CN119653732A - A network data analysis device based on computer - Google Patents

Abstract

The invention relates to the technical field of network data analysis and discloses a network data analysis device based on a computer, which comprises a chassis cabinet, wherein a water cooling radiating mechanism extending into the interior of the chassis cabinet is arranged on the back surface of the chassis cabinet, a large server body is attached to the water cooling radiating mechanism, a radiating groove is formed in the side surface of the chassis cabinet, a mounting box is fixedly arranged at the top of the chassis cabinet, a radiating fan is fixedly arranged in the mounting box, a dust filter screen is fixedly arranged at the inlet of the mounting box, an exhaust pipe is fixedly connected at the outlet of the mounting box, an air cooling radiating mechanism inserted into the chassis cabinet and facing the large server body is connected to the exhaust pipe, and a dust cleaning mechanism for cleaning the dust filter screen is also connected to the exhaust pipe. The invention combines water cooling and air cooling, has better heat dissipation effect, is convenient for filtering dust in heat dissipation airflow, is convenient for cleaning accumulated dust and is convenient for use.

Description

A network data analysis device based on computer

Technical Field

The present invention relates to the technical field of network data analysis, and in particular to a network data analysis device based on a computer.

Background Art

Computer network data analysis refers to the process of inspecting, cleaning, transforming and modeling data generated and collected through the network to extract valuable information and insights. The basis of network data analysis is large servers with powerful computing power.

Large servers generate a lot of heat when running, which needs to be dissipated. At present, most of the heat is dissipated by air cooling. The heat dissipation effect of a single heat dissipation method is relatively general. In addition, a large amount of flowing airflow is used for air cooling. The dust carried in the airflow needs to be filtered by a filter. The existing filter needs to be manually cleaned every time it is used for a period of time to prevent clogging, which is troublesome. Therefore, in view of the above situation, it is urgent to develop a computer-based network data analysis device that combines water cooling and air cooling to achieve better heat dissipation effect; it is convenient to filter dust in the heat dissipation airflow and clean accumulated dust, and it is easy to use, so as to overcome the shortcomings in current practical applications and meet current needs.

Summary of the invention

The purpose of the present invention is to provide a computer-based network data analysis device to solve the problems raised in the above background technology.

In order to achieve the above object, the present invention adopts the following technical solutions:

A network data analysis device based on a computer comprises a chassis cabinet, a water-cooling heat dissipation mechanism, a large server body, an installation box, an air-cooling heat dissipation mechanism, a dust cleaning mechanism, a dust filter and a cooling fan. The back of the chassis cabinet is provided with a water-cooling heat dissipation mechanism extending to the inside of the chassis cabinet, the large server body is fitted with the water-cooling heat dissipation mechanism, a heat dissipation slot is arranged on the side of the chassis cabinet, an installation box is fixed on the top of the chassis cabinet, a cooling fan is fixedly installed in the installation box, a dust filter is fixedly installed at the inlet of the installation box, and a drain is fixedly connected to the outlet of the installation box. The exhaust pipe is connected to an air cooling mechanism inserted into the chassis cabinet and facing the large server body. The exhaust pipe is also connected to a cleaning mechanism for cleaning the dust filter. The cleaning mechanism includes: a guide pipe, a second valve, a cleaning brush, an outer shell, a transmission shaft and a driving blade. The outer shell is fixed to one side of the installation box, one end of the guide pipe is fixed to the exhaust pipe, and the other end of the guide pipe is inserted into the outer shell. The cleaning brush is rotatably connected to the outer shell through the transmission shaft, and a plurality of driving blades are fixed on the transmission shaft. The air outlet end of the guide pipe faces the driving blades.

Preferably, an air outlet is provided on the top of the outer shell.

Preferably: the water-cooled heat dissipation mechanism includes: a water tank, a heat absorption shell, a heat sink, a submersible pump, an input pipe, a return pipe, a first semiconductor refrigeration sheet, a first heat dissipation fin and a plug; the water tank is fixed to the back of the chassis cabinet, the water tank is filled with water, the heat absorption shell is fixed in the chassis cabinet, the large server body is in contact with the inner wall of the heat absorption shell, a plurality of heat sinks inserted into the interior thereof and in contact with the water flow are fixed on the left and right sides of the water tank, a submersible pump is fixedly installed in the water tank, the water inlet of the submersible pump is connected to the lower end of the heat absorption shell through the input pipe, a return pipe inserted into the water tank is installed on the upper end of the heat absorption shell, a plurality of first semiconductor refrigeration sheets are fixedly installed on the outer wall of the water tank, each of the first semiconductor refrigeration sheets is fixed with a first heat dissipation fin at the hot end, and the plug is detachably fixed to the water tank by a thread. When in use, water is transported to the heat-absorbing shell through a submersible pump, and the heat on the large server body is taken away by the heat-absorbing shell. The water after absorbing heat flows back to the water tank through the return pipe, and the heat in the water is dissipated outward through the heat sink. At the same time, the water in the water tank is cooled by the first semiconductor refrigeration sheet, so as to keep the water at a lower temperature.

Preferably: the air-cooled heat dissipation mechanism comprises: a spiral tube, a first valve, a second semiconductor cooling sheet, a second heat dissipation fin and a blow pipe, one end of the spiral tube is fixed to the exhaust pipe, the other end of the spiral tube is fixed to the blow pipe, the blow pipe is inserted into the chassis cabinet facing the large server body, the spiral tube is fixedly mounted with a first valve, a plurality of second semiconductor cooling sheets are fixed to the spiral tube, and the hot end of each second semiconductor cooling sheet is fixed with a second heat dissipation fin. When in use, the first valve is opened, the heat dissipation fan blows the airflow into the spiral tube, the second semiconductor cooling sheet cools the airflow passing through the spiral tube, and then the low-temperature airflow is blown from the blow pipe into the large server body, thereby taking away the heat in the large server body.

Preferably, the heat absorbing shell, the heat sink, the first heat dissipating fins, the spiral tube and the second heat dissipating fins are all made of copper.

Preferably: a cabinet door is installed on the front side of the chassis cabinet, the cabinet door is rotatably connected to the chassis cabinet via a hinge, and the cabinet door is made of transparent explosion-proof glass.

Preferably: a handle is fixed on the cabinet door, an electromagnet is fixed on one side of the chassis cabinet, an adsorption block for being attracted by the electromagnet is fixed on one side of the cabinet door, and the adsorption block is made of iron material.

Preferably, a plurality of casters are fixedly mounted on the bottom of the chassis cabinet, and the casters are provided with foot brakes.

Preferably, a smoke alarm is fixedly installed on the top of the interior of the chassis cabinet.

The beneficial effects of the present invention are as follows: when the computer-based network data analysis device is used, water is conveyed into the heat-absorbing shell through a submersible pump, and the heat on the large server body is taken away through the heat-absorbing shell. The water after absorbing heat flows back into the water tank from the return pipe, and the heat in the water is dissipated outward through the heat sink. At the same time, the water in the water tank is cooled by the first semiconductor refrigeration sheet, so as to keep the water at a relatively low temperature. At the same time, the first valve is opened and the second valve is closed, and the air flow is blown into the spiral tube by the heat dissipation fan, and the air flow passing through the spiral tube is cooled and cooled by the second semiconductor refrigeration sheet. Then, the low-temperature air flow is blown into the large server body from the blowing pipe, so as to take away the heat in the large server body; in addition, the dust in the air flow is filtered out by the dust filter. After a period of use, the second valve is opened and the first valve is closed, and the heat dissipation fan blows the air flow into the guide pipe, and the guide pipe blows the air flow to the driving blade, and the driving blade drives the transmission shaft to rotate, and the transmission shaft drives the dust cleaning brush to rotate, so that the dust cleaning brush sweeps from the front side of the dust filter, thereby cleaning the dust accumulated on the dust filter. In summary, the present invention has a better heat dissipation effect by combining water cooling and air cooling; it is convenient to filter dust in the heat dissipation airflow and to clean the accumulated dust, and is easy to use.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of the front structure of the present invention.

FIG. 2 is a schematic diagram of the back structure of the present invention.

FIG. 3 is a schematic diagram of the opening state of the present invention.

FIG. 4 is a partial structural schematic diagram 1 of the present invention.

FIG5 is an internal cross-sectional view of the water cooling heat dissipation mechanism of the present invention.

FIG. 6 is a second partial structural schematic diagram of the present invention.

FIG. 7 is a third schematic diagram of a partial structure of the present invention.

FIG. 8 is a schematic diagram of the disassembled state of FIG. 7 of the present invention.

FIG. 9 is a schematic diagram of the cleaning state of FIG. 7 of the present invention.

FIG. 10 is a third schematic diagram of a partial structure of the present invention.

FIG. 11 is an internal cross-sectional view of the dust cleaning mechanism of the present invention.

FIG. 12 is a partial view of point A in FIG. 11 of the present invention.

Legend:

1. Chassis cabinet; 101. Heat sink; 2. Cabinet door; 201. Handle; 202. Adsorption block; 3. Electromagnet; 4. Casters; 5. Water cooling mechanism; 501. Water storage tank; 502. Heat absorbing shell; 503. Heat sink; 504. Submersible pump; 505. Inlet pipe; 506. Return pipe; 507. First semiconductor cooling sheet; 508. First heat sink fin; 509. Plug; 6. Large server body; 601. Ventilation slot; 7. Installation box; 701, exhaust pipe; 8, air-cooled heat dissipation mechanism; 801, spiral tube; 802, first valve; 803, second semiconductor refrigeration plate; 804, second heat dissipation fin; 805, blow pipe; 9, cleaning mechanism; 901, guide pipe; 902, second valve; 903, cleaning brush; 904, outer shell; 9041, air outlet; 905, transmission shaft; 906, driving blade; 10, dust filter; 11, cooling fan; 12, smoke alarm.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Specific examples are given below.

Referring to FIGS. 1 to 12 , in an embodiment of the present invention, a computer-based network data analysis device includes a chassis cabinet 1, a water-cooling heat dissipation mechanism 5, a large server body 6, an installation box 7, an air-cooling heat dissipation mechanism 8, a dust cleaning mechanism 9, a dust filter 10 and a cooling fan 11. The back of the chassis cabinet 1 is provided with a water-cooling heat dissipation mechanism 5 extending to the inside of the chassis cabinet 1. The large server body 6 is fitted with the water-cooling heat dissipation mechanism 5. The large server body 6 is connected to an external computer via a network cable (the large server body 6 is a prior art product). Computer data is analyzed through the large server body 6. A heat dissipation slot 101 is provided on the side of the chassis cabinet 1 so that heat can be discharged from the heat dissipation slot 101. The large server body 6 itself is provided with a ventilation slot 601. The top of the chassis cabinet 1 is fixed with an installation box 7, and the installation box 7 is fixed inside. A cooling fan 11 is fixedly installed, a dust filter 10 is fixedly installed at the entrance of the installation box 7, an exhaust pipe 701 is fixedly connected to the outlet of the installation box 7, and the exhaust pipe 701 is connected to an air-cooling heat dissipation mechanism 8 inserted into the chassis cabinet 1 and facing the large server body 6. The exhaust pipe 701 is also connected to a cleaning mechanism 9 for cleaning the dust filter 10. When in use, the large server body 6 is heat-absorbed by the water-cooling heat dissipation mechanism 5, and at the same time, air is blown through the cooling fan 11, and the airflow passes through the air-cooling heat dissipation mechanism 8 to dissipate heat to the large server body 6, thereby reducing the temperature of the large server body 6 and preventing the large server body 6 from overheating. In addition, the dust in the airflow is filtered out by the dust filter 10. After a period of use, the dust accumulated on the dust filter 10 is cleaned out by the cleaning mechanism 9.

The water cooling heat dissipation mechanism 5 includes: a water tank 501, a heat absorption shell 502, a heat sink 503, a submersible pump 504, an input pipe 505, a return pipe 506, a first semiconductor refrigeration sheet 507, a first heat dissipation fin 508 and a plug 509. The water tank 501 is fixed to the back of the chassis cabinet 1. The water tank 501 is filled with water. The heat absorption shell 502 is fixed in the chassis cabinet 1. The large server body 6 is in contact with the inner wall of the heat absorption shell 502. A plurality of heat sinks 503 inserted into the inside of the water tank 501 and in contact with the water flow are fixed on both sides of the water tank 501. A submersible pump 504 is fixedly installed in the water tank 501. The water inlet of the submersible pump 504 is connected to the lower end of the heat absorption shell 502 through the input pipe 505. The upper end of the heat absorption shell 502 is equipped with a return pipe 506 inserted into the water tank 501. A plurality of first heat sinks 508 are fixedly installed on the outer wall of the water tank 501. A semiconductor refrigeration plate 507, each first semiconductor refrigeration plate 507 has a first heat sink 508 fixed at its hot end, and the heat at the hot end of the first semiconductor refrigeration plate 507 is dissipated outwards through the first heat sink 508 to ensure the continuous cooling effect of the first semiconductor refrigeration plate 507. The plug 509 is detachably fixed to the water tank 501 through a thread. The water tank 501 can be added to the water tank 501 by removing it. When in use, the water is transported to the heat absorption shell 502 through the submersible pump 504, and the heat on the large server body 6 is taken away by the heat absorption shell 502. The water after absorbing heat flows back to the water tank 501 from the return pipe 506, and the heat in the water is dissipated outwards through the heat sink 503. At the same time, the water in the water tank 501 is cooled by the first semiconductor refrigeration plate 507, so as to keep the water at a relatively low temperature.

The air-cooling heat dissipation mechanism 8 includes: a spiral tube 801, a first valve 802, a second semiconductor cooling sheet 803, a second heat dissipation fin 804 and a blowing pipe 805. One end of the spiral tube 801 is fixed to the exhaust pipe 701, and the other end of the spiral tube 801 is fixed to the blowing pipe 805. The blowing pipe 805 is inserted into the chassis cabinet 1 facing the large server body 6. The first valve 802 is fixedly installed on the spiral tube 801. A plurality of second semiconductor cooling sheets 803 are fixed on the spiral tube 801. The hot end of each second semiconductor cooling sheet 803 is fixed with a second heat dissipation fin 804. When in use, the first valve 802 is opened, and the heat dissipation fan 11 blows the airflow into the spiral tube 801. The second semiconductor cooling sheet 803 cools and cools the airflow passing through the spiral tube 801. Then, the low-temperature airflow is blown from the blowing pipe 805 into the large server body 6, thereby taking away the heat in the large server body 6.

The cleaning mechanism 9 includes: a guide tube 901, a second valve 902, a cleaning brush 903, an outer shell 904, a transmission shaft 905 and a driving blade 906. The outer shell 904 is fixed to one side of the installation box 7. One end of the guide tube 901 is fixed to the exhaust pipe 701, and the other end of the guide tube 901 is inserted into the outer shell 904. The cleaning brush 903 is rotatably connected to the outer shell 904 through the transmission shaft 905. A plurality of driving blades 906 are fixed on the transmission shaft 905. The outlet end of the guide tube 901 faces the driving blade 906. 06. An air outlet 9041 is provided at the top of the outer shell 904 to facilitate the discharge of air. When cleaning, the second valve 902 is opened and the first valve 802 is closed. The cooling fan 11 blows the airflow into the guide tube 901. The guide tube 901 blows the airflow toward the driving blade 906. The driving blade 906 drives the transmission shaft 905 to rotate. The transmission shaft 905 drives the cleaning brush 903 to rotate, so that the cleaning brush 903 sweeps from the front side of the dust filter 10, thereby cleaning the dust accumulated on the dust filter 10.

The heat absorbing shell 502, the heat sink 503, the first heat sink fin 508, the spiral tube 801 and the second heat sink fin 804 are all made of copper, so that they have good thermal conductivity.

A cabinet door 2 is installed on the front side of the chassis cabinet 1. The cabinet door 2 is rotatably connected to the chassis cabinet 1 through a hinge. The cabinet door 2 is made of transparent explosion-proof glass so that the internal situation of the chassis cabinet 1 can be observed through the cabinet door 2. A handle 201 is fixed on the cabinet door 2. An electromagnet 3 is fixed on one side of the chassis cabinet 1. An adsorption block 202 for being attracted by the electromagnet 3 is fixed on one side of the cabinet door 2. The adsorption block 202 is made of iron material.

A plurality of casters 4 are fixedly mounted on the bottom of the cabinet 1. The casters 4 are provided with foot brakes. The cabinet 1 can be moved by the casters 4, and the casters 4 can be fixed by the foot brakes.

A smoke alarm 12 is fixedly installed on the top of the interior of the chassis cabinet 1. When the large server body 6 accidentally catches fire, the smoke alarm 12 sounds an alarm to warn, thereby improving safety performance.

Working principle: When the computer-based network data analysis device is used, the water flow is transported to the heat-absorbing shell 502 through the submersible pump 504, and the heat on the large server body 6 is taken away by the heat-absorbing shell 502. The water flow after absorbing heat flows back to the water storage tank 501 through the return pipe 506, and the heat in the water flow is dissipated outward through the heat sink 503. At the same time, the water flow in the water storage tank 501 is cooled by the first semiconductor cooling sheet 507, so as to keep the water flow at a lower temperature. At the same time, the first valve 802 is opened and the second valve 902 is closed, and the air flow is blown into the spiral tube 801 by the heat dissipation fan 11, and the second semiconductor cooling sheet 803 cools the water flow through the spiral tube 801. The air flow in the tube 801 is cooled and then the low-temperature air flow is blown from the blowing tube 805 into the large server body 6, thereby taking away the heat in the large server body 6; in addition, the dust in the air flow is filtered out by the dust filter 10. After a period of use, the second valve 902 is opened and the first valve 802 is closed. The cooling fan 11 blows the air flow into the guide tube 901. The guide tube 901 blows the air flow toward the driving blade 906, which drives the transmission shaft 905 to rotate through the driving blade 906, and drives the cleaning brush 903 to rotate through the transmission shaft 905, so that the cleaning brush 903 sweeps from the front side of the dust filter 10, thereby cleaning the dust accumulated on the dust filter 10.

The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims (9)

1. A network data analysis device based on a computer is characterized by comprising a case cabinet (1), a water cooling and heat radiating mechanism (5), a large server body (6), a mounting box (7), an air cooling and heat radiating mechanism (8), a dust removing mechanism (9), a dust filter screen (10) and a heat radiating fan (11), wherein the water cooling and heat radiating mechanism (5) extending to the inside of the case cabinet (1) is mounted on the back of the case cabinet (1), the large server body (6) is attached to the water cooling and heat radiating mechanism (5), a heat radiating groove (101) is formed in the side surface of the case cabinet (1), a mounting box (7) is fixed on the top of the case cabinet (1), the heat radiating fan (11) is fixedly mounted in the mounting box (7), a dust filter screen (10) is fixedly mounted at the inlet of the mounting box (7), an exhaust pipe (701) is fixedly connected to the outlet of the mounting box (7), the air cooling mechanism (8) inserted into the case cabinet (1) and facing the large server body (6), a guide pipe (903) is connected with a dust removing valve (903), and the dust removing mechanism (902) is further connected to the exhaust pipe (903), and the dust removing mechanism (902) comprises a dust removing valve (902) The dust removal brush comprises an outer shell (904), a transmission shaft (905) and driving blades (906), wherein the outer shell (904) is fixed on one side of a mounting box (7), one end of a flow guide pipe (901) is fixed with an exhaust pipe (701), the other end of the flow guide pipe (901) is inserted into the outer shell (904), the dust removal brush (903) is rotationally connected with the outer shell (904) through the transmission shaft (905), a plurality of driving blades (906) are fixed on the transmission shaft (905), and the air outlet end of the flow guide pipe (901) faces the driving blades (906).

2. The computer-based network data analysis device of claim 1, wherein the top of the outer housing (904) is provided with an air outlet (9041).

3. The computer-based network data analysis device according to claim 1, wherein the water-cooling heat dissipation mechanism (5) comprises a water storage tank (501), a heat absorption shell (502), heat dissipation fins (503), a submersible pump (504), an input pipe (505), a return pipe (506), a first semiconductor refrigerating fin (507), a first heat dissipation fin (508) and a plug (509), the water storage tank (501) is fixed on the back surface of the cabinet (1), the water storage tank (501) is filled with water flow, the heat absorption shell (502) is fixed in the cabinet (1), the large server body (6) is attached to the inner wall of the heat absorption shell (502), a plurality of heat dissipation fins (503) which are inserted into the water storage tank (501) and are in contact with the water flow are fixed on the left side and the right side, the submersible pump (504) is fixedly installed in the water storage tank (501), a water delivery port of the submersible pump (504) is connected with the lower end of the heat absorption shell (502) through the input pipe (505), the upper end of the shell (502) is provided with a water flow, the first semiconductor refrigerating fin (507) is fixedly installed on the outer wall of the first semiconductor refrigerating fin (507) of the heat dissipation shell (501), the plug (509) is detachably fixed with the water storage tank (501) through threads.

4. The computer-based network data analysis device according to claim 3, wherein the air-cooled heat dissipation mechanism (8) comprises a spiral tube (801), a first valve (802), a second semiconductor refrigerating sheet (803), a second heat dissipation fin (804) and a blowing pipe (805), one end of the spiral tube (801) is fixed with the exhaust pipe (701), the other end of the spiral tube (801) is fixed with the blowing pipe (805), the blowing pipe (805) is inserted into the cabinet (1) and faces the large server body (6), the first valve (802) is fixedly installed on the spiral tube (801), a plurality of second semiconductor refrigerating sheets (803) are fixed on the spiral tube (801), and a second heat dissipation fin (804) is fixed on the hot end of each second semiconductor refrigerating sheet (803).

5. The computer-based network data analysis device of claim 4, wherein the heat absorbing housing (502), the heat sink (503), the first heat sink (508), the spiral tube (801), and the second heat sink (804) are all made of copper.

6. The computer-based network data analysis device according to claim 1, wherein a cabinet door (2) is installed at the front side of the cabinet (1), the cabinet door (2) is rotatably connected with the cabinet (1) through a hinge, and the cabinet door (2) is made of transparent explosion-proof glass.

7. The computer-based network data analysis device according to claim 6, wherein a handle (201) is fixed on the cabinet door (2), an electromagnet (3) is fixed on one side of the cabinet (1), an adsorption block (202) for being attracted by the electromagnet (3) is fixed on one side of the cabinet door (2), and the adsorption block (202) is made of iron materials.

8. The computer-based network data analysis device according to claim 1, wherein a plurality of casters (4) are fixedly installed at the bottom of the cabinet (1), and the casters (4) are provided with foot brakes.

9. The computer-based network data analysis device according to claim 1, wherein a smoke alarm (12) is fixedly installed at the inner top end of the cabinet (1).