CN118888473A - Semiconductor wet etching cleaning device and cleaning method - Google Patents

Abstract

The application provides a semiconductor wet etching cleaning device and a cleaning method, and relates to the field of semiconductor wafer processing. A semiconductor wet etch cleaning apparatus comprising: the storage rack is fixedly connected with a supporting leg rack at the outer side of the storage rack, a fixing rack is fixedly connected with the bottom of the supporting leg rack, and a cylinder barrel is fixedly connected to one side of the fixing rack; the inner cavity of the storage rack is provided with a lifting assembly, and immersion liquid assemblies are arranged around the lifting assembly; the inner cavity of the fixing frame is provided with a supply assembly matched with the cylinder barrel, and one side of the supply assembly is provided with a rotating assembly. According to the semiconductor wet etching cleaning device and the cleaning method, during the cleaning of the wafer after wet etching processing, repeated descending immersing and lifting disengaging operation is carried out on the wafer in the cleaning agent, repeated immersing disengaging cleaning is carried out on impurities attached to the surface of the wafer, and meanwhile dynamic cleaning operation is carried out on the impurities on the surface of the wafer.

Description

Semiconductor wet etching cleaning device and cleaning method

Technical Field

The present application relates to the technical field of semiconductor wafer processing, and in particular to a semiconductor wet etching cleaning device and a cleaning method.

Background Art

A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, which are then slowly pulled out to form cylindrical single crystal silicon. After the silicon crystal rod is ground, polished, and sliced, it forms a silicon wafer, or wafer. Domestic wafer production lines are mainly 8-inch and 12-inch. After the wafer is wet-etched, the wafer surface needs to be cleaned.

In the prior art (the announcement number is CN116564866B, and the patent name is a patent application for a semiconductor wet etching cleaning device), the rotating rod is switched from being connected to the inner tooth plate to being connected to the outer tooth plate through a lateral switching component, and the wafer plate is in a rotating state inside the cleaning cylinder. When rotating, the wafer plate can also move horizontally, pushing the cleaning liquid inside the cleaning cylinder to clean and rinse the particles generated by wet etching on the wafer plate. At the same time, while the longitudinal moving component drives it into the cleaning cylinder, the supporting rod can also be rotated to the top of the wafer plate through the lateral switching component, and the wafer plate can be fixed with the receiving roller to prevent the wafer plate from falling off during the cleaning process. In the process of implementing this technical solution, it was found that the prior art at least has the problem of incomplete cleaning.

During the cleaning process of wafers after wet etching, cleaning agents are mostly used to clean the wafer surface in a static immersion manner. However, the stubborn impurities attached to the wafer surface cannot be effectively cleaned and removed, and will still remain on the wafer surface. Since the wafer surface has many precision points, the subsequent processing yield of the wafer is low.

Summary of the invention

The present application aims to at least solve the technical problem in the prior art that the wafer cannot be fully cleaned by combining repeated immersion and dynamic rotation, resulting in stubborn impurities remaining on the wafer surface, leading to a low yield rate of subsequent wafer processing. To this end, the present application proposes a semiconductor wet etching cleaning device and cleaning method.

A semiconductor wet etching cleaning device according to an embodiment of the present application includes: a storage rack, a leg rack is fixedly connected to the outside of the storage rack, a fixing rack is fixedly connected to the bottom of the leg rack, and a cylinder barrel is fixedly connected to one side of the fixing rack;

The inner cavity of the storage rack is provided with a lifting component, and the lifting component is provided with immersion components around it;

The inner cavity of the fixing frame is provided with a supply component used in conjunction with the cylinder barrel, and a rotating component is provided on one side of the supply component.

Preferably, the lifting assembly includes a double-headed motor, an output shaft of the double-headed motor is embedded with an electric push rod, and the piston rod of the electric push rod is fixedly connected to a driving circular gear, a driven circular gear that rotates with the storage rack is provided on the side of the driving circular gear away from the double-headed motor, and a threaded rod is fixedly connected to the top of the driven circular gear, a lifting cylinder is provided on the surface of the threaded rod, and a threaded groove that cooperates with the threaded rod is provided in the inner cavity of the lifting cylinder, and the top of the lifting cylinder passes through the storage rack and is provided with a bracket through a bearing.

Preferably, the immersion assembly includes a connecting frame, which is fixed to the bottom of the bracket, and a small spoiler fan is rotatably connected to the center of the inner side of the connecting frame, an annular protrusion is fixedly connected to the side of the connecting frame close to the small spoiler fan, and a clamping ring is arranged on the inner side of the annular protrusion, annular slide rails rotatably matched with the annular protrusion are provided on both sides of the clamping ring, and a plugging opening is provided on the outer side of the clamping ring, large elastic silicone pads are fixedly connected to the two sides of the clamping ring close to the plugging opening, and small elastic silicone pads are fixedly connected to the two sides of the clamping ring away from the plugging opening.

Preferably, the supply assembly includes a cam, which is fixed on the other output shaft of the double-headed motor, and the side of the cam away from the double-headed motor is slidably connected to a sliding frame, a push rod is fixedly connected to the center of one side of the sliding frame, the other end of the push rod is fixedly connected to a piston that slidably cooperates with the cylinder barrel, and the two air inlets of the cylinder barrel are connected to an air intake pipe, and an air intake valve is provided on the air intake pipe, the exhaust port of the cylinder barrel is connected to an exhaust pipe, and an exhaust valve is provided on the exhaust pipe, the leg frame is fixedly connected to a heater near the bottom of the cylinder barrel, and the exhaust port of the heater is connected to a heat transfer pipe used in conjunction with the exhaust pipe, and the top of the exhaust pipe is connected to a pressure storage tank.

Preferably, the rotating assembly includes a pressurized pipe, which is connected to the top of the pressure storage tank, and the other end of the pressurized pipe is connected to a four-way valve, the three exhaust ports of the four-way valve are connected to branch pipes, and the other end of the branch pipe is connected to a first annular main pipe fixedly matched with the leg frame, the four ends of the bottom of the first annular main pipe are connected to telescopic pipes, and the bottom end of the telescopic pipe is connected to a three-way pipe fixedly matched with the bracket, the two ends of the bottom of the three-way pipe are connected to a first injection head, and both sides of the clamping ring are fixedly connected with rotating blades used in conjunction with the annular convex ring, and the first injection head is located obliquely above the rotating blades.

Preferably, a reserved sliding opening is opened on the top of the storage rack, and the inner cavity of the reserved sliding opening is slidably connected with a limiting sliding strip fixedly matched with the bracket.

Preferably, the clamping ring is distributed in a circular shape along the central axis of the bracket, and the plugging opening adopts a semicircular design, and a clamping gap that cooperates with wafer loading is reserved between the large elastic silicone pad and the small elastic silicone pad.

Preferably, both sides of the fixed frame are provided with sliding grooves, and the inner cavity of the sliding groove is slidably connected with a sliding block fixedly matched with the sliding frame.

Preferably, liquid storage areas are provided around the inner cavity of the storage rack, and a fine filter is embedded at the bottom of the storage rack near the liquid storage area, and drainage pipes for use with the liquid storage area are connected around the bottom of the liquid storage area.

A semiconductor wet etching cleaning method, according to the semiconductor wet etching cleaning device, comprises the following steps:

Step 1: First, pour the wafer-specific cleaning agent into the six groups of liquid storage areas in the storage rack to the predetermined height, respectively, and insert the wafers to be cleaned into the clamping ring from the plugging opening, and use two groups of large elastic silicone pads and small elastic silicone pads to flexibly clamp the inserted wafers in place, first control the electric push rod to start and drive the driving circular gear to move up to the meshing part of the driven circular gear, and then control the double-headed motor to start and drive the driving circular gear in place to drive the driven circular gear to rotate, and the driven circular gear drives the threaded rod to rotate in the opposite direction. With the three groups of reserved sliding openings and limit sliding strips acting as sliding limiters for the lifting cylinder, the threaded rod drives the lifting cylinder to move downward in the storage rack through the threaded groove, and the lifting cylinder drives the bracket to move downward as a whole;

Step 2, the bracket drives the six wafers in the six clamping circles to move down as a whole into the cleaning agent in the six liquid storage areas through the six connecting frames, and makes the six clamping circles leak out one-quarter to one-sixth of the area, so that the first injection head can subsequently inject and rotate the rotating blades. After the six wafers are immersed in the cleaning agent to a predetermined height, the double-headed motor is first controlled to pause, and then the electric push rod is controlled to close and drive the driving circular gear to move down and disengage from the meshing part of the driven circular gear to the initial position, and then the double-headed motor is controlled to continue to open and drive the cam to rotate. At this time, the driving circular gear on the electric push rod is in an idling state, and the slide groove and the slider play a sliding limit role on both sides of the sliding frame. The cam drives the sliding frame to move back and forth horizontally, and the sliding frame drives the piston on the push rod to perform reciprocating work in the cylinder barrel;

Step three, when the piston is in the return suction state in the cylinder barrel, the intake valves on the two groups of intake pipes are controlled to open, and the exhaust valves on the exhaust pipe are controlled to close, so that the outside air enters the cylinder barrel through the two groups of intake pipes. When the piston is in the process exhaust state in the cylinder barrel, on the contrary, before the piston pressurizes the air entering the cylinder barrel and supplies it into the exhaust pipe, the heater is controlled to open in advance and the generated heat source is unidirectionally supplied to the exhaust pipe through the heat transfer pipe. Then, the pressurized heat source formed after the heat source and the pressurized gas merge is unidirectionally supplied to the pressure storage tank through the exhaust pipe for temporary storage. Then, the pressurized heat source in the pressure storage tank is unidirectionally supplied to the three groups of branch pipes through the four-way valve on the pressure pipe, and then supplied to the six groups of telescopic pipes at the bottom of the first annular main pipe that follow the six groups of clamping rings to move downward and stretch, and then the first spray heads on the six groups of three-way pipes that move synchronously downward with the six groups of clamping rings spray to the rotating blade area where the cleaning agent leaks out of the six groups of clamping rings;

Step 4. Under the impact force of the airflow from the pressurized heat source, six groups of annular convex rings and annular slide rails provide rotational support for both sides of the six clamping rings. The impact forces of the six airflows force the six rotating blades to drive the six wafers that are limited in the six clamping rings to rotate in the cleaning agent. With the turbulence of the six small spoiler fans, the cleaning agent flowing in the six liquid storage areas rinses and cleans the surfaces of the six rotating wafers. After the six wafers are cleaned, on the contrary, the lifting cylinder drives the six wafers that are limited in the six clamping rings to separate from the cleaning agent upward through the bracket. This process is repeated more than three times to complete the cleaning of the six wafers. When the cleaning agent in the six liquid storage areas needs to be replaced, the impurities in the cleaning agent are first filtered by the fine filter mesh in the six liquid storage areas. The cleaning agent after filtering out the impurities is then discharged from the drain pipe, which is convenient for subsequent treatment of the cleaning agent.

The beneficial effects of the present application are as follows: during the cleaning of the wafer after wet etching, the double-headed motor first provides a unified driving source, and the electric push rod adjusts the meshing stroke between the driving circular gear and the driven circular gear, and then the lifting and lowering cooperation of the threaded rod, the lifting cylinder and the threaded groove drives the bracket to move accordingly, providing convenience for repeated immersion of the wafer, and then, the large elastic silicone pad and the small elastic silicone pad are first used to flexibly limit the wafer inserted into the clamping ring through the plugging opening, and at the same time, the cleaning agent is disturbed by the small spoiler fan, and then the bracket drives the wafer fixed in place in the clamping ring through the connecting frame to repeatedly descend, immerse and rise and separate in the cleaning agent, and the impurities attached to the surface of the wafer are repeatedly immersed and separated for cleaning, and then, the cam and the sliding frame move back and forth horizontally, and the piston is driven by the push rod to reciprocate and perform work in the cylinder barrel and generate The pressurized gas is then provided with a heat source by the heater and is supplied into the exhaust pipe in one direction through the heat transfer pipe to merge with the pressurized gas to form a pressurized heat source, which is stored in the pressure storage tank for standby use, providing heating and cleaning convenience for the wafers in the immersed and detached states. Finally, with the rotational support of the clamping ring provided by the annular convex ring and the annular slide rail, the pressurized heat source in the pressure storage tank is sequentially sprayed from the pressurized pipe, the four-way valve, the branch pipe, the first annular main pipe, the telescopic pipe and the three-way pipe through the first spray head to the rotating blade area on the clamping ring. Under the impact force of the high-pressure airflow, the rotating blades are forced to drive the wafers in the clamping ring to keep rotating when immersed and detached, and the impurities on the surface of the wafer are dynamically cleaned. The combination of repeated immersion and dynamic rotation is adopted to achieve a full cleaning effect on the wafer, avoid stubborn impurities remaining on the wafer surface, and improve the yield of subsequent wafer processing.

Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

FIG1 is a schematic diagram of a three-dimensional structure of a semiconductor wet etching cleaning device according to an embodiment of the present application;

FIG2 is a front view of a three-dimensional structure of a semiconductor wet etching cleaning device according to an embodiment of the present application;

FIG3 is a three-dimensional internal view of a semiconductor wet etching cleaning device according to an embodiment of the present application;

FIG4 is a front view of the structure of a lifting assembly and an immersion assembly according to an embodiment of the present application;

FIG5 is a bottom view of the lifting assembly structure according to an embodiment of the present application;

FIG6 is a bottom cross-sectional view of a lifting cylinder structure according to an embodiment of the present application;

FIG7 is a front view of the structure of the immersion assembly according to an embodiment of the present application;

FIG8 is a partial exploded view of the structure of an immersion assembly according to an embodiment of the present application;

FIG9 is an exploded view of the structure of a clamping ring, a large elastic silicone pad and a small elastic silicone pad according to an embodiment of the present application;

10 is a bottom cross-sectional view of the structure of the fixing frame, the cylinder barrel, the supply assembly and the rotating assembly according to an embodiment of the present application;

FIG11 is a side cross-sectional view of a fixing frame, a cylinder barrel and a supply assembly structure according to an embodiment of the present application;

FIG12 is a bottom view of the immersion assembly and the rotating assembly structure according to an embodiment of the present application;

FIG13 is a front view of the rotating assembly structure according to an embodiment of the present application;

14 is a partial rear view of the supply assembly and auxiliary assembly structure according to an embodiment of the present application;

15 is a partial front view of the supply assembly and the auxiliary assembly structure according to an embodiment of the present application;

FIG. 16 is an exploded view of the storage rack, fine filter screen and drain pipe structure according to an embodiment of the present application.

Icons: 1. Storage rack; 2. Leg rack; 3. Fixed rack; 4. Cylinder barrel; 5. Lifting assembly; 51. Double-headed motor; 52. Electric push rod; 53. Driving circular gear; 54. Driven circular gear; 55. Threaded rod; 56. Lifting cylinder; 57. Threaded groove; 58. Bracket; 6. Immersion assembly; 61. Connecting rack; 62. Small spoiler fan; 63. Annular convex ring; 64. Clamping ring; 65. Annular slide rail; 66. Plug opening; 67. Large elastic silicone pad; 68. Small elastic silicone pad; 7. Supply assembly; 71. Cam; 72. Sliding rack; 73. Push rod; 74. Piston; 75. Exhaust pipe; 76. Heater; 77. Heat transfer pipe; 78. Pressure storage tank; 8. Rotating assembly; 81. Pressurized pipe; 82. Four-way valve; 83. Branch pipe; 84. First annular main pipe; 85. Telescopic pipe; 86. Three-way pipe; 87. First injection head; 88. Rotating blade; 9. Auxiliary assembly; 91. Three-way joint; 92. First straight pipe; 93. Second annular main pipe; 94. Second injection head; 95. Second straight pipe; 96. Third annular main pipe; 97. Aeration pipe; 98. Aeration rack; 99. Aeration hole; 10. Reserved sliding mouth; 11. Limiting slide bar; 12. Slide groove; 13. Sliding block; 14. Liquid storage area; 15. Fine filter screen; 16. Drain pipe.

DETAILED DESCRIPTION

The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

In order to make the purpose, technical solutions and advantages of the implementation methods of this application clearer, the technical solutions in the implementation methods of this application will be clearly and completely described below in conjunction with the drawings in the implementation methods of this application. Obviously, the described implementation methods are part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

As shown in FIGS. 1 to 16 , a semiconductor wet etching cleaning device according to an embodiment of the present application includes: a storage rack 1, a leg rack 2 is fixedly connected to the outside of the storage rack 1, a fixing rack 3 is fixedly connected to the bottom of the leg rack 2, and a cylinder barrel 4 used in conjunction with one group of the leg racks 2 is fixedly connected to one side of the fixing rack 3;

Liquid storage areas 14 are provided around the inner cavity of the storage rack 1 to facilitate pouring of cleaning agents. At the same time, the cleaning agents are stored in partitions to prevent impurities from accumulating too much in the cleaning agents and reduce the amount of cleaning agents poured. A fine filter 15 is embedded at the bottom of the storage rack 1 near the liquid storage area 14, and drainage pipes 16 used in conjunction with the liquid storage area 14 are connected around the bottom of the liquid storage area 14 to discharge the filtered cleaning agents and facilitate subsequent unified cleaning of impurities left on the fine filter 15. A lifting component 5 is provided in the inner cavity of the storage rack 1, and immersion components 6 used in conjunction with the storage rack 1 are provided around the lifting component 5 to repeatedly lower and immerse the wafers in the cleaning agent and lift them up to remove them, so that impurities attached to the surface of the wafers are repeatedly immersed and removed for cleaning;

The inner cavity of the fixing frame 3 is provided with a supply assembly 7 used in conjunction with the cylinder barrel 4, and a rotating assembly 8 used in conjunction with the immersion assembly 6 is provided on one side of the supply assembly 7 to perform dynamic cleaning operations on impurities on the surface of the wafer.

As shown in FIGS. 4 to 13 , the lifting assembly 5 includes a double-headed motor 51, which is fixed to one side of the top of the fixed frame 3 and provided with a unified driving source by the double-headed motor 51. An output shaft of the double-headed motor 51 is embedded with an electric push rod 52, and the piston rod of the electric push rod 52 is fixedly connected with a driving circular gear 53. A driven circular gear 54 that rotates with the storage frame 1 is arranged on the side of the driving circular gear 53 away from the double-headed motor 51. The electric push rod 52 adjusts the meshing stroke between the driving circular gear 53 and the driven circular gear 54, and a threaded rod 55 is fixedly connected to the top of the driven circular gear 54. A lifting cylinder 56 is arranged on the surface of the threaded rod 55, and a threaded groove 57 that threads with the threaded rod 55 is opened in the inner cavity of the lifting cylinder 56. The top of the lifting cylinder 56 passes through the storage frame 1 and is provided with a bracket 58 through a bearing. The lifting and lowering cooperation of the threaded rod 55, the lifting cylinder 56 and the threaded groove 57 drives the bracket 58 to move accordingly, providing convenience for repeated immersion of the wafer.

A reserved sliding opening 10 is provided at the top of the storage rack 1, and the inner cavity of the reserved sliding opening 10 is slidably connected with a limiting sliding bar 11 fixedly matched with the bracket 58, which plays a role of sliding limit for the lifting and lowering of the bracket 58 to prevent the bracket 58 from shaking and tilting during the lifting and lowering, thereby improving the stability of the bracket 58 during the lifting and lowering.

The immersion assembly 6 includes a connecting frame 61, which is fixed to the bottom of the bracket 58, and a small spoiler fan 62 is rotatably connected to the center of the inner side of the connecting frame 61, and an annular convex ring 63 is fixedly connected to the side of the connecting frame 61 close to the small spoiler fan 62, and a clamping ring 64 is arranged on the inner side of the annular convex ring 63. The small spoiler fan 62 turbules the cleaning agent, and the bracket 58 drives the wafer fixed in the clamping ring 64 to repeatedly descend and immerse in the cleaning agent through the connecting frame 61, and lifts and detaches the wafer attached to the wafer. The impurities on the circular surface are repeatedly immersed and cleaned. Both sides of the clamping ring 64 are provided with annular slide rails 65 that rotate with the annular convex ring 63, and the outer side of the clamping ring 64 is provided with a plugging opening 66. Both sides of the clamping ring 64 close to the plugging opening 66 are fixedly connected with large elastic silicone pads 67, and both sides of the clamping ring 64 away from the plugging opening 66 are fixedly connected with small elastic silicone pads 68. The large elastic silicone pads 67 and the small elastic silicone pads 68 are used to flexibly limit the wafer inserted into the clamping ring 64 through the plugging opening 66.

The clamping ring 64 is distributed in a circular shape along the central axis of the bracket 58, which is convenient for cleaning the six groups of wafers, and the plugging opening 66 adopts a semicircular design, which is convenient for the wafers to be inserted into the clamping ring 64, and a clamping gap is reserved between the large elastic silicone pad 67 and the small elastic silicone pad 68 to cooperate with the wafer loading. While providing a reserved gap for the wafer to be inserted into the clamping ring 64, it is also convenient for the large elastic silicone pad 67 and the small elastic silicone pad 68 to flexibly clamp and position the wafer, so as to prevent the large elastic silicone pad 67 and the small elastic silicone pad 68 from clamping the wafer too tightly and causing damage to its surface components.

The supply assembly 7 includes a cam 71, which is fixed on the other output shaft of the double-headed motor 51, and a sliding frame 72 is slidably connected to the side of the cam 71 away from the double-headed motor 51, and the cam 71 and the sliding frame 72 move back and forth horizontally. A push rod 73 is fixedly connected to the center of one side of the sliding frame 72, and the other end of the push rod 73 is fixedly connected to a piston 74 that slides with the cylinder barrel 4. The push rod 73 drives the piston 74 to reciprocate in the cylinder barrel 4 to do work and generate pressurized gas, and the two air inlets of the cylinder barrel 4 are connected to an air intake pipe, and the air intake pipe is provided with a An air inlet valve is provided, the exhaust port of the cylinder barrel 4 is connected to an exhaust pipe 75, and an exhaust valve is provided on the exhaust pipe 75. A heater 76 is fixedly connected to the bottom of the leg frame 2 near the cylinder barrel 4, and the exhaust port of the heater 76 is connected to a heat transfer pipe 77 used in conjunction with the exhaust pipe 75. The top of the exhaust pipe 75 is connected to a pressure storage tank 78. The heat source provided by the heater 76 is unidirectionally supplied to the exhaust pipe 75 through the heat transfer pipe 77 to merge with the pressurized gas to form a pressurized heat source, which is stored in the pressure storage tank 78 for standby use, providing heating and cleaning convenience for the wafers in the immersed and separated states;

Slide grooves 12 are provided on both sides of the fixed frame 3, and the inner cavity of the slide groove 12 is slidably connected with a slider 13 fixedly matched with the sliding frame 72, which plays a role of sliding limit on both sides of the sliding frame 72 and improves the stability of the sliding frame 72 when moving back and forth.

The rotating assembly 8 includes a pressurizing pipe 81, which is connected to the top of the pressure storage tank 78, and the other end of the pressurizing pipe 81 is connected to a four-way valve 82, and the three exhaust ports of the four-way valve 82 are connected to a branch pipe 83, and the other end of the branch pipe 83 is connected to a first annular main pipe 84 fixedly matched with the leg support 2, and the four ends of the bottom of the first annular main pipe 84 are connected to telescopic pipes 85, and the bottom end of the telescopic pipe 85 is connected to a three-way pipe 86 fixedly matched with the bracket 58, and the two ends of the bottom of the three-way pipe 86 are connected to the first injection head 87, and both sides of the clamping ring 64 are fixedly connected to the annular convex ring 63. The rotating blades 88 and the first injection head 87 are located obliquely above the rotating blades 88. The annular convex ring 63 and the annular slide rail 65 provide rotational support for the clamping ring 64. The pressurized heat source in the pressure storage tank 78 is sequentially injected through the pressurized pipe 81, the four-way valve 82, the branch pipe 83, the first annular main pipe 84, the telescopic pipe 85 and the three-way pipe 86 through the first injection head 87 to the rotating blade 88 area on the clamping ring 64. Under the impact force of the high-pressure airflow, the rotating blades 88 are forced to drive the wafers in the clamping ring 64 to keep rotating when immersed and separated, so as to dynamically clean the impurities on the surface of the wafer.

As shown in FIGS. 14 and 15 , during the cleaning of the wafer after the wet etching process, the cleaning agent and residual fine impurities will adhere to the surface of the wafer, and most of the cleaning agents and residual impurities on the surface need to be manually cleaned and dried again. At the same time, the cleaning agent cannot be aerated, resulting in insufficient contact between the cleaning agent and the wafer, affecting the cleaning effect of the wafer. An auxiliary component 9 is provided on the supply component 7, and the auxiliary component 9 includes a three-way joint 91. Two groups of three-way joints 91 are connected to one end of the pressurized pipe 81 close to the pressure storage tank 78, and the other end of the three-way joint 91 is connected to a first straight pipe 92, and the end of the first straight pipe 92 away from the three-way joint 91 is connected to The leg frame 2 is fixedly matched with the second annular main pipe 93, and the four ends of the inner cavity of the second annular main pipe 93 are connected with the second injection heads 94 used in conjunction with the clamping ring 64, and the second injection heads 94 are axially symmetrically distributed along the horizontal axis of the clamping ring 64 in the initial state. The pressurized heat source in the pressure storage tank 78 is sequentially supplied to the two groups of second annular main pipes 93 through the pressure pipe 81 through the two groups of three-way joints 91 and the first straight pipe 92, and then sprayed to the area of the clamping ring 64 in the state of shedding cleaning agent by the two groups of axially symmetrically distributed second injection heads 94, so as to quickly heat and dry the cleaning agent on the surface of the wafer in the detached state of the clamping ring 64, and also blow off and clean the fine impurities remaining on the surface of the wafer;

One end of the pressure storage tank 78 near one of the groups of leg frames 2 is connected to a second straight pipe 95, and the other end of the second straight pipe 95 is connected to a third annular main pipe 96 fixedly matched with the leg frame 2, and the four ends of the top of the third annular main pipe 96 are all connected to an aeration pipe 97 that penetrates and cooperates with the storage rack 1, and the top of the aeration pipe 97 is connected to an aeration rack 98 used in conjunction with the liquid storage area 14, and an aeration hole 99 is arranged in an array on one side of the aeration rack 98 near the clamping ring 64, and the aeration hole 99 is inclined toward the clamping ring 64. The pressurized heat source in the pressure storage tank 78 is supplied to the third annular main pipe 96 through the second straight pipe 95, and then supplied to the aeration rack 98 through the aeration pipe 97, and finally sprayed to the cleaning agent area in the liquid storage area 14 through the aeration holes 99 inclined toward the clamping ring 64, so as to aerate the cleaning agent around the wafer in the immersed clamping ring 64. On the one hand, the rotation speed of the small spoiler fan 62 is accelerated by the fluidity of the cleaning agent, and on the other hand, the contact between the cleaning agent and the wafer is improved, thereby further enhancing the cleaning effect of the wafer.

A semiconductor wet etching cleaning method, based on a semiconductor wet etching cleaning device, comprises the following steps:

Step 1, first pour the wafer-specific cleaning agent into the six groups of liquid storage areas 14 in the storage rack 1 to a predetermined height, respectively, and insert the wafers to be cleaned into the clamping ring 64 from the plugging opening 66, and flexibly clamp the inserted wafers by two groups of large elastic silicone pads 67 and small elastic silicone pads 68. After they are in place, first control the electric push rod 52 to start and drive the driving circular gear 53 to move up and get stuck in the meshing part of the driven circular gear 54, then control the double-headed motor 51 to start and drive the driving circular gear 53 in place to drive the driven circular gear 54 to rotate, and the driven circular gear 54 drives the threaded rod 55 to rotate in the opposite direction, and the three groups of reserved sliding openings 10 and the limiting sliding strips 11 play the role of sliding limit for the lifting cylinder 56, and the threaded rod 55 drives the lifting cylinder 56 to move downward in the storage rack 1 through the threaded groove 57, and the lifting cylinder 56 drives the bracket 58 to move downward as a whole;

Step 2, the bracket 58 drives the six wafers in the six clamping rings 64 to move down as a whole into the cleaning agent in the six liquid storage areas 14 through the six connecting frames 61, and makes the six clamping rings 64 leak out a quarter to a sixth of the area, so that the first injection head 87 can subsequently inject and rotate the rotating blades 88. After the six wafers are immersed in the cleaning agent to a predetermined height, the double-headed motor 51 is first controlled to pause, and then the electric push rod 52 is controlled to close and drive the driving circular gear 53 to move down and disengage from the meshing portion of the driven circular gear 54 to the initial position, and then the double-headed motor 51 is controlled to continue to open and drive the cam 71 to rotate. At this time, the driving circular gear 53 on the electric push rod 52 is in an idling state, and the slide groove 12 and the slider 13 play a sliding limit role on both sides of the sliding frame 72. Then, the cam 71 drives the sliding frame 72 to move back and forth horizontally, and the sliding frame 72 drives the piston 74 on the push rod 73 to perform reciprocating work in the cylinder barrel 4;

Step 3: When the piston 74 is in the return suction state in the cylinder barrel 4, the intake valves on the two intake pipes are controlled to open, and the exhaust valves on the exhaust pipe 75 are controlled to close, so that the outside air enters the cylinder barrel 4 through the two intake pipes. When the piston 74 is in the process exhaust state in the cylinder barrel 4, on the contrary, before the piston 74 pressurizes the air entering the cylinder barrel 4 and supplies it to the exhaust pipe 75, the heater 76 is controlled to open in advance and the heat source generated is unidirectionally supplied to the exhaust pipe 75 through the heat transfer pipe 77, so that the heat source and the pressurized air are The pressurized heat source formed after the compressed gases merge is supplied to the pressure storage tank 78 through the exhaust pipe 75 for temporary storage. Then, the pressurized heat source in the pressure storage tank 78 is supplied to the three groups of branch pipes 83 through the four-way valve 82 on the pressure pipe 81, and then supplied to the six groups of telescopic pipes 85 at the bottom of the first annular main pipe 84 that follow the six groups of clamping rings 64 to move downward and stretch. Then, the first spray head 87 on the six groups of three-way pipes 86 that follow the six groups of clamping rings 64 to move downward synchronously sprays to the rotating blade 88 area where the cleaning agent leaks out of the six groups of clamping rings 64.

Step 4, under the impact force of the airflow of the boosted heat source, the six groups of annular convex rings 63 and the annular slide rails 65 play a role of rotational support for the two sides of the six groups of clamping rings 64, and the impact force of the six airflows forces the six groups of rotating blades 88 to drive the six wafers that are limited in the six clamping rings 64 to rotate in the cleaning agent. Under the turbulence of the six groups of small spoiler fans 62, the cleaning agent flowing in the six liquid storage areas 14 rinses and cleans the surfaces of the six wafers in a rotating state. After the six wafers are cleaned, on the contrary, the lifting cylinder 56 drives the six wafers that are limited in the six clamping rings 64 to separate from the cleaning agent upward through the bracket 58, and so on, repeating more than three times to complete the cleaning of the six wafers. When the cleaning agent in the six liquid storage areas 14 needs to be replaced, the fine filter 15 in the six liquid storage areas 14 first filters the impurities in the cleaning agent, and the cleaning agent after filtering out the impurities is discharged from the drain pipe 16, which is convenient for the subsequent treatment of the cleaning agent.

Step 5. When the six wafers after immersion are separated from the cleaning agent to the initial loading position each time, the pressurized heat source in the pressure storage tank 78 is supplied to the two groups of three-way joints 91 through the pressure pipe 81 in one direction, and the pressurized heat source in the two groups of three-way joints 91 is supplied to the two groups of second annular main pipes 93 through the two groups of first straight pipes 92, and then the six groups of second injection heads 94 above and below spray the pressurized heat source to the six wafer areas in the six groups of clamping rings 64 at the initial loading position. At this time, the six groups of first injection heads 87 still drive the six wafers in the six groups of clamping rings 64 to blow and rotate through the six groups of rotating blades 88, and the pressurized heat source sprayed by the six groups of second injection heads 94 above and below performs air drying and heating on the six wafers in the rotating six groups of clamping rings 64, forcing the cleaning agent and fine impurities adhering to the six wafers to fall into the six groups of liquid storage areas 14;

Step 6. When the six wafers are immersed in the cleaning agent each time and are in the rotating cleaning position, the pressurized heat source in the pressure storage tank 78 is directly supplied to the third annular main pipe 96 in one direction through the second straight pipe 95. The pressurized heat source supplied to the third annular main pipe 96 is then supplied to the aeration racks 98 located at two corners of the six liquid storage areas 14 in one direction through the six aeration pipes 97. The pressurized heat source supplied to the aeration racks 98 is ejected upward through the six aeration holes 99 in one direction, and the cleaning agent around the six wafers in the six rotating clamping rings 64 is aerated and disturbed. The rotating disturbance speed of the six small disturbance fans 62 in the cleaning agent is accelerated, and the surfaces of the six rotating wafers are further rinsed, forcing the fine impurities attached to the surfaces of the six wafers to fall off.

It should be noted that the specific models and specifications of the double-headed motor 51, the electric push rod 52 and the heater 76 need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

The power supply and principle of the double-headed motor 51, the electric push rod 52 and the heater 76 are clear to those skilled in the art and will not be described in detail here.

The above are only embodiments of the present application and are not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (10)

1. A semiconductor wet etching cleaning device, characterized in that it comprises: a storage rack (1), the outer side of the storage rack (1) is fixedly connected to a leg rack (2), the bottom of the leg rack (2) is fixedly connected to a fixing rack (3), and one side of the fixing rack (3) is fixedly connected to a cylinder barrel (4); The inner cavity of the storage rack (1) is provided with a lifting component (5), and liquid immersion components (6) are provided around the lifting component (5); The inner cavity of the fixing frame (3) is provided with a supply assembly (7) for use with the cylinder barrel (4), and a rotating assembly (8) is provided on one side of the supply assembly (7). 2. A semiconductor wet etching cleaning device according to claim 1, characterized in that the lifting component (5) includes a double-headed motor (51), an output shaft of the double-headed motor (51) is embedded with an electric push rod (52), and the piston rod of the electric push rod (52) is fixedly connected to a driving circular gear (53), and a driven circular gear (54) that rotates with the storage rack (1) is arranged on the side of the driving circular gear (53) away from the double-headed motor (51), and a threaded rod (55) is fixedly connected to the top of the driven circular gear (54), a lifting cylinder (56) is arranged on the surface of the threaded rod (55), and a threaded groove (57) that threads with the threaded rod (55) is opened in the inner cavity of the lifting cylinder (56), and the top of the lifting cylinder (56) passes through the storage rack (1) and is provided with a bracket (58) through a bearing. 3. A semiconductor wet etching cleaning device according to claim 2, characterized in that the immersion component (6) comprises a connecting frame (61), the connecting frame (61) is fixed to the bottom of the bracket (58), and a small spoiler fan (62) is rotatably connected to the center of the inner side of the connecting frame (61), a side of the connecting frame (61) close to the small spoiler fan (62) is fixedly connected to an annular convex ring (63), and a clamping ring (64) is arranged on the inner side of the annular convex ring (63), both sides of the clamping ring (64) are provided with annular slide rails (65) rotatably matched with the annular convex ring (63), and a plugging opening (66) is opened on the outer side of the clamping ring (64), both sides of the clamping ring (64) close to the plugging opening (66) are fixedly connected to large elastic silicone pads (67), and both sides of the clamping ring (64) away from the plugging opening (66) are fixedly connected to small elastic silicone pads (68). 4. A semiconductor wet etching cleaning device according to claim 3, characterized in that the supply assembly (7) comprises a cam (71), the cam (71) is fixed on the other output shaft of the double-headed motor (51), and the side of the cam (71) away from the double-headed motor (51) is slidably connected to a sliding frame (72), a push rod (73) is fixedly connected at the center of one side of the sliding frame (72), and the other end of the push rod (73) is fixedly connected to a movable member that slidably cooperates with the cylinder barrel (4). A plug (74) is provided, and two air inlets of the cylinder barrel (4) are connected to an air inlet pipe, and an air inlet valve is provided on the air inlet pipe; an exhaust port of the cylinder barrel (4) is connected to an exhaust pipe (75), and an exhaust valve is provided on the exhaust pipe (75); a heater (76) is fixedly connected to the bottom of the leg frame (2) near the cylinder barrel (4), and an exhaust port of the heater (76) is connected to a heat transfer pipe (77) used in conjunction with the exhaust pipe (75); and a top end of the exhaust pipe (75) is connected to a pressure storage tank (78). 5. A semiconductor wet etching cleaning device according to claim 4, characterized in that the rotating component (8) comprises a pressurized pipe (81), the pressurized pipe (81) is connected to the top of the pressure storage tank (78), and the other end of the pressurized pipe (81) is connected to a four-way valve (82), three exhaust ports of the four-way valve (82) are connected to branch pipes (83), and the other end of the branch pipe (83) is connected to a first annular main pipe (84) fixedly matched with the support leg frame (2), the four ends of the bottom of the first annular main pipe (84) are all connected to telescopic pipes (85), and the bottom end of the telescopic pipe (85) is connected to a three-way pipe (86) fixedly matched with the bracket (58), the two ends of the bottom of the three-way pipe (86) are all connected to a first injection head (87), and both sides of the clamping ring (64) are fixedly connected to rotating blades (88) used in conjunction with the annular convex ring (63), and the first injection head (87) is located obliquely above the rotating blades (88). 6. A semiconductor wet etching cleaning device according to claim 5, characterized in that a reserved sliding opening (10) is provided on the top of the storage rack (1), and the inner cavity of the reserved sliding opening (10) is slidably connected to a limiting sliding strip (11) fixedly matched with the bracket (58). 7. A semiconductor wet etching cleaning device according to claim 6, characterized in that the clamping ring (64) is distributed in a circular shape along the central axis of the bracket (58), and the plugging opening (66) adopts a semicircular design, and a clamping gap is reserved between the large elastic silicone pad (67) and the small elastic silicone pad (68) to cooperate with wafer loading. 8. A semiconductor wet etching cleaning device according to claim 7, characterized in that both sides of the fixed frame (3) are provided with a slide groove (12), and the inner cavity of the slide groove (12) is slidably connected to a slider (13) fixedly matched with the sliding frame (72). 9. A semiconductor wet etching cleaning device according to claim 8, characterized in that a liquid storage area (14) is provided around the inner cavity of the storage rack (1), and a fine filter (15) is embedded at the bottom of the storage rack (1) near the liquid storage area (14), and a drainage pipe (16) used in conjunction with the liquid storage area (14) is connected around the bottom of the liquid storage area (14). 10. A semiconductor wet etching cleaning method, according to a semiconductor wet etching cleaning device according to claim 9, characterized in that it comprises the following steps: Step 1: First, pour the wafer-specific cleaning agent into the six groups of liquid storage areas (14) in the storage rack (1) to a predetermined height, respectively, insert the wafers to be cleaned into the clamping ring (64) from the plug opening (66), and flexibly clamp the inserted wafers in place with two groups of large elastic silicone pads (67) and small elastic silicone pads (68), first control the electric push rod (52) to open and drive the driving circular gear (53) to move up to the meshing part of the driven circular gear (54), and then control the double-headed motor (51) is opened and drives the driving circular gear (53) in place to drive the driven circular gear (54) to rotate, and the driven circular gear (54) drives the threaded rod (55) to rotate in the opposite direction. The three sets of reserved sliding openings (10) and the limit sliding strips (11) play a sliding limit role on the lifting cylinder (56). The threaded rod (55) drives the lifting cylinder (56) to move downward in the storage rack (1) through the threaded groove (57), and the lifting cylinder (56) drives the bracket (58) to move downward as a whole; Step 2: The support (58) drives the six wafers in the six clamping rings (64) to move downward as a whole into the cleaning agent in the six liquid storage areas (14) through the six connecting frames (61), and makes the six clamping rings (64) leak out a quarter to a sixth of the area, so that the first spray head (87) can subsequently spray and rotate the rotating blade (88). After the six wafers are immersed in the cleaning agent to a predetermined height, the double-headed motor (51) is first controlled to pause, and then the electric push rod (52) is controlled to close and drive the driving circular gear (53) to move downward and disengage from After the meshing portion of the moving circular gear (54) reaches the initial position, the double-headed motor (51) is controlled to continue to turn on and drive the cam (71) to rotate. At this time, the driving circular gear (53) on the electric push rod (52) is in an idling state, and the slide groove (12) and the slider (13) play a sliding limit role on both sides of the sliding frame (72). Then, the cam (71) drives the sliding frame (72) to move back and forth horizontally, and the sliding frame (72) drives the piston (74) on the push rod (73) to perform reciprocating work in the cylinder barrel (4); Step 3: When the piston (74) is in the return suction state in the cylinder barrel (4), the intake valves on the two intake pipes are controlled to open, and the exhaust valves on the exhaust pipe (75) are controlled to close, so that outside air enters the cylinder barrel (4) through the two intake pipes. When the piston (74) is in the process exhaust state in the cylinder barrel (4), on the contrary, before the piston (74) pressurizes the air entering the cylinder barrel (4) and supplies it to the exhaust pipe (75), the heater (76) is controlled to open in advance and the generated heat source is unidirectionally supplied to the exhaust pipe (75) through the heat transfer pipe (77). Then, the heat source and the pressurized air are The pressurized heat source formed after the merging of the two bodies is supplied to the pressure storage tank (78) through the exhaust pipe (75) for temporary storage. Then, the pressurized heat source in the pressure storage tank (78) is supplied to the three groups of branch pipes (83) through the four-way valve (82) on the pressure pipe (81) and then supplied to the six groups of telescopic pipes (85) at the bottom of the first annular main pipe (84) that are stretched by the six groups of clamping rings (64) moving downward. Then, the first spray head (87) on the six groups of three-way pipes (86) that move downward synchronously with the six groups of clamping rings (64) sprays the six groups of clamping rings (64) toward the rotating blade (88) area where the cleaning agent leaks out. Step 4: Under the impact of the airflow from the pressurized heat source, the six groups of annular protrusions (63) and the annular slide rails (65) provide rotation support for the six groups of clamping rings (64) on both sides. The impact of the six airflows forces the six groups of rotating blades (88) to drive the six wafers that are limited in the six clamping rings (64) to rotate in the cleaning agent. Under the coordination of the turbulence of the six groups of small turbulent fans (62), the cleaning agent flowing in the six liquid storage areas (14) rinses and cleans the surfaces of the six wafers in the rotating state. After the cleaning of the six wafers is completed, on the contrary, the lifting cylinder (56) drives the six wafers that have been limited in the six clamping rings (64) to move upward and away from the cleaning agent through the bracket (58), and so on, repeating more than three times to complete the cleaning of the six wafers. When the cleaning agent in the six liquid storage areas (14) needs to be replaced, the fine filter (15) in the six liquid storage areas (14) first filters the impurities in the cleaning agent, and then the cleaning agent after the impurities are filtered out is discharged from the drain pipe (16), which is convenient for the subsequent treatment of the cleaning agent.