CN119324174B - Field effect tube packaging device and packaging method - Google Patents
Field effect tube packaging device and packaging method Download PDFInfo
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- CN119324174B CN119324174B CN202411876861.6A CN202411876861A CN119324174B CN 119324174 B CN119324174 B CN 119324174B CN 202411876861 A CN202411876861 A CN 202411876861A CN 119324174 B CN119324174 B CN 119324174B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3202—Mechanical details, e.g. rollers or belts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3222—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
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Abstract
本发明公开了一种场效应管封装装置和封装方法，应用于场效应管封装技术领域，包括所述包括工作台、传送部一和从右往左依次设置于工作台顶部的取料机构、检测部一、固定机构、焊接机构、冷却机构、检测部二、下料机构，所述取料机构用于取下电路板并放置在所述传送部一上传送，所述固定机构和焊接机构用于在检测合格的电路板上封装场效应管，所述冷却机构用于冷却焊接完成的电路板，所述下料机构用于下料并收纳封装后检测合格的电路板，所述检测部一用于检测电路板变形情况，所述检测部二用于检测封装有场效应管的电路板的管脚焊接情况，所述封装装置还包括有封装系统，本发明，能够提高场效应管封装效率。
The present invention discloses a field effect tube packaging device and a packaging method, which are applied to the technical field of field effect tube packaging, and include a workbench, a conveying part 1, and a material taking mechanism, a detection part 1, a fixing mechanism, a welding mechanism, a cooling mechanism, a detection part 2, and a material unloading mechanism which are sequentially arranged on the top of the workbench from right to left. The material taking mechanism is used to take out a circuit board and place it on the conveying part 1 for transmission. The fixing mechanism and the welding mechanism are used to package a field effect tube on a circuit board that has passed the inspection. The cooling mechanism is used to cool the circuit board that has been welded. The material unloading mechanism is used to unload and store the circuit board that has passed the inspection after packaging. The detection part 1 is used to detect the deformation of the circuit board. The detection part 2 is used to detect the soldering condition of the pins of the circuit board packaged with the field effect tube. The packaging device also includes a packaging system. The present invention can improve the packaging efficiency of the field effect tube.
Description
Technical Field
The invention relates to the technical field of field effect transistor packaging, in particular to a field effect transistor packaging device and a field effect transistor packaging method.
Background
A field effect transistor is an abbreviation for field effect transistor. There are mainly two types, junction field effect transistors and metal oxide semiconductor field effect transistors, which are semiconductor devices that are voltage controlled by the majority carriers involved in conduction, also known as unipolar transistors. The packaging forms of the field effect tube include two types, namely, a plug-in type field effect tube pin penetrates through a mounting hole of a circuit board and is welded on the circuit board, and a surface mounting type field effect tube pin and a heat dissipation flange are directly welded on a bonding pad on the surface of the circuit board.
Although the surface-mounted packaging has many advantages, when the packaging form is used, the lead space of the circuit board is small, and when the packaging is abnormal, the circuit board is almost impossible to repair again, so that the requirement on the welding process is strict, if the welding is not cooled in time, the connection of the circuit board can be damaged, the use of subsequent products can be influenced, and the traditional surface-mounted packaging device can only perform the packaging operation of a single field effect tube, so that the production efficiency and the product qualification rate are greatly influenced.
Therefore, it is necessary to provide a field effect transistor packaging apparatus and a packaging method for solving the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a field effect transistor packaging device and a field effect transistor packaging method, which can improve the packaging quality and efficiency of a field effect transistor so as to solve the problems in the background technology.
In order to solve the technical problems, the invention provides a field effect tube packaging device and a packaging method, wherein the field effect tube packaging device comprises a workbench, a first conveying part, a first material taking mechanism, a first detecting part, a fixing mechanism, a welding mechanism, a cooling mechanism, a second detecting part and a discharging mechanism, wherein the first material taking mechanism, the first detecting part, the fixing mechanism, the welding mechanism, the cooling mechanism, the second detecting part and the discharging mechanism are sequentially arranged at the top of the workbench from right to left;
the first detection part comprises a first upright post, two first groups of air cylinders and two first groups of cameras;
the fixing mechanism is provided with two groups, the left side of the fixing mechanism is provided with a second conveying part, and the fixing mechanism comprises a pick-up part, a dispensing component and a mounting part;
The welding mechanism comprises a driving part III and four groups of welding heads, and the four groups of welding heads are equidistantly fixed at the bottom of the driving part III;
The cooling mechanism is provided with two groups and comprises a second upright post, two groups of second air cylinders and two groups of cooling heads, the cooling heads are of hollow structures, and an air outlet channel facing the first conveying part is arranged in the cooling heads;
The second detection part comprises a third upright post, a third group of air cylinders, a second group of cameras and two groups of temperature sensors;
The packaging device also comprises a packaging system, wherein the packaging system is used for collecting the conditions before and after packaging and judging the overall packaging result;
The packaging system comprises a collecting module, a judging module, a counting module, a control module and an alarm module, wherein the collecting module is used for collecting and recording the deformation condition of the circuit board raw material and the welding quality and temperature of the pins of the field effect tube, the judging module is used for judging and analyzing according to the collected data, the counting module is used for carrying out intermittent counting when the circuit board raw material and the circuit board packaged with the field effect tube are abnormal, the control module is used for controlling the operation of each link, and the alarm module is used for carrying out alarm prompt when the packaging device is abnormal in production.
According to the technical scheme, the first conveying part is fixed at the center of the top of the workbench, the first conveying part is arranged on the right side of the fixing mechanism, the welding mechanism and the cooling mechanism, and the right end of the first conveying part is provided with the defective goods recovery area.
According to the technical scheme, the material taking mechanism comprises a blanking assembly, a first material moving assembly and a first limiting part;
the blanking assembly comprises a first driving part, a first rotating table, two groups of storage frames and two groups of material sucking parts, the top of the workbench is fixedly connected with a protective shell, the first driving part and the material sucking parts are fixed at the top of the workbench and inside the protective shell, the first rotating table is connected with a bearing at the top of the workbench, two groups of material taking openings and two groups of limit openings are formed in the top of the first rotating table, each group of storage frames is two, the storage frames are arranged at the top of the first rotating table, and the storage frames, the material sucking parts correspond to the material taking openings in position;
the material moving assembly I is arranged on the left side of the rotary table I, the conveying part I penetrates through the top of the material moving assembly I, the material moving assembly I comprises a base, an electric telescopic rod, a limiting guide post and a material moving block, the electric telescopic rod is fixed on the side part of the base, the limiting guide post is fixed on the base, the material moving block is sleeved on the limiting guide post and is in sliding connection with the limiting guide post, the output end of the electric telescopic rod is fixedly connected with the material moving block, and the top of the material moving block is fixedly connected with the material moving rod;
The clamping block is fixedly connected to the output end of the limiting part, the clamping block is matched with the opening on the first rotary table in size, and the circuit board to be packaged can be sucked by the sucking part, and the temperature property of the rotary table during discharging can be limited and improved when the circuit board is moved to the first conveying part by the material moving component.
According to the technical scheme, the first upright post is fixed on the top of the workbench, the first air cylinder is fixed on one side part of the upright post, the first camera is fixed on one output end of the air cylinder, deformation of the packaged circuit board raw material can be detected, and the field effect transistor is packaged on the deformed circuit board in a processing mode.
According to the technical scheme, the second stand column is fixed at the top of the workbench, the second air cylinder is fixed at the second side part of the stand column, the cooling head is fixed at the second output end of the air cylinder, the cooling head is connected with the air pump, the welding spots of the pins of the field effect tube can be cooled, and meanwhile the field effect tube which is not welded and not glued is blown up by utilizing air flow, so that the field effect tube is offset.
According to the technical scheme, the dispensing assembly comprises a driving part II, a rotary table II, a dispensing seat, a limiting plate and a glue gun, wherein the dispensing seat is provided with four groups, the uniform circumference of the dispensing seat is distributed at the top of the rotary table II, the top of the dispensing seat is provided with a through groove and a detection groove, the through groove penetrates through the top of the rotary table II, the dispensing seat is adjustably fixed with two groups of sliding blocks, the limiting plate is fixed on the rotary table II, the limiting plate is provided with four groups of mounting grooves, the mounting grooves correspond to the positions of the dispensing seat, the glue gun is arranged in the mounting grooves, a glue outlet of the glue gun is positioned in the through groove, a photosensitive sensor is arranged in the detection groove, the photosensitive sensor is fixedly connected with the dispensing seat, glue can be dispensed on a field effect tube on the dispensing seat, and the mounting stability is improved.
According to the technical scheme, the stand column III is fixed at the top of the workbench, the air cylinder III is fixed at the three side parts of the stand column, the camera II and the temperature sensor are fixed at the output end of the air cylinder III, and the position of the field effect tube and the condition of a pin welding spot after the encapsulation is finished can be detected.
According to the technical scheme, the blanking mechanism comprises a receiving component, a material moving component II and a limiting part II, the structure of the receiving component is identical to the structure of the blanking component, the limiting part II is identical to the limiting part I in structure, the material moving component II comprises two groups of air cylinders IV and two groups of pushing plates, the air cylinders IV are fixed on one side part of the conveying part, the pushing plates are fixed on the output end of the air cylinders IV, and the field effect tubes which are qualified in packaging can be stored and placed.
According to the technical scheme, the acquisition module is electrically connected with the first detection part and the second detection part, and the control module is electrically connected with the first transmission part, the fixing mechanism, the welding mechanism, the cooling mechanism, the second detection part, the blanking mechanism and the second transmission part.
Compared with the prior art, the invention has the beneficial effects that the fixing mechanism, the welding mechanism and the cooling mechanism are arranged, so that the fixing, the welding and the cooling of the field effect tube can be finished, the welding point of the pin of the field effect tube can be cooled, and the unwelded field effect can be blown up by utilizing air flow to generate position offset, thereby being beneficial to improving the packaging effect and the production efficiency of the field effect tube;
through being provided with detection portion one and detection portion two, can detect the circuit board before the encapsulation field effect transistor and the circuit board after the encapsulation, ensure that the circuit board of encapsulation does not have the deformation, be favorable to improving the accuracy of encapsulation, reduce the inspection time of the product before the encapsulation and after the encapsulation simultaneously, improved production efficiency.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the take-off mechanism of the present invention;
FIG. 3 is a schematic view of the bottom view of the take off mechanism of the present invention;
FIG. 4 is a schematic rear view of a portion of the structure of the present invention;
FIG. 5 is an enlarged schematic view of the area A of FIG. 4 in accordance with the present invention;
FIG. 6 is a schematic view of the mounting mechanism of the present invention;
FIG. 7 is an enlarged schematic view of the structure of area B in FIG. 6 in accordance with the present invention;
FIG. 8 is an enlarged schematic view of the structure of area C of FIG. 4 in accordance with the present invention;
FIG. 9 is a schematic view of a cooling head portion in partial cross-section of the present invention;
in the figure, a workbench, a conveying part I;
3. The material taking mechanism comprises a material taking mechanism body 31, a material discharging assembly 311, a first driving part 312, a first rotary table 313, a storage frame 314, a material sucking part 32, a first material moving assembly 321, a base 322, an electric telescopic rod 323, a limiting guide post 324, a material moving block 33 and a first limiting part;
4. The first detection part, 41, the first cylinder, 42 and the first camera;
5. The device comprises a fixing mechanism, a pickup part, a 52 dispensing component, a 521 driving part II, a 522 rotating table II, a 523 dispensing seat, a 524 limiting plate, a 525 dispensing gun, a 526 photosensitive sensor and a 53 mounting part, wherein the fixing mechanism is arranged on the pickup part;
6. the welding mechanism comprises a welding mechanism, a driving part III, a welding head 62;
7. the cooling mechanism comprises a cooling mechanism, a cylinder II, a cooling head 72 and a cooling head;
8. The device comprises a second detection part, a third cylinder, a second camera, a second temperature sensor and a third cylinder, wherein the second detection part is 81;
9. the device comprises a blanking mechanism, a receiving assembly, a second shifting assembly 921, a fourth cylinder 922, a push plate 93 and a second limiting part, wherein the blanking mechanism is arranged on the first shifting assembly;
10. and a second conveying part.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-9, the technical scheme is that the field effect transistor packaging device comprises a workbench 1, a first conveying part 2, a material taking mechanism 3, a first detecting part 4, a fixing mechanism 5, a welding mechanism 6, a cooling mechanism 7, a second detecting part 8 and a discharging mechanism 9 which are sequentially arranged at the top of the workbench 1 from right to left, wherein the material taking mechanism 3 is used for taking down a circuit board and placing the circuit board on the first conveying part 2 for conveying, the fixing mechanism 5 and the welding mechanism 6 are used for packaging a field effect transistor on a qualified circuit board, the cooling mechanism 7 is used for cooling the circuit board after welding, the discharging mechanism 9 is used for discharging and accommodating the qualified circuit board after packaging, the first detecting part 4 is used for detecting the deformation condition of the circuit board, and the second detecting part 8 is used for detecting the welding condition of a pin of the field effect transistor.
Referring to fig. 1, a first conveying part 2 is fixed at the top center of the workbench 1, the first conveying part 2 is arranged on the right side of the fixing mechanism 5, the welding mechanism 6 and the cooling mechanism 7, a defective product recovery area is arranged at the right end of the first conveying part 2, and the first conveying part 2 preferably drives a transmission belt to convey.
Referring to fig. 1 to 3, the material taking mechanism 3 includes a blanking component 31, a first moving component 32 and a first limiting portion 33, the blanking component 31 is used for loading and unloading, the first moving component 32 is used for moving a circuit board removed from the blanking component 31 onto the first conveying portion 2, and the first limiting portion 33 is used for limiting the blanking component 31;
The blanking assembly 31 comprises a first driving part 311, a first rotating table 312, two groups of containing frames 313 and two groups of material absorbing parts 314, wherein a protective shell is fixedly connected to the top of the workbench 1, the first driving part 311 and the material absorbing parts 314 are fixed at the top of the workbench 1 and inside the protective shell, the first rotating table 312 is connected with a bearing at the top of the workbench 1, the output end of the first driving part 311 is connected with the first rotating table 312 in a rack-and-pinion transmission mode, the first driving part 311 is used for driving the first rotating table 312 to rotate, two groups of material taking openings and two groups of limit openings are formed in the top of the first rotating table 312, each group of containing frames 313 is two, the containing frames 313 are arranged at the top of the first rotating table 312, the containing frames 313, the material absorbing parts 314 correspond to the material taking openings in positions, and the material absorbing parts 314 are used for absorbing circuit boards;
The first material moving component 32 is arranged at the left side of the first rotary table 312, the first conveying part 2 penetrates through the top of the first material moving component 32, the first material moving component 32 comprises a base 321, an electric telescopic rod 322, a limiting guide column 323 and a material moving block 324, the electric telescopic rod 322 is fixed on the side part of the base 321, the limiting guide column 323 is fixed on the base 321, the material moving block 324 is sleeved on the limiting guide column 323 and is in sliding connection with the limiting guide column 323, the output end of the electric telescopic rod 322 is fixedly connected with the material moving block 324, and the top of the material moving block 324 is fixedly connected with the material moving rod;
the clamping block is fixedly connected to the output end of the first limiting part 33, the clamping block is matched with the opening on the first rotating table 312 in size, the first limiting part 33 is driven to stretch by an air cylinder, when the first limiting part 33 stretches, the clamping block is clamped into the limiting opening and used for limiting the first rotating table 312, the first rotating table 312 is prevented from rotating, and when the first limiting part 33 contracts, the clamping block releases the limiting of the first rotating table 312.
It should be noted that, the material sucking part 314 is driven by a cylinder to lift, the output end of the material sucking part 314 is connected with a suction cup to suck and discharge materials, the receiving frame 313 is a frame capable of taking and discharging materials up and down, a limiting structure for preventing materials from falling is arranged at the bottom of the receiving frame 313, and the receiving frame 313 is an existing structure and will not be repeated here.
In actual operation, the electric telescopic rod 322 stretches, so that the material moving block 324 drives the material moving rod to be located below the first rotary table 312, the material sucking part 314 stretches and sucks the circuit board in the storage frame 313 and descends, so that the circuit board is located on the base 321, then the electric telescopic rod 322 contracts, the circuit board is moved from the top of the base 321 to the first conveying part 2 to be conveyed, after the circuit board on the first storage frame 313 is conveyed, the first limiting part 33 contracts firstly, the first driving part 311 drives the first rotary table 312 to rotate, the first limiting part 33 stretches again, the clamping block is clamped into the notch, and the first rotary table 312 is limited.
Referring to fig. 4 and 5, the first detecting portion 4 includes a first column, a first two groups of cylinders 41 and a first two groups of cameras 42, the first column is fixed on the top of the workbench 1, the first cylinder 41 is fixed on a side portion of the first column, the first camera 42 is fixed at an output end of the first cylinder 41, and when in use, the first cylinder 41 starts production to drive the first camera 42 to descend, and a circuit board deformation condition of a field effect transistor to be packaged is photographed.
Referring to fig. 1, 6 and 7, the fixing mechanism 5 is provided with two groups, the left side of the fixing mechanism 5 is provided with a second conveying part 10, the second conveying part 10 is used for conveying and arranging the field effect tubes so that the directions of the field effect tubes are consistent, the fixing mechanism 5 comprises a pick-up part 51, a dispensing assembly 52 and a mounting part 53, the pick-up part 51 is used for placing the field effect tubes which are orderly arranged on the second conveying part 10 on the dispensing assembly 52 for dispensing, and the mounting part 53 is used for mounting the field effect tubes which are finished by dispensing on a circuit board;
The pick-up part 51 and the mounting part 53 can move up and down, left and right, and back and forth, and suction cups for picking up and mounting the field effect transistor are provided on the pick-up part 51 and the mounting part 53.
The dispensing assembly 52 comprises a second driving part 521, a second rotating table 522, a dispensing seat 523, a limiting plate 524 and a dispensing gun 525, wherein the second driving part 521 is used for driving the second rotating table 522 to rotate by a bevel gear driven by a motor, the dispensing seat 523 is provided with four groups, the dispensing seat 523 is uniformly circumferentially distributed at the top of the second rotating table 522, the top of the dispensing seat 523 is provided with a through groove and a detection groove, the through groove penetrates through the top of the second rotating table 522, the dispensing seat 523 is adjustably fixed with two groups of sliding blocks, field effect tubes with different sizes are conveniently placed after adjustment, the limiting plate 524 is fixed on the second rotating table 522, the limiting plate 524 is provided with four groups of mounting grooves, the mounting grooves correspond to the positions of the dispensing seat 523, the dispensing gun 525 is arranged in the mounting grooves, a dispensing opening of the dispensing gun 525 is positioned in the through groove, the detection groove is provided with a photosensitive sensor 526, and the photosensitive sensor 526 is fixedly connected with the dispensing seat 523.
In actual operation, when the pick-up part 51 places the fet on the dispensing base 523, the fet covers the detection groove, the photosensor 526 detects that the light is darkened, and is in a dark state, then the second driving part 521 is started, the second driving part 522 is driven to rotate for a quarter turn, the glue gun 525 is started, the glue is dispensed on the fet, then the second driving part 521 is started, the second driving part 522 is driven to continue to rotate for a quarter turn, and the fet dispensed with the glue is picked up by the mounting part 53 and mounted on the circuit board.
Referring to fig. 1 and 4, the welding mechanism 6 includes a third driving portion 61 and four welding heads 62, the four welding heads 62 are equidistantly fixed at the bottom of the third driving portion 61, the third driving portion 61 is preferably driven by an air cylinder, so that the four welding heads 62 can be driven to move back and forth along the first conveying portion 2 and move up and down independently or simultaneously, and when in use, the third driving portion 61 drives the welding heads 62 to adjust the back and forth positions and the up and down positions, so that the welding heads 62 weld pins of the field effect transistor to a circuit board.
Referring to fig. 4, 8 and 9, the cooling mechanism 7 is provided with two groups, the cooling mechanism 7 includes a second column, two groups of cylinders two 71 and two groups of cooling heads 72, the second column is fixed at the top of the workbench 1, the second cylinder 71 is fixed at the two sides of the column, the cooling heads 72 are fixed at the output ends of the second cylinder 71, the cooling heads 72 are hollow structures, an air outlet channel facing the first conveying part 2 is arranged inside the cooling heads 72, the cooling heads 72 are connected with an air pump, when in use, the second cylinder 71 stretches to drive the cooling heads 72 to descend, so that the cooling heads 72 cover the pins of the field effect tube after welding, the air pump is started, air flows rapidly blow the pins from the air outlet channel, the welding of the pins is cooled, and meanwhile, rapid cold air flows can blow up the field effect tube after welding, so that the position of the field effect tube is changed.
Referring to fig. 8, the second detecting portion 8 includes a third column, a third group of cylinders 81, a second group of cameras 82, and a second group of temperature sensors 83, the third column is fixed on the top of the workbench 1, the third cylinder 81 is fixed on the third side of the column, the second camera 82 and the temperature sensors 83 are fixed on the output end of the third cylinder 81, the second camera 82 is used for shooting the welding condition of the fet pins, and the temperature sensors 83 are used for detecting the welding temperature of the fet pins.
Referring to fig. 1, 4 and 8, the blanking mechanism 9 includes a receiving component 91, a moving component two 92 and a limiting part two 93, the structure of the receiving component 91 is the same as that of the blanking component 31, the limiting part two 93 and the limiting part one 33 are the same in structure, the moving component two 92 is used for moving the qualified circuit board on the conveying part one 2 to the lower part of the blanking component 31, the moving component two 92 includes two groups of cylinders four 921 and two groups of pushing plates 922, the cylinders four 921 are fixed on the side part of the conveying part one 2, the pushing plates 922 are fixed at the output end of the cylinders four 921, and when in use, the cylinders four 921 start to stretch, so that the pushing plates 922 push the circuit board on the conveying part one 2 to the receiving component 91, and the circuit board is accommodated and placed in the accommodating frame 313 by the receiving component 91.
It should be noted that, fixing mechanism 5, welding mechanism 6, cooling mechanism 7, detection portion two 8 and unloading mechanism 9 are provided with place the platform corresponding to the position department of conveying portion one 2, are provided with pneumatic clamping jaw near conveying portion one 2's one side, and pneumatic clamping jaw centre gripping circuit board when improving installation, welding, cooling, detection more is favorable to improving the precision of encapsulation.
The packaging device further comprises a packaging system, the packaging system is used for collecting the conditions before and after packaging and judging the whole packaging result, the packaging system comprises a collecting module, a judging module, a counting module, a control module and an alarm module, the collecting module is electrically connected with the first detecting part 4 and the second detecting part 8, the collecting module is used for collecting and recording the deformation condition of the circuit board raw material and the welding quality and temperature of the pins of the field effect tube, the judging module is used for judging and analyzing according to the collected data, the counting module is used for carrying out intermittent counting when the circuit board raw material and the circuit board packaged with the field effect tube are abnormal, the control module is electrically connected with the first conveying part 2, the fixing mechanism 5, the welding mechanism 6, the cooling mechanism 7, the second detecting part 8, the blanking mechanism 9 and the second conveying part 10, the control module is used for controlling the operation of each link, and the alarm module is used for carrying out alarm prompt when the packaging device is abnormal in production.
The packaging method of the field effect transistor packaging device comprises the following steps:
The first step is that the control module controls the material taking mechanism 3 to take materials and starts the first conveying part 2 to feed materials, and meanwhile controls the second conveying part 10 to start the field effect transistor.
And step two, the first detection part 4 detects the deformation condition of the circuit board of the field effect tube to be packaged, and the judgment module analyzes and judges the circuit board to perform subsequent packaging operation.
Specifically, the acquisition module acquires and records a shooting picture of the first camera 42, a contour matched with the circuit board shape of the field effect tube to be packaged is arranged in the judgment module, when the circuit board shape of the field effect tube to be packaged is matched with the contour, the circuit board is qualified, the subsequent packaging operation can be performed, when the circuit board shape of the field effect tube to be packaged is not matched with the contour, the circuit board is deformed to cause abnormal contour, the circuit board is unqualified, the subsequent packaging operation cannot be performed, meanwhile, the circuit board is fed back to the control module and the counting module, the control module controls the fixing mechanism 5, the welding mechanism 6, the cooling mechanism 7, the detection part II 8 and the blanking mechanism 9 corresponding to the deformed circuit board to be not operated, the first transmission part 2 is transmitted to the defective product recovery area, the counting module counts the deformation quantity, and the count value is marked as a.
And thirdly, the control module controls the fixing mechanism 5 to pick up and install the field effect tube, controls the welding mechanism 6 to weld pins of the field effect tube onto the circuit board, and controls the cooling mechanism 7 to cool the welded circuit board.
And fourthly, the second detection part 8 detects the welding quality and temperature of the field effect tube pins on the circuit board, and the judgment module analyzes and judges the abnormal reasons.
Specifically, the acquisition module acquires and records the shooting picture of the second camera 82 and the actual welding highest temperature detected by the temperature sensor 83, the actual highest temperature is recorded as T, a standard welding spot contour corresponding to a pin of the field effect tube, a standard position contour of the field effect tube on the circuit board, a welding spot temperature threshold meeting the storage requirement and a counting threshold are arranged in the judgment module, the temperature threshold is recorded as T, and the counting threshold is N.
When T is less than or equal to T, the cooling mechanism 7 runs normally for normal cooling, and the temperature requirement of storage is met;
When the position profile of the actual field effect tube on the circuit board is consistent with the standard position profile and the welding spot of the pin of the actual field effect tube is consistent with the standard welding spot profile, the field effect tube is packaged to be qualified and can be stored;
when the position profile of the actual field effect tube on the circuit board is consistent with the standard position profile and the welding spot of the pin of the field effect tube is inconsistent with the standard welding spot profile, the counting module performs intermittent counting of the abnormality of the welding mechanism 6 for the abnormality of the welding mechanism 6, and the counting value is b;
when the position profile of the actual field effect tube on the circuit board is inconsistent with the standard position profile and the welding spot of the pin of the field effect tube is consistent with the standard welding spot profile, the abnormal mounting of the fixed mechanism 5 is caused, if the actual position profile of the field effect tube can be detected at the moment, the abnormal mounting of the fixed mechanism 5 is caused, the intermittent counting is carried out by the counting module, the counting value is c 1, and if the actual position profile of the field effect tube can not be detected, the abnormal mounting of the fixed mechanism 5 is caused, and the counting value is c 2;
The position profile of the actual field effect tube on the circuit board is inconsistent with the standard position profile, the welding spots of the pins of the field effect tube are inconsistent with the standard welding spot profile, but when the welding spots are complete, the position deviation of the field effect tube is caused by the error touch of the field effect tube when the cooling mechanism 7 is cooled, the counting module counts the abnormal discontinuities of the cooling mechanism 7, the counting value is d;
When T > T, the corresponding cooling mechanism 7 runs abnormally, the judging module judges that the cooling mechanism is defective, and meanwhile, the cooling mechanism 7 is fed back to the counting module, the counting module performs intermittent counting of the cooling mechanism 7 abnormality, the counting value is still d, and deformation of pin welding spots and influence on the packaged circuit board are avoided when the circuit board is stored.
When a is more than or equal to N in the same batch, the counting module feeds back the alarm module to carry out alarm prompt, and staff checks the circuit boards in the batch, so that the influence on the production progress caused by the abnormality of the circuit boards is avoided, and the production efficiency is reduced;
When b, c 1、c2 and d are more than or equal to N, the counting module feeds back an alarm module to carry out alarm prompt, a worker overhauls the corresponding fixing mechanism 5, the welding mechanism 6 and the cooling mechanism 7, the defect rate of the field effect tube package is prevented from being passively increased due to the abnormality of the processing mechanism, after the worker processes the corresponding mechanism, the counting value of the mechanism is zeroed, the rest mechanisms still continue to count, if all the mechanisms are overhauled by the worker, the counting value still reaches N again, the alarm module carries out alarm prompt, and meanwhile, all the mechanisms on the packaging device are controlled to stop running, and the defect that continuous production does not meet the production requirement is avoided, and the production quality and the production progress are influenced.
It should be noted that the packaging device can also be used for single circuit board inspection of unpackaged field effect transistors and circuit board inspection of packaged field effect transistors.
Through the steps, the circuit board before the field effect tube is packaged and the circuit board after the field effect tube is packaged can be detected, the packaged circuit board is ensured to be free from deformation, the packaging accuracy is improved, and meanwhile, the fixing mechanism 5, the welding mechanism 6 and the cooling mechanism 7 are arranged, so that the field effect tube can be fixed, welded and cooled, the production flow and the cooling time are reduced, and the packaging efficiency is improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
It should be noted that the above-mentioned embodiments are merely preferred embodiments of the present invention, and the present invention is not limited thereto, but may be modified or substituted for some of the technical features thereof by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The field effect tube packaging device comprises a workbench (1), a first conveying part (2) and a material taking mechanism (3), a first detecting part (4), a fixing mechanism (5), a welding mechanism (6), a cooling mechanism (7), a second detecting part (8) and a blanking mechanism (9), wherein the material taking mechanism (3) is used for taking down a circuit board and placing the circuit board on the first conveying part (2) for conveying, the fixing mechanism (5) and the welding mechanism (6) are used for packaging the field effect tube on the circuit board which is qualified in detection, the cooling mechanism (7) is used for cooling the circuit board which is finished in welding, the blanking mechanism (9) is used for blanking and accommodating the circuit board which is qualified in detection after packaging, the first detecting part (4) is used for detecting the deformation condition of the circuit board, and the second detecting part (8) is used for detecting the pin welding condition of the circuit board which is packaged with the field effect tube;
The first detection part (4) comprises a first upright post, a first two groups of air cylinders (41) and a first two groups of cameras (42);
The fixing mechanism (5) is provided with two groups, the left side of the fixing mechanism (5) is provided with a second conveying part (10), and the fixing mechanism (5) comprises a pick-up part (51), a dispensing assembly (52) and a mounting part (53);
The dispensing assembly (52) comprises a second driving part (521), a second rotating table (522), a dispensing seat (523), a limiting plate (524) and a dispensing gun (525), wherein a through groove and a detection groove are formed in the top of the dispensing seat (523), the through groove penetrates through the top of the second rotating table (522), two groups of sliding blocks are adjustably fixed on the dispensing seat (523), a photosensitive sensor (526) is arranged in the detection groove, and the photosensitive sensor (526) is fixedly connected with the dispensing seat (523);
The pick-up part (51) and the mounting part (53) can move up and down, left and right and back and forth, and suction cups are arranged on the pick-up part (51) and the mounting part (53);
The welding mechanism (6) comprises a driving part III (61) and four groups of welding heads (62), and the four groups of welding heads (62) are equidistantly fixed at the bottom of the driving part III (61);
The cooling mechanism (7) is provided with two groups, the cooling mechanism (7) comprises a second upright post, two groups of air cylinders (71) and two groups of cooling heads (72), the second upright post is fixed at the top of the workbench (1), the second air cylinders (71) are fixed at two side parts of the upright post, the cooling heads (72) are fixed at the output ends of the second air cylinders (71), the cooling heads (72) are connected with an air pump, the cooling heads (72) are of hollow structures, an air outlet channel facing the first conveying part (2) is arranged inside, the second air cylinders (71) are elongated and drive the cooling heads (72) to descend, the cooling heads (72) are covered on welded field effect tube pins, air flows are fast blown to the pins from the air outlet channel, and meanwhile, fast cold air flows can blow up unwelded field effect tubes, so that the positions of the field effect tubes change;
The second detection part (8) comprises a third upright post, a third cylinder (81) with two groups, a second camera (82) with two groups and a second temperature sensor (83);
the packaging device also comprises a packaging system, wherein the packaging system is used for collecting the conditions before and after packaging and judging the overall packaging result;
The packaging system comprises an acquisition module, a judgment module, a counting module, a control module and an alarm module, wherein the acquisition module is used for acquiring and recording the deformation condition of the circuit board raw material and the welding quality and temperature of the pins of the field effect tube, the judgment module is used for judging and analyzing according to acquired data, the counting module is used for carrying out intermittent counting when the circuit board raw material and the circuit board packaged with the field effect tube are abnormal, the control module is used for controlling the operation of each link, and the alarm module is used for carrying out alarm prompt when the packaging device is abnormal in production.
2. The field effect tube packaging device according to claim 1, wherein the first conveying part (2) is fixed at the top center of the workbench (1), the first conveying part (2) is arranged on the right side of the fixing mechanism (5), the welding mechanism (6) and the cooling mechanism (7), and a defective product recovery area is arranged at the right end of the first conveying part (2).
3. A field effect transistor packaging apparatus according to claim 2, wherein the material taking mechanism (3) comprises a blanking component (31), a material moving component one (32) and a limiting part one (33);
The blanking assembly (31) comprises a first driving part (311), a first rotating table (312), two groups of containing frames (313) and two groups of material absorbing parts (314), wherein a protective shell is fixedly connected to the top of the workbench (1), the first driving part (311) and the material absorbing parts (314) are fixed to the top of the workbench (1) and inside the protective shell, the first rotating table (312) is connected with a bearing at the top of the workbench (1), two groups of material taking openings and two groups of limit openings are formed in the top of the first rotating table (312), two groups of containing frames (313) are arranged at the top of the first rotating table (312), and the containing frames (313), the material absorbing parts (314) correspond to the material taking openings in position;
The first material moving component (32) is arranged on the left side of the first rotary table (312), the first conveying part (2) penetrates through the top of the first material moving component (32), the first material moving component (32) comprises a base (321), an electric telescopic rod (322), a limiting guide post (323) and a material moving block (324), the electric telescopic rod (322) is fixed on the side part of the base (321), the limiting guide post (323) is fixed on the base (321), the material moving block (324) is sleeved on the limiting guide post (323) and is in sliding connection with the limiting guide post (323), the output end of the electric telescopic rod (322) is fixedly connected with the material moving block (324), and the top of the material moving block (324) is fixedly connected with the material moving rod;
The output end of the first limiting part (33) is fixedly connected with a clamping block, and the clamping block is matched with the opening on the first rotary table (312) in size.
4. The field effect tube packaging device according to claim 1, wherein the first upright post is fixed on the top of the workbench (1), the first cylinder (41) is fixed on one side of the first upright post, and the first camera (42) is fixed on the output end of the first cylinder (41).
5. The field effect tube packaging device according to claim 1, wherein the dispensing base (523) is provided with four groups, the dispensing base (523) is uniformly circumferentially distributed at the top of the rotary table two (522), the limiting plate (524) is fixed on the rotary table two (522), four groups of mounting grooves are formed in the limiting plate (524), the mounting grooves correspond to the positions of the dispensing base (523), the glue gun (525) is arranged in the mounting grooves, and the glue outlet of the glue gun (525) is located in the through groove.
6. The field effect tube packaging device according to claim 1, wherein the third upright post is fixed on the top of the workbench (1), the third cylinder (81) is fixed on the third side part of the upright post, and the second camera (82) and the temperature sensor (83) are fixed on the output end of the third cylinder (81).
7. A field effect tube packaging apparatus according to claim 3, wherein the blanking mechanism (9) comprises a receiving component (91), a moving component two (92) and a limiting part two (93), the structure of the receiving component (91) is identical to that of the blanking component (31), the limiting part two (93) is identical to that of the limiting part one (33), the moving component two (92) comprises two groups of air cylinders four (921) and two groups of pushing plates (922), the air cylinders four (921) are fixed on the side part of the conveying part one (2), and the pushing plates (922) are fixed on the output end of the air cylinders four (921).
8. The field effect tube packaging device according to claim 6, wherein the acquisition module is electrically connected with the first detection part (4) and the second detection part (8), and the control module is electrically connected with the first transmission part (2), the fixing mechanism (5), the welding mechanism (6), the cooling mechanism (7), the second detection part (8), the blanking mechanism (9) and the second transmission part (10).
9. The packaging method of the field effect tube packaging device is characterized by comprising the following steps that a control module controls a material taking mechanism (3) to take materials and a first transmission part (2) to feed materials, and a second transmission part (10) to start the transmission of the field effect tube;
The first detection part (4) detects the deformation condition of the circuit board of the field effect transistor to be packaged, and the judgment module analyzes and judges the circuit board to perform subsequent packaging operation;
step three, the control module controls the fixing mechanism (5) to pick up and install the field effect tube, controls the welding mechanism (6) to weld pins of the field effect tube onto the circuit board, and controls the cooling mechanism (7) to cool the welded circuit board;
And fourthly, a second detection part (8) detects the welding quality and the temperature of the field effect tube pins on the circuit board, and a judgment module analyzes and judges the abnormal reasons.
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Address after: 213000 No.10 Hongzhuang Road, Zhonglou District, Changzhou City, Jiangsu Province Patentee after: Jiangsu Ruiyuan Holding Group Co., Ltd. Country or region after: China Address before: 213000 No.10 Hongzhuang Road, Zhonglou District, Changzhou City, Jiangsu Province Patentee before: Jiangsu Ruiyuan Semiconductor Co., Ltd. Country or region before: China |