CN119419165A - Wafer rotating platform, wafer operation platform and operation method thereof - Google Patents
Wafer rotating platform, wafer operation platform and operation method thereof Download PDFInfo
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- CN119419165A CN119419165A CN202411541576.9A CN202411541576A CN119419165A CN 119419165 A CN119419165 A CN 119419165A CN 202411541576 A CN202411541576 A CN 202411541576A CN 119419165 A CN119419165 A CN 119419165A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
- H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
本发明公开了一种晶圆旋转平台、晶圆作业平台及其作业方法，该晶圆旋转平台包括晶圆承载台、晶圆支撑组件、晶圆顶升机构和晶圆旋转机构，晶圆承载台用于承载晶圆；晶圆支撑组件沿坚直方向移动并可凸出于晶圆承载台用于支撑晶圆；晶圆顶升机构与晶圆支撑组件相连并驱动晶圆支撑组件沿竖直方向移动；晶圆旋转机构在晶圆支撑组件凸出于晶圆承载台时，驱动晶圆支撑组件围绕竖直方向旋转，并同步带动晶圆旋转。本发明通过晶圆支撑组件能够实现对于晶圆的支撑，同时配合晶圆旋转机构，能够在对晶圆支撑后再带动晶圆同步旋转，以使得晶圆被取出后，放置在各个后续工位上的晶圆的方位一致，以此来保证晶圆后续制程作业的正常有序进行。
The present invention discloses a wafer rotating platform, a wafer operation platform and an operation method thereof, wherein the wafer rotating platform comprises a wafer carrying platform, a wafer supporting assembly, a wafer lifting mechanism and a wafer rotating mechanism, wherein the wafer carrying platform is used to carry the wafer; the wafer supporting assembly moves in a vertical direction and can protrude from the wafer carrying platform to support the wafer; the wafer lifting mechanism is connected to the wafer supporting assembly and drives the wafer supporting assembly to move in a vertical direction; when the wafer supporting assembly protrudes from the wafer carrying platform, the wafer rotating mechanism drives the wafer supporting assembly to rotate around a vertical direction and synchronously drives the wafer to rotate. The present invention can realize the support of the wafer through the wafer supporting assembly, and at the same time cooperate with the wafer rotating mechanism, can drive the wafer to rotate synchronously after supporting the wafer, so that after the wafer is taken out, the orientation of the wafers placed on each subsequent station is consistent, so as to ensure the normal and orderly progress of the subsequent process operation of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer processing equipment, in particular to a wafer rotating platform. In addition, the invention also relates to a wafer operation platform and an operation method thereof.
Background
At present, the wafer manufacturing process mainly comprises preheating and dispensing operations, wherein when the wafer is fed to a preheating station, the orientation of the wafer in a material box is possibly inconsistent, so that after the wafer is fed to the preheating station, the orientation of the wafer on the preheating station is deflected, and when the wafer is taken out from the preheating station and then put into a dispensing station, the orientation of the wafer is deflected again, and the preheating station, the dispensing station and the like are provided with a plurality of orientations which are located in different positions, so that the orientation of the wafer on different stations is inconsistent, and the normal operation of the wafer is affected.
In view of this, there is a need to design a wafer spin platform to solve the above-mentioned problems.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art.
Therefore, the invention provides a wafer rotating platform which can realize lifting and rotating alignment of a wafer.
According to a first aspect of the present invention, there is provided a wafer spin platform comprising:
the wafer bearing table is used for bearing wafers;
The wafer supporting component moves along the vertical direction and can protrude out of the wafer bearing table to be used for supporting the wafer;
the wafer dome lifting mechanism is connected with the wafer supporting assembly and drives the wafer supporting assembly to move along the vertical direction;
and the wafer rotating mechanism drives the wafer supporting component to rotate around the vertical direction and synchronously drives the wafer to rotate when the wafer supporting component protrudes out of the wafer bearing table.
The wafer supporting assembly has the beneficial effects that the wafer supporting assembly can be used for supporting the wafer and is matched with the wafer rotating mechanism, and the wafer can be driven to synchronously rotate after being supported, so that the orientation of the wafer placed on each subsequent station is consistent after the wafer is taken out, and the normal and orderly operation of the subsequent processing of the wafer is ensured.
Preferably, the crystal dome lifting mechanism includes:
The first screw rod transmission assembly drives the wafer support assembly to move up and down along the vertical direction;
The first driving motor is in belt transmission connection with the first screw rod transmission assembly through a transmission belt so as to drive the first screw rod transmission assembly to move.
Further preferably, the wafer support assembly includes:
The crystal dome lifting mechanism is suitable for driving the chassis to move along the vertical direction;
a stationary outer ring secured to the chassis via a plurality of support posts;
The movable top ring is connected with the fixed outer ring through a bearing, and the movable top ring can protrude out of the wafer bearing table.
Preferably, the movable top ring includes:
The movable top ring includes:
A top support adapted to protrude from the wafer carrier and contact the wafer;
a bottom mount connected to the stationary outer ring via a bearing;
and the middle connecting piece is connected with the bottom mounting piece and the top supporting piece at the same time.
Further preferably, a vacuum adsorption cavity is arranged between the top support and the fixed outer ring, the vacuum adsorption cavity is provided with a first vacuum joint connected with external vacuum equipment,
The contact end of the top supporting piece is provided with a plurality of vacuum chucks for adsorbing the wafers, and the vacuum chucks are communicated with the vacuum adsorption cavity.
Preferably, the wafer rotation mechanism includes:
The belt pulley turntable is fixedly sleeved on the bottom mounting piece;
the driving assembly is arranged on the chassis and is in transmission connection with the belt wheel turntable belt through a transmission belt, so that the belt wheel turntable can be driven to rotate, and the movable top ring is driven to synchronously rotate through the belt wheel turntable.
Further preferably, the driving assembly includes:
the output end of the second driving motor is provided with a first gear;
The input end of the speed reducing mechanism is in transmission connection with the first gear belt, and the output end of the speed reducing mechanism is linked with the belt wheel turntable and drives the belt wheel turntable to rotate.
Preferably, the speed reducing mechanism comprises a transmission shaft, and a second gear and a third gear which are arranged at two ends of the transmission shaft, wherein the second gear is connected with the first gear through a transmission belt, the third gear is linked with the pulley turntable through the transmission belt, and the diameter of the second gear is larger than that of the first gear.
A second aspect of the present invention provides a wafer processing platform, comprising:
the wafer rotating platform according to the first aspect of the present invention;
The heating module is arranged on the wafer bearing table, the wafer rotating platform divides the heating module into an inner ring heating plate and an outer ring heating plate, and the inner ring heating plate and the outer ring heating plate are suitable for heating the wafer at the same time;
the wafer lifting mechanism is suitable for moving along the vertical direction and is suitable for protruding the heating module and supporting the wafer.
Preferably, the inner ring heating plate and the outer ring heating plate are fixedly installed on the same horizontal plane through a plurality of support rods.
Still preferably, the outer heating plate is provided with a plurality of groups of vacuum adsorption areas, each group of vacuum adsorption areas comprises a plurality of groups of vacuum flow channels which are arranged in a staggered manner, the surface of the outer heating plate is provided with a plurality of vacuum adsorption holes, each vacuum adsorption hole is communicated with a plurality of groups of vacuum flow channels, and the vacuum flow channels are suitable for being connected into a second vacuum connector so as to be capable of sucking air in the vacuum flow channels through the second vacuum connector and enabling each vacuum adsorption hole to adsorb the wafer under negative pressure.
Preferably, the wafer lifting mechanism includes:
The wafer carrier is suitable for moving along the vertical direction, and is respectively arranged at the periphery side edge and the center of the wafer so as to simultaneously support the periphery side edge of the wafer and the center of the wafer after upwards extending out of the heating module.
Further preferably, the wafer lifting mechanism further comprises:
The second lead screw transmission assemblies are arranged on the periphery side of the wafer and connected with the wafer bearing pieces through bottom plates, and the second lead screw transmission assemblies are connected through transmission belts so as to be capable of synchronous movement;
and the third driving motor is in belt transmission connection with the adjacent second screw rod transmission assemblies through a transmission belt so as to drive each second screw rod transmission assembly to synchronously move along the vertical direction.
Preferably, each of the second screw drive assemblies includes:
The transmission gears are connected through a transmission belt, and at least one transmission gear is connected with the output end of the third driving motor so as to drive the transmission gears to synchronously rotate through the third driving motor;
The screw rod transmission piece comprises a screw rod and a screw rod nut, the screw rod is in threaded connection with the screw rod nut, the screw rod is suitable for driving the screw rod to rotate through the transmission gear, and the screw rod nut is enabled to linearly move along a path defined by the screw rod.
The third aspect of the present invention provides a wafer operation method, which is applied to the wafer operation platform of the second aspect of the present invention, and the wafer operation method includes the following steps:
Conveying the wafer to a material receiving position;
the wafer lifting mechanism ascends to receive the wafer;
The wafer lifting mechanism descends to enable the wafer to gradually approach the heating module until the temperature of the wafer reaches a first set temperature;
the wafer lifting mechanism continuously descends until the wafer reaching the first set temperature is placed on the heating module and continuously heated, so that the temperature of the wafer reaches the second set temperature;
Processing the wafer reaching the second set temperature;
The wafer rotating platform jacks up the processed wafer and rotates the wafer to a specified angle;
And taking out and conveying the processed wafer at the specified angle to the next station.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is an overall assembly view of a wafer spin platform of the present invention;
FIG. 2 is a perspective view of a wafer spin platform of the present invention;
FIG. 3 is a block diagram of a wafer lift mechanism and its drive connections for a wafer rotation platform of the present invention;
FIG. 4 is a cross-sectional view of a wafer support assembly of the wafer rotation platform of the present invention;
FIG. 5 is a block diagram of a wafer rotation mechanism of the wafer rotation platform of the present invention;
FIG. 6 is a block diagram illustrating the assembly of a wafer lift mechanism and a wafer support assembly of the wafer rotation platform of the present invention;
FIG. 7 is a block diagram of a wafer handling platform of the present invention;
FIG. 8 is a block diagram of a wafer heating mechanism of the present invention;
FIG. 9 is a cross-sectional view of the wafer heating mechanism of the present invention;
FIG. 10 is a view showing a state in which a wafer lift mechanism of the wafer work platform of the present invention is raised;
FIG. 11 is a block diagram of a second lead screw drive assembly of the wafer handling platform of the present invention;
fig. 12 is an assembled schematic view of the wafer handling platform according to the present invention.
Reference numerals illustrate:
1.A wafer carrier;
2. Wafer support assembly, 21, chassis, 211, mounting part, 212, guide post, 22, fixed outer ring, 23, movable top ring, 231, top support, 2311, vacuum chuck, 2322, air channel, 232, bottom mounting piece, 233, middle connector, 24, vacuum adsorption cavity, 25, sealing ring, 26, bearing, 27, support post, 28, first vacuum joint;
3. A crystal dome lifting mechanism; 31, a first screw rod transmission assembly, 32, a first driving motor;
4. wafer rotating mechanism 41, belt wheel turntable 42, driving component 421, second driving motor 422, first gear 423, second gear 424, third gear;
5. Heating module, 51, inner ring heating plate, 52, outer ring heating plate, 521, vacuum adsorption area, 522, vacuum flow channel, 523, second vacuum joint;
6. The wafer lifting mechanism, 61, a wafer carrier, 62, a second screw transmission assembly, 621, a transmission gear, 622, a screw transmission member, 6221, a screw, 6222, a screw nut, 6223, a mounting block, 63, a third driving motor, 64, a bottom plate;
7. an idler;
8. a driving belt.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention. In the description of the present invention, it should be understood that the meaning of "a plurality" is two or more unless otherwise indicated.
It should be noted that, the wafer type of the wafer rotating platform and the wafer operation platform disclosed in the present application is preferably a large square wafer, and it is mainly aimed at the problems of the large square wafer in the process thereof. However, it should be understood that the solution disclosed in the present application is applicable to the currently mainstream wafer shape (small-sized circular wafer) and the commonly used specifications thereof, but due to the differences of the wafer shape and the specifications, some of the functions involved in the solution of the present application are not necessary in the currently mainstream wafer process.
Here, the following is a detailed description of the structure of the large-sized square wafer involved in the process of the present application. With regard to the currently prevailing wafer type, a person skilled in the art can operate empirically, and therefore, a description of this type of wafer process will not be given below.
Referring to fig. 1, 2 and 4, a wafer rotating platform according to an embodiment of the present invention includes a wafer carrying table 1, a wafer supporting assembly 2, a wafer lifting mechanism 3, and a wafer rotating mechanism 4, wherein the wafer carrying table 1 is used for carrying a wafer, and the wafer supporting assembly 2 can move along a vertical direction and can support the wafer when protruding from the wafer carrying table 1. The wafer lift mechanism 3 is connected to the wafer support assembly 2, and the wafer support assembly 2 can be driven to move in a vertical direction by the wafer lift mechanism 3 to support a wafer. When the wafer supporting component 2 protrudes out of the wafer carrying table 1, the wafer rotating mechanism 4 can drive the wafer supporting component 2 to rotate around the vertical direction and synchronously drive the wafer to rotate, so that the wafer is rotationally positioned.
Specifically, the wafer lifting mechanism 3 includes a first screw driving assembly 31 and a first driving motor 32, where the first screw driving assembly 31 can drive the wafer supporting assembly 2 to move up and down along the vertical direction, and the first driving motor 32 is in belt driving connection with the first screw driving assembly 31 through the driving belt 8, so as to drive the first screw driving assembly 31 to move.
In this embodiment, since the wafer is mainly a large-sized square wafer, in order to stably support the large-sized square wafer, the contact surface between the wafer carrier 1 and the wafer is also square to adapt to the specification and shape of the large-sized square wafer, so as to ensure stable support of the large-sized square wafer.
Referring to fig. 1 and 3, when the wafer supporting component 2 contacts with the wafer, since the contact surface of the wafer supporting component 2 and the wafer is mainly located in the middle area of the wafer, in order to generate a stable supporting effect on the wafer as much as possible, the contact surface of the wafer supporting component 2 and the wafer is arranged in a ring shape, so as to realize stable supporting on the wafer. The wafer supporting assembly 2 comprises a chassis 21, a fixed outer ring 22 and a movable top ring 23, wherein the fixed outer ring 22 is connected with the chassis 21 through a plurality of supporting columns 27, i.e. the chassis 21 can drive the wafer supporting assembly 2 to synchronously move along the vertical direction. The circumference side of the chassis 21 further extends to form a plurality of mounting portions 211, and each mounting portion 211 is provided with a guide post 212, so that the chassis 21 can be ensured not to generate radial offset when the wafer support assembly 2 is driven to move along the vertical direction through the guide posts 212.
In addition, the movable top ring 23 is movably connected with the fixed outer ring 22 through bearings 26, the movable top ring 23 can rotate relative to the fixed outer ring 22 due to the arrangement of the bearings 26 (two bearings 26 are arranged in the bearings 26, and the two bearings 26 are all thin-wall bearings 26), and the rotation direction of the movable top ring 23 rotates around the vertical direction, so that when the movable top ring 23 supports a wafer, the wafer can be driven to rotate synchronously.
Specifically, the movable top ring 23 includes a top support 231 and a bottom mount 232, and the bottom mount 232 is fixedly connected to the top support 231 through a middle connection 233. Wherein, the top supporting member 231 extends a mounting portion 211 along a radial direction, the mounting portion 211 cooperates with the fixed outer ring 22 to form an embedded mounting groove, one end of the middle connecting member 233 is embedded into the mounting groove and fixedly connected with the mounting portion 211 by a bolt, and meanwhile, the other end of the middle connecting member 233 is connected with the bottom mounting member 232. The bottom mounting member 232 is configured as a stepped structure, and has a top end connected to the middle connecting member 233 and a bottom end connected to the pulley turntable 41, so that each structural member connected thereto can be driven to rotate synchronously by rotation of the pulley turntable 41.
The top support 231 can be in direct contact with the wafer, and a plurality of vacuum chucks 2311 are arranged at the contact ends of the top support 231 and the wafer, so that the wafer can be sucked by the plurality of vacuum chucks 2311 under negative pressure after the vacuum chucks 2311 are in contact with the wafer, and the contact stability between the wafer and the top support 231 is ensured.
More specifically, a vacuum adsorption chamber 24 is formed between the top support 231 and the fixed outer ring 22, and a sealing ring 25 is disposed in the vacuum adsorption chamber 24, so that air in the vacuum adsorption chamber 24 can be restricted from directly flowing with outside air through the sealing ring 25. In addition, an air flow channel 2322 is further formed in the top support 231, the air flow channel 2322 can be communicated with the vacuum adsorption cavity 24 and the vacuum chuck 2311, a first vacuum connector 28 is further connected into the vacuum adsorption cavity 24, the vacuum adsorption cavity 24 can be vacuumized through the first vacuum connector 28, and negative pressure is generated between the contact surface of the vacuum chuck 2311 and the wafer so as to stably adsorb the wafer.
Referring to fig. 4, the wafer rotation mechanism 4 includes a pulley turntable 41 and a driving assembly 42, the pulley turntable 41 is fixedly sleeved on the bottom mounting piece 232, the driving assembly 42 is mounted on the chassis 21, and the driving assembly 42 is in belt transmission connection with the pulley turntable 41 via the transmission belt 8, so as to drive the pulley to rotate through the pulley, and the movable top ring 23 is driven to synchronously rotate through the rotation of the pulley turntable 41.
Specifically, the driving assembly 42 includes a second driving motor 421 and a reduction mechanism, an input end of the reduction mechanism is in transmission connection with the first gear 422, and an output end of the reduction mechanism is connected with the pulley turntable 41, so as to drive the pulley turntable to rotate. Meanwhile, the speed reducing mechanism further comprises a transmission shaft, a second gear 423 and a third gear 424 which are arranged at two ends of the transmission shaft, the second gear 423 is connected with the first gear 422 through a transmission belt 8, the third gear 424 is connected with the pulley turntable 41 through the transmission belt 8, and the diameter of the second gear 423 is larger than that of the first gear 422.
That is, after the second driving motor 421 outputs driving force to the second gear 423 through the first gear 422, the second gear 423 can be driven to rotate, and since the diameter of the third gear 424 is smaller than that of the second gear 423, when the second gear 423 rotates one turn, the third gear 424 is driven to rotate for a plurality of turns, and then power is output to the pulley turntable 41 through the third gear 424, so as to drive the pulley turntable 41 to rotate.
However, the cutting angle of the driving belt 8 led in and led out between the third gear 424 and the pulley turntable 41 is too large, so that the driving area between the driving belt 8 and the third gear 424 and between the pulley turntable 41 is reduced, and the stability of the driving process between the pulley turntable 41 and the third gear 424 is further affected. Therefore, in order to increase the transmission area between the transmission belt 8 and the pulley turntable 41 and between the third gear 424, the idler pulley 7 is provided between the third gear 424 and the pulley turntable 41.
By providing the idler pulley 7, the belt 8 led out from the third gear 424 can be guided to drive with the pulley turntable 41 at a smaller cutting angle, and the drive area between the belt 8 and the pulley turntable 41 can be increased. Meanwhile, when the driving belt 8 is led into the third gear 424 from the pulley turntable 41, the led-in driving belt 8 is also adjusted in its leading-in angle by the idler pulley 7, so that the driving area between the driving belt 8 and the third gear 424 is larger, thereby ensuring the stability in driving between the pulley turntable 41 and the third gear 424.
Referring to fig. 6 and 12, a wafer working platform according to an embodiment of the present invention includes the wafer rotating platform, the heating module 5 and the wafer lifting mechanism 6 according to any of the foregoing embodiments, where the heating module 5 is disposed on the wafer carrying platform 1 and is provided with a heat insulation board on a peripheral side of the heating module 5, and the wafer rotating platform can separate the heating module 5 into an inner ring heating plate 51 and an outer ring heating plate 52, and the inner ring heating plate 51 and the outer ring heating plate 52 can heat a wafer at the same time, and the wafer lifting mechanism 6 can move along a vertical direction and support the wafer after protruding the heating module 5.
Specifically, the bottoms of the inner ring heating plate 51 and the outer ring heating plate 52 are respectively provided with a plurality of support rods, and the inner ring heating plate 51 and the outer ring heating plate 52 can be fixedly installed on the same horizontal plane through the plurality of support rods. Since the wafers are simultaneously placed on the inner ring heating plate 51 and the outer ring heating plate 52, by keeping the inner ring heating plate 51 and the outer ring heating plate 52 on the same horizontal plane, it is ensured that no height difference is generated between contact surfaces of the wafers after the wafers are contacted with the inner ring heating plate 51 and the outer ring heating plate 52, and even heating of the wafers by the inner ring heating plate 51 and the outer ring heating plate 52 is ensured.
Referring to fig. 7 to 8, more specifically, a plurality of groups of vacuum adsorption areas 521 are provided on the outer ring heating plate 52, each group of vacuum adsorption areas 521 is respectively arranged around the outer ring heating plate 52, and the groups of vacuum adsorption areas 521 independently work without interference with each other. Each group of vacuum adsorption areas 521 comprises a plurality of groups of vacuum flow passages 522 which are arranged in a staggered manner, and a plurality of vacuum adsorption holes are formed in the surface of the outer ring heating plate 52, each vacuum adsorption hole is communicated with the vacuum flow passage 522, the vacuum flow passage 522 can be connected to a second vacuum connector 523, and air in the vacuum flow passage 522 can be pumped out through the second vacuum connector 523 so that the vacuum adsorption holes can adsorb wafers under negative pressure.
Referring to fig. 5, the wafer lift mechanism 6 includes a wafer carrier 61, and the wafer carrier 61 is movable in a vertical direction and provides effective support for the wafer after the heating module 5 is protruded. The wafer carrier 61 is distributed along the edge of the wafer, and at least one wafer carrier 61 is also disposed at the center of the wafer, and when the wafer carrier 61 protrudes from the heating module 5 and contacts with the wafer, the wafer carrier 61 can support the peripheral edge of the wafer and the center of the wafer at the same time, so as to ensure the stable support of the whole wafer.
Specifically, the wafer lifting mechanism 6 further includes a second screw transmission assembly 62 and a third driving motor 63, and the third driving motor 63 is in belt transmission connection with the adjacent second screw transmission assembly 62 through the transmission belt 8, so that the second screw transmission assembly 62 can be driven to move along the vertical direction.
The second lead screw transmission components 62 are arranged on the periphery of the wafer and are connected with the wafer bearing piece 61 through the bottom plate 64, and the plurality of second lead screw transmission components 62 are connected through the transmission belt 8, so that synchronous movement among the plurality of second lead screw transmission components 62 is realized, idler wheels 7 are also arranged among the plurality of second lead screw transmission components 62, and further the transmission belt 8 can be ensured to effectively transmit with each second lead screw transmission component 62 through the idler wheels 7, so that the transmission efficiency is reduced due to the fact that the transmission area between the transmission belt 8 and each second lead screw transmission component 62 is too small.
Each second screw rod transmission assembly 62 comprises a transmission gear 621 and a screw rod transmission piece 622, the transmission gears 621 in adjacent second screw rod transmission assemblies 62 are in belt transmission connection through a transmission belt 8, at least one transmission gear 621 is connected with the output end of the third driving motor 63 so as to drive one transmission gear 621 to rotate through the third driving motor 63, and then other transmission gears 621 are driven to synchronously rotate through the rotating transmission gears 621.
Referring to fig. 11, each of the lead screw transmission members 622 includes a lead screw 6221 and a lead screw nut 6222, and the lead screw 6221 is threadedly coupled with the lead screw nut 6222 such that the lead screw nut 6222 disposed thereon is not rotated and is movable along the lead screw 6221 when the lead screw 6221 is rotated in place, and such that the lead screw nut 6222 is rotated while being moved along the lead screw 6221 when the lead screw 6221 is stationary but the lead screw nut 6222 disposed thereon is rotated. And the screw nuts 6222 are connected through the same bottom plate 64, so that synchronous movement among the screw driving members 622 is ensured, and meanwhile, since the wafer supporting members are also arranged on the same bottom plate 64, when the bottom plate 64 synchronously moves, the wafer supporting members arranged on the bottom plate 64 can be driven to synchronously move.
Specifically, since the second screw driver 622 can support the peripheral side and the center of the wafer respectively, the second screw driver 622 supporting the peripheral side of the wafer uses the same bottom plate 64 to control the synchronous movement thereof, while the second screw driver 622 supporting the center of the wafer connects the second screw driver 62, the wafer carrier 61 and the guide post 212 through the mounting block 6223, so that the second screw driver 62 can synchronously drive the wafer carrier 61 to move along the vertical direction through the mounting block 6223, and the guide post 212 penetrates through the mounting block 6223 to limit the second screw driver 62 from generating radial offset in the process of driving the wafer carrier 61 to move.
In addition, in order to ensure that the base plate 64 does not deviate during movement, a plurality of guide posts 212 are further provided on the base plate 64, and the guide posts 212 penetrate through the base plate 64 so that each region of the base plate 64 can move synchronously along a set direction without deviation.
Referring to fig. 9 to 10, a wafer processing method according to an embodiment of the present invention is applied to the wafer processing platform described in any of the above embodiments, and includes the following steps:
Conveying the wafer to a material receiving position;
the wafer lifting mechanism 6 lifts and receives the wafer;
the wafer lifting mechanism 6 descends to enable the wafer to gradually approach the heating module 5 until the temperature of the wafer reaches a first set temperature;
the wafer lifting mechanism 6 continuously descends until the wafer reaching the first set temperature is placed on the heating module 5 and continuously heated, so that the temperature of the wafer reaches the second set temperature;
Processing the wafer reaching the second set temperature;
The wafer rotating platform jacks up the processed wafer and rotates the wafer to a specified angle;
And taking out and conveying the processed wafer at the specified angle to the next station.
The wafer operation platform is mainly used for heating the wafer and performing primary anti-warping operation.
When heating, the wafer is first received by the wafer lifting mechanism 6 and scanned when entering, and the wafer is not in contact with the heating module 5. Along with the gradual retraction of the wafer lifting mechanism 6, the distance between the wafer supported by the wafer lifting mechanism 6 and the heating module 5 is gradually reduced, so that the temperature generated by the heating module 5 on the wafer gradually rises until the temperature of the wafer reaches a first set temperature, the wafer lifting mechanism 6 is completely retracted to an initial position, the supported wafer is also completely placed on the surface of the heating module 5 to be directly heated until the temperature of the wafer reaches a second set temperature, and then subsequent processing procedures (dispensing operation, detection operation and the like) are performed on the wafer. Through the heating operation on the wafer, the wafer can be ensured not to generate larger warpage (the wafer may generate a certain degree of warpage in the feeding or heating process) due to the sudden increase of the temperature in the whole process, and even the wafer can be cracked in severe cases so as to influence the subsequent process of the wafer.
When the wafer reaches the second set temperature, the whole wafer is softened, so that the wafer can be primarily leveled by performing the warp-resistant operation on the wafer in this state. Then, the wafer rotation platform is required to adjust the azimuth of the leveled wafer, and the azimuth of the wafer is adjusted when the wafer is conveyed into the wafer operation platform, and meanwhile, the azimuth of the wafer in the same batch is not completely consistent when the wafer is initially fed, so that the azimuth of the wafer is required to be adjusted to a specified angle and then conveyed to the next station for operation, and the azimuth of the wafer is ensured to be consistent when the wafer is conveyed to the next station for operation.
Therefore, when the wafer azimuth is adjusted, the wafer is firstly required to be jacked up through the wafer rotating platform, then the wafer rotating platform drives the wafer to rotate to a designated angle at the same time, then the wafer rotating platform is retracted to an initial position and the wafer with the adjusted azimuth is placed on the heating module 5, the wafer is jacked up again to a receiving position through the wafer lifting mechanism 6, and finally the wafer is taken out from the receiving position and conveyed to the next station for processing, so that all operations of the wafer in the wafer operating platform are completed, manual intervention is not required in the whole process, automatic alignment correction can be realized, the azimuth accuracy in the wafer operating process is ensured, and the working efficiency of the whole operation flow is improved.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-described preferred embodiments according to the present invention are intended to suggest that, from the above description, various changes and modifications can be made by the worker in question without departing from the technical spirit of the present invention. The technical scope of the present invention is not limited to the description, but must be determined by the scope of claims.
Claims (15)
1. A wafer rotation platform, comprising:
a wafer carrying table (1), wherein the wafer carrying table (1) is used for carrying a wafer;
a wafer supporting component (2), wherein the wafer supporting component (2) moves along a vertical direction and can protrude out of the wafer bearing table (1) for supporting the wafer;
The wafer lifting mechanism (3), the wafer lifting mechanism (3) is connected with the wafer supporting assembly (2) and drives the wafer supporting assembly (2) to move along the vertical direction;
And the wafer rotating mechanism (4) is used for driving the wafer supporting assembly (2) to rotate around the vertical direction and synchronously driving the wafer to rotate when the wafer supporting assembly (2) protrudes out of the wafer bearing table (1).
2. Wafer rotation platform according to claim 1, characterized in that the wafer lift mechanism (3) comprises:
the first screw rod transmission assembly (31) drives the wafer support assembly (2) to move up and down along the vertical direction;
The first driving motor (32) is in belt transmission connection with the first screw transmission assembly (31) through the transmission belt (8) so as to drive the first screw transmission assembly (31) to move.
3. The wafer rotation platform according to claim 1, wherein the wafer support assembly (2) comprises:
-a chassis (21), the wafer lift mechanism (3) being adapted to drive the chassis (21) to move in a vertical direction;
-a fixed outer ring (22), the fixed outer ring (22) being fixed to the chassis (21) via a plurality of support columns (27);
the movable top ring (23), the movable top ring (23) is connected with the fixed outer ring (22) through a bearing (26), and the movable top ring (23) can protrude out of the wafer bearing table (1).
4. A wafer spin platform according to claim 3, wherein the movable top ring (23) comprises:
-a top support (231), the top support (231) being adapted to protrude from the wafer carrier (1) and to be in contact with the wafer;
-a bottom mount (232), the bottom mount (232) being connected to the stationary outer ring (22) via a bearing (26);
-a middle connection (233), said middle connection (233) connecting said bottom mounting (232) and said top support (231) simultaneously.
5. The wafer spin platform of claim 4, wherein a vacuum suction chamber (24) is provided between the top support (231) and the stationary outer ring (22), the vacuum suction chamber (24) being provided with a first vacuum connection (28) to an external vacuum device,
The contact end of the top supporting piece (231) is provided with a plurality of vacuum chucks (2311) used for adsorbing the wafer, and the vacuum chucks (2311) are communicated with the vacuum adsorption cavity (24).
6. The wafer rotation platform according to claim 4, wherein the wafer rotation mechanism (4) comprises:
The belt pulley turntable (41), the belt pulley turntable (41) is fixedly sleeved on the bottom mounting piece (232);
the driving assembly (42) is arranged on the chassis (21), and the driving assembly (42) is in belt transmission connection with the belt wheel turntable (41) through a transmission belt (8) so as to drive the belt wheel turntable (41) to rotate and drive the movable top ring (23) to synchronously rotate through the belt wheel turntable (41).
7. The wafer spin platform of claim 6, wherein the drive assembly (42) comprises:
the second driving motor (421), the output end of the second driving motor (421) is provided with a first gear (422);
The input end of the speed reducing mechanism is in belt transmission connection with the first gear (422), and the output end of the speed reducing mechanism is connected with the belt pulley turntable (41) and drives the belt pulley turntable (41) to rotate.
8. The wafer spin platform of claim 7, wherein the reduction mechanism comprises a drive shaft, and a second gear (423) and a third gear (424) mounted on both ends of the drive shaft, the second gear (423) being connected to the first gear (422) by a drive belt (8), the third gear (424) being connected to the pulley turntable (41) by a drive belt (8), the second gear (423) having a diameter larger than that of the first gear (422).
9. A wafer processing platform, comprising:
the wafer rotation platform of any one of claims 1 to 8;
The heating module (5) is arranged on the wafer carrying table (1), the wafer rotating platform divides the heating module (5) into an inner ring heating plate (51) and an outer ring heating plate (52), and the inner ring heating plate (51) and the outer ring heating plate (52) are suitable for heating the wafer at the same time;
The wafer lifting mechanism (6), the wafer lifting mechanism (6) is suitable for moving along the vertical direction, and the wafer lifting mechanism (6) is suitable for protruding the heating module (5) and supporting the wafer.
10. The wafer work platform of claim 9, wherein the inner ring heater plate (51) and the outer ring heater plate (52) are fixedly mounted on the same horizontal plane via a plurality of support rods.
11. The wafer work platform of claim 9, wherein a plurality of groups of vacuum adsorption areas (521) are arranged on the outer ring heating plate (52), each group of vacuum adsorption areas (521) comprises a plurality of groups of vacuum flow channels (522) which are arranged in a staggered manner, a plurality of vacuum adsorption holes are formed in the plate surface of the outer heating plate, each vacuum adsorption hole is communicated with the vacuum flow channel (522), and the vacuum flow channel (522) is suitable for being connected to a second vacuum connector (523) so as to be capable of sucking air in the vacuum flow channel (522) through the second vacuum connector (523) and enabling each vacuum adsorption hole to adsorb the wafer under negative pressure.
12. Wafer work platform according to claim 9, characterized in that the wafer lift mechanism (6) comprises:
-a wafer carrier (61), the wafer carrier (61) being adapted to move in a straight direction, and the wafer carrier (61) being arranged at the peripheral edge and the centre of the wafer, respectively, so as to be able to support the peripheral edge of the wafer and the centre of the wafer simultaneously after protruding upwards out of the heating module (5).
13. The wafer work platform of claim 12, wherein the wafer lift mechanism (6) further comprises:
The second screw rod transmission assemblies (62) are arranged on the periphery side of the wafer and are connected with the wafer carriers (61) through bottom plates (64), and the second screw rod transmission assemblies (62) are connected through transmission belts (8) so as to be capable of synchronous movement;
And the third driving motor (63) is in belt transmission connection with the adjacent second screw transmission assemblies (62) through a transmission belt (8) so as to drive each second screw transmission assembly (62) to synchronously move along the vertical direction.
14. The wafer work platform of claim 13, wherein each of said second screw drive assemblies (62) comprises:
The transmission gears (621) are connected with each other through a transmission belt (8), and at least one transmission gear (621) is connected with the output end of the third driving motor (63) so as to be capable of driving each transmission gear (621) to synchronously rotate through the third driving motor (63);
The screw transmission piece (622), the screw transmission piece (622) comprises a screw (6221) and a screw nut (6222), the screw (6221) is in threaded connection with the screw nut (6222), and the screw (6221) is suitable for driving the screw nut (6222) to rotate through the transmission gear (621) and enabling the screw nut (6222) to linearly move along a path defined by the screw (6221).
15. A wafer processing method applied to the wafer processing platform of claims 9 to 14, the wafer processing method comprising the steps of:
Conveying the wafer to a material receiving position;
the wafer lifting mechanism (6) lifts and receives the wafer;
The wafer lifting mechanism (6) descends to enable the wafer to gradually approach the heating module (5) until the temperature of the wafer reaches a first set temperature;
The wafer lifting mechanism (6) continuously descends until the wafer reaching the first set temperature is placed on the heating module (5) and continuously heated, so that the temperature of the wafer reaches the second set temperature;
Processing the wafer reaching the second set temperature;
The wafer rotating platform jacks up the processed wafer and rotates the wafer to a specified angle;
And taking out and conveying the processed wafer at the specified angle to the next station.
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| CN202411541576.9A CN119419165A (en) | 2024-10-31 | 2024-10-31 | Wafer rotating platform, wafer operation platform and operation method thereof |
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| CN202411541576.9A CN119419165A (en) | 2024-10-31 | 2024-10-31 | Wafer rotating platform, wafer operation platform and operation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119953952A (en) * | 2025-04-11 | 2025-05-09 | 捷安特（昆山）有限公司 | Prepreg sheet stacking device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119953952A (en) * | 2025-04-11 | 2025-05-09 | 捷安特（昆山）有限公司 | Prepreg sheet stacking device |
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