CN119905462A - A heat sink for semiconductor - Google Patents
A heat sink for semiconductor Download PDFInfo
- Publication number
- CN119905462A CN119905462A CN202510388110.8A CN202510388110A CN119905462A CN 119905462 A CN119905462 A CN 119905462A CN 202510388110 A CN202510388110 A CN 202510388110A CN 119905462 A CN119905462 A CN 119905462A
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- CN
- China
- Prior art keywords
- support
- radiating
- shell
- groove
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
- H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of semiconductor radiators and discloses a radiator for a semiconductor, which comprises a support, wherein a plurality of radiating fins are arranged at the bottom of the support, radiating fans are arranged at the top of the support, connecting rods are rotatably arranged on one sides of the front and the back of the support, the front of each connecting rod is penetrated with a knob, one side of each connecting rod is provided with an auxiliary structure, each auxiliary structure comprises a shell, a ventilation groove is formed in the shell, and a wind collecting groove is formed in one side of the inner wall of the shell.
Description
Technical Field
The invention relates to the technical field of semiconductor radiators, in particular to a radiator for a semiconductor.
Background
The patent application with the publication number of CN203351580U comprises a radiating fin and is characterized in that the radiating fin is provided with a radiating plate up and down, the radiating fin and the inside of the radiating plate are of a hollow structure which is communicated, the radiating plate is provided with a circular tube which is communicated with the hollow structure, the circular tube is provided with a medium tube and an exhaust tube, the medium tube is used for injecting a refrigerating medium into the hollow structure, and the exhaust tube is used for exhausting gas in the hollow structure. The semiconductor radiator with the structure has the advantages of better radiating effect and convenient use.
In the prior art including above-mentioned patent, semiconductor radiator that is used often still needs to install the fan additional besides the fin body and assist the heat dissipation, and the fan is rotatory to outwards discharge the heat that the fin absorbed, but the suction of fan is limited eventually can't take more heat to the suction also can inhale objects such as dust flying bits in the fin, because the space is very easily led to the fact the dust to adhere to in the fin, will cause the radiating effect of fin after more dust piles up, even the manual dismantlement clearance of later stage also needs to consume longer time.
Disclosure of Invention
The invention aims to solve the problems that a single fan with higher temperature of radiating fins in a semiconductor radiator has low radiating efficiency and dust is easy to be attached in the radiating fins to influence radiating performance.
In order to solve the technical problems, the technical scheme of the invention is that the radiator for the semiconductor comprises a support, wherein the bottom of the support is provided with a plurality of radiating fins, the top of the support is provided with a radiating fan, one sides of the front and the back of the support are respectively provided with a connecting rod in a rotating way, the front of the connecting rods is penetrated with a knob, and one side of each connecting rod is provided with an auxiliary structure;
the auxiliary structure comprises a shell, a ventilation groove is formed in the shell, an air collecting groove is formed in one side of the inner wall of the shell, a plurality of air guide grooves are radially formed in the periphery of the air collecting groove, and an air inlet is fixedly communicated with one side of the ventilation groove.
Preferably, the top of shell slides and is equipped with the movable block, the top of movable block runs through there is the spacing screw, one side of movable block is fixed to be equipped with the activity cover, logical groove has been seted up to one side of activity cover bottom, logical groove and one of them ventilation groove looks adaptation.
Preferably, the bottom of the inner wall of the shell is fixedly communicated with a communicating pipe, dead angles inside the shell are fixedly provided with inclined blocks, and the front surface and the back surface of the inner wall of the shell are provided with L-shaped sliding grooves.
Preferably, the top of the inner wall of the shell is fixedly provided with a choke plate, the choke plate is telescopic, and fixing screws penetrate through the front side and the rear side of the top of the choke plate.
Preferably, the cleaning tube penetrates through the inside of the radiating fin, a stabilizing frame is fixedly arranged on one side of the support, the stabilizing frame is matched with the cleaning tube, and the outer diameter of the cleaning tube is the same as the inner diameter of the movable cover.
Preferably, the bottom of the cleaning pipe is provided with a plurality of rotary rings in a straight-line shape at equal intervals, air holes are formed in the rotary rings and fixedly communicated with the cleaning pipe, and cleaning heads are fixedly communicated with the outer parts of the rotary rings in a circumferential array shape.
Preferably, a plugging sheet is fixedly arranged on one side of the top of the support, a heat dissipation bottom plate is arranged at the bottom of the support, a plurality of air outlet pipes are arranged on the top array of the heat dissipation bottom plate, and a connecting pipe is fixedly communicated with one side of the heat dissipation bottom plate.
Compared with the prior art, the technical scheme of the invention has the following advantages:
(1) The support is provided with the shell capable of being switched in a double form, the shell can finish cleaning dust at the gap in the radiating fins in a closed state, the shell can borrow part of wind power generated by the radiating fan through the air blocking plate in an open state, the radiating fins are assisted by the air outlet of the radiating bottom plate to quickly dissipate heat, the secondary heat dissipation is assisted to accelerate the radiating speed, the shell is two-purpose, the working mode can be freely switched according to practical conditions, the inside of the shell is provided with the air collecting groove, the air collecting groove is used for leading the wind exhausted by the radiating fan into the ventilation groove better in the closed state of the shell, the shell can be connected with the cleaning pipe in the closed state of the shell, after the shell is connected together, the collected larger wind power can be sprayed out from the cleaning head through the cleaning pipe, the sprayed wind power can drive the rotating ring to rotate, so that the dust in the interval of the radiating fins can be cleaned without dead angle, the dust can be cleaned, and the dust can be prevented from accumulating more dust for a long time, and the whole radiating effect of the radiator is prevented;
(2) The bottom of support is equipped with the radiating bottom plate, can open the choke plate flexible under the circumstances that the shell is normally open to intercept partial wind-force, carry radiating fin's bottom and upwards discharge after referring to wind-force, compare in the fan and lean on the suction of self to absorb and radiating fin's initiative gives off, the water conservancy diversion of bottom can let radiating fan's efficiency higher, radiating fin's temperature decline is also faster, the radiating effect of radiator is improved to the secondary, one side of the connecting pipe of radiating bottom plate one side is equipped with the blocking piece, only can open the connecting pipe when the communicating pipe on the shell is docked with it, break away from the back from communicating pipe when the connecting pipe, communicating pipe will become the closed again.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a heat dissipating fin structure according to the present invention;
FIG. 3 is a schematic view showing the closing of the housing structure of the present invention;
FIG. 4 is a schematic view of a connecting rod according to the present invention;
FIG. 5 is a schematic view of an auxiliary structure of the present invention;
FIG. 6 shows the present invention the air inlet structure is schematically shown;
FIG. 7 is a schematic left-hand view of the housing structure of the present invention;
FIG. 8 is a schematic view of the bottom view of the housing structure of the present invention;
FIG. 9 is a schematic view of a cleaning tube according to the present invention;
FIG. 10 is a schematic view of a rotating ring structure according to the present invention;
FIG. 11 is an enlarged schematic view of the structure of the present invention A;
FIG. 12 is a schematic view of a heat dissipating bottom plate according to the present invention;
Fig. 13 is a schematic view of the internal structure of the housing of the present invention.
The heat dissipation fin, the knob, the auxiliary structure, the fixing screw, the 302, the choke plate, the 303, the shell, the 304, the movable cover, the 305, the movable block, the 306, the limit screw, the 307, the air guide groove, the 308, the air inlet, the 309, the inclined block, the 310, the communicating pipe, the 311, the air collecting groove, the 312, the chute, the 313, the ventilation groove, the 4, the heat dissipation fan, the 5, the cleaning pipe, the 6, the connecting rod, the 7, the blocking piece, the 8, the support, the 9, the stabilizing frame, the 10, the heat dissipation bottom plate, the 11, the air outlet pipe, the 12, the connecting pipe, the 13, the rotating ring, the 14 and the cleaning head are shown in the figure.
Detailed Description
So that the objects, technical solutions and advantages of the embodiments of the present disclosure are more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of the terms "comprising" or "includes" and the like in this disclosure is intended to cover an element or article listed after that term and equivalents thereof without precluding other elements or articles. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
As shown in fig. 1 to 13, the radiator for a semiconductor provided by the invention comprises a support 8, wherein a plurality of radiating fins 1 are arranged at the bottom of the support 8, a radiating fan 4 is arranged at the top of the support 8, connecting rods 6 are rotatably arranged at one side of the front and the back of the support 8, a knob 2 penetrates through the front of each connecting rod 6, and an auxiliary structure 3 is arranged at one side of each connecting rod 6;
The auxiliary structure 3 comprises a shell 303, a ventilation groove 313 is formed in the shell 303, a wind collecting groove 311 is formed in one side of the inner wall of the shell 303, a plurality of wind guiding grooves 307 are formed in the periphery of the wind collecting groove 311 in a radial mode, and an air inlet 308 is fixedly communicated with one side of the ventilation groove 313.
The top of the shell 303 is slidably provided with a moving block 305, a limit screw 306 penetrates through the top of the moving block 305, one side of the moving block 305 is fixedly provided with a movable cover 304, one side of the bottom of the movable cover 304 is provided with a through groove, and the through groove is matched with one of the ventilation grooves 313.
The bottom of the inner wall of the shell 303 is fixedly communicated with a communicating pipe 310, inclined blocks 309 are fixedly arranged at dead angles in the shell 303, L-shaped sliding grooves 312 are formed in the front face and the back face of the inner wall of the shell 303, and the inclined blocks 309 can be matched with the air guide grooves 307 to gather wind into the air collecting grooves 311.
The top of the inner wall of the shell 303 is fixedly provided with a choke plate 302, the choke plate 302 is telescopic, and fixing screws 301 penetrate through the front side and the rear side of the top of the choke plate 302.
The cleaning tube 5 penetrates through the heat radiating fin 1, a stabilizing frame 9 is fixedly arranged on one side of the support 8, the stabilizing frame 9 is matched with the cleaning tube 5, and the outer diameter of the cleaning tube 5 is the same as the inner diameter of the movable cover 304.
The bottom of the cleaning pipe 5 is provided with a plurality of rotary rings 13 which are arranged in a straight line at equal intervals, air holes are arranged in the rotary rings 13 and fixedly communicated with the cleaning pipe 5, and cleaning heads 14 are fixedly communicated with the outside of the rotary rings 13 in a circumferential array shape.
One side at the top of the support 8 is fixedly provided with a plugging sheet 7, the bottom of the support 8 is provided with a heat dissipation bottom plate 10, the top of the heat dissipation bottom plate 10 is provided with a plurality of air outlet pipes 11 in an array, and one side of the heat dissipation bottom plate 10 is fixedly communicated with a connecting pipe 12.
The working principle and the using flow of the invention are as follows: when a user normally uses the radiating fin 1 to radiate heat, if auxiliary heat radiation is required, the loosening knob 2 can be rotated firstly, the shell 303 is rotated by taking the rotating joint of the connecting rod 6 and the support 8 as the center of a circle after loosening, the shell 303 is rotated to be opened by 90 degrees, the tightening knob 2 is rotated after opening, the sliding groove 312 in the shell 303 moves along the connecting rod 6, the shell 303 is vertical after moving to the final position, the communicating pipe 310 at the bottom is butted with the connecting pipe 12, the blocking block at one side of the connecting pipe 12 is propped open, the communicating pipe 310 and the connecting pipe 12 are communicated with each other, then the fixing screw 301 is rotated and loosened, the choke plate 302 is pulled outwards after loosening, the fixing is screwed again after pulling out, then the radiating fan 4 can be started normally, the temperature in the radiating fin 1 is discharged outwards after the radiating fan 4 is started, the wind power generated by the heat dissipation fan 4 is intercepted by the wind blocking plate 302 to block a part of the wind power, the blocked wind power is introduced into the shell 303 and enters the air inlet 308, at the moment, because the movable cover 304 is closed, one of the ventilation grooves 313 is closed, the air current entering the air inlet 308 is discharged from the other ventilation groove 313, the discharged wind power enters the heat dissipation bottom plate 10 and finally is discharged outwards from the air outlet pipe 11, the discharged wind power can accelerate the discharge of the self heat of the heat dissipation fin 1, the heat dissipation treatment can be carried out with higher efficiency by matching with the heat dissipation fan 4, more dust remains in the gap of the heat dissipation fin 1 after long-term use, when the heat dissipation efficiency is influenced, the shell 303 can be rotated right above the support 8 and downwards covered, the communicating pipe 310 can be blocked by the blocking piece 7 when the cover is covered, at this time, the movable cover 304 at the other side of the housing 303 is just above the cleaning tube 5, and then the limit screw 306 is loosened, the moving block 305 is pushed downwards, so that the through groove at the back of the movable cover 304 is mutually communicated with the ventilation groove 313 at the other side of the housing 303 while the movable cover 304 is in butt joint with the cleaning tube 5, at this time, the wind force generated by the heat dissipation fan 4 is collected and conveyed into the cleaning tube 5 by the wind collecting groove 311, and along with the wind force input into the rotating ring 13 arranged on the cleaning tube 5, stronger wind force can be filled, the wind force can drive the rotating ring 13 to rotate to form a rotating airflow when being compressed and discharged outwards from the cleaning head 14, so that dust in gaps of the heat dissipation fins 1 can be cleaned rapidly in a large area by the rotating airflow, and the influence of the dust on the heat dissipation effect is avoided.
The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, the scope of which is defined by the claims. Various modifications and equivalent arrangements of this invention will occur to those skilled in the art, and are intended to be within the spirit and scope of the invention.
Claims (7)
1. The radiator for the semiconductor comprises a support (8), and is characterized in that a plurality of radiating fins (1) are arranged at the bottom of the support (8), a radiating fan (4) is arranged at the top of the support (8), connecting rods (6) are rotatably arranged on one side of the front surface and the back surface of the support (8), a knob (2) penetrates through the front surface of each connecting rod (6), and auxiliary structures (3) are arranged on one side of each connecting rod (6);
the auxiliary structure (3) comprises a shell (303), a ventilation groove (313) is formed in the shell (303), a wind collecting groove (311) is formed in one side of the inner wall of the shell (303), a plurality of wind guiding grooves (307) are formed in the periphery of the wind collecting groove (311) in a radial mode, and an air inlet (308) is fixedly formed in one side of the ventilation groove (313).
2. The heat sink for semiconductor according to claim 1, wherein the top of the housing (303) is slidably provided with a moving block (305), a limit screw (306) is inserted through the top of the moving block (305), a movable cover (304) is fixedly arranged on one side of the moving block (305), a through groove is formed on one side of the bottom of the movable cover (304), and the through groove is matched with one of the ventilation grooves (313).
3. The heat sink for a semiconductor according to claim 2, wherein the bottom of the inner wall of the housing (303) is fixedly connected with a communicating pipe (310), dead corners inside the housing (303) are fixedly provided with inclined blocks (309), and the front and back surfaces of the inner wall of the housing (303) are provided with L-shaped sliding grooves (312).
4. A radiator for a semiconductor according to claim 3, wherein a choke plate (302) is fixedly arranged on the top of the inner wall of the housing (303), the choke plate (302) is telescopic, and fixing screws (301) penetrate through the front side and the rear side of the top of the choke plate (302).
5. The radiator for semiconductors according to claim 1, wherein the cleaning tube (5) penetrates through the inside of the radiating fin (1), a stabilizing frame (9) is fixedly arranged on one side of the support (8), the stabilizing frame (9) is matched with the cleaning tube (5), and the outer diameter of the cleaning tube (5) is identical to the inner diameter of the movable cover (304).
6. The heat sink for semiconductor according to claim 5, wherein the bottom of the cleaning tube (5) is provided with a plurality of rotary rings (13) which are arranged at equal intervals in a straight line shape, air holes are arranged in the rotary rings (13), the air holes are fixedly communicated with the cleaning tube (5), and cleaning heads (14) are fixedly communicated with the outside of the rotary rings (13) in a circumferential array shape.
7. The radiator for semiconductors according to claim 1, wherein one side of the top of the support (8) is fixedly provided with a blocking sheet (7), the bottom of the support (8) is provided with a radiating bottom plate (10), the top of the radiating bottom plate (10) is provided with a plurality of air outlet pipes (11) in an array, and one side of the radiating bottom plate (10) is fixedly communicated with a connecting pipe (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510388110.8A CN119905462B (en) | 2025-03-31 | 2025-03-31 | Radiator for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510388110.8A CN119905462B (en) | 2025-03-31 | 2025-03-31 | Radiator for semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119905462A true CN119905462A (en) | 2025-04-29 |
| CN119905462B CN119905462B (en) | 2025-06-20 |
Family
ID=95473980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202510388110.8A Active CN119905462B (en) | 2025-03-31 | 2025-03-31 | Radiator for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119905462B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209439172U (en) * | 2019-01-23 | 2019-09-27 | 华北理工大学 | Auxiliary dust removal device for vehicle radiator |
| CN111696926A (en) * | 2020-05-18 | 2020-09-22 | 马鞍山芯海科技有限公司 | Manufacturing method of chip packaging structure and chip packaging structure |
| CN212623974U (en) * | 2020-09-18 | 2021-02-26 | 惠州市三口精密部件有限公司 | CPU radiator convenient to clearance |
| CN112958542A (en) * | 2021-02-04 | 2021-06-15 | 安徽商贸职业技术学院 | Machine case structure convenient for cleaning inside of computer |
| CN114253376A (en) * | 2021-12-18 | 2022-03-29 | 深圳市索沃思数码有限公司 | Novel heat radiation structure of notebook computer |
| CN114779908A (en) * | 2022-03-23 | 2022-07-22 | 重庆电子工程职业学院 | Computer CPU radiator |
| CN218602419U (en) * | 2022-08-26 | 2023-03-10 | 任英 | Integrated circuit with excellent heat dissipation performance |
| CN220774347U (en) * | 2023-08-05 | 2024-04-12 | 合肥田上源信息科技有限公司 | Integrated circuit chip packaging structure |
| CN117971019A (en) * | 2024-02-26 | 2024-05-03 | 镇江市长虹散热器有限公司 | Water-cooled radiator and radiating method thereof |
| CN118778781A (en) * | 2024-06-26 | 2024-10-15 | 山东商务职业学院 | A heat dissipation device for computer power supply |
-
2025
- 2025-03-31 CN CN202510388110.8A patent/CN119905462B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209439172U (en) * | 2019-01-23 | 2019-09-27 | 华北理工大学 | Auxiliary dust removal device for vehicle radiator |
| CN111696926A (en) * | 2020-05-18 | 2020-09-22 | 马鞍山芯海科技有限公司 | Manufacturing method of chip packaging structure and chip packaging structure |
| CN212623974U (en) * | 2020-09-18 | 2021-02-26 | 惠州市三口精密部件有限公司 | CPU radiator convenient to clearance |
| CN112958542A (en) * | 2021-02-04 | 2021-06-15 | 安徽商贸职业技术学院 | Machine case structure convenient for cleaning inside of computer |
| CN114253376A (en) * | 2021-12-18 | 2022-03-29 | 深圳市索沃思数码有限公司 | Novel heat radiation structure of notebook computer |
| CN114779908A (en) * | 2022-03-23 | 2022-07-22 | 重庆电子工程职业学院 | Computer CPU radiator |
| CN218602419U (en) * | 2022-08-26 | 2023-03-10 | 任英 | Integrated circuit with excellent heat dissipation performance |
| CN220774347U (en) * | 2023-08-05 | 2024-04-12 | 合肥田上源信息科技有限公司 | Integrated circuit chip packaging structure |
| CN117971019A (en) * | 2024-02-26 | 2024-05-03 | 镇江市长虹散热器有限公司 | Water-cooled radiator and radiating method thereof |
| CN118778781A (en) * | 2024-06-26 | 2024-10-15 | 山东商务职业学院 | A heat dissipation device for computer power supply |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119905462B (en) | 2025-06-20 |
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