CN119324177A - PVD equipment conveying system based on two conveying platforms - Google Patents
PVD equipment conveying system based on two conveying platforms Download PDFInfo
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- CN119324177A CN119324177A CN202411858465.0A CN202411858465A CN119324177A CN 119324177 A CN119324177 A CN 119324177A CN 202411858465 A CN202411858465 A CN 202411858465A CN 119324177 A CN119324177 A CN 119324177A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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Abstract
本发明涉及晶圆加工技术领域，尤其涉及一种基于双传送平台的PVD设备传送系统，该基于双传送平台的PVD设备传送系统包括第一传送平台、第二传送平台、上料结构和传送结构；第一工作腔内设有第一机械抓手；第二传送平台连接在第一传送平台的一侧，第二工作腔内设有第二机械抓手；传送结构包括轨道和储料件。本发明的一种基于双传送平台的PVD设备传送系统通过储料件在第一工作腔和第二工作腔内移动，方便第一机械抓手和第二机械抓手抓取晶圆放置在不同的工作台上，并且通过储料件的移动使得储料件上的晶圆能够按照不同的工艺路线进行加工制作，从而能够针对不同工艺路线的晶圆加工，适应性强，提高生产效率，提高产能。
The present invention relates to the field of wafer processing technology, and in particular to a PVD equipment transmission system based on a dual transmission platform, the PVD equipment transmission system based on the dual transmission platform includes a first transmission platform, a second transmission platform, a loading structure and a transmission structure; a first mechanical gripper is provided in a first working chamber; the second transmission platform is connected to a side of the first transmission platform, and a second mechanical gripper is provided in the second working chamber; the transmission structure includes a track and a storage member. The PVD equipment transmission system based on a dual transmission platform of the present invention moves in the first working chamber and the second working chamber through the storage member, so that the first mechanical gripper and the second mechanical gripper can grab the wafer and place it on different workbenches, and the movement of the storage member enables the wafer on the storage member to be processed and manufactured according to different process routes, so that wafers of different process routes can be processed, with strong adaptability, improved production efficiency, and increased production capacity.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a PVD equipment conveying system based on a double conveying platform.
Background
The Chinese patent document with the authority of the publication number CN115020308B discloses a wafer transmission device, an equipment platform system and a wafer transmission method thereof, the wafer transmission device, the equipment platform system and the wafer transmission method thereof disclose a conveying manipulator, a placing rack, an alignment device and an alignment manipulator, the conveying manipulator is positioned among a wafer loading box, the placing rack and wafer processing equipment, the conveying manipulator is used for conveying wafers in the wafer loading box to the placing rack and conveying the aligned wafers on the placing rack to the wafer processing equipment, the alignment manipulator is positioned between the placing rack and the alignment device and is used for conveying the wafers between the placing rack and the alignment device, and when the wafer transmission device, the equipment platform system and the wafer transmission method thereof are used, the alignment device for positioning the wafers is contained in the wafer transmission device, and the alignment device is not needed in the corresponding wafer processing equipment, so that the design of the mechanical transmission system of the wafer processing equipment is simplified, the wafer transmission efficiency in the wafer processing equipment is improved, and the whole efficiency of the equipment is further realized.
Currently, PVD metallization systems for semiconductor wafer processing commonly employ a Cluster system (Cluster wafer fabrication facility system). Each cluster tool system integrates a plurality of Process Modules (PMs) in a vacuum enclosure to Process wafers by wafers without breaking vacuum from the cluster tool system, and during cluster tool operation, wafer processing time and robot motion beats are fairly deterministic and can be considered constant under normal conditions.
In the current PVD apparatuses, the transfer platform mainly adopts a single-platform structure, and such a design is susceptible to transfer delay in mass production, thereby resulting in a decrease in the overall working efficiency of the apparatus. In addition, the single-platform transfer system cannot effectively split and manage substrates to be processed when processing multiple tasks, and further limits the improvement of productivity. The mainstream double-platform design scheme is limited to a specific process route and cavity combination, and after the product requirement is changed, the efficiency of the conveying platform is still reduced, so that the conveying platform becomes a productivity bottleneck.
Disclosure of Invention
The invention provides a PVD equipment conveying system based on a double conveying platform, which aims to solve the technical problems of low wafer production efficiency and low productivity of a single-platform mechanism in the prior art.
In order to solve the problems, the PVD equipment conveying system based on the double conveying platforms provided by the invention adopts the following technical scheme:
The PVD equipment conveying system based on the double conveying platforms comprises a first conveying platform, a second conveying platform, a feeding structure and a conveying structure, wherein the first conveying platform is connected with the feeding structure, a plurality of work tables are arranged in the circumferential direction of the first conveying platform, the first conveying platform comprises a first work cavity, a first mechanical gripper is arranged in the first work cavity and used for grabbing wafers in the feeding structure into work tables arranged around the first conveying platform, the second conveying platform is connected to one side, far away from the feeding structure, of the first conveying platform, a plurality of work tables are arranged in the circumferential direction of the second conveying platform, the second conveying platform comprises a second work cavity, a second mechanical gripper is arranged in the second work cavity and used for grabbing the wafers in the first conveying platform into work tables arranged around the second conveying platform, the conveying structure comprises a track arranged between the first conveying platform and the second conveying platform and a storage piece which is assembled on the track in a sliding mode, and a plurality of wafers can be placed on the storage piece.
The PVD equipment conveying system based on the double conveying platforms has the advantages that when the PVD equipment conveying system based on the double conveying platforms is used, firstly, a storage piece is stopped near a feeding structure on a track, then wafers of the feeding structure are sequentially grabbed onto the storage piece through a first mechanical grabbing hand, then the wafers are placed at different work tables according to different process routes through the first mechanical grabbing hand, then the storage piece is moved into a second work cavity, and the wafers are placed at different work tables according to different process routes through the second mechanical grabbing hand until all the wafers are processed, then the storage piece is stopped near the feeding structure on the track, then the wafers of the storage piece are sequentially grabbed into the feeding structure through the first mechanical grabbing hand, and meanwhile, new wafers to be processed are grabbed onto the storage piece. According to the PVD equipment conveying system based on the double conveying platforms, the storage piece moves in the first working cavity and the second working cavity, so that the first mechanical gripper and the second mechanical gripper can conveniently grip wafers and place the wafers on different working platforms, the wafers on the storage piece can be processed and manufactured according to different process routes through the movement of the storage piece, the processing equipment is capable of simultaneously processing the wafers in different process routes, high in adaptability, high in production efficiency and high in productivity, and meanwhile, the first mechanical gripper can store a plurality of wafers on the storage piece, so that air communication between a feeding structure and the first working cavity is reduced, and the vacuum state in the first working cavity is maintained.
Further, all be equipped with the connecting channel between first conveying platform and the second conveying platform, between first conveying platform and the material loading structure, the connecting channel is used for with first working chamber and second working chamber intercommunication, with first working chamber and material loading structure intercommunication.
The device has the beneficial effects that the first working cavity and the second working cavity are conveniently separated, the mutual influence between the first working cavity and the second working cavity is avoided, and the processing accuracy is ensured.
Further, the track is "8" style of calligraphy structure and track cross-section be the I shape, and the storage spare includes storage portion and sliding part, and sliding part has the spout of T style of calligraphy and spout and the orbital upper end adaptation of I shape, is equipped with many slide bars that can follow perpendicular to spout extending direction in the spout, and the slide bar rotates towards orbital one end and is equipped with the walking wheel that the axis extends along vertical direction, and the walking wheel is contact with the track all the time so that the storage spare is along the track walking.
The movable storage device has the beneficial effects that the movement of the storage piece is convenient, and meanwhile, through moving the sliding rod assembled in the sliding groove, when each traveling wheel walks on the arc-shaped part of the track, all the traveling wheels can also simultaneously lean against the track, so that the storage piece can stably walk and stop on the track.
Further, a plurality of blind holes are formed in the inner side wall of the sliding groove, the sliding rod is slidably assembled in the blind holes, a spring is connected between the sliding rod and the bottoms of the blind holes, and the spring is always in a compressed state.
The beneficial effects are that simple structure guarantees through spring elasticity that the walking wheel compresses tightly on the track all the time.
Further, the end parts of the sliding rods are connected with concave connecting frames, the upper ends of the connecting frames are provided with rotating motors, and output shafts of the rotating motors vertically extend downwards and are coaxially fixedly connected with the travelling wheels.
The movable storage device has the beneficial effects that the movable storage device is simple in structure, the movable storage device is convenient to drive the travelling wheels to rotate, and meanwhile, the movable storage device is controlled separately, so that the stable movement of the storage parts can be ensured when the travelling wheels are arranged on tracks with different radians.
Further, the connecting frame is also provided with a convex supporting seat, and the convex part of the supporting seat is coaxially arranged in the travelling wheel to support the travelling wheel.
The rotary traveling wheel has the beneficial effects of improving the stability of the traveling wheel during rotation.
Further, the storage part comprises a plurality of storage layers which are arranged at intervals along the vertical direction, and each storage layer is used for placing one wafer.
Further, both ends of the connecting channel are all provided with vacuum isolation pieces, the vacuum isolation pieces are used for sealing the connecting channel and keeping a vacuum state at the same time, the vacuum isolation pieces comprise a frame and a vacuum extractor, the frame is provided with a through hole penetrating through the frame along the horizontal direction, the lower side wall of the through hole is provided with a sliding groove, the sliding groove is internally provided with an isolation plate capable of completely sealing and blocking the through hole, the vacuum extractor is used for keeping the connecting channel in the vacuum state, a notch is formed in a track extending into the connecting channel, and the notch is correspondingly arranged with the isolation plate.
The wafer processing device has the beneficial effects of being simple in structure and convenient to operate, and guaranteeing that the first working cavity and the second working cavity are vacuum cavities, so that the processing quality of wafers is guaranteed.
Further, the first conveying platform is of a tetrahedron structure, two working positions for installing the working platform are respectively arranged on the periphery of the first conveying platform, the second conveying platform is of an octahedral structure, eight working positions which are uniformly distributed and used for installing the working platform are arranged on the circumference of the second conveying platform, the first conveying platform and the second conveying platform share the two working positions and are used for forming a connecting channel for communicating the first working cavity with the second working cavity, the first conveying platform and the feeding structure share the two working positions and are used for forming a connecting channel for communicating the first working cavity with the feeding structure.
Further, the vacuum extractor comprises a vacuum pump and an extracting pipe connected to the vacuum pump, and the extracting pipe is communicated with the inner cavity of the connecting channel.
Has the advantages of simple structure and convenient use.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, embodiments of the invention are illustrated by way of example and not by way of limitation, and like reference numerals refer to similar or corresponding parts and in which:
FIG. 1 is a schematic diagram of a PVD equipment transfer system based on a dual transfer platform according to the present invention;
FIG. 2 is a schematic diagram of a vacuum isolator for a PVD equipment transfer system based on a dual transfer platform in accordance with the present invention;
FIG. 3 is a schematic diagram of a transfer structure of a PVD equipment transfer system based on a dual transfer platform in accordance with the invention;
FIG. 4 is a schematic diagram of a storage part of a PVD equipment transfer system based on a dual transfer platform according to the present invention;
FIG. 5 is a vertical cross-sectional view of a stocker of a PVD equipment transfer system based on a dual transfer platform in accordance with the invention;
FIG. 6 is an enlarged schematic view of FIG. 5A;
FIG. 7 is an enlarged schematic view of FIG. 6 at B;
FIG. 8 is a horizontal cross-sectional view of a stocker of a PVD equipment transfer system based on a dual transfer platform in accordance with the invention.
Reference numerals illustrate:
1. A first transfer platform; 2, a second conveying platform, 3, a feeding structure, 4, a workbench, 5, a first mechanical gripper, 6, a second mechanical gripper, 7, a track, 8, a storage part, 9, a connecting channel, 10, a storage part, 11, a sliding part, 12, a chute, 13, a sliding rod, 14, a travelling wheel, 15, a blind hole, 16, a spring, 17, a connecting frame, 18, a rotating motor, 19, a supporting seat, 20, a storage material layer, 21, a frame, 22, a perforation, 23, a sliding groove, 24, a separation plate, 25 and a notch.
Detailed Description
The following description of the embodiments of the present invention will be made more complete and clear to those skilled in the art by reference to the figures of the embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Any number of elements in the figures are for illustration and not limitation, and any naming is used for distinction only and not for any limiting sense.
The principles and spirit of the present invention are explained in detail below with reference to several representative embodiments thereof.
The invention provides an embodiment 1 of a PVD equipment conveying system based on a double conveying platform, which comprises the following steps:
As shown in fig. 1 to 8, a PVD apparatus transfer system based on a dual transfer platform of the present invention includes a first transfer platform 1, a second transfer platform 2, a loading structure 3, a transfer structure, a connection channel 9, and a control system. The longitudinal direction of the first transfer stage 1 is defined as the left-right direction.
The loading structure 3 is used for storing wafers to be processed, and can add the wafers to be processed or take away the processed wafers manually.
The first conveying platform 1 is connected at the left end of the feeding structure 3, a plurality of work tables 4 are arranged in the circumferential direction of the first conveying platform 1, the first conveying platform 1 is provided with a first working cavity, and the first working cavity is respectively communicated with each work table 4 and the feeding structure 3 on the circumference of the first conveying platform 1. A first mechanical gripper 5 is arranged in the first working cavity and is used for grabbing the wafer in the feeding structure 3 into a working table 4 arranged around the first conveying platform 1. In this embodiment, the first conveying platform 1 has a tetrahedron structure, two working positions for installing the working table 4 are respectively arranged around the first conveying platform 1, wherein the working tables 4 are not arranged at the four working positions at the left side and the right side, and the working table 4 at the circumference of the first conveying platform 1 is a cavity with operations of degassing, pre-cleaning and the like.
The second conveying platform 2 is connected to one side, far away from the feeding structure 3, of the first conveying platform 1, a plurality of working tables 4 are also arranged in the circumferential direction of the second conveying platform 2, the second conveying platform 2 is provided with a second working cavity, and the second working cavity is respectively communicated with each working table 4 and the first working cavity of the circumference of the second conveying platform 2. A second mechanical gripper 6 is arranged in the second working chamber for grabbing the wafer into a working table 4 arranged around the second transfer platform 2. In this embodiment, the second conveying platform 2 is of an octahedral structure, eight working positions for installing working tables are uniformly distributed in the circumferential direction of the second conveying platform 2, two working positions on the right side of the second conveying platform 2 are not provided with working tables 4, and the connecting channel 9 for communicating the first working cavity and the second working cavity is formed between the two working positions on the left side of the first conveying platform 1, and the working tables 4 on the circumference of the second conveying platform 2 are cavities for degassing, pre-cleaning and other operations.
The connecting channel 9 is provided with two, and two connecting channels 9 are located respectively between first conveying platform 1 and second conveying platform 2, between first conveying platform 1 and the material loading structure 3, and connecting channel 9 is used for communicating first working chamber and second working chamber, with first working chamber and material loading structure 3 intercommunication.
The left and right ends of the connection channel 9 are provided with vacuum spacers for sealing the connection channel 9 while maintaining a vacuum state. As shown in fig. 2, the vacuum separator comprises two frames 21 arranged at intervals along the left-right direction and a vacuum extractor arranged between the two frames 21, wherein the frames 21 are provided with through holes 22 penetrating through the frames 21 along the horizontal direction, the lower side walls of the through holes 22 are provided with sliding grooves 23, the bottoms of the sliding grooves 23 are provided with separating cylinders, the telescopic ends of the separating cylinders vertically extend upwards and are connected with separating plates 24, and the separating plates 24 are used for completely sealing and blocking the through holes 22. The vacuum extractor comprises a vacuum pump and an extracting pipe connected to the vacuum pump, wherein the extracting pipe is communicated with the inner cavity of the connecting channel 9 so as to keep the vacuum state in the connecting channel 9.
As shown in fig. 3, the transfer structure comprises a rail 7 provided between the first and second working chambers and a magazine 8 slidably mounted on the rail 7. The track 7 is of an 8-shaped structure, the section of the track 7 is I-shaped, two notches 25 are formed in the part, extending into the connecting channel 9 between the first conveying platform 1 and the second conveying platform 2, of the track 7, the two notches 25 are respectively arranged in one-to-one correspondence with two isolation plates 24 on two frames 21 in the connecting channel 9 between the first conveying platform 1 and the second conveying platform 2, and therefore the isolation plates 24 can seal the connecting channel 9.
As shown in fig. 4 and 6, the storage part 8 includes a storage part 10 and a sliding part 11, the storage part 10 includes a plurality of storage layers 20 arranged at intervals along a vertical direction, each storage layer 20 is used for placing a wafer, and each storage layer 20 can be passed through by a corresponding first mechanical gripper 5 or second mechanical gripper 6.
The rail 7 is provided with a plurality of stop points, and each stop point is provided with a detector for detecting the position of the storage piece 8.
As shown in fig. 4,5, 6, 7 and 8, the sliding part 11 is connected to the bottom of the storage part 10, the sliding part 11 is provided with a T-shaped chute 12, the chute 12 is adapted to the upper end of the i-shaped track 7, a plurality of blind holes 15 are formed in two inner side walls of the chute 12 and are arranged at intervals along the extending direction of the chute 12, sliding rods 13 are slidably assembled in the blind holes 15, springs 16 are connected between the sliding rods 13 and bottoms of the blind holes 15, and the springs 16 are always in a compressed state. One end of the sliding rod 13 far away from the hole bottom of the blind hole 15 is connected with a concave connecting frame 17, the upper end of the connecting frame 17 is provided with a rotating motor 18, an output shaft of the rotating motor 18 extends vertically downwards, and a traveling wheel 14 is coaxially connected to the output shaft of the rotating motor 18. In this embodiment, the elasticity that provides through spring 16 makes walking wheel 14 compress tightly on track 7's lateral wall all the time, and then guarantees the stability when storing piece 8 removes, simultaneously because each walking wheel 14 sets up alone, even when storing piece 8 walked to track 7's arc section, each walking wheel 14 also can be according to the compression volume of the different self-adaptation of radian adjusting spring 16, and then makes walking wheel 14 compress tightly on track 7 all the time, finally guarantees the stability when storing piece 8 removes.
In this embodiment, as shown in fig. 7, in order to ensure the rotation stability of the travelling wheel 14, the connecting frame 17 is further provided with a convex supporting seat 19, and the convex portion of the supporting seat 19 is coaxially disposed in the travelling wheel 14 to support the travelling wheel 14.
The first mechanical gripper 5 and the second mechanical gripper 6 are single-picking and single-placing mechanical grippers in the prior art, and specific structures are not described herein.
The control system is used for controlling the storage piece 8 to move on the track 7 and controlling the storage piece 8 to stop at each stop point position on the track 7 according to a set program and signals transmitted into the control system by the detector, and when the storage piece 8 stops at the set stop point position, the corresponding first mechanical gripper 5 or the second mechanical gripper 6 is controlled to grab a wafer onto the storage piece 8 or grab the wafer from the storage piece 8 into a cavity at the corresponding workbench 4.
When the PVD equipment conveying system based on the double conveying platforms is used, firstly, the storage piece 8 is stopped near the feeding structure 3 on the track 7 through the control system, then, firstly, the isolation plates 24 on two sides of the connecting channel 9 between the first conveying platform 1 and the feeding structure 3 are opened, at the moment, the wafers of the feeding structure 3 are sequentially grabbed onto the storage piece 8 through the first mechanical grippers 5 and placed on different storage layers 20, then, the isolation plates 24 on two sides of the connecting channel 9 between the first conveying platform 1 and the feeding structure 3 are closed, then, the wafers are placed at the positions of the working platforms 4 which are different in circumference of the first conveying platform 1 according to different process routes through the first mechanical grippers 5, when the working platforms 4 on the circumference of the first conveying platform 1 are all in a working state, the two isolation plates 24 in the connecting channel 9 between the first conveying platform 1 and the second conveying platform 2 are opened, at the moment, the storage piece 8 enters the second working cavity along the track 7, then, the wafers are sequentially grabbed onto the corresponding to the two isolation plates 24 on the connecting channel 9 between the first conveying platform 1 and the second conveying platform 2, the wafers can be processed through the first mechanical grippers 5, the two isolation plates 24 on the two corresponding sides of the connecting channel 9 between the first conveying platform 1 and the second conveying platform 3 are stopped, the wafers can be repeatedly processed, and the wafers can be simultaneously, and the wafers can be stopped on the two adjacent to the working platforms 3 through the first and the two isolation plates 4, and the corresponding to the first mechanical grippers 3, and the wafer can be processed, and completely and the wafer on the two adjacent to the two isolation plates, and the two isolation plates 3, and the wafer can be processed, and the next to the wafer and the wafer can be processed.
According to the PVD equipment conveying system based on the double conveying platforms, the storage piece 8 moves in the first working cavity and the second working cavity, so that the first mechanical gripper 5 and the second mechanical gripper 6 can conveniently grip wafers and place the wafers on different working platforms 4, and the wafers on the storage piece 8 can be processed and manufactured according to different process routes through the movement of the storage piece 8, so that the PVD equipment conveying system based on the double conveying platforms can process wafers of different process routes at the same time, is high in adaptability, improves production efficiency, and improves productivity.
The invention provides an embodiment 2 of a PVD equipment conveying system based on a double conveying platform, which comprises the following steps:
the difference from embodiment 1 is mainly that in embodiment 1, a connection channel is provided between the first conveying platform and the second conveying platform, and the connection channel is used for communicating the first working chamber with the second working chamber.
In this embodiment, no connection channel is provided between the first and second transfer platforms, and at this time, the first and second working chambers are directly connected.
Embodiment 3 of a PVD device transfer system based on a dual transfer platform provided by the invention:
The difference with the embodiment 1 is mainly that in the embodiment 1, the end parts of the sliding rods are connected with concave connecting frames, the upper ends of the connecting frames are provided with rotating motors, and the output shafts of the rotating motors vertically extend downwards and are coaxially fixedly connected with the travelling wheels.
In this embodiment, the rotating electrical machine is disposed at the lower end of the connecting frame, and at this time, the output shaft of the rotating electrical machine extends vertically upwards and is fixedly connected with the travelling wheel coaxially.
Embodiment 4 of a PVD equipment transfer system based on a dual transfer platform provided by the invention:
the difference from the embodiment 1 is mainly that in the embodiment 1, the connecting frame is also provided with a convex supporting seat, and the convex part of the supporting seat is coaxially arranged in the travelling wheel to support the travelling wheel.
In this embodiment, no support base is provided.
Embodiment 5 of a PVD equipment transfer system based on a dual transfer platform provided by the invention:
The difference from the embodiment 1 is mainly that in the embodiment 1, the first mechanical gripper and the second mechanical gripper are both single-picking and single-placing mechanical grippers.
In this embodiment, the first mechanical gripper is a dual pick and dual place manipulator in the prior art.
From the foregoing description of the present specification, it will be further understood by those skilled in the art that terms such as "upper", "lower", "front", "rear", "left", "right", "width", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate an azimuth or a positional relationship, are based on the azimuth or the positional relationship shown in the drawings of the present specification, are for convenience only in explaining aspects of the present invention and simplifying the description, and do not explicitly or implicitly refer to devices or elements having to have the specific azimuth, be constructed and operate in the specific azimuth, and thus the azimuth or positional relationship terms described above should not be interpreted or construed as limitations of aspects of the present invention.
The present invention is not limited to the preferred embodiments, and the present invention is described above in any way, but is not limited to the preferred embodiments, and any person skilled in the art will appreciate that the present invention is not limited to the embodiments described above, while the above-described methods and techniques may be utilized to make some changes or modifications to equivalent embodiments, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention will still fall within the scope of the technical solutions of the present invention.
In addition, in the description of the present specification, the meaning of "plurality" means at least two, for example, two, three or more, etc., unless specifically defined otherwise.
Claims (10)
1. The PVD equipment conveying system based on the double conveying platforms is characterized by comprising a first conveying platform, a second conveying platform, a feeding structure and a conveying structure;
the first conveying platform is connected with the feeding structure, a plurality of work tables are arranged in the circumferential direction of the first conveying platform, the first conveying platform comprises a first working cavity, and a first mechanical gripper is arranged in the first working cavity;
The second conveying platform is connected to one side, far away from the feeding structure, of the first conveying platform, a plurality of work tables are arranged in the circumferential direction of the second conveying platform, the second conveying platform comprises a second working cavity, and a second mechanical gripper is arranged in the second working cavity;
the conveying structure comprises a track arranged between the first conveying platform and the second conveying platform and a storage piece which is assembled on the track in a sliding way, and a plurality of wafers can be placed on the storage piece;
The first mechanical gripper is used for grabbing the wafer on the storage piece into a workbench arranged around the first conveying platform, and the second mechanical gripper is used for grabbing the wafer on the storage piece into a workbench arranged around the second conveying platform.
2. The PVD equipment conveying system based on double conveying platforms according to claim 1, wherein connecting channels are arranged between the first conveying platform and the second conveying platform and between the first conveying platform and the feeding structure, and the connecting channels are used for communicating the first working cavity with the second working cavity and the first working cavity with the feeding structure.
3. The PVD equipment conveying system based on two conveying platforms according to claim 2, wherein the track is of an 8-shaped structure, the section of the track is I-shaped, the storage piece comprises a storage part and a sliding part, the sliding part is provided with a T-shaped sliding groove and is matched with the upper end of the I-shaped track, a plurality of sliding rods capable of moving along the extending direction perpendicular to the sliding groove are arranged in the sliding groove, one end of the sliding rod, which faces the track, is rotatably provided with a travelling wheel with an axis extending along the vertical direction, and the travelling wheel is always contacted with the track to enable the storage piece to travel along the track.
4. A PVD apparatus transfer system based on a dual transfer platform according to claim 3, wherein a plurality of blind holes are formed in the inner side wall of the chute, the sliding rod is slidably mounted in the blind holes, and a spring is connected between the sliding rod and the bottom of the blind holes, and is always in a compressed state.
5. The PVD equipment conveying system based on two conveying platforms according to claim 4, wherein the end parts of the sliding rods are connected with concave connecting frames, rotating motors are arranged at the upper ends of the connecting frames, and output shafts of the rotating motors vertically extend downwards and are fixedly connected with the travelling wheels in a coaxial mode.
6. The PVD equipment conveying system based on double conveying platforms according to claim 5, wherein the connecting frame is further provided with a convex supporting seat, and the convex part of the supporting seat is coaxially arranged in the travelling wheel to support the travelling wheel.
7. The PVD tool transfer system of claim 6, wherein the storage section comprises a plurality of storage layers spaced apart in a vertical direction, each storage layer for holding a wafer.
8. The PVD equipment conveying system based on the double conveying platforms according to any one of claims 2 to 7, wherein vacuum isolating pieces are arranged at two ends of the connecting channel, the vacuum isolating pieces are used for sealing the connecting channel and keeping a vacuum state, the vacuum isolating pieces comprise a frame and a vacuum extractor, a through hole penetrating the frame along the horizontal direction is formed in the frame, a sliding groove is formed in the lower side wall of the through hole, an isolating plate capable of completely sealing and blocking the through hole is slidably arranged in the sliding groove, the vacuum extractor is used for keeping the vacuum state in the connecting channel, a notch is formed in a track extending into the connecting channel, and the notch is arranged corresponding to the isolating plate.
9. The PVD equipment conveying system based on the double conveying platforms according to any one of claims 2-7, wherein the first conveying platform is of a tetrahedron structure, two working positions for installing the working platforms are arranged on the periphery of the first conveying platform respectively, the second conveying platform is of an octahedral structure, eight working positions for installing the working platforms are uniformly distributed in the circumferential direction, the first conveying platform and the second conveying platform share two working positions and are used for forming a connecting channel for communicating the first working cavity with the second working cavity, the first conveying platform and the feeding structure share two working positions and are used for forming a connecting channel for communicating the first working cavity with the feeding structure.
10. The PVD tool transfer system of claim 8, wherein the vacuum extractor comprises a vacuum pump and an extraction tube connected to the vacuum pump, the extraction tube in communication with the connecting channel lumen.
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| CN202411858465.0A CN119324177A (en) | 2024-12-17 | 2024-12-17 | PVD equipment conveying system based on two conveying platforms |
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| CN202411858465.0A CN119324177A (en) | 2024-12-17 | 2024-12-17 | PVD equipment conveying system based on two conveying platforms |
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| JP2017116889A (en) * | 2015-12-25 | 2017-06-29 | 株式会社ニコン | Transport apparatus and method, exposure system, exposure method, and device manufacturing method |
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| CN118692965A (en) * | 2024-08-22 | 2024-09-24 | 深圳市矩阵多元科技有限公司 | Square substrate transfer system for process platform |
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| JP2017116889A (en) * | 2015-12-25 | 2017-06-29 | 株式会社ニコン | Transport apparatus and method, exposure system, exposure method, and device manufacturing method |
| US20210242052A1 (en) * | 2020-02-05 | 2021-08-05 | Kabushiki Kaisha Yaskawa Denki | Transfer system, transfer method, and transfer apparatus |
| CN217822671U (en) * | 2022-05-31 | 2022-11-15 | 厦门宏泰智能制造有限公司 | In-out material inspection bin |
| CN118471850A (en) * | 2024-04-12 | 2024-08-09 | 深圳市矩阵多元科技有限公司 | Synchronous processing platform for multicrystal wafers on same plane |
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