CN119819543B - Semiconductor dispensing laminating equipment - Google Patents
Semiconductor dispensing laminating equipmentInfo
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- CN119819543B CN119819543B CN202510331922.9A CN202510331922A CN119819543B CN 119819543 B CN119819543 B CN 119819543B CN 202510331922 A CN202510331922 A CN 202510331922A CN 119819543 B CN119819543 B CN 119819543B
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- dispensing head
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Abstract
The application relates to the technical field of semiconductors and provides a semiconductor dispensing bonding device which comprises a workbench, a conveying mechanism, a dispensing head, a suction nozzle, a mounting frame and two driving mechanisms, wherein the conveying mechanism is arranged on the workbench and used for conveying a tool provided with a chip, the mounting frame is arranged on the workbench and used for mounting the dispensing head and the suction nozzle, the driving mechanisms are arranged on the mounting frame and used for respectively driving the dispensing head and the suction nozzle to do reciprocating sliding motion, the conveying mechanism comprises a plurality of guide rails which are arranged at intervals along the length direction of the mounting frame, the dispensing head and the suction nozzle are respectively arranged on two sides of the mounting frame, and a cleaning mechanism is arranged on the workbench on the advancing path of the dispensing head towards the conveying mechanism. The application can clean the residual glue on the dispensing head in time in the dispensing operation gap, effectively prevent the problem of preliminary curing of the glue caused by overlong residence time, and further avoid the problem that the curing glue is mixed into new glue to influence the bonding quality.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a semiconductor dispensing and bonding device.
Background
The semiconductor industry is one of the core pillars of the modern high-tech industry and has an important strategic position on a global scale. With the continuous progress of technology, the integration level of semiconductor devices is higher and higher, and the requirements on the manufacturing process are also more and more strict. The dispensing bonding process is one of the key links in the semiconductor manufacturing process, and directly affects the performance, reliability and yield of the chip.
Currently, in solving the problem of residual glue dispensing heads, methods commonly adopted in the industry include periodic replacement of the glue dispensing heads, removal of residual glue by high-temperature heating, or manual cleaning by introducing auxiliary tools. Specifically, the common treatment method comprises the steps of firstly utilizing an external cleaning device to spray a solvent to dissolve residues and then wiping the residues, secondly softening and solidifying glue by a built-in heating system to facilitate subsequent cleaning, and thirdly designing a special scraper structure to directly remove aged substances attached to the surface. Although these methods can alleviate the problem to some extent, they still have drawbacks.
However, the above conventional method exposes a significant limitation in practical application, in the process of dispensing operation, since the dispensing head generally has a certain residence time after dispensing a chip on a tool or a batch of tools, if the time is long, especially for the glue with a short initial fixing time, the glue near the dispensing head may have a certain curing, and when dispensing a chip on the next batch or the next tool, the glue with a certain curing will be mixed into the new glue to affect the bonding effect between the subsequent chip and other parts, and at this time, the cured glue on the dispensing head is not easy to clean by adopting the method in the process of operation, so further improvement is needed.
Disclosure of Invention
In order to solve the above problems, the present application provides a semiconductor dispensing bonding apparatus.
The application provides a semiconductor dispensing bonding device, which adopts the following technical scheme:
the utility model provides a semiconductor dispensing laminating equipment, includes the workstation, sets up in order to be used for carrying the conveying mechanism who is equipped with the frock of chip on the workstation, sets up in the point gum head and the suction nozzle of conveying mechanism top, sets up in the workstation in order for the mounting bracket of point gum head and suction nozzle installation and two sets up in the mounting bracket in order to drive the driving mechanism that point gum head and suction nozzle do reciprocating sliding motion respectively, conveying mechanism includes the guide rail that a plurality of set up along the length direction interval of mounting bracket, point gum head and suction nozzle set up respectively in the both sides of mounting bracket, be provided with clearance mechanism on the workstation on the point gum head towards conveying mechanism travel, clearance mechanism is used for clearing up the incomplete glue on the point gum head, clearance mechanism is including being used for accepting along with the glue after the heating in order to break away from in the joint board of the incomplete glue of point gum head, sets up in the joint board in order to be used for scraping the elastic scraper and be used for adjusting plate horizontal position's adjusting the adjusting component, elastic scraper sets up in the joint board one side that is close to conveying mechanism.
By adopting the technical scheme, before the driving mechanism drives the dispensing head to dispense the next tooling or chips of the next batch, in the advancing process of the dispensing head towards the chips, the heated new glue can be extruded along with pressure, then the solidified glue can be driven to flow out on the premise of pressure extrusion, then the solidified glue can be supported by the supporting plate, so that random dripping of the solidified glue is prevented from causing waste or pollution, and along with moving, the solidified glue can be flexibly scraped to the positions of the elastic scraping plates through the elasticity of the elastic scraping plates, and the cleaning effect is ensured. The method is used for scraping the glue with certain curing before each dispensing so as to reduce the influence of the adhesive effect between the subsequent chip and other parts, and compared with the methods of replacing the dispensing head, using high-temperature heating to remove residual glue or manually cleaning, the method has lower influence on the working state of the dispensing head.
Wherein, set up the point and glue the head and the suction nozzle in the both sides of mounting bracket respectively to be applicable to the glue that just solid time is short, in order to pass through the suction nozzle with other spare parts after glue just solid on the chip with the bonding, in order to improve the bonding effect between chip and other spare parts. Because the path that the dispensing head moved towards the chip is comparatively fixed, if the dispensing head is in the same place in order to scrape the solidified glue on the dispensing head, the residual glue received before and the glue scraped by the elastic scraping plate can be also scraped, and along with the glue extruded again, the glue is adhered on the dispensing head, and after the dispensing head is used for a certain number of times at the same position on the receiving plate and the elastic scraping plate, the horizontal position of the receiving plate is changed through the adjusting component. At this time, the glue on the receiving plate and the elastic scraping plate can be cleaned manually or by disassembling. Compared with the prior art, the method can also reduce damage to the dispensing head.
Preferably, the cleaning mechanism further comprises a collecting assembly for collecting the glue on the receiving plate and the elastic scraping plate, the collecting assembly comprises a scraping plate abutting against the receiving plate, a guide plate arranged on the scraping plate and a collecting groove for receiving the glue guided by the guide plate, and the scraping plate is used for abutting against the elastic scraping plate.
Through adopting above-mentioned technical scheme, through being provided with collection subassembly to collect the glue on accepting board and the elasticity scraper blade, with further perfect system, retrieve the waste rubber that the clearance in-process produced comprehensively, keep operational environment clean and tidy. Specifically, can effectively clear away the residual glue on the board of holding through the scraper blade to guide the glue of striking off into the collecting vat through the guide plate and carry out centralized processing, avoided the pollution that the residual glue caused to the point gum head and to follow-up point gum operation's influence.
Preferably, the bearing plate and the elastic scraping plate are non-adhesive plates, the bearing plate and the elastic scraping plate have thermal conductivity, the bearing plate is internally provided with a containing cavity, and an input pipe for conveying high-temperature media to enter the containing cavity and an output pipe for outputting the media after heat exchange are arranged outside the bearing plate.
Through adopting above-mentioned technical scheme, accept the board and possess the heat conductivity and be provided with and hold the chamber, can utilize high temperature medium to heat accepting the board, and carry out heat conduction to the elasticity scraper blade to effectively soften the residual glue of accepting or melting point and glue remaining cured glue on the head, so that to accepting on the board and on the elasticity scraper blade, promote cleaning efficiency. Meanwhile, the adhesive force of the residual glue on the surfaces of the bearing plate and the elastic scraping plate is reduced due to the design of the non-adhesive plate, so that the subsequent cleaning is facilitated. The input pipe and the output pipe are arranged to realize medium circulation, so that continuous heat supply is ensured, the energy utilization rate is improved, and the cleaning effect is further ensured.
Preferably, the receiving plate is arranged obliquely upwards near one end of the conveying mechanism, the collecting groove is arranged on one side of the receiving plate far away from the conveying mechanism, the collecting groove is arranged along the whole length of the length direction of the receiving plate, the guide plate is arranged on one side of the scraping plate far away from the collecting groove, the guide plate is arranged in an arc shape towards the direction far away from the collecting groove, one end of the guide plate is arranged near the elastic scraping plate, the other end of the guide plate is arranged near the collecting groove, and the angle between the guide plate and the scraping plate is arranged in an acute angle.
Through adopting above-mentioned technical scheme, will accept the board and be the slope and upwards set up the direction that can effectively guide glue flow direction to keep away from conveying mechanism near conveying mechanism's one end, avoid glue backward flow to pollute the some gluey region. The collecting vat sets up along accepting board length direction overall length and can ensure that all glue that flows down are collected completely, improves cleaning efficiency and reduces extravagant. And wherein the arc design of guide plate and the acute angle setting between its and the scraper blade help optimizing glue flow path, make glue guide into the collecting vat more smoothly to promote the cleaning effect.
Preferably, the elastic scraping plate is a first air bag at the top of the bearing plate, air is filled in the first air bag, and the first air bag is arranged along the whole length of the length direction of the bearing plate.
By adopting the technical scheme, the elastic scraping plate is the first air bag and is arranged at the top of the bearing plate, and due to the elasticity and deformability of the elastic scraping plate, the rubber head is abutted against the rubber head so as to adapt to different surface shapes, so that the problem that equipment is damaged or the scraping is not thorough due to rigid collision is avoided, meanwhile, residual rubber is ensured to be sufficiently removed, and the quality and reliability of a dispensing process are improved.
Preferably, the supporting plate is a flexible plate, a heat conducting plate which is in butt joint with the supporting plate to conduct heat is arranged below the supporting plate, the adjusting assembly comprises two reels which are respectively used for winding the two ends of the supporting plate and second driving parts which drive the reels to rotate, and the scraping plates are provided with two second driving parts which are respectively arranged at the two ends of the heat conducting plate.
Through adopting above-mentioned technical scheme, the board that holds that the flexible sheet set up can adapt to different operational environment better, improves the flexibility and the efficiency to the cull clearance. The heat conducting plate is abutted with the bearing plate to conduct heat, so that the surface temperature of the bearing plate can be effectively maintained, and the residual glue is prevented from being cooled and solidified. The spool in the adjusting part and the second driving piece cooperation are used, realize accepting the accurate adjustment that board and elasticity scraper blade are located horizontal position, ensure the stability of clearance process.
Along with the rotation of second driving piece with driving the spool, two spools are with rolling respectively with unreel and hold the board, at the in-process of rolling, the scraper blade is scraping the incomplete glue that is in softening in order to extrude the gas in the first gasbag to with the gas extrusion in the first gasbag of rolling on the spool in the first gasbag that is located between two spools, in order to be the arch state. So as to reduce the possibility of uneven rolling in the rolling process of the follow-up first air bag along with the bearing plate. And after being wound to a certain degree, the winding machine reversely rotates to be reused.
Preferably, the two ends of the bearing plate are fixed to form a closed loop, and the adjusting assembly comprises a rotating shaft for winding the bearing plate and a third driving piece for driving the rotating shaft to rotate.
By adopting the technical scheme, the two ends of the bearing plate are fixed to be in closed loop arrangement, so that the bearing plate forms a continuous circulation structure. The design can ensure that the bearing plate always maintains a stable form in the cleaning process, and deformation or failure caused by uneven stress is avoided.
Preferably, the first air bag is provided with elastic protruding points, the elastic protruding points are arranged at intervals along the length direction of the first air bag, and the elastic protruding points are used for being abutted to the side wall of the dispensing head.
Through adopting above-mentioned technical scheme, although first gasbag can be adapted to the point gum head of different shapes, when the extrusion for first gasbag is the indent, and its area of contact with the point gum head lateral wall is less, through being provided with the elasticity bump on first gasbag to this, increased frictional force and area of contact between first gasbag and the point gum head lateral wall, the elasticity bump can strengthen the contact effect between first gasbag and the point gum head lateral wall, can clear away the residual gum on the point gum head lateral wall more effectively.
Preferably, the elastic bump is a second air bag, and the second air bag is communicated with the first air bag or is communicated with an adjacent second air bag.
Through adopting above-mentioned technical scheme, the elasticity bump design is the clean effect of the first lateral wall of point gum for the second gasbag can effectively be strengthened. Compared with other fixed structures, the second air bag has better flexibility, and can generate proper deformation when the contact point is glued to the head, so that the surface profile of the dispensing head can be more tightly attached, and the residual glue cleaning efficiency is improved. Meanwhile, when the second air bags are communicated with the first air bags or the adjacent second air bags are communicated with each other, the pressure can be uniformly distributed, the risk of damaging equipment due to the fact that local cleaning force is too strong is avoided, and the whole cleaning process is ensured to be stable and reliable.
Preferably, the first air bag is detachably connected to the receiving plate.
Through adopting above-mentioned technical scheme, realize dismantling between first gasbag and the board of accepting and be connected, this design makes first gasbag can conveniently change or maintain after long-time use, simultaneously, this kind of detachable connection mode still is convenient for wash alone or overhaul first gasbag.
In summary, the application has the following beneficial effects:
Through set up clearance mechanism on the first travel path of point gum, can in time clear up the residual gum on the point gum head in the operation clearance of point gum, effectively prevent the preliminary solidification problem of glue that leads to because of dwell time overlength to avoid solidifying glue and mixing in the new glue and influence bonding quality.
Drawings
FIG. 1 is a schematic view showing the overall structure of embodiment 1 of the present application;
FIG. 2 is a schematic view showing the structure of a workbench in embodiment 1 of the present application;
FIG. 3 is a schematic view showing the structure of a suction nozzle in embodiment 1 of the present application;
FIG. 4 is an enlarged partial schematic view of position A of FIG. 2;
FIG. 5 is a schematic view showing the internal structure of the receiving plate in embodiment 1 of the present application;
FIG. 6 is a schematic view showing the structure of a cleaning mechanism in embodiment 2 of the present application;
FIG. 7 is a schematic view showing the structure of embodiment 3 of the present application;
fig. 8 is a schematic view showing the structure of an elastic bump in embodiment 4 of the present application.
The reference numerals are 1, a workbench, 11, a conveying mechanism, 111, a guide rail, 112, a sliding seat, 12, a dispensing head, 13, a suction nozzle, 14, a mounting frame, 15, a driving mechanism, 16, a control mechanism, 17, a cover body, 171, a cabinet door, 18, an annular light source detection device, 2, a cleaning mechanism, 21, a bearing plate, 211, a containing cavity, 212, an input pipe, 213, an output pipe, 22, an elastic scraping plate, 221, a deformation space, 23, an adjusting component, 231, a rack, 232, an incomplete gear, 233, a first driving piece, 234, a reel, 235, a second driving piece, 236, a rotating shaft, 237, a third driving piece, 24, a collecting component, 241, a scraping plate, 242, a guide plate, 243, a collecting groove, 25, a heat conducting plate, 3 and an elastic bump.
Detailed Description
The present application will be described in further detail with reference to fig. 1 to 8.
The embodiment of the application discloses a semiconductor dispensing and bonding device.
Example 1:
The semiconductor dispensing laminating equipment comprises a workbench 1, a conveying mechanism 11, a dispensing head 12, a suction nozzle 13, a mounting rack 14, two driving mechanisms 15 and a control mechanism 16, wherein the conveying mechanism 11 is arranged on the workbench 1 and used for conveying tools provided with chips, the mounting rack 14 is arranged above the conveying mechanism 11 and used for mounting the dispensing head 12 and the suction nozzle 13, the two driving mechanisms 15 and the control mechanism 16 are arranged on the mounting rack 14 and used for respectively driving the dispensing head 12 and the suction nozzle 13 to do reciprocating sliding movement, the control mechanism 16 is electrically connected with the conveying mechanism 11, the driving mechanisms 15, the dispensing head 12 and the suction nozzle 13 and used for respectively controlling the tools provided with the chips to transport, driving the dispensing head 12 or the suction nozzle 13 to correspondingly move, and controlling the dispensing head 12 to perform dispensing and the suction nozzle 13 to adsorb parts used for laminating with the chips, and the control mechanism 16 is the prior art and is not repeated.
Wherein, be provided with the cover body 17 on the workstation 1 to cover the part that is located workstation 1 upper surface and establishes, in order to play dirt-proof effect, and offered the opening on the cover body 17, be provided with the cabinet door 171 that opens and close the opening on the cover body 17, in order to place corresponding tool that is equipped with the chip in the cover body 17 and carry out the processing of point gum and laminating.
The conveying mechanism 11 includes a plurality of guide rails 111 disposed along a length direction of the mounting frame 14 at intervals, a sliding seat 112 slidably connected to the guide rails 111, and a driving assembly (not shown in the drawing) for driving the sliding seat 112 to slide, in this embodiment, the guide rails 111 are specifically shown in two, and two sliding seats 112 are correspondingly disposed for placing tools for sliding transportation. The driving assembly may be a combination of a screw and a driving motor to drive the sliding seat 112 to slide, or drive the sliding seat 112 to slide in other driving manners, which will not be described in detail herein.
The length direction of the mounting frame 14 is parallel to the width direction of the guide rail 111, and the dispensing head 12 and the suction nozzle 13 are respectively disposed on two sides of the mounting frame 14, wherein the dispensing head 12 performs dispensing processing on the chip through the driving mechanism 15, and the suction nozzle 13 is used for sucking the part and attaching the dispensed chip.
In order to improve the dispensing accuracy and the attaching accuracy, an annular light source detecting device 18 is disposed on the side of the dispensing head 12 and the suction nozzle 13 near the conveying mechanism 11, and the annular light source detecting device 18 is electrically connected to the control mechanism 16 for transmitting the corresponding detected images to the control mechanism 16 for processing or checking, so as to improve the accuracy of the dispensing or the suction nozzle 13 during working.
Referring to fig. 2 and 4, further, in the use process of the dispensing head 12, due to the limited length of the guide rail 111 and the limited number of the sliding seats 112, there is a rest gap in the dispensing operation, for which the glue at the dispensing head 12 may be cured initially, and may be mixed with the newly extruded glue to be dispensed on the chip during the subsequent operation, so as to affect the bonding quality between the subsequent and the parts, in this embodiment, a cleaning mechanism 2 is disposed on the working table 1 on the advancing path of the dispensing head 12 towards the conveying mechanism 11.
The cleaning mechanism 2 is used for cleaning the residual glue on the dispensing head 12, and the cleaning mechanism 2 specifically comprises a receiving plate 21 for receiving the residual glue which is separated from the dispensing head 12 along with the heated glue, an elastic scraping plate 22 arranged on the receiving plate 21 for scraping the glue, an adjusting component 23 for adjusting the horizontal position of the receiving plate 21, and a collecting component 24 for collecting the glue on the receiving plate 21 and the elastic scraping plate 22.
In this embodiment, the receiving plate 21 and the elastic scraping plate 22 are non-adhesive plates, and the receiving plate 21 and the elastic scraping plate 22 have thermal conductivity, wherein the receiving plate 21 may be made of one of ceramic, silicon dioxide, aluminum alloy or stainless steel, and specifically set according to requirements. The elastic scraping plate 22 is made of a material which can be selected to be heat-conducting silica gel as required to have certain elasticity.
Referring to fig. 4 and 5, the receiving plate 21 has a receiving cavity 211 therein, an input pipe 212 for conveying a high-temperature medium into the receiving cavity 211 and an output pipe 213 for outputting a medium after heat exchange are fixedly arranged outside the receiving plate 21, wherein, in order to be convenient for matching with a subsequent adjusting assembly 23 to adjust the horizontal position of the receiving plate 21, the input pipe 212 and the output pipe 213 are both flexible pipes. The elastic scraper 22 is disposed on one side of the receiving plate 21 near the conveying mechanism 11, and can be specifically connected with the receiving plate 21 in a thermoplastic manner, and the elastic scraper 22 can arch in a direction away from the receiving plate 21, and the arch portion can be triangular or arc-shaped, and a deformation space 221 for the elastic scraper 22 to deform when abutting against the dispensing head 12 is reserved between the elastic scraper 22 and the receiving plate 21 according to requirements.
It should be noted that, with use, the elastic scraper 22 may be pressed to have a concave shape, and for this phenomenon, a fixing plate fixedly connected to the receiving plate 21 may be provided at an end of the elastic scraper 22, and air with a certain pressure may be injected into the deformation space 221. Or springs are arranged in the deformation space 221 at intervals along the length direction of the elastic scraping plate 22, so that the elastic scraping plate 22 is supported, and the elastic scraping plate is particularly arranged according to the requirement.
The adjusting component 23 may be a screw rod threaded through the lower end of the receiving plate 21 and a driving motor for driving the screw rod to rotate, so as to change the position on the receiving plate 21 along with the forward rotation or the reverse rotation of the driving motor, or the adjusting component 23 may include two racks 231 disposed on the upper surface of the workbench 1 to be disposed opposite to each other, an incomplete gear 232 engaged with the racks 231, and a first driving member 233 fixedly connected with the incomplete gear 232, where the first driving member 233 is specifically a driving motor, and is configured as the incomplete gear 232, so as to drive the receiving plate 21 to slide reciprocally under unidirectional rotation of the driving motor. In this embodiment, the adjustment assembly 23 is specifically shown in the latter case.
The collecting assembly 24 includes a blade 241 abutting against the receiving plate 21, a deflector 242 disposed on the blade 241, and a collecting groove 243 for receiving the glue guided by the deflector 242, wherein the blade 241 abuts against the elastic blade 22. It should be noted that, in order to facilitate the collection of the glue after the subsequent heating, in this embodiment, the end of the receiving plate 21 close to the conveying mechanism 11 is disposed obliquely upward, so that the softened glue flows along the oblique direction of the receiving plate 21, and in this regard, the collecting groove 243 is disposed on the side of the receiving plate 21 far from the conveying mechanism 11, and the collecting groove 243 is disposed along the entire length of the receiving plate 21 in the length direction. And the baffle 242 is disposed on one side of the scraping plate 241 away from the collecting tank 243, the baffle 242 is disposed in an arc shape toward the direction away from the collecting tank 243, one end of the baffle 242 is disposed near the elastic scraping plate 22, the other end of the baffle 242 is disposed near the collecting tank 243, and the angle between the baffle 242 and the scraping plate 241 is disposed in an acute angle for flowing the scraped glue into the collecting tank 243 for collecting.
It should be noted that, for the collected glue, the inner bottom wall of the collecting tank 243 may be inclined, and a collecting pipe may be fixedly provided at the end of the collecting tank 243 to flow to the corresponding storage box for collecting treatment.
The implementation principle of the semiconductor dispensing bonding equipment of the embodiment of the application is that before a driving mechanism 15 drives a dispensing head 12 to dispense the next tooling or chips of the next batch, the heated new glue can be extruded along with pressure in the advancing process of the dispensing head 12 towards the chips, then the solidified glue is driven to flow out on the premise of pressure extrusion, then the solidified glue is carried out through a bearing plate 21 to prevent waste or pollution caused by random dripping, and the residual glue with different forms can be flexibly scraped through the elasticity of the elastic scraping plate 22 along with moving to the elastic scraping plate 22, so that the cleaning effect is ensured. In this way, the glue cured before each dispensing is scraped to reduce the influence of the bonding effect between the subsequent chip and other parts, and the influence on the working state of the dispensing head 12 is lower compared with the methods of replacing the dispensing head 12, using high-temperature heating to remove residual glue or manually cleaning and the like.
Example 2:
Referring to fig. 6, in the present embodiment, the difference from embodiment 1 is that the elastic scraper 22 is a first air bag at the top of the receiving plate 21, the first air bag is filled with air, and the first air bag is provided along the entire length of the receiving plate 21 in the longitudinal direction. The receiving plate 21 is a flexible plate, and a heat conducting plate 25 abutting against the receiving plate 21 for conducting heat is disposed below the receiving plate 21, and the heat conducting plate 25 can refer to the receiving plate 21 in embodiment 1, and the description thereof will not be repeated.
The adjusting assembly 23 includes two reels 234 for winding two ends of the receiving plate 21 and a second driving member 235 for driving the reels 234 to rotate, wherein two ends of the receiving plate 21 are fixedly connected to the reels 234, or the reels 234 are detachably connected with reels for winding the receiving plate 21. The second driving member 235 is also a driving motor, and the second driving member 235 is provided with two rollers and is fixedly connected with the two rollers 234 respectively, so that the roller 234 at one end can be wound after unwinding. In this regard, the scrapers 241 are provided in two and are provided at both ends of the heat conductive plate 25, respectively.
Example 3:
referring to fig. 7, in the present embodiment, two ends of the receiving plate 21 are fixed to form a closed loop, and at this time, the adjusting assembly 23 includes a rotating shaft 236 around which the receiving plate 21 is wound and a third driving member 237 for driving the rotating shaft 236 to rotate, one third driving member 237 is provided, and the third driving member 237 may also be provided for a driving motor.
Example 4:
Referring to fig. 8, the difference from embodiment 2 is that the first air bag is provided with elastic bumps 3, the elastic bumps 3 are provided with a plurality of elastic bumps 3 at intervals along the length direction of the first air bag, and the elastic bumps 3 are used for abutting against the side wall of the dispensing head 12. The elastic bump 3 may be provided as a second air bag, and the second air bag is connected to the first air bag, or adjacent second air bags are connected.
Further, with use, the first air bag or the second air bag is broken or deformed, and for this purpose, the first air bag may be detachably connected to the receiving plate 21, and may be specifically adhered to the receiving plate 21 by an adhesive tape.
The above embodiments are not intended to limit the scope of the application, so that the equivalent changes of the structure, shape and principle of the application are covered by the scope of the application.
Claims (6)
1. A semiconductor dispensing laminating device is characterized by comprising a workbench (1), a conveying mechanism (11) arranged on the workbench (1) and used for conveying tools with chips, a dispensing head (12) and a suction nozzle (13) which are arranged above the conveying mechanism (11), a mounting frame (14) arranged on the workbench (1) and used for mounting the dispensing head (12) and the suction nozzle (13), and two driving mechanisms (15) arranged on the mounting frame (14) and used for respectively driving the dispensing head (12) and the suction nozzle (13) to do reciprocating sliding motion, wherein the conveying mechanism (11) comprises a plurality of guide rails (111) which are arranged at intervals along the length direction of the mounting frame (14), the dispensing head (12) and the suction nozzle (13) are respectively arranged on two sides of the mounting frame (14), a cleaning mechanism (2) is arranged on the conveying mechanism (11) on the travelling path of the dispensing head (12), the cleaning mechanism (2) is used for cleaning residual glue on the dispensing head (12), and the cleaning mechanism (2) comprises a plurality of guide rails (111) which are arranged along with the length direction of the mounting frame (14) and are arranged on two sides of the mounting frame (14) at intervals, and a plurality of glue scraping plates (21) which are used for being separated from the dispensing head (12) and are arranged on a plurality of elastic scraping plates (21) and are used for taking up and connecting glue plates (21) and are arranged on the adhesive scraping plates (21) The device comprises an adjusting component (23) for adjusting the horizontal position of a bearing plate (21) and a collecting component (24) for collecting glue on the bearing plate (21) and an elastic scraping plate (22), wherein the elastic scraping plate (22) is arranged on one side, close to a conveying mechanism (11), of the bearing plate (21);
The collecting assembly (24) comprises a scraping plate (241) abutted against the bearing plate (21), a guide plate (242) arranged on the scraping plate (241) and a collecting groove (243) for bearing glue guided by the guide plate (242), and the scraping plate (241) is used for being abutted against the elastic scraping plate (22);
The elastic scraping plate (22) is a first air bag at the top of the bearing plate (21), air is filled in the first air bag, the first air bag is arranged along the whole length of the length direction of the bearing plate (21), elastic protruding points (3) are arranged on the first air bag, a plurality of elastic protruding points (3) are arranged at intervals along the length direction of the first air bag, the elastic protruding points (3) are used for being abutted against the side wall of the dispensing head (12), the elastic protruding points (3) are second air bags, and the second air bags are communicated with the first air bags;
One end of the bearing plate (21) close to the conveying mechanism (11) is obliquely upwards arranged, a heat conducting plate (25) which is in butt joint with the bearing plate (21) to conduct heat is arranged below the bearing plate (21), and two scraping plates (241) are arranged at two ends of the heat conducting plate (25) respectively.
2. The semiconductor dispensing and bonding equipment according to claim 1, wherein the receiving plate (21) and the elastic scraping plate (22) are non-adhesive plates, the receiving plate (21) and the elastic scraping plate (22) have thermal conductivity, the receiving plate (21) is internally provided with a containing cavity (211), and an input pipe (212) for conveying high-temperature medium into the containing cavity (211) and an output pipe (213) for outputting the medium after heat exchange are arranged outside the receiving plate (21).
3. The semiconductor dispensing and bonding equipment according to claim 1, wherein one end of the receiving plate (21) close to the conveying mechanism (11) is obliquely upwards, the collecting groove (243) is formed in one side of the receiving plate (21) far away from the conveying mechanism (11), the collecting groove (243) is formed in the whole length of the receiving plate (21) in the length direction, the guide plate (242) is formed in one side of the scraping plate (241) far away from the collecting groove (243), the guide plate (242) is arranged in an arc shape in the direction far away from the collecting groove (243), one end of the guide plate (242) is arranged close to the elastic scraping plate (22), the other end of the guide plate (242) is arranged close to the collecting groove (243), and an angle between the guide plate (242) and the scraping plate (241) is acute.
4. A semiconductor dispensing and bonding apparatus according to claim 1, wherein the receiving plate (21) is a flexible plate, and the adjusting assembly (23) comprises two reels (234) for respectively winding two ends of the receiving plate (21) and a second driving member (235) for driving the reels (234) to rotate.
5. The dispensing and attaching apparatus of claim 1, wherein the receiving plate (21) has two ends fixed to be in a closed loop configuration, and the adjusting assembly (23) includes a rotating shaft (236) around which the receiving plate (21) is wound, and a third driving member (237) for driving the rotating shaft (236) to rotate.
6. A semiconductor dispensing and bonding apparatus according to any one of claims 1 to 5, wherein the first air bag is detachably connected to the receiving plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510331922.9A CN119819543B (en) | 2025-03-20 | 2025-03-20 | Semiconductor dispensing laminating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510331922.9A CN119819543B (en) | 2025-03-20 | 2025-03-20 | Semiconductor dispensing laminating equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN119819543A CN119819543A (en) | 2025-04-15 |
| CN119819543B true CN119819543B (en) | 2025-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202510331922.9A Active CN119819543B (en) | 2025-03-20 | 2025-03-20 | Semiconductor dispensing laminating equipment |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004188369A (en) * | 2002-12-13 | 2004-07-08 | Seiko Epson Corp | Liquid ejector |
| CN207430626U (en) * | 2017-10-23 | 2018-06-01 | 大冶市国冠制盖有限公司 | A kind of doctor blade device of coating machine |
| CN113751615A (en) * | 2021-09-28 | 2021-12-07 | 江苏科瑞智能装备有限公司 | Automatic demoulding device of numerical control turret punch press |
| CN220554756U (en) * | 2023-08-04 | 2024-03-05 | 深圳市金东存储科技有限公司 | A high-precision dispensing device for electronic components |
| CN222112412U (en) * | 2024-04-15 | 2024-12-06 | 浙江巨合新能源有限公司 | Coating head residual glue leaking and recycling device and coating machine |
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| CN100438985C (en) * | 2007-02-16 | 2008-12-03 | 友达光电股份有限公司 | Scraping structure of nozzle scraping machine |
| CN112439622A (en) * | 2020-11-20 | 2021-03-05 | 北京朋禹利明文化有限公司 | Steel pipe rust cleaning all-in-one that sprays paint for five metals production |
| CN222306754U (en) * | 2024-05-20 | 2025-01-07 | 廊坊德比利装饰材料有限公司 | A scraper for cleaning the dipping tank of a dipping machine |
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| JP2004188369A (en) * | 2002-12-13 | 2004-07-08 | Seiko Epson Corp | Liquid ejector |
| CN207430626U (en) * | 2017-10-23 | 2018-06-01 | 大冶市国冠制盖有限公司 | A kind of doctor blade device of coating machine |
| CN113751615A (en) * | 2021-09-28 | 2021-12-07 | 江苏科瑞智能装备有限公司 | Automatic demoulding device of numerical control turret punch press |
| CN220554756U (en) * | 2023-08-04 | 2024-03-05 | 深圳市金东存储科技有限公司 | A high-precision dispensing device for electronic components |
| CN222112412U (en) * | 2024-04-15 | 2024-12-06 | 浙江巨合新能源有限公司 | Coating head residual glue leaking and recycling device and coating machine |
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| CN119819543A (en) | 2025-04-15 |
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