CN119758043A - Chip package's testing arrangement - Google Patents
Chip package's testing arrangement Download PDFInfo
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- CN119758043A CN119758043A CN202510251857.9A CN202510251857A CN119758043A CN 119758043 A CN119758043 A CN 119758043A CN 202510251857 A CN202510251857 A CN 202510251857A CN 119758043 A CN119758043 A CN 119758043A
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Abstract
The invention relates to the technical field of chip packaging, in particular to a chip packaging testing device, which comprises a workbench, wherein a clamping mechanism is arranged at the upper end of the workbench, an L-shaped frame is fixedly connected to the position, close to one side, of the upper end of the workbench, a cleaning mechanism is arranged at the lower end of the workbench, the cleaning mechanism comprises an air inlet pipe, a collecting box is fixedly connected to the outer side of the air inlet pipe, a baffle is fixedly connected to the upper end of the collecting box, two groups of symmetrical clamping grooves are formed in the position, close to the upper end, of the inner wall of the collecting box, a motor is arranged at the upper end of the L-shaped frame, a second electric telescopic rod is arranged at the lower end of the L-shaped frame, an outer shell of the second electric telescopic rod is fixedly connected to an output shaft of the motor, two groups of symmetrical polishing sheets are fixedly connected to the inner side of the electric telescopic rod, and debris inside the collecting box is cleaned by the two groups of clamping plates through mutual matching of the two groups of L-shaped sweeping rods.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a chip packaging testing device.
Background
In order to avoid the damage of the chip caused by external scratch, protection needs to be applied to the chip, namely, the chip needs to be packaged, and the chip packaging test is to perform function and performance test on the packaged chip, and in the chip packaging test process, after the wafer manufacturing is completed, the probe is contacted with the bonding pad on the chip, so that the function of the chip is tested.
When the existing chip is tested, the chip needs to be clamped and fixed, the quality of the chip needs to be tested under the clamping condition, burrs left in the chip production need to be cleaned, and therefore, the chip packaging testing device is provided.
Disclosure of Invention
In order to overcome the defects in the prior art and solve at least one technical problem in the background art, the invention provides a chip packaging testing device.
The technical scheme includes that the chip packaging testing device comprises a workbench, a clamping mechanism is arranged at the upper end of the workbench, an L-shaped frame is fixedly connected to the position, close to one side, of the upper end of the workbench, a cleaning mechanism is arranged at the lower end of the workbench, the cleaning mechanism comprises an air inlet pipe, a collecting box is fixedly connected to the outer side of the air inlet pipe, a baffle is fixedly connected to the upper end of the collecting box, two groups of symmetrical clamping grooves are formed in the position, close to the upper end, of the inner wall of the collecting box, a motor is arranged at the upper end of the L-shaped frame, a second electric telescopic rod is arranged at the lower end of the L-shaped frame, an output shaft of the motor is fixedly connected with a shell of the second electric telescopic rod, an output shaft of the second electric telescopic rod is fixedly connected with an electric clamping block, and two groups of symmetrical polishing sheets are fixedly connected to the inner side of the electric clamping block.
Preferably, the fixture includes the first fixed block with workstation fixed connection, first electric telescopic handle is installed to the rear end of first fixed block, the first slider of output shaft fixedly connected with of first electric telescopic handle, the lower extreme sliding connection of first slider has the second fixed block, the lower extreme and the workstation fixed connection of second fixed block, the upper end fixedly connected with first fixed plate of first slider, the front end fixedly connected with first mount of first fixed plate, the front end fixedly connected with first splint of first mount.
Preferably, the upper end of the first sliding block is close to the first fixed shaft of position fixedly connected with in the middle, the outside of first fixed shaft rotates and is connected with first fixed cover, the outside fixedly connected with first movable rod of first fixed cover, the other end fixedly connected with second fixed cover of first movable rod, the inboard of second fixed cover rotates and is connected with the second fixed shaft, the lower extreme fixedly connected with movable plate of second fixed shaft, the inboard and the intake pipe rotation of movable plate are connected.
Preferably, the upper end of the movable plate is close to a third fixed shaft which is fixedly connected with a third fixed sleeve, a second movable rod is fixedly connected to the outer side of the third fixed sleeve, a fourth fixed sleeve is fixedly connected to the other end of the second movable rod, a fourth fixed shaft is rotatably connected to the inner side of the fourth fixed sleeve, a second sliding block is fixedly connected to the lower end of the fourth fixed shaft, a second fixed plate is fixedly connected to the upper end of the second sliding block, a second fixed frame is fixedly connected to the rear end of the second fixed plate, a second clamping plate is fixedly connected to the rear end of the second fixed frame, a third fixed block is fixedly connected to the lower end of the second sliding block, and the lower end of the third fixed block is fixedly connected with the workbench.
Preferably, the front end of the first fixing plate is fixedly connected with a first L-shaped sweeping rod.
Preferably, the rear end fixedly connected with second L type of second fixed plate sweeps the pole, first fixed plate and the equal sliding connection of second fixed plate are in the inboard of collecting the box.
Preferably, the cleaning mechanism comprises an air pump arranged at the lower end of the workbench, an air outlet of the air pump is fixedly connected with an exhaust pipe, the front end of the exhaust pipe is fixedly connected with a baffle, an air inlet pipe of the air pump is fixedly connected with an air inlet pipe, the outer side of the air inlet pipe penetrates through the movable plate, the upper end of the air inlet pipe is fixedly connected with a funnel, and the outer side of the air inlet pipe is fixedly connected with a filter vat.
Preferably, the upper end of the filter vat is rotatably connected with a rotating shaft, the lower end of the rotating shaft is fixedly connected with a blade, the inner side of the filter vat is provided with a spray header, and the outer side of the filter vat is fixedly connected with a drain pipe.
Preferably, a filter disc is fixedly connected to the inner side of the filter barrel close to the lower end.
Compared with the prior art, the invention provides a chip packaging testing device, which has the following beneficial effects:
1. Through the mutually supporting of first slider and second slider, make first splint and second splint can remove simultaneously, carry out the centre gripping to chip package when removing, avoid the chip skew, apply the pressure of settlement to chip through first splint and second splint and carry out the centre gripping to the quality of chip checks, through the mutually supporting of motor and electric telescopic handle, make electric clamp splice polish the burring through polishing the piece to chip package when pivoted, further promoted the quality of encapsulation.
2. Through the mutually supporting of pole is swept to first L type and second L type, make first splint and second splint clear up the piece of collecting box inside, make the piece clear up in can concentrating to retrieve, avoid leaving behind impurity and influence follow-up test effect.
3. Through the mutually supporting of air pump and intake pipe, make the inside piece of collecting box enter into inside the filter vat and obtain concentrated collection processing, filter small granule piece and dust through the mutually supporting of blade and shower, clean gas is discharged to the baffle inside through the blast pipe, carries out more comprehensive clearance to collecting box inside to carry out comprehensive removal to the remaining tiny particulate matter in chip outside, improve the quality of chip.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a chip package testing apparatus according to the present invention;
FIG. 2 is a schematic cross-sectional view of an overall structure of a chip package testing apparatus according to the present invention;
FIG. 3 is a schematic diagram of the overall structure of a clamping mechanism of a chip package testing device according to the present invention;
FIG. 4 is an enlarged schematic view of a portion of a clamping mechanism of a chip package testing device according to the present invention;
FIG. 5 is a schematic cross-sectional view of the whole structure of a cleaning mechanism of a chip package test device according to the present invention;
Fig. 6 is a schematic cross-sectional view of a portion of a chip package testing apparatus according to the present invention.
The electric grinding machine comprises a workbench, a 2, a clamping mechanism, a 21, a first fixed block, a 22, a first electric telescopic rod, a 23, a first sliding block, a 24, a second fixed block, a 25, a first fixed plate, a 26, a first fixed frame, a 27, a first clamping plate, a 28, a first fixed shaft, a 29, a first fixed sleeve, a 210, a first moving rod, a 211, a second fixed shaft, a 212, a second fixed sleeve, a 213, a moving plate, a 214, a third fixed sleeve, a 215, a third fixed shaft, a 216, a second moving rod, a 217, a fourth fixed shaft, a 218, a fourth fixed sleeve, a 219, a second sliding block, a 220, a second fixed plate, a 221, a second fixed frame, a 222, a second clamping plate, a 223, a third fixed block, a 224, a first L-shaped sweeping rod, a 225, a second L-shaped sweeping rod, a 3, a collecting box, a 4, a baffle, a5, an L-shaped frame, a 6, a cleaning mechanism, a 61, an air pump, a 62, an exhaust pipe, a 63, an air inlet pipe, a 64, a filtering barrel, a 65, a 66, a rotating shaft, a vane, a motor, a 67, a spray head, a 68, a fan, a 68, an electric fan, a spray head, a 8, a fan, a 8, a telescopic rod, a 8, a grinding drum, a magnetic chuck, a 8, a magnetic chuck.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1-6, a testing device for chip package includes a workbench 1, a clamping mechanism 2 is installed at the upper end of the workbench 1, an L-shaped frame 5 is fixedly connected to the upper end of the workbench 1 near one side, a cleaning mechanism 6 is installed at the lower end of the workbench 1, the cleaning mechanism 6 includes an air inlet pipe 63, a collecting box 3 is fixedly connected to the outer side of the air inlet pipe 63, a baffle 4 is fixedly connected to the upper end of the collecting box 3, two groups of symmetrical clamping grooves are formed in the position, near the upper end, of the inner wall of the collecting box 3, a motor 7 is installed at the upper end of the L-shaped frame 5, a second electric telescopic rod 8 is installed at the lower end of the L-shaped frame 5, a housing of the second electric telescopic rod 8 is fixedly connected to an output shaft of the second electric telescopic rod 8, and two groups of symmetrical polishing sheets 10 are fixedly connected to the inner side of the electric telescopic rod 9.
In this embodiment, the clamping mechanism 2 includes a first fixed block 21 fixedly connected with the workbench 1, a first electric telescopic rod 22 is installed at the rear end of the first fixed block 21, a first sliding block 23 is fixedly connected with an output shaft of the first electric telescopic rod 22, a second fixed block 24 is slidably connected with the lower end of the first sliding block 23, the lower end of the second fixed block 24 is fixedly connected with the workbench 1, a first fixed plate 25 is fixedly connected with the upper end of the first sliding block 23, a first fixing frame 26 is fixedly connected with the front end of the first fixed plate 25, and a first clamping plate 27 is fixedly connected with the front end of the first fixing frame 26.
Specifically, a first electric telescopic rod 22 installed at the rear end of the first fixed block 21 is started, an output shaft of the first electric telescopic rod 22 drives a first sliding block 23 to slide above a second fixed block 24, when the first sliding block 23 slides, the first sliding block 23 drives a first fixed plate 25 to move, the first fixed plate 25 drives a first fixed frame 26 to move forwards, and the first fixed frame 26 drives a first clamping plate 27 to move.
In this embodiment, a first fixed shaft 28 is fixedly connected to the upper end of the first slider 23 near the middle, a first fixed sleeve 29 is rotatably connected to the outer side of the first fixed shaft 28, a first moving rod 210 is fixedly connected to the outer side of the first fixed sleeve 29, a second fixed sleeve 212 is fixedly connected to the other end of the first moving rod 210, a second fixed shaft 211 is rotatably connected to the inner side of the second fixed sleeve 212, a moving plate 213 is fixedly connected to the lower end of the second fixed shaft 211, and the inner side of the moving plate 213 is rotatably connected to the air inlet pipe 63.
Specifically, the first slider 23 drives the first fixed sleeve 29 to move through the first fixed shaft 28, the first fixed sleeve 29 drives the second fixed sleeve 212 to move through the first moving rod 210, and the second fixed sleeve 212 drives the moving plate 213 to rotate through the second fixed shaft 211.
In this embodiment, a third fixing shaft 215 is fixedly connected to a position of the upper end of the moving plate 213 near one side, a third fixing sleeve 214 is rotatably connected to the outer side of the third fixing shaft 215, a second moving rod 216 is fixedly connected to the outer side of the third fixing sleeve 214, a fourth fixing sleeve 218 is fixedly connected to the other end of the second moving rod 216, a fourth fixing shaft 217 is rotatably connected to the inner side of the fourth fixing sleeve 218, a second slider 219 is fixedly connected to the lower end of the fourth fixing shaft 217, a second fixing plate 220 is fixedly connected to the upper end of the second slider 219, a second fixing frame 221 is fixedly connected to the rear end of the second fixing plate 220, a second clamping plate 222 is fixedly connected to the rear end of the second fixing frame 221, a third fixing block 223 is slidably connected to the lower end of the second slider 219, and the lower end of the third fixing block 223 is fixedly connected to the workbench 1.
Specifically, when the moving plate 213 rotates, the third fixing sleeve 214 is driven to move by the third fixing shaft 215, the third fixing sleeve 214 pulls the fourth fixing shaft 217 by the second moving rod 216, and the fourth fixing shaft 217 drives the second slider 219 to move backward at the upper end of the third fixing block 223, so that the second slider 219 drives the second fixing plate 220 to move, and the second fixing plate 220 drives the second fixing frame 221 to move.
In this embodiment, the front end of the first fixing plate 25 is fixedly connected with a first L-shaped sweeping rod 224.
Specifically, the first fixing plate 25 drives the first L-shaped sweeping bar 224 to move forward.
In this embodiment, the second L-shaped sweeping bar 225 is fixedly connected to the rear end of the second fixing plate 220, and the first fixing plate 25 and the second fixing plate 220 are both slidably connected to the inner side of the collecting box 3.
Specifically, the second fixing plate 220 drives the second L-shaped sweeping bar 225 to move backward, the debris at the bottom of the collection box 3 is pushed into the funnel 610, the air pump 61 is started, and the air pump 61 sucks the debris inside the collection box 3 into the filter vat 64 through the air inlet pipe 63.
In this embodiment, the cleaning mechanism 6 includes an air pump 61 installed at the lower end of the workbench 1, an output port of the air pump 61 is fixedly connected with an exhaust pipe 62, a front end of the exhaust pipe 62 is fixedly connected with the baffle 4, an inlet air pipe 63 of the air pump 61 is fixedly connected with an inlet air pipe 63, an outer side of the air pipe 63 penetrates through the movable plate 213, an upper end of the air pipe 63 is fixedly connected with a funnel 610, and an outer side of the air pipe 63 is fixedly connected with a filter barrel 64.
Specifically, the filtered gas is discharged into the baffle 4 through the exhaust pipe 62, and the fine particles remained outside the chip are comprehensively removed, so that the quality of the chip is improved.
In this embodiment, the upper end of the filter vat 64 is rotatably connected with a rotating shaft 65, the lower end of the rotating shaft 65 is fixedly connected with a vane 66, the inner side of the filter vat 64 is provided with a spray header 67, and the outer side of the filter vat 64 is fixedly connected with a drain pipe 69.
Specifically, the large pieces of debris fall directly over the filter 68, the air flow drives the blades 66 to rotate to break up the water sprayed from the spray header 67, and the filtered water is discharged through the drain pipe 69.
In this embodiment, a filter 68 is fixedly attached to the inner side of the filter tub 64 near the lower end.
Specifically, small debris and dust particles increase in weight when they encounter water and fall onto the filter sheet 68 for concentrated collection.
When the working principle is used, a chip is placed on the inner side of the electric clamping block 9, the second electric telescopic rod 8 is started, the output shaft of the second electric telescopic rod 8 drives the electric clamping block 9 to move downwards, the chip is placed in the clamping groove at the upper end of the collecting box 3, the first electric telescopic rod 22 arranged at the rear end of the first fixed block 21 is started, the output shaft of the first electric telescopic rod 22 drives the first sliding block 23 to slide above the second fixed block 24, the first sliding block 23 drives the first fixed plate 25 to move when sliding, the first fixed plate 25 drives the first fixed frame 26 to move forwards, the first fixed frame 26 drives the first clamping plate 27 to move, the first sliding block 23 drives the first fixed sleeve 29 to move through the first fixed shaft 28, the first fixed sleeve 29 drives the second fixed sleeve 212 to move through the first moving rod 210, the second fixed sleeve 212 drives the moving plate 213 to rotate through the second fixed shaft 211, when the moving plate 213 rotates, the third fixing sleeve 214 is driven to move by the third fixing shaft 215, the third fixing sleeve 214 pulls the fourth fixing shaft 217 by the second moving rod 216, the fourth fixing shaft 217 drives the second slider 219 to move backward at the upper end of the third fixing block 223, the second slider 219 drives the second fixing plate 220 to move, the second fixing plate 220 drives the second fixing frame 221 to move, the second fixing frame 221 drives the second clamping plate 222 to move, so that the first clamping plate 27 and the second clamping plate 222 clamp the chip, the quality of the chip is detected by the set force during clamping, if the chip package is provided with oxidation scratch, the chip package is extruded and broken by the pressure exerted by the first clamping plate 27 and the second clamping plate 222, if the quality is qualified, the chip package is intact, and the qualified chip package is clamped by the first clamping plate 27 and the second clamping plate 222, the output shaft of the second electric telescopic rod 8 is utilized to drive the electric clamping block 9 to continuously clamp the chip, the motor 7 is started, the output shaft of the motor 7 drives the second electric telescopic rod 8 to rotate, the second electric telescopic rod 8 drives the electric clamping block 9 to rotate, the electric clamping block 9 polishes and removes burrs on the outer side of the chip through the polishing sheet 10, after polishing, generated chips and unqualified chip packaging chips which are extruded and broken are concentrated in the inner part of the collecting box 3, the first electric telescopic rod 22 is started again, the first fixing plate 25 and the second fixing plate 220 respectively drive the first L-shaped sweeping rod 224 and the second L-shaped sweeping rod 225 to move in opposite directions, the chips at the bottom of the collecting box 3 are pushed into the funnel 610, the air pump 61 is started, the air pump 61 sucks the chips inside the collecting box 3 into the filter drum 64 through the air inlet pipe 63, the large chips directly drop above the filter disc 68, the air flow drives the blades 66 to rotate to scatter water sprayed out of the small chips and the weight of the small chips, the small chips and the particles are all dropped onto the filter disc 68 to be concentrated and collected, filtered water is discharged from the drain pipe 69 to the inner part of the chip 4, and the dust particles are discharged from the inside the filter pipe 4 to the filter pipe 4 after the filtered water is discharged to the outside, and the dust particles are completely removed.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a chip package's testing arrangement, includes workstation (1), wherein fixture (2) are installed to the upper end of workstation (1), the upper end of workstation (1) is close to one side the position fixedly connected with L type frame (5), clearance mechanism (6) are installed to the lower extreme of workstation (1), clearance mechanism (6) include intake pipe (63), the outside fixedly connected with of intake pipe (63) collects box (3), the upper end fixedly connected with baffle (4) of collecting box (3), two sets of symmetrical draw-in grooves have been seted up to the position that the inner wall of collecting box (3) is close to the upper end, motor (7) are installed to the upper end of L type frame (5), second electric telescopic handle (8) are installed to the lower extreme of L type frame (5), the shell of the output shaft fixedly connected with second electric telescopic handle (8) of motor (7), the output shaft fixedly connected with electric clamping block (9) of second electric telescopic handle (8), two sets of symmetrical abrasive disc (10) are beaten to the inboard fixedly connected with electric clamping block (9).
2. The device for testing the chip package according to claim 1, wherein the clamping mechanism (2) comprises a first fixing block (21) fixedly connected with the workbench (1), a first electric telescopic rod (22) is installed at the rear end of the first fixing block (21), a first sliding block (23) is fixedly connected with an output shaft of the first electric telescopic rod (22), a second fixing block (24) is slidingly connected with the lower end of the first sliding block (23), the lower end of the second fixing block (24) is fixedly connected with the workbench (1), a first fixing plate (25) is fixedly connected with the upper end of the first sliding block (23), a first fixing frame (26) is fixedly connected with the front end of the first fixing plate (25), and a first clamping plate (27) is fixedly connected with the front end of the first fixing frame (26).
3. The device for testing chip package according to claim 2, wherein the upper end of the first slider (23) is fixedly connected with a first fixed shaft (28) near the middle, the outer side of the first fixed shaft (28) is rotatably connected with a first fixed sleeve (29), the outer side of the first fixed sleeve (29) is fixedly connected with a first movable rod (210), the other end of the first movable rod (210) is fixedly connected with a second fixed sleeve (212), the inner side of the second fixed sleeve (212) is rotatably connected with a second fixed shaft (211), the lower end of the second fixed shaft (211) is fixedly connected with a movable plate (213), and the inner side of the movable plate (213) is rotatably connected with the air inlet pipe (63).
4. The device for testing chip package according to claim 3, wherein a third fixing shaft (215) is fixedly connected to a position, close to one side, of the upper end of the moving plate (213), a third fixing sleeve (214) is rotatably connected to the outer side of the third fixing shaft (215), a second moving rod (216) is fixedly connected to the outer side of the third fixing sleeve (214), a fourth fixing sleeve (218) is fixedly connected to the other end of the second moving rod (216), a fourth fixing shaft (217) is rotatably connected to the inner side of the fourth fixing sleeve (218), a second slider (219) is fixedly connected to the lower end of the fourth fixing shaft (217), a second fixing plate (220) is fixedly connected to the upper end of the second slider (219), a second fixing frame (221) is fixedly connected to the rear end of the second fixing plate (220), a second clamping plate (222) is fixedly connected to the rear end of the second fixing frame (221), a third fixing block (223) is slidably connected to the lower end of the second slider (219), and the lower end of the third fixing block (223) is fixedly connected to the workbench (1).
5. The device for testing chip package according to claim 2, wherein the front end of the first fixing plate (25) is fixedly connected with a first L-shaped sweeping rod (224).
6. The device for testing chip package according to claim 4, wherein the second L-shaped sweeping rod (225) is fixedly connected to the rear end of the second fixing plate (220), and the first fixing plate (25) and the second fixing plate (220) are both slidably connected to the inner side of the collecting box (3).
7. The device for testing the chip package according to claim 1, wherein the cleaning mechanism (6) comprises an air pump (61) arranged at the lower end of the workbench (1), an air outlet of the air pump (61) is fixedly connected with an air outlet pipe (62), the front end of the air outlet pipe (62) is fixedly connected with the baffle plate (4), an air inlet pipe (63) of the air pump (61) is fixedly connected with the air inlet pipe, the outer side of the air inlet pipe (63) penetrates through the movable plate (213), the upper end of the air inlet pipe (63) is fixedly connected with a funnel (610), and the outer side of the air inlet pipe (63) is fixedly connected with a filter barrel (64).
8. The device for testing chip package according to claim 7, wherein the upper end of the filter vat (64) is rotatably connected with a rotating shaft (65), the lower end of the rotating shaft (65) is fixedly connected with a blade (66), a spray header (67) is mounted on the inner side of the filter vat (64), and a drain pipe (69) is fixedly connected on the outer side of the filter vat (64).
9. The device for testing chip package according to claim 8, wherein a filter (68) is fixedly connected to the inner side of the filter tub (64) near the lower end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510251857.9A CN119758043A (en) | 2025-03-05 | 2025-03-05 | Chip package's testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510251857.9A CN119758043A (en) | 2025-03-05 | 2025-03-05 | Chip package's testing arrangement |
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| CN119758043A true CN119758043A (en) | 2025-04-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202510251857.9A Pending CN119758043A (en) | 2025-03-05 | 2025-03-05 | Chip package's testing arrangement |
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Application publication date: 20250404 |