cooling tube 32 is of a hollow pipe structure and is configured to transmit and guide the cooling liquid to flow, the liquid cooling flow channel is formed in the liquid cooling tube 32, the cooling liquid flows in the liquid cooling tube 32 to absorb and take away heat, at least a portion of the liquid cooling tube 32 is located in the channel 311, so that the liquid cooling tube 32 and the fin group 31 can be tightly combined, and heat conduction efficiency is improved, i.e. heat is transferred to the fins first and then transferred to the liquid cooling tube 32 through contact, the liquid cooling tube 32 is integrated in the fin group 31, thereby saving the space volume of the heat dissipating device 100 and improving the structural compactness of the heat dissipating device 100.

Referring to fig. 4, the channel 311 is formed in the fin group 31, the first heat dissipating component 3 includes a liquid cooling tube 32, and a liquid cooling flow channel is formed in the liquid cooling tube 32, and a part of the liquid cooling tube 32 is located in the channel 311, so that a part of the liquid cooling flow channel is also located in the channel 311, thereby, by integrating the liquid cooling tube 32 in the fin group 31, the liquid cooling tube 32 is tightly combined with the fin group 31, so that the assembly compactness of the heat dissipating device 100 is improved, the space volume of the heat dissipating device 100 is saved, the cooling liquid flows in the liquid cooling tube 32, and the cooling liquid absorbs and takes away heat, thereby ensuring the heat exchange efficiency and improving the heat conduction efficiency.

In any one of the embodiments of the present invention, the fin group 31 includes a plurality of heat dissipation single sheets, each of the plurality of heat dissipation single sheets is formed with a through hole in a thickness direction thereof, each of the through holes is communicated in the thickness direction of the heat dissipation single sheet to define the channel 311, the channel 311 includes a first through section 3111 and a second through section 3112, each of the first through section 3111 and the second through section 3112 extends in the thickness direction of the heat dissipation single sheet, and the first through section 3111 and the second through section 3112 are arranged at intervals. From this, through setting up the fin group 31 that a plurality of heat dissipation singlechips are constituteed, increased heat radiating area, improved the efficiency of heat conduction, be convenient for modularization manufacturing and change, a plurality of heat dissipation singlechips are piled up together along its thickness direction, all be formed with the through-hole on every heat dissipation singlechips, the through-hole provides the location space for the interlude of liquid cooling pipe 32, the through-hole on a plurality of heat dissipation singlechips aligns after piling up, thereby form continuous passageway 311, passageway 311 is used for holding liquid cooling pipe 32, passageway 311 includes first through section 3111 and second through section 3112, the flow direction of coolant liquid has been led, the condition emergence of coolant liquid short circuit has been avoided, the heat transfer homogeneity has been improved.

Referring to fig. 4 and 6, the fin group 31 includes 49 heat dissipation monoliths, the 49 heat dissipation monoliths are arranged in a thickness direction thereof, four through holes are formed on each heat dissipation monolith, the four through holes on one heat dissipation monolith are correspondingly communicated with the four through holes on an adjacent heat dissipation monolith, and the corresponding through holes are coaxially arranged, i.e., the four through holes on one heat dissipation monolith correspond to the four through holes on an adjacent heat dissipation monolith, respectively, the channel 311 has two channels, and each channel 311 includes a first through section 3111 and a second through section 3112, the first through section 3111 and the second through section 3112 extend in the thickness direction of the heat dissipation monolith, the first through section 3111 and the second through section 3112 are arranged at intervals, the height of the first through section 3111 is lower than the height of the second through section 3112, and a distance between the first through sections 3111 of the two channels 311 is smaller than a distance between the first through section 3111 and the second through section 3112 of the same channel 311.

In any of the embodiments of the present invention, the liquid cooling pipe 32 has a first pipe section 321, a second pipe section 322, and a third pipe section 323 connected in this order, the first pipe section 321 and the third pipe section 323 are arranged in parallel and spaced apart in the radial direction, the second pipe section 322 extends along an arc, the first pipe section 321 is located in the first through section 3111, and the third pipe section 323 is located in the second through section 3112. Therefore, by arranging the first pipe section 321 and the third pipe section 323 which are arranged in parallel at intervals and the second pipe section 322 which is connected between the first pipe section 321 and the third pipe section 323, the distance of the liquid cooling flow channel is prolonged without changing the space volume, the cooling path is increased, the heat exchange efficiency is improved, and the compactness and the reliability of the heat dissipating device 100 are enhanced.

Referring to fig. 4, the liquid cooling pipe 32 includes a first pipe section 321, a second pipe section 322, and a third pipe section 323, the first pipe section 321 and the third pipe section 323 extend in a thickness direction of the heat dissipation monolith, the first pipe section 321 and the third pipe section 323 extend along a straight line, the second pipe section 322 is connected between the first pipe section 321 and the second pipe section 322, the liquid cooling pipe 32 is formed in a U shape, the second pipe section 322 extends along an arc, flow resistance of the cooling liquid is reduced, turbulence, vortex and pressure drop loss of the cooling liquid in a flow process are avoided, the first pipe section 321 and the third pipe section 323 are located in the heat dissipation fin group 31, and the second pipe section 322 is located outside the heat dissipation fin group 31, so that assembly and maintenance are facilitated.

In some possible embodiments, the free end of the first pipe section 321 is provided with a sealing joint 324, i.e. the end of the first pipe section 321 connected to the external cooling system, the sealing joint 324 is provided to ensure that no leakage of cooling fluid occurs at the connection of the liquid cooling pipe 32 to the external cooling system, and the sealing joint 324 allows for quick connection and disconnection.

Here, the sealing joint 324 is formed as a high temperature resistant material member, and the sealing joint 324 is screwed with the first pipe section 321, so that the disassembly and the replacement are convenient.

In any one of the embodiments of the present invention, the first heat dissipating component 3 includes a mounting frame 33, where the mounting frame 33 is connected between the fin group 31 and the second heat dissipating component 4, the mounting frame 33 is formed with a first connection portion, the fin group 31 is formed with a second connection portion, and the mounting frame 33 and the fin group 31 are cooperatively connected with each other through the first connection portion and the second connection portion. From this, realized being connected between installing frame 33 and the fin group 31 through first connecting portion and the cooperation of second connecting portion for fin group 31 can link to each other with installing frame 33 more firmly, has avoided the condition emergence that fin group 31 dropped, is convenient for assemble and maintain simultaneously.

Referring to fig. 2 and 6, the mounting frame 33 is located between the fin group 31 and the second heat sink member 4, and the second heat sink member 4 is connected to an upper side of the mounting frame 33, the fin group 31 is connected to a lower side of the mounting frame 33, a first connection portion is formed on the mounting frame 33, a second connection portion is formed on the fin group 31, and the first connection portion and the second connection portion are engaged to connect the fin group 31 to the mounting frame 33.

Further, one of the first and second connection parts is formed as a connection protrusion 312, and the other of the first and second connection parts is formed as a connection groove 331, the connection protrusion 312 protruding into the connection groove 331. It can be understood that the first connection portion may be formed as the connection protrusion 312, the second connection portion may be formed as the connection groove 331, or the first connection portion may be formed as the connection groove 331, and the second connection portion may be formed as the connection protrusion 312, so that the connection protrusion 312 is located in the connection groove 331, connection between the mounting frame 33 and the fin group 31 is achieved, the connection manner between the connection protrusion 312 and the connection groove 331 is simple, rapid assembly of the mounting frame 33 and the fin group 31 is achieved, assembly positioning is facilitated, and the connection structure between the mounting frame 33 and the fin group 31 is stable and reliable.

As shown in fig. 6, the first connection part is formed as a connection groove 331 and the second connection part is formed as a connection protrusion 312.

In other possible embodiments, the mating connection structure of the first connection portion and the second connection portion includes, but is not limited to.

In any embodiment of the present invention, the second heat dissipation assembly 4 includes a fixing frame 41 and a fan 42, the fan 42 is disposed in the fixing frame 41, the fixing frame 41 is formed with a third connection portion, the mounting frame 33 is formed with a fourth connection portion, and the mounting frame 33 and the fixing frame 41 are cooperatively connected with the fourth connection portion through the third connection portion. Therefore, the connection between the fixed frame 41 and the mounting frame 33 is realized through the cooperation of the third connecting part and the fourth connecting part, so that the fixed frame 41 and the mounting frame 33 can be stably connected, the condition that the fixed frame 41 and the mounting frame 33 are separated from each other is avoided, the connection stability of the fixed frame 41 and the mounting frame 33 is improved, and the assembly difficulty of the mounting frame 33 and the fixed frame 41 is reduced.

Referring to fig. 5 and 6, the fixing frame 41 is positioned at an upper side of the mounting frame 33, the second heat sink member 4 is connected to the mounting frame 33 through the fixing frame 41, a third connection portion is formed on the fixing frame 41, a fourth connection portion is formed on the mounting frame 33, and the third connection portion is engaged with the fourth connection portion so that the fixing frame 41 is connected to the mounting frame 33.

Further, the third connection portion is formed as a first connection hole 411, the fourth connection portion is formed as a second connection hole 332, and the fastener 5 penetrates the first connection hole 411 and the second connection hole 332 to be connected. As shown in fig. 6, the first connection holes 411 penetrate the fixing frame 41 in the up-down direction, the second connection holes 332 penetrate the mounting frame 33 in the up-down direction, the fixing frame 41 is formed in a rectangular shape, the first connection holes 411 are formed at least at four corners of the fixing frame 41, the mounting frame 33 comprises two mounting frames 33, two sides of the two mounting frames 33 in the length direction of the fin group 31 are respectively formed with a connection groove 331, each mounting frame 33 is respectively formed with a second connection hole 332, the second connection holes 332 are arranged in one-to-one correspondence with the first connection holes 411, and the corresponding first connection holes 411 and second connection holes 332 penetrate the fastening pieces 5, so that the fixing frame 41 and the mounting frame 33 are connected by penetrating the first connection holes 411 and the second connection holes 332 through the fastening pieces 5, and the connection mode is simple, and the assembly is convenient.

In any embodiment of the present invention, as shown in fig. 4, a mounting bar 412 is provided in the fixing frame 41, the mounting bar 412 is detachably connected to the fixing frame 41, and the fan 42 is provided on the mounting bar 412. It can be appreciated that the fixing frame 41 is connected with the mounting bar 412, which provides an assembling position for the fan 42, the mounting bar 412 is used for carrying the fan 42 or other air-cooled components, the mounting bar 412 is detachably connected with the fixing frame 41, so that the fan 42 can be conveniently disassembled and assembled to maintain, replace or clean the fan 42, maintainability of the heat dissipating device 100 is improved, and the mounting bar 412 can adapt to fan 42 models with different sizes, air volumes and rotating speeds.

In other embodiments, the provision of shock absorbing members on the mounting bar 412 reduces the transmission of vibrations generated during operation of the blower 42 to other components and reduces the noise generated during operation of the blower 42.

In any one of the embodiments of the present invention, the fixing assembly 2 includes a first carrier plate 21 and a second carrier plate 22, the first carrier plate 21 is disposed at the bottom of the fin group 31, the second carrier plate 22 is disposed at both sides of the first carrier plate 21 in the thickness direction of the fin group 31, the first carrier plate 21 is connected to the second carrier plate 22, and the second carrier plate 22 is connected to the fin group 31. It can be appreciated that the first bearing plate 21 and the second bearing plate 22 are arranged to jointly bear the supporting, positioning and connecting functions of the radiating fin group 31, so that the structural stability of the fixing assembly 2 is ensured, the first bearing plate 21 is positioned below the radiating fin group 31 and is used for bearing and connecting the radiating fin group 31, the second bearing plate 22 is distributed on two sides of the first bearing plate 21, the first bearing plate 21 and the second bearing plate 22 can be connected in a welding, fastening piece 5 connecting and clamping mode and the like, and the effective fixing and protecting of the radiating fin group 31 are realized.

Referring to fig. 3 and 5, the first loading plate 21 has one loading plate positioned under the fin group 31, the second loading plate 22 has two loading plates 22, the two loading plates 22 are respectively connected to both sides of the fin group 31 in the thickness direction, the second loading plate 22 is positioned between the first loading plate 21 and the fin group 31, and the second loading plates 22 are connected to the first loading plate 21.

Here, it is preferable that the heat sink group 31 is connected to the second carrier plate 22 through a heat conductive adhesive.

In any one of the embodiments of the present invention, the first bearing plate 21 is formed with a fifth connection portion, the second bearing plate 22 is formed with a sixth connection portion, and the first bearing plate 21 and the second bearing plate 22 are cooperatively connected with the sixth connection portion through the fifth connection portion. Therefore, the connection between the first bearing plate 21 and the second bearing plate 22 is realized through the cooperation of the fifth connecting part and the sixth connecting part, so that the first bearing plate 21 and the second bearing plate 22 can be stably connected, the condition that the first bearing plate 21 and the second bearing plate 22 are separated from each other is avoided, and the connection stability of the first bearing plate 21 and the second bearing plate 22 is improved.

Referring to fig. 5, the second loading plate 22 is positioned at an upper side of the first loading plate 21, a fifth connection part is formed on the first loading plate 21, a sixth connection part is formed on the second loading plate 22, and the fifth connection part is engaged with the sixth connection part so that the first loading plate 21 and the second loading plate 22 are connected.

Further, the fifth coupling portion is formed as the third coupling hole 211, the sixth coupling portion is formed as the fourth coupling hole 221, and the fastener 5 is coupled through the first coupling hole 411 and the second coupling hole 332. As shown in fig. 6, the third connection holes 211 have four, four third connection holes 211 penetrate the first loading plate 21 in the up-down direction, and four connection holes 221 penetrate the second loading plate 22 in the up-down direction, and each third connection hole 211 corresponds to one fourth connection hole 221.

In any embodiment of the present invention, the second carrier plate 22 is provided with a limiting member 222, and the limiting member 222 is located at two sides of the fin group 31 in the thickness direction thereof. It can be appreciated that the fin group 31 is located between the limiting members 222, and the limiting members 222 are used for positioning and fixing the fin group 31, so that the fin group 31 is ensured not to deviate or loose after being mounted, thereby improving the stability and reliability of the heat dissipating device 100, and simultaneously, improving the vibration resistance of the fin group 31, facilitating assembly during assembly, and improving the assembly precision and assembly efficiency.

Alternatively, the limiting member 222 may be a boss, a buckle, a stopper, a fastener 5, an elastic pressing block, or the like.

In any embodiment of the present invention, as shown in fig. 4, the first heat dissipation assembly 3 further includes a limiting seat 34, wherein a limiting groove is formed on the limiting seat 34, and at least a portion of the first pipe section 321 and at least a portion of the second pipe section 322 are located in the limiting groove. It can be appreciated that the spacing seat 34 cooperates with the liquid cooling tube 32 to ensure that the liquid cooling tube 32 maintains a stable position after assembly, and the spacing groove on the spacing seat 34 limits the liquid cooling tube 32 to prevent the liquid cooling tube 32 from shifting, vibrating or deforming during operation, thereby playing a role in supporting the liquid cooling tube 32, reducing stress concentration of the liquid cooling tube 32 and reducing fatigue fracture risk.

Preferably, the limiting seat 34 is made of aluminum alloy, so that the limiting seat 34 has good thermal conductivity and mechanical strength.

In any one of the embodiments of the present invention, the mounting assembly 1 includes a mounting member 11 and an adjusting member 12, a mounting groove 111 is formed on the mounting member 11, and the adjusting member 12 is coupled to the mounting member 11 to fix the server unit 200. Referring to fig. 3, the mounting assembly 1 realizes positioning and bearing of the server unit 200 through the mounting groove 111 on the mounting member 11, and applies a clamping force to the server unit 200 through the adjusting member 12, so that the mounting assembly can be applied to server units 200 with various specifications and sizes, the adaptability of the heat dissipating device 100 is improved, and the mounting assembly 1 has a simple structure and is convenient to assemble and maintain.

In any of the embodiments of the present invention, the adjusting member 12 is screwed to the mounting member 11, and a side surface of the adjusting member 12 facing the mounting groove 111 is formed as an adjusting surface adapted to be abutted to the server unit 200. It will be appreciated that the adjusting member 12 is formed with a screw thread, the mounting member 11 is formed with a screw thread, the adjusting member 12 is connected to the mounting member 11 by screw engagement, and the adjusting member 12 is formed with an adjusting surface which abuts against the server unit 200, so that the server unit 200 is stably clamped between the adjusting members 12.

Further, the protection pad 13 is arranged between the adjusting surface and the server unit 200, so that the risk of damage to the server unit 200 caused by the adjusting piece 12 is avoided, and the server unit 200 is protected.

A heat sink 100 according to an embodiment of the present invention will be described with reference to fig. 1 to 6.

Referring to fig. 1 to 6, the heat dissipating device 100 includes a mounting assembly 1, a fixing assembly 2, a first heat dissipating assembly 3 and a second heat dissipating assembly 4, the mounting assembly 1 includes a mounting member 11 and an adjusting member 12, the fixing assembly 2 includes a first carrier 21 and a second carrier 22, the first heat dissipating assembly 3 includes a liquid cooling pipe 32, a heat dissipating fin group 31, a mounting frame 33 and a limiting seat 34, and the second heat dissipating assembly 4 includes a fixing frame 41 and a fan 42.

Specifically, the installation component 1 has the installation groove 111, the server unit 200 is located in the installation groove 111, the installation component 1 can firmly link the server unit 200 with the heat abstractor 100, the fixed component 2 is connected in the top of installation component 1, the top of fixed component 2 is connected to first cooling component 3, first cooling component 3 has fin group 31 and liquid cooling runner, liquid in the liquid cooling runner, liquid can absorb the heat of server unit 200 and take away the heat, make the server unit 200 be in suitable operating temperature all the time, the second cooling component 4 is connected in the top of first cooling component 3, second cooling component 4 is formed with the forced air cooling runner, the temperature of fin group 31 has been taken away to the air flow like this, the effect of cooling has been played to fin group 31, simultaneously, the at least part of liquid cooling runner also is located in the forced air cooling runner, in this way, the temperature of liquid cooling runner can be taken away in the heat of taking away fin group 31.

When the heat dissipating device 100 works, the first heat dissipating component 3 and/or the second heat dissipating component 4 can be turned on according to the actual temperature of the server unit 200 when the server unit 200 needs to cool, that is, when the temperature of the server unit 200 is higher, the first heat dissipating component 3 or the second heat dissipating component 4 can be turned on selectively, and when the temperature of the server unit 200 reaches the threshold value, the first heat dissipating component 3 and the second heat dissipating component 4 can be turned on simultaneously.

The passageway 311 forms in fin group 31, first radiator unit 3 includes liquid cooling pipe 32, form the liquid cooling runner in the liquid cooling pipe 32, a portion of liquid cooling pipe 32 is located passageway 311, thus, a portion of liquid cooling runner is also located passageway 311, from this, through with liquid cooling pipe 32 integrated in fin group 31, make liquid cooling pipe 32 and fin group 31 closely combine, the assembly compactness of heat abstractor 100 has been improved, the space volume of heat abstractor 100 has been saved, the interior coolant liquid of liquid cooling pipe 32, the coolant liquid absorbs and takes away the heat, the efficiency of heat exchange has been guaranteed, and the heat conduction efficiency has been improved. The fin group 31 includes 49 heat dissipation singlechips, 49 heat dissipation singlechips are arranged in the thickness direction of self, four through holes are formed on each heat dissipation singlechip, four through holes on one heat dissipation singlechip are correspondingly communicated with four through holes on the adjacent heat dissipation singlechips, and the corresponding through holes are coaxially arranged, namely, four through holes on one heat dissipation singlechip are respectively corresponding to four through holes on the adjacent heat dissipation singlechips, the channel 311 has two, and each channel 311 comprises a first through section 3111 and a second through section 3112, the first through section 3111 and the second through section 3112 extend in the thickness direction of the heat dissipation singlechips, the first through section 3111 and the second through section 3112 are arranged at intervals, the height of the first through section 3111 is lower than the height of the second through section 3112, and the distance between the first through sections 3111 of the two channels 311 is smaller than the distance between the first through section 3111 and the second through section 3112 of the same channel 311.

The liquid cooling pipe 32 comprises a first pipe section 321, a second pipe section 322 and a third pipe section 323, wherein the first pipe section 321 and the third pipe section 323 extend in the thickness direction of the radiating single sheet, the first pipe section 321 and the third pipe section 323 extend along a straight line, the second pipe section 322 is connected between the first pipe section 321 and the second pipe section 322, the liquid cooling pipe 32 is formed into a U shape, the second pipe section 322 extends along an arc line, the flowing resistance of cooling liquid is reduced, turbulence, vortex and pressure drop loss of the cooling liquid in the flowing process are avoided, the first pipe section 321 and the third pipe section 323 are located in the radiating fin group 31, and the second pipe section 322 is located outside the radiating fin group 31, so that the assembly and the maintenance are convenient. The end of the first tube section 321 that is connected to the external cooling system is provided with a sealing joint 324,

The mounting frame 33 is located between the fin group 31 and the second heat dissipation component 4, and the second heat dissipation component 4 is connected at the upside of the mounting frame 33, the fin group 31 is connected at the downside of the mounting frame 33, the first connecting portion is formed on the mounting frame 33, the second connecting portion is formed on the fin group 31, the first connecting portion cooperates with the second connecting portion so that the fin group 31 is connected with the mounting frame 33, the first connecting portion is formed into a connecting groove 331, the second connecting portion is formed into a connecting protrusion 312, the connecting protrusion 312 is located in the connecting groove 331, and connection between the mounting frame 33 and the fin group 31 is achieved.

The fixing frame 41 is located at the upper side of the mounting frame 33, the second heat dissipating component 4 is connected with the mounting frame 33 through the fixing frame 41, the third connecting portion is formed on the fixing frame 41, the fourth connecting portion is formed on the mounting frame 33, and the third connecting portion is matched with the fourth connecting portion so that the fixing frame 41 is connected with the mounting frame 33. The first connecting holes 411 penetrate the fixing frame 41 in the up-down direction, the second connecting holes 332 penetrate the mounting frame 33 in the up-down direction, the fixing frame 41 is formed into a rectangle, the first connecting holes 411 are formed at least at four corners of the fixing frame 41, the mounting frame 33 comprises two, two mounting frames 33 are formed on two sides of the fin group 31 in the length direction, each mounting frame 33 is provided with a connecting groove 331, each mounting frame 33 is provided with a second connecting hole 332, the second connecting holes 332 are arranged in a one-to-one correspondence with the first connecting holes 411, and the corresponding first connecting holes 411 penetrate the fastening pieces 5 into the second connecting holes 332, so that the fixing frame 41 and the mounting frame 33 penetrate the first connecting holes 411 and the second connecting holes 332 through the fastening pieces 5 to achieve connection. The fixing frame 41 is internally provided with a mounting bar 412, the mounting bar 412 is detachably connected with the fixing frame 41, and the fan 42 is arranged on the mounting bar 412. The first bearing plate 21 has one bearing plate located below the fin group 31, the second bearing plate 22 has two, two second bearing plates 22 are connected to two sides of the fin group 31 in the thickness direction, the second bearing plate 22 is located between the first bearing plate 21 and the fin group 31, and the second bearing plates 22 are connected to the first bearing plate 21. The heat dissipation fin group 31 is connected with the second bearing plate 22 through heat conducting glue.

The second bearing plate 22 is located at the upper side of the first bearing plate 21, the fifth connecting portion is formed on the first bearing plate 21, the sixth connecting portion is formed on the second bearing plate 22, and the fifth connecting portion cooperates with the sixth connecting portion to connect the first bearing plate 21 and the second bearing plate 22. The third connection holes 211 have four, four third connection holes 211 penetrating the first loading plate 21 in the up-down direction, and four connection holes 221 penetrating the second loading plate 22 in the up-down direction, each third connection hole 211 corresponding to one fourth connection hole 221. The fin group 31 is located between the limiting members 222, and the limiting members 222 are used for positioning and fixing the fin group 31, so that the fin group 31 cannot deviate or loosen after being installed. The spacing seat 34 cooperates with the liquid cooling pipe 32, ensures that the liquid cooling pipe 32 keeps stable position after assembly, and the spacing groove on the spacing seat 34 limits the liquid cooling pipe 32, prevents that the liquid cooling pipe 32 from shifting, vibrating or deforming in the operation process, and plays a role in supporting the liquid cooling pipe 32. The mounting assembly 1 realizes the positioning and bearing of the server unit 200 through the mounting groove 111 on the mounting piece 11, and applies clamping force to the server unit 200 through the adjusting piece 12, so that the mounting assembly is applicable to server units 200 with various specifications and sizes, and the suitability of the heat dissipating device 100 is improved. A protection pad 13 is provided between the adjustment surface and the server unit 200.

The server according to the embodiment of the second aspect of the present invention comprises a server unit 200 and the heat dissipating device 100 according to the embodiment of the first aspect of the present invention, wherein the server unit 200 is adapted to be arranged on the heat dissipating device 100.

According to the server of the embodiment of the invention, by arranging the heat dissipating device 100 of the first aspect of the embodiment of the invention, the same technical effects are achieved, namely, the first heat dissipating component 3 is provided with the liquid cooling flow channel, the second heat dissipating component 4 is provided with the air cooling flow channel, at least part of the first heat dissipating component 3 is positioned in the air cooling flow channel, so that the heat can be quickly conducted out through the liquid and can be further cooled by means of air flow or can be selected between the liquid cooling and the air cooling, the temperature can be more effectively controlled, the problems of performance degradation and hardware service life shortening caused by overheat can be reduced, and the heat dissipating device 100 is particularly suitable for heat dissipating requirements in a high-density computing environment, and has a simple integral structure and is convenient to assemble and maintain.

In some embodiments, the server unit 200 includes a housing 201, a heat dissipation portion 202 is formed on the housing 201, and the heat dissipation portion 202 is formed on opposite side walls of the housing 201. As shown in fig. 2, the heat dissipation portion 202 is formed in a rectangular shape, and the rectangular heat dissipation portion 202 is formed with a plurality of heat dissipation meshes arranged in an array, so that not only is the airflow path optimized, but also the heat dissipation efficiency is improved, and a good dust prevention effect is achieved.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.

Claims (15)

1. A heat dissipation device for dissipating heat from a server unit (200), the heat dissipation device comprising:

-a mounting assembly (1), the mounting assembly (1) being formed with a mounting groove (111), the mounting groove (111) being adapted to fix the server unit (200);

The fixing component (2) is arranged at the upper part of the mounting component (1);

The first heat dissipation assembly (3), the first heat dissipation assembly (3) is arranged above the fixed assembly (2), the first heat dissipation assembly (3) is provided with a heat dissipation fin group (31) and a liquid cooling runner, and the liquid cooling runner is positioned in the heat dissipation fin group (31);

the second heat dissipation assembly (4), second heat dissipation assembly (4) are located first heat dissipation assembly (3) deviate from one side of server unit (200), second heat dissipation assembly (4) are formed with the forced air cooling runner, at least part of fin group (31) is located in the forced air cooling runner, part of liquid cooling runner is located in the forced air cooling runner.

2. The heat dissipating device according to claim 1, wherein the fin group (31) has a channel (311) formed therein, the first heat dissipating component (3) includes a liquid cooling tube (32), the liquid cooling flow channel is formed in the liquid cooling tube (32), and at least a portion of the liquid cooling tube (32) is located in the channel (311).

3. The heat dissipating device according to claim 2, wherein the fin group (31) comprises a plurality of heat dissipating single sheets arranged in a thickness direction thereof, each of the heat dissipating single sheets having a through hole formed thereon, each of the through holes communicating in the thickness direction of the heat dissipating single sheet to define the passage (311),

The channel (311) comprises a first through section (3111) and a second through section (3112), the first through section (3111) and the second through section (3112) extend in the thickness direction of the heat dissipation monolithic, and the first through section (3111) and the second through section (3112) are arranged at intervals.

4. A heat sink according to claim 3, characterised in that the liquid cooling tube (32) has a first tube section (321), a second tube section (322) and a third tube section (323) connected in sequence, the first tube section (321) and the third tube section (323) being arranged in parallel and spaced apart in a radial direction, the second tube section (322) extending in an arc, the first tube section (321) being located in the first through section (3111) and the third tube section (323) being located in the second through section (3112).

5. The heat dissipating device according to claim 4, wherein the first heat dissipating component (3) comprises a mounting frame (33), the mounting frame (33) is connected between the heat dissipating fin group (31) and the second heat dissipating component (4), the mounting frame (33) is formed with a first connecting portion, the heat dissipating fin group (31) is formed with a second connecting portion, and the mounting frame (33) and the heat dissipating fin group (31) are cooperatively connected with the second connecting portion through the first connecting portion.

6. The heat dissipating device according to claim 5, wherein the second heat dissipating component (4) comprises a fixing frame (41) and a fan (42), the fan (42) is disposed in the fixing frame (41), the fixing frame (41) is formed with a third connecting portion, the mounting frame (33) is formed with a fourth connecting portion, and the mounting frame (33) and the fixing frame (41) are cooperatively connected with the fourth connecting portion through the third connecting portion.

7. The heat dissipating device according to claim 6, wherein a mounting bar (412) is provided in the fixing frame (41), the mounting bar (412) is detachably connected to the fixing frame (41), and the fan (42) is provided on the mounting bar (412).

8. A heat dissipating device according to claim 3, wherein the fixing member (2) comprises a first carrier plate (21) and a second carrier plate (22), the first carrier plate (21) is provided at the bottom of the fin group (31), the second carrier plate (22) is provided at both sides of the first carrier plate (21) in the thickness direction of the fin group (31), the first carrier plate (21) is connected to the second carrier plate (22), and the second carrier plate (22) is connected to the fin group (31).

9. The heat dissipating device according to claim 8, wherein the first carrier plate (21) is formed with a fifth connection portion, the second carrier plate (22) is formed with a sixth connection portion, and the first carrier plate (21) and the second carrier plate (22) are cooperatively connected to the sixth connection portion through the fifth connection portion.

10. The heat dissipating device according to claim 8, wherein the second carrier plate (22) is provided with a stopper (222), and the stopper (222) is located on both sides of the fin group (31) in the thickness direction thereof.

11. The heat dissipating device according to claim 5, wherein the first heat dissipating component (3) further comprises a limiting seat (34), wherein a limiting groove is formed on the limiting seat (34), and at least a portion of the first pipe section (321) and at least a portion of the second pipe section (322) are located in the limiting groove.

12. The heat sink according to any of the claims 1-11, wherein the mounting assembly (1) comprises a mounting member (11) and an adjusting member (12), the mounting groove (111) being formed on the mounting member (11), the adjusting member (12) being connected to the mounting member (11) for fixing the server unit (200).

13. The heat sink according to claim 12, characterized in that the adjusting member (12) is screwed with the mounting member (11), a side surface of the adjusting member (12) facing the mounting groove (111) being formed as an adjusting surface adapted to be in abutting connection with the server unit (200).

14. A server, characterized by comprising a server unit (200) and a heat sink according to any of the claims 1-13, said server unit (200) being adapted to be provided on said heat sink (100).

15. The server according to claim 14, wherein the server unit (200) includes a housing (201), and wherein the housing (201) has heat dissipation portions (202) formed thereon, and wherein the heat dissipation portions (202) are formed on opposite side walls of the housing (201).