CN118974657A - 感光性树脂组合物以及印刷布线板的制造方法 - Google Patents

感光性树脂组合物以及印刷布线板的制造方法 Download PDF

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Publication number
CN118974657A
CN118974657A CN202380031229.9A CN202380031229A CN118974657A CN 118974657 A CN118974657 A CN 118974657A CN 202380031229 A CN202380031229 A CN 202380031229A CN 118974657 A CN118974657 A CN 118974657A
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CN
China
Prior art keywords
photosensitive resin
resin composition
photopolymerization initiator
film
carboxyl group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380031229.9A
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English (en)
Chinese (zh)
Inventor
须藤大作
福田晋一朗
冈本大地
志村优之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Publication of CN118974657A publication Critical patent/CN118974657A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
CN202380031229.9A 2022-03-29 2023-03-28 感光性树脂组合物以及印刷布线板的制造方法 Pending CN118974657A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-054426 2022-03-29
JP2022054426 2022-03-29
PCT/JP2023/012393 WO2023190454A1 (ja) 2022-03-29 2023-03-28 感光性樹脂組成物およびプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN118974657A true CN118974657A (zh) 2024-11-15

Family

ID=88202437

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380031229.9A Pending CN118974657A (zh) 2022-03-29 2023-03-28 感光性树脂组合物以及印刷布线板的制造方法

Country Status (4)

Country Link
JP (1) JPWO2023190454A1 (https=)
KR (1) KR20240155931A (https=)
CN (1) CN118974657A (https=)
WO (1) WO2023190454A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3723036B2 (ja) 2000-03-29 2005-12-07 太陽インキ製造株式会社 活性エネルギー線硬化性樹脂及びこれを用いた光硬化性・熱硬化性樹脂組成物
JP4840865B2 (ja) * 2006-11-07 2011-12-21 太陽ホールディングス株式会社 アルカリ現像可能な感光性樹脂組成物およびそれを用いたプリント配線板
CN103513515A (zh) * 2012-06-29 2014-01-15 太阳油墨（苏州）有限公司 碱显影型感光性树脂组合物、干膜、固化物以及印刷电路板
JP5572737B1 (ja) * 2013-06-04 2014-08-13 太陽インキ製造株式会社 光硬化熱硬化性樹脂組成物、硬化物、及びプリント配線板
JP5882510B2 (ja) * 2014-06-30 2016-03-09 太陽インキ製造株式会社 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法
JP6383621B2 (ja) * 2014-09-24 2018-08-29 太陽インキ製造株式会社 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JP6788372B2 (ja) * 2015-06-05 2020-11-25 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7254511B2 (ja) * 2018-03-28 2023-04-10 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、およびプリント配線板の製造方法
JP7084185B2 (ja) * 2018-03-30 2022-06-14 太陽インキ製造株式会社 硬化性樹脂組成物、そのドライフィルムおよび硬化物、それらを用いたプリント配線板

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Publication number Publication date
JPWO2023190454A1 (https=) 2023-10-05
KR20240155931A (ko) 2024-10-29
WO2023190454A1 (ja) 2023-10-05

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