CN120129218A - A single-phase liquid cooling server heat pipe heat dissipation backplane - Google Patents
A single-phase liquid cooling server heat pipe heat dissipation backplane Download PDFInfo
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- CN120129218A CN120129218A CN202510600508.3A CN202510600508A CN120129218A CN 120129218 A CN120129218 A CN 120129218A CN 202510600508 A CN202510600508 A CN 202510600508A CN 120129218 A CN120129218 A CN 120129218A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20381—Thermal management, e.g. evaporation control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Physics & Mathematics (AREA)
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- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat pipe radiating backboard of a single-phase liquid cooling server, and belongs to the technical field of liquid cooling radiating equipment. The heat pipe radiating backboard of the single-phase liquid cooling server comprises a backboard body, an evaporating end, a condensing end and an intelligent control module, wherein the evaporating end and the condensing end are arranged on the backboard body, and the condensing end is arranged above the evaporating end. The condensing end is composed of a plurality of stages of condensers, and each stage of condenser is a micro-channel heat exchanger. The invention adopts the pump-free heat pipe phase-change heat dissipation technology, and can effectively reduce the dependence on CDU through the intelligent control module, the gas-liquid dual-mode heat dissipation structure and the hierarchical circulation design, and the unique air cooling and liquid cooling dual heat dissipation path design can effectively improve the heat dissipation performance of the data center and reduce the maintenance cost. The heat pipe radiating backboard of the single-phase liquid cooling server can adapt to different environmental conditions, can maintain a high-efficiency cooling effect under the working condition of a high-temperature environment, and has strong adaptability and wide application prospect.
Description
Technical Field
The invention belongs to the technical field of liquid cooling heat dissipation equipment, and particularly relates to a heat pipe heat dissipation backboard of a single-phase liquid cooling server.
Background
As the demand for data centers continues to grow, the problems of power consumption and heat dissipation of servers are increasingly prominent. The traditional air cooling heat dissipation mode is difficult to meet the cooling requirement of high heat flux equipment, for example, chinese patent publication No. CN 115397204A discloses a heat pipe backboard air conditioner grading treatment system and a control method thereof, which sucks out high-temperature air in a server through a fan and cools the high-temperature air into low-temperature air through a heat exchanger, so that the aim of cooling is fulfilled. According to the technical scheme, air cooling is adopted, the ratio (Power Usage Effectiveness, PUE) of total energy consumption of a data center of an air cooling system to energy consumption of IT equipment is generally 1.5-1.8, and the PUE of a liquid cooling system can be reduced to 1.05-1.15, so that the refrigerating and energy-saving effects of the liquid cooling system are far higher than those of the air cooling system. Therefore, the liquid cooling technology gradually becomes the main stream of the industry due to the higher heat exchange efficiency.
The single-phase liquid cooling in the liquid cooling technology is widely focused because the single-phase liquid cooling can directly and comprehensively cool the server, has higher heat dissipation efficiency and lower energy consumption. The single-phase liquid cooling technology utilizes the circulation flow of a single-phase cooling liquid in the system to dissipate heat. In a data center, a single-phase liquid cooling technology is often used for cooling high-density heating equipment such as a server, so as to improve energy efficiency and equipment stability. However, the current single-phase liquid cooling system still has the following three problems in the use process:
Firstly, the local temperature rise is too high, the existing single-phase liquid cooling system mainly depends on natural convection of cooling liquid or an external circulating pump to realize heat dissipation, but for a high-power-density computing unit, the local area still can be excessively high in temperature rise, and the stable operation of a server is affected. For example, chinese patent No. CN 106028745A discloses a "heat dissipation structure of a server cabinet based on a secondary heat pipe", which is to guide heat generated by a primary heating element in a server chassis through a primary heat pipe to exchange heat with the secondary heat pipe, while avoiding the complicated structure and hidden safety hazards caused by liquid entering the server in a form, the heat pipe is utilized to conduct heat directly, and then the heat dissipation of the secondary heat pipe is designed to decrease the energy sequentially, so that the heat exchange coefficient is small and the thermal resistance is large. For another example, chinese patent application publication No. CN 107580804A discloses "cooling electronic equipment in a data center," describing an embodiment of a thermosiphon system that cools electronic heat-generating equipment mounted in a server rack of the data center, directly contacting an evaporation module of the thermosiphon system with the heat-generating equipment, evaporating a working fluid to a condensation module, and finally circulating to a condenser module of the thermosiphon system. For example, chinese patent No. CN 109496110A discloses a "heat dissipation system for a data center with directly connected loop heat pipe and refrigeration cycle pipeline", wherein the heat generated by the core chip in the server is heated and evaporated into gas by the evaporation end and the core chip in the server, the gas returns to the condensation end along the gas pipe, the condensation end is connected to the refrigeration cycle pipeline of the refrigerant cycle unit through the quick joint unit for circulating working medium, the heat at the condensation end of the loop heat pipe is transmitted to the condenser of the refrigerant cycle unit by the circulating working medium, and the heat is exchanged outdoors through the condenser. The technical schemes of the two patents are that the heat pipe is directly attached to the heating unit, heat generated in the server is taken away by utilizing the heat pipe evaporation condensation principle, and the temperature in the server can be reduced to a certain extent, but the heat is still radiated in a single stage, so that local temperature is easy to rise, and the heat pipe is directly attached to the heating unit, so that the problems of large heat conduction resistance and small heat exchange area are generated, and the heat exchange efficiency is affected.
Second, the degree of dependence on the coolant distribution unit (Coolant Distribution Unit, CDU) is high, and the single-phase liquid cooling system generally needs to be configured with the CDU to control and circulate the coolant temperature, and the cooling capacity of the CDU directly determines the heat dissipation performance of the system, so that the equipment cost and the maintenance complexity are increased, and the traditional CDU needs to manage complex multi-branch two-phase flow and needs to pass through the precise temperature control of liquid cooling. For example, each cabinet requires approximately 8-12 external branch valves, and a high-pressure circulating pump is required to pump, and the high-pressure circulating pump occupies more than 40% of the CDU volume, so that the traditional CDU volume is relatively large, and the industry average value is approximately 1.5 cubic meters.
Thirdly, the energy consumption optimization difficulty is high, the existing liquid cooling system often adopts an operation mode of fixed flow and fan rotating speed, and real-time feedback and dynamic adjustment cannot be carried out according to the load of a server and the change of the environmental temperature, so that the energy consumption optimization is insufficient.
Therefore, there is a need for a heat sink that can meet the heat dissipation requirements of high power servers, and that can optimize energy consumption management, and reduce the dependence on external cooling devices (such as CDUs), so as to effectively improve the operational stability and energy efficiency ratio of the data center.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a heat pipe heat dissipation back plate of a single-phase liquid cooling server, so as to solve the technical problems that the existing heat dissipation equipment lacks intelligent regulation and control feedback, and is dependent on a cooling liquid distribution unit (CDU) so that the heat dissipation performance is low and the heat dissipation requirement of a high-power server cannot be met.
In order to achieve the above purpose, the invention is realized by adopting the following technical scheme:
The invention discloses a heat pipe radiating backboard of a single-phase liquid cooling server, which comprises a backboard body, an evaporation end, a condensation end and an intelligent control module;
The evaporation end and the condensation end are arranged on the backboard body, and the condensation end is arranged above the evaporation end; the condensing end consists of a plurality of stages of condensers, each stage of condenser is a micro-channel heat exchanger, the micro-channel heat exchanger is filled with refrigerant, and a fan is arranged behind the backboard body close to the condensing end; the intelligent control module is arranged at the side of the backboard body and used for monitoring the temperature distribution of the condensing end and the evaporating end in real time and regulating the air quantity and the cooling liquid flow of the fan passing through the condensing end and the evaporating end in real time according to temperature feedback.
Preferably, the evaporator and the condenser corresponding to the same stage are connected through a rising pipe and a falling pipe to form a refrigerant circulation closed loop.
Further preferably, the evaporator of the evaporation end is provided with three stages, including a first-stage evaporator, a second-stage evaporator and a third-stage evaporator which are arranged in parallel, and the condenser of the condensation end is provided with three stages, including a first-stage condenser, a second-stage condenser and a third-stage condenser which are arranged in parallel;
the ascending pipes are correspondingly arranged at three stages, and comprise a primary ascending pipe, a secondary ascending pipe and a tertiary ascending pipe, and the descending pipes are correspondingly arranged at three stages, and comprise a primary descending pipe, a secondary descending pipe and a tertiary descending pipe;
the first-stage evaporator, the first-stage ascending pipe, the first-stage condenser and the first-stage descending pipe are sequentially connected to form a closed loop;
the secondary evaporator, the secondary ascending pipe, the secondary condenser and the secondary descending pipe are sequentially connected to form a closed loop;
the three-stage evaporator, the three-stage ascending pipe, the three-stage condenser and the three-stage descending pipe are sequentially connected to form a closed loop.
Still more preferably, the primary evaporator and the secondary evaporator are communicated through a primary communicating pipe, and the secondary evaporator and the tertiary evaporator are communicated through a secondary communicating pipe.
The evaporating end and the condensing end are connected through a rising pipe and a falling pipe, so that a three-stage independent closed refrigerant circulation loop is formed. The high-temperature cooling liquid output by the cabinet of the data center sequentially flows through cooling liquid channels from the first-stage evaporator to the second-stage evaporator to the third-stage evaporator, and performs multi-stage heat exchange with working medium (refrigerant) in the evaporator, and the refrigerant absorbs heat and evaporates, enters a micro-channel flat tube in a condenser at a condensing end through a rising tube, is forcedly convected and condensed into liquid state through an external fan, and flows back into the evaporator at an evaporating end by virtue of gravity.
Preferably, the refrigerant filled in the microchannel heat exchanger includes, but is not limited to, R134a, and may be, for example, carbon dioxide, water, or the like.
Preferably, the intelligent control module comprises a main controller, a temperature sensor and a cooling liquid distribution unit;
The main controller is arranged outside the data center cabinet, two cooling liquid distribution units are arranged on two sides of the data center cabinet respectively, the outlet end of the first cooling liquid distribution unit is connected with the first-stage evaporator, and the third-stage evaporator is connected with the inlet end of the second cooling liquid distribution unit;
The two temperature sensors are arranged, the first temperature sensor is arranged at the outlet end of the first cooling liquid distribution unit connected with the primary evaporator, a cooling liquid valve is arranged on a pipeline of the outlet end connected with the evaporation end, and the second temperature sensor is arranged at the inlet end of the second cooling liquid distribution unit connected with the tertiary evaporator.
Preferably, the fan adopts an axial flow fan for leading the air in the data center cabinet out of the cabinet through the condensation end.
Preferably, the number of axial fans may be one or more.
Further preferably, the main controller synchronously adjusts the opening degree of the cooling liquid valve and the air quantity of the axial flow fan according to the liquid inlet temperature of the primary evaporator and the liquid outlet temperature of the tertiary evaporator.
Preferably, the outlet end of the first cooling liquid distribution unit is connected with the liquid inlet of the first-stage evaporator, and the liquid outlet of the third-stage evaporator is connected with the inlet end of the second cooling liquid distribution unit.
Preferably, the microchannel heat exchanger comprises a plurality of parallel laid microchannel flat tubes, and fins are uniformly arranged between adjacent microchannel flat tubes.
Preferably, the evaporator is a plate heat exchanger or a shell-and-tube heat exchanger.
Compared with the prior art, the invention has the following beneficial effects:
according to the heat pipe radiating backboard of the single-phase liquid cooling server, disclosed by the invention, a pumpless heat pipe phase change radiating technology is adopted, dependence on CDU can be effectively reduced through an intelligent control module, a gas-liquid dual-mode radiating structure and a hierarchical circulation design, and the unique air cooling and liquid cooling dual-radiating path design can effectively improve the radiating performance of a data center and reduce the maintenance cost. The heat pipe radiating backboard of the single-phase liquid cooling server can adapt to different environmental conditions, ensures that the working condition under the high-temperature environment keeps the efficient cooling effect, and has stronger adaptability and wide application prospect. The specific innovation point analysis is as follows:
Firstly, the split gravity heat pipes are adopted as heat dissipation carriers, the condensers are all arranged as micro-channel heat exchangers, refrigerant is filled in the micro-channel heat exchangers, meanwhile, the fan is arranged behind the backboard body close to the condensation end, the gas-liquid phase change of the refrigerant can be realized through natural circulation driven by gravity through the structural design, meanwhile, the evaporation end and the condensation end are respectively provided with a plurality of stages of evaporators and condensers with the same quantity, independent closed refrigerant self-circulation loops can be formed in the evaporators and the condensers corresponding to the same stage, heat exchange efficiency is effectively improved, and energy consumption is remarkably lower than that of a traditional cooling system, so that the split gravity heat pipe type heat exchanger is particularly suitable for high-temperature and high-heat environments.
Second, set up intelligent control module at backplate body side, can real-time supervision evaporate end and condensation end's temperature distribution, synchronous regulation refrigerant's flow and fan amount of wind ensure that cooling system is in the best energy efficiency state. For example, for the working condition of higher environmental temperature in summer, the intelligent control module can automatically increase the air quantity when the temperature difference between the hot end and the cold end is smaller, so that the device can maintain the efficient heat exchange effect under the condition of low temperature difference.
Third, the invention can reduce the dependence on CDU, the traditional CDU branch is complex, and the functions can be realized only by the traditional liquid cooling precise temperature control and high-pressure pump. On the one hand, the invention completes the phase change heat transfer of working medium by independent heat pipe circulation (closed loop of evaporation end-condensation end), each heat pipe loop has no pump and self-circulation, CDU only needs to provide basic liquid cooling flow (single-phase cooling liquid), therefore, under the same heat dissipation power (50 kW), the volume of CDU needed by the invention is only 1/3 of that of the traditional system (industry average value is 1.5 cubic meters, and the scheme of the invention is about 0.5 cubic meters). On the other hand, the structural design of the invention can effectively simplify the pipeline topology, and through the coupling design of the evaporator (plate heat exchanger) and the condenser (micro-channel heat exchanger), CDU connection ports (only two external pipelines for liquid inlet and outlet are needed for a single cabinet) can be effectively reduced, and 8-12 external branch valves are needed for each cabinet of the traditional CDU, so that the volume and the fault point of the CDU are greatly reduced.
Fourth, the invention uses gravity to drive to replace the traditional external pump, the separated gravity heat pipe loop effectively realizes the pump-free circulation, and does not need to rely on a cooling water system, thereby reducing the extra energy consumption requirement, effectively reducing the running cost of equipment and having higher energy efficiency ratio. In addition, the device itself is structurally free of complicated mechanical parts, so that the cost of long-term maintenance and the influence on the environment can be reduced.
Further, the refrigerant is selected to be a refrigerant working medium capable of performing phase change heat exchange at the evaporation end and the condensation end, such as an environment-friendly refrigerant, so that the environmental impact can be reduced, and the energy-saving environment-friendly requirement is met. Such as R134a, carbon dioxide or water.
Furthermore, the evaporator and the condenser of the evaporation end and the condensation end of the heat pipe heat dissipation backboard of the single-phase liquid cooling server can be considered to be arranged in two stages to four stages, and the stage numbers can be adjusted according to different application scenes. Currently, three stages are preferred from the viewpoints of structure and actual working condition requirements.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a heat pipe heat dissipation back plate of a single-phase liquid cooling server according to the present invention;
FIG. 2 is a schematic diagram of an exemplary configuration of a single-phase liquid-cooled server heat pipe heat sink back plate for a data center cooling system according to the present invention;
FIG. 3 is a schematic diagram of an apparatus structure of a rack of a data center;
FIG. 4 is a schematic diagram of a microchannel heat exchanger;
FIG. 5 is a schematic diagram of a partial structure of an evaporating end of a heat pipe heat dissipation back plate of a single-phase liquid cooling server according to the present invention;
fig. 6 is a graph of experimental results of application of the heat pipe heat dissipation back plate of the single-phase liquid cooling server.
The cooling system comprises 100 parts of a data center cooling system, 110 parts of a data center cabinet, 120 parts of a first cooling liquid distribution unit, 121 parts of a second cooling liquid distribution unit, 130 parts of a first temperature sensor, 131 parts of a second temperature sensor, 140 parts of a cooling liquid valve, 150 parts of a main controller, 160 parts of a condensation end, 161 parts of a first-stage condenser, 162 parts of a second-stage condenser, 163 parts of a third-stage condenser, 164 parts of an axial fan, 165 parts of a first-stage downcomer, 166 parts of a second-stage downcomer, 167 parts of a third-stage downcomer, 170 parts of an evaporation end, 171 parts of a first-stage evaporator, 172 parts of a second-stage evaporator, 173 parts of a third-stage evaporator, 174 parts of a first-stage riser, 175 parts of a second-stage riser, 176 parts of a third-stage riser, 177 parts of a first-stage communication pipe, 178 parts of a second-stage communication pipe, 181 parts of a liquid inlet, 182 parts of a liquid outlet, 190 parts of a microchannel heat exchanger, 191 parts of a microchannel flat pipe, 192 parts of a fin.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the attached drawing figures:
Example 1
Referring to fig. 1, the heat pipe radiating backboard of the single-phase liquid cooling server disclosed by the invention comprises a backboard body, an evaporation end 170, a condensation end 160 and an intelligent control module, wherein the evaporation end 170 and the condensation end 160 are both arranged on the backboard body, the condensation end 160 is arranged above the evaporation end 170, the condensation end 160 is composed of a plurality of stages of condensers, each stage of condenser is a micro-channel heat exchanger 190, the micro-channel heat exchanger 190 is filled with refrigerant, and a fan is arranged behind the backboard body provided with the condensation end and used for leading air inside a cabinet 110 of a data center out of the cabinet through the condensation end.
The evaporation end 170 is formed by a plurality of stages of evaporators, the number of the evaporators and the number of the condensers are the same, and the evaporators and the condensers corresponding to the same stage are connected to form a refrigerant circulation closed loop. The refrigerant absorbs heat and evaporates and then enters the micro-channel heat exchanger 190 of the condenser, is forced to be condensed into a liquid state by forced convection by an external fan, and then flows back into the evaporator by means of gravity.
Referring to fig. 2, in the data center cooling system 100, the back plate body is regarded as a cabinet door of the data center cabinet 110, and the intelligent control module is disposed beside the back plate body, and is used for monitoring temperature distribution of the condensation end 160 and the evaporation end 170 in real time, and adjusting refrigerant flow rate passing through the condensation end 160 and the evaporation end 170 and air quantity of the fan in real time according to temperature feedback.
Preferably, the intelligent control module comprises a main controller 150, a temperature sensor and cooling liquid distribution units, wherein the main controller 150 is arranged outside the data center cabinet 110, two cooling liquid distribution units are arranged, each cooling liquid distribution unit comprises a first cooling liquid distribution unit 120 and a second cooling liquid distribution unit 121, the two cooling liquid distribution units are respectively arranged at two sides of the data center cabinet 110, an outlet end of the first cooling liquid distribution unit 120 is connected with a first-stage evaporator 171, and a third-stage evaporator 173 is connected with an inlet end of the second cooling liquid distribution unit 121;
The two temperature sensors are provided, and include a first temperature sensor 130 and a second temperature sensor 131, wherein the first temperature sensor 130 is installed at an outlet end of the first cooling liquid distribution unit 120 connected to the primary evaporator 171, and a cooling liquid valve 140 is provided on a pipeline of the outlet end connected to the evaporation end 170, and the second temperature sensor 131 is installed at an inlet end of the second cooling liquid distribution unit 121 connected to the tertiary evaporator 173. The main controller 150 performs temperature feedback based on the temperature parameters acquired by the two temperature sensors in real time, and synchronously adjusts the opening degree of the coolant valve 140 and the rotating speed of the axial flow fan 164, so as to realize dynamic balance of heat dissipation efficiency and energy consumption.
In view of the structure and the actual working condition requirements, the evaporator and the condenser at the evaporation end and the condensation end of the embodiment of the invention are preferably arranged in three stages. Specifically, the evaporation end 170 is composed of a primary evaporator 171, a secondary evaporator 172 and a tertiary evaporator 173 which are arranged in parallel, and the three evaporators are connected through two sections of communicating pipes, specifically, the primary evaporator 171 and the secondary evaporator 172 are communicated through a primary communicating pipe 177, and the secondary evaporator 172 and the tertiary evaporator 173 are communicated through a secondary communicating pipe 178.
Preferably, as shown in fig. 1, the evaporator used in the present embodiment is a plate heat exchanger (e.g., a printed circuit board heat exchanger) or a shell-and-tube heat exchanger (e.g., a high efficiency tank).
Preferably, the condensation end 160 is composed of a primary condenser 161, a secondary condenser 162 and a tertiary condenser 163 which are arranged in parallel, each of the primary condensers works independently, and the condensers adopt a micro-channel heat exchanger 190. As shown in fig. 4, the microchannel heat exchanger 190 includes a plurality of parallel microchannel flat tubes 191, fins 192 are uniformly arranged between adjacent microchannel flat tubes 191, and the design of the fin structure increases the contact area between the refrigerant and the cold air, and improves the condensation efficiency, thereby enhancing the overall heat exchange effect. The micro-channel heat exchanger 190 is filled with a heat pipe working medium, namely a refrigerant, and the refrigerant used in the embodiment is R134a, and may also be a refrigerant such as carbon dioxide or water.
Preferably, the evaporator and the condenser corresponding to the same stage are connected through a rising pipe and a falling pipe to form a refrigerant circulation closed loop. Further preferably, the rising pipes are correspondingly arranged in three stages, including a first-stage rising pipe 174, a second-stage rising pipe 175 and a third-stage rising pipe 176, and the falling pipes are correspondingly arranged in three stages, including a first-stage falling pipe 165, a second-stage falling pipe 166 and a third-stage falling pipe 167;
the first evaporator 171, the first rising pipe 174, the first condenser 161 and the first falling pipe 165 are sequentially connected to form a closed loop, the second evaporator 172, the second rising pipe 175, the second condenser 162 and the second falling pipe 166 are sequentially connected to form a closed loop, and the third evaporator 173, the third rising pipe 176, the third condenser 163 and the third falling pipe 167 are sequentially connected to form a closed loop.
Preferably, referring to fig. 3, the fans disposed behind the back plate body near the condensation end, i.e., outside the data center cabinet 110, are axial fans 164, and the number of axial fans 164 may be one or more, for guiding the air inside the data center cabinet 110 out of the cabinet through the condensation end. Therefore, it is further preferable that the main controller 150 synchronously adjusts the opening size of the coolant valve 140 and the air volume of the axial flow fan 164 according to the temperature of the liquid inlet 181 of the primary evaporator 171 and the temperature of the liquid outlet 182 of the tertiary evaporator 173.
Preferably, referring to fig. 5, the outlet end of the first cooling liquid distribution unit 120 is connected to the liquid inlet 181 of the first stage evaporator 171, and the liquid outlet 182 of the third stage evaporator 173 is connected to the inlet end of the second cooling liquid distribution unit 121.
One working scenario of the invention when the heat pipe heat dissipation back plate of the single-phase liquid cooling server is used is described below by way of an application example.
Fig. 2 is an exemplary structural diagram of a heat pipe heat dissipation back plate of a single-phase liquid cooling server for a cooling system of a data center, and by using such an application example, the problem of excessive temperature of an internal server of the data center is enumerated, and a solution for performing temperature control adjustment by using the heat pipe heat dissipation back plate of the single-phase liquid cooling server is provided.
In particular, as the power consumption and heat dissipation of the data center server are increasingly increased, the working temperature in the data center server is up to 70 ℃, so that the problems of slow running speed, reduced calculation power, equipment damage and the like of the server caused by overhigh temperature are solved, the heat dissipation back plate of the heat pipe of the single-phase liquid cooling server is utilized for heat dissipation, and the heat in the server is taken away through the cold air circulation cooling of the environment, so that the high-quality stable running of the server is ensured.
As shown in fig. 3, in use, the temperature of the cooling liquid in the data center server rises, the cooling liquid flows into the liquid inlet 181 of the primary evaporator 171 through the first cooling liquid distribution unit 120, sequentially passes through the secondary evaporator 172 and the tertiary evaporator 173, finally flows out of the liquid outlet 182 of the tertiary evaporator 173, and then enters the second cooling liquid distribution unit 121. In the above process, the refrigerant performs multistage heat exchange with the internal working medium when passing through the evaporation end 170, and after the refrigerant in the evaporation end 170 absorbs heat and evaporates to become gas, the gas enters the condensation end 160 through the ascending pipes at all stages, the condensers at all stages of the condensation end 160 are all microchannel heat exchangers 190, and the fin structure can effectively increase the heat exchange area. Meanwhile, the axial flow fan 164 outside the data center cabinet 110 draws out cold air inside the data center cabinet 110, and then discharges the warmed cold air outside the data center cabinet 110 through the condensation end 160, and when the cold air passes through the condensation end 160, the gaseous refrigerant inside the micro-channel heat exchanger 190 is condensed into a liquid state by utilizing forced convection, and flows back into the evaporation end 170 through the downcomers of each stage by means of gravity, so that the purpose of cooling the single-phase liquid cooling server is achieved through the process. In addition, the main controller 150 in the intelligent control module performs temperature feedback based on temperature sensors arranged at the outlet end and the inlet end of the cooling liquid distribution unit, and then synchronously adjusts the opening degree of the cooling liquid valve 140 and the rotating speed of the axial flow fan 164, so as to realize dynamic balance of heat dissipation efficiency and energy consumption.
The application experiment is carried out by adopting the heat pipe radiating backboard of the single-phase liquid cooling server, specifically, under the condition that the environment temperature is 38 ℃, two different fan powers (60 kW and 200kW are adopted in the experiment) are used for carrying out the experiment, the inlet temperature of cold air before passing through the condensing end is 38 ℃, three inlet temperature working conditions of 70 ℃, 60 ℃ and 52 ℃ are simulated before the cooling liquid enters the condensing end, after the cooling liquid is cooled through the condensing end, the temperature of a cold air outlet is increased, the maximum temperature can reach 59 ℃, and the temperature of the cooling liquid outlet is obviously reduced. For example, when the fan power is 200kW and the inlet temperature of the cooling liquid is 70 ℃, the outlet temperature is 54 ℃, and the result is shown in fig. 6, which shows the heat dissipation amounts corresponding to two different fan powers under three working conditions. According to the change, the heat pipe heat dissipation backboard of the single-phase liquid cooling server obviously reduces the temperature of cooling liquid in the heat exchange process, and enables the temperature of cold air to rise, so that the heat exchange backboard has excellent heat exchange effect, and particularly has the advantage of realizing the reverse end difference. Therefore, the heat exchange efficiency of the heat pipe heat dissipation backboard of the single-phase liquid cooling server is obvious, and more efficient energy exchange can be realized in practical application.
In summary, the heat pipe radiating backboard of the single-phase liquid cooling server provided by the invention is combined with the composite hierarchical radiating structure of the plate heat exchanger and the microchannel heat exchanger, so that efficient phase change cooling can be effectively realized, local temperature rise is reduced, and heat exchange uniformity is improved. Meanwhile, the intelligent control module can be used for dynamically adjusting the flow of the cooling liquid and the operation parameters of the fan, so that the energy consumption is optimized, and a more stable and energy-saving heat dissipation scheme is realized. The invention adopts a composite hierarchical structure of a plate heat exchanger and a micro-channel heat exchanger, combines an air cooling and liquid cooling dual heat dissipation path, solves the problem of overhigh local temperature rise of the traditional single-phase cooling, and realizes energy-saving optimization of a heat dissipation backboard by utilizing multi-stage temperature sensing and cooperative control through the independent closed refrigerant self-circulation loop design formed by a plurality of stages of evaporators and condensers and embedding a pumpless heat pipe into a single-phase liquid cooling system for phase-change heat dissipation. Therefore, the heat pipe heat dissipation backboard of the single-phase liquid cooling server can improve the heat dissipation uniformity of the high heat flux density data center, and the maintenance cost is obviously lower than that of the traditional cold plate scheme.
The above is only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited by this, and any modification made on the basis of the technical scheme according to the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (10)
1. The heat pipe radiating backboard of the single-phase liquid cooling server is characterized by comprising a backboard body, an evaporation end (170), a condensation end (160) and an intelligent control module;
The evaporator comprises a back plate body, an evaporator end (170) and a condenser end (160), wherein the evaporator end (170) and the condenser end (160) are arranged on the back plate body, the condenser end (160) is arranged above the evaporator end (170), the condenser end (160) is composed of a plurality of stages of condensers, each stage of condenser is a micro-channel heat exchanger (190), the micro-channel heat exchanger (190) is filled with refrigerant, and a fan is arranged behind the back plate body close to the condenser end;
The intelligent control module is arranged beside the backboard body and used for monitoring temperature distribution of the condensation end (160) and the evaporation end (170) in real time and adjusting air quantity and cooling liquid flow of a fan passing through the condensation end (160) and the evaporation end (170) in real time according to temperature feedback.
2. The heat pipe heat sink back plate of single-phase liquid cooling server according to claim 1, wherein the evaporator and the condenser corresponding to the same stage are connected by a rising pipe and a falling pipe to form a refrigerant circulation closed loop.
3. The heat pipe heat dissipation back of a single-phase liquid cooling server according to claim 2, wherein the evaporator of the evaporation end (170) is three stages, including a primary evaporator (171), a secondary evaporator (172) and a tertiary evaporator (173) which are arranged in parallel, and the condenser of the condensation end (160) is three stages, including a primary condenser (161), a secondary condenser (162) and a tertiary condenser (163) which are arranged in parallel;
the rising pipes are correspondingly arranged in three stages, and comprise a first-stage rising pipe (174), a second-stage rising pipe (175) and a third-stage rising pipe (176), and the falling pipes are correspondingly arranged in three stages, and comprise a first-stage falling pipe (165), a second-stage falling pipe (166) and a third-stage falling pipe (167);
The primary evaporator (171), the primary rising pipe (174), the primary condenser (161) and the primary falling pipe (165) are sequentially connected to form a closed loop;
The secondary evaporator (172), the secondary ascending pipe (175), the secondary condenser (162) and the secondary descending pipe (166) are sequentially connected to form a closed loop;
The three-stage evaporator (173), the three-stage ascending pipe (176), the three-stage condenser (163) and the three-stage descending pipe (167) are sequentially connected to form a closed loop.
4. A heat pipe heat dissipation back plate for a single-phase liquid cooling server according to claim 3, wherein the primary evaporator (171) and the secondary evaporator (172) are connected by a primary connection pipe (177), and the secondary evaporator (172) and the tertiary evaporator (173) are connected by a secondary connection pipe (178).
5. A single-phase liquid cooling server heat pipe heat dissipation back plate according to claim 3, wherein said intelligent control module comprises a main controller (150), a temperature sensor and a coolant distribution unit;
The main controller (150) is arranged outside the data center cabinet (110), two cooling liquid distribution units are arranged and are respectively arranged at two sides of the data center cabinet (110), the outlet end of the first cooling liquid distribution unit (120) is connected with the first-stage evaporator (171), and the third-stage evaporator (173) is connected with the inlet end of the second cooling liquid distribution unit (121);
The two temperature sensors are arranged, a first temperature sensor (130) is arranged at the outlet end of a first cooling liquid distribution unit (120) connected with a primary evaporator (171), a cooling liquid valve (140) is arranged on a pipeline of the outlet end connected with an evaporation end (170), and a second temperature sensor (131) is arranged at the inlet end of a second cooling liquid distribution unit (121) connected with a tertiary evaporator (173).
6. The heat pipe heat sink back plate of single phase liquid cooled server of claim 5, wherein said fan employs an axial flow fan (164) for directing air inside said data center cabinet (110) out of the cabinet through a condensing end.
7. The heat pipe heat dissipation back plate of a single-phase liquid cooling server according to claim 6, wherein the main controller (150) synchronously adjusts the opening of the cooling liquid valve (140) and the air volume of the axial flow fan (164) according to the temperature of the liquid inlet (181) of the primary evaporator (171) and the temperature of the liquid outlet (182) of the tertiary evaporator (173).
8. The heat pipe heat dissipation back plate of a single-phase liquid cooling server according to claim 5, wherein an outlet end of the first cooling liquid distribution unit (120) is connected to a liquid inlet (181) of the primary evaporator (171), and a liquid outlet (182) of the tertiary evaporator (173) is connected to an inlet end of the second cooling liquid distribution unit (121).
9. The heat pipe heat dissipation back plate of a single-phase liquid cooling server according to any one of claims 1 to 8, wherein the microchannel heat exchanger (190) comprises a plurality of parallel laid microchannel flat pipes (191), and fins (192) are uniformly arranged between adjacent microchannel flat pipes (191).
10. A heat pipe heat dissipation back plate for a single-phase liquid cooling server according to any one of claims 1 to 8, wherein the evaporator is a plate heat exchanger or a shell and tube heat exchanger.
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