CN119092448A - Resin loading mechanism and semiconductor packaging equipment - Google Patents
Resin loading mechanism and semiconductor packaging equipment Download PDFInfo
- Publication number
- CN119092448A CN119092448A CN202411401556.1A CN202411401556A CN119092448A CN 119092448 A CN119092448 A CN 119092448A CN 202411401556 A CN202411401556 A CN 202411401556A CN 119092448 A CN119092448 A CN 119092448A
- Authority
- CN
- China
- Prior art keywords
- base
- resin
- moving
- movable
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
本发明属于半导体封装技术领域，提供一种树脂装载机构，包括第三基座，能够做往复直线移动；第四移动层，设有第四移动基板，第四移动层通过第四移动基板相对第三基座活动设置；托盘搬运机构，设置于所述第四移动基板上，托盘搬运机构用于树脂的传输以及空的树脂托盘的回收；托盘搬运机构包括第二主夹机构和第二副夹机构，其中第二主夹机构用于树脂托盘的托取搬运，第二副夹机构用于薄膜的固定。本发明通过设置第二主夹机构和第二副夹机构，将树脂托盘的搬运和薄膜的固定分开设置，在保证树脂托盘能够完全采用自动化上料，还能够使树脂托盘往复回收利用，且通过第二副夹机构控制薄膜与树脂托盘的分离，无需复杂的操作流程，提高封装上料效率。
The present invention belongs to the field of semiconductor packaging technology, and provides a resin loading mechanism, including a third base capable of reciprocating linear movement; a fourth moving layer, provided with a fourth moving substrate, the fourth moving layer is movably arranged relative to the third base through the fourth moving substrate; a tray transport mechanism, arranged on the fourth moving substrate, the tray transport mechanism is used for the transmission of resin and the recovery of empty resin trays; the tray transport mechanism includes a second main clamping mechanism and a second auxiliary clamping mechanism, wherein the second main clamping mechanism is used for the support and transportation of the resin tray, and the second auxiliary clamping mechanism is used for the fixation of the film. The present invention separates the transportation of the resin tray and the fixation of the film by arranging the second main clamping mechanism and the second auxiliary clamping mechanism, while ensuring that the resin tray can be fully automatically loaded, and the resin tray can also be recycled and reused, and the separation of the film and the resin tray is controlled by the second auxiliary clamping mechanism, without the need for complicated operating procedures, thereby improving the efficiency of packaging loading.
Description
Technical Field
The invention relates to the field of semiconductor chip substrate packaging, in particular to a resin loading mechanism and semiconductor packaging equipment.
Background
With the progress of semiconductor technology over time, more complex semiconductor devices such as integrated circuits, large scale integrated circuits, etc. have evolved. The development of these technologies has greatly advanced the fields of computers, communications, medical treatment, etc., so that our lives are more convenient and efficient.
The compression encapsulation of chip substrate is the essential step, and traditional chip substrate's compression encapsulation equipment needs to carry out the manual work and carries out the resin material loading, and the manual work material loading resin on the one hand lays the precision low, and manual operation danger coefficient increases, and production efficiency is low simultaneously, therefore how to realize the automated transmission of resin is the problem that the field personnel need to solve urgently.
Disclosure of Invention
The invention provides a resin loading mechanism, which solves the problems of safety, precision, low packaging efficiency and automatic resin transmission caused by the need of manual feeding assistance of traditional packaging equipment in the technical background.
In order to solve the technical problems, the invention adopts the following technical scheme:
a resin loading mechanism comprising:
the third base can do reciprocating linear movement;
the fourth moving layer is provided with a fourth moving substrate, and the fourth moving layer is movably arranged relative to the third base through the fourth moving substrate;
And the tray conveying mechanism is arranged on the fourth movable substrate and is used for conveying resin and recovering empty resin trays.
In some embodiments, the device further comprises a third moving layer, a third moving substrate is arranged, the third moving substrate is movably arranged on the third base, the fourth moving layer is movably arranged on the third moving layer, and the moving directions of the fourth moving layer and the third moving layer are consistent and perpendicular to the moving direction of the third base.
In some embodiments, a fourth guide rail is disposed on the third base, a fourth slider is disposed on the fourth guide rail, the third moving substrate is disposed on the fourth slider, and an axial direction of the fourth guide rail is consistent with a moving direction of the fourth moving layer.
In some embodiments, a fifth guide rail is disposed on the third translation substrate, a fifth slider is disposed on the fifth guide rail, and an axial direction of the fifth guide rail is consistent with an axial direction of the fourth guide rail.
In some embodiments, the number of the fourth guide rails is at least two, at least two fourth guide rails are arranged in parallel at intervals, and at least one fourth sliding block is arranged on each fourth guide rail;
The number of the fifth guide rails is at least two, the fifth guide rails are arranged in parallel at intervals, and at least one fifth sliding block is arranged on each fifth guide rail.
In some embodiments, the device further comprises a fourth driving assembly, the fourth driving assembly comprises a fourth driving motor, a fourth driving belt wheel, a fourth driven belt wheel and a fourth synchronous belt, the fourth driving motor is arranged on the third movable base plate, the fourth driving belt wheel is arranged on an output shaft of the fourth driving motor, the fourth driven belt wheel is rotatably arranged on the fourth movable base plate, and the fourth synchronous belt is wound on the fourth driving belt wheel and the fourth driven belt wheel;
The third base is provided with a third connecting block, the fourth moving substrate is provided with a fourth connecting block, the third connecting block is fixedly connected with the fourth synchronous belt, and the fourth connecting block is connected with the fourth synchronous belt.
In some embodiments, in the initial position, the third connection block is proximate to the fourth driven pulley, the fourth connection block is proximate to the fourth driving pulley, and when the third moving layer and the fourth moving layer are fully extended, the third connection block is proximate to the fourth driving pulley, and the fourth connection block is proximate to the fourth driven pulley.
In some embodiments, the tray handling mechanism comprises a second upper base and a second lower base which are mutually connected from top to bottom, wherein the second upper base is connected to the lower side of the second translation substrate, and a second main clamping mechanism and a second auxiliary clamping mechanism are arranged on the second lower base;
the second main clamping mechanism comprises two second main clamping connecting rods which are arranged in parallel, the second main clamping connecting rods are movably arranged on the second lower base, and two ends of each second main clamping connecting rod are provided with second main clamping jaws which can be opened and closed;
the second auxiliary clamping mechanism comprises two auxiliary moving seats which are arranged relative to the second lower base, and a first main clamping block capable of lifting and a second auxiliary clamping block fixedly arranged are arranged on the auxiliary moving seats;
The first main clamping block can move up and down relative to the first auxiliary clamping block, so that the first main clamping block and the first auxiliary clamping block can be opened and closed;
The two auxiliary moving seats can move back to back or opposite to each other, so that the second auxiliary clamping block is driven to open and close.
In some embodiments, the present invention also provides a semiconductor packaging apparatus, including:
the resin loading mechanism as described in the above embodiments;
The second installation platform is provided with at least one third guide rail, a third sliding block is arranged on the third guide rail, and the third base is arranged on the third sliding block;
and the third driving assembly is used for driving the resin loading mechanism to reciprocate linearly along the third guide rail.
In some embodiments, the third driving assembly includes a third driving motor disposed on the third base, a second gear is disposed at an output end of the third driving motor, a second rack is disposed on the second mounting platform, the second rack is disposed in parallel with the third guide rail, and the second gear is meshed with the second rack.
Compared with the prior art, the invention has the beneficial effects that:
Through set up reciprocating motion's resin loading mechanism on second mounting platform, set up tray transport mechanism on resin loading mechanism for the transmission of resin and the secondary recycle of tray need not to carry out artifical material loading, simultaneously, combine second owner on the tray transport mechanism to press from both sides mechanism and second auxiliary clamp mechanism, press from both sides the transport fixed to the tray through the second owner and press from both sides the mechanism, cooperate the second auxiliary clamp mechanism again and carry out the fixed of the film of resin tray below to guarantee the stable transmission of resin, avoid separating between film and the resin tray, lead to the resin to spill.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
FIG. 1 is a first perspective view of the resin loading mechanism of the present invention;
FIG. 2 is a top view of the resin loading mechanism of the present invention;
FIG. 3 is an exploded view of the resin state machine of the present invention;
FIG. 4 is another schematic view of FIG. 3;
FIG. 5 is an exploded view of the tray handling mechanism of the present invention;
FIG. 6 is a schematic view of another alternative construction of the tray handling mechanism of the present invention;
FIG. 7 is a cross-sectional view of H-H of FIG. 2;
fig. 8 is a schematic view of a resin loading mechanism according to the present invention disposed on a second mounting platform.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings. In the description of the present embodiment, unless otherwise indicated, the terms "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the present application must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In one embodiment, as shown in fig. 1, the resin loading mechanism 800 includes a third base 801, a third moving layer and a fourth moving layer, wherein the third base 801 is slidably disposed on the second mounting platform 102, the third moving layer can protrude to one side with respect to the third base 801, the fourth moving layer can protrude to one side with respect to the third moving layer and is consistent with the protruding direction of the third moving layer, meanwhile, the moving directions of the third moving layer and the fourth moving layer are perpendicular to the moving direction of the third base 801, and the tray handling mechanism 4034 is disposed on the fourth moving substrate for handling the resin tray.
Further, as shown in fig. 3 and 4, the third moving layer includes a third moving substrate 802, the third moving substrate 802 is slidably disposed on a third base 801, a fourth driving motor 8021 is disposed on the third moving substrate 801, an output shaft of the fourth driving motor 8021 is connected to a fourth driving pulley 8022, a rotating fourth driven pulley 8024 is disposed on the third moving substrate 802, and the third moving substrate 802 and the fourth driving pulley 8024 are connected in a winding manner through a fourth synchronous belt 8025;
Further, the fourth moving layer includes a fourth moving substrate 803, and a tray conveying mechanism 8031 for conveying an empty resin tray 80344 or conveying a resin tray 80344 on which a film and a resin are to be laid is provided on the fourth moving substrate 803. In this embodiment, in order to reduce the driving device, as shown in fig. 7, a fourth connection block 8033 is disposed on the fourth moving substrate 803, the fourth connection block 8033 is fixedly connected with the fourth synchronous belt 8025, in the initial position, the third connection block 8014 is close to the fourth driven pulley 8024, the fourth connection block 8033 is close to the fourth driving pulley 8022, and when the fourth driving motor 8021 rotates, the third moving layer and the fourth moving layer are driven to move relative to the third connection block 8014 on the third base 801, and meanwhile, the fourth connection block 8033 is fixedly connected with the fourth synchronous belt 8025, and the fourth movement substrate 803 and the third moving substrate 802 synchronously move due to the fixed connection of the fourth connection block 8033.
Alternatively, the fourth moving substrate 803 may be driven by a separate driving device, such as a motor lead screw slider structure, a motor combined with a synchronous wheel synchronous belt structure, or a cylinder structure with a push rod.
In one embodiment, as shown in fig. 5, the tray handling mechanism includes a second upper base 40341 and a second lower base 40342 that are fixedly connected from top to bottom, a preset distance is provided between the second upper base 40341 and the second lower base 40342, the second upper base 40341 is fixedly connected to the second moving substrate 403, and the second tray clamping assembly 4034 further includes a second main clamping mechanism and a second sub clamping mechanism, which are specifically as follows;
Referring to fig. 5 again, the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, two main clamping cylinders 403433 with two open and close free ends, the two free ends can move back to back or move opposite to each other to open and close the second main clamping jaws 303424, two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly arranged at two ends of the second main clamping connecting rods 403423, the second main clamping jaws 403424 are matched with clamping grooves 403441 on a resin tray 40344, the main clamping cylinders 403433 are fixed on a second lower base 40342, the two main clamping push rods 403422 are respectively fixed at two open and close free ends of the main clamping cylinders 403433, and the two free ends of the main clamping cylinders 403433 move opposite to each other to drive the four second main clamping jaws 403424 to open and close so as to grasp or put down the resin tray 40344, and in this embodiment, the second main clamping jaw 403424 is a hook type structure.
Further, four second main guide rails 403426 are disposed on the second lower base 40342, four corresponding second main sliders 403425 are disposed on the four second main guide rails 403426, the axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free ends of the main clamping cylinder 403433, and the four second main sliders 403425 are respectively and fixedly disposed at two ends of the corresponding two main clamping connecting rods 403423, so as to support the second main clamping connecting rods 403423.
Optionally, as shown in fig. 6, the second main clamping jaw 403424 may be further configured to be in a rotating structure, the two parallel second main clamping links 403434 are rotatably disposed on the second lower base 40342, specifically, four rotating brackets 403435 are disposed on the second lower base 40342, the second main clamping link 403434 is rotatably disposed on the four rotating brackets 403425 through bearings, a second main clamping rocker 403436 is disposed between two free ends of the main clamping cylinder 403433 and two corresponding second main clamping links 403434, one end of the second main clamping rocker 403436 is fixedly connected with the second main clamping link 40344, the other end of the second main clamping rocker 403436 is movably connected with one free end of the main clamping cylinder 403433, for example, a first connecting rod with a first connecting slot with a long strip structure is movably connected with one free end of the main clamping cylinder 403433, one end of the first connecting rod with the first connecting slot is disposed on a side far away from the second lower base 40342, so that the first connecting slot moves vertically, and the first connecting rod can move vertically to avoid interference with the first connecting slot to form a first connecting slot 962, so that the first clamping jaw can be opened and closed or closed by the first connecting slot is configured to avoid interference with the first connecting slot to move in the first connecting slot. For example, when the two free ends of the main clamp cylinder 403433 are opened and separated, the second main clamp jaw 403424 is not engaged with the resin tray 40344, and when the two free ends of the main clamp cylinder 403433 are closed and close, the second main clamp jaw 403424 is in mating abutment with the clamp groove 403441 of the resin tray.
As shown in fig. 5, the second sub-clamping mechanism includes a sub-clamping cylinder 403421, a sub-clamping cylinder 403421 is provided with two free ends capable of moving toward or away from each other, a sub-moving seat 403428 provided at the free end of the sub-clamping cylinder 403421, a first sub-clamping block 403431 provided on the sub-moving seat 403428, the first sub-clamping block 403431 capable of clamping and coating one side edge of the resin tray 40344, a first lifting/lowering block 403430 provided on the sub-moving seat 403428, specifically, a second lifting/lowering cylinder 403429 provided on the sub-moving seat 403428, the second lifting/lowering cylinder 403429 connecting the free end of the cylinder 403429 with the first main clamping block 403430, closing and opening the first sub-clamping block 403431 by lifting/lowering the first main clamping block 403430, clamping and fixing the film, and combining the sub-clamping cylinder 403421 to bring the sub-moving seat 403428 close to each other, thereby fixing the edge of the film carrying the resin with respect to the resin tray 40344. In this embodiment, the two sets of the auxiliary moving seat 403428, the first auxiliary clamping block 40341 and the first main clamping block 40340 and the second lifting cylinder 403429 are symmetrically arranged with respect to the second upper base 40341, so as to clamp and fix the film at the edge of the resin tray 40344, and keep the resin tray 40344 and the film moving synchronously.
Further, a second sub rail 403411 is provided on the second upper base 40341, a second sub slider 403432 is provided on the second sub rail 403411, and the second sub slider 403432 is connected to the sub moving seat 403428, so as to provide support for the sub moving seat 403428, and an axial direction of the second sub rail 403411 is consistent with an opening and closing moving direction of the free end of the sub chuck cylinder 403421.
In this embodiment, as shown in fig. 5, the first secondary clamping block 403431 and the first primary clamping block 403430 are located on opposite sides of the resin tray 40344 and the second primary clamping jaw 403424 is located on the other two opposite sides of the resin tray 40344.
In one embodiment, as shown in fig. 8, the present invention further provides a semiconductor package apparatus, which mainly includes the resin loading mechanism in each of the above embodiments, the second mounting platform 102 having at least one third rail 1025 thereon, the third rail 1025 having a third slider 8013 thereon, the third base 801 being fixedly disposed on the third slider 8013, and a third driving assembly for driving the resin loading mechanism 800 to reciprocate linearly along the third rail 8013. Specifically, in the embodiment, the third driving assembly includes a third driving motor 8011 disposed on a third base 801, an output end of the third driving motor 8011 is provided with a second gear 8012, a second straight rack 1026 is disposed on the second mounting platform 102, the second straight rack 1026 is parallel to the third guide rail 1025, and the second gear 8012 and the second straight rack 1026 are in meshed transmission.
Alternatively, the transmission manner of the second gear 8012 and the second straight rack 1026 may be replaced by a screw slider structure, or a transmission structure of a synchronous belt synchronous wheel is adopted, where the third driving motor 8011 needs to be disposed on the second mounting platform.
Optionally, the third driving assembly may be replaced by a straight push rod cylinder, and the third base is fixedly connected with the free end of the straight push rod cylinder.
The foregoing is merely a preferred embodiment of the invention, and it should be noted that modifications and enhancements can be made by those skilled in the art without departing from the principles of the present invention. Such modifications and variations are also considered to be a departure from the scope of the invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411401556.1A CN119092448B (en) | 2024-10-09 | 2024-10-09 | Resin loading mechanism and semiconductor packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411401556.1A CN119092448B (en) | 2024-10-09 | 2024-10-09 | Resin loading mechanism and semiconductor packaging equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119092448A true CN119092448A (en) | 2024-12-06 |
| CN119092448B CN119092448B (en) | 2025-06-27 |
Family
ID=93662373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411401556.1A Active CN119092448B (en) | 2024-10-09 | 2024-10-09 | Resin loading mechanism and semiconductor packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119092448B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014148857A1 (en) * | 2013-03-22 | 2014-09-25 | (주)에스티아이 | Device and method for transferring substrate and substrate-transferring tray |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN116978841A (en) * | 2023-07-05 | 2023-10-31 | 深圳市捷佳伟创新能源装备股份有限公司 | Vehicle handling device and carrier handling method |
| CN118125051A (en) * | 2024-03-07 | 2024-06-04 | 铜陵富仕三佳机器有限公司 | A resin double-row feeding device and process |
-
2024
- 2024-10-09 CN CN202411401556.1A patent/CN119092448B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014148857A1 (en) * | 2013-03-22 | 2014-09-25 | (주)에스티아이 | Device and method for transferring substrate and substrate-transferring tray |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN116978841A (en) * | 2023-07-05 | 2023-10-31 | 深圳市捷佳伟创新能源装备股份有限公司 | Vehicle handling device and carrier handling method |
| CN118125051A (en) * | 2024-03-07 | 2024-06-04 | 铜陵富仕三佳机器有限公司 | A resin double-row feeding device and process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119092448B (en) | 2025-06-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI255252B (en) | Substrate accommodating tray pallet and substrate transfer system | |
| CN207174883U (en) | A kind of flow channel type is layered upper trigger | |
| CN107293803B (en) | Material stacking production line | |
| CN111842035A (en) | A kind of multi-channel lamination assembly equipment for mobile phone camera module | |
| CN111564526A (en) | Solder strip laying device, stacking equipment and stacking method | |
| CN111867800B (en) | Resin casting device | |
| CN107039324B (en) | A fully automatic tubular PECVD loading and unloading machine and method | |
| CN118597818A (en) | An electronic paper material taking system with integrated loading and unloading | |
| CN119092448B (en) | Resin loading mechanism and semiconductor packaging equipment | |
| CN223273237U (en) | Resin loading mechanism and semiconductor packaging equipment | |
| CN220786306U (en) | Film pulling device | |
| CN110040523A (en) | Device is moved away from a kind of layering of overlapping runner plate | |
| CN223273235U (en) | Layered chip substrate, resin conveying structure and semiconductor packaging equipment | |
| CN119381313B (en) | Chip substrate loading mechanism and semiconductor packaging equipment | |
| CN223273236U (en) | Novel chip substrate loading mechanism and semiconductor packaging equipment | |
| CN219216789U (en) | Marshalling equipment and palletizing system | |
| CN117817072A (en) | Inductance tin dipping transfer steering swinging plate workstation | |
| CN223273234U (en) | A fully automatic loading and unloading mechanism for semiconductor chip substrates | |
| TWI800830B (en) | Method for controlling stacking device to automatically adjust stacking height | |
| CN222785877U (en) | Automatic feeding and discharging device for tray of motor magnet assembly production line | |
| CN109094883B (en) | Box pushing machine | |
| CN222260996U (en) | Lifting and transferring device for high-density integrated circuit lead frame electroplating production line | |
| CN220664170U (en) | Material conveying equipment | |
| CN222497593U (en) | Magnetic core material loading and transfer device | |
| CN223665427U (en) | Feeding mechanism of high-density integrated circuit lead frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20250609 Address after: 226007 Jiangsu Province, Chongchuan District, Nantong City, No. 688 Xingfu Road, Building 4, 1st and 2nd floors Applicant after: Mifan Technology (Nantong) Co.,Ltd. Country or region after: China Address before: Building 3, No. 1239 Chunli Road, Jinshan District, Shanghai, June 2015 Applicant before: Mifan Technology (Shanghai) Co.,Ltd. Country or region before: China |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |