CN119200790A

CN119200790A - Server and data center

Info

Publication number: CN119200790A
Application number: CN202411733318.0A
Authority: CN
Inventors: 黄凯
Original assignee: Suzhou Metabrain Intelligent Technology Co Ltd
Current assignee: Suzhou Metabrain Intelligent Technology Co Ltd
Priority date: 2024-11-29
Filing date: 2024-11-29
Publication date: 2024-12-27
Anticipated expiration: 2044-11-29
Also published as: CN119200790B

Abstract

The application relates to the technical field of operation and maintenance architecture and discloses a server and a data center, wherein the server comprises a chassis, a middle backboard module, a data processing module, a fan module, an expansion module and a power module, wherein the middle backboard module is arranged in the chassis and extends along a first direction, and a circuit is arranged in the middle backboard module for signal transmission; the data processing module is at least provided with one data processing module, the data processing module is positioned on one side of the middle backboard module along the second direction and is in wireless connection with the middle backboard module, the fan module is in wireless connection with the middle backboard module, the expansion module is in wireless connection with the middle backboard module and is used for connecting expansion equipment, the power module is in wireless connection with the middle backboard module, the expansion module, the fan module, the data processing module and the power module are arranged in the chassis along the first direction and are in signal interaction with each other through the middle backboard module, and the problem that a server cannot meet PUE indexes and noise can be solved or improved.

Description

Server and data center

Technical Field

The application relates to the technical field of operation and maintenance architecture, in particular to a server and a data center.

Background

The high-power consumption components used in the server mainly comprise a CPU (Central Processing Unit, a central processing unit), a GPU (Graphics Processing Unit, a graphics processor) and the like, the power consumption of the processor is greatly increased, and the maximum power consumption of the processor is more than 500W, even more than 700W, even more.

In the related art, a server mainly uses air cooling, and air cooling heat dissipation gradually reaches a heat dissipation bottleneck in the process of continuously improving the power consumption of a processor, and meanwhile, as the requirements of a data center PUE (Power Usage Effectiveness, power supply use efficiency) become more stringent, under the influence of a high-power-consumption processor and a trend of reducing energy consumption, important consideration is needed to be given to how to improve the air cooling heat dissipation.

In order to improve the system heat dissipation of the server, the rotation speed of the fan can be increased, but the power consumption of the fan can be increased, so that the power consumption of the server system is increased, the PUE index of the data center is affected, the rotation speed of the fan is increased, and the noise of the data center is increased.

Disclosure of Invention

The application provides a server and a data center, which are used for solving or improving the problems that the server cannot meet the PUE index and the noise level is high.

In one aspect, the application provides a server, which is provided with a first direction and a second direction which are intersected, and comprises a chassis, a middle back plate module, a data processing module, a fan module, an expansion module and a power supply module.

The middle backboard module is arranged in the chassis and extends along the first direction, and a circuit is arranged in the middle backboard module for signal transmission;

the data processing module is at least provided with one, is positioned at one side of the middle backboard module along the second direction and is in wireless connection with the middle backboard module;

the fan module is in wireless connection with the middle backboard module;

the expansion module is in wireless connection with the middle backboard module and is used for connecting expansion equipment;

the power module is in wireless connection with the middle backboard module;

The expansion module, the fan module, the data processing module and the power module are arranged in the chassis along the first direction, and mutually interact with signals through the middle backboard module.

Through set up the well backplate module that extends along first direction in quick-witted incasement to arrange extension module, fan module, data processing module and power module along first direction and set up in quick-witted incasement, and all carry out wireless connection with well backplate module, thereby can realize extension module through well backplate module, fan module, control signal and power supply signal transmission between data processing module and the power module, thereby need not to set up the cable, can reduce the resistance of the heat dissipation wind stream that fan module produced, improve the velocity of flow of heat dissipation wind stream, thereby improve the inside forced air cooling radiating effect of server, reduce fan module's energy consumption, with satisfying the PUE index requirement, and the noise reduction.

In an alternative embodiment, the middle backboard module is provided with one data processing module on both sides along the second direction.

In an alternative embodiment, the data processing module located at one side of the middle backboard module and the data processing module located at the other side of the middle backboard module are arranged in a central symmetry manner, and symmetry axes of the data processing modules located at two sides of the middle backboard module are perpendicular to the first direction and the second direction.

In an optional implementation manner, the data processing module includes a drawing component and a main board unit, the main board unit is disposed on the drawing component, slots are disposed on two sides of the chassis along the second direction, and the drawing component is inserted into the slots, so that the main board unit and the middle back board module are connected through hot plug connection along the second direction.

In an alternative implementation manner, the expansion module and the power module are respectively connected with two ends of the middle backboard module along the first direction, the fan module and the data processing module are located between the expansion module and the power module, wherein the expansion module and the power module are inserted into the chassis along the first direction, and the expansion module is in hot plug connection with the middle backboard module.

In an alternative embodiment, the expansion module includes at least one expansion module, a plurality of expansion slots are disposed on one end face of the expansion module along the first direction, and the other end face of the expansion module along the first direction is connected with the middle backboard module through thermal plug.

In an alternative embodiment, the power module includes a first signal board, a power unit and an extension unit, the first signal board extends along the second direction, the first signal board and the middle backboard module are plugged along the first direction, the power unit and the extension unit are at least provided with one, and the power unit and the extension unit are arranged side by side along the second direction and are in wireless connection with the first signal board.

In an alternative embodiment, the power supply unit and the extension unit are both connected to one side of the first signal board along the first direction through hot plug, and the other side of the first signal board along the first direction is connected to the middle backboard module through hot plug.

In an alternative implementation mode, a plurality of ventilation holes are formed in the first signal board, and/or ventilation grooves are formed in the expansion module.

In an alternative embodiment, the fan module includes a fan unit and a second signal board, the second signal board extends along the second direction, the fan unit is provided with a plurality of, a plurality of the fan unit is along the second direction sets up side by side, and with second signal board wireless connection, the second signal board with well backplate module wireless connection, a plurality of the fan unit is two sets of respectively and is located in the both sides of well backplate module.

In an optional implementation manner, the air guide device further comprises an air guide assembly, wherein the fan module is arranged between the expansion module and the data processing module, and the air guide assembly is arranged at two sides of the middle backboard module respectively and is arranged between the fan module and the power module.

In an optional implementation manner, a first control module is arranged on the second signal board, and the first control module can control the rotation speed difference of the fan units located at two sides of the middle back board module to be 30% -45%.

In an optional implementation manner, a main board high-speed signal plug, a main board low-speed signal plug and a main board power supply plug which are spliced with the middle backboard module are arranged at the edge part of the main board unit, which is close to the middle backboard module, and the main board high-speed signal plug, the main board low-speed signal plug and the main board power supply plug are arranged at intervals along the first direction;

The main board high-speed signal plug is used for providing high-speed signals for the expansion equipment, the main board low-speed signal plug is used for providing low-speed control signals and PCIE signals for the expansion equipment, and providing low-speed control signals for the fan module and the power supply module.

In an alternative embodiment, the middle backboard module comprises a board body and a fixing frame, wherein the board body is fixed in the chassis through the fixing frame;

And/or, a first expansion plug interface, a fan control plug interface, a main board high-speed signal plug interface, a main board low-speed signal plug interface, a main board power supply plug interface and a first power supply plug interface are sequentially arranged on one side surface of the board body along the second direction along the first direction; the board body is provided with a first expansion plug interface, a fan power supply plug interface, a main board low-speed signal plug interface, a main board high-speed signal plug interface and a second expansion plug interface which are sequentially arranged on the other side face of the board body along the second direction along the first direction, wherein the two first expansion plug interfaces positioned on the two sides of the middle backboard module are respectively used for being connected with two expansion modules in the expansion module so as to transmit control signals and power supply signals, the two groups of the main board high-speed signal plug interfaces, the main board low-speed signal plug interfaces and the main board power supply plug interfaces positioned on the two sides of the middle backboard module are respectively used for being connected with the data processing modules positioned on the two sides of the middle backboard module, the fan control plug interfaces and the fan power supply plug interfaces are used for being connected with the fan module, and the first power supply plug interfaces and the second expansion plug interfaces are used for being connected with the power supply module.

On the other hand, the application also provides a data center, which comprises the server in any one of the embodiments.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the description of the embodiments or the related art will be briefly described, and it is apparent that the drawings in the description below are some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

FIG. 1 is a block diagram of a server according to an embodiment of the present application;

FIG. 2 is a front view of an expansion module in a server according to an embodiment of the present application;

FIG. 3 is a rear view of an expansion module in a server according to an embodiment of the present application;

FIG. 4 is a rear view of another expansion module in a server according to an embodiment of the present application;

fig. 5 is a frame diagram of a fan module in a server according to an embodiment of the application;

FIG. 6 is a frame diagram of a motherboard unit in a server according to an embodiment of the present application;

FIG. 7 is a frame diagram of one side of a backplane module in a server according to an embodiment of the present disclosure;

FIG. 8 is a frame diagram of another side of a backplane module in a server according to an embodiment of the present disclosure;

FIG. 9 is a block diagram of a second information board in a server according to an embodiment of the present application;

FIG. 10 is a view of a server with an expansion module end according to an embodiment of the present application;

FIG. 11 is a view of a server with a power module end according to an embodiment of the present application;

fig. 12 is a view of a side of a server provided with a drawing member in an embodiment of the present application;

FIG. 13 is a block diagram of an expansion unit in a server according to an embodiment of the present application;

Fig. 14 is a frame diagram of a power supply unit in a server according to an embodiment of the present application.

Reference numerals illustrate:

x, the first direction, Y, the second direction;

1. A middle backboard module; 2, a data processing module, 3, a fan module, 4, an expansion module, 5, a power module;

11. A first expansion interface; 12, a fan control plug interface, 13, a main board high-speed signal plug interface, 14, a main board low-speed signal plug interface, 15, a main board power supply plug interface, 16, a second expansion plug interface, 17, a fan power supply plug interface, 18, a first power supply plug interface;

21. A drawing part 22, a main board unit;

221. the main board high-speed signal plug, 222, the main board low-speed signal plug, 223, the main board power supply plug;

31. A fan unit 32, a second signal board;

321. Fan control plug 322, fan power plug 323, first control module;

41. the expansion module is 42, the ventilation groove is 43, the first expansion plug;

51. a first signal board; 52, a power supply unit, 53, an expansion unit;

511. The power supply plug comprises a first power supply plug, 512 second expansion plugs, 513 second power supply plug interfaces, 514 third expansion plug interfaces;

521. and 531, a third expansion plug.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Therefore, the application provides a server and a data center to solve or improve the problems that the server cannot meet the PUE index and the noise level is high.

Embodiments of the present application are described below with reference to fig. 1 to 14.

According to an embodiment of the present application, in one aspect, there is provided a server having a first direction X and a second direction Y intersecting with each other, as shown in fig. 1, including a chassis, a middle back plate module 1, a data processing module 2, a fan module 3, an expansion module 4, and a power module 5, and the specific scheme is as follows.

As shown in fig. 1, the middle backboard module 1 can be fixedly arranged in the chassis in a clamping manner or in a screwing manner by an i-bolt and a stud in the chassis and extends along a first direction X, a circuit is arranged in the middle backboard module 1 for signal transmission, and specifically comprises a control signal, a power supply signal and the like, the data processing module 2 is at least provided with one, the data processing module 2 is positioned on one side of the middle backboard module 1 along the second direction Y and is in wireless connection with the middle backboard module 1, the fan module 3 is in wireless connection with the middle backboard module 1, the expansion module 4 is in wireless connection with the middle backboard module 1 and is used for connecting expansion equipment, and the power supply module 5 is in wireless connection with the middle backboard module 1.

The expansion module 4, the fan module 3, the data processing module 2 and the power module 5 are arranged in the chassis along the first direction X, and perform signal interaction with each other through the middle backboard module 1, specifically, the signal interaction includes various signals that need to be transmitted during the service area system operation such as control signals and power supply signals.

Specifically, the included angle between the first direction X and the second direction Y may be 60 ° to 90 °, specifically 60 °, 70 °, 80 ° and 90 °, preferably 90 ° (shown in fig. 1), and of course, may be other angles according to specific requirements.

The term "wireless connection" as used herein refers to connection not through a cable but by means of plug connection, welding, or the like.

It should be explained that the "data processing module 2 is located at one side of the middle backplate module 1 along the second direction Y", the data processing module 2 and the middle backplate module 1 are arranged side by side along the second direction Y.

It should be further noted that, in the case where the extension module 4, the fan module 3, the data processing module 2, and the power module 5 are arranged in the first direction X, the extension module 4, the fan module 3, the data processing module 2, and the power module 5 may be arranged randomly in the order of arrangement along the first direction X, for example, the fan module 3 may be arranged at any position along the first direction X in the case, and the specific positions are two end positions, an intermediate position, and the like, of the case along the first direction X, and the extension module 4, the data processing module 2, and the power module 5 may also be optionally adjusted in the case along the first direction X according to specific heat dissipation requirements and the like.

Specifically, the chassis may be a metal chassis, or may be a plastic chassis, or the like, and may be selected according to specific requirements, such as a chassis with a waterproof material.

In this embodiment, as shown in fig. 1, by arranging the middle backboard module 1 extending along the first direction X in the chassis and arranging the extension module 4, the fan module 3, the data processing module 2 and the power module 5 in the chassis along the first direction X and wirelessly connecting the extension module 4, the fan module 3, the data processing module 2 and the power module 5 with the middle backboard module 1, control signals and power supply signals between the extension module 4, the fan module 3, the data processing module 2 and the power module 5 can be transmitted through the middle backboard module 1, so that cables are not required, resistance of heat dissipation airflow generated by the fan module can be reduced, the flow speed of the heat dissipation airflow is improved, the air cooling heat dissipation effect inside the server is improved, the energy consumption of the fan module 3 is reduced, the PUE index requirements are met, and noise is reduced.

In one embodiment, as shown in fig. 1, two sides of the middle backplate module 1 along the second direction Y are provided with one data processing module 2, i.e. the number of data processing modules 2 is two.

In this embodiment, by providing one data processing module 2 on both sides of the middle backplate module 1, the volume of the server can be reduced, and the occupied area of the server can be reduced.

In some embodiments, which are not shown, the middle backplate module 1 is provided with a plurality of data processing modules 2 along two sides of the second direction Y, specifically, the number of the data processing modules 2 may be 3 to 6, specifically, 3 to 4, 5 and 6, specifically, if the number of the data processing modules 2 located at one side of the middle backplate module 1 is plural, the plurality of data processing modules 2 may be arranged side by side along the first direction X and connected with the middle backplate module 1, or may be arranged in a manner that the plurality of data processing modules 2 are overlapped at intervals along a third direction and connected with the middle backplate module 1, wherein the third direction is arranged at an included angle with the first direction X and the second direction Y, and preferably, any two of the first direction X, the second direction Y and the third direction Y are arranged vertically.

In one embodiment, as shown in fig. 1, 7 and 8, the data processing modules 2 located at one side of the middle backplate module 1 are arranged in central symmetry with the data processing modules 2 located at the other side of the middle backplate module 1, and the symmetry axes of the data processing modules 2 located at both sides of the middle backplate module 1 are perpendicular to the first direction X and the second direction Y, i.e. the model numbers of the data processing modules 2 located at both sides of the middle backplate module 1 are the same, and the data processing modules 2 located at one side of the middle backplate module 1 can be installed at the other side of the middle backplate module 1 by rotating the data processing modules 2 around 180 ° around the symmetry center, that is to say, the general purpose of the data processing modules 2 can be realized.

In a specific use process, as shown in fig. 1, 7 and 8, the data processing module 2 is provided with a plurality of connection parts with the middle backboard module 1, and the connection parts are different in type, for example, the data processing module 2 is provided with a main board high-speed signal plug 221, a main board low-speed signal plug 222 and a main board power supply plug 223, which are respectively used for being plugged with the main board high-speed signal plug 13, the main board low-speed signal plug 14 and the main board power supply plug 15 on the middle backboard module 1, so that the main board high-speed signal plug 13, the main board low-speed signal plug 14 and the main board power supply plug 15 which are positioned on two sides of the middle backboard module 1 are also arranged in a central symmetry manner.

In this embodiment, the data processing modules 2 located on both sides of the middle back plate are arranged in a central symmetry manner, so that the data processing modules 2 located on both sides of the middle back plate module 1 can be used in common, and the development cost of the server can be reduced.

In some embodiments, which are not shown, the data processing modules 2 located on both sides of the middle backplate module 1 may be symmetrically arranged, and the symmetry center plane is perpendicular to the second direction Y, i.e. the data processing modules 2 located on both sides of the middle backplate module 1 are of different types, and in this case, the plugging structures for connecting with the data processing modules 2 located on both sides of the middle backplate module 1 are also symmetrical structures.

In some embodiments, which are not shown, the data processing modules 2 located on one side of the middle backplate module 1 are disposed in central symmetry with the data processing modules 2 located on the other side of the middle backplate module 1, and the symmetry axes of the data processing modules 2 located on both sides of the middle backplate module 1 are disposed in parallel with the first direction X, and at this time, the plugging structures for connecting with the data processing modules 2 located on both sides of the middle backplate module 1 are also in central symmetry structures.

In one embodiment, as shown in fig. 6 and 12, the data processing module 2 includes a drawing component 21 and a main board unit 22, where the main board unit 22 may be fixedly disposed on the drawing component 21 by a fastening structure or a screw connection, as shown in fig. 12, slots are disposed on two sides of the chassis along the second direction Y, and the drawing component 21 is inserted into the slots, so that the main board unit 22 and the middle backplate module 1 are connected by thermal plug connection along the second direction Y.

Specifically, as shown in fig. 6 and 12, the drawing component 21 may be a drawer, two sides of the drawer are provided with sliding rails, corresponding positions of the sliding rails in the slots are provided with sliding grooves, and positions of the drawer, which are close to the middle backboard module 1, are provided with avoiding parts so that a plug on the main board unit 22 can be connected with the middle backboard module 1 through a hot plug board, and of course, the drawing component 21 may also be a plurality of types of structures such as a flat board, so long as blind plugging with the slots can be realized, and blind plugging between the main board unit 22 and the middle backboard module 1 is facilitated.

In this embodiment, by fixing the main board unit 22 on the drawing member 21 and providing slots on both sides of the chassis along the second direction Y, the drawing member 21 is plugged with the slots along the second direction Y, so that not only is blind plugging of the main board unit 22 with the middle backplate module 1 realized and convenient for disassembly and assembly, but also, when there are a plurality of data processing modules 2 in the server, the main board unit 22 and the middle backplate module 1 are connected through hot plugging, and maintenance can be performed without stopping the server from cutting off the power supply.

In one embodiment, as shown in fig. 1, the expansion module 4 and the power module 5 are respectively connected with two ends of the middle backboard module 1 along the first direction X in a plugging manner, the fan module 3 and the data processing module 2 are located between the expansion module 4 and the power module 5, wherein, as shown in fig. 1, the expansion module 4 and the power module 5 are plugged in the chassis along the first direction X, and the expansion module 4 is in hot plug connection with the middle backboard module 1.

Specifically, as shown in fig. 2, the expansion module 4 may be provided with a plurality of connection parts for performing wireless cable connection with expansion devices (such as a solid state disk, a mechanical hard disk, and the like).

More specifically, the extension module 4 and the power module 5 are both provided with guide parts to be matched with the guide groove parts in the chassis, so that the extension module 4 and the chassis are subjected to blind insertion along the first direction X, the power module 5 and the chassis are subjected to blind insertion along the first direction X, and even further, the guide parts can be arranged on the edge of the extension module 4 or the edge of the power module 5 and extend to structures such as a cuboid along the first direction X, so long as the guide parts can be in sliding fit with the guide groove parts, and the blind insertion of the extension module 4 or the power module 5 along the first direction X can be realized.

It should be noted that the plugging direction of the extension module 4 and the chassis is opposite to the plugging direction of the power module 5 and the chassis.

In this embodiment, as shown in fig. 1, the power module 5 and the extension module 4 are respectively disposed at two end positions of the middle backboard module 1 along the first direction X and are plugged with the middle backboard module 1 along the first direction X, so that the power module 5 and the extension module 4 can be conveniently detached and maintained when the power module 5 and the extension module 4 fail, and meanwhile, the extension module 4 and the middle backboard module 1 are connected through hot plug, so that the extension module 4 can be detached and maintained without cutting off the power of the server, and the maintenance convenience of the server is improved.

In a specific embodiment, as shown in fig. 1, the expansion module 4 includes at least one expansion module 41, as shown in fig. 2, one end surface of the expansion module 41 along the first direction X is provided with a plurality of expansion plugging slots, as shown in fig. 3 and fig. 4, the other end surface of the expansion module 41 along the first direction X is connected with the middle backplate module 1 through thermal plugging, specifically, the number of expansion modules 41 may be 1 to 4, specifically, any one of 1, 2,3 and 4, preferably, the number of expansion modules 41 is preferably 2, as shown in fig. 1 and fig. 10, and when the number of expansion modules 41 exceeds 3, the expansion modules 41 may be all connected with one circuit board in a wireless manner, and the circuit board is further connected with the middle backplate module 1 through thermal plugging.

Specifically, as shown in fig. 2 to fig. 4, taking the number of extension modules 41 as 2 as an example, the extension modules 41 are NVME backplanes (NVME, i.e., non-Volatile Memory express is a high-performance storage access and transmission protocol), and the two NVME backplanes are arranged side by side along the second direction Y.

One of the NVME backplates is provided with 12 SFF 8639 connectors (also called U.2 connectors, which are backplates widely used in industrial Solid State Drives (SSDs) or mechanical hard disks (HDDs)) on the side facing the outside of the chassis as shown in fig. 2 for expanding 12 NVME SSDs, and a first expansion plug 43, specifically a high-density connector, on the lower right corner of the side facing the inside of the chassis as shown in fig. 3 for plugging with the middle backplate module 1 to realize the input of uplink signals of expansion equipment, the input of low-speed signals and power supply.

The other NVME backboard is provided with 12 SFF 8639 connectors (also called U.2 connectors, which are backboard interfaces widely applied to industrial Solid State Disks (SSDs) or mechanical hard disks (HDDs)) on the side surface facing the outside of the chassis as shown in fig. 2, and is used for expanding 12 NVME SSDs, and a first expansion plug 43, particularly a high-density connector, is arranged at the lower left corner of the side surface facing the inside of the chassis as shown in fig. 4 and is used for being spliced with the middle backboard module 1 so as to realize the input of uplink signals, the input of low-speed signals and the power supply of expansion equipment.

The uplink 48 PCIE lane signals of the two NVME backplanes are respectively from the two data processing modules 2, the low-speed signals of the two NVME backplanes are respectively from the baseboard management controllers of the two data processing modules 2, and are used for monitoring the states of the 12 NVME SSD, and supplying power to the middle backplate.

Specifically, as shown in fig. 2 to 4, a plurality of ventilation slots 42 are disposed on the expansion module 41 to facilitate air intake.

In this embodiment, the expansion module 4 includes at least one expansion module 41, one end surface of the expansion module 41 along the first direction X is provided with a plurality of expansion plugging slots, and the other end surface of the expansion module 41 along the first direction X is connected with the middle backboard module 1 through hot plug, so that when the expansion modules 41 are plural, the grouping, dismounting and maintenance can be realized, and the running efficiency of the server in the maintenance process is improved.

In one embodiment, as shown in fig. 1, the power module 5 includes a first signal board 51, a power unit 52 and an extension unit 53, where the first signal board 51 extends along a second direction Y, the first signal board 51 is plugged with the middle backplate module 1 along a first direction X, at least one of the power unit 52 and the extension unit 53 is disposed side by side along the second direction Y, and the power unit 52 and the extension unit 53 are both wirelessly connected with the first signal board 51.

The first signal board 51 is capable of transmitting interaction signals required by the power supply unit 52 and the expansion unit 53, such as control signals and power supply signals, and other components.

Specifically, the expansion unit 53 is a PCIE expansion board, and is configured to be plugged PCIE RISER.

In this embodiment, by providing the expansion unit 53 in the power module 5, an expansion device can be further added to the server.

In a specific embodiment, as shown in fig. 1, the power supply unit 52 and the extension unit 53 are both connected to one side of the first signal board 51 along the first direction X by thermal plug connection, and the other side of the first signal board 51 along the first direction X is connected to the middle backplate module 1by thermal plug connection.

Specifically, as shown in fig. 11, the power supply units 52 are AC power supplies, the number of which is 1-2, preferably 2, and the expansion units 53 are PCIE expansion boards, the number of which is 1-2, preferably 2, wherein the 2 expansion units 53 are respectively in signal connection with the 2 data processing modules 2.

Specifically, as shown in fig. 9, a second expansion plug 512 and a first power supply plug 511 are arranged at the middle upper part of one side of the first signal board 51, which is close to the middle back board module 1, and are used for being plugged with the middle back board module 1, the second expansion plug 512 realizes information interaction between expansion equipment in the expansion unit 53 and the data processing module 2, and the first power supply plug 511 is used for providing power for the middle back board module 1.

As shown in fig. 9, at least one third extension plug interface 514 and at least one second power supply plug interface 513 are disposed on a side of the first signal board 51 away from the middle back board module 1, the third extension plug interface 514 is used for plugging with a third extension plug 531 on the extension unit 53, and as shown in fig. 14, the second power supply plug interface 513 is used for plugging with a second power supply plug 521 on the power supply unit 52.

In particular, as shown in fig. 9, the second power supply jack 513 is a CRPS jack (Common Redundant Power Supply is a server power specification with standardized design), as shown in fig. 13, the third extension jack 514 is PCIE RISER (pcie+ power supply) -a mother head, and is connected to the extension units 53, power is directly supplied from the first signal board 51, and the 32 PCIE lanes on the uplink come from one data processing module 2, as shown in fig. 13, each extension unit 53 can extend 1 x16 slot and 2 x8 slots.

The second expansion plug 512 is a low-speed signal-male plug, and is connected to the second expansion plug 16 of the middle backplane module 1, the second expansion plug 16 is specifically PCIE RISER-female plug, uplink PCIE signals are respectively from 32 PCIE lanes of the 2 data processing modules 2, the low-speed signals are respectively connected to the substrate management controllers of the two data processing modules 2 and are respectively connected to the 2 expansion units 53 as monitoring management of PCIE devices, and are also connected to the power supply unit 52 as monitoring management of power supplies, and the power supply unit 52 may also be called PSU (Power Supply Unit, i.e. power supply unit).

In one embodiment, the first signal board 51 is provided with a plurality of ventilation holes, and/or, as shown in fig. 2, the expansion module 4 is provided with ventilation grooves 42, specifically, the ventilation holes can be set according to the shapes of other parts on the first signal board 51, the common shapes are rectangle, circle, etc., and the ventilation grooves 42 are arranged between two adjacent expansion devices on the expansion module 4 and are rectangle, or can be set to other shapes, such as circle, etc., according to the requirement.

In this embodiment, by providing the ventilation holes in the first signal board 51 and providing the ventilation slots 42 in the expansion module 4, resistance to the air-cooled air flow can be reduced, heat dissipation efficiency can be improved, and energy consumption and noise of the fan module can be reduced.

In one embodiment, as shown in fig. 1 and fig. 5, the fan module 3 includes a fan unit 31 and a second signal board 32, the second signal board 32 extends along a second direction Y, the fan unit 31 is provided with a plurality of fan units, the plurality of fan units 31 are arranged side by side along the second direction Y, and are wirelessly connected with the second signal board 32 by plugging or welding, and the second signal board 32 is wirelessly connected with the middle backplate module 1 by plugging or welding, as shown in fig. 1, and the plurality of fan units 31 are respectively located at two sides of the middle backplate module 1 in two groups.

Specifically, the fan units 31 are 6056 fan modules, the number of the fan units 31 is 4-8, specifically any one of 4, 6 and 8, preferably, the number of the fan units 31 is 6 (as shown in the figure), and two sides of the middle back plate module 1 are 3.

Specifically, as shown in fig. 5, the second signal board 32 is provided with a fan control plug 321 and a fan power plug 322 for plugging with the fan control plug interface 12 and the fan power plug interface 17 on the middle backboard module 1, and in particular, the fan control plug 321 and the fan power plug 322 are all high-density connectors.

In this embodiment, as shown in fig. 1, a plurality of fan units 31 are wirelessly connected to a second signal board 32, the second signal board 32 is connected to the middle backboard module 1, and the plurality of fan units 31 are respectively located at two sides of the middle backboard module 1, and respectively perform rotational speed control through data processing modules 2 located at two sides of the middle backboard module 1, so as to perform air cooling on the data processing modules 2 located at two sides of the middle backboard module 1, thereby improving the accuracy of temperature control of the system.

In one embodiment, each fan unit 31 is inserted into the chassis along the first direction X, each fan unit 31 is connected with the second signal board 32 in a hot-plugging manner along the first direction X, specifically, a guide groove extending along the first direction X is provided in the chassis, a sliding block corresponding to the guide groove is provided on the periphery of the fan unit 31, and the sliding block is slidably matched with the guide groove, so that the fan unit 31 is slidably inserted into the chassis, so as to realize the hot-plugging connection between the fan unit 31 and the second signal board 32.

In the specific maintenance process of the server, after a certain fan unit 31 is found to have a fault, the expansion module 41 corresponding to the position of the faulty fan unit 31 in the expansion module 4 is removed from the front window end of the server, and then the faulty fan unit 31 is removed from the front window of the server for replacement, so that the maintenance of the fan unit 31 can be realized under the condition that the server is shut down without power failure.

In one embodiment, the server further comprises an air guiding assembly, wherein the fan module 3 is arranged between the expansion module 4 and the data processing module 2, and the two air guiding assemblies are respectively arranged at two sides of the middle back plate module 1 and are respectively arranged between the fan module 3 and the power supply module 5.

Specifically, the air guide assembly is two air guide plates extending along the first direction X, and as for the shape surface of the air guide assembly along the first direction X, the air guide assembly can be selected and set according to specific requirements.

In this embodiment, the fan module 3 is disposed between the expansion module 4 and the data processing module 2, so that the air cooling effect on the data processing module 2 can be enhanced, and the two air guide assemblies are respectively disposed on two sides of the middle back plate module 1 and are both disposed between the fan module 3 and the power supply module 5, so that the air flow leakage amount can be reduced, and the air cooling effect on the data processing module 2 can be improved.

In one embodiment, as shown in fig. 5, the second signal board 32 is provided with a first control module 323, specifically, a CPLD (Complex Programmable Logic Device, a complex programmable logic device), where the first control module 323 can control the rotation speed difference of the fan units 31 located at two sides of the middle backplate module 1 to be 30% -45%, specifically, the rotation speed difference of the fan units 31 located at two sides of the middle backplate module 1 is any one of 30%, 35%, 40% and 45%, preferably 40%.

In a specific use process, when one data processing module 2 controls the rotation speed of the fan unit 31 on the corresponding side to be 80%, and the other data processing module 2 controls the rotation speed of the fan unit 31 on the corresponding side to be 30%, in order to avoid that the rotation speed difference of the fan units 31 on two sides of the middle backboard module 1 is too large and backflow is caused, the first control module 323 can increase the rotation speed of the fan unit 31 with low rotation speed from 30% to 40%, so that the rotation speed difference is 40%.

The first control module 323 can control the fan unit 31 to radiate heat to the server at the full rotation speed after detecting that the substrate management controller on the data processing module 2 is abnormal through the hardware watchdog.

In this embodiment, the first control module 323 is provided to adjust the rotational speed difference of the fan units 31 located at both sides of the middle backplate module 1, thereby reducing backflow and improving the air cooling effect.

In one embodiment, as shown in fig. 6, a high-speed signal plug 221, a low-speed signal plug 222 and a power supply plug 223 are disposed on the edge of the main board unit 22 near the middle backplate module 1, and the high-speed signal plug 221, the low-speed signal plug 222 and the power supply plug 223 are disposed at intervals along the first direction X.

The motherboard high-speed signal plug 221 is used for providing high-speed signals to the expansion device, the motherboard low-speed signal plug 222 is used for providing low-speed control signals and PCIE signals to the expansion device, and providing low-speed control signals to the fan module 3 and the power module 5.

Specifically, the high-speed signal plug 221 of the motherboard is a PCIE X48/high-density connector-male connector, the low-speed signal plug 222 of the motherboard is a PCIE X32/high-density connector-male connector, and the power plug 223 of the motherboard is a power supply male connector.

In this embodiment, by hot plug connection of the main board unit 22 with the middle backplate module 1 through the main board high speed signal plug 221, the main board low speed signal plug 222, and the main board power supply plug 223, interaction of various signals can be achieved.

In one embodiment, the middle backboard module 1 comprises a board body and a fixing frame, wherein the board body is fixed in the chassis through the fixing frame, the board body is a circuit board with the thickness of 3 mm-5 mm, and the fixing frame is a plastic bracket.

As shown in fig. 7, on one side surface of the board body in the second direction Y, a first expansion jack 11, a fan control jack 12, a main board high-speed signal jack 13, a main board low-speed signal jack 14, a main board power supply jack 15, and a first power supply jack 18 are provided in this order in the first direction X.

As shown in fig. 8, on the other side surface of the board body along the second direction Y, a first expansion jack 11, a fan power supply jack 17, a main board power supply jack 15, a main board low-speed signal jack 14, a main board high-speed signal jack 13, and a second expansion jack 16 are provided in this order along the first direction X.

The two first extension interfaces 11 located at two sides of the middle backboard module 1 are respectively used for connecting with two extension modules 41 in the extension module 4 to transmit control signals and power supply signals;

specifically, as shown in fig. 7,8 and 3, the first expansion interface is connected to the first expansion plug 43 on the expansion module 41, the 48 PCIE lane signals on the uplink are from the processor in the data processing module 2, the low-speed signals on the uplink are from the baseboard management controller of the data processing module 2, and the power supply is from the first signal board 51.

As shown in fig. 7, 8 and 6, two groups of motherboard high-speed signal sockets 13, motherboard low-speed signal sockets 14 and motherboard power supply sockets 15 located on both sides of the middle backboard module 1 are respectively used for connecting with the data processing modules 2 located on both sides of the middle backboard module 1.

Specifically, the high-speed signal interface is a PCIE X48/high-density connector-female, and is connected to the PCIE X48/high-density connector-male of the motherboard unit 22, and the 48 PCIE lane signals on the uplink come from the processor of the data processing module 2, so as to provide PCIE signals of the data processing module 2 for the NVME SSD in the expansion module 4 and the PCIE device in the expansion unit 53.

The low-speed signal interface 14 of the motherboard is a PCIE X32/high-density connector-female header, and is connected with the PCIE X32/high-density connector-male header of the motherboard unit 22, and the 32 PCIE lane signals of the upstream are used for providing the PCIE signals of the data processing module 2 for the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53, the low-speed signals are from the processor and the baseboard management controller of the node 1, and are used for providing the PCIE signals of the data processing module 2 for the NVME SSD in the expansion module 4 and the PCIE devices in the expansion unit 53, and providing the low-speed control signals output by the data processing module 2 for the power supply unit 52 and the fan module 3.

As shown in fig. 7, 8 and 6, the motherboard power supply plug interface 15 is a power supply female connector, and is connected to a power supply male connector of the motherboard unit 22, for supplying power to the data processing module 2.

As shown in fig. 7, 8 and 5, the fan control interface 12 and the fan power supply interface 17 are used for connecting with the fan module 3, specifically, the fan control interface 12 is a female connector and is connected with a fan control plug 321 (male connector) on the second signal board 32, the uplink controller signals are from the baseboard management controllers of the two data processing modules 2, the PWM signals for controlling the rotation speed of the fan unit 31 and the TACH signals for obtaining the fan rotation speed information are sent by combining with the heat dissipation regulation and control strategy, and the fan power supply interface 17 is a female connector and is connected with a fan power supply plug 322 (male connector) on the second signal board 32 so as to supply power to the fan unit 31.

As shown in fig. 7, 8 and 9, the first power supply plug interface 18 and the second extension plug interface 16 are used for connection with the power module 5, specifically, the first power supply plug interface 18 is connected with the first power supply plug 511 on the first signal board 51, and the second extension plug interface 16 is connected with the second extension plug 512 on the extension unit 53.

In this embodiment, the middle backboard module 1 is connected with the extension module 4, the fan module 3, the data processing module 2 and the power module 5 through the plug and the plug interface, and the structure is simple and the installation is convenient.

All of the above schemes are fully described below with one embodiment.

The embodiment provides a server, which has a first direction X and a second direction Y which are intersected, as shown in fig. 1, and includes a chassis, a middle back board module 1, a data processing module 2, a fan module 3, an expansion module 4 and a power module 5, and the specific scheme is as follows.

As shown in fig. 1, the middle backboard module 1 may be fixedly arranged in the chassis in a clamping manner or in a screwing manner by an i-bolt and a stud in the chassis, and extends along a first direction X, a circuit is built in the middle backboard module 1 for signal transmission, specifically including a control signal, a power supply signal and the like, the data processing module 2 is at least provided with one, the data processing module 2 is located at one side of the middle backboard module 1 along the second direction Y and is in wireless connection with the middle backboard module 1, the fan module 3 is in wireless connection with the middle backboard module 1, the expansion module 4 is in wireless connection with the middle backboard module 1 for connecting expansion equipment, and the power supply module 5 is in wireless connection with the middle backboard module 1.

Further, as shown in fig. 1, two sides of the middle backplate module 1 along the second direction Y are provided with one data processing module 2, i.e. the number of data processing modules 2 is two.

Further, as shown in fig. 1, 7 and 8, the data processing modules 2 located at one side of the middle backplate module 1 are arranged in central symmetry with the data processing modules 2 located at the other side of the middle backplate module 1, and the symmetry axes of the data processing modules 2 located at both sides of the middle backplate module 1 are perpendicular to the first direction X and the second direction Y, that is, the types of the data processing modules 2 located at both sides of the middle backplate module 1 are the same, and the data processing modules 2 located at one side of the middle backplate module 1 can be installed at the other side of the middle backplate module 1 by rotating the data processing modules 2 around 180 ° around the symmetry center, that is, the data processing modules 2 can be commonly used.

Further, as shown in fig. 6 and 12, the data processing module 2 includes a drawing component 21 and a main board unit 22, where the main board unit 22 may be fixedly disposed on the drawing component 21 by a fastening structure or a screw connection, as shown in fig. 12, slots are disposed on two sides of the chassis along the second direction Y, and the drawing component 21 is inserted into the slots, so that the main board unit 22 and the middle back board module 1 are connected by thermal insertion and extraction along the second direction Y.

Further, as shown in fig. 1, the expansion module 4 and the power module 5 are respectively connected with two ends of the middle backboard module 1 along the first direction X in an inserting manner, and the fan module 3 and the data processing module 2 are located between the expansion module 4 and the power module 5, wherein, as shown in fig. 1, the expansion module 4 and the power module 5 are inserted into the chassis along the first direction X, and the expansion module 4 is connected with the middle backboard module 1 in a hot inserting manner.

Further, as shown in fig. 1, the expansion module 4 includes at least one expansion module 41, as shown in fig. 2, a plurality of expansion plugging slots are disposed on one end face of the expansion module 41 along the first direction X, as shown in fig. 3 and fig. 4, the other end face of the expansion module 41 along the first direction X is connected with the middle backboard module 1 through thermal plugging, specifically, the number of expansion modules 41 may be 1-4, specifically, any one of 1,2,3 and 4, preferably, as shown in fig. 1 and fig. 10, the number of expansion modules 41 is preferably 2, and when the number of expansion modules 41 exceeds 3, the expansion modules 41 may be all connected with one circuit board in a wireless manner, and the circuit board is connected with the middle backboard module 1 through thermal plugging.

Specifically, as shown in fig. 2 to 4, taking the number of extension modules 41 as 2 as an example, the extension modules 41 are NVME backplanes (NVME, i.e., non-Volatile Memory express is a high-performance storage access and transmission protocol), and the two NVME backplanes are both arranged side by side along the second direction Y.

Further, as shown in fig. 1, the power module 5 includes a first signal board 51, a power unit 52 and an extension unit 53, where the first signal board 51 extends along the second direction Y, the first signal board 51 is plugged with the middle backplate module 1 along the first direction X, at least one of the power unit 52 and the extension unit 53 is disposed side by side along the second direction Y, and both the power unit 52 and the extension unit 53 are wirelessly connected with the first signal board 51.

Further, as shown in fig. 1, the power supply unit 52 and the extension unit 53 are both connected to one side surface of the first signal board 51 along the first direction X by thermal plug connection, and the other side surface of the first signal board 51 along the first direction X is connected to the middle backplate module 1 by thermal plug connection.

Further, the first signal board 51 is provided with a plurality of ventilation holes, and/or as shown in fig. 2, the expansion module 4 is provided with ventilation grooves 42, specifically, the ventilation holes can be set according to the shapes of other parts on the first signal board 51, the common shapes are rectangular, circular, etc., and the ventilation grooves 42 are arranged between two adjacent expansion devices on the expansion module 4, are rectangular, can be set into other shapes, such as circular, etc., according to the requirements.

Further, as shown in fig. 1 and fig. 5, the fan module 3 includes a fan unit 31 and a second signal board 32, the second signal board 32 extends along the second direction Y, the fan unit 31 is provided with a plurality of fan units 31, and the plurality of fan units 31 are arranged side by side along the second direction Y and are wirelessly connected with the second signal board 32 by plugging or welding, and the second signal board 32 is wirelessly connected with the middle backplate module 1 by plugging or welding, as shown in fig. 1, and the plurality of fan units 31 are respectively located at two sides of the middle backplate module 1 in two groups.

Specifically, as shown in fig. 5, the second signal board 32 is provided with a fan control plug 321 and a fan power plug 322 for plugging with the fan control plug interface 12 and the fan power plug interface 17 on the middle backboard assembly, and in particular, the fan control plug 321 and the fan power plug 322 are all high-density connectors.

Further, each fan unit 31 is inserted into the chassis along the first direction X, each fan unit 31 is connected with the second signal board 32 in a hot-plugging manner along the first direction X, specifically, a guide groove extending along the first direction X is provided in the chassis, a sliding block corresponding to the sliding groove is provided on the periphery of the fan unit 31, and the sliding block is slidably matched with the guide groove, so that the fan unit 31 is slidably inserted into the chassis, and hot-plugging connection of the fan unit 31 and the second signal board 32 is realized.

Further, the server further comprises an air guide assembly, the fan module 3 is arranged between the expansion module 4 and the data processing module 2, the two air guide assemblies are respectively arranged on two sides of the middle back plate module 1, and the two air guide assemblies are respectively arranged between the fan module 3 and the power supply module 5.

Further, as shown in fig. 5, the second signal board 32 is provided with a first control module 323, specifically, a CPLD (Complex Programmable Logic Device, a complex programmable logic device), where the first control module 323 can control the rotational speed difference of the fan units 31 located at two sides of the middle backplate module 1 to be 30% -45%, specifically, the rotational speed difference of the fan units 31 located at two sides of the middle backplate module 1 is any one of 30%, 35%, 40% and 45%, preferably 40%.

Further, as shown in fig. 6, the edge portion of the main board unit 22 near the middle backboard module 1 is provided with a main board high-speed signal plug 221, a main board low-speed signal plug 222 and a main board power supply plug 223 which are inserted into the middle backboard module 1, and the main board high-speed signal plug 221, the main board low-speed signal plug 222 and the main board power supply plug 223 are arranged at intervals along the first direction X.

Further, the middle backboard module 1 comprises a board body and a fixing frame, the board body is fixed in the chassis through the fixing frame, the board body is a circuit board with the thickness of 3 mm-5 mm, and the fixing frame is a plastic bracket.

In the assembly process of the server, as shown in fig. 1, the second signal board 32 is fixed in the chassis, and then the middle back board module 1 is installed in the chassis.

The fan unit 31 is inserted into the chassis along the first direction X from the front window of the server, so that the fan unit 31 is connected with the second signal board 32 in a hot plug manner.

Two expansion modules 41 are inserted into the front window of the chassis, so that the expansion modules 41 are connected with the middle backboard module 1 in a hot plug manner.

Two drawing members 21 with a main board unit 22 fixed thereto are respectively inserted into the chassis from slots on both sides of the chassis, so that the main board unit 22 is connected with the middle back board module 1 in a hot plug manner.

The first signal board 51 is inserted into the chassis along the first direction X from the rear window of the server, so that the first signal board 51 is connected with the middle backboard module 1 in a hot plug manner.

The extension unit 53 and the power supply unit 52 are inserted into the chassis along the first direction X, so that the extension unit 53 and the power supply unit 52 are connected with the first signal board 51 in a hot plug manner.

The assembly mode of the server can realize that a plurality of components can be maintained under the condition that the server is not shut down.

According to an embodiment of the present application, in another aspect, there is provided a data center including the server in any one of the above embodiments.

In this embodiment, the data center includes the above-described server, and has the same technical effects as the above-described server.

Although embodiments of the present application have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the application, and such modifications and variations fall within the scope of the application as defined by the appended claims.

Claims

1. A server having a first direction (X) and a second direction (Y) intersecting each other, characterized in that it comprises:

Chassis;

A mid-backplane module (1) is arranged in the chassis and extends along the first direction (X), the mid-backplane module (1) having a built-in circuit for signal transmission;

A data processing module (2), at least one of which is provided, the data processing module (2) being located on one side of the mid-backplane module (1) along the second direction (Y) and being wirelessly connected to the mid-backplane module (1);

A fan module (3) wirelessly connected to the mid-backplane module (1);

An extension module (4) wirelessly connected to the mid-backplane module (1) and used for connecting an extension device;

A power module (5) wirelessly connected to the mid-backplane module (1);

The expansion module (4), the fan module (3), the data processing module (2) and the power supply module (5) are arranged in the chassis along the first direction (X), and perform signal exchange with each other through the mid-backplane module (1).

2. The server according to claim 1, characterized in that one of the data processing modules (2) is arranged on both sides of the mid-backplane module (1) along the second direction (Y).

3. The server according to claim 2, characterized in that the data processing module (2) located on one side of the mid-backplane module (1) is centrally symmetrically arranged with the data processing module (2) located on the other side of the mid-backplane module (1), and the symmetry axes of the data processing modules (2) located on both sides of the mid-backplane module (1) are perpendicular to both the first direction (X) and the second direction (Y).

4. The server according to any one of claims 1 to 3, characterized in that the data processing module (2) comprises a pull-out component (21) and a mainboard unit (22), the mainboard unit (22) being arranged on the pull-out component (21), slots being arranged on both side surfaces of the chassis along the second direction (Y), the pull-out component (21) being plugged into the slots, so that the mainboard unit (22) is connected to the mid-backplane module (1) along the second direction (Y) by hot plugging.

5. The server according to any one of claims 1 to 3, characterized in that the expansion module (4) and the power module (5) are respectively connected to two ends of the mid-backplane module (1) along the first direction (X), and the fan module (3) and the data processing module (2) are located between the expansion module (4) and the power module (5);

The expansion module (4) and the power module (5) are plugged into the chassis along the first direction (X), and the expansion module (4) is hot-pluggably connected to the mid-backplane module (1).

6. The server according to claim 5, characterized in that the expansion module (4) comprises at least one expansion module (41), a plurality of expansion plug-in slots are arranged on one end face of the expansion module (41) along the first direction (X), and the other end face of the expansion module (41) along the first direction (X) is connected to the mid-backplane module (1) through hot plugging.

7. The server according to claim 6, characterized in that the power module (5) comprises a first signal board (51), a power supply unit (52) and an extension unit (53), the first signal board (51) extends along the second direction (Y), the first signal board (51) is plugged into the mid-backplane module (1) along the first direction (X), at least one of the power supply unit (52) and the extension unit (53) are provided, the power supply unit (52) and the extension unit (53) are arranged side by side along the second direction (Y), and both are wirelessly connected to the first signal board (51).

8. The server according to claim 7, characterized in that the power supply unit (52) and the expansion unit (53) are both connected to the first signal board (51) along one side of the first direction (X) through hot plugging, and the first signal board (51) is hot plugged to the mid-backplane module (1) along the other side of the first direction (X).

9. The server according to claim 7, characterized in that a plurality of ventilation holes are provided on the first signal plate (51);

And/or, a ventilation slot (42) is provided on the extension module (41).

10. The server according to any one of claims 1 to 3, characterized in that the fan module (3) comprises a fan unit (31) and a second signal board (32), the second signal board (32) extends along the second direction (Y), a plurality of the fan units (31) are provided, the plurality of the fan units (31) are arranged side by side along the second direction (Y) and are wirelessly connected to the second signal board (32), the second signal board (32) is wirelessly connected to the mid-backplane module (1), and the plurality of the fan units (31) are in two groups and are respectively located on both sides of the mid-backplane module (1).

11. The server according to claim 10, characterized in that it also includes an air guide component, the fan module (3) is arranged between the expansion module (4) and the data processing module (2), and two air guide components are provided, which are respectively located on both sides of the mid-backplane module (1), and are both located between the fan module (3) and the power module (5).

12. The server according to claim 11, characterized in that a first control module (323) is provided on the second signal board (32), and the first control module (323) can control the rotation speed difference of the fan units (31) located on both sides of the mid-backplane module (1) to be 30%-45%.

13. The server according to claim 4, characterized in that a mainboard high-speed signal plug (221), a mainboard low-speed signal plug (222) and a mainboard power supply plug (223) plugged with the mainboard module (1) are arranged at an edge of the mainboard unit (22) close to the middle backplane module (1), and the mainboard high-speed signal plug (221), the mainboard low-speed signal plug (222) and the mainboard power supply plug (223) are arranged at intervals along the first direction (X);

The mainboard high-speed signal plug (221) is used to provide a high-speed signal to the expansion device, and the mainboard low-speed signal plug (222) is used to provide a low-speed control signal and a PCIE signal to the expansion device, and to provide a low-speed control signal to the fan module (3) and the power module (5).

14. The server according to claim 2 or 3, characterized in that the mid-backplane module (1) comprises a board body and a fixing frame, and the board body is fixed in the chassis through the fixing frame;

And/or, on a side surface of the board body along the second direction (Y), a first expansion plug interface (11), a fan control plug interface (12), a mainboard high-speed signal plug interface (13), a mainboard low-speed signal plug interface (14), a mainboard power supply plug interface (15) and a first power supply plug interface (18) are sequentially arranged along the first direction (X);

On the other side of the board body along the second direction (Y), a first expansion plug interface (11), a fan power plug interface (17), a mainboard power plug interface (15), a mainboard low-speed signal plug interface (14), a mainboard high-speed signal plug interface (13) and a second expansion plug interface (16) are sequentially arranged along the first direction (X);

Wherein, the two first extension plug interfaces (11) located on both sides of the middle backplane module (1) are respectively used to connect to the two extension modules (41) in the extension module (4) to transmit control signals and power supply signals;

Two groups of the mainboard high-speed signal plug-in interface (13), the mainboard low-speed signal plug-in interface (14) and the mainboard power supply plug-in interface (15) located on both sides of the mid-backplane module (1) are respectively used to connect to the data processing modules (2) located on both sides of the mid-backplane module (1);

The fan control plug interface (12) and the fan power supply plug interface (17) are used to connect to the fan module (3);

The first power supply socket (18) and the second extension socket (16) are used to connect to a power supply module (5).

15. A data center, comprising: a server as described in any one of claims 1 to 14.