CN119677051A - A handheld terminal self-heating structure - Google Patents
A handheld terminal self-heating structure Download PDFInfo
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- CN119677051A CN119677051A CN202411842977.8A CN202411842977A CN119677051A CN 119677051 A CN119677051 A CN 119677051A CN 202411842977 A CN202411842977 A CN 202411842977A CN 119677051 A CN119677051 A CN 119677051A
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Abstract
The invention discloses a self-radiating structure of a handheld terminal, which relates to the technical field of parts of an electric equipment shell, wherein an infrared probe and a loudspeaker are arranged on the front surface of a main shell, the temperature of a fire scene can be monitored through infrared scanning acquisition, when the temperature of a region in front of a firefighter reaches an early warning threshold value, the loudspeaker can give an alarm to the firefighter to remind the firefighter to avoid a high-temperature dangerous region in time, the safety of the firefighter in rescue of the fire scene is improved, a circuit board is sealed in a relatively independent space through a heat insulation cabin box, the conduction of low-boiling-point liquid filled in the first C-shaped copper pipe, the second C-shaped copper pipe and the inside is utilized, and the active refrigeration and the cooling of a semiconductor refrigerating sheet are realized, so that the temperature of the inside of the heat insulation cabin box is prevented from being too high in an active refrigeration mode, and the running stability of the device in an extremely high-temperature fire scene is improved.
Description
Technical Field
The invention relates to the technical field of parts of an electric equipment shell, in particular to a self-radiating structure of a handheld terminal.
Background
In modern fire rescue operation, the handheld terminal is an electronic device for communication, data acquisition and transmission and position positioning of firefighters in a fire scene, and the stability of performance of the handheld terminal is directly related to the efficiency and safety of fire scene rescue actions.
In general, a fire scene is an extremely severe high-temperature environment, when a fire happens, the temperature of surrounding air is increased sharply due to heat generated by combustion of a combustion object, the handheld terminal faces a severe heat dissipation problem due to the excessively high ambient temperature, the traditional handheld terminal mainly dissipates heat by means of airflow, however, the traditional handheld terminal is affected by the high-temperature environment of the fire scene, so that the conventional heat dissipation mode cannot meet the operation requirement of the handheld terminal for fire fighting and disaster relief, the operation stability of internal electronic elements is seriously affected by continuous high Wen Qinru handheld terminal, the safety and stability of the handheld terminal in use in the fire scene are affected by high temperature and heat radiation, and even extremely interference is caused to rescue actions in serious cases.
Therefore, a self-heat dissipation structure of a handheld terminal is proposed to solve some of the problems in the prior art.
Disclosure of Invention
The invention aims to solve the defects that the internal heat dissipation structure of a handheld terminal is poor in operation efficiency, so that the internal electronic element of the handheld terminal is easy to be at high temperature, and the stability and safety of the handheld terminal during fire rescue are affected in the prior art.
In order to solve the problems existing in the prior art, the invention adopts the following technical scheme:
A self-radiating structure of a handheld terminal comprises a main shell, wherein a rear cover is fixedly arranged on the back surface of the main shell, an elastic hook is arranged on the back surface of the rear cover, an infrared probe is fixedly arranged at the upper position of the front surface of the main shell, a loudspeaker is arranged in the main shell, an antenna which is vertically arranged is arranged at the top of the main shell, a heat insulation cabin box is fixedly arranged in the main shell, a circuit board connected with the infrared probe, the loudspeaker and the antenna is arranged in the heat insulation cabin box, a wireless transmission module, a positioning module and a charging and discharging module are integrated in the circuit board, a storage battery connected with the charging and discharging module is arranged in the heat insulation cabin box, a charging port connected with the charging and discharging module is arranged on the main shell, a plurality of uniformly distributed first C-shaped copper pipes are fixedly arranged in the heat insulation cabin box, a second C-shaped copper pipes which are communicated with the plurality of first C-shaped copper pipes one to one, low boiling point liquid is filled in the first C-shaped copper pipes, a semiconductor refrigerating piece is arranged in the main shell, a heat absorption surface of the semiconductor refrigerating piece is attached to the second C-shaped copper pipes, and the heat absorption surface of the semiconductor refrigerating piece faces away from the outer side of the main shell.
Preferably, the main housing, the rear cover, and the exterior of the antenna are all made of engineering plastics.
Preferably, a graphene layer and an aluminum foil layer are sequentially attached to the inner end walls of the main housing and the rear cover.
Preferably, a support arranged on the back of the heat insulation cabin box is fixedly arranged in the main shell, a plugboard is inserted in the support in a sliding manner, one end of the plugboard is exposed out of the main shell, the semiconductor refrigerating sheet is fixedly inlaid in the plugboard, a plug connected with the circuit board is fixedly arranged in the support, a socket matched with the plug is arranged on the plugboard, and the socket is connected with the semiconductor refrigerating sheet.
Preferably, two ends of the second C-shaped copper pipe are inserted into two ends of the corresponding first C-shaped copper pipe in a sliding manner, copper plates are connected between the plurality of second C-shaped copper pipes corresponding to the same semiconductor refrigerating piece, a reed for elastically supporting the copper plates is fixedly arranged on the back surface of the heat insulation cabin box, and the copper plates are tightly attached to the heat absorption surfaces of the semiconductor refrigerating pieces by means of the elastic support of the reed.
Preferably, the back cover is internally and fixedly provided with a copper box closely attached to the radiating surface of the semiconductor refrigerating plate, water is filled in the copper box, and the back surface of the back cover is screwed with a threaded cover communicated with the inside of the copper box.
Preferably, a plurality of volutes are fixedly arranged on the front inner end wall of the heat insulation cabin box, and fan wheels are rotatably arranged on the volutes.
Preferably, the air inlet of the volute faces the first C-shaped copper pipe, and the air outlet of the volute faces the inner side end wall of the heat insulation cabin box.
Preferably, the thickness of the volute is set to be 5mm, and a driving mechanism for driving the fan wheel to rotate is mounted on the heat insulation cabin box.
Preferably, a partition plate is fixedly arranged at the middle position in the heat insulation cabin box, two independent spaces which are not communicated with each other are formed in the heat insulation cabin box through the partition plate, a volute is arranged in each independent space, each independent space corresponds to one semiconductor refrigerating sheet, temperature differences exist in the two independent spaces, a driving mechanism comprises a heat pipe fixedly arranged in the two independent spaces, a first sliding block is slidably arranged in the heat pipe, low-boiling-point liquid positioned at one side of the first sliding block is filled in the heat pipe, a sliding groove which corresponds to the heat pipe is formed in the outer end wall of the heat insulation cabin box, a second sliding block is slidably arranged in the sliding groove, magnets which are magnetically attracted with each other are respectively arranged in the first sliding block and the second sliding block, a rack rod which is parallel to the sliding groove is fixed on the second sliding block, rotation of the fan wheels penetrates to the outer side of the heat insulation cabin box, a driving belt is connected between rotating shafts of two adjacent fan wheels, and a gear which is fixedly arranged on the rotating shaft of one fan wheel.
Compared with the prior art, the invention has the beneficial effects that:
1. According to the invention, the positioning module is integrated in the circuit board, so that the fire scene external command center can accurately monitor the position of a fire fighter in time, meanwhile, the infrared probe and the loudspeaker are arranged on the front surface of the main shell, the temperature of a fire scene can be monitored through infrared scanning acquisition, when the temperature of the area in front of the fire fighter reaches the early warning threshold value, the loudspeaker can give out alarm reminding to the fire fighter to remind the fire fighter to avoid a high-temperature dangerous area in time, the safety of the fire fighter in fire scene rescue is improved, the circuit board is sealed in a relatively independent space through the heat insulation cabin box, the conduction of the first C-shaped copper pipe, the second C-shaped copper pipe and the low-boiling point liquid filled in the heat insulation cabin box and the active refrigeration and cooling of the semiconductor refrigeration piece can be avoided, the purpose of cooling and heat dissipation inside the heat insulation cabin box can be realized through the active refrigeration mode, and the running stability of the device in an extremely high-temperature fire scene is improved;
2. According to the invention, the plugboard is slidably inserted into the bracket, and the semiconductor refrigeration piece is inlaid in the plugboard, so that the semiconductor refrigeration piece can be flexibly and conveniently replaced when damaged, the inside of the device is guaranteed to continuously and stably perform active cooling and heat dissipation, and meanwhile, the two ends of the second C-shaped copper pipe are slidably inserted into the two ends of the corresponding first C-shaped copper pipe and are matched with the elastic support of the reed, so that the copper plate fixedly connected with the second C-shaped copper pipe can be adaptively and tightly attached to the heat absorption surface of the semiconductor refrigeration piece, and the effect and stability of the heat absorption surface of the semiconductor refrigeration piece on the second C-shaped copper pipe in a refrigerating and cooling manner are guaranteed;
3. According to the invention, the ultrathin spiral case and the fan wheel are arranged in the heat insulation cabin box, and the air flow in the heat insulation cabin box can be driven to flow by means of the rotation of the fan wheel in the spiral case, so that the heat insulation cabin box is cooled and radiated more uniformly, meanwhile, the inside of the heat insulation cabin box is divided into two independent spaces which are not communicated with each other through the partition plate, and a temperature difference is formed, and the driving mechanism is driven to provide power for the rotation of the fan wheel, so that the device can not adopt a motor when providing rotary driving for the fan wheel, the space occupation of the spiral case and the fan wheel in the heat insulation cabin box can be effectively reduced, unnecessary heat generated during the operation of the motor can be prevented from influencing the heat radiation in the heat insulation cabin box, and the stability of the heat radiation operation in the device can be further ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a split view of the present invention from a front view;
FIG. 2 is a disassembled view of the inner structure of the main housing of the present invention from the front perspective;
FIG. 3 is a split view of the present invention from the back view;
FIG. 4 is a disassembled view of the back view of the internal structure of the main housing of the present invention;
FIG. 5 is a perspective view of the present invention;
FIG. 6 is a front view of the present invention;
FIG. 7 is a cross-sectional view taken at A-A of FIG. 6 in accordance with the present invention;
FIG. 8 is a cross-sectional view taken at B-B of FIG. 6 in accordance with the present invention;
FIG. 9 is a cross-sectional view taken at C-C of FIG. 6 in accordance with the present invention;
fig. 10 is a split view of the scroll and impeller of the present invention.
Number in the figure:
1. A main housing; 101, a rear cover, 102, an elastic hook, 103, an infrared probe, 104, a loudspeaker, 105 and an antenna;
2. A thermally insulated pod; 201, a circuit board, 202, a first C-shaped copper pipe, 203, a second C-shaped copper pipe, 204, a copper plate, 205, a reed, 206, a semiconductor refrigerating sheet, 207 and a baffle;
3. the socket comprises a bracket, 301, a plugboard, 302, a plug, 303 and a socket;
4. 401, fan wheel;
5. heat pipe 501, first slide block 502, slide groove 503, second slide block 504, rack bar 505, driving belt 506, gear;
6. copper box 601, screw cap.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
The embodiment provides a self-radiating structure of a handheld terminal, see fig. 1-10, and specifically, the self-radiating structure comprises a main shell 1, a rear cover 101 is fixedly arranged on the back surface of the main shell 1, an elastic hook 102 is arranged on the back surface of the rear cover 101, an infrared probe 103 is fixedly arranged above the front surface of the main shell 1, a loudspeaker 104 is arranged in the main shell 1, an antenna 105 which is vertically arranged is arranged at the top of the main shell 1, a heat insulation cabin box 2 is fixedly arranged in the main shell 1, a circuit board 201 connected with the infrared probe 103, the loudspeaker 104 and the antenna 105 is arranged in the heat insulation cabin box 2, a wireless transmission module, a positioning module and a charging and discharging module are integrated in the circuit board 201, a storage battery connected with the charging and discharging module is arranged in the heat insulation cabin box 2, a plurality of first C-shaped copper pipes 202 which are uniformly distributed are fixedly arranged in the main shell 1, a plurality of second C-shaped copper pipes 203 which are correspondingly communicated with the plurality of first C-shaped copper pipes 202 are arranged on the back surface of the heat insulation cabin box 2, the first C-shaped copper pipes 202 and the second C-shaped copper pipes 203 are arranged in the heat insulation cabin box 2 are arranged in a way, the heat insulation cabin box is arranged in a way, the second C-shaped copper pipes 206 is far away from the heat insulation cabin surface is far from the heat insulation cabin surface and has a semiconductor refrigerating surface and is arranged in the heat insulation cabin, and is far away from the heat insulation cabin, and has the semiconductor refrigerating surface and has the heat-insulating refrigerating and has the heat-insulating effect.
When the device is used, the device is suitable for a fire rescue scene, during daily use, the charging port arranged on the main shell 1 can be used for charging the storage battery arranged in the heat insulation cabin box 2, the storage battery can provide power support for the device, the device can be mounted on the chest shoulder part of a firefighter through the elastic hook 102 in the fire rescue process, the integrated positioning module in the circuit board 201 can position the device in a fire scene in real time, and data interaction is carried out between the wireless transmission module and the antenna 105 and an external server, so that a command center can conveniently know the position of the firefighter in time, the infrared probe 103 can detect the fire condition of the fire scene, monitor the temperature of the fire scene through infrared scanning, and process related data in the circuit board 201, and when the temperature of the area in front of the fire scene is acquired by the infrared probe 103, the firefighter can send an alarm to the firefighter through the loudspeaker 104 to remind the firefighter, the firefighter is carried out on a high-temperature dangerous area, and the safety of the firefighter in the fire scene rescue scene is facilitated to be avoided.
In the specific implementation process, as shown in fig. 1 and 3, the outer parts of the main casing 1, the rear cover 101 and the antenna 105 are all made of engineering plastics, a graphene layer and an aluminum foil layer are sequentially attached to the inner end walls of the main casing 1 and the rear cover 101, when the device is used, the whole protection performance of the device can be effectively improved by adopting the anti-falling and high-temperature-resistant engineering plastics to make the outer parts of the main casing 1, the rear cover 101 and the antenna 105, the device can be normally used in a high-temperature environment of a fire scene, and the graphene layer and the aluminum foil layer attached to the inside of the main shell 1 and the rear cover 101 can effectively absorb, reflect and shield heat radiation in the fire scene, so that excessive heat radiation in the fire scene is prevented from diffusing to the inside of the heat insulation cabin box 2, and the stability of the circuit board 201 in the heat insulation cabin box 2 during operation is guaranteed.
When the device is used, the inside of the device is in a relatively independent space, the high-temperature environment in a fire scene is not easy to influence the normal operation of the internal parts of the device, in order to avoid the influence of the high-temperature environment in the fire scene on the internal circuit board 201 of the heat insulation cabin box 2, the inside of the heat insulation cabin box 2 is kept in a relatively stable low-temperature environment in an active cooling mode, so that the stability of the operation of the internal circuit board 201 of the heat insulation cabin box 2 is ensured, in the operation process, a semiconductor refrigeration piece 206 arranged in the main shell 1 is electrified and started, based on the Peltier effect, when current passes through a thermocouple, one junction emits heat, and the other junction absorbs heat, so that one side of the semiconductor refrigeration piece 206 forms a heat absorption surface, the other side of the semiconductor refrigeration piece 206 forms a heat dissipation surface, and the heat absorption surface of the semiconductor refrigeration piece 206 is attached to the second C-shaped copper pipe 203 by virtue of the flowing conduction of the first C-shaped copper pipe 202 and the second C-shaped copper pipe 203 and the low-boiling point liquid in the heat insulation cabin box 2, so that the inside of the heat insulation cabin box 2 is in the low-temperature environment is ensured, and the first C-shaped copper pipe 202 and the second C-shaped copper pipe 203 can be filled with the low-boiling point liquid or the second alcohol-shaped alcohol-type alcohol-filled in the high-temperature circuit board 201.
The circuit board 201 is sealed in a sealed and heat-insulating independent space through the heat-insulating cabin box 2, the interference of the external fire scene high-temperature environment to the operation environment of the circuit board 201 inside the heat-insulating cabin box 2 can be reduced, meanwhile, the semiconductor refrigerating sheet 206 is arranged for refrigerating, the first C-shaped copper pipe 202, the second C-shaped copper pipe 203 and the flow conduction of the internal low-boiling-point liquid are matched, the internal temperature of the heat-insulating cabin box 2 can be prevented from being too high in an active refrigerating mode, the purpose of cooling and radiating the inside of the heat-insulating cabin box 2 is achieved, and the stability of the device in the operation of an extremely high-temperature fire scene can be improved.
In the specific implementation process, as shown in fig. 1-4, a bracket 3 arranged on the back of a heat insulation cabin box 2 is fixedly arranged in a main shell 1, a plugboard 301 is inserted in the bracket 3 in a sliding way, one end of the plugboard 301 is exposed out of the main shell 1, a semiconductor refrigerating sheet 206 is fixedly embedded in the plugboard 301, a plug 302 connected with a circuit board 201 is fixed in the bracket 3, a socket 303 matched with the plug 302 is arranged on the plugboard 301, and the socket 303 is connected with the semiconductor refrigerating sheet 206. The semiconductor refrigerating piece 206 in the device is in a replaceable mode, and the semiconductor refrigerating piece 206 is usually operated in a relatively extreme high-temperature environment in the use process due to the high-temperature environment subjected to fire rescue, and is easy to damage due to overload operation in a severe environment, so that the actual situation of the semiconductor refrigerating piece 206 needs to be detected after each fire rescue, and if the semiconductor refrigerating piece 206 is damaged or has poor effect, the semiconductor refrigerating piece 206 can be replaced in a pluggable connection mode, and the operation convenience of the device for replacing the semiconductor refrigerating piece 206 can be effectively improved.
In a specific implementation process, as shown in fig. 2, fig. 4 and fig. 7-fig. 9, two ends of a second C-shaped copper tube 203 are slidably inserted into two ends of a corresponding first C-shaped copper tube 202, a copper plate 204 is commonly connected between a plurality of second C-shaped copper tubes 203 corresponding to the same semiconductor refrigeration piece 206, a reed 205 for elastically supporting the copper plate 204 is fixedly installed on the back of the heat insulation cabin box 2, the copper plate 204 is tightly attached to a heat absorption surface of the semiconductor refrigeration piece 206 by means of the elastic support of the reed 205, and when the device is used, as two ends of the second C-shaped copper tube 203 are slidably inserted into two ends of the corresponding first C-shaped copper tube 202, the second C-shaped copper tube 203 can be slidably adjusted relative to the first C-shaped copper tube 202, a plurality of second C-shaped copper tubes 203 corresponding to the same semiconductor refrigeration piece 206 are fixedly connected through the copper tube 204, and the heat conduction area between the plurality of second C-shaped copper tubes 203 and the semiconductor refrigeration piece 206 can be effectively improved by means of the elastic support of the reed 205, and the copper plate 204 can be self-adaptively attached to the heat absorption surface of the semiconductor refrigeration piece 206, so that the heat absorption surface 206 is tightly attached to the semiconductor refrigeration piece 206 by the heat absorption surface 206, and the heat absorption stability of the second C-shaped copper tube 206 is always attached to the heat absorption surface and the second refrigeration stability is improved.
In a specific implementation process, as shown in fig. 1, 3 and 7, a copper box 6 closely attached to a heat dissipation surface of a semiconductor refrigeration piece 206 is fixedly installed in a rear cover 101, water is filled in the copper box 6, a threaded cover 601 communicated with the inside of the copper box 6 is screwed on the back surface of the rear cover 101, when the device is used, heat generated in the semiconductor refrigeration piece 206 can be absorbed by water filled in the copper box 6 through conduction of the copper box 6 after the semiconductor refrigeration piece 206 is electrified and started, and the heat generated by the heat dissipation surface of the semiconductor refrigeration piece 206 can be temporarily stored in the water in the copper box 6 through the characteristic of high specific heat capacity of the water, so that the stability of operation of the semiconductor refrigeration piece 206 in a high-temperature environment on a fire scene can be guaranteed.
In a specific implementation process, as shown in fig. 4, 7 and 10, a plurality of spiral cases 4 are fixedly installed on the front inner end wall of the heat insulation cabin box 2, a fan wheel 401 is rotationally installed on the spiral cases 4, an air inlet of each spiral case 4 faces to the inner side end wall of the heat insulation cabin box 2, an air outlet of each spiral case 4 faces to the inner side end wall of the corresponding heat insulation cabin box 2, when the heat insulation cabin box is used, the fan wheel 401 installed in each spiral case 4 continuously rotates, continuously flowing air flow is formed in the corresponding heat insulation cabin box 2, and because the air inlet of each spiral case 4 faces to the first C-shaped copper pipe 202, and the air outlet of each spiral case 4 faces to other positions in the heat insulation cabin box 2, in the air flow flowing process, low-temperature environments formed by refrigerating and cooling of semiconductor refrigerating sheets 206 are wrapped, and low-temperature air flows in other directions in the heat insulation cabin box 2 are formed, so that the inside of the heat insulation cabin box 2 is cooled and dissipated evenly, and the running stability of self-cooling inside the heat insulation cabin box is guaranteed.
In a specific implementation process, as shown in fig. 2,3 and 7, the thickness of the spiral case 4 is set to be 5mm, a driving mechanism for driving the fan wheel 401 to rotate is installed on the heat insulation cabin box 2, a partition 207 is fixedly installed in the middle position in the heat insulation cabin box 2, the inside of the heat insulation cabin box 2 is divided into two independent spaces which are not communicated with each other through the partition 207, one spiral case 4 is installed in each independent space, each independent space corresponds to one semiconductor refrigerating sheet 206, a temperature difference exists in the two independent spaces, the driving mechanism comprises a heat pipe 5 fixedly installed in the two independent spaces, a first sliding block 501 is installed in the heat pipe 5 in a sliding mode, a low boiling point liquid positioned on one side of the first sliding block 501 is filled in the heat pipe 5, a sliding groove 502 which is correspondingly arranged with the heat pipe 5 is formed in the outer end wall of the heat insulation cabin box 2, a second sliding block 503 is installed in the sliding groove 502, a magnet which is installed in each first sliding block 501 and the second sliding block 503, a rack bar 504 which is arranged in parallel with the sliding groove 502 is fixed in each independent space, the fan wheel 401 rotates, a rack bar 401 penetrates through the outer side of the heat insulation cabin box 2, and is meshed with a rotating shaft 401, and a rotating shaft 401 is installed between the two adjacent racks 401 and a rotating shaft 401.
When the device is used, the inside of the heat insulation cabin box 2 is divided into two independent spaces which are not communicated with each other through the partition 207, each independent space corresponds to different semiconductor refrigerating sheets 206, the two different independent spaces in the heat insulation cabin box 2 can be respectively controlled in temperature through the control of the semiconductor refrigerating sheets 206, the cooling degrees of the radiating surfaces of the two semiconductor refrigerating sheets 206 are different, the two independent spaces are provided with temperature differences, the low boiling point liquid in the heat pipes 5 inserted in the two independent spaces is subjected to gas-liquid conversion due to the existence of the temperature differences, the heat absorption and the gasification in the independent spaces with high temperature are carried out, the heat release and the liquefaction in the independent spaces with low temperature are carried out circularly, so that the first sliding block 501 is driven to continuously move in the heat pipes 5, the low boiling point liquid in the heat pipes 5 can be water, alcohol or ethylene glycol, the magnetic attraction of magnets in the first sliding block 501 and the second sliding block 503 is driven to synchronously move in the sliding groove 502 in a reciprocating manner, and then the reciprocating rod 504 fixedly connected with the second sliding block 503 is driven to move in a reciprocating manner, and then the rack bar 504 and the rack bar 506 are meshed with the rack bar 401 in a driving belt 401 and a driving belt, and a driving fan is meshed with a driving belt 505 in the driving belt 401.
In the running process of the device, the spiral case 4 is set to be 5mm thick, and the motor driving mode is not adopted to provide power for the rotation of the fan wheel 401, so that the space occupation of the spiral case 4 and the fan wheel 401 in the heat insulation cabin box 2 can be effectively reduced, the device is more integrated, meanwhile, the fan wheel 401 is not driven to rotate by the motor, unnecessary heating generated during the running of the motor can be avoided, and the stability of the heat dissipation running inside the device is further guaranteed.
Specifically, the working principle and the operation method of the invention are as follows:
When a fire fighter is in fire fighting and disaster relief, the device can be mounted on the chest and shoulder through the elastic hooks 102, the position of the fire fighter wearing the device in the fire scene can be positioned in real time through the positioning module integrated in the circuit board 201, the fire rescue can be conveniently arranged according to the real-time position, the infrared probe 103 arranged on the front surface of the main shell 1 can collect infrared temperature of the fire scene right in front, related data are transmitted into the circuit board 201 for analysis, after the temperature on the front path exceeds a safety threshold value, the fire fighter is alerted through the loudspeaker 104, the fire fighter can conveniently avoid dangerous areas in time, the device runs, the semiconductor refrigeration piece 206 is inserted into the bracket 3 through the plugboard 301 for installation, the copper plate 204 is tightly attached to the heat absorbing surface of the semiconductor refrigeration piece 206 by virtue of the elastic support of the reed 205, the heat dissipating surface of the semiconductor refrigeration piece 206 is tightly attached to the copper box 6, after the semiconductor refrigerating sheets 206 are electrified and started, the heat absorption surfaces are cooled and refrigerated, the low temperature is transferred into the heat insulation cabin box 2 through the heat conduction of the first C-shaped copper pipe 202, the second C-shaped copper pipe 203 and the internal low boiling point liquid, the heat generated by the heat generation of the heat dissipation surface is absorbed by the water stored in the copper box 6, the inside of the heat insulation cabin box 2 is divided into two independent spaces which are not communicated with each other through the partition 207, the temperature in the two independent spaces is different through the control of the different temperatures of the heat absorption surfaces of the two semiconductor refrigerating sheets 206, the temperature difference exists, so that the low boiling point liquid in the heat pipe 5 continuously performs gas-liquid conversion, the first sliding block 501 is driven to circularly move in the heat pipe 5, the second sliding block 503 drives the rack bar 504 to synchronously reciprocate along the sliding groove 502 by virtue of the magnetic attraction of the magnets in the first sliding block 501 and the second sliding block 503, the rack bar 504 is driven to mesh with the gear 506, and the transmission connection of the transmission belt 505 drives the fan wheel 401 to rotate in the volute 4, and continuously flowing air flow is formed in two independent spaces, so that refrigeration and cooling are uniformly dispersed in the heat insulation cabin box 2 by means of air flow, and the uniformity of heat dissipation and cooling is ensured.
The present invention is not limited to the above-mentioned embodiments, and any person skilled in the art, based on the technical solution of the present invention and the inventive concept thereof, can be replaced or changed within the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411842977.8A CN119677051B (en) | 2024-12-13 | 2024-12-13 | A self-heating structure for a handheld terminal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202411842977.8A CN119677051B (en) | 2024-12-13 | 2024-12-13 | A self-heating structure for a handheld terminal |
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| CN119677051A true CN119677051A (en) | 2025-03-21 |
| CN119677051B CN119677051B (en) | 2025-09-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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