CN119017227A - Ultra-high frequency quartz wafer polishing machine and polishing method - Google Patents
Ultra-high frequency quartz wafer polishing machine and polishing method Download PDFInfo
- Publication number
- CN119017227A CN119017227A CN202411180661.7A CN202411180661A CN119017227A CN 119017227 A CN119017227 A CN 119017227A CN 202411180661 A CN202411180661 A CN 202411180661A CN 119017227 A CN119017227 A CN 119017227A
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- rotating column
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- 238000005498 polishing Methods 0.000 title claims abstract description 175
- 239000010453 quartz Substances 0.000 title claims abstract description 66
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 238000001179 sorption measurement Methods 0.000 claims abstract description 18
- 239000007788 liquid Substances 0.000 claims description 66
- 238000005192 partition Methods 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 44
- 230000033001 locomotion Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本发明涉及抛光技术领域，其公开了一种超高频石英晶片抛光机，包括工作台与中间齿轮，工作台的上端开设有工作孔，工作台的内部设置有下抛光机构，工作台的上端设置有上抛光机构，中间齿轮的端面沿圆周方向阵列设置有若干个插孔，中间齿轮的厚度小于石英晶片的厚度，下抛光机构与上抛光机构均包括抛光构件，抛光构件包括与工作孔同轴的旋转柱以及用于驱使旋转柱发生旋转的电机，旋转柱朝向工作孔的一端同轴设置有固定盘，固定盘朝向工作孔的一端同轴设置有吸附盘，吸附盘朝向工作孔的一端同轴可拆卸式安装有抛光盘。
The invention relates to the technical field of polishing, and discloses an ultra-high frequency quartz wafer polishing machine, comprising a workbench and an intermediate gear, wherein a working hole is provided at the upper end of the workbench, a lower polishing mechanism is arranged inside the workbench, an upper polishing mechanism is arranged at the upper end of the workbench, a plurality of jacks are arranged in an array along a circumferential direction on the end face of the intermediate gear, the thickness of the intermediate gear is less than the thickness of the quartz wafer, the lower polishing mechanism and the upper polishing mechanism both comprise polishing components, the polishing components comprise a rotating column coaxial with the working hole and a motor for driving the rotating column to rotate, a fixed disk is coaxially arranged at one end of the rotating column facing the working hole, an adsorption disk is coaxially arranged at one end of the fixed disk facing the working hole, and a polishing disk is coaxially and detachably mounted at one end of the adsorption disk facing the working hole.
Description
Technical Field
The invention relates to the technical field of polishing, in particular to an ultrahigh frequency quartz wafer polishing machine and a polishing method.
Background
With the rapid development of the electronic industry, the demand of quartz wafers as the core of the electronic industry is increasing, when the quartz wafers are produced and manufactured, polishing devices are needed to polish and polish the surfaces of the quartz wafers, so that the flatness of the quartz wafers is improved, the subsequent photoetching process is facilitated, the existing polishing mode is mainly a chemical mechanical polishing method, the chemical corrosion and mechanical polishing of the polishing solution to the surfaces of the quartz wafers are utilized to simultaneously act, the advantages of the chemical polishing and mechanical polishing are combined, the polishing method is generally adopted in the modern semiconductor industry, generally the quartz wafers are fixed on a lower working disc, the polishing solution and the surface of the quartz wafer are contacted to generate corrosion reaction through relative rotation between the upper working plate and the lower working plate, so that the surface of the quartz wafer is corroded and softened, and a large amount of solid abrasive in the polishing solution helps mechanical polishing to remove the corroded surface of the quartz wafer, so that the polishing of the quartz wafer is realized.
Based on the above, the invention provides an ultrahigh frequency quartz wafer polishing machine and a polishing method.
Disclosure of Invention
In order to solve the problems mentioned in the background, the invention provides an ultrahigh frequency quartz wafer polishing machine and a polishing method.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.
The ultra-high frequency quartz wafer polishing machine comprises a workbench and an intermediate gear, wherein a working hole is formed in the upper end of the workbench, a lower polishing mechanism is arranged in the workbench, an upper polishing mechanism is arranged at the upper end of the workbench, a plurality of jacks are formed in the end face of the intermediate gear in an array manner along the circumferential direction, the thickness of the intermediate gear is smaller than that of a quartz wafer, and the lower polishing mechanism and the upper polishing mechanism both comprise polishing members;
The polishing component comprises a rotary column coaxial with the working hole and a motor for driving the rotary column to rotate, a fixed disk is coaxially arranged at one end of the rotary column facing the working hole, an adsorption disk is coaxially arranged at one end of the fixed disk facing the working hole, and the polishing disk is coaxially and detachably arranged at one end of the adsorption disk facing the working hole.
Further, be provided with the baffle in the column spinner, the baffle separates into the upper region and the lower region of each other not intercommunication with the internal region of column spinner, lower region is located the one side of upper region towards the working hole, the column spinner deviates from the one end rotation of working hole and installs rotatory lid, rotatory lid's tip is provided with side joint and core joint, the core hole has been seted up on the baffle, side joint and upper region intercommunication, connect through the core pipe between core joint and the core hole and be connected, the end-to-end connection of side joint has the negative pressure pump, the end-to-end connection of core joint has the water pump.
Further, the end face of the adsorption disc, which deviates from the working hole, is provided with a plurality of air grooves along the circumferential direction array, the groove bottom of each air groove is provided with a plurality of air holes along the groove length direction array, the end face of the fixing disc is provided with a first connecting hole communicated with the air grooves, connection is realized between the first connecting hole and the upper area through an air pipe, and the first connecting hole and the air pipe are correspondingly provided with a plurality of air holes.
Further, the end face of the adsorption disc is provided with a plurality of first liquid holes in an array along the circumferential direction, the first liquid holes are positioned between two adjacent air grooves, positioning protrusions extend towards the orifice of the working hole, the end face of the polishing disc, which faces away from the working hole, is provided with a plurality of first liquid grooves which are correspondingly matched with the positioning protrusions, and the first liquid grooves are correspondingly provided with a plurality of liquid grooves;
A liquid groove II corresponding to the liquid groove I is arranged on the end face of the polishing disk, facing the working hole, and the liquid groove I and the liquid groove II are communicated through the liquid hole II;
the end face of the fixed disk is provided with a second connecting hole communicated with the first liquid hole, and the second connecting hole is connected with the lower area through a liquid pipe.
Further, the rotary column and the motor of the polishing component of the lower polishing mechanism are arranged in the workbench, the polishing disk is positioned in the working hole, the upper end of the rotary column is coaxially extended with a convex shaft, a driving gear is arranged outside the convex shaft, and an inner gear ring coaxial with the working hole is arranged on the upper end face of the workbench.
Further, go up polishing mechanism and be including being the crane that goes up and go up the arrangement and be used for driving the crane to take place the sharp module one of motion, go up polishing mechanism's polishing component's column spinner and motor all install on the crane, install the sleeve on the crane, the column spinner cover is established in the sleeve, sets up the power transmission piece between motor and column spinner and is the belt drive, is provided with the counter weight component between crane and the column spinner.
Further, the counter weight component is including setting up at the outside fixed cover of column spinner and the crossbearer of being connected with the crane is articulated, articulates between crossbearer and the fixed cover and is provided with the connecting rod, has the slide along length direction slidable mounting on the crossbearer, and the slide is driven by sharp module two and takes place the motion, is provided with the counter weight dish on the slide.
Further, the outside of the rotary column is provided with a limiting ring positioned above the fixed sleeve, and the outside of the rotary column is sleeved with a spring positioned between the limiting ring and the fixed sleeve.
Further, the fixed sleeve is sleeved outside the rotary column, a supporting ring for supporting the fixed sleeve is arranged outside the rotary column, and a pressure sensor is arranged between the supporting ring and the fixed sleeve.
A polishing method of an ultrahigh frequency quartz wafer polishing machine comprises the following steps:
step one: inserting a quartz wafer into an insertion hole on an intermediate gear, placing the intermediate gear between the annular gear and the driving gear, and meshing the intermediate gear with the annular gear or the driving gear, wherein the lower end surface of the quartz wafer is contacted with a polishing disk of a lower polishing mechanism;
step two: the linear module is used for driving the lifting frame to move downwards and carrying the polishing member of the upper polishing mechanism to move downwards together so that the polishing disk of the upper polishing mechanism contacts with the upper end surface of the quartz wafer;
step three: the sliding seat is driven to move through the linear module II, and the pressure of the counterweight member applied to the polishing member of the upper polishing mechanism is changed based on the lever principle to reach a set value, wherein the pressure is the polishing pressure applied to the quartz wafer;
Step four: the motor of the lower polishing mechanism is started to drive the rotary column to rotate, so that the driving gear is driven to rotate, the intermediate gear rotates around the self axis and revolves around the convex axis, the intermediate gear can drive the quartz wafers to rotate together, in the rotating process, the upper end face and the lower end face of the quartz wafers respectively rotate relative to the two polishing discs, meanwhile, polishing liquid can sequentially pass through the core joint, the core tube, the lower area, the liquid tube, the liquid hole I, the liquid groove I and the liquid Kong Erliu to enter the liquid groove II and flow outwards to be in contact with the quartz wafers, and the rotating action is matched with the polishing liquid to polish the quartz wafers.
Compared with the prior art, the invention has the beneficial effects that:
the scheme can realize the polishing of the quartz wafer, and in the polishing process:
1. the polishing of the two ends of the quartz wafer can be realized at the same time, and the polishing efficiency is improved;
2. The polishing pressure of the quartz wafer can be realized through the counterweight component, the polishing pressure can be adjusted, and the polishing pressure is monitored by the pressure sensor in real time and displayed on the display screen;
Further, the weight member adjusts the polishing pressure applied to the quartz wafer by changing the position of the slide seat, namely, the polishing pressure can be adjusted in real time according to the polishing progress requirement in the polishing process;
And 3, the polishing disc is detachably mounted on the adsorption disc in a negative pressure adsorption mode, so that as long as the assembly accuracy of parts except the polishing disc is not a problem, the polishing disc is horizontally arranged as a whole, and compared with the common screw bolt fixing mode in the prior art, screw bolt fixing needs to take into consideration that screw bolts cannot be screwed and askew, and otherwise, the levelness of the polishing disc is easily caused to have errors, so that the accuracy of a subsequent polishing structure is affected.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic diagram of an upper polishing mechanism and a lower polishing mechanism;
FIG. 3 is a schematic view of a lower polishing mechanism;
FIG. 4 is a schematic view of an upper polishing mechanism;
FIG. 5 is a schematic view of a weight member;
FIG. 6 is a schematic view of a polishing member;
FIG. 7 is a cross-sectional view of the polishing member;
Figure 8 is an exploded view of the fixed platen, the suction platen, and the polishing platen;
Fig. 9 is an exploded view of a fixed platen, a suction platen, and a polishing platen;
fig. 10 is a schematic view of an intermediate gear.
The reference numerals in the drawings are:
100. A work table; 200. a polishing mechanism; 201. a first linear module; 202. a lifting frame; 203. a weight member; 2031. a fixed sleeve; 2032. a cross frame; 2033. a connecting rod; 2034. a second linear module; 2035. a slide; 2036. a weight plate; 204. a spring; 300. a lower polishing mechanism; 301. a drive gear; 302. an intermediate gear; 3021. a jack; 303. an inner gear ring; 400. a polishing member; 401. a motor; 402. a power transmission member; 403. a spin column; 404. a partition plate; 405. a core tube; 406. a side joint; 407. a core joint; 408. an air pipe; 409. a liquid pipe; 410. a fixed plate; 411. an adsorption plate; 4111. a first liquid hole; 4112. an air tank; 4113. air holes; 412. polishing disk; 4121. a first liquid tank; 4122. a second liquid hole; 4123. and a second liquid tank.
Detailed Description
In order to further describe the technical means and effects adopted by the present invention for achieving the intended purpose, the following detailed description will refer to the specific implementation, structure, characteristics and effects according to the present invention with reference to the accompanying drawings and preferred embodiments.
In the present drawing, a refers to a quartz wafer.
Referring to fig. 1-10, an ultra-high frequency quartz wafer polishing machine comprises a workbench 100, a working hole is formed in the upper end of the workbench 100, a lower polishing mechanism 300 is arranged in the workbench 100, an upper polishing mechanism 200 is arranged at the upper end of the workbench 100, and the upper polishing mechanism and the lower polishing mechanism cooperate to realize polishing treatment on the upper surface and the lower surface of a quartz wafer, and besides, the ultra-high frequency quartz wafer polishing machine also comprises an intermediate gear 302 used for placing the quartz wafer to be polished, further, referring to fig. 10, a plurality of jacks 3021 are arranged on the end face of the intermediate gear 302 in an array along the circumferential direction, the thickness of the intermediate gear 302 is smaller than that of the quartz wafer, and when in use, the quartz wafer is directly inserted into the intermediate gear 302.
Referring to fig. 3 and 4, both the lower polishing mechanism 300 and the upper polishing mechanism 200 include a polishing member 400.
Referring to fig. 6 to 10, the polishing member 400 includes a rotation column 403 coaxial with the working hole and a motor 401 for driving the rotation column 403 to rotate, and further, a power connection is achieved between the motor 401 and the rotation column 403 through a power transmission member 402.
A partition 404 is provided in the spin column 403, and the partition 404 partitions the inner region of the spin column 403 into an upper region and a lower region that are not communicated with each other, the lower region being located on a side of the upper region facing the working hole.
The rotary column 403 is provided with a rotary cover at one end facing away from the working hole, a side joint 406 and a core joint 407 are arranged at the end of the rotary cover, a core hole is arranged on the partition plate 404, wherein the side joint 406 is communicated with the upper area, the core joint 407 is connected with the core hole through a core pipe 405, namely the core joint 407 is communicated with the lower area, in addition, the side joint 406 is connected with a negative pressure pump, and the core joint 407 is connected with a water pump for injecting polishing liquid into the lower area.
The rotary column 403 is provided with the fixed disk 410 towards the coaxial one end of working hole, and the fixed disk 410 is provided with the adsorption disk 411 towards the coaxial one end of working hole, and the coaxial detachable of one end towards working hole of adsorption disk 411 has polishing disk 412, and detachable mode is negative pressure absorption.
Further, referring to fig. 7-9, a plurality of air grooves 4112 are arrayed along the circumferential direction on the end surface of the adsorption disc 411 facing away from the working hole, a plurality of air holes 4113 are arrayed along the groove length direction on the bottom of each air groove 4112, a first connecting hole communicated with the air groove 4112 is formed on the end surface of the fixing disc 410, connection is achieved between the first connecting hole and the upper region through an air pipe 408, a plurality of negative pressure pumps are arranged corresponding to the air pipe 408, the negative pressure pumps are started, air sequentially passes through the air holes 4113, the air grooves 4112, the first connecting hole, the air pipe 408, the upper region and the side joints 406 to be pumped away by the negative pressure pumps, negative pressure is formed at the air holes 4113, adsorption fixing of the polishing disc 412 can be achieved, and when the negative pressure pumps stop running, the adsorption fixing is released.
Further, referring to fig. 7-9, a plurality of first liquid holes 4111 are arrayed on the end surface of the adsorption disc 411 along the circumferential direction, the first liquid holes 4111 are located between two adjacent air grooves 4112, positioning protrusions extend towards the opening of the working hole from the first liquid holes 4111, a plurality of liquid grooves 4121 corresponding to the positioning protrusions are arranged on the end surface of the polishing disc 412, which faces away from the working hole, and a plurality of liquid grooves 4121 corresponding to the first liquid grooves 4121 are arranged; the positioning protrusion cooperates with the first liquid groove 4121 to perform a positioning function, and when the polishing disc 412 is mounted on the adsorption disc 411, the first liquid groove 4121 is communicated with the first liquid hole 4111, and the orifice of the air hole 4113 is attached to the end face of the polishing disc 412 facing away from the working hole.
The polishing disk 412 is provided with a second liquid groove 4123 corresponding to the first liquid groove 4121 on the end face facing the working hole, and the first liquid groove 4121 and the second liquid groove 4123 are communicated through the second liquid hole 4122.
The end face of the fixed disc 410 is provided with a second connecting hole 4111 communicated with the first liquid hole, and the second connecting hole is connected with the lower area through a liquid pipe 409; the water pump is activated and the polishing liquid can flow into the liquid tank two 4123 and outwards through the core joint 407, the core tube 405, the lower region, the liquid tube 409, the liquid hole one 4111, the liquid tank one 4121 and the liquid hole two 4122 in sequence.
Referring to fig. 3, a rotary column 403 and a motor 401 of a polishing member 400 of a lower polishing mechanism 300 are installed in a work table 100, a polishing disk 412 is positioned in a work hole, a protruding shaft coaxially extends from an upper end of the rotary column 403, a driving gear 301 is installed outside the protruding shaft, and an upper end surface of the work table 100 is provided with an inner gear ring 303 coaxial with the work hole; after the quartz wafer is inserted into the intermediate gear 302, the intermediate gear 302 is placed between the ring gear 303 and the driving gear 301, and the intermediate gear 302 is meshed with the ring gear 303 or the driving gear 301, and the step of placing the quartz wafer into the polishing machine is performed.
Referring to fig. 4, the upper polishing mechanism 200 includes a lifting frame 202 in a lifting arrangement and a linear module one 201 for driving the lifting frame 202 to move.
The rotating column 403 and the motor 401 of the polishing member 400 of the upper polishing mechanism 200 are both mounted on the lifting frame 202, wherein a sleeve is mounted on the lifting frame 202, the rotating column 403 is sleeved in the sleeve, the rotating column 403 can rotate and move along the axial line direction, and the movement of the rotating column 403 is for the feeding amount during polishing, so that the movement distance is very small, generally only a few millimeters, and the power transmission member 402 can be made to be a belt transmission technology, namely, the power can be continuously supplied to the rotating column 403 during the movement of the rotating column 403.
A counterweight member 203 is disposed between the lifting frame 202 and the rotating column 403, specifically, referring to fig. 5, the counterweight member 203 includes a fixed sleeve 2031 disposed outside the rotating column 403 and a transverse frame 2032 hinged to the lifting frame 202, a connecting rod 2033 is hinged between the transverse frame 2032 and the fixed sleeve 2031, a hinge shaft at a hinge position of the connecting rod 2033 and the transverse frame 2032, and a hinge shaft at a hinge position of the transverse frame 2032 and the lifting frame 202 are parallel to each other and perpendicular to an axis of the rotating column 403.
A sliding seat 2035 is arranged on the transverse frame 2032 in a sliding manner along the length direction, the sliding seat 2035 is driven to move by a linear module II 2034, and a counterweight disc 2036 is arranged on the sliding seat 2035; the sum of the weight forces of the cross frame 2032 and the components disposed on the cross frame 2032 acts on the fixed housing 2031, i.e., the polishing member 400 of the upper polishing mechanism 200, through the connecting rod 2033, to have a tendency to move downward.
In a preferred embodiment, the outer portion of the spin column 403 is provided with a stop collar located above the fixed sleeve 2031, and the outer portion of the spin column 403 is sleeved with a spring 204 located between the stop collar and the fixed sleeve 2031, and the polishing member 400 is supported by the spring 204 when not in use.
In a preferred embodiment, the support ring is disposed below the fixing sleeve 2031 outside the rotating column 403, the fixing sleeve 2031 is sleeved outside the rotating column 403, and the fixing sleeve 2031 is in contact with the support ring, i.e. the support ring supports the fixing sleeve 2031, so that the force applied to the fixing sleeve 2031 by the weight member 203 acts on the support ring and thus on the polishing member 400, and a pressure sensor is disposed between the support ring and the fixing sleeve 2031, and the force acting on the support ring can be monitored in real time, i.e. the pressure applied to the polishing member 400 can be monitored in real time by the pressure sensor.
It should be noted that the bottom of the rotary column 403 of the polishing member 400 of the upper polishing mechanism 200 is provided with a avoiding groove for avoiding the protruding shaft and the driving gear 301.
A polishing method of an ultrahigh frequency quartz wafer polishing machine comprises the following steps:
Step one: after the quartz wafer is inserted into the insertion hole 3021 on the intermediate gear 302, the intermediate gear 302 is placed between the ring gear 303 and the driving gear 301, and the intermediate gear 302 is meshed with the ring gear 303 or the driving gear 301, and the lower end surface of the quartz wafer is in contact with the polishing disk 412 of the lower polishing mechanism 300;
Step two: the first linear module 201 drives the lifting frame 202 to move downwards, and the polishing member 400 with the upper polishing mechanism 200 moves downwards together, so that the polishing disk 412 of the upper polishing mechanism 200 contacts with the upper end surface of the quartz wafer;
Step three: the sliding seat 2035 is driven to move through the linear module II 2034, and the pressure applied to the polishing member 400 of the upper polishing mechanism 200 by the counterweight member 203 is changed based on the lever principle, wherein the pressure can be monitored by a pressure sensor and displayed on a display screen, and the pressure is the polishing pressure applied to the quartz wafer;
step four: the motor 401 of the lower polishing mechanism 300 is started to drive the rotary column 403 to rotate, so that the driving gear 301 is driven to rotate, the intermediate gear 302 rotates around the axis of the convex shaft while rotating around the axis of the convex shaft, and the intermediate gear 302 rotates together with the quartz wafer.
In this scheme, the straight line module is current electric telescopic link or hydraulic rod or lead screw rectilinear motion technique etc. and is not described in detail.
The present invention is not limited in any way by the above-described preferred embodiments, but is not limited to the above-described preferred embodiments, and any person skilled in the art will appreciate that the present invention can be embodied in the form of a program for carrying out the method of the present invention, while the above disclosure is directed to equivalent embodiments capable of being modified or altered in some ways, it is apparent that any modifications, equivalent variations and alterations made to the above embodiments according to the technical principles of the present invention fall within the scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411180661.7A CN119017227B (en) | 2024-08-27 | 2024-08-27 | Ultra-high frequency quartz wafer polishing machine and polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411180661.7A CN119017227B (en) | 2024-08-27 | 2024-08-27 | Ultra-high frequency quartz wafer polishing machine and polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN119017227A true CN119017227A (en) | 2024-11-26 |
| CN119017227B CN119017227B (en) | 2025-04-15 |
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| CN202411180661.7A Active CN119017227B (en) | 2024-08-27 | 2024-08-27 | Ultra-high frequency quartz wafer polishing machine and polishing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120680411A (en) * | 2025-07-18 | 2025-09-23 | 苏州迪弘铝业有限公司 | Quartz shaft polishing device for semiconductors |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6267646B1 (en) * | 1998-04-10 | 2001-07-31 | Kabushiki Kaisha Toshiba | Polishing machine |
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| CN114619361A (en) * | 2022-01-10 | 2022-06-14 | 贵阳博亚机械制造有限公司 | Efficient polishing device and chemical polishing method |
| CN218546326U (en) * | 2022-09-13 | 2023-02-28 | 四川省三台县固锐实业有限责任公司 | Water-resistant testing device for coated abrasive tool |
| CN219234951U (en) * | 2023-04-06 | 2023-06-23 | 青岛融合智能科技有限公司 | A double-sided polishing machine capable of on-line detection of thickness |
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2024
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| US6267646B1 (en) * | 1998-04-10 | 2001-07-31 | Kabushiki Kaisha Toshiba | Polishing machine |
| CN211053436U (en) * | 2019-10-25 | 2020-07-21 | 南安市国阳磨具科技有限公司 | Polishing disk convenient for injecting polishing solution |
| CN211867434U (en) * | 2019-12-31 | 2020-11-06 | 浙江芯晖装备技术有限公司 | Polishing disk fixing device |
| CN215968113U (en) * | 2021-10-08 | 2022-03-08 | 浙江永耀机械科技有限公司 | Polishing solution feeding disc structure of polishing machine |
| CN114619361A (en) * | 2022-01-10 | 2022-06-14 | 贵阳博亚机械制造有限公司 | Efficient polishing device and chemical polishing method |
| CN218546326U (en) * | 2022-09-13 | 2023-02-28 | 四川省三台县固锐实业有限责任公司 | Water-resistant testing device for coated abrasive tool |
| CN219234951U (en) * | 2023-04-06 | 2023-06-23 | 青岛融合智能科技有限公司 | A double-sided polishing machine capable of on-line detection of thickness |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN120680411A (en) * | 2025-07-18 | 2025-09-23 | 苏州迪弘铝业有限公司 | Quartz shaft polishing device for semiconductors |
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|---|---|
| CN119017227B (en) | 2025-04-15 |
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