CN119017250A - Semiconductor wafer grinding and polishing equipment and grinding process - Google Patents
Semiconductor wafer grinding and polishing equipment and grinding process Download PDFInfo
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- CN119017250A CN119017250A CN202411525688.5A CN202411525688A CN119017250A CN 119017250 A CN119017250 A CN 119017250A CN 202411525688 A CN202411525688 A CN 202411525688A CN 119017250 A CN119017250 A CN 119017250A
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- 238000000227 grinding Methods 0.000 title claims abstract description 197
- 238000005498 polishing Methods 0.000 title claims abstract description 49
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000008569 process Effects 0.000 title claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 63
- 238000005192 partition Methods 0.000 claims abstract description 6
- 238000009434 installation Methods 0.000 claims description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 21
- 239000007921 spray Substances 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 11
- 238000011010 flushing procedure Methods 0.000 claims description 9
- 230000001050 lubricating effect Effects 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005461 lubrication Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 87
- 238000001179 sorption measurement Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000012634 fragment Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本发明提供了一种半导体晶圆研磨和抛光设备及研磨工艺，属于研磨抛光技术领域，包括工作机台，工作机台上转动设置有第一安装机台，第一安装机台上沿自身周向均匀间隔设置有若干个安装分区，每个安装分区内均转动设置有第二安装机台，第二安装机台上设置有用于固定晶圆的定位机构，工作机台的上方沿第一安装机台旋转方向依次设有一次研磨机构和二次研磨机构。在对晶圆进行研磨和抛光时，由机械手对晶圆定心夹持后，将晶圆夹持放入第二安装机台，第一安装机台运作过程中，使晶圆依次经过一次研磨机构和二次研磨机构，先后对晶圆进行粗研磨加工和精研磨加工，两次研磨加工工作连续，设备不停机，具有提高对晶圆的研磨效率的效果。
The present invention provides a semiconductor wafer grinding and polishing equipment and grinding process, belonging to the field of grinding and polishing technology, including a working machine, a first mounting machine is rotatably arranged on the working machine, a plurality of mounting partitions are evenly spaced along the circumference of the first mounting machine, a second mounting machine is rotatably arranged in each mounting partition, a positioning mechanism for fixing the wafer is arranged on the second mounting machine, and a primary grinding mechanism and a secondary grinding mechanism are arranged in sequence above the working machine along the rotation direction of the first mounting machine. When grinding and polishing the wafer, after the wafer is centered and clamped by a robot, the wafer is clamped and placed in the second mounting machine. During the operation of the first mounting machine, the wafer passes through the primary grinding mechanism and the secondary grinding mechanism in sequence, and the wafer is subjected to rough grinding and fine grinding successively. The two grinding processes are continuous, and the equipment does not stop, which has the effect of improving the grinding efficiency of the wafer.
Description
Technical Field
The invention relates to the technical field of grinding and polishing, in particular to a semiconductor wafer grinding and polishing device and a grinding process.
Background
The silicon wafer is a basic material for manufacturing the semiconductor device, and various complex circuit structures can be manufactured by carrying out photoetching, ion implantation, etching and other process steps on the silicon wafer, so that the semiconductor device with specific functions is formed. The silicon wafer is mainly made of monocrystalline silicon, and the monocrystalline silicon material is subjected to processes such as slicing, grinding, polishing and the like to form the silicon wafer with certain thickness and specification.
The patent with publication number CN208961748U discloses a double-sided lapping device for wafer processing, comprising: the grinding machine comprises a base, supporting legs, a workbench, a first transmission mechanism, a grinding disc, a first motor, an electric push rod, a lower mounting seat, an upper mounting seat, a second transmission mechanism, a grinding head, a second motor, a cushion block, a sun gear, a planetary gear, an input shaft and an output shaft; the base is rectangular, and cylindrical supporting legs which are rectangular in array are fixed at the bottom of the base through bolts; a rectangular workbench is arranged above the base and is connected with the base through a cushion block. The wafer is arranged on the grinding disc, the grinding head descends and is pressed on the wafer after the lower mounting seat descends, and the two sides of the wafer can be processed by enabling the grinding head to rotate relative to the grinding disc.
However, when the wafer is processed, according to the polishing degree of the wafer, after the wafer is required to be removed in time, the structures such as the polishing pad, the millstone and the like are replaced, different polishing liquids are used for assisting, the polishing operation is started again, the instrument is started and stopped frequently, the polishing and polishing efficiency is reduced, and the service life of the instrument is influenced.
Disclosure of Invention
In view of the foregoing problems in the prior art, the present invention provides a semiconductor wafer grinding and polishing apparatus and a grinding process.
In order to achieve the above purpose, the invention adopts the following technical scheme:
In a first aspect, a semiconductor wafer grinding and polishing apparatus is provided, including a working machine, a first mounting machine is rotatably disposed on the working machine, a plurality of mounting partitions are uniformly disposed on the first mounting machine along a circumferential direction thereof at intervals, a second mounting machine is rotatably disposed in each mounting partition, and a positioning mechanism for fixing a wafer is disposed on the second mounting machine;
The top of workstation is equipped with once grinds mechanism and secondary grinding mechanism in proper order along first mounting plate platform direction of rotation, and once grinds the mechanism and includes first installation arm, and the below rotary drive of first installation arm is provided with first grinding tool bit, and secondary grinding mechanism includes the second installation arm, and the below rotary drive of second installation arm is provided with the second grinding tool bit, and first installation arm and second installation arm are all perpendicular to go up and down to set up with the workstation, and first grinding tool bit and second grinding tool bit all set up with the second mounting plate platform is eccentric.
Further, be provided with first flexible post and the flexible post of second on the workstation, first installation arm and second installation arm are connected respectively on the top of first flexible post and the flexible post of second, are equipped with on the workstation and are used for driving the first driving piece and the second driving piece of the vertical flexible of first flexible post and the flexible post of second respectively.
Further, the first installation arm and the second installation arm are respectively connected with the first telescopic column and the second telescopic column in a rotating mode, and the first telescopic column and the second telescopic column are respectively provided with a first swinging assembly and a second swinging assembly which are used for driving the first installation arm and the second installation arm to horizontally swing in a reciprocating mode.
Further, the positioning mechanism comprises a vacuum pump, a vacuum cavity is formed in the second mounting machine table, a plurality of adsorption holes communicated with the vacuum cavity are formed in the top of the second mounting machine table, and the suction end of the vacuum pump is communicated with the vacuum cavity.
Further, a burr grinding mechanism is arranged between the primary grinding mechanism and the secondary grinding mechanism on the working machine table, the burr grinding mechanism comprises a third mounting arm, the third mounting arm is connected with the working machine table through a third telescopic column, and a third driving piece for driving the third telescopic column to vertically stretch out and draw back is arranged on the working machine table;
the mounting plate is arranged below the third mounting arm, a plurality of grinding wheels are arranged below the mounting plate in a uniformly spaced rotary driving mode along the circumferential direction of the mounting plate, and a fourth driving piece for synchronously driving the plurality of grinding wheels to radially move along the mounting plate is arranged on the mounting plate.
Further, the fourth driving piece includes drive lead screw, slider and fifth driving piece, has radially offered the spout along self on the mounting disc, and the spout is equipped with many along mounting disc axial interval, and slider one-to-one sliding connection is in the spout, all is on a parallel with self length direction rotation in every spout and is connected with drive lead screw, drive lead screw in slider threaded connection, and the setting of fifth driving piece is used for driving many drive lead screws simultaneously on the mounting disc and rotates.
Further, the edge of the top wall of the second mounting plate is coaxially provided with a yielding step along the circumferential direction, a yielding ring corresponding to the polishing wheel is coaxially arranged on the yielding step on the second mounting plate in a lifting manner, and a sixth driving piece for driving the yielding ring to vertically lift is arranged on the second mounting plate.
Further, still include lubricated subassembly, lubricated subassembly is including setting up first storage jar and the second storage jar in workstation top, first storage jar and second storage jar are used for depositing coarse grinding lubricating liquid and correct grinding lubricating liquid respectively, the bottom of first storage jar is connected with first outlet pipe, be provided with first electronic valve on the first outlet pipe, first outlet pipe is located one side of grinding mechanism once, the bottom of second storage jar is connected with the second outlet pipe, be provided with second electronic valve on the second outlet pipe, the second outlet pipe is located one side of secondary grinding mechanism.
Further, a flushing component and a water removing component are sequentially arranged between the burr grinding mechanism and the secondary grinding mechanism, and a fourth mounting arm is arranged above the working machine table;
The flushing component comprises a spray head arranged on a fourth mounting arm, a third storage tank for storing cleaning liquid is arranged on the fourth mounting arm, a third water outlet pipe communicated with the spray head is connected to the third storage tank, a plurality of spray heads are uniformly arranged at intervals along the radial direction of the first mounting machine table, and the water outlet ends of the spray heads incline to one side of the primary grinding mechanism;
the dewatering component comprises an air knife, the air knife is radially arranged at the bottom of the fourth mounting arm along the workbench, the air inlet end of the air knife is connected with an air source for supplying dry and hot air, and the inner wall of the air outlet end of the air knife is provided with a heating wire.
In a second aspect, there is also provided a semiconductor wafer grinding process employing a semiconductor wafer grinding and polishing apparatus as provided in the first aspect, comprising:
s01, measuring the thickness and the surface flatness of the wafer, and planning the grinding polishing quantity of the two surfaces of the wafer;
S02, positioning and adsorbing the center of the wafer by a manipulator, transferring and placing the wafer on a second mounting machine table, primarily rough grinding the single surface of the wafer to reduce the thickness to a rough grinding target grinding amount, and continuously secondarily fine grinding and thinning the single surface of the wafer and polishing the single surface of the wafer to a fine grinding target grinding amount;
S03, clamping the wafer from the second mounting machine table by the mechanical arm, turning over the wafer, mounting the wafer on the second mounting machine table again, and carrying out rough grinding and finish grinding on the wafer in sequence to enable the two surfaces of the wafer to be thinned and polished to the target grinding amount;
s04, measuring the thickness and the surface flatness of the wafer again, and packaging and boxing the wafer after finishing the grinding and polishing of the wafer.
The beneficial effects of the invention are as follows: when the wafer is ground and polished, after the wafer is clamped by the manipulator in a centering manner, the wafer is clamped and placed into the second mounting machine table, and in the operation process of the first mounting machine table, the wafer sequentially passes through the primary grinding mechanism and the secondary grinding mechanism, the wafer is subjected to rough grinding processing and finish grinding processing, the two grinding processing works are continuous, the equipment is not stopped, and the synchronous grinding work of a plurality of wafers can be realized by simultaneously mounting the wafer on the second mounting machine tables, so that the grinding efficiency of the wafer is greatly improved.
Drawings
Fig. 1 is a schematic view showing the overall structure of a semiconductor wafer grinding and polishing apparatus according to embodiment 1 of the present application.
Fig. 2 is a schematic top view of the polishing and grinding apparatus for semiconductor wafers according to embodiment 1 of the present application.
Fig. 3 is a schematic structural diagram of a secondary polishing mechanism according to embodiment 1 of the present application.
Fig. 4 is a schematic structural view of a burr grinding mechanism according to embodiment 1 of the present application.
Fig. 5 is a schematic view showing a mounting structure of a grinding wheel on a slider according to embodiment 1 of the present application.
Fig. 6 is a schematic view showing the structure of the flushing assembly and the water removal assembly according to embodiment 1 of the present application.
The method comprises the following steps of 1, a working machine table; 11. a first mounting plate; 12. a second mounting plate; 121. a step of giving way; 122. a yielding ring; 123. a sixth driving member; 124. adsorption holes; 2. a primary grinding mechanism; 21. a first mounting arm; 22. a first abrasive tip; 23. a first telescoping column; 24. a first driving member; 25. a first swing assembly; 26. a third driving motor; 3. a secondary grinding mechanism; 31. a second mounting arm; 32. a second abrasive tip; 33. a second telescoping column; 34. a second driving member; 35. a second swing assembly; 351. a swing driving motor; 352. a drive plate; 353. a guide post; 36. a fourth driving motor; 4. a burr grinding mechanism; 41. a third mounting arm; 42. a third telescoping column; 43. a third driving member; 44. a mounting plate; 45. grinding wheel; 46. driving a screw rod; 47. a slide block; 48. a fifth driving member; 49. a polishing driving motor; 491. a slider; 492. an elastic member; 5. a lubrication assembly; 51. a first storage tank; 52. a second storage tank; 53. a first water outlet pipe; 54. a second water outlet pipe; 6. a fourth mounting arm; 61. a spray head; 62. an air knife; 63. a third water outlet pipe; 64. and an air pipe.
Detailed Description
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
Example 1
The embodiment of the application provides a semiconductor wafer grinding and polishing device, referring to fig. 1 and 2, which comprises a working machine table 1, wherein a first mounting machine table 11 is horizontally rotatably mounted on the working machine table 1, a first driving motor for driving the first mounting machine table 11 to rotate is arranged in the working machine table 1, a plurality of mounting areas are uniformly arranged on the first mounting machine table 11 along the circumferential direction of the first mounting machine table at intervals, a second mounting machine table 12 is independently and horizontally rotatably mounted in each mounting area, a second driving motor for driving each second mounting machine table 12 to rotate is arranged in the first mounting machine table 11, and a positioning mechanism for fixing wafers is arranged on the second mounting machine table 12. In the embodiment of the application, the positioning mechanism is a vacuum pump, a vacuum cavity is formed in each second mounting machine table 12, an exhaust runner communicated with the vacuum cavity is arranged in each second mounting machine table 12, a plurality of adsorption holes 124 communicated with the vacuum cavity are formed in the top wall of each second mounting machine table 12, the vacuum pump is mounted in the working machine table 1, the suction end of the vacuum pump is communicated with the adsorption holes 124 through the exhaust runner, an electronic valve is arranged in each second mounting machine table 12 on the exhaust runner, and each second mounting machine table 12 is enabled to independently control the adsorption holes 124 to suck air through each electronic valve.
The upper part of the working machine table 1 is sequentially provided with a primary grinding mechanism 2 and a secondary grinding mechanism 3 along the rotation direction of the first mounting machine table 11, and in the rotation process of the first mounting machine table 11, the primary grinding mechanism 2 and the secondary grinding mechanism 3 can simultaneously correspond to the second mounting machine tables 12 in different mounting areas, and the primary grinding mechanism 2 and the secondary grinding mechanism 3 respectively execute rough grinding and fine grinding operations on wafers on the second mounting machine tables 12.
Specifically, the primary grinding mechanism 2 includes a first mounting arm 21, the first mounting arm 21 is located directly above the first mounting machine 11 and the second mounting machine 12, a first grinding bit 22 is rotatably mounted under the first mounting arm 21, a third driving motor 26 is mounted on the first mounting arm 21, and the third driving motor 26 is used for driving the first grinding bit 22 to rotate. The first installation arm 21 is installed on the work machine table 1 through the vertical lift of the first telescopic column 23, the first telescopic column 23 is located the outside of the first installation machine table 11 and used for guiding the first installation arm 21 vertically, the work machine table 1 is provided with a first driving piece 24, the first driving piece 24 can be a linear module, the linear module is fixed on the work machine table 1, a movable seat in the linear module is fixedly connected with the top end of the first telescopic column 23, the first telescopic column 23 is vertically telescopic through the first driving piece 24, and accordingly the first grinding tool bit 22 is vertically lifted, and the downward feeding amount of the first grinding tool bit 22 can be accurately controlled through the linear module.
Referring to fig. 3, the secondary grinding mechanism 3 includes a second mounting arm 31, the second mounting arm 31 is located directly above the first mounting machine 11 and the second mounting machine 12, a second grinding bit 32 is rotatably mounted under the second mounting arm 31, a fourth driving motor 36 is mounted on the second mounting arm 31, and the fourth driving motor 36 is used for driving the second grinding bit 32 to rotate. The second installation arm 31 is vertically lifted and installed on the working machine table 1 through the second telescopic column 33, the second telescopic column 33 is located on the outer side of the first installation machine table 11 and used for vertically guiding the second installation arm 31, the working machine table 1 is provided with a second driving piece 34, the second driving piece 34 can be a linear module, the linear module is fixed on the working machine table 1, and a movable seat in the linear module is fixedly connected with the top end of the second telescopic column 33.
The bottoms of the first grinding bit 22 and the second grinding bit 32 are grinding surfaces with diameters not smaller than the radius of the wafer, the first grinding bit 22 and the second grinding bit 32 are eccentrically arranged with the second mounting machine table 12, the machining mesh number of the second grinding bit 32 is larger than that of the first grinding bit 22, when the first grinding bit 22 and the second grinding bit 32 descend and eccentrically contact the wafer, the first grinding bit 22 and the second grinding bit 32 respectively and independently rotate, and the second working machine table 1 drives the wafer on the first grinding bit 22 and the second grinding bit 32 to independently rotate, so that the wafer is comprehensively ground by the first grinding bit 22 and the second grinding bit 32.
Further, in order to make the grinding tool bit grind the wafer more uniformly, the first mounting arm 21 and the second mounting arm 31 are respectively connected with the first telescopic column 23 and the second telescopic column 33 in a rotating way, and the first swinging component 25 and the second swinging component 35 for driving the first mounting arm 21 and the second mounting arm 31 to swing horizontally and reciprocally are respectively arranged on the first telescopic column 23 and the second telescopic column 33. The first swing assembly 25 and the second swing assembly 35 respectively comprise a swing driving motor 351, a driving disc 352 and a guide column 353, the swing driving motor 351 is respectively fixed at the tops of the first telescopic column 23 and the second telescopic column 33, the driving disc 352 is coaxially connected to an output shaft of the swing driving motor 351, the guide column 353 is eccentrically and fixedly connected to the top wall of the driving disc 352, guide grooves are formed in the first mounting arm 21 and the second mounting arm 31 in a manner of being perpendicular to the rotation axis direction of the first mounting arm 21 and the second mounting arm 31, the guide column 353 is embedded in the guide grooves, and the guide column 353 is in rolling contact with the inner arms of the guide grooves.
Referring to fig. 4, a burr grinding mechanism 4 is further provided on the table 1 between the primary grinding mechanism 2 and the secondary grinding mechanism 3. Specifically, the burr grinding mechanism 4 includes a third mounting arm 41, the third mounting arm 41 is connected to the working machine 1 through a third telescopic column 42, and a third driving member 43 for driving the third telescopic column 42 to vertically extend and retract is provided on the working machine 1. The third driving member 43 may be a linear module, where the linear module is fixed on the working platform 1, and the movable seat of the linear module is fixedly connected with the top end of the third telescopic column 42. A mounting plate 44 is fixed below the third mounting arm 41, a plurality of grinding wheels 45 are rotatably mounted below the mounting plate 44 at uniform intervals along the circumferential direction of the mounting plate 44, and a fourth driving member for synchronously driving the plurality of grinding wheels 45 to radially move along the mounting plate 44 is arranged on the mounting plate 44.
Referring to fig. 5, specifically, the device includes a driving screw 46, a sliding block 47 and a fifth driving member 48, wherein the mounting disc 44 is radially provided with sliding grooves along the self, the sliding grooves are axially provided with a plurality of sliding grooves along the mounting disc 44 at intervals, the sliding blocks 47 are slidably connected in the sliding grooves in a one-to-one correspondence manner, the driving screw 46 is rotationally connected in each sliding groove in parallel with the length direction of the sliding grooves, the driving screw 46 is in threaded connection with the sliding block 47, and the fifth driving member 48 is arranged on the mounting disc 44 and is used for simultaneously driving the driving screws 46 to rotate. The fifth driving member 48 may be a motor that drives the plurality of driving screws 46 to rotate synchronously through bevel gear transmission. Grinding wheel 45 is rotatably mounted on slide blocks 47, and each slide block 47 is fixedly provided with a grinding driving motor 49, and grinding driving motor 49 is used for driving grinding wheel 45 to rotate. After the wafer is roughly ground, the third mounting arm 41 is lowered, the fourth driving piece synchronously drives the grinding wheels 45 to synchronously approach inwards to clamp the wafer, the second mounting machine table 12 drives the wafer to rotate, the grinding wheels 45 independently rotate to grind burrs and burrs caused by the rough grinding on the edge of the wafer, and deep scratches caused by the burrs and burrs on the surface of the wafer in the fine grinding process are avoided.
Further, the edge of the top wall of the second mounting machine table 12 is coaxially provided with a step 121 along the circumferential direction thereof, the step 121 is coaxially sleeved with a step 122, the step 122 is coaxially and vertically lifted relative to the second mounting machine table 12 in the step 121, and the second mounting machine table 12 is provided with a sixth driving member 123 for driving the step 122 to vertically lift. The position of the abdication ring 122 corresponds to the position of the polishing wheel 45, when the third mounting arm 41 moves downwards to polish the edge burrs of the wafer, the abdication ring 122 is driven to descend by the sixth driving piece 123, so that the movement space of the polishing wheel 45 can be abdied, and the polishing wheel 45 can be aligned with the edge of the wafer more quickly.
Further, in order to avoid the damage of the grinding wheel 45 to the wafer caused by excessive clamping of the wafer, in the embodiment of the present application, a movable groove is formed in the slider 47, a slider 491 is provided in the movable groove in a horizontal sliding manner, a plurality of elastic members 492 are uniformly arranged in the movable groove at intervals along the circumferential direction of the slider 491, the elastic members 492 are used for driving the slider 491 to move to the center of the movable groove, and the grinding wheel 45 and the grinding driving motor 49 are both mounted on the slider 491. By providing the slider 491, the grinding wheel 45 has a horizontal margin when contacting the wafer edge, avoiding excessive clamping of the wafer by the grinding wheel 45.
Referring to fig. 6, further, a flushing component and a water removing component are sequentially arranged between the burr grinding mechanism 4 and the secondary grinding mechanism 3 along the rotation direction of the first mounting machine table 11, a fourth mounting arm 6 is arranged above the working machine table 1, and the flushing component and the water removing component are both mounted on the fourth mounting arm 6. The second mounting machine table 12 and fragments generated by rough grinding on the wafer can be quickly cleaned through the flushing component, so that the fragments are prevented from causing larger scratches on the wafer in the finish grinding operation, and the water removal component can further remove the fragments and residual grinding lubricating liquid in the rough grinding stage, so that interference of the rough grinding lubricating liquid to the finish grinding lubricating liquid is avoided in the finish grinding stage, and the finish grinding and polishing effects on the wafer are improved.
Specifically, the flushing assembly includes a spray head 61 disposed on a fourth mounting arm 6, a third storage tank for storing a cleaning solution is disposed on the fourth mounting arm 6, a third water outlet pipe 63 communicating with the spray head 61 is connected to the third storage tank, and a water pump is disposed on the third water outlet pipe 63, so that the cleaning solution in the third storage tank can be pumped out from the spray head 61. The shower heads 61 are provided at regular intervals in the radial direction of the first mounter 11, and the water outlet ends of the shower heads 61 are inclined toward the primary polishing mechanism 2, so that the wafer and the chips on the second mounter 12 can be washed toward the primary polishing mechanism 2.
The dewatering subassembly includes air knife 62, and air knife 62 radially sets up in the bottom of fourth installation arm 6 along workstation 1, and air inlet end of air knife 62 is connected with the air supply that is used for supplying with dry hot air through trachea 64, is provided with the heater strip on the air outlet end inner wall of air knife 62. After the air blown by the air knife 62 is purged from the wafer and the second mounting table 12, the remaining liquid and chips on the wafer and the second mounting table 12 are discharged in the direction of the primary polishing mechanism 2. And through the combined action of the dry hot air and the heating wire, the temperature of the air blown to the wafer and the second mounting machine table 12 can be greatly increased, so that the surface of the wafer is quickly dried, and meanwhile, the surface of the wafer is modified by utilizing high temperature, so that the secondary finish grinding processing effect is improved.
Example 2
The embodiment of the invention also provides a semiconductor wafer grinding process, which adopts the semiconductor wafer grinding and polishing equipment provided by the embodiment 1, and comprises the following steps:
S01, measuring the thickness and the surface flatness of the wafer, and planning the grinding polishing quantity of the two surfaces of the wafer.
S02, the manipulator positions and adsorbs the center of the wafer, the wafer is transported and placed on a second mounting machine table 12, the single-side rough grinding of the wafer is reduced to the rough grinding target grinding amount, and the single-side secondary fine grinding of the wafer is continued to be reduced and polished to the fine grinding target grinding amount.
S03, clamping the wafer from the second mounting machine table 12 by the mechanical arm, turning over the wafer, mounting the wafer on the second mounting machine table 12 again, and performing rough grinding and finish grinding on the wafer in sequence to enable the two surfaces of the wafer to be thinned and polished to the target grinding amount.
S04, measuring the thickness and the surface flatness of the wafer again, and packaging and boxing the wafer after finishing the grinding and polishing of the wafer.
It will be apparent to those skilled in the art that while preferred embodiments of the present invention have been described, additional variations and modifications may be made to these embodiments once the basic inventive concepts are known to those skilled in the art. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the invention. It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. The semiconductor wafer grinding and polishing equipment is characterized by comprising a working machine table (1), wherein a first mounting machine table (11) is rotatably arranged on the working machine table (1), a plurality of mounting partitions are uniformly arranged on the first mounting machine table (11) at intervals along the circumferential direction of the first mounting machine table, a second mounting machine table (12) is rotatably arranged in each mounting partition, and a positioning mechanism for fixing a wafer is arranged on the second mounting machine table (12);
The utility model discloses a grinding machine for grinding work machines, including work bench (1), first installation machine bench (11) direction of rotation is equipped with once grinding mechanism (2) and secondary grinding mechanism (3) in proper order, once grinding mechanism (2) are including first installation arm (21), the below rotary drive of first installation arm (21) is provided with first grinding tool bit (22), secondary grinding mechanism (3) are including second installation arm (31), the below rotary drive of second installation arm (31) is provided with second grinding tool bit (32), first installation arm (21) and second installation arm (31) are all vertical to go up and down to set up with work bench (1), first grinding tool bit (22) and second grinding tool bit (32) all set up with second installation machine bench (12) are eccentric.
2. The semiconductor wafer grinding and polishing apparatus according to claim 1, wherein the working machine (1) is provided with a first telescopic column (23) and a second telescopic column (33), the first mounting arm (21) and the second mounting arm (31) are respectively connected to the top ends of the first telescopic column (23) and the second telescopic column (33), and the working machine (1) is provided with a first driving member (24) and a second driving member (34) for respectively driving the first telescopic column (23) and the second telescopic column (33) to vertically expand and contract.
3. A semiconductor wafer grinding and polishing apparatus according to claim 2, wherein the first mounting arm (21) and the second mounting arm (31) are rotatably connected to the first telescopic column (23) and the second telescopic column (33), respectively, and the first telescopic column (23) and the second telescopic column (33) are provided with a first swinging assembly (25) and a second swinging assembly (35) for driving the first mounting arm (21) and the second mounting arm (31) to horizontally reciprocate, respectively.
4. The semiconductor wafer grinding and polishing apparatus according to claim 1, wherein the positioning mechanism comprises a vacuum pump, a vacuum chamber is provided in the second mounting table (12), a plurality of suction holes (124) communicated with the vacuum chamber are provided at the top of the second mounting table (12), and a suction end of the vacuum pump is communicated with the vacuum chamber.
5. A semiconductor wafer grinding and polishing apparatus according to claim 1, wherein a burr grinding mechanism (4) is provided on the work machine (1) between the primary grinding mechanism (2) and the secondary grinding mechanism (3), the burr grinding mechanism (4) includes a third mounting arm (41), the third mounting arm (41) is connected with the work machine (1) through a third telescopic column (42), and a third driving member (43) for driving the third telescopic column (42) to vertically expand and contract is provided on the work machine (1);
The lower part of the third mounting arm (41) is provided with a mounting disc (44), a plurality of grinding wheels (45) are arranged below the mounting disc (44) in a uniformly spaced rotary driving mode along the circumferential direction of the mounting disc (44), and a fourth driving piece for synchronously driving the grinding wheels (45) to radially move along the mounting disc (44) is arranged on the mounting disc (44).
6. The semiconductor wafer grinding and polishing apparatus according to claim 5, wherein the fourth driving member includes a driving screw (46), a slider (47) and a fifth driving member (48), the mounting plate (44) is radially provided with a plurality of sliding grooves along the axial direction of the mounting plate (44), the slider (47) is slidably connected in the sliding grooves in a one-to-one correspondence manner, each sliding groove is rotationally connected with the driving screw (46) parallel to the length direction of the slider (47), the driving screw (46) is in threaded connection with the slider (47), and the fifth driving member (48) is disposed on the mounting plate (44) and is used for simultaneously driving the plurality of driving screws (46) to rotate.
7. The semiconductor wafer grinding and polishing apparatus according to claim 5, wherein an escape step (121) is coaxially provided along a circumferential direction of an edge of a top wall of the second mounting table (12), an escape ring (122) corresponding to a grinding wheel (45) is coaxially provided on the second mounting table (12) in a vertically lifting manner at the escape step (121), and a sixth driving member (123) for driving the escape ring (122) to vertically lift is provided on the second mounting table (12).
8. The semiconductor wafer grinding and polishing apparatus according to claim 5, further comprising a lubrication assembly (5), wherein the lubrication assembly (5) comprises a first storage tank (51) and a second storage tank (52) which are arranged above the working machine table (1), the first storage tank (51) and the second storage tank (52) are respectively used for storing coarse grinding lubricating liquid and fine grinding lubricating liquid, a first water outlet pipe (53) is connected to the bottom of the first storage tank (51), a first electronic valve is arranged on the first water outlet pipe (53), the first water outlet pipe (53) is located on one side of the primary grinding mechanism (2), a second water outlet pipe (54) is connected to the bottom of the second storage tank (52), a second electronic valve is arranged on the second water outlet pipe (54), and the second water outlet pipe (54) is located on one side of the secondary grinding mechanism (3).
9. The semiconductor wafer grinding and polishing apparatus according to claim 5, wherein a flushing component and a water removal component are sequentially arranged between the burr grinding mechanism (4) and the secondary grinding mechanism (3), and a fourth mounting arm (6) is arranged above the working machine table (1);
The flushing assembly comprises a spray head (61) arranged on a fourth mounting arm (6), a third storage tank for storing cleaning liquid is arranged on the fourth mounting arm (6), a third water outlet pipe (63) communicated with the spray head (61) is connected to the third storage tank, a plurality of spray heads (61) are uniformly arranged at intervals along the radial direction of the first mounting machine table (11), and the water outlet end of the spray head (61) is inclined to one side of the primary grinding mechanism (2);
the dewatering assembly comprises an air knife (62), the air knife (62) is radially arranged at the bottom of the fourth mounting arm (6) along the workbench (1), the air inlet end of the air knife (62) is connected with an air source for supplying dry hot air, and a heating wire is arranged on the inner wall of the air outlet end of the air knife (62).
10. A semiconductor wafer grinding process employing a semiconductor wafer grinding and polishing apparatus according to any one of claims 5 to 9, comprising:
s01, measuring the thickness and the surface flatness of the wafer, and planning the grinding polishing quantity of the two surfaces of the wafer;
S02, positioning and adsorbing the center of the wafer by a manipulator, transferring and placing the wafer on a second mounting machine table (12), primarily and coarsely grinding the single surface of the wafer to reduce the thickness to a coarsely ground target grinding amount, and continuously secondarily and finely grinding and thinning the single surface of the wafer and polishing the single surface of the wafer to a finely ground target grinding amount;
S03, clamping the wafer from the second mounting machine table (12) by the mechanical arm, turning over the wafer, mounting the wafer on the second mounting machine table (12) again, and performing rough grinding and finish grinding on the wafer in sequence to enable the two surfaces of the wafer to be thinned and polished to the target grinding amount;
s04, measuring the thickness and the surface flatness of the wafer again, and packaging and boxing the wafer after finishing the grinding and polishing of the wafer.
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| CN202411525688.5A CN119017250B (en) | 2024-10-30 | 2024-10-30 | Semiconductor wafer grinding and polishing equipment and grinding process |
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| CN202411525688.5A CN119017250B (en) | 2024-10-30 | 2024-10-30 | Semiconductor wafer grinding and polishing equipment and grinding process |
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