CN120035098A

CN120035098A - Heat dissipation housing, heat dissipation back clip and heat dissipation system

Info

Publication number: CN120035098A
Application number: CN202510289330.5A
Authority: CN
Inventors: 陈锦鹏; 施福来; 孙婷; 郭亚
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2025-03-11
Filing date: 2025-03-11
Publication date: 2025-05-23

Abstract

The application provides a heat dissipation shell which is used for dissipating heat of electronic equipment, wherein a heat dissipation back clamp comprises a protection shell, a phase-change heat storage film and a soaking plate, the protection shell is sleeved on the back of the electronic equipment, the phase-change heat storage film is arranged on the protection shell, the soaking plate is laminated on the phase-change heat storage film, and heat generated by the operation of the electronic equipment is conducted to the phase-change heat storage film after being soaked by the soaking plate. The phase change heat storage film can absorb a large amount of heat, and meanwhile, the temperature rise is not obvious, so that the heat storage capacity of the heat dissipation shell is improved, the temperature rise rate of the heat dissipation shell is reduced, and the time of the electronic equipment in a low-temperature working environment is prolonged. The application also provides a heat dissipation back clip and electronic equipment.

Description

Heat dissipation shell, heat dissipation back splint and heat dissipation system

Technical Field

The present invention relates to the field of heat dissipation of electronic devices, and in particular, to a heat dissipation housing, a heat dissipation back clip, and a heat dissipation system.

Background

With the continuous development of the communication industry and AI technology, the functions of the existing intelligent terminal equipment such as the mobile phone are more and more abundant and various, and when the existing mobile phone brings more abundant experiences of games, images, AI and the like to users, the heating phenomenon is more and more serious due to the increase of the power consumption of the mobile phone. The internal space of the mobile phone is limited, the heat dissipation requirement of the mobile phone is difficult to meet only through natural convection heat dissipation, and at present, parts such as a micropump liquid cooling protective shell, a heat dissipation back clamp and the like are adopted for the mobile phone to dissipate heat. However, the existing micropump liquid cooling protective housing can only perform temperature equalization on heat generated in the operation process of the electronic equipment, so that the heat exchange efficiency of the electronic equipment and the external environment cannot be improved, and along with the lengthening of the operation time of the electronic equipment, the thermal experience of the electronic equipment can be obviously deteriorated.

Disclosure of Invention

The application provides a heat dissipation shell, a heat dissipation back clamp and a heat dissipation system which are convenient to use.

The heat dissipation shell is used for dissipating heat of electronic equipment, the heat dissipation back clamp comprises a protection shell, a phase-change heat storage film and a soaking plate, the protection shell is sleeved on the back of the electronic equipment, the phase-change heat storage film is arranged on the protection shell, the soaking plate is laminated on the phase-change heat storage film, and heat generated by operation of the electronic equipment is conducted to the phase-change heat storage film after being soaked by the soaking plate.

The application further provides a heat dissipation back clamp which is connected to the heat dissipation shell or the back of the electronic equipment, wherein the heat dissipation shell comprises a connecting seat, a semiconductor refrigerating sheet, a second wireless charging coil and a second circuit board, the semiconductor refrigerating sheet is arranged on the connecting seat, the second wireless charging coil is arranged on one side of the connecting seat, the second circuit board is arranged on the other side of the connecting seat, the second circuit board is electrically connected with the second wireless charging coil, the second wireless charging coil can sense the change of a magnetic field generated by the wireless charging coil of the electronic equipment to generate second current, and the second current is used for supplying power to the semiconductor refrigerating sheet.

The application also provides a heat dissipation system which is used for dissipating heat of the electronic equipment and comprises a heat dissipation shell and a heat dissipation back clamp, wherein the heat dissipation shell is sleeved on the back of the electronic equipment, and the heat dissipation back clamp is connected to one side, away from the electronic equipment, of the heat dissipation shell.

The heat dissipation shell is sleeved on the back of the electronic equipment, and after the heat generated by the operation of the electronic equipment is soaked by the soaking plate, the heat is conducted to the phase change heat storage film through contact, and the phase change heat storage film has the characteristic of high heat storage density, so that the temperature rise is not obvious while the phase change heat storage film absorbs a large amount of heat, the heat storage capacity of the heat dissipation shell is improved, the heating rate of the heat dissipation shell is reduced, the time of the electronic equipment in a low-temperature working environment is prolonged, the use heat test of the electronic equipment is not greatly changed, and the heat test of a user using the electronic equipment is improved.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are of some embodiments of the invention and that other drawings may be derived from these drawings without undue effort.

Fig. 1 is a schematic perspective view of a heat dissipation housing according to an embodiment of the application.

Fig. 2 is an exploded perspective view of the heat dissipating case of fig. 1.

Fig. 3 is a further exploded perspective view of the heat dissipating housing of fig. 2.

Fig. 4 is a further exploded perspective view of the heat dissipating housing of fig. 3.

Fig. 5 is a further exploded perspective view of the heat dissipating housing of fig. 4.

Fig. 6 is a schematic perspective view of another view of the heat dissipation housing in fig. 5.

Fig. 7 is a perspective cross-sectional view of the heat dissipating housing of fig. 1.

Fig. 8 is an enlarged view of a portion VIII in fig. 7.

Fig. 9 is a use state diagram of the heat dissipation case of fig. 1.

Fig. 10 is a schematic perspective view of a heat dissipation back clip according to an embodiment of the application.

Fig. 11 is a schematic perspective view of another view of the heat sink clip of fig. 10.

Fig. 12 is an exploded perspective view of the heat sink clip of fig. 10.

Fig. 13 is an exploded perspective view of the heat sink clip of fig. 11.

Fig. 14 is a further exploded perspective view of the heat sink clip of fig. 12.

Fig. 15 is a further exploded perspective view of the heat sink clip of fig. 13.

Fig. 16 is a further exploded perspective view of the heat sink clip of fig. 14.

Fig. 17 is a further exploded perspective view of the heat sink clip of fig. 15.

Fig. 18 is a view showing a state of use of the heat sink clip of fig. 10.

Fig. 19 is a schematic perspective view of a heat dissipation system according to an embodiment of the application.

Fig. 20 is a schematic perspective view of another view of the heat dissipating system of fig. 19.

Fig. 21 is an exploded perspective view of the heat dissipating system of fig. 19.

Fig. 22 is a schematic perspective view of another view of the heat dissipation system of fig. 20.

FIG. 23 is a schematic view of the heat dissipation system of FIG. 19 in use;

FIG. 24 is a schematic side view of the heat dissipating system of FIG. 23;

FIG. 25 is a schematic side view of a heat dissipating system according to another embodiment of the present application;

Fig. 26 is a schematic side view of a heat dissipating system according to another embodiment of the present application.

The main reference numerals illustrate:

100. A heat dissipation system; 20, a heat dissipation shell; 21, a protective housing; 210, back plate, 2101, first receiving space, 2102, receiving slot, 2103, support portion, 2104, positioning slot, 2106, first slot, 2107, second slot, 211, mounting space, 212, side wall, 213, end wall, 23, phase change thermal storage membrane, 232, first relief hole, 234, second relief hole, 24, soaking plate, 242, first cover membrane, 244, second cover membrane, 245, circulation pump, 25, heat conducting adhesive film, 26, first wireless charging coil, 262, first circuit board, 264, flexible circuit board, 27, first magnetic suction member, 40, heat sink clip, 41, connecting seat, 410, first mounting slot, 411, second mounting slot, 412, first positioning tab, 413, positioning column, 414, positioning hole, 415, positioning flange, 416, clamping slot, 417, heat conducting connecting plate, 418, fixing slot, 4182, connecting hole, 419, clamping slot, 42, semiconductor tab, 43, second wireless charging coil, 44, second circuit board, 442, second circuit board, 45, circulating pump, 25, heat conducting adhesive film, 26, first wireless charging coil, 262, first circuit board, 264, flexible circuit board, 27, first magnetic suction member, 40, heat sink clip, 41, connecting seat, connecting flange, 410, first mounting slot, 411, second mounting slot, second mounting plate, 412, first positioning tab, 413, positioning tab, positioning column, positioning tab, 416, positioning tab, positioning slot, positioning tab, positioning slot, positioning tab mounting flange and mounting flange and mounting tab mounting and, 322 parts of a main board, 322 parts of a heating source, 330 parts of a battery and 350 parts of a wireless charging coil.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without any inventive effort, are intended to be within the scope of the invention.

Furthermore, the following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments in which the application may be practiced. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present application are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, directly connected, indirectly connected via an intermediary, or in communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-4, a heat dissipation housing 20 in an embodiment of the present invention is used for dissipating heat of an electronic device, the electronic device is provided with a wireless charging coil, the heat dissipation housing 20 includes a protection housing 21, a phase-change heat storage film 23, a soaking plate 24 and a heat-conducting adhesive film 25, the protection housing 21 is sleeved on the back of the electronic device, the phase-change heat storage film 23 is disposed on the protection housing, the soaking plate 24 is laminated on the phase-change heat storage film 23, the heat-conducting adhesive film 25 is laminated on the side of the soaking plate 24 facing away from the phase-change heat storage film 23, heat generated by the electronic device running in an inner cavity of the protection housing 21 is conducted to the soaking plate 24 through the heat-conducting adhesive film 25, in this embodiment, the soaking plate 24 is a liquid cooling film cold-conducting plate, and the heat flows along with a heat-conducting liquid of the soaking plate 24, so that the heat is conducted to the whole soaking plate 24 rapidly and uniformly, so that the heat generated by the electronic device running is conducted to the phase-change heat storage film 23 after passing through the soaking plate 24, and the phase-change material in the phase-change heat storage film 23 can absorb a large amount of heat during the phase change process, thereby effectively reducing the temperature generated by the electronic device when running.

It should be noted that, the heat dissipation housing 20 is sleeved on the back of the electronic device, the heat dissipation housing 20 is used for dissipating heat from a heat source of the electronic device, the soaking plate 24 is made of a non-conductive polymer material, so as to enhance the soaking effect of the soaking plate 24, and the soaking plate 24 may be, but is not limited to, a liquid cooling membrane soaking plate, an ultrathin soaking plate, a semiconductor refrigerating plate, and the like. The phase-change heat storage film 23 is made of a material with higher heat storage capacity, higher reliability and lower cost so as to achieve better heat dissipation effect, and specifically, the phase-change heat storage film 23 can be made of, but not limited to, an expanded graphite matrix composite material, a microcapsule packaging material, polyalcohol, high-density polyethylene, paraffin, fatty acid and derivatives thereof, hydrated salt, molten salt and the like. The electronic device may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart watch, a VR head mounted display, a smart wearable device, etc., and the heating source may be, but is not limited to, a processor, an image sensor, a memory module, a radio frequency circuit, a screen display circuit, a WIFI module, a bluetooth module, a camera module, etc. "connected" in the description of the embodiments of the present invention is intended to include both direct connection and indirect connection, such as where the a and B connections include direct connection of a and B or other connection through a third element C or more. The connection also comprises two cases of integrated connection and non-integrated connection, wherein the integrated connection means that A and B are integrally formed and connected, and the non-integrated connection means that A and B are non-integrally formed and connected.

The heat dissipation shell 20 is sleeved on the back of the electronic equipment, and after the heat generated by the operation of the electronic equipment is soaked by the soaking plate 24, the heat is conducted to the phase-change heat storage film 23 through contact, and the phase-change heat storage film 23 has the characteristic of high heat storage density, so that the temperature rise of the phase-change heat storage film 23 is not obvious while a large amount of heat is absorbed, the heat storage capacity of the heat dissipation shell 20 is improved, the temperature rising rate of the heat dissipation shell 20 is reduced, the time of the electronic equipment in a low-temperature working environment is prolonged, the use thermal test change of the electronic equipment is not great, and the thermal test of a user using the electronic equipment is improved.

As shown in fig. 5 and 6, the heat dissipation housing 20 includes a back plate 210 and a peripheral wall surrounding the edge of the back plate 210, wherein the back plate 210 and the peripheral wall form a mounting space 211, and the mounting space 211 is used for accommodating electronic equipment. In this embodiment, the back plate 210 is a rectangular plate, and the peripheral wall includes side walls 212 disposed on opposite sides of the back plate 210 and end walls 213 disposed on opposite sides of the back plate 210, and the back plate 210, the two side walls 212 and the two end walls 213 define an installation space 211. The inner surface of the back plate 210 is provided with a first accommodating space 2101, and the heat conductive adhesive film 25 can be positioned in the first accommodating space 2101, and in this embodiment, the first accommodating space 2101 is a rectangular groove, and the rectangular groove is distributed on the inner surface of the whole back plate 210. In this embodiment, the accommodating groove 2102 is located on the inner surface of the back plate 210 in the first accommodating space 2101, and the shape of the phase-change heat storage film 23 and the shape of the soaking plate 24 are consistent with the shape of the accommodating groove 2102.

Optionally, the heat dissipation housing 20 further includes a first wireless charging coil 26, where the first wireless charging coil 26 is disposed on the protection housing 21, and when the wireless charging coil of the electronic device accommodated in the installation space 211 generates a changing magnetic field, the first wireless charging coil 26 senses the changing magnetic field to generate a first current, and the first current is used to supply power to the vapor chamber 24. In this embodiment, the first wireless charging coil 26 is disposed at one end of the inner surface of the back plate 210, the area of the wireless charging coil of the electronic device is larger than the area of the first wireless charging coil 26, and the orthographic projection of the first wireless charging coil 26 on the surface of the wireless charging coil of the electronic device is located on the surface of the wireless charging coil. The first wireless charging coil 26 may be embedded in the back plate 210, in this embodiment, the bottom surface of the accommodating groove 2102 of the heat dissipation housing 20 is provided with a supporting portion 2103, specifically, the supporting portion 2103 is a circular block, and the first wireless charging coil 26 is disposed on the supporting portion 2103.

Optionally, the heat dissipation housing 20 further includes a first magnetic attraction member 27, where the first magnetic attraction member 27 can be embedded in the back plate 210, and the protection housing 21 is provided with a positioning slot 2104, and in this embodiment, the positioning slot 2104 is disposed on an inner surface of the back plate 210, and the first magnetic attraction member 27 is positioned in the positioning slot 2104. Specifically, the positioning groove 2104 is provided around the outer periphery of the surface of the support portion 2103. In this embodiment, the first magnetic attraction member 27 is a first magnetic attraction ring, the positioning groove 2104 is an annular groove, the first magnetic attraction ring can be positioned in the annular groove, the first wireless charging coil 26 is positioned in an inner cavity of the first magnetic attraction ring, an inner circumferential surface of the first magnetic attraction ring is spaced from an outer circumferential surface of the first wireless charging coil 26, and a surface of the first magnetic attraction member 27, a surface of the first wireless charging coil 26 and a bottom surface of the accommodating groove 2102 are coplanar. The phase-change thermal storage film 23 is provided with a first avoiding hole 232, and when the phase-change thermal storage film 23 is accommodated in the accommodating groove 2102, the supporting portion 2103 and the first magnetic attraction member 27 are accommodated in the first avoiding hole 232.

In other embodiments, the supporting portion 2103 on the heat dissipation housing 20 may be omitted, the first magnetic member 27 is directly attached to the bottom surface of the accommodating groove 2102, the first wireless charging coil 26 is accommodated in the inner cavity of the first magnetic member 27, the first wireless charging coil 26 is fixedly connected to the bottom surface of the accommodating groove 2102, and the inner peripheral surface of the first magnetic member 27 is spaced from the outer peripheral surface of the first wireless charging coil 26. Alternatively, a spacer ring is provided between the inner peripheral surface of the first magnetic attraction member 27 and the outer peripheral surface of the first wireless charging coil 26. When the first magnetic attraction 27 and the first wireless charging coil 26 are positioned on the back plate 210, the surface of the first magnetic attraction 27 and the surface of the first wireless charging coil 26 are coplanar with the bottom surface of the accommodating groove 2102.

Optionally, the heat dissipation housing 20 further includes a first circuit board 262 and a flexible circuit board 264, the first circuit board 262 is connected to the first wireless charging coil 26 through the flexible circuit board 264, a clearance groove is formed in an inner surface of the heat dissipation housing 20, and the first circuit board 262 and the flexible circuit board 264 are accommodated in the clearance groove. In this embodiment, the back plate 210 is provided with an avoidance groove on the bottom surface of the accommodating groove 2102, the avoidance groove includes a first groove 2106 and a second groove 2107 communicating with the first groove 2106, one end of the second groove 2107 away from the first groove 2106 extends to the supporting portion 2103, the first circuit board 262 is accommodated in the first groove 2106, and the flexible circuit board 264 is accommodated in the second groove 2107. The phase-change heat storage film 23 is further provided with a second avoiding hole 234, and when the phase-change heat storage film 23 is accommodated in the accommodating groove 2102, the first circuit board 262 faces the second avoiding hole 234.

In this embodiment, the vapor chamber 24 is a liquid-cooled membrane cold-conducting plate, which includes a middle plate, a first coating 242 covering one side of the middle plate, a second coating 244 covering the opposite side of the middle plate, and a circulation pump 245, wherein the middle plate has a flow channel, and the flow channel is filled with a heat transfer liquid, and the circulation pump 245 operates to drive the heat transfer liquid to flow in the flow channel so as to uniformly and rapidly transfer heat to the entire vapor chamber 24. When the first coating film 242 of the vapor chamber 24 is attached to the phase-change heat storage film 23, the circulation pump 245 is accommodated in the first groove 2106 through the second avoiding hole 234, and the circulation pump 245 is electrically connected to the first circuit board 262. When the circulation pump 245 operates, the heat transfer liquid in the flow channel can be driven to flow in the flow channel, the flow is quickly transferred to the whole vapor chamber 24 along with the heat transfer liquid in the flow channel, the conduction capacity of the vapor chamber 24 of the heat dissipation shell 20 in the thickness direction and the plane direction is quickly improved, the conduction impedance is reduced, and the heat dissipation effect is improved.

As shown in fig. 5 to 8, when the heat dissipation case 20 is assembled, the first magnetic attraction member 27 is mounted to the positioning groove 2104 of the protection case 21, the first wireless charging coil 26 is placed on the supporting portion 2103, the first wireless charging coil 26 is located in the inner cavity of the first magnetic attraction member 27, the first circuit board 262 is positioned in the first groove 2106 of the protection case 21, the flexible circuit board 264 is accommodated in the second groove 2107, the phase change heat storage film 23 is positioned in the accommodating groove 2102 of the protection case 21, the supporting portion 2103 is accommodated in the first avoiding hole 232 with the first circuit board 262 facing the second avoiding hole 234, the first coating film 242 of the soaking plate 24 is adhered to the surface of the phase change heat storage film 23, the circulating pump 245 of the soaking plate 24 is electrically connected to the first circuit board 262, the soaking plate 24 is accommodated in the accommodating groove, and the heat conduction adhesive film 25 is accommodated in the first accommodating space 2101, and the heat conduction adhesive film 25 is adhered to the second coating film 244 of the soaking plate 24.

As shown in fig. 7-9, when the heat dissipation housing 20 is used, the heat dissipation housing 20 is sleeved on the back of the electronic device 300, the electronic device 300 comprises a housing, a main board 320, a battery 330, a display screen and a wireless charging coil 350, the display screen is arranged on the front surface of the housing and is electrically connected to the main board 320, the battery 330 and the wireless charging coil 350 are accommodated in the housing, the wireless charging coil 350 is close to the back of the housing, the main board 320 is electrically connected to the battery 330 and the wireless charging coil 350, the battery 330 is used for supplying power to the main board 320, the display screen and the wireless charging coil 350, and a heat generating source 322 is arranged on the main board 320. When the heat dissipation shell 20 is sleeved on the back of the electronic device 300, the first wireless charging coil 26 is opposite to the wireless charging coil 350, heat generated when the heating source 322 of the electronic device 300 operates is conducted to the soaking plate 24 through the heat conduction adhesive film 25 in a contact mode, meanwhile, the electronic device 300 starts a wireless reverse charging function to enable the wireless charging coil 350 to generate a changed magnetic field, the first wireless charging coil 26 senses the change of the magnetic field to generate current to supply power to the circulating pump of the soaking plate 24, the circulating pump operates to drive the heat conduction liquid in the soaking plate 24 to flow in a runner, so that heat is conducted from a hot zone to a cold zone rapidly, the heat is conducted to the whole soaking plate 24 rapidly and evenly, the heat on the soaking plate 24 is conducted to the phase-change heat storage film 23 efficiently, the phase-change heat storage film 23 can absorb a large amount of heat, the heat storage capacity of the phase-change heat storage film 23 is improved, the heating rate of the heat dissipation shell 20 is reduced, the time of the electronic device 300 in a low-temperature working environment is prolonged, and the heat inspection of a user using the electronic device is improved. In the invention, the heat dissipation shell 20 is matched with the first wireless charging coil 26 in the heat dissipation shell 20 through the wireless charging coil 350 of the electronic device 300 to generate current to supply power to the heat dissipation plate 24, namely the electronic device is used as a power source to supply power to the heat dissipation shell 20 in a wireless charging mode, so that the problem that the heat dissipation shell 20 needs an external power source when in operation is solved, the effect of using the outdoor portable heat dissipation shell 20 by a user is realized, and the use is convenient.

As shown in fig. 10-15, the present invention further provides a heat dissipation back clip 40, where the heat dissipation back clip 40 can be connected to the heat dissipation housing 20 of any of the above embodiments to commonly dissipate heat of an electronic device, or the heat dissipation back clip 40 is directly connected to the back of the electronic device to dissipate heat of the electronic device, the heat dissipation back clip 40 includes a connection base 41, a semiconductor cooling plate 42, a second wireless charging coil 43 and a second circuit board 44, the semiconductor cooling plate 42 is disposed on the connection base 41, the second wireless charging coil 43 is disposed on one side of the connection base 41, the second circuit board 44 is disposed on the other side of the connection base 41, the second circuit board 44 is electrically connected to the second wireless charging coil 43, and the second wireless charging coil 43 can sense a change of a magnetic field generated by the wireless charging coil of the electronic device to generate a second current, and the second current is used to power the semiconductor cooling plate 42. When the heat sink back clip 40 is connected to the back of the electronic device, the second wireless charging coil 43 of the heat sink back clip 40 is opposite to the wireless charging coil of the electronic device, that is, the orthographic projection of the second wireless charging coil 43 on the surface of the wireless charging coil of the electronic device along the axial direction thereof is located within the range of the surface. When the heat dissipation back clip 40 is needed to dissipate heat, the main board of the electronic device controls the battery to supply power to the wireless charging coil so that the wireless charging coil generates a changing magnetic field, and the second wireless charging coil 43 senses the change of the magnetic field to generate a second current for supplying power to the semiconductor refrigerating sheet 42 so that the semiconductor refrigerating sheet 42 operates and refrigerates, thereby dissipating heat to the electronic device.

Compared with the prior art that the semiconductor refrigerating sheet of the heat dissipation back clip needs to be powered by an external power supply, the heat dissipation back clip is inconvenient for a user to use the heat dissipation back clip for radiating the electronic equipment outdoors, and the heat dissipation back clip 40 is matched with the second wireless charging coil 43 in the heat dissipation back clip 40 through the wireless charging coil carried by the electronic equipment 300 to generate power for the semiconductor refrigerating sheet 42, so that the problem that the heat dissipation back clip 40 needs to be powered by the external power supply when in operation is solved, the outdoor portable use effect is realized, and the heat dissipation back clip 40 can be conveniently carried outdoors by the user for radiating the heat of the electronic equipment.

As shown in fig. 16 to 17, a first mounting groove 410 is provided on one side of the connection base 41, the second wireless charging coil 43 is mounted in the first mounting groove 410, a second mounting groove 411 is provided on the opposite side of the connection base 41, and the semiconductor cooling fin 42 is mounted in the second mounting groove 411. Specifically, the connection base 41 has a disc shape, and the second mounting slot 411 is located in a middle portion of a surface of the connection base 41 facing the second circuit board 44, and in this embodiment, the second mounting slot 411 is a rectangular slot. In other embodiments, the second mounting slot 411 may also be, but is not limited to, a circular slot, a polygonal slot, an elliptical slot, etc. The surface of the connecting seat 41 facing the second circuit board 44 is convexly provided with a plurality of first positioning pieces 412 at the edge of the second mounting slot 411, the semiconductor refrigeration piece 42 is accommodated in the second mounting slot 411, and the plurality of first positioning pieces 412 are arranged around the outer peripheral surface of the semiconductor refrigeration piece 42. The surface of the connecting seat 41 facing the second circuit board 44 is provided with a plurality of positioning posts 413 around the second mounting slot 411, the positioning posts 413 are respectively close to the outer periphery of the connecting seat 41, each positioning post 413 is provided with a positioning hole 414 along the axial direction of the positioning post, in the embodiment, the surface of the connecting seat 41 facing the second circuit board 44 is provided with four positioning posts 413 around the second mounting slot 411, and the four positioning posts 413 are respectively close to the outer periphery of the connecting seat 41. The surface of the connecting seat 41 facing the second circuit board 44 is provided with a positioning flange 415, the positioning flange 415 is close to the periphery of the connecting seat 41 and surrounds the periphery of the connecting seat 41, the positioning flange 415 is provided with a plurality of clamping grooves 416, the clamping grooves 416 are arranged at intervals along the periphery of the positioning flange 415, in the embodiment, the positioning flange 415 is provided with eight clamping grooves 416, and the eight clamping grooves 416 are uniformly arranged at intervals along the periphery of the positioning flange 415.

Specifically, the first mounting groove 410 is located in the middle of the surface of the connecting seat 41 facing away from the second circuit board 44, the first mounting groove 410 is communicated with the second mounting groove 411, the first mounting groove 410 is a circular groove, and the second wireless charging coil 43 is accommodated in the first mounting groove 410. The connection base 41 is provided with a heat conductive connection plate 417 between the first mounting groove 410 and the second mounting groove 411, that is, the heat conductive connection plate 417 is located between the first mounting groove 410 and the second mounting groove 411. The heat dissipation back clip 40 further includes a second magnetic attraction piece 45, where the second magnetic attraction piece 45 is disposed on one side of the connection seat 41 near the second wireless charging coil 43, and the second magnetic attraction piece 45 and the second wireless charging coil 43 are spaced from each other. Specifically, the surface of the connection seat 41 facing away from the second circuit board 44 is provided with a fixing groove 418 around the outer periphery of the first mounting groove 410, the second magnetic attraction piece 45 is positioned in the fixing groove 418, and the connection seat 41 forms a spacer ring between the first mounting groove 410 and the fixing groove 418. The connecting seat 41 is provided with a plurality of connecting holes 4182 on the bottom surface of the fixing groove 418, the plurality of connecting holes 4182 are arranged around the circumference of the fixing groove 418, in this embodiment, the bottom surface of the fixing groove 418 is provided with four connecting holes 4182, and the four connecting holes 4182 are respectively opposite to the positioning holes 414 of the plurality of positioning posts 413. In this embodiment, the second magnetic attraction member 45 is an annular magnetic sheet, the fixing groove 418 is an annular groove, the annular magnetic sheet can be positioned in the annular groove, and the isolation ring can isolate the second magnetic attraction member 45 from the second wireless charging coil 43.

In other embodiments, the first mounting slot 410 may be, but not limited to, a rectangular slot, a polygonal slot, an elliptical slot, etc., the second wireless charging coil 43 may be, but not limited to, a rectangular wireless charging coil, a polygonal wireless charging coil, or an elliptical wireless charging coil, the fixing slot 418 may be, but not limited to, a rectangular slot, a polygonal slot, an elliptical slot, etc., and the second magnetic attraction member 45 may be, but not limited to, a rectangular magnetic ring, a polygonal magnetic ring, an elliptical magnetic ring, etc.

Optionally, the heat dissipation back clip 40 further includes a heat conducting pad 46, the heat conducting pad 46 is disposed on a side of the connection seat 41 facing away from the semiconductor refrigeration sheet 42, and the heat conducting pad 46 contacts the semiconductor refrigeration sheet 42. Specifically, a clamping groove 419 is formed on a surface of the connection base 41 facing away from the second circuit board 44, the clamping groove 419 communicates with the fixing groove 418 and the first mounting groove 410, and the thermal pad 46 is positioned in the clamping groove 419. In this embodiment, the clamping groove 419 is a circular groove, the heat conducting pad 46 is a circular heat conducting silica gel pad, the heat conducting silica gel pad is positioned in the clamping groove 419, the axis of the fixing groove 418 and the axis of the first mounting groove 410 are collinear, the diameter of the clamping groove 419 is larger than the diameter of the fixing groove 418, and the diameter of the fixing groove 418 is larger than the diameter of the first mounting groove 410.

As shown in fig. 16 and 17, the middle portion of the second circuit board 44 is provided with a through groove 442, the semiconductor refrigeration piece 42 is accommodated in the through groove 442, in this embodiment, the rectangular groove of the through groove 442 has an opening area larger than that of the second mounting groove 411, when the second circuit board 44 is placed on the surface of the connecting seat 41 provided with the second mounting groove 411, the four first positioning pieces 412 are respectively accommodated in the through groove 442, and the first positioning pieces 412 are attached to the inner peripheral surface of the through groove 442. The second circuit board 44 is provided with a plurality of mounting holes 443, the plurality of mounting holes 443 are located around the through slot 442, and the plurality of mounting holes 443 are opposite to the positioning holes 414 of the plurality of positioning posts 413 respectively. Specifically, the second circuit board 44 is a circular circuit board, and the diameter of the second circuit board 44 is smaller than or equal to the inner diameter of the positioning flange 415, so that the second circuit board 44 can be accommodated in the inner cavity of the positioning flange 415. The second circuit board 44 is provided with a plurality of electronic devices.

Optionally, the heat dissipation back clip 40 further includes a heat sink 47, a fan assembly 48 and a cover assembly 49, wherein the heat sink 47 can be connected to the connection base 41, so that the heat sink 47 contacts with the semiconductor cooling fin 42, the semiconductor cooling fin 42 conducts heat to the heat sink 47, cold air generated by the operation of the fan 482 exchanges heat with the heat sink 47 and then is discharged out of the heat dissipation back clip 40, and cold energy generated by the semiconductor cooling fin 42 is conducted to the heat dissipation shell 20 or the back of the electronic device. Specifically, the heat sink 47 includes a heat-conducting substrate 470, a plurality of heat dissipation fins 472 and two heat-conducting wind shields 473, wherein the heat dissipation fins 472 are respectively disposed at two opposite ends of one surface of the heat-conducting substrate 470, and the two heat-conducting wind shields 473 are respectively disposed at two opposite sides of the heat-conducting substrate 470. The radiator 47 is provided with a second accommodating space 474 at one side facing away from the semiconductor refrigeration sheet 42, the fan assembly 48 is accommodated in the second accommodating space 474, the two heat-conducting wind shields 473 and the heat dissipation fins 472 enclose the second accommodating space 474, a ventilation groove 4720 is arranged between each two adjacent heat dissipation fins 472, the ventilation groove 4720 is communicated with the second accommodating space 474, and the fan assembly 48 is accommodated in the second accommodating space 474 to reduce the superposition thickness of the fan assembly 48 and the radiator 47. In this embodiment, the heat conducting substrate 470 is a rectangular plate, wherein a part of the heat dissipating fins 472 are disposed at one end of one surface of the heat conducting substrate 470 at intervals, another part of the heat dissipating fins 472 are disposed at the opposite end of one surface of the heat conducting substrate 470 at intervals, two heat conducting wind shields 473 are respectively disposed at two opposite side edges of the heat conducting substrate 470, each heat dissipating fin 472 is parallel to the length direction of the heat conducting substrate 470, and the length direction of the ventilation slot 4720 between each two adjacent heat dissipating fins 472 is parallel to the length direction of the heat conducting substrate 470. The surface of the heat conducting substrate 470 facing away from the heat dissipating fins 472 is provided with a plurality of first fixing holes 4702, the plurality of first fixing holes 4702 are respectively opposite to the plurality of mounting holes 443 on the second circuit board 44, in this embodiment, the surface of the heat conducting substrate 470 facing away from the heat dissipating fins 472 is provided with four first fixing holes 4702, and the four first fixing holes 4702 are respectively located at four corners of the heat conducting substrate 470. One of the heat-conductive air shields 473 of the heat sink 47 is provided with a threading groove 4732 that communicates with the second accommodating space 474. Alternatively, the opposite ends of the plurality of heat dissipation fins 472 at the same end of the heat conduction substrate 470 are respectively formed in arc shape.

It is understood that the heat sink 47 may be made of, but not limited to, aluminum, copper, high heat conductive polymer, etc., and the heat sink 47 may be made of aluminum extrusion, die casting, cutting, shaping, etc. type of heat sink with the heat conductive substrate 470 thinned, or may be made of a more lightweight sheet metal heat sink, or may be made of high heat conductive polymer. In other embodiments, the heat-conducting substrate 470 may be, but is not limited to, a circular plate, an oval plate, a polygonal plate, etc., and a plurality of heat dissipation fins are arranged around the heat-conducting substrate 470 at intervals, and the heat dissipation fins enclose a receiving space.

The fan assembly 48 includes a fan 482 and a support 485, the fan 482 is connected to the support 485, and the support 485 and the fan 482 are accommodated in the second accommodating space 474. The support 485 includes a positioning portion 4850 and a support tube 4855 connected to the positioning portion 4850, wherein an end of the support tube 4855 remote from the positioning portion 4850 is connected to the fan 482. Since both the support 485 and the fan 482 are accommodated in the second accommodation space 474, the support 485 and the fan 482 do not increase the thickness of the heat sink 47. Specifically, the positioning portion 4850 includes a second positioning plate 4851 and a connecting plate 4852, the connecting plate 4852 is connected to an edge of the second positioning plate 4851, the connecting plate 4852 is parallel to the second positioning plate 4851, the supporting tube 4855 is connected to a middle portion of the second positioning plate 4851, in this embodiment, the second positioning plate 4851 is a circular plate, an outer peripheral surface of the circular plate is connected with a plurality of connecting plates 4852, the plurality of connecting plates 4852 are uniformly arranged at intervals around a circumference of the circular plate, the supporting tube 4855 is a supporting tube, one end of the supporting tube supports the fan 482, an opposite end of the supporting tube is connected to the middle portion of the second positioning plate 4851, an axis of the supporting tube is collinear with an axis of the second positioning plate 4851, and one end of each connecting plate 4852, which is far away from the second positioning plate 4851, is provided with a second fixing hole 4857.

The cover assembly 49 comprises a cover shell 490 and a protection frame 496, the cover shell 490 is connected to one side of the connection seat 41, which is far away from the heat conducting pad 46, the radiator 47 is accommodated in an inner cavity of the cover shell 490, the cover shell 490 comprises a peripheral wall 491 and a cover plate 492, the cover plate 492 is connected to one end of the peripheral wall 491, which is far away from the connection seat 41, the peripheral wall 491 and the cover plate 492 enclose an inner cavity of the cover shell 490, an air inlet 4922 is arranged on the cover plate 492, the air inlet 4922 is communicated with the inner cavity of the cover shell 490, in this embodiment, the air inlet 4922 is a circular port positioned in the middle of the cover plate 492, an air outlet 4912 is arranged on the peripheral wall 491, and the air outlet 4912 is communicated with the inner cavity of the cover shell 490. In this embodiment, the outer peripheral wall 491 is a cylinder, and the cover plate 492 is a circular plate, the outer periphery of which is connected to the edge of one end of the cylinder. The peripheral wall 491 is provided with two air outlets 4912, the two air outlets 4912 are located at two opposite ends of the peripheral wall 491 in the radial direction, when the cover casing 490 is covered on the radiator 47, the two air outlets 4912 are respectively opposite to the ventilation slots 4720 of the radiating fins 472, and the cover casing 490 covers the fan 482 and the radiator 47 to play a role of protection. Because the air inlet 4922 is located in the middle of the cover plate 492, and the air outlet 4912 is located on the peripheral wall 491, the air inlet 4922 and the air outlet 4912 are respectively located in different directions of the cover shell 490, and the interval between the air inlet 4922 and the air outlet 4912 is larger, so that hot air discharged from the air outlet 4912 can be prevented from flowing back to the air inlet 4922, and the heat dissipation effect is improved.

In other embodiments, the peripheral wall 491 is provided with more than three air outlets 4912, and the more than three air outlets 4912 are uniformly arranged at intervals around the circumference of the peripheral wall 491.

The inner surface of the cover plate 492 is provided with a circle of connecting ring groove 4924 around the air inlet 4922, the outer periphery of the protection frame 496 is clamped with the connecting ring groove 4924, the inner bottom surface of the cover plate 492 in the connecting ring groove 4924 is provided with a clamping column 4921, and the clamping column 4921 can be clamped with the protection frame 496. In the present embodiment, the cover plate 492 is provided with a plurality of clamping posts 4921 on the inner bottom surface of the connecting ring slot 4924, and the plurality of clamping posts 4921 are arranged one circle around the circumference of the connecting ring slot 4924. The inner surface of the cover 492 is provided with a connecting arc piece 4925 around the air inlet 4922, the connecting arc piece 4925 is used for connecting to the support frame 485, in this embodiment, the inner surface of the cover 492 is provided with two connecting arc pieces 4925 around the air inlet 4922, the two connecting arc pieces 4925 are positioned at two opposite ends of the air inlet 4922 in the radial direction, and each connecting arc piece 4925 is provided with a locking hole 4926. The side of the inner peripheral surface of the outer peripheral wall 491 away from the cover plate 492 is provided with a plurality of clamping blocks 4914, the plurality of clamping blocks 4914 are arranged at intervals around the circumference of the outer peripheral wall 491, in the embodiment, the side of the inner peripheral surface of the outer peripheral wall 491 away from the cover plate 492 is provided with eight clamping blocks 4914, and the eight clamping blocks 4914 are uniformly arranged at intervals around the circumference of the outer peripheral wall 491.

The protection frame 496 is opposite to the fan 482 to protect the fan 482, specifically, the protection frame 496 includes a positioning ring 4961 and a baffle 4963 connected in the positioning ring 4961, where the positioning ring 4961 can be clamped in the connection ring slot 4924 of the cover 492. The baffle 4963 is provided with a plurality of ventilation holes 4965, and the plurality of ventilation holes 4965 are arranged at intervals around the circumference of the positioning ring 4961. In this embodiment, four vent holes 4965 are provided on the baffle 4963, and the four vent holes 4965 are uniformly spaced around the circumference of the positioning ring 4961. The positioning ring 4961 is provided with a clamping hole 4966, and the clamping column 4921 of the cover 490 can be clamped in the clamping hole 4966. In the present embodiment, the positioning ring 4961 is provided with a plurality of clamping holes 4966, the plurality of clamping holes 4966 are arranged around the circumference of the positioning ring 4961, and the plurality of clamping columns 4921 can be respectively clamped in the plurality of clamping holes 4966.

When the heat dissipation back clip 40 is assembled, the semiconductor refrigeration piece 42 is accommodated in the second mounting slot 411 of the connecting seat 41, so that the semiconductor refrigeration piece 42 contacts the heat conduction connecting plate 417; placing the second circuit board 44 on the connecting seat 41, so that the first positioning piece 412 is inserted into the through groove 442 and the first positioning piece 412 is propped against the inner peripheral surface of the through groove 442, and the four mounting holes 443 of the second circuit board 44 are respectively opposite to the positioning holes 414 of the four positioning posts 413 of the connecting seat 41; the heat sink 47 is placed on one side of the second circuit board 44 away from the connecting seat 41, the semiconductor refrigerating sheet 42 is attached to the surface of the heat conducting base 470 away from the heat dissipating fins 472, so that the four first fixing holes 4702 of the heat sink 47 are opposite to the four mounting holes 443 of the second circuit board 44 respectively, four locking members such as screws respectively pass through the four connecting holes 4182 of the connecting seat 41 and the four mounting holes 443 of the second circuit board 44 and are respectively locked in the four first fixing holes 4702 of the heat sink 47, so that the semiconductor refrigerating sheet 42, the second circuit board 44 and the heat sink 47 are fixedly connected to the connecting seat, the cold side of the semiconductor refrigerating sheet 42 contacts the heat conducting connecting plate 417, the hot side of the semiconductor refrigerating sheet 42 contacts the heat sink 47, the second magnetic sucking member 45 is positioned in the fixing grooves 418 of the connecting seat 41, the second wireless charging coil 43 is positioned in the first mounting groove 410 of the connecting seat 41, the heat conducting pad 46 is positioned in the clamping groove of the connecting seat 41, the positioning ring 4961 of the protecting frame 496 is clamped in the clamping groove 419 of the connecting seat 41 respectively, the connecting seat 4924 of the protecting frame 490 is clamped in the connecting frame 4924, the two supporting frames 4925 are respectively connected to the supporting frames 4925 and the supporting frames 4925 are respectively, the two arc frames 4925 are placed between the connecting frames 4925 and the connecting frames 4925 are connected to the connecting frames 482, the locking member such as a screw penetrates through the second fixing hole 4857 to connect the fan assembly 48 to the cover case 490, and covers the cover assembly 49 on the radiator 47, so that the positioning flange 415 abuts against the inner peripheral surface of the peripheral wall 491 of the cover case 490, and the eight clamping blocks 4914 are respectively clamped to the eight clamping grooves 416 of the connecting seat 41, so that the fan assembly 48 and the cover assembly 49 are connected to the connecting seat 41, the fan assembly 48 is accommodated in the second accommodating space 474 of the radiator 47, and the air outlet 4912 is opposite to the ventilation groove 4720 of the radiator 47.

As shown in fig. 16-18, when the heat dissipation back clip 40 is used, the heat dissipation back clip 40 is connected to the back of the electronic device 300, the heat dissipation back clip 40 and the electronic device 300 can be connected through but not limited to magnetic connection, glue connection and the like, the second wireless charging coil 43 is opposite to the wireless charging coil 350, the electronic device 300 opens the wireless reverse charging function to enable the wireless charging coil 350 to generate a changed magnetic field, the second wireless charging coil 43 senses the change of the magnetic field to generate a second current, the second current supplies power to the semiconductor cooling fin 42, the fan 482 and the second circuit board 44, the heat dissipation back clip is supplied with power through the wireless charging coil, the second circuit board 44 controls the cooling capacity generated by the operation of the semiconductor cooling fin 42 to be conducted to the back of the electronic device 300 through the heat conduction pad 46, the heat generated by the operation of the semiconductor cooling fin 42 is conducted to the heat sink 47 through the heat conduction connection plate 417, meanwhile, the second circuit board 44 controls the operation of the fan 482 to suck external air from the ventilation slot 4720 of the heat sink 47, and the external air is discharged from the ventilation slot 4912 after heat exchange between the air and the external fin 472 of the heat sink 47.

The semiconductor refrigerating sheet 42 of the heat dissipation back clip 40 can cool the back of the electronic device 300 quickly, and simultaneously, the heat generated by the semiconductor refrigerating sheet 42 can be dissipated to the external environment quickly and efficiently through the cooperation of the radiator 47 and the fan 482, so that the heat dissipation efficiency is improved. Secondly, compared with the prior art that the heat dissipation back clip needs to be powered by an external power supply, the heat dissipation back clip is inconvenient for a user to use the heat dissipation back clip for radiating the electronic device outdoors, the heat dissipation back clip 40 provided by the invention is matched with the second wireless charging coil 43 in the heat dissipation back clip 40 through the wireless charging coil 350 carried by the electronic device 300 to generate power for the semiconductor refrigerating sheet 42, the fan 482 and the second circuit board 44, so that the problem that the heat dissipation back clip 40 needs to be powered by the external power supply when in operation is solved, the effect of using the outdoor portable heat dissipation back clip 40 by the user is realized, and the use is convenient.

As shown in fig. 5 and fig. 16-24, the present invention further provides a heat dissipation system 100, where the heat dissipation system 100 is used for dissipating heat from an electronic device 300, the heat dissipation system 100 includes the heat dissipation housing 20 according to any one of the embodiments and the heat dissipation back clip 40 according to any one of the embodiments, the heat dissipation housing 20 is sleeved on the back of the electronic device 300, and the heat dissipation back clip 40 is connected to the heat dissipation housing 20. When the heat dissipation system 100 is used to dissipate heat from the electronic device 300, the heat dissipation housing 20 is sleeved on the back of the electronic device 300, heat generated by the operation of the electronic device 300 is conducted to the phase-change heat storage film 23 through the heat conduction adhesive film 25 and the soaking plate 24, the phase-change heat storage film 23 can absorb a large amount of heat, and the heat on the phase-change heat storage film 23 is conducted to the protection housing 21, so that the heat dissipation housing 20 plays a role of uniform temperature and heat storage, meanwhile, cold generated by the operation of the semiconductor refrigerating sheets 42 of the heat dissipation back clip 40 is conducted to the protection housing 21 through the heat conduction pad 46, and then the electronic device 300 is cooled, the heat generated by the operation of the semiconductor refrigerating sheets 42 is conducted to the heat radiator 47 through the semiconductor refrigerating sheets 42, and the heat on the heat radiator 47 is discharged to the external environment through the fan 482, so that the electronic device 300 is rapidly and efficiently dissipated.

The heat dissipation shell 20 and the heat dissipation back clamp 40 of the heat dissipation system 100 are all powered by the wireless anti-charging function of the electronic device 300, specifically, when the electronic device 300 starts the wireless anti-charging function, the wireless charging coil 350 of the electronic device 300 generates a changed magnetic field, the first wireless charging coil 26 senses the change of the magnetic field to generate a first current for powering the vapor chamber 24, and the second wireless charging coil 43 senses the change of the magnetic field to generate a second current for powering the semiconductor refrigerating plate 42, so that the problem that an external power supply is needed when the heat dissipation system 100 is used is solved, a user can conveniently carry the heat dissipation system 100 outdoors to dissipate heat of the electronic device 300, the outdoor portable use effect is realized, the temperature equalizing and heat dissipation efficiency of the electronic device 300 in the use process is further improved, and the heat experience of the user is improved.

As shown in fig. 24, the area of the wireless charging coil 350 of the electronic device 300 is larger than the area of the first wireless charging coil 26 and the area of the second wireless charging coil 43, and the wireless charging coil 26 can completely cover the first wireless charging coil 26 and the second wireless charging coil 43, specifically, the orthographic projection of the first wireless charging coil 26 on one surface of the wireless charging coil 350 of the electronic device 300 along the axial direction thereof forms a first projection area, and the orthographic projection of the second wireless charging coil 43 on the one surface of the wireless charging coil 26 of the electronic device 300 along the axial direction thereof forms a second projection area, and the first projection area and the second projection area are staggered with each other. That is, a first projection area formed by orthographic projection of the first wireless charging coil 26 on the surface of the wireless charging coil 350 along the axial direction thereof, and a second projection area formed by orthographic projection of the second wireless charging coil 43 on the surface of the wireless charging coil 350 along the axial direction thereof are located on the same surface of the wireless charging coil 350, and the first projection area and the second projection area are staggered with each other so as to realize simultaneous power supply of the first wireless charging coil 26 and the second wireless charging coil 43 by the wireless charging coil 350 of the electronic device 300. Therefore, the heat dissipation housing 20 and the heat dissipation back clip 40 of the heat dissipation system 100 are both powered by the wireless charging coil 350 of the electronic device 300 in a wireless reverse charging manner, and an external power supply is not needed, so that the heat dissipation system is convenient for users to use outdoors.

Optionally, the first magnetic attraction member 27 of the heat dissipation shell 20 and the second magnetic attraction member 45 of the heat dissipation back clip 40 attract each other, so that the heat dissipation back clip 40 is positioned on the back of the heat dissipation shell 20. The heat dissipation back clip 40 is detachably connected to the heat dissipation casing 20, and according to the heat productivity of the electronic device 300, a user can only choose the heat dissipation casing 20 to dissipate heat of the electronic device 300, only choose the heat dissipation back clip 40 to dissipate heat of the electronic device 300, or choose the combination of the heat dissipation casing 20 and the heat dissipation back clip 40 to dissipate heat of the electronic device 300, so that the heat dissipation back clip is convenient to use and simple to operate.

As shown in fig. 25, the heat dissipation system according to another embodiment of the present application has a similar structure to that of any one of the above embodiments, except that the heat dissipation back clip 40a of the heat dissipation system according to another embodiment omits the second wireless charging coil 43 based on the heat dissipation back clip 40 of the heat dissipation system 100, and a feed point is provided between the heat dissipation housing 20a and the heat dissipation back clip 40a, so that the first circuit board 262 of the heat dissipation housing 20a is electrically connected with the second circuit board 44 of the heat dissipation back clip 40 a. When the heat dissipation system is used for dissipating heat of the electronic device, the wireless charging coil 350 generates a changing magnetic field, the first wireless charging coil 26 senses the change of the magnetic field to generate power for the vapor chamber 24 so as to drive the heat conduction liquid in the vapor chamber 24 to flow in the flow channel, meanwhile, the current generated by the first wireless charging coil 26 supplies power to the second circuit board 44, the semiconductor refrigerating sheet 42 and the fan 482 through the feed points, and the second circuit board 44 controls the semiconductor refrigerating sheet 42 and the fan 482 to operate.

The heat dissipation system in this embodiment omits the second wireless charging coil, reduces the number of wireless coils, saves manufacturing cost, and avoids the occupation space of the second wireless charging coil, which is not only beneficial to the layout of other electronic devices, but also beneficial to the miniaturization of the heat dissipation system. The heat dissipation path and the heat dissipation effect of the heat dissipation system in this embodiment are the same as those of the heat dissipation system in any one of the above embodiments, and will not be described here again.

As shown in fig. 26, the heat dissipation system according to another embodiment of the present application has a similar structure to that of any of the above embodiments, except that the heat dissipation case 20b of the heat dissipation system according to another embodiment omits the first wireless charging coil 26 on the basis of the heat dissipation case 20 of the heat dissipation system 100, and a feed point is provided between the heat dissipation case 20b and the heat dissipation back clip 40b, so that the first circuit board 262 of the heat dissipation case 20b is electrically connected with the second circuit board 44 of the heat dissipation back clip 40 b. When the heat dissipation system is used for dissipating heat of the electronic equipment, the wireless charging coil 350 generates a changing magnetic field, the second wireless charging coil 43 senses that the changing magnetic field generates power to the second circuit board 44, the semiconductor refrigerating sheet 42 and the fan 482, the second circuit board 44 controls the semiconductor refrigerating sheet 42 and the fan 482 to operate so as to drive the heat conduction liquid in the vapor chamber 24 to flow in the flow channel, meanwhile, the current generated by the second wireless charging coil 43 supplies power to the first circuit board and the vapor chamber 24 through the feed points, and the first circuit board controls the vapor chamber 24 to operate.

The heat dissipation system in this embodiment omits the first wireless charging coil, reduces the number of wireless coils, saves manufacturing cost, and avoids the occupation space of the first wireless charging coil, which is not only beneficial to the layout of other electronic devices, but also beneficial to the miniaturization of the heat dissipation system. The heat dissipation path and the heat dissipation effect of the heat dissipation system in this embodiment are the same as those of the heat dissipation system in any one of the above embodiments, and will not be described here again.

The foregoing is a description of embodiments of the present invention, and it should be noted that, for those skilled in the art, modifications and variations can be made without departing from the principles of the embodiments of the present invention, and such modifications and variations are also considered to be within the scope of the present invention.

Claims

1. A heat dissipation housing for dissipating heat from an electronic device, the heat dissipation housing comprising:

The protection shell is sleeved on the back of the electronic equipment;

A phase-change heat storage film provided to the protective case, and

And the soaking plate is laminated on the phase change heat storage film, and heat generated by the operation of the electronic equipment is conducted to the phase change heat storage film after being soaked by the soaking plate.

2. The heat dissipating housing of claim 1, wherein the electronic device comprises a wireless charging coil, the heat dissipating housing further comprising a first wireless charging coil disposed in the protective housing, the wireless charging coil of the electronic device generating a varying magnetic field, the first wireless charging coil sensing the variation in the magnetic field to generate a first current, the first current for powering the vapor chamber.

3. The heat dissipation shell of claim 1, further comprising a first magnetic attraction member, wherein the protective shell is provided with a positioning groove, the first magnetic attraction member is positioned in the positioning groove, the phase change heat storage film is provided with a first avoidance hole, and the first magnetic attraction member is accommodated in the first avoidance hole.

4. The heat dissipation casing according to claim 3, wherein an accommodating groove is formed in an inner surface of the heat dissipation casing, the phase-change heat storage film and the soaking plate are accommodated in the accommodating groove, a supporting portion is arranged on a bottom surface of the accommodating groove of the heat dissipation casing, the positioning groove is formed in the supporting portion, and the supporting portion is accommodated in the first avoiding hole.

5. The heat dissipation housing of claim 2, further comprising a first circuit board and a flexible circuit board, wherein the first circuit board is connected to the first wireless charging coil through the flexible circuit board, a clearance groove is formed in an inner surface of the heat dissipation housing, and the first circuit board and the flexible circuit board are accommodated in the clearance groove.

6. A heat sink clip, wherein the heat sink clip is connected to a heat sink housing as claimed in any one of claims 1 to 5, or the heat sink clip is connected to a back of an electronic device, the heat sink clip comprising:

A connecting seat;

The semiconductor refrigerating piece is arranged on the connecting seat;

a second wireless charging coil arranged at one side of the connecting seat, and

The second circuit board is arranged on the other side of the connecting seat, the second circuit board is electrically connected to the second wireless charging coil, the second wireless charging coil can sense the change of a magnetic field generated by the wireless charging coil of the electronic equipment so as to generate second current, and the second current is used for supplying power to the semiconductor refrigerating sheet.

7. The heat sink clip of claim 6 wherein one side of the connection base has a first mounting slot, the second wireless charging coil is mounted in the first mounting slot, the opposite side of the connection base has a second mounting slot, and the semiconductor cooling fin is mounted in the second mounting slot.

8. The heat sink clip of claim 6 further comprising a second magnetic attraction element disposed on a side of the connection base proximate the second wireless charging coil, the second magnetic attraction element being spaced from the second wireless charging coil.

9. The heat dissipation back clip of claim 6, further comprising a heat sink and a fan, wherein the second circuit board is located between the heat sink and the connection base, a through groove is formed in the second circuit board, the semiconductor refrigerating sheet is accommodated in the through groove, the heat sink is in contact with the semiconductor refrigerating sheet, the semiconductor refrigerating sheet conducts heat to the heat sink, cold air generated by operation of the fan exchanges heat with the heat sink and then is discharged out of the heat dissipation back clip, and cold energy generated by the semiconductor refrigerating sheet is conducted to the heat dissipation shell or the back of the electronic device.

10. The heat sink clip of claim 6 further comprising a thermally conductive connecting plate and a thermally conductive pad, the thermally conductive connecting plate contacting a surface of the semiconductor cooling fin facing away from the heat sink, the thermally conductive pad being disposed on a side of the connecting base facing away from the semiconductor cooling fin, the semiconductor cooling fin contacting the thermally conductive connecting plate.

11. A heat dissipation system for dissipating heat from an electronic device, the heat dissipation system comprising a heat dissipation housing according to any one of claims 1-5 and a heat dissipation back clip according to any one of claims 6-10, the heat dissipation housing being sleeved on the back of the electronic device, the heat dissipation back clip being connected to a side of the heat dissipation housing facing away from the electronic device.

12. The heat dissipating system of claim 11, wherein the first magnetic attraction element of the heat dissipating housing and the second magnetic attraction element of the heat dissipating back clip attract each other to position the heat dissipating back clip to the heat dissipating housing.

13. The heat dissipating system of claim 12, wherein the first wireless charging coil forms a first projection area on one of the surfaces of the wireless charging coil of the electronic device along its axis and the second wireless charging coil forms a second projection area on the one of the surfaces of the wireless charging coil of the electronic device along its axis, the first projection area being spaced apart from the second projection area.