CN120188268A - 半导体试验装置、半导体试验方法以及半导体装置的制造方法 - Google Patents

半导体试验装置、半导体试验方法以及半导体装置的制造方法 Download PDF

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Publication number
CN120188268A
CN120188268A CN202380077502.1A CN202380077502A CN120188268A CN 120188268 A CN120188268 A CN 120188268A CN 202380077502 A CN202380077502 A CN 202380077502A CN 120188268 A CN120188268 A CN 120188268A
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China
Prior art keywords
semiconductor
electrode
constant current
electrodes
test
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Pending
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CN202380077502.1A
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English (en)
Chinese (zh)
Inventor
中西学
上野和起
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN120188268A publication Critical patent/CN120188268A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN202380077502.1A 2022-11-17 2023-10-04 半导体试验装置、半导体试验方法以及半导体装置的制造方法 Pending CN120188268A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022183962 2022-11-17
JP2022-183962 2022-11-17
PCT/JP2023/036242 WO2024106052A1 (ja) 2022-11-17 2023-10-04 半導体試験装置、半導体試験方法および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN120188268A true CN120188268A (zh) 2025-06-20

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CN202380077502.1A Pending CN120188268A (zh) 2022-11-17 2023-10-04 半导体试验装置、半导体试验方法以及半导体装置的制造方法

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JP (1) JP7829726B2 (https=)
CN (1) CN120188268A (https=)
WO (1) WO2024106052A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6765125B2 (ja) * 2017-09-27 2020-10-07 日本電産リード株式会社 抵抗測定装置、基板検査装置、及び抵抗測定方法
JP7356088B2 (ja) * 2019-04-12 2023-10-04 俊彦 水上 半導体試験装置および半導体素子の試験方法
CN116325104A (zh) * 2020-10-05 2023-06-23 三菱电机株式会社 半导体试验装置和半导体试验方法
JP2022143992A (ja) * 2021-03-18 2022-10-03 三菱電機株式会社 半導体試験装置および半導体試験方法

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JP7829726B2 (ja) 2026-03-13
WO2024106052A1 (ja) 2024-05-23
JPWO2024106052A1 (https=) 2024-05-23

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