CN119492470A - A static and dynamic friction detection system for high-precision processing of semiconductor wafers - Google Patents
A static and dynamic friction detection system for high-precision processing of semiconductor wafers Download PDFInfo
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- CN119492470A CN119492470A CN202411630256.0A CN202411630256A CN119492470A CN 119492470 A CN119492470 A CN 119492470A CN 202411630256 A CN202411630256 A CN 202411630256A CN 119492470 A CN119492470 A CN 119492470A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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Abstract
本发明公开了一种用于半导体晶圆高精度加工过程的静动摩擦检测系统，主要包括往复式摩擦磨损检测设备和计算机控制系统；当拨叉推动晶圆片在X方向运动时，通过传力梁的形变带动位移传感器内部铁芯微动，从而根据计算机控制系统采集到的电压值来确定动摩擦力大小，在此过程中，通过位移传感器检测传力梁上的应变间隙形变可以有效采集到静摩擦力；同时，晶圆片在Y方向微动时，微动摩擦力大小由Y向应变式力传感器直接测量。两种传感器结合既能实现双向测力，同时也能实现较宽摩擦力范围的测试以及动静摩擦力的同一系统全覆盖测量。本发明结构简单，转化及维护成本较低，适合半导体加工制造行业及其他材料研发机构大规模应用。
The present invention discloses a static and dynamic friction detection system for high-precision processing of semiconductor wafers, which mainly includes a reciprocating friction and wear detection device and a computer control system; when the shift fork pushes the wafer to move in the X direction, the deformation of the force transmission beam drives the internal iron core of the displacement sensor to slightly move, so as to determine the magnitude of the dynamic friction force according to the voltage value collected by the computer control system. In this process, the static friction force can be effectively collected by detecting the strain gap deformation on the force transmission beam through the displacement sensor; at the same time, when the wafer slightly moves in the Y direction, the magnitude of the micro-motion friction force is directly measured by the Y-direction strain force sensor. The combination of the two sensors can realize bidirectional force measurement, as well as the test of a wider friction range and the full coverage measurement of dynamic and static friction forces by the same system. The present invention has a simple structure, low conversion and maintenance costs, and is suitable for large-scale application in the semiconductor processing and manufacturing industry and other material research and development institutions.
Description
Technical Field
The invention relates to the field of high-precision friction test equipment, in particular to a static and dynamic friction detection system for a high-precision processing process of a semiconductor wafer, and particularly relates to a side pushing static and dynamic friction detection system for a deep processing process of the semiconductor wafer.
Background
With the continuous development of semiconductor technology, the quality requirements on the surface of a wafer are higher and higher, and the friction and abrasion between the semiconductor wafer and an objective table directly affect the surface quality and the processing precision of the wafer in the deep processing process, so that the appearance defects such as scratches, stains, cracks and the like left on the wafer by equipment in the processing process and the phenomenon of bending and edge curling of the wafer caused by thermal stress and mechanical stress can be timely found through the detection of the friction force between the wafer and the objective table, and the optimization and the replacement of grinding materials and devices are further guided, so that the stability of the processing quality of the wafer is ensured. Meanwhile, the friction data can also provide a basis for adjusting the processing parameters of the wafer, so that the material design and the processing process optimization are facilitated, and the processing efficiency and the wafer surface quality are improved. In the wafer surface processing process, according to the loading of working conditions, the wafer is required to be laterally applied with thrust force to guide the wafer to move towards the planning direction, so that the static and dynamic friction force of the wafer is tested, and the friction coefficient is calculated through computer software. However, the thickness of the wafer after deep processing is about 500-750 μm, and the mass is small, so that the friction and abrasion detection difficulty of the wafer material is multiplied. At present, due to the change of international trade policies, some countries issue export control policies aiming at the field of semiconductor equipment, and the detection and analysis of semiconductor materials in China are greatly influenced. In order to improve the safety of a semiconductor industrial chain, the localization rate of semiconductor measuring equipment is urgent, and meanwhile, at present, detecting equipment for the friction performance of wafer materials is lacking in domestic markets, so that the development of equipment for detecting the friction force of the wafer materials is necessary.
Disclosure of Invention
Based on the above, the invention aims to provide a static and dynamic friction detection system for a high-precision processing process of a semiconductor wafer, which is used for detecting friction and wear of a semiconductor wafer material in the processes of processing, sample shifting and the like, and simultaneously simulates reciprocating friction and wear detection for realizing balanced loading of different areas on the upper surface of the wafer, thereby providing a basis for adjusting the processing technological parameters of the wafer and improving the processing efficiency and the surface quality of the wafer.
In order to achieve the purpose, the invention adopts the following technical scheme:
A static and dynamic friction detection system for a high-precision processing process of a semiconductor wafer comprises reciprocating friction and wear detection equipment and a computer control system;
The reciprocating type friction and wear detection device takes a mounting bottom plate and a portal frame as a main frame, one end, far away from the portal frame, of the upper surface of the mounting bottom plate is provided with a Y-direction electric translation table, a rotary platform with a self-locking nut is arranged on the Y-direction electric translation table, a lower sample table is arranged on the rotary platform, the top surface of the lower sample table is of a concave structure, and a round lower sample is arranged in the concave structure of the lower sample table;
an X-direction electric translation table is horizontally arranged on the portal frame beam, a Z-direction electric lifting table driven by a top stepping motor is arranged on the X-direction electric translation table, a high-precision friction force measuring device is arranged on the Z-direction electric lifting table, and a high-definition camera is arranged on the high-precision friction force measuring device;
The high-precision friction force measuring device comprises a two-dimensional piezoelectric ceramic translation table capable of performing micro-distance adjustment in X and Z directions, wherein one side of a two-dimensional piezoelectric ceramic translation table panel is provided with a Y-shaped force transfer beam which extends downwards, strain gaps are formed on two sides of the top of the Y-shaped force transfer beam, and high-precision displacement sensors are arranged on two sides of the Y-shaped force transfer beam at the bottom of the two strain gaps;
The signal output end of the computer control system is respectively and electrically connected with the driving mechanisms of the Y-direction electric translation stage, the Z-direction electric lifting stage, the rotating platform, the X-direction electric translation stage and the two-dimensional piezoelectric ceramic translation stage, and the signal input end of the computer control system is respectively and electrically connected with the high-precision displacement sensor and the Y-direction strain type force sensor.
As a further improvement of the technical scheme of the invention, the shifting fork mechanism for the side pushing wafer comprises four shifting forks, and an arc structure matched with the periphery of the wafer is formed between every two shifting forks.
Further, the X-direction electric translation stage is driven by a transmission device, the transmission device comprises an X-direction servo motor, a main shaft of the X-direction servo motor is connected with a driving wheel, the driving wheel is connected with a driven wheel through a synchronous belt, and the driven wheel is connected with a screw rod of the X-direction electric translation stage to realize transmission.
Further, the X-direction electric translation stage is provided with X-direction optical limit switches at two ends, the Y-direction electric translation stage is provided with Y-direction optical limit switches at two ends, and the X-direction optical limit switches and the Y-direction optical limit switches are electrically connected with the signal input end of the computer control system.
Further, the Y-direction electric translation stage is driven by a Y-direction servo motor, and the Y-direction servo motor is connected with a translation stage screw rod through a coupler.
Further, the Z-direction electric lifting table is driven by a stepping motor at the top of the Z-direction electric lifting table.
Further, the rotating platform is rotated by manual control. After the lower sample is installed on the upper surface, the disc can be manually rotated, a testing area is selected, and the testing area is locked by the nut of the rotating platform after being rotated to a proper position.
Further, after the round lower sample is filled into the lower sample stage, the round lower sample is locked through bolts around the lower sample stage, and the bolts are made of flexible materials.
Further, adjustable supporting feet are arranged at the bottom of the mounting bottom plate.
Further, the high-definition camera is arranged on the same side of the Y-shaped force measuring beam of the two-dimensional piezoelectric ceramic translation stage through a lens mounting frame.
By adopting the technical scheme, the beneficial effects obtained by the invention are as follows:
1. The invention provides a large-span friction force detection method between wafers of different masses and equipment surfaces, which uses a combination of a force transmission Liang Dapei inductive displacement sensor and a strain type force sensor, when a shifting fork pushes the wafers to move in the X direction, the deformation of a force transmission beam drives an iron core in the displacement sensor to jog, so that the magnitude of dynamic friction force is determined according to a voltage value acquired by a computer control system, in the process, the static friction force can be effectively acquired by detecting the strain gap deformation on the force transmission beam through the displacement sensor, and meanwhile, when the wafers jog in the Y direction, the magnitude of the jog friction force is directly measured by the Y-direction strain type force sensor. The combination of the two sensors can realize bidirectional force measurement, test of a wider friction force range and full-coverage measurement of the same system of dynamic friction force and static friction force.
2. According to the invention, the optical lifting platform is matched with the piezoelectric ceramic displacement platform, and the high-definition camera is combined to realize automatic adjustment of machine vision, so that the position of the wafer can be accurately positioned, the fork is controlled with high precision, and the damage of a moving part to a sample is avoided.
3. The force transfer beam structure provided by the invention is sensitive to react with elastic materials, and can realize simultaneous measurement of static and dynamic friction force with a high-precision data acquisition device.
4. The invention has simple structure and lower conversion and maintenance cost, and is suitable for large-scale application in the semiconductor processing and manufacturing industry and other material research and development institutions.
Drawings
FIG. 1 is a schematic diagram of a reciprocating frictional wear detection apparatus of the present invention;
FIG. 2 is a half cross-sectional view of FIG. 1;
FIG. 3 is a schematic diagram of a high-precision friction force measuring device according to the present invention;
FIG. 4 is a partial view of the transmission of the present invention;
The device comprises a reference numeral 1, an installation bottom plate, 2, a leveling support leg, 3, a portal frame, 4, a Y-direction electric translation platform, 5, a rotary platform, 6, a lower sample platform, 7, a round lower sample, 8, a bolt, 9, a wafer, 10, weights, 11, a high-precision friction force measuring device, 11-1, a shifting fork, 11-2, a Y-direction strain sensor, 11-3, a force transmission beam, 11-4, a high-precision displacement sensor, 11-5, a strain gap, 11-6, a two-dimensional piezoelectric ceramic displacement platform, 12, a high-definition camera, 13, a Z-direction electric lifting platform, 14, a stepping motor, 15, a transmission device, 15-1, a driving wheel, 15-2, a synchronous belt, 15-3, a driven wheel, 16, a device housing, 17, a Y-direction servo motor, 18, a coupling, 19, a Y-direction optical limit switch, 20, an X-direction servo motor, 21, an X-direction electric translation platform, 22, an X-direction optical limit switch, 23 and a lens mounting frame.
Detailed Description
The construction and operation of the present invention will be described in detail with reference to the accompanying drawings.
In the invention, the computer control system adopts a research and development 610L, an X-direction electric translation platform and a Y-direction electric translation platform to purchase from Shanghai friendship fiber laser instrument limited, a rotation platform 5 to purchase from Shanghai friendship fiber laser instrument limited, a Y-direction strain sensor 11-2 to purchase from a clam port sensor system engineering limited, a high-precision displacement sensor 11-4 to purchase from Beijing sea spring sensing technology limited, a two-dimensional piezoelectric ceramic displacement platform 11-6 to purchase from Harbin core open-day technology limited, a high-definition camera 12 to purchase from Shanghai friendship fiber laser instrument limited, and a Z-direction electric lifting platform 13 to purchase from Shanghai friendship fiber laser instrument limited.
Referring to fig. 1-4, the invention provides a static and dynamic friction detection system for a high-precision processing process of a semiconductor wafer, which comprises reciprocating friction and wear detection equipment and a computer control system.
The reciprocating type friction and wear detection device takes a mounting bottom plate 1 and a portal frame 3 as a main frame, a device shell 16 is arranged outside the main frame, an adjustable supporting leg 2 is arranged at the bottom of the mounting bottom plate 1, a Y-direction electric translation table 4 is arranged at one end, far away from the portal frame 3, of the upper surface of the mounting bottom plate 1, a rotary platform 5 with a self-locking nut is arranged on the Y-direction electric translation table 4, a lower sample table 6 is arranged on the rotary platform 5, the top surface of the lower sample table 6 is of a concave structure, a circular lower sample 7 is arranged in the concave structure of the lower sample table 6, a wafer 9 serving as an upper sample is arranged on the top surface of the circular lower sample 7, and a stress weight 10 for providing positive pressure for wafer contact friction is arranged on the upper surface of the wafer 9.
The X-direction electric translation table 21 is horizontally installed on the beam of the portal frame 3, the Z-direction electric lifting table 13 driven by the stepping motor 14 is installed at the top of the X-direction electric translation table 21, the Z-direction electric lifting table 13 is provided with a high-precision friction force measuring device 11, and the high-precision friction force measuring device 11 is provided with a high-definition camera 12.
The high-precision friction force measuring device 11 comprises a two-dimensional piezoelectric ceramic translation table 11-6 capable of performing micro-distance adjustment in X and Z directions, the two-dimensional piezoelectric ceramic translation table 11-6 is driven by voltage, one side of a panel of the two-dimensional piezoelectric ceramic translation table 11-6 is provided with a Y-shaped force transfer beam 11-3 extending downwards, two sides of the top of the Y-shaped force transfer beam 11-3 are provided with a strain gap 11-5, two sides of the Y-shaped force transfer beam 11-3 at the bottom of the two strain gaps 11-5 are provided with high-precision displacement sensors 11-4, the bottom of the Y-shaped force transfer beam 11-3 Liang Bing is connected with one end of a Y-direction strain type force sensor 11-2, the other end of the Y-direction strain type force sensor 11-2 is connected with a horizontally arranged shifting fork 11-1 mechanism for pushing a wafer, and the shifting fork 11-1 mechanism for pushing the wafer is abutted against the wafer 9. The high-definition camera 12 is arranged on the same side of the Y-shaped force measuring beam 11-3 of the two-dimensional piezoelectric ceramic translation table 11-6 through a lens mounting frame 23.
Specifically, because the upper sample wafer 9 is in a 50mm wafer shape, the shifting fork 11-1 mechanism for pushing the wafer laterally is designed to comprise four shifting forks, each two shifting forks are in an arc structure matched with the periphery of the wafer 9, so that the push-pull movement of the wafer 9 on the lower round sample 7 can be realized, and the friction force in the movement process is collected and recorded by the high-precision displacement sensor 11-4 and the Y-direction strain type force sensor 11-2. The bottoms of the four shifting forks are horizontal planes, and because the pushed wafer 9 is thinner, accurate control is needed during Z-direction movement, and particularly, the control is divided into two steps, namely, coarse adjustment is completed by driving the Z-direction electric lifting platform 13 by the stepping motor 14, when the high-definition camera 12 detects that the distance between the shifting fork and the round lower sample 7 is larger, the electric lifting platform 13 works to drive the shifting fork to move downwards, when the high-definition camera detects that the height of the shifting fork is less than or equal to 1mm from the round lower sample 7, the electric lifting platform 13 stops working, the two-dimensional piezoelectric ceramic translation platform 11-6 starts a fine adjustment mode, and the shifting fork is driven to be close to the side surface of the lower sample 7 and the side surface of the upper sample wafer 9 by smaller displacement, so that accurate positioning of the shifting fork 11-1 is realized, not only can the pushing of the wafer 9 be ensured, but also the shifting fork is ensured not to interfere with the round lower sample 7.
Specifically, in order to coordinate the whole structure of the device and ensure the running stability of the device, the X-direction electric translation stage 21 is driven by a transmission device 15, the transmission device 15 comprises an X-direction servo motor 20, a main shaft of the X-direction servo motor 20 is connected with a driving wheel 15-1, the driving wheel 15-1 is connected with a driven wheel 15-3 by a synchronous belt 15-2, and the driven wheel 15-3 is connected with a screw rod of the X-direction electric translation stage 21 to realize transmission. The Y-direction electric translation stage 4 is driven by a Y-direction servo motor 17, and the Y-direction servo motor 17 is connected with a translation stage screw rod through a coupler 18.
Specifically, in order to prevent X, Y from striking the equipment housing 16 during the movement to the electric translation stage, the invention arranges an X-direction optical limit switch 22 at two ends of the X-direction electric translation stage 21, and arranges a Y-direction optical limit switch 19 at two ends of the Y-direction electric translation stage 4.
Specifically, the rotary platform 5 is driven to rotate manually, after the round lower sample 7 is installed, the disc can be rotated manually, a test area is selected, and after the test area is rotated to a proper position, the test area is locked by the nut of the rotary platform. Specifically, in order to ensure the installation stability of the circular lower sample 7 in the rotation process of the lower sample table 6 and ensure the accuracy of friction measurement, the circular lower sample 7 is locked through bolts 8 around the lower sample table 6 after being filled into the lower sample table 6, and in order to avoid the scratch of the circular lower sample 7, the bolts 8 are made of flexible materials.
The signal output end of the computer control system is respectively and electrically connected with the Y-direction servo motor 17, the X-direction servo motor 20, the stepping motor 14, the driving mechanism of the rotary platform 5 and the driving mechanism of the two-dimensional piezoelectric ceramic translation table 11-6, and the signal input end of the computer control system is respectively and electrically connected with the high-precision displacement sensor 11-4, the Y-direction strain type force sensor 11-2, the X-direction optical limit switch 22 and the Y-direction optical limit switch 19.
Referring to fig. 3, when a wafer with a light mass or a small friction force with a generated displacement contact surface is tested, the wafer 9 is pushed to move in the X direction by the adjustable fork, the inner iron core of the high-precision displacement sensor 11-4 is driven to jog by the deformation of the force transfer beam 11-3, so that the magnitude of the dynamic friction force is determined according to the voltage value acquired by the computer control system, in the process, the static friction force can be effectively acquired by detecting the deformation of the strain gap 11-5 on the force transfer beam 11-3 by the high-precision displacement sensor 11-4, and meanwhile, when the wafer 9 jogs in the Y direction, the magnitude of the jog friction force is directly measured by the Y-direction strain force sensor 11-2. The combination of the two sensors can realize bidirectional force measurement, and simultaneously can realize the test of a wider friction force range and the measurement of dynamic friction force and static friction force.
Claims (10)
1. A static and dynamic friction detection system for a high-precision processing process of a semiconductor wafer is characterized by comprising reciprocating friction and wear detection equipment and a computer control system;
The reciprocating type friction and wear detection device takes a mounting bottom plate (1) and a portal frame (3) as main frames, one end, far away from the portal frame (3), of the upper surface of the mounting bottom plate (1) is provided with a Y-direction electric translation table (4), the Y-direction electric translation table (4) is provided with a rotary platform (5) with a self-locking nut, the rotary platform (5) is provided with a lower sample table (6), the top surface of the lower sample table (6) is of a concave structure, a round lower sample (7) is arranged in the concave structure of the lower sample table (6), the top surface of the round lower sample (7) is provided with a wafer (9) serving as an upper sample, and the upper surface of the wafer (9) is provided with a stress weight (10) for providing positive pressure for wafer contact friction;
An X-direction electric translation table (21) is horizontally arranged on a cross beam of the portal frame (3), a Z-direction electric lifting table (13) driven by a top stepping motor (14) is arranged on the X-direction electric translation table (21), a high-precision friction force measuring device (11) is arranged on the Z-direction electric lifting table (13), and a high-definition camera (12) is arranged on the high-precision friction force measuring device (11);
The high-precision friction force measuring device (11) comprises a two-dimensional piezoelectric ceramic translation table (11-6) capable of performing micro-distance adjustment in X and Z directions, wherein one side of a panel of the two-dimensional piezoelectric ceramic translation table (11-6) is provided with a Y-shaped force transfer beam (11-3) extending downwards, strain gaps (11-5) are formed in two sides of the top of the Y-shaped force transfer beam (11-3), high-precision displacement sensors (11-4) are arranged on two sides of the Y-shaped force transfer beam (11-3) at the bottom of the two strain gaps (11-5), the bottom of the Y-shaped force transfer beam (11-3) is connected with one end of a Y-direction strain force sensor (11-2), the other end of the Y-direction strain force sensor (11-2) is connected with a horizontally arranged shifting fork (11-1) for pushing a wafer, and the shifting fork (11-1) for pushing the wafer is abutted with the wafer (9);
The signal output end of the computer control system is respectively and electrically connected with the driving mechanisms of the Y-direction electric translation stage (4), the Z-direction electric lifting stage (13), the rotating platform (5), the X-direction electric translation stage (21) and the two-dimensional piezoelectric ceramic translation stage (11-6), and the signal input end of the computer control system is respectively and electrically connected with the high-precision displacement sensor (11-4) and the Y-direction strain type force sensor (11-2).
2. The static and dynamic friction detection system for the high-precision processing of the semiconductor wafer according to claim 1, wherein the shifting fork (11-1) mechanism for the side pushing wafer comprises four shifting forks, and each two shifting forks are in an arc structure matched with the periphery of the wafer (9).
3. A static and dynamic friction detection system for high-precision processing of semiconductor wafers according to claim 2, wherein the X-direction electric translation stage (21) is driven by a transmission device (15), the transmission device (15) comprises an X-direction servo motor (20), a main shaft of the X-direction servo motor (20) is connected with a driving wheel (15-1), the driving wheel (15-1) is connected with a driven wheel (15-3) by a synchronous belt (15-2), and the driven wheel (15-3) is connected with a screw rod of the X-direction electric translation stage (21) to realize transmission.
4. A static and dynamic friction detection system for a high-precision processing process of a semiconductor wafer according to claim 3, wherein the two ends of the X-direction electric translation stage (21) are provided with an X-direction optical limit switch (22), the two ends of the Y-direction electric translation stage (4) are provided with a Y-direction optical limit switch (19), and the X-direction optical limit switch (22) and the Y-direction optical limit switch (19) are electrically connected with a signal input end of a computer control system.
5. The static and dynamic friction detection system for the high-precision processing process of the semiconductor wafer according to claim 4, wherein the Y-direction electric translation stage (4) is driven by a Y-direction servo motor (17), and the Y-direction servo motor (17) is connected with a translation stage screw rod through a coupler (18).
6. A static and dynamic friction detection system for high precision processing of semiconductor wafers as claimed in claim 5 wherein the Z-direction motorized lift table (13) is driven by a stepper motor (14) at its top.
7. A stiction detection system for high precision processing of semiconductor wafers according to claim 6, wherein the rotary stage (5) is rotated by manual actuation.
8. A static and dynamic friction detection system for high precision processing of semiconductor wafers according to any one of claims 1 to 7, wherein the circular lower sample (7) is locked by bolts (8) around the lower sample stage (6) after being loaded into the lower sample stage (6), and the bolts (8) are made of flexible materials.
9. A static and dynamic friction detection system for high precision processing of semiconductor wafers according to any of claims 1-7, characterized in that the bottom of the mounting base plate (1) is provided with adjustable feet (2).
10. A static and dynamic friction detection system for high precision processing of semiconductor wafers according to any one of claims 1-7, wherein the high definition camera (12) is mounted on the same side of the Y-shaped force measuring beam (11-3) of the two-dimensional piezoelectric ceramic translation stage (11-6) through a lens mounting frame (23).
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