CN119852237A - Wafer bearing device, detection equipment and detection method - Google Patents
Wafer bearing device, detection equipment and detection method Download PDFInfo
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- CN119852237A CN119852237A CN202510336037.XA CN202510336037A CN119852237A CN 119852237 A CN119852237 A CN 119852237A CN 202510336037 A CN202510336037 A CN 202510336037A CN 119852237 A CN119852237 A CN 119852237A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明涉及晶圆检测技术领域，尤其是一种晶圆承载装置、检测设备及检测方法，晶圆承载装置包括承载单体及转台，承载单体的数量为多个且在转台上周向分布；承载单体包括水平移动机构及竖直移动机构，水平滑移块在水平驱动件的作用下沿转台径向往复移动，竖直移动机构设置在水平滑移块上，竖直滑移块在竖直驱动件的作用下在水平滑移块上沿竖直方向往复升降；竖直滑移块上固定连接用于夹持晶圆的夹爪。本发明待检测位置的承载单体可以将夹爪单独收回，从而将晶圆边沿区域完全暴露出来；通过一次旋转即可晶圆完整边沿区域的检测，不需要与其他设备进行配合，有效简化装置结构、缩短检测耗时、提高检测结果的精度和质量。
The present invention relates to the field of wafer detection technology, in particular to a wafer bearing device, detection equipment and detection method, wherein the wafer bearing device comprises a bearing unit and a turntable, wherein the number of the bearing units is multiple and circumferentially distributed on the turntable; the bearing unit comprises a horizontal moving mechanism and a vertical moving mechanism, wherein the horizontal sliding block reciprocates radially along the turntable under the action of a horizontal driving member, and the vertical moving mechanism is arranged on the horizontal sliding block, and the vertical sliding block reciprocates and rises and falls along the vertical direction on the horizontal sliding block under the action of a vertical driving member; and a clamping claw for clamping a wafer is fixedly connected to the vertical sliding block. The bearing unit at the position to be detected of the present invention can retract the clamping claw separately, thereby completely exposing the edge area of the wafer; the complete edge area of the wafer can be detected by one rotation, and no coordination with other equipment is required, thereby effectively simplifying the device structure, shortening the detection time, and improving the accuracy and quality of the detection result.
Description
Technical Field
The invention relates to the technical field of wafer detection, in particular to a wafer bearing device, detection equipment and a detection method.
Background
In the semiconductor manufacturing process, the edge of the wafer needs to be detected so as to improve the yield and meet the requirements of the prior process. In the wafer detection process, a tool is required to clamp and position the wafer, and in the wafer detection process, continuous rotation is required to complete detection of a plurality of edge areas or complete edges. But in the prior art, the tool supports and clamps the outer edge of the wafer from the bottom of the wafer, so that the bottom of the edge of the wafer is shielded, and the detection process cannot be completed through one rotation. To above-mentioned problem, adopt fixture to promote and rotate the wafer among the prior art, put back the wafer and detect the mode of shielding the region and improve, but this kind of improvement scheme structure and operation step are complicated, and the operation consumes time, and the result that detects many times only need carry out complicated processing and just can obtain complete border detection result, and detection cost is high.
Disclosure of Invention
The invention aims to solve the problems, and provides a wafer bearing device, detection equipment and a detection method, which adopt the following technical scheme:
The wafer bearing device comprises bearing monomers and a turntable, wherein the turntable is arranged in the horizontal direction, the number of the bearing monomers is multiple, the bearing monomers are circumferentially distributed on the turntable, the bearing monomers comprise a horizontal moving mechanism and a vertical moving mechanism, the horizontal moving mechanism comprises a horizontal driving piece and a horizontal sliding block, the horizontal sliding block moves radially and reciprocally along the turntable under the action of the horizontal driving piece, the vertical moving mechanism is arranged on the horizontal sliding block and comprises a vertical driving piece and a vertical sliding block, the vertical sliding block moves reciprocally along the vertical direction on the horizontal sliding block under the action of the vertical driving piece, and clamping jaws for clamping wafers are fixedly connected onto the vertical sliding block.
On the basis of the scheme, the bearing unit further comprises a limiting mechanism, the limiting mechanism comprises a limiting nut and a limiting stud which are in threaded connection, the limiting stud is arranged on the horizontal sliding block along the vertical direction and is in threaded connection with the horizontal sliding block, and when the vertical sliding block moves up to the limit position, the bottom end of the limiting stud is abutted with the vertical sliding block.
Preferably, the number of the bearing monomers is 5, and the bearing monomers are uniformly distributed on the turntable in the circumferential direction.
Preferably, the clamping jaw comprises a receiving arm extending outwards along the radial direction of the turntable, the outer side end part of the receiving arm extends upwards to form a clamping block, and the clamping block is abutted with the outer edge of the wafer.
On the basis of the scheme, the clamping block is provided with a flexible device along the radial direction of the wafer towards one side of the wafer.
Preferably, the horizontal moving mechanism further comprises a horizontal sliding rail, the vertical moving mechanism further comprises a vertical sliding rail, the horizontal sliding rail is fixedly installed on the turntable along the radial direction, the horizontal sliding block is movably arranged on the horizontal sliding rail, the vertical sliding rail is fixedly arranged on the horizontal sliding block along the vertical direction, and the vertical sliding block is slidably arranged on the vertical sliding rail.
The wafer detection equipment is characterized by comprising the wafer bearing device, a sliding mechanism, a rotating mechanism and a detection mechanism, wherein the rotating mechanism comprises a rotary driving piece, the rotary table is arranged on the rotary driving piece and is driven to rotate by the rotary driving piece, the sliding mechanism comprises a first sliding guide rail fixedly arranged on an upper base plate, the first sliding guide rail is arranged in the horizontal direction, the rotating mechanism is slidably arranged on the first sliding guide rail and moves between a placement position and a detection position, and the detection mechanism is arranged at the detection position.
On the basis of the scheme, the rotating mechanism further comprises a slip ring and a rotating frame, the rotating frame is fixedly connected with the turntable coaxially, the rotating frame is fixedly connected with a rotor of the slip ring coaxially through a connecting rod, hollow grooves communicated with the rotor are formed in the middle of the rotating frame and the connecting rod, and the connecting rod penetrates through the rotary driving piece.
A wafer detection method, which uses the wafer detection equipment, comprises the following steps:
s1, adjusting the relative positions of all bearing monomers to enable all clamping jaws to be positioned in the same horizontal plane, and enabling the circle center of a circle formed by the clamping positions of all clamping jaws to be coaxial with a turntable;
s2, the rotating mechanism moves to a placing position, a wafer to be detected is placed on each clamping jaw of the bearing device, and the inner side of each clamping jaw is abutted with the edge of the wafer;
s3, the rotating mechanism moves to a detection position, and the rotary driving piece drives the rotary table to rotate;
S4, when one clamping jaw moves towards the direction of the detection mechanism and a preset distance exists from the detection mechanism, the clamping jaw extends outwards in the radial direction and then moves downwards, and then retracts inwards in the radial direction, so that the bottom surface and the side surface of the wafer at the supporting position of the clamping jaw are exposed in the detection range of the detection mechanism;
S5, after the detection mechanism completes detection of the position of the wafer, the clamping jaw extends outwards in the radial direction and moves upwards, and then retracts inwards in the radial direction until returning to the original position to be abutted with the wafer;
s6, repeating the steps S4 and S5 until the area to be detected of the wafer is detected.
On the basis of the scheme, when the clamping jaw is leveled in the step S1, the method comprises the following steps:
A1. placing a wafer standard on a bearing device;
A2. Placing a level gauge at the center of the wafer standard component;
A3. According to the detection result of the level gauge, rotating a limit stud carrying a monomer in the abnormal height direction, and adjusting the bottom height of the limit stud so as to adjust the heights of the vertical sliding block and the clamping jaw;
A4. after rotating the level by a preset angle, repeating the step A3;
A5. And D, rotating the level to the initial direction when the level is placed, judging whether the wafer standard component is in a horizontal state at the moment, and repeating the step A4 and the step A5 if the wafer standard component is not in the horizontal state.
Preferably, the horizontal moving mechanism further comprises a first horizontal travel switch and a second horizontal travel switch, wherein the horizontal sliding block is fixedly connected with the horizontal sliding piece, when the horizontal sliding piece is retracted inwards to a first preset position, the horizontal sliding piece enters the detection range of the first horizontal travel switch, and when the horizontal sliding piece is retracted inwards to a second preset position, the horizontal sliding piece enters the detection range of the second horizontal travel switch;
In the steps S2 and S5, when the vertical sliding block moves upwards to a third preset position, the clamping jaw is abutted with the wafer, and the vertical driving piece stops acting;
In step S4, the clamping jaw extends out in the radial direction and then moves downward, and then when the clamping jaw retracts into the second predetermined position in the radial direction, the second horizontal travel switch is triggered, and at the moment, the clamping jaw moves out of the detection range of the detection mechanism, and the horizontal driving member stops acting.
The wafer edge detection device has the beneficial effects that the wafer is stably supported through the bearing monomers which can be independently controlled, in the wafer edge detection process, the bearing monomers at the position to be detected can be independently retracted, so that the edge region of the wafer is completely exposed, meanwhile, the stability of the wafer support is not affected, the error of a detection result caused by the deviation of the wafer position is avoided, the detection of the complete edge region of the wafer can be realized through one-time rotation, the cooperation with other equipment is not needed, the device structure is effectively simplified, the detection time consumption is shortened, and the precision and quality of the detection result are improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of a wafer carrying state according to the present invention;
FIG. 3 is a cross-sectional view of the structure of the present invention;
FIG. 4 is a schematic view of the mounting state of the bearing unit of the present invention;
FIG. 5 is a schematic view of the structure of the bearing monomer of the present invention;
FIG. 6 is a schematic view of another view angle structure of the carrier of the present invention;
FIG. 7 is a schematic diagram of a limiting mechanism for a bearing unit according to the present invention.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the accompanying drawings:
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, directly connected, indirectly connected via an intermediate medium, or in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present invention, it should be understood that the terms "center," "length," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
As shown in fig. 1 and 2, a wafer carrying device includes a carrying unit and a turntable 22, wherein the turntable 22 is disposed along a horizontal direction and rotates in the horizontal plane. The number of the bearing monomers is more than one and the bearing monomers are circumferentially distributed on the turntable 22, preferably, the number of the bearing monomers is 5 and the bearing monomers are circumferentially uniformly distributed on the turntable 22, so that the stable bearing of the wafer 6 is realized, and meanwhile, when any bearing monomer does not provide a bearing function, the wafer 6 can still keep stable in position and cannot deflect or shake.
As shown in fig. 4 to 6, the carrying unit includes a horizontal moving mechanism and a vertical moving mechanism, the horizontal moving mechanism includes a horizontal driving member 31 and a horizontal sliding block 33, the horizontal sliding block 33 moves radially and reciprocally along the turntable 22 under the action of the horizontal driving member 31, the vertical moving mechanism is disposed on the horizontal sliding block 33 and includes a vertical driving member 41 and a vertical sliding block 43, and the vertical sliding block 43 moves reciprocally on the horizontal sliding block 33 in the vertical direction under the action of the vertical driving member 41. The horizontal driving member 31 and the vertical driving member 41 may be linear driving elements such as a motor, a cylinder, a hydraulic cylinder, etc. Preferably, the horizontal moving mechanism further comprises a horizontal sliding rail 32, the vertical moving mechanism further comprises a vertical sliding rail 44, the horizontal sliding rail 32 is fixedly mounted on the turntable 22 along the radial direction, the horizontal sliding block 33 is movably arranged on the horizontal sliding rail 32, the vertical sliding rail 44 is fixedly arranged on the horizontal sliding block 33 along the vertical direction, the vertical sliding block 43 is slidably arranged on the vertical sliding rail 44, and the stability and the accuracy of the moving paths of the horizontal sliding block 33 and the vertical sliding block 43 are ensured through the horizontal sliding rail 32 and the vertical sliding rail 44.
The vertical sliding block 43 is fixedly connected with a clamping jaw 5 for clamping the wafer 6, the clamping jaw 5 comprises a receiving arm extending outwards along the radial direction of the turntable 22, the outer end part of the receiving arm extends upwards to form a clamping block, and the clamping block is abutted with the outer edge of the wafer 6. The wafer 6 is supported by the supporting arm from the bottom of the wafer 6, and the supporting and positioning of the wafer 6 are completed by combining the abutting action of the clamping blocks on the edge of the wafer 6.
Because the edge position of the wafer 6 is thinner, when radial clamping is carried out at the edge, damage such as collapse and the like can be easily caused at the edge due to overlarge clamping force, and the problems of unstable positioning and clamping, eccentric wafer and the like can be possibly caused due to overlarge clamping force. Therefore, the clamping block is provided with a flexible device along the radial direction of the wafer 6 towards one side of the wafer 6, so that the clamping effect is improved and damage to the edge of the wafer is prevented. The flexible device may be a spring, a buffer sheet, or the like, and may be elastically deformed along the radial direction of the wafer 6, or the like.
The bearing unit further comprises a limiting mechanism, as shown in fig. 7, wherein the limiting mechanism comprises a limiting nut 45 and a limiting stud 46 which are in threaded connection, the limiting nut 45 is sleeved outside the limiting stud 46 to position the limiting stud 46, the limiting stud 46 is arranged on the horizontal sliding block 33 along the vertical direction and is in threaded connection with the horizontal sliding block 33, and when the vertical sliding block 43 moves up to the limit position, the bottom end of the limiting stud 46 is abutted against the vertical sliding block 43. The height is adjusted by rotating the limit stud 46, so that the limit position of the vertical sliding block 43 and the clamping jaw 5 when moving to the top end is limited, and then the leveling operation is performed when the wafer 6 is carried by the carrying device, so that the accuracy of the horizontal position and the angle of the wafer 6 is ensured.
The wafer detection equipment comprises the wafer bearing device, a sliding mechanism, a rotating mechanism and a detection mechanism, wherein the rotating mechanism comprises a rotating driving piece 21, the turntable 22 is arranged on the rotating driving piece 21 and is driven to rotate by the rotating driving piece 21, and the rotating driving piece 21 can be a motor, a gear mechanism and other rotating driving elements. Because the bearing device comprises a plurality of connecting wires, in order to prevent the connecting wires from winding in the rotating process of the turntable 22, as shown in fig. 3, the rotating mechanism further comprises a slip ring 23 and a rotating frame 24, the slip ring 23 comprises a stator and a rotor, the stator is fixedly connected with the rotating frame 24 coaxially with the turntable 22, the rotating frame 24 is fixedly connected with the rotor of the slip ring 23 coaxially through a connecting rod, hollow grooves communicated with the rotor are formed in the middle parts of the rotating frame 24 and the connecting rod, and the connecting rod penetrates through the rotating driving piece 21. The connecting wire of the bearing device is correspondingly connected with the stator after passing through the rotating frame 24, the connecting rod and the rotor.
The sliding mechanism comprises a first sliding guide rail 12 fixedly arranged on an upper base plate 11, the first sliding guide rail 12 is arranged along the horizontal direction, the rotating mechanism is slidably arranged on the first sliding guide rail 12 and moves between a placing position and a detecting position, specifically, a first sliding seat 13 is slidably arranged on the first sliding guide rail 12, and the rotating mechanism is fixedly arranged on the first sliding seat 13. The sliding mechanism may further include a second sliding rail 15 fixedly disposed on the lower base plate 14, the second sliding rail 15 is disposed parallel to the first sliding rail 12 in a horizontal plane, the second sliding seat 16 is slidably disposed on the second sliding rail 15, and a stator of the slip ring 23 is fixedly mounted on the second sliding seat 16.
The detecting mechanism is arranged at the detecting position, and the detecting mechanism can be a device for detecting the wafer, such as a camera, a sensor and the like.
A wafer detection method, which uses the wafer detection equipment, comprises the following steps:
S1, adjusting the relative positions of all bearing monomers to enable all clamping jaws 5 to be in the same horizontal plane, and enabling the circle center of a circle formed by the clamping positions of all clamping jaws 5 to be coaxial with a turntable 22, wherein when the clamping jaws 5 are leveled, the method comprises the following steps:
A1. placing a wafer standard on a bearing device;
A2. Placing a level gauge at the center of the wafer standard component;
A3. according to the detection result of the level gauge, rotating a limit stud 46 carrying a monomer in an abnormal height direction, and adjusting the bottom height of the limit stud 46 so as to adjust the heights of the vertical sliding block 43 and the clamping jaw 5;
A4. after rotating the level by a preset angle, repeating the step A3;
A5. And (3) rotating the level to the initial direction when the level is placed, judging whether the wafer standard piece is in a horizontal state at the moment, and if the wafer standard piece is not in the horizontal state, repeating the step A4 and the step A5 until the wafer standard piece is in the horizontal state.
S2, the rotating mechanism moves to a placing position, a wafer 6 to be detected is placed on each clamping jaw 5 of the bearing device, and the inner side of each clamping jaw 5 is abutted with the edge of the wafer 6;
s3, the rotating mechanism moves to a detection position, and the rotary driving piece 21 drives the turntable 22 to rotate;
S4, when one clamping jaw 5 moves towards the direction of the detection mechanism and a preset distance exists from the detection mechanism, the clamping jaw 5 extends outwards in the radial direction and then moves downwards, and then retracts inwards in the radial direction, so that the bottom surface and the side surface of the wafer 6 at the supporting position of the clamping jaw 5 are exposed in the detection range of the detection mechanism;
s5, after the detection mechanism completes detection of the position of the wafer 6, the clamping jaw 5 extends outwards in the radial direction and moves upwards, and then retracts inwards in the radial direction until returning to the original position to be abutted with the wafer 6;
s6, repeating the steps S4 and S5 until the detection of the area to be detected of the edge of the wafer 6 is completed.
The horizontal moving mechanism further comprises a first horizontal travel switch 35 and a second horizontal travel switch 36, wherein the horizontal sliding block 33 is fixedly connected with the horizontal sliding piece 34, when the horizontal sliding block 33 is retracted inwards to a first preset position, the horizontal sliding piece 34 enters the detection range of the first horizontal travel switch 35, when the horizontal sliding block 33 is retracted inwards to a second preset position, the horizontal sliding piece 34 enters the detection range of the second horizontal travel switch 36, the vertical moving mechanism further comprises a vertical displacement sensor 42, and when the vertical sliding block 43 is moved upwards to a third preset position, the vertical displacement sensor 42 detects the position signal of the vertical sliding block 43;
In the steps S2 and S5, when the vertical sliding block 43 moves upwards to a third preset position, the clamping jaw 5 is abutted with the wafer 6, specifically, the top surface of the supporting arm of the clamping jaw 5 is abutted with the bottom surface of the wafer 6, the vertical driving piece 41 stops acting, and the horizontal state of the wafer 6 is ensured;
In step S4, the clamping jaw 5 extends out in the radial direction and moves downward, and then when the clamping jaw 5 retracts into the second predetermined position in the radial direction, the second horizontal travel switch 36 is triggered, at this time, the clamping jaw 5 moves out of the detection range of the detection mechanism, the clamping jaw 5 does not interfere with the detection mechanism, and the horizontal driving member 31 stops moving, so that the clamping jaw 5 is prevented from colliding with the detection mechanism in the rotation process, and the detection mechanism can be guaranteed to completely detect or sample the wafer edge region.
By arranging the travel switches and the sensors, the moving range of each moving part can be limited, and corresponding action signals can be sent to the upper computer at the same time so as to accurately monitor the control and detection process of the machine.
The present invention has been described above by way of example, but the present invention is not limited to the above-described embodiments, and any modifications or variations based on the present invention fall within the scope of the present invention.
Claims (11)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510772470.8A CN120319720A (en) | 2025-03-21 | 2025-03-21 | Wafer carrying device, detection equipment and detection method |
| CN202510336037.XA CN119852237B (en) | 2025-03-21 | 2025-03-21 | A wafer detection method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510336037.XA CN119852237B (en) | 2025-03-21 | 2025-03-21 | A wafer detection method |
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| CN202510772470.8A Division CN120319720A (en) | 2025-03-21 | 2025-03-21 | Wafer carrying device, detection equipment and detection method |
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| CN119852237A true CN119852237A (en) | 2025-04-18 |
| CN119852237B CN119852237B (en) | 2025-07-04 |
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| CN202510772470.8A Pending CN120319720A (en) | 2025-03-21 | 2025-03-21 | Wafer carrying device, detection equipment and detection method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN120369740A (en) * | 2025-06-25 | 2025-07-25 | 苏州赛腾精密电子股份有限公司 | Wafer inspection mechanism |
| CN120404763A (en) * | 2025-07-03 | 2025-08-01 | 苏州赛腾精密电子股份有限公司 | Wafer overturning detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120715824B (en) * | 2025-08-14 | 2025-12-02 | 浙江丽水中欣晶圆半导体科技有限公司 | A clamping device system and its inspection method for wafer surface inspection |
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| CN119852237B (en) | 2025-07-04 |
| CN120319720A (en) | 2025-07-15 |
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