CN119274880B - Semiconductive water-blocking binding tape containing water-blocking powder and preparation device thereof - Google Patents

Semiconductive water-blocking binding tape containing water-blocking powder and preparation device thereof Download PDF

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Publication number
CN119274880B
CN119274880B CN202411776239.8A CN202411776239A CN119274880B CN 119274880 B CN119274880 B CN 119274880B CN 202411776239 A CN202411776239 A CN 202411776239A CN 119274880 B CN119274880 B CN 119274880B
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coating
substrate
blocking
water
air suction
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CN202411776239.8A
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CN119274880A (en
Inventor
阎海智
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Shenyang Wodexi Industrial Material Co ltd
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Shenyang Wodexi Industrial Material Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/30—Drying; Impregnating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/32—Filling or coating with impervious material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/32—Filling or coating with impervious material
    • H01B13/321—Filling or coating with impervious material the material being a powder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
    • H01B7/282—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable
    • H01B7/285—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable by completely or partially filling interstices in the cable
    • H01B7/288—Preventing penetration of fluid, e.g. water or humidity, into conductor or cable by completely or partially filling interstices in the cable using hygroscopic material or material swelling in the presence of liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/29—Protection against damage caused by extremes of temperature or by flame
    • H01B7/292—Protection against damage caused by extremes of temperature or by flame using material resistant to heat
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
    • Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention discloses a semiconductive water-blocking binding tape containing water-blocking powder and a preparation device thereof, in particular to the technical field of cable materials, the preparation device comprises a raw material supply system, a coating system, a powdering system and a drying and curing system, the coating system comprises a coating rack, the coating frame is provided with a base material roll, a coating head and a supporting roller set, a conveying pipeline of the raw material supply system is connected to the coating head, the powdering system is used for applying water-blocking filler to the substrate, and the preparation device further comprises a wool smoothing component used for forming air flow penetrating through the substrate on the substrate. The binding product prepared by the invention has strong hygroscopicity, large expansion rate, reliable water blocking effect, small product resistance and good semi-conductive performance, and can effectively weaken the electric field strength after being applied to a cable, and has low production cost and stable technical performance.

Description

Semiconductive water-blocking binding tape containing water-blocking powder and preparation device thereof
Technical Field
The invention relates to the technical field of cable materials, in particular to a semiconductive water-blocking binding tape containing water-blocking powder and a preparation device thereof.
Background
The invention relates to the technical field of cable materials, in particular to a preparation device of a semiconductive water-blocking binding belt for a waterproof medium-voltage, high-voltage and ultra-voltage power cable, other control, communication, signal and instrument cables with shielding requirements.
In the traditional cable waterproof technology, the used binding belt has the problems of insufficient waterproof performance, high material cost, complex preparation process and the like, the importance of the semiconductive water-blocking material serving as a protective layer in a high-voltage cable is in urgent need of improvement, and particularly in the actual production process of the binding belt, the key for determining the production quality of the binding belt is coating processing, and the binding belt is required to provide good coating quality guarantee, so that the coating layer is fully coated, the thickness of the coating layer is uniform, the coating layer is stably attached and the like.
When the substrate is stored and fed in the coating process, the substrate is continuously separated from the substrate roll, the compressed floss structure which is originally caused by rolling extrusion is pulled away again, so that a tiny tilted floss structure appears on the surface of the substrate, when the coating layer is relatively thick in the coating process, the tiny floss structure can be pressed down to form a cover, and the integrity of the coating layer can be kept, but if the coating layer is relatively thin, and the substrate material has a large number of larger floss structures, the coating layer is difficult to completely press down the floss structure, so that the actual coating effect can be influenced, the product quality is reduced, the actual protection effect on the cable can be influenced when the product is applied to the cable in the later stage, and the cable quality can not be effectively ensured.
Disclosure of Invention
The invention provides a semiconductive water-blocking binding tape containing water-blocking powder and a preparation device thereof, and aims to solve the problems that a tiny fluff structure on a substrate influences the actual coating effect, and the product quality is reduced, so that when a later product is applied to a cable, the actual protection effect on the cable is influenced, and the cable quality cannot be effectively ensured.
The preparation device of the semiconductive water-blocking binding belt containing water-blocking powder comprises a raw material supply system, a coating system, a powdering system and a drying and curing system, wherein the raw material supply system is used for supplying coating raw materials to the coating system, the coating system is used for coating the coating raw materials on the surface of a substrate, and the drying and curing system is used for heating and drying the coated coating layer and accelerating the curing of the materials;
The coating system comprises a coating frame, a base material roll, a coating head and a supporting roller set are arranged on the coating frame, a conveying pipeline of the raw material supply system is connected to the coating head, and the powdering system is used for applying water-blocking filler to a substrate;
the apparatus also includes a hair-smoothing assembly for creating a flow of air across the substrate on the substrate.
In a preferred embodiment, the down-hair component is arranged on the coating frame, the down-hair component comprises an air suction cover, two ends of the air suction cover are fixedly connected with the coating frame through mounting plates respectively, an air suction pipe is fixedly connected to the bottom of the air suction cover and connected with air suction equipment, the air suction cover is positioned at the bottom of the substrate, the air suction cover is positioned at a position before the coating processing of the substrate, and an opening of the air suction cover is arranged corresponding to the substrate.
In a preferred embodiment, the two ends of the air extraction cover are fixedly connected with guide plugging plates, the guide plugging plates are attached to the edges of the substrate, the guide plugging plates plug the two ends of the air extraction cover, so that the top of the air extraction cover forms an air inlet opening, the guide plugging plates extend onto the coating support roller and are provided with circular arc-shaped clamping groove structures which are mutually matched with the outer circumference of the coating support roller, and two groups of guide plugging plates and the air extraction cover form a group of adhesive roller openings outside the coating support roller.
In a preferred embodiment, the side of the coating head facing away from the direction of movement of the substrate is provided with a glue overflow area, at which excess coating material is deposited as the coating head outputs the coating material.
In a preferred embodiment, the down-hair component further comprises a blowing cover, the blowing cover is arranged above the substrate and corresponds to the position of the air suction cover, the opening of the blowing cover is arranged corresponding to the substrate, two ends of the blowing cover are fixedly connected with the mounting plate, and a blowing pipe is arranged on the blowing cover and connected with blowing equipment.
In a preferred embodiment, the air blowing cover is provided with a heating structure, the heating structure is formed by fixedly connecting a plurality of groups of electric heating wires to the air blowing cover, and the plurality of groups of electric heating wires are distributed in a net shape.
In a preferred embodiment, the gas-pumping cover is provided with a micro-pore plate, the micro-pore plate is detachably connected with the gas-pumping cover, and the substrate is in sliding fit with the micro-pore plate.
The semiconductive water-blocking binding belt comprises a substrate and two coating layers, wherein the two coating layers are respectively a first coating layer and a second coating layer;
the first coating layer and the second coating layer are respectively arranged on the front surface and the back surface of the substrate, and water-blocking fillers are filled in the spinning gaps of the substrate.
In a preferred embodiment, the substrate is a polyester fabric and the water blocking filler is a water blocking powder which is a semiconducting resistor powder.
In a preferred embodiment, the first coating layer is formed by coating a semiconductive adhesive on one side surface of the substrate, and the second coating layer is formed by coating a semiconductive rubber water blocking adhesive on the other side surface of the substrate.
The invention has the beneficial effects that the preparation equipment can exhaust air from the lower part of the substrate by utilizing the down-hair component, so that air flow passing through a spinning gap of the substrate from top to bottom is formed in the substrate, further, a micro fluff structure on a textile material enters the spinning gap, further, before the substrate reaches the top of a coating supporting roller for coating, the problem that the quality of a coating layer is influenced due to the protruding micro fluff structure can be greatly reduced, further, the actual quality of a product is effectively ensured, the protection effect of the product on the cable is ensured when the product is applied to the cable, and the binding tape prepared by the invention has the advantages of strong hygroscopicity, high expansion rate, reliable water blocking effect, small product resistance, good semi-conductivity, capability of effectively weakening the electric field strength, high integral mechanical strength, good heat resistance, simple production process, low production cost, stable technical performance and strong practicability.
Drawings
FIG. 1 is a schematic structural view of a semiconductive water-blocking tie of the present invention containing water-blocking powder.
FIG. 2 is a flow chart of a method for preparing the semiconductive water-blocking binding belt containing water-blocking powder.
FIG. 3 is a schematic diagram of a system for preparing a semiconductive water-blocking binding tape containing water-blocking powder according to the present invention.
Fig. 4 is a schematic structural view of a coating system and a drying and curing system used for preparing the semiconductive water-blocking binding tape containing water-blocking powder according to the present invention.
Fig. 5 is a schematic view of the overall structure of the coating system of the present invention.
Fig. 6 is a simplified view of the hair alignment assembly of the present invention.
FIG. 7 is a schematic view showing the state in which fluff on a base textile material is blown into a textile gap by an air stream according to the present invention.
Fig. 8 is a schematic structural view of the improved hair straightening assembly of the present invention.
FIG. 9 is a schematic view of the mounting plate of the present invention.
Fig. 10 is a schematic view showing an operation state of the suction hood of the present invention.
FIG. 11 is a schematic view showing the airflow action at the opening of the adhesive roll during the coating operation of the present invention.
FIG. 12 is a schematic view showing the contact state between the edge of the substrate and the guide plugging plate.
Fig. 13 is a schematic view of the mating of the guide plugging plate of the present invention on a coating backup roll.
FIG. 14 is a schematic view of the structure of the present invention with the addition of a hood and edge pull assembly.
Fig. 15 is an enlarged view of the invention based on the edge pull assembly of fig. 14.
FIG. 16 is a top view of the edge pull assembly of the present invention.
FIG. 17 is a schematic view of an edge roller assembly of the present invention mated with two sets of guide rollers to form a sloped structure.
The adhesive coating device comprises the following components of 1, a substrate, 11, a first coating layer, 12, a second coating layer, 13, a water-blocking filler, 2, a raw material supply system, 3, a coating system, 31, a coating frame, 32, a coating head, 321, an adhesive overflow area, 33, a supporting roller set, 331, a guide roller, 332, a coating supporting roller, 34, a base material roll, 35, a winding roller, 4, a drying and curing system, 5, a powdering system, 6, a hair smoothing component, 61, an air suction cover, 611, an air suction pipe, 612, a sticking roller opening, 613, a microporous plate, 62, a mounting plate, 63, a guide blocking plate, 64, an air blowing cover, 641, an air blowing pipe, 642, a heating structure, 7, a edge pulling component, 71, a flexible belt, 711, a guide clamping groove, 72, a guide wheel, 721, a guide convex ring, 73 and a needle.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings, wherein it is to be understood that the following detailed description is for the purpose of further illustrating the application only and is not to be construed as limiting the scope of the application, as various insubstantial modifications and adaptations of the application to those skilled in the art can be made in light of the foregoing disclosure.
Embodiment 1 referring to fig. 1 of the specification, a semiconductive water-blocking binding tape containing water-blocking powder comprises a substrate 1 and two coating layers, wherein the two coating layers are a first coating layer 11 and a second coating layer 12 respectively, and the first coating layer 11 and the second coating layer 12 are respectively arranged on the front surface and the back surface of the substrate 1.
The substrate 1 is a polyester fabric (for example, polyester cloth), the textile gaps of the substrate 1 are filled with water-blocking filler 13, the water-blocking filler 13 is water-blocking powder, the water-blocking powder can be scattered on the polyester cloth, and the water-blocking powder is filled in the fabric gaps through vibration.
The first coating layer 11 is formed by coating a semiconductive adhesive on one side surface of the substrate 1, and the second coating layer 12 is formed by coating a semiconductive rubber water blocking adhesive on the other side surface of the substrate 1.
The water-blocking powder is a semiconductor resistor water powder, such as SAP (super absorbent resin).
Among them, the semiconductive adhesive is a special adhesive material, which not only has good adhesive property, but also has a certain conductivity or semi-conductivity. The material is widely applied to industries such as electronics, electricity, automobiles and the like, and particularly applied to occasions needing to realize the bonding and conductive functions at the same time. The main components and characteristics are as follows:
the matrix resin is usually a polymer material such as epoxy resin, polyurethane, acrylic resin, etc., and provides adhesive properties and mechanical strength.
Conductive fillers common conductive fillers are carbon black, metal powders (e.g., silver powder, copper powder), conductive polymers, and the like, which impart conductivity or semi-conductivity to the adhesive.
Plasticizers for improving the flexibility and processability of the adhesive.
And (3) a curing agent, namely promoting the curing of the matrix resin and ensuring that the adhesive can be quickly hardened in the use process.
Other additives such as antioxidants, moisture barriers, lubricants, etc., are used to improve the overall properties of the adhesive.
And the semiconductive rubber water-blocking adhesive is a special material combining conductivity, flexibility and waterproof performance of rubber. The adhesive has wide application in electronic, electric, communication and automobile industries, especially in the fields of adhesion, conductivity and waterproof. The main components and characteristics are as follows:
Base rubber common base rubbers include silicone rubber, nitrile rubber (NBR), neoprene (CR), butyl rubber, crosslinked semiconducting polyacrylate, and the like. The rubber has good flexibility and weather resistance, and can adapt to various environmental conditions.
Conductive filler typically includes carbon black, graphite, metal powders (e.g., silver powder, copper powder, etc.). These fillers can impart conductivity or semi-conductivity to the adhesive.
The waterproof agent, such as silane coupling agent, hydrophobic silica, etc., can improve the waterproof performance of the adhesive and prevent water intrusion.
Plasticizers, such as phthalates, phosphates, and the like, are used to improve the flexibility and processability of the adhesive.
Curing agents, such as amines, anhydrides, etc., are used to promote the crosslinking reaction of the matrix rubber, ensuring that the adhesive can harden rapidly during use.
Other additives such as antioxidants, moisture barriers, lubricants, etc., are used to improve the overall properties of the adhesive.
Embodiment 2, based on the semiconductive water-blocking binding tape containing water-blocking powder provided in embodiment 1, the invention further provides a preparation process of the semiconductive water-blocking binding tape containing water-blocking powder, and referring to fig. 2 of the specification, the preparation process comprises the following steps:
firstly, manufacturing a substrate 1, and selecting a polyester fabric to manufacture the substrate 1 meeting the requirements according to the specification requirements of products;
Step two, cleaning the surface of the substrate 1 to remove impurities, for example, using an air blowing device to blow air, wherein the direction of the air blowing deviates from the output direction of the fabric substrate so as to reduce the possibility that the impurities are blown to the rubberizing position;
step three, applying a first coating layer 11, namely coating a semiconductive adhesive on a substrate 1 through a coating system 3 (the linear speed is 10-30 m/min), and then drying through a drying and curing system 4 (the drying temperature is 120-200 ℃), so as to form the first coating layer 11;
Applying a water-blocking filler 13, namely applying the water-blocking filler 13 (namely water-blocking powder) to the substrate 1 obtained in the step three through a powdering system 5, wherein the water-blocking filler 13 is applied from the uncoated side of the substrate 1, so that the water-blocking filler 13 is fused into a textile gap of the substrate 1 (when the water-blocking filler is applied, vibration equipment can be adopted to drive the substrate to vibrate, so that the water-blocking powder is better fused into the textile gap of the substrate);
Step five, applying a second coating layer 12, namely coating a semiconductive rubber water-blocking adhesive (the linear speed is 10-30 m/min) on the substrate 1 through a coating system 3, and then drying (the drying temperature is 120-200 ℃) through a drying and curing system to form the second coating layer 12;
and step six, testing the waterproof performance and the high pressure resistance of the binding belt product.
The binding tape prepared by the invention has the advantages of strong hygroscopicity, large expansion rate, high expansion rate, reliable water blocking effect, small product resistance, good semi-conductive performance, high integral mechanical strength, good heat resistance, stable technical performance and strong practicability due to the arrangement of the semi-conductive adhesive coating layer and the semi-conductive rubber water blocking adhesive coating layer.
The invention also provides a preparation device of the semiconductive water-blocking binding belt containing water-blocking powder, which mainly comprises a raw material supply system 2, a coating system 3, a powdering system 5 and a drying and curing system 4, wherein the raw material supply system 2 is used for supplying coating raw materials to the coating system 3, for example, based on the step three and the step five, semiconductive adhesive and semiconductive rubber water-blocking adhesive are respectively supplied to the coating system 3 through the raw material supply system 2, the coating system 3 is used for coating the coating raw materials (semiconductive adhesive or semiconductive rubber water-blocking adhesive) on the surface of the substrate 1, and the drying and curing system 4 is used for heating and drying the coated coating layer and accelerating the material curing.
The raw material supply system 2 includes a coating raw material storage tank, a delivery pipe (self-heating), a delivery driving device, and a flow control valve.
The coating system 3 includes a coating frame 31, a base material roll 34, a coating head 32 and a supporting roller set 33 are disposed on the coating frame 31, a conveying pipeline of the raw material supply system 2 is connected to the coating head 32, a coating raw material is supplied to the coating head 32, the conveying driving device drives the coating raw material to circulate and convey, the supply of the coating raw material is realized (a pump can be used for pumping, the height of a storage tank for the coating raw material can be increased, the coating raw material can flow by itself by gravity), the coating head 32 coats corresponding materials on the surface of a substrate, and then the coating raw material is conveyed to a drying and curing system 4 for drying and heating, curing of the materials is accelerated, and finally the coating raw material is wound.
The powdering system 5 is used to apply a water-blocking filler 13 (i.e., water-blocking powder) to the substrate, wherein the powdering may be performed using a powdering machine to fuse the water-blocking powder into the textile interstices of the substrate.
The preparation device improves the production efficiency of the water-blocking binding belt, reduces the production cost, improves the water resistance and electrical performance of the product, and is beneficial to ensuring the uniformity of water-blocking powder coating.
In example 3, in the foregoing embodiment, for the production process of the semiconductive water-blocking binding tape of the water-blocking powder provided by the present invention, the key device for determining the production quality is the coating system 3, which is required to provide good quality assurance, so as to ensure that the coating layer is sufficiently coated, the thickness of the coating layer is uniform, the adhesion of the coating layer is stable, etc., in the production of the corresponding water-blocking binding tape in the prior art, in order to ensure the product quality of the water-blocking binding tape, the thickness of the coating layer is relatively large, but the performance of the semiconductive water-blocking binding tape provided by the present invention is relatively high, so that, compared with the ordinary water-blocking binding tape, the thickness of the outer coating layer of the product can be relatively thin.
In the preparation process provided by the invention, although the surface of the substrate 1 is effectively cleaned by using the blowing equipment, most of thread ends and other impurities can be removed, but part of tiny villi (directly connected with the textile) connected to the substrate 1 cannot be removed, especially when the substrate 1 is stored and fed in a manner of a substrate roll 34, the substrate 1 is continuously separated from the substrate roll 34 in the feeding process, the inner and outer layers of substrates 1 are separated, the compressed villi structure originally caused by rolling extrusion is pulled apart again, so that a tiny raised villi structure appears on the surface of the substrate 1, when a coating layer is relatively thick in coating processing, the tiny villi structure can be pressed down, and a cover is formed, and further the integrity of the coating layer can be kept, if the coating layer is relatively thin, and the substrate 1 material itself is provided with a plurality of villi structures, the structure is difficult to be completely pressed down, the quality of the structure is influenced, and the cable quality is effectively influenced in the cable can not be effectively guaranteed, and the cable protection effect in the later stage can not be effectively guaranteed.
For this purpose, the invention also provides the following technical scheme, specifically, referring to fig. 4 to 14 of the specification, the drying and curing system 4 is arranged at the output end of the coating system 3, the supporting roller set 33 comprises a guiding roller 331 and a coating supporting roller 332, the coating supporting roller 332 is positioned below the coating head 32, the coating processing is carried out on the surface of the substrate 1 by matching with the coating head 32, the substrate 1 on the substrate material roll 34 is guided and conveyed by the guiding roller 331 and guided to the area between the coating supporting roller 332 and the coating head 32, the raw material supply system 2 supplies corresponding coating raw materials to the coating head 32 and outputs the corresponding coating raw materials to the surface of the substrate 1, the coating operation is completed by the coating head 32 along with the conveying of the substrate 1, the coated substrate 1 is directly guided and conveyed into the drying and curing system 4 by the corresponding guiding roller 331 for heating and curing, the coating supporting roller 332 is provided with a down-hair component 6 on one side facing away from the coating conveying direction of the substrate 1, the down-hair component 6 comprises an air suction cover 61, two ends of the air suction cover 61 are fixedly connected with the coating frame 31 through mounting plates 62 respectively, the bottom of the air suction cover 61 is fixedly connected with an air suction pipe 611, the air suction pipe 611 is connected with air suction equipment (such as an air suction pump), the air suction cover 61 is positioned at the bottom of the substrate 1 and is positioned at a position before the coating processing of the substrate 1, an opening of the air suction cover 61 is arranged corresponding to the substrate 1, and then the air suction cover 61 can suck air below the substrate 1 in the processing process, so that an air flow passing through a spinning gap of the substrate 1 from top to bottom is formed in the substrate 1, and the air flow can deform a tiny fluff structure on a textile material downwards and enter the spinning gap, and then before the substrate 1 reaches the top of the coating supporting roller 332 for coating, the problem that the quality of a coating layer is influenced due to the fact that the tiny fluff structure is prominent can be greatly reduced, and then the actual quality of a product is effectively guaranteed, and the protection effect of the product applied to a cable is guaranteed.
Further, in the above embodiment, the coating frame 31 is further provided with the wind-up roller 35, the substrate 1 after being dried in the drying and curing system 4 is coated by the coating head 32 and then led to the wind-up roller 35 for winding, so that the subsequent operation is facilitated.
Further, in order to improve the effect of the air flow passing through the substrate 1, referring to fig. 8 to 13 of the specification, two ends of the air suction cover 61 are fixedly connected with guide plugging plates 63, the guide plugging plates 63 are attached to edges of the substrate 1, the two ends of the air suction cover 61 are plugged by the guide plugging plates 63, so that an air inlet opening is formed at the top of the air suction cover 61, the efficiency of the air flow passing through the substrate 1 during air suction can be improved, the guide plugging plates 63 extend to the coating support roller 332, a circular arc-shaped clamping groove structure mutually matched with the outer circumference of the coating support roller 332 is arranged, the guide plugging plates 63 can be clamped on the coating support roller 332, contact plugging can be formed between the edges of the two sides of the substrate 1 under the condition that the rotation of the coating support roller 332 is not affected, one side of the air suction cover 61 corresponding to the coating support roller 332 is slidingly attached to the coating support roller 332, the two sets of guide plugging plates 63 and the air exhaust cover 61 form a set of paste roller openings 612 outside the coating supporting roller 332, the paste roller openings 612 correspond to a triangular area formed between the substrate 1 and the coating supporting roller 332, so as to maximally increase the ventilation area of the surface of the substrate 1 and extend the area to the coating point as far as possible, wherein one side of the coating head 32, which is far away from the moving direction of the substrate 1, is provided with a glue overflow area 321, when the coating head 32 outputs the coating raw material, the glue overflow area 321 enables the excessive coating raw material to be accumulated at the glue overflow area 321, namely the glue overflow area 321 is used for accommodating the excessive coating raw material, so that the coating raw material can form a pre-coverage on the surface of the substrate 1, and the coating head 32 forms a blade coating to ensure that the coating raw material can fully contact with the substrate 1, meanwhile, the accumulated coating raw material in the glue overflow area 321 is closer to the paste roller openings 321, and the air exhaust cover 61 is in the air exhaust process, due to the air flow, negative pressure is formed in the triangular region formed between the coating support roller 332 and the substrate 1, and the negative pressure can promote the coating raw materials accumulated above the triangular region to form downward pressure, namely, the capability of the coating raw materials to permeate into the spinning gap of the substrate 1 is increased, so that the bonding effect of the coating layer and the substrate 1 can be increased, the bonding strength of the coating layer is improved, meanwhile, the effect of the coating raw materials to permeate and press down the tiny fluff is enhanced, and the influence on the quality of the coating layer caused by the outward warping of the tiny fluff structure is avoided to the greatest extent.
Besides being used for limiting the air extraction space, the guiding plugging plate 63 can also guide the substrate 1 to ensure that the substrate passes through the coating area accurately, and under the limitation of the guiding plugging plate 63, the coating raw material can be ensured to be fully contacted with the edge of the substrate 1 without overflowing, so that the coating effect is improved.
Further, in order to improve the efficiency of processing the micro fluff, referring to fig. 14 of the specification, the embodiment further provides a technical scheme, specifically, the following fluff component 6 further includes a blowing cover 64, the blowing cover 64 is disposed above the substrate 1 and corresponds to the position of the air suction cover 61, the opening of the blowing cover 64 is disposed corresponding to the substrate 1, two ends of the blowing cover 64 are fixedly connected with the mounting plate 62, the blowing cover 64 is provided with a blowing pipe 641, the blowing pipe 641 is connected with a blowing device (such as a blowing pump), a heating structure 642 is disposed in the blowing cover 64, the heating structure 642 is formed by fixedly connecting a plurality of groups of electric heating wires with the blowing cover 64, and the plurality of groups of electric heating wires are in a net-shaped distribution, so that the blowing of the blowing cover 64 can make the airflow passing through the substrate 1 stronger, meanwhile, the heating structure 642 heats the air, and shapes the fluff after the fluff is blown, thereby avoiding subsequent upwarp, and improving the processing effect of the fluff.
In order to reduce the subsequent processing steps, specifically, referring to fig. 14, the embodiment further provides a technical solution, in which, in the air suction cover 61 is provided with a micro-hole plate 613, the micro-hole plate 613 is detachably connected with the air suction cover 61 (for example, by screw mounting), the substrate 1 is slidably attached to the micro-hole plate 613, so that the substrate 1 can form a penetrating air flow, and meanwhile, the down-deformation of the nap at the lower part of the substrate 1 can be avoided, the flatness of the lower surface of the substrate 1 is ensured, meanwhile, if the substrate 1 is pre-filled with the water-blocking filler 13, the water-blocking filler 13 is not separated from the substrate 1 by supporting and filtering the micro-hole plate 613 during the first coating, so as to ensure the processing stability, and after the first coating, the substrate 1 surface is formed with the first coating layer 11, and when the second coating is performed, the material is separated from the material roll, the first coating layer 11 is separated, and the nap at the lower part of the substrate 1 is prevented from being deformed, and the second coating component is not required when the two layers of material are separated from each other.
Further, in the above embodiment, the guiding plugging plate 63 has a limiting effect on the substrate 1, and also has a plugging effect on the openings 612 of the adhesive roll, where a part of the substrate 1 is relatively soft, thin in whole and high in elasticity, at this time, when the substrate 1 passes through the down-hair component 6, the substrate 1 is easy to wave, and the edge of the substrate 1 is separated from the guiding plugging plate 63, so as to affect the plugging effect on the airflow space, therefore, referring to fig. 14 to 17 of the specification, the embodiment further provides a technical scheme that two sets of edge pulling components 7 are disposed on the inner side of the guiding plugging plate 63, the two sets of edge pulling components 7 are disposed on the upper and lower sides of the substrate 1, each set of edge pulling components 7 includes a set of flexible belts 71 and two sets of guide wheels 72, the flexible belts 71 are sleeved outside the two sets of guide wheels 72, so as to form a track structure, and the surface of the flexible belts 71 is fixedly connected with multiple sets of needles 73.
Wherein, the edge of the base 1 cooperates with the flexible belt 71, and then makes the needle 73 can prick into the surface of the base 1, forms certain supporting effect to the base 1, and when the base 1 is carried, the flexible belt 71 can move like the track, does not influence the carrying of the base 1, and then can form effective support to the edge of the base 1 by means of the flexible belt 71, make the edge of the base 1 fit the guide plugging plate 63 as much as possible, reduce the clearance between the base 1 and the guide plugging plate 63.
It should be noted that, the edge pulling assembly 7 may be disposed near the suction hood 61 according to the length of the guide plugging plate 63 and the conveying track of the substrate 1, and may be configured in multiple groups, so that the corresponding positions and numbers of the edge pulling assemblies 7 are reasonably set without affecting the operations of the suction hood 61 and the blowing hood 64.
Further, referring to fig. 16 and 17 of the present disclosure, the length direction of the flexible belt 71 is obliquely set with respect to the conveying direction of the substrate 1, that is, the flexible belt 71 is gradually close to the guide plugging plate 63 along the conveying direction of the substrate 1, specifically, in the two sets of guide wheels 72 in each set of edge pulling assembly 7, the distance between the guide wheels 72 on one side, which is away from the conveying direction of the substrate 1, and the guide plugging plate 63 is greater than the distance between the guide wheels 72 on the other set of guide wheels 72, that is, one set of guide wheels 72 is far from the guide plugging plate 63, the other set of guide wheels 72 is closer to the guide plugging plate 63, and the surface of the guide wheels 72 is fixedly connected with a guide convex ring 721, the inner side wall of the flexible belt 71 is provided with a guide clamping groove 711, and the guide convex ring 721 and the guide clamping groove are mutually clamped, and the flexible belt 71 is made of an elastic material, such as a rubber belt, so that self-adaptive deformation can be generated, and the flexible belt 71 supported by the two sets of guide wheels 72 forms a relative inclination (for facilitating the viewing, the inclination angle in the illustration is relatively greater), and further, after the substrate 1 contacts the needle 73, in the advancing process, one set of guide wheels 72 is far from the guide plugging plate 63, and the other set of guide belt 71 is further, and the air-flat to the two edges 61 are coated with the substrate 61, and the air-sealing cover 61, and the air-sealing effect is further improved.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.

Claims (9)

1. The preparation device of the semiconductive water-blocking binding belt containing the water-blocking powder is characterized by comprising a raw material supply system (2), a coating system (3), a powdering system (5) and a drying and curing system (4), wherein the raw material supply system (2) is used for supplying coating raw materials to the coating system (3), the coating system (3) is used for coating the coating raw materials on the surface of a substrate (1), and the drying and curing system (4) is used for heating and drying the coated coating layer and accelerating material curing;
The coating system (3) comprises a coating frame (31), a base material roll (34), a coating head (32) and a supporting roller set (33) are arranged on the coating frame (31), a conveying pipeline of the raw material supply system (2) is connected to the coating head (32), and the powdering system (5) is used for applying water-blocking filler (13) on a substrate;
The preparation device further comprises a hair smoothing assembly (6), wherein the hair smoothing assembly (6) is used for forming air flow penetrating through the substrate (1) on the substrate (1);
The coating machine comprises a coating frame (31), wherein a wool component (6) is arranged on the coating frame (31), the wool component (6) comprises an air suction cover (61), two ends of the air suction cover (61) are fixedly connected with the coating frame (31) through mounting plates (62) respectively, an air suction pipe (611) is fixedly connected to the bottom of the air suction cover (61), the air suction pipe (611) is connected with air suction equipment, the air suction cover (61) is arranged at the bottom of a substrate (1), the air suction cover (61) is arranged at the position before coating processing of the substrate (1), and an opening of the air suction cover (61) is arranged corresponding to the substrate (1).
2. The device for preparing the semiconductive water-blocking binding belt containing water-blocking powder according to claim 1, wherein two ends of the air suction cover (61) are fixedly connected with guide blocking plates (63), the guide blocking plates (63) are attached to the edges of the substrate (1), the guide blocking plates (63) block the two ends of the air suction cover (61) to form air inlet openings at the tops of the air suction cover (61), the guide blocking plates (63) extend onto the coating support roller (332) and are provided with circular arc-shaped clamping groove structures mutually matched with the outer circumference of the coating support roller (332), and a group of attaching roller openings (612) are formed outside the coating support roller (332) by the two groups of the guide blocking plates (63) and the air suction cover (61).
3. The device for preparing the semiconductive water-blocking binding belt containing water-blocking powder according to claim 2, wherein a glue overflow area (321) is arranged on one side of the coating head (32) away from the moving direction of the substrate (1), and the glue overflow area (321) enables redundant coating raw materials to be accumulated at the glue overflow area (321) when the coating head (32) outputs the coating raw materials.
4. The device for preparing the semiconductive water-blocking binding belt containing water-blocking powder according to claim 3, wherein the hair-smoothing component (6) further comprises a blowing cover (64), the blowing cover (64) is arranged above the substrate (1) and corresponds to the position of the air suction cover (61), an opening of the blowing cover (64) is arranged corresponding to the substrate (1), two ends of the blowing cover (64) are fixedly connected with the mounting plate (62), a blowing pipe (641) is arranged on the blowing cover (64), and the blowing pipe (641) is connected with blowing equipment.
5. The device for preparing the semiconductive water-blocking binding belt containing water-blocking powder as claimed in claim 4, wherein a heating structure (642) is arranged in the blowing cover (64), the heating structure (642) is formed by fixedly connecting a plurality of groups of electric heating wires on the blowing cover (64), and the electric heating wires are distributed in a net shape.
6. The device for preparing the semiconductive water-blocking binding belt containing water-blocking powder according to claim 5, wherein the air suction cover (61) is provided with a micro-pore plate (613), the micro-pore plate (613) is detachably connected with the air suction cover (61), and the substrate (1) is in sliding fit with the micro-pore plate (613).
7. The semiconductive water-blocking binding belt containing water-blocking powder prepared by the preparation device according to claim 6 is characterized by comprising a substrate (1) and two coating layers, wherein the two coating layers are respectively a first coating layer (11) and a second coating layer (12);
the first coating layer (11) and the second coating layer (12) are respectively arranged on the front surface and the back surface of the substrate (1), and water-blocking fillers (13) are filled in spinning gaps of the substrate (1).
8. The semiconductive water-blocking binding belt containing water-blocking powder according to claim 7, wherein the substrate (1) is a polyester fabric, the water-blocking filler (13) is water-blocking powder, and the water-blocking powder is semiconductive resistance water powder.
9. A semiconductive water-blocking binding tape comprising water-blocking powder according to claim 8, wherein the first coating layer (11) is formed by coating a semiconductive adhesive on one side surface of the substrate (1), and the second coating layer (12) is formed by coating a semiconductive rubber water-blocking adhesive on the other side surface of the substrate (1).
CN202411776239.8A 2024-12-05 2024-12-05 Semiconductive water-blocking binding tape containing water-blocking powder and preparation device thereof Active CN119274880B (en)

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CN208542464U (en) * 2018-06-21 2019-02-26 无锡腾华电缆材料科技有限公司 Semiconductive blocks water binding strap production line
CN221335067U (en) * 2023-12-01 2024-07-16 游晟纺织科技(深圳)有限公司 Textile rubberizing coating device

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KR20100098885A (en) * 2009-03-02 2010-09-10 유성권 Semiconductive waterproof tape producting method
DE102010030657A1 (en) * 2010-06-29 2011-12-29 Deutsches Zentrum für Luft- und Raumfahrt e.V. Method for applying e.g. catalytic active metal particles, on carbon-containing membrane to manufacture e.g. gas diffusion layer, in fuel cell application, involves passing flow of gas through porous substrate to apply particles
CN221789872U (en) * 2023-12-29 2024-10-01 无锡腾华电缆材料科技有限公司 Water-blocking binding tape coating machine

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CN208542464U (en) * 2018-06-21 2019-02-26 无锡腾华电缆材料科技有限公司 Semiconductive blocks water binding strap production line
CN221335067U (en) * 2023-12-01 2024-07-16 游晟纺织科技(深圳)有限公司 Textile rubberizing coating device

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