CN118866792A - A docking and transfer device for silicon wafer edge removal - Google Patents
A docking and transfer device for silicon wafer edge removal Download PDFInfo
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- CN118866792A CN118866792A CN202411336711.6A CN202411336711A CN118866792A CN 118866792 A CN118866792 A CN 118866792A CN 202411336711 A CN202411336711 A CN 202411336711A CN 118866792 A CN118866792 A CN 118866792A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3408—Docking arrangements
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- H—ELECTRICITY
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0611—Sorting devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
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- H—ELECTRICITY
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- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
本申请提供一种硅片去边用对接移载设备，甩干机构，其配设有可夹持单个不同尺寸硅片的夹持组件，所述夹持组件包括安装板和置于安装板上的多级架和定位柱，在所述多级架上设有用于夹持硅片外边缘的夹持块；移载机构，其配设有相背而置且异向转动的干手指和湿手指，并横跨所述甩干机构悬置，所述湿手指可将湿硅片置放到所述定位柱所围设的空间，并被所述夹持块夹持；所述干手指可将甩干后的干硅片从所述夹持块中取走。本申请一种硅片去边用对接移载设备，可自动收接硅片，并能干湿分类取片，且能多尺寸兼容夹持，结构设计合理，各部件配合精准，置放位置可控，兼容性好，工作效率高且移载速度快。
The present application provides a docking and transfer device for silicon wafer edge removal, a spin-drying mechanism, which is equipped with a clamping assembly that can clamp a single silicon wafer of different sizes, the clamping assembly includes a mounting plate and a multi-stage frame and positioning columns placed on the mounting plate, and a clamping block for clamping the outer edge of the silicon wafer is provided on the multi-stage frame; a transfer mechanism, which is equipped with dry fingers and wet fingers that are placed back to back and rotate in opposite directions, and are suspended across the spin-drying mechanism, the wet fingers can place the wet silicon wafer in the space enclosed by the positioning columns and be clamped by the clamping block; the dry fingers can take the dried silicon wafer away from the clamping block. The present application provides a docking and transfer device for silicon wafer edge removal, which can automatically receive and receive silicon wafers, and can take out wafers by dry or wet classification, and can clamp multiple sizes compatibly, with a reasonable structural design, precise coordination of each component, controllable placement position, good compatibility, high working efficiency and fast transfer speed.
Description
Technical Field
The application belongs to the technical field of semiconductor silicon wafer production equipment, and particularly relates to butt joint transfer equipment for removing edges of silicon wafers.
Background
In the existing silicon wafer corrosion edging machine, in the loading and unloading transfer equipment with the front end in butt joint with a production line, due to unreasonable structural design, the efficiency is low and the wafers are easy to stack during loading, and a wafer basket is required to be manually placed on a workbench, so that the connection of the upper working procedure and the lower working procedure is incoherent. Meanwhile, the spin-drying mechanism can only control single-size silicon wafers and cannot be compatible with the placement of silicon wafers with various sizes, so that when the type of the silicon wafers is changed, the clamping mechanism needs to be replaced again to adapt to the clamping of the silicon wafers with new sizes, and the equipment has poor intelligence.
Disclosure of Invention
The application provides butt joint transfer equipment for removing edges of silicon wafers, which solves the technical problems of poor automation degree and small compatibility in the existing equipment.
In order to solve at least one of the technical problems, the application adopts the following technical scheme:
a butt joint transfer device for removing edges of silicon wafers comprises:
The spin-drying mechanism is provided with a clamping assembly capable of clamping single silicon wafers with different sizes, the clamping assembly comprises a mounting plate, a multi-stage frame and a positioning column, the multi-stage frame and the positioning column are arranged on the mounting plate, and a clamping block for clamping the outer edge of the silicon wafers is arranged on the multi-stage frame;
the transfer mechanism is provided with dry fingers and wet fingers which are opposite to each other and rotate in opposite directions, and the wet fingers cross the spin-drying mechanism to suspend, and can place the wet silicon wafer into a space surrounded by the positioning column and be clamped by the clamping blocks; and the dried silicon wafer after spin-drying can be taken away from the clamping block by the dry fingers.
Further, the mounting plate is configured in a cross-shaped structure, and the multi-stage rack and the positioning column are arranged at the outer extending ends of the multi-stage rack and the positioning column; and the multi-stage frame is pivoted with the mounting plate.
Further, the clamping assembly further includes a support shaft for supporting the mounting plate, which is constructed in a hollow structure and has an elongated hole provided along its length at an axial wall surface thereof; the supporting shaft is driven to rotate, and the clamping block can be driven to rotate through the mounting plate.
Further, the multi-stage frame is constructed in a multi-stage ladder structure, and all ladder tables are arranged towards the center of the supporting shaft; the clamping device is provided with a straight section which is downwards suspended and a stepped section which is gradually lifted and is arranged in an outward inclined mode, and a plurality of clamping grooves matched with the clamping blocks are formed in one side face, close to the supporting shaft, of the stepped section.
Further, the clamping groove is a blind hole groove with a U-shaped structure; the clamping block comprises a tail part and an end part, wherein the tail part is directly inserted into the clamping groove, and the end part is clamped and fixed on the outer edge of the silicon wafer; the end face of the end part is constructed into a curved surface structure with double cambered surfaces connected, the joint part of the end part is a cambered surface groove, and the height of the upper cambered surface is larger than that of the lower cambered surface.
Further, a connecting block connected with the lifting cylinder through a connecting rod is arranged on the inner side of the supporting shaft, a connecting claw connected with the connecting block is arranged on the top of the connecting block, a plurality of connecting rods pivoted with the connecting claw are arranged on the connecting claw, and the connecting rods pass through a strip hole on the supporting shaft to be pivoted with the lower end of the multi-stage frame;
The lifting cylinder drives the connecting block to lift through the connecting rod, so that the connecting claw drives the multi-stage frame to expand outwards or contract inwards through the connecting rod, and the area enclosed by the clamping block is adjusted to loosen or clamp the silicon wafer.
Further, the spin-drying mechanism also comprises a gas-liquid component and a protection component, wherein,
The gas-liquid assembly comprises: the upper spray head is connected with a swinging motor through a pipeline frame, the swinging motor can drive the upper spray head through the pipeline frame, and when the clamping assembly drives the silicon wafer to rotate, the silicon wafer is flushed or blown while swinging; the lower spray head is fixed at a fixed position all the time;
The protection component comprises an outer cylinder and an inner cylinder arranged on the inner side of the outer cylinder, and the inner cylinder is controlled to lift, so that the silicon wafer is enclosed in the protection component when the silicon wafer is spin-dried.
Further, a finished product table is further arranged at the rear side of the spin-drying mechanism, the transfer mechanism comprises a suspension beam which is arranged across the spin-drying mechanism and the finished product table, and a transfer assembly for controlling the movement of the dry finger and the wet finger is further arranged on the suspension beam;
the dry fingers and the wet hands are suspended on the transfer assembly through a fixing frame and are separated through a separation plate arranged on the fixing frame, and the dry fingers and the wet hands are respectively connected with the two sides of the fixing frame through finger motors;
The dry fingers and the wet hands are connected with the finger motor through rotating shafts, and are driven by the rotating shafts to alternately turn over between a horizontal state when working and a vertical state when not working; and the extending direction of the silicon wafer in the horizontal state is consistent with the transmission direction of the silicon wafer, and the silicon wafer is vertically arranged upwards in the vertical state.
Further, a feeding mechanism and a temporary storage mechanism are arranged in sequence before the spin-drying mechanism, wherein,
The spin-drying mechanism is provided with an uploading table for storing the wafer basket and a placing table for placing the silicon wafers, and the silicon wafers placed in the wafer basket are transferred to the placing table one by one through a material taking finger for placing;
The temporary storage mechanism comprises a temporary storage table and a suspension sucker for transferring the silicon wafer, and can absorb and take out the silicon wafer sliced on the placement table and transfer the silicon wafer on the temporary storage table;
the temporary storage table has the same structure as the placement table, and is provided with matching grooves with radius lengths, but the matching grooves in the temporary storage table and the placement table have different orientations.
Further, the feeding mechanism comprises two uploading tables and two placing tables, and the material taking finger is arranged at the center of the surrounding area; the two uploading tables and the two placing tables are opposite to the positions of the material taking fingers;
the uploading platform is arranged on the base through the rotating platform and is driven by a rotating motor arranged on the base; the inner side of the base is also provided with a horizontal motor which can drive the rotary motor to move along the length direction of the base;
The horizontal motor drives the rotating motor to move through the transmission of a roll shaft, and drives the loading platform and the wafer basket carrying the silicon wafers through the rotating platform to move from a loading end far away from the material taking finger to a slicing end near the material taking finger;
At the slicing end, the rotary motor drives the rotary table to drive the loading table and the slice basket to rotate together, and the opening of the slice basket is obliquely arranged towards one side of the material taking finger.
The butt joint transfer equipment for removing the edges of the silicon wafers can automatically receive the silicon wafers, can dry and wet classify and take the silicon wafers, can be compatible and clamped in multiple sizes, has reasonable structural design, accurate matching of all parts, controllable placement position, good compatibility, high working efficiency and high transfer speed.
Drawings
FIG. 1 is a top view of a wafer edge removal docking transfer apparatus according to one embodiment of the present application;
FIG. 2 is a perspective view of a loading mechanism according to an embodiment of the present application;
FIG. 3 is a state diagram of a loading assembly at a loading end according to an embodiment of the present application;
FIG. 4 is a state diagram of a loading assembly at a slice end according to an embodiment of the present application;
FIG. 5 is a cross-sectional view of the motor distribution in the base of an embodiment of the present application;
FIG. 6 is a schematic view of a tape assembly according to an embodiment of the present application;
FIG. 7 is a schematic diagram of a temporary storage mechanism according to an embodiment of the application;
FIG. 8 is a perspective view of a spin-drying mechanism according to an embodiment of the present application;
FIG. 9 is a schematic view of a clamping assembly according to an embodiment of the present application;
FIG. 10 is a schematic view of a multi-stage rack engaging a clamp block according to an embodiment of the present application;
FIG. 11 is a schematic view of a clamping assembly at another angle according to an embodiment of the application;
FIG. 12 is a schematic view of a gas-liquid assembly according to an embodiment of the present application;
FIG. 13 is a schematic view of a shield assembly according to an embodiment of the present application;
FIG. 14 is a schematic view of a transfer mechanism according to an embodiment of the present application;
FIG. 15 is a schematic view of a portion of a transfer mechanism according to an embodiment of the present application;
fig. 16 is a schematic diagram of an airway layout on a dry finger in accordance with an embodiment of the present application.
In the figure:
10. A feeding mechanism; 11. a feeding assembly; 111. a base; 112. an uploading table; 113. a first rotating electric machine; 114. a rotary table; 115. a slice basket frame; 116. a translation motor; 12. a sheet setting assembly; 121. a placement table; 122. adjusting the sliding table; 123. a mating groove; 13. a material taking finger; 20. a temporary storage mechanism; 21. a temporary storage table; 22. suspending the sucker; 30. a spin-drying mechanism; 31. a mounting table; 32. a clamping assembly; 321. a support shaft; 322. a mounting plate; 323. a multi-stage rack; 324. a clamping block; 325. positioning columns; 326. a connecting rod; 327. a connecting claw; 328. a second rotating electric machine; 329. a lifting cylinder; 33. a gas-liquid assembly; 331. an upper nozzle; 332. a lower nozzle; 333. an upper pipeline frame; 334. a pipe fixing frame; 335. a swing motor; 336. an identifier; 337. identifying a disc; 338. a drain pipe; 34. a protective assembly; 341. an outer cylinder; 342. an inner cylinder; 343. a vertical plate frame; 344. a second cylinder; 40. a transfer mechanism; 41. a suspension beam; 42. lifting and shifting the group; 43. a horizontal shift group; 44. a fixing frame; 45. dry finger; 46. wet fingers; 47. a partition plate; 48. a finger motor; 49. a rotating shaft; 410. a connecting piece; 411. a cover plate; 412. an airway; 50. a finished product table; 60. and a pickling mechanism.
Detailed Description
The application will now be described in detail with reference to the drawings and specific examples.
The embodiment provides a butt-joint transfer device for removing edges of silicon wafers, as shown in fig. 1, which comprises a feeding mechanism 10 for taking out the silicon wafers placed in a wafer basket one by one, a temporary storage mechanism 20 for transferring and storing the silicon wafers, a spin-drying mechanism 30 for cleaning the two sides of the silicon wafers and drying the surfaces of the silicon wafers, and a transfer mechanism 40 for taking out wet silicon wafers from the temporary storage mechanism 20, placing the wet silicon wafers on the spin-drying mechanism 30 and taking out dry silicon wafers from the spin-drying mechanism 30, and transferring the dry silicon wafers to a discharging mechanism. Wherein, feed mechanism 10 is set up in the one end of this equipment, and spin-drying mechanism 30 is set up in the other end of this equipment, and temporary storage mechanism 20 is arranged in between feed mechanism 10 and spin-drying mechanism 30, and transfer mechanism 40 is hung at the equipment top and is located temporary storage mechanism 20 and spin-drying mechanism 30. In the whole process, two sets of components are arranged in each mechanism to be matched with each other, so that time is saved, interference is avoided, the two sets of components are matched with each other accurately, silicon wafers can be automatically taken and placed and can be accurately positioned, and the two sets of components can be dry-wet classified and taken, so that the device is suitable for production of multi-size silicon wafers, personnel auxiliary operation is not needed, the utilization rate of connection of each mechanism is high, the compatibility is good, the stability is high, the working efficiency is high, and the transfer speed is high.
As shown in fig. 2, the loading mechanism 10 includes two loading assemblies 11 for placing wafer baskets, two wafer placement assemblies 12 for placing silicon wafers, and a multi-axis rotary take-out finger 13 reciprocating between the loading assemblies 11 and the wafer placement assemblies 12. The two feeding components 11 and the two placing components 12 are arranged around the material taking finger 13 and are arranged towards the center of the material taking finger 13. The take-out fingers 13 are disposed on the center line in the width direction of the entire apparatus, i.e., at a center line position in the wafer transport direction. The two feeding assemblies 11 are positioned outside the material taking fingers 13, namely at the end of the machine platform of the equipment. The sheet placing component 12 is positioned on one side of the material taking finger 13 close to the temporary storage mechanism 20, and is opposite to the circle center of the material taking finger 13, and the material taking finger 13 is positioned in the middle position surrounded by the feeding component 11 and the sheet placing component 12; and the extension lines of the silicon wafer taking and placing angles in the feeding assembly 11 and the wafer placing assembly 12 are intersected and placed at the circle center of the taking finger 13.
As shown in fig. 3 to 4, in the feeding mechanism 10, two uploading tables 112 and two placing tables 121 are provided, the material taking finger 13 is placed at the center of the surrounding area, and the two uploading tables 112 and the two placing tables 121 are opposite to each other relative to the center line of the machine where the material taking finger 13 is located. The rotary table 114 drives the upper stage 112 and the wafer basket carrying the silicon wafers to move from the loading end to the wafer dividing end, and is driven by the first rotary motor 113 arranged at one side of the wafer dividing end, so that the rotary table 114 drives the upper stage 112 and the wafer basket to rotate together, and the opening of the wafer basket is obliquely arranged towards one side of the material taking finger 13.
Further, the two loading assemblies 11 have the same structure, and each loading assembly 11 is provided with a loading platform 112, which is placed on the base 111, and a basket 115 for loading a basket is provided on the loading platform 112. The base 111 is fixed on the machine, the uploading platform 112 is arranged on the base 111 through the rotating platform 114, the base 111 is movably connected with the rotating platform 114, and the uploading platform 112 is fixed on the top of the rotating platform 114. On the base 111, an end far away from the material taking finger 13 is a feeding end, and an end near to the material taking finger 13 is a slicing end.
As shown in fig. 5, the base 111 is disposed along the longitudinal direction of the machine, and a translation motor 116 for driving the rotary table 114 to move along the longitudinal direction of the base 111 is disposed in the middle of the upper end surface thereof, and is configured on the inner side of the base 111, and the rotary motor 113 is disposed vertically on the central axis of the base 111. The translation motor 116 can drive the roller shafts which are horizontally arranged to rotate through the rotating shaft, so as to drive the rotary motor 113 to gradually move from the feeding end to the slicing end or from the slicing end to the feeding end along the length direction of the base 111. Meanwhile, the first rotary motor 113 can drive the rotary table 114 to rotate during the slicing process, so as to control the direction of the opening end of the slice basket 115.
As shown in fig. 3, when the loading platform 112 is located at the loading end of the base 111, the wafer basket 115 is internally provided with a wafer basket carrying silicon wafers, and the open end of the wafer basket is disposed inward, that is, along the center line of the base 111. The translation motor 116 drives the roll shaft to drive the rotation motor 113, the rotary table 114, the loading table 112 and the slice basket 115 to move horizontally toward the slice end until the slice end is reached.
As shown in fig. 4, when the turntable 114 moves to the slicing end, the first rotating motor 113 drives the turntable 114 to rotate, so that the opening end of the basket support 115 placed on the upper stage 112 is offset to the position of the material taking finger 13 by 45 ° and the opening of the basket support 115 placed on the upper stage 112 is inclined to the material taking finger 13. At this time, the open ends of the basket brackets 115 at both sides are obliquely disposed toward the material taking finger 13, so that the material taking finger 13 is convenient for material taking operation. The open end of the slice basket is positioned relative to the material taking finger 13, and is arranged in the forward direction at the material feeding end, and is obliquely arranged at the slice dividing position. The loading table 112 is not only movable but also rotatable, and can drive the wafer basket carrying the silicon wafers to adjust different positions in different directions so as to adapt to different positions.
As shown in fig. 5, each of the placement units 12 is provided with a placement table 121, and two placement tables 121 are oppositely disposed at two sides of the material taking finger 13. A matching groove 123 with a radius length for matching with the material taking finger 13 is arranged on one side of the placing table 121, and the matching groove 123 directly penetrates through the outer wall surface of the placing table 121 from the center of the circle and is a groove with a single side opening, and is mainly matched with the size and the shape of the material taking finger 13. The matching grooves 123 in the two placement tables 121 are obliquely arranged towards one side of the material taking finger 13, and the extension lines of the matching grooves 123 intersect at the circle center of the material taking finger 13.
The material taking finger 13 is a multi-shaft ceramic finger, is of a strip-shaped structure and is provided with a plurality of air holes, and a silicon wafer can be stably placed on the upper end face of the material taking finger through a vacuum adsorption mode. The take-out finger 13 is driven by multi-axis pivoting, can be extended and retracted up and down in the vertical height direction, and can be rotated on any horizontal plane based on a preset angle, precisely takes out the silicon wafer from the wafer basket 115, and rapidly places the silicon wafer on the placing table 121. In order to save the time for rotation and movement of the take-out finger 13, the route is optimized, preferably, the opening ends of the slice basket frame 115 and the opening ends of the matching grooves 123 at the slice end are all inclined to the take-out finger 13, and the inclination angles are 45 degrees, so that the rotation angle and the transfer route of the take-out finger 13 can be reduced to the greatest extent.
Outside the fitting groove 123 and around the center of the placement table 121, vacuum suction holes for sucking the silicon wafer are provided, and the suction holes are spaced apart and uniformly arranged. Meanwhile, an adjusting sliding table 122 for adjusting the position of the placing table 121 is arranged at the periphery of the lower end of the placing table 121, and the adjusting sliding table 122 is mainly used for finely adjusting the transverse and longitudinal positions in the horizontal plane of the placing table 121.
In this process, the empty wafer basket 115 is placed at the loading end of the base 111, and the wafer basket 115 is placed by the robot arm, and then all the wafers are horizontally inserted into the wafer basket, wherein the opening of the wafer basket 115 faces the wafer-separating end. Then, the translation motor 116 drives the roll shaft to drive the rotary motor one 113 to move, so as to drive the rotary table 114, the uploading table 112 and the slice basket frame 115 to horizontally move to the slice end on the base 111; when the rotary table 114 is located at the slicing position, the rotary shaft of the rotary motor 113 is supported to rotate against the rotary table 114, so that the opening side of the slice basket 115 rotates 45 ° towards the side of the center of the circle where the material taking finger 13 is located, and then the slice is placed. The position and angle of the take-out fingers 13 are then adjusted to take out the silicon wafer from the wafer basket 115, wherein the take-out fingers 13 take out the wafer from the upper part of the wafer basket and then take out the wafer from top to bottom along the height of the wafer basket. The material taking finger 13 drives the silicon wafer to rotate and adjusts the position of the silicon wafer so that the height of the silicon wafer is matched with the height of the placing table 121, and then the silicon wafer is placed on the placing table 121, so that the silicon wafer feeding work is completed.
In the feeding mechanism 10, the feeding assembly 11 can automatically adjust the wafer basket containing the silicon wafer to different working postures at different positions, namely, two postures which are positive and inclined relative to the position of the material taking finger 13, namely, a positive posture during feeding and an inclined posture during material taking. Meanwhile, the plurality of groups of uploading tables 112 and placing tables 121 can synchronously or asynchronously work, and the silicon wafer is fetched and placed through the same fetching finger 13, so that the circulation efficiency is high; the butt joint is high in efficiency, safe and reliable without personnel intervention; the transfer path can be shortened, the picking and placing accuracy is high, and the consistency of butt joint and slicing of all silicon wafers is ensured.
The feeding mechanism 10 is followed by a pickling mechanism 60, the pickling mechanism 60 is positioned between the feeding mechanism 10 and the temporary storage mechanism 20, the pickling mechanism 60 is mainly used for pickling the surface layer on the surface of the silicon wafer, the pickling mechanism is provided with two pickling tanks, and the temporary storage mechanism 20 is provided with two temporary storage tables 21. Each pickling tank corresponds to the positions of the placing table 121 and the temporary storage table 21 on the same side and is positioned in the middle; and is reciprocated to and from the three positions by the suspension chuck 22 which spans the placing table 121, the pickling mechanism, and the temporary storage mechanism 20. For the placing table 121, the cleaning tank, and the temporary storage table 21 on the same side, the suspension chuck 22 can transfer the silicon wafer placed on the placing table 121 into the pickling tank, and then transfer the silicon wafer in the pickling tank into the temporary storage table 21 through the suspension chuck 22. The pickling mechanism 60 is not particularly limited, and its structure and drawings are omitted here.
As shown in fig. 7, the temporary storage mechanism 20 includes a temporary storage stage 21 and a suspension chuck 22 placed on a frame and suspended, which can suck and take out the silicon wafer sliced onto the placement stage 121 and transfer the silicon wafer onto the temporary storage stage 21. Wherein, the temporary storage mechanism 20 is provided with two temporary storage tables 21 and two suspension sucking discs 22, the suspension sucking discs 22 on two sides share the same fixed frame beam, and two independent moving components are respectively arranged on two sides of the frame beam to control the moving positions of the suspension sucking discs 22. The moving assembly comprises a transverse sliding group moving along the length direction of the frame beam, namely the silicon wafer transmission direction, and a lifting sliding group moving along the height direction of the frame. Since the positions of the placing table 121, the cleaning bath, and the temporary storage table 21 in the frame length direction are the same, there is no need to adjust the lateral position of the suspension suction cup 22, that is, there is no need to provide a traverse slide group that moves in the frame width direction.
The temporary storage table 21 has the same structure as the placement table 121, and is provided with matching grooves 123 with radius lengths, but the matching grooves 123 are oriented differently. Wherein, the matching groove 123 in the placing table 121 is obliquely arranged towards the position of the material taking finger 13, namely, towards the position of the center line of the machine; the matching groove 123 in the temporary storage table 21 is arranged along the silicon wafer transmission direction, and the opening of the matching groove is arranged towards one side of the spin-drying mechanism 30 in the direction. The suspension chuck 22 is driven by a frame beam provided along the longitudinal direction of the machine to reciprocate between the placing table 121, the cleaning bath, and the temporary storage table 21. The structure of the suspension chuck 22 is a conventional structure, and is not particularly limited herein.
As shown in fig. 8, the spin-drying mechanism 30 is located behind the temporary storage mechanism 20, and is mainly used for washing the chemical solution on the two sides of the silicon wafer and performing air blowing spin-drying on the silicon wafer, where the main purpose of washing is to dilute the acid solution remained on the surface of the silicon wafer, and the washing solution adopts pure water. The spin-drying mechanism 30 comprises a workbench and two clamping assemblies 32 for clamping multiple types of silicon wafers, wherein each clamping assembly 32 is provided with a gas-liquid assembly 33 for flushing and drying the silicon wafers and a protection assembly 34 for preventing gas and liquid from splashing during spin-drying. That is, a set of clamping components 32, a gas-liquid component 33 and a protection component 34 are respectively arranged on two sides of the frame beam and are used for cleaning and spin-drying the silicon wafer on one side.
The two clamping assemblies 32 share a workbench, two mounting hole grooves are formed in the workbench, and the two mounting hole grooves are matched with the clamping assemblies 32 on the two sides respectively; and spin-drying components on two sides of the frame beam work independently and do not interfere with each other. Therefore, the spin-drying assembly on one side will be described in detail.
Specifically, the clamping assembly 32, the gas-liquid assembly 33 and the protection assembly 34 all pass through the mounting hole slot and are fixed on the mounting table 31 together, the mounting table 31 is positioned below the workbench, and the clamping assembly 32 is configured inside the protection assembly 34 and is suspended.
As shown in fig. 9, the clamping unit 32 includes a second rotating electric machine 328 fixed below the mounting table 31, and a timing pulley (omitted from the drawings) connected to an output end of the second rotating electric machine 328. A support shaft 321 coaxially connected to the synchronous pulley is provided on the upper end surface of the mounting table 31, and a mounting plate 322 having a cross structure is fixedly provided on the top of the support shaft 321. A multi-stage frame 323 with a ladder structure and a positioning column 325 for supporting and positioning the position of the silicon wafer are arranged on the four extension ends of the mounting plate 322; the stepped mesas of the multi-stage frame 323 are all arranged towards one side of the center of the supporting shaft 321, and clamping blocks 324 for clamping the outer edge of the silicon wafer are arranged on the stepped mesas of the multi-stage frame 323.
Each type of silicon wafer is provided with four clamping blocks 324 and four positioning columns 325 of the same type, and the clamping blocks and the four positioning columns are equally distributed on the four extension ends of the mounting plate 322; the four clamping blocks 324 can clamp the outer edge of the silicon wafer, and the positioning columns 325 not only can guide the silicon wafer, but also can support the lower end face of the silicon wafer so that the silicon wafer is stably and horizontally placed in the space surrounded by the clamping blocks 324. When the silicon wafer is placed in the space surrounded by the positioning posts 325 of the corresponding model, the silicon wafer is positioned and guided into the space clamped by the corresponding clamping blocks 324 for fixing, after the silicon wafer is clamped and fixed, the output end of the rotating motor II 328 transmits power to the supporting shaft 321 through the synchronous belt wheel, and then the supporting shaft 321 rotates to drive the clamped silicon wafer to rotate.
As shown in fig. 10, the multi-stage shelf 323 is provided with a straight section suspended downwards and a stepped section ascending step by step and inclined outwards, three groups of clamping grooves are arranged on a single side surface in the stepped section from bottom to top along the height direction of the single side surface, the clamping grooves are blind holes with a U-shaped structure and have a depth smaller than the thickness of the multi-stage shelf 323, and the three groups of clamping grooves are arranged in a stepped horizontal manner, and the openings of the three groups of clamping grooves are all arranged towards one side of the center of the silicon wafer. Along the step surface of the multi-stage frame, the opening positions of the three clamping grooves are horizontally and transversely configured, and the three clamping grooves are arranged in a step-type outwards staggered manner, so that the silicon wafers with different specifications and models are adapted; and a mounting hole for fixing the clamping block 324 is arranged in the clamping groove near one side of the opening. The clamping block 324 matched with the clamping groove at the uppermost layer has the largest surrounding size and is used for clamping and fixing the silicon wafer with the maximum size; the clamping block 324 corresponding to the clamping groove at the lowest end can clamp the silicon wafer with the smaller size model, and the clamping block 324 corresponding to the clamping groove at the middle position is mainly used for clamping the silicon wafer with the middle size model. In this embodiment, the multi-stage frame 323 is mainly adapted to three silicon wafers, which are respectively 8 inch, 6 inch and 5 inch structures, and of course, silicon wafers of different sizes and types can be designed, and the multi-stage frame 323 with the structure can be designed and used without specific limitation.
The clamping block 324 is directly fixed on the multi-stage frame 323 through bolts, and the clamping block 324 comprises a tail part and an end part, wherein the tail part is directly inserted into the clamping groove, and the end part is mainly used for clamping the outer edge of the silicon wafer; the thickness of the end portion is adapted to the thickness of the step section in the multi-stage frame 323 and is larger than the groove depth of the clamping groove, and the end portion is clamped and fixed at the end portion of the clamping groove. The end face of the end part is constructed into a curved surface structure with double cambered surfaces connected, and the joint part of the end part is a cambered surface groove, so that the stability and the stability of the clamped silicon wafer are further ensured, and the groove is arranged at the lowest part of the double cambered surfaces connected; meanwhile, in order to improve the clamping strength, the height of the bulge of the upper cambered surface is required to be larger than that of the bulge of the lower cambered surface, so that the silicon wafer can be prevented from shaking or dislocating out of the groove in the rotating process.
As shown in fig. 11, a lift cylinder 329 for driving the clamp block 324 to expand outward or contract inward by fine adjustment is further provided on the lower end surface of the mounting table 31. The support shaft 321 is constructed in a hollow structure, and four elongated holes are provided along its height on its wall surface. A connecting block connected with a lifting cylinder 329 through a connecting rod 326 is arranged on the inner side of the supporting shaft 321, and a connecting claw 327 fixedly connected with the connecting block is arranged on the top of the connecting block. The connecting claw 327 is a square seat, which is directly connected with the connecting block, four connecting grooves are arranged on the periphery of the seat, each connecting groove is provided with a connecting rod 326 connected with the connecting groove through a bolt, one end of each connecting rod 326 is pivoted with the connecting groove, and the other end of each connecting rod 326 passes through a strip hole on the wall surface of the supporting shaft 321 and is directly pivoted with the lower end of the multi-stage frame 323. Thus, the multi-stage rack 323 is pivoted with the connecting claw 327 in a multi-stage manner; and the middle part of the lower section of the multi-stage frame 323 passes through the slot hole on the mounting plate 322 and is pivoted with the mounting plate 322. The lifting cylinder 329 drives the connecting block to lift through the connecting rod 326, so that the connecting claw 327 drives the multi-stage frame 323 to expand outwards or shrink inwards through the connecting rod 326, and the area enclosed by the clamping block 324 is adjusted to loosen or clamp the silicon wafer.
Furthermore, when the silicon wafer is in the space surrounded by the positioning post 325, the position of the clamping block 324 needs to be finely adjusted, so that the silicon wafer and the corresponding clamping block 324 are expanded outwards, the silicon wafer enters the groove of the clamping block 324 after crossing the upper cambered surface of the clamping block 324, and the synchronous contraction space of the clamping block 324 is finely adjusted, so that the outer edge of the silicon wafer is clamped by the groove of the clamping block 324. In the process, the lifting cylinder 329 is required to drive the connecting block to ascend, so that the connecting block drives the connecting rod 326 in the connecting claw 327 to drive the multi-stage frame 323 to expand outwards, the area enclosed by the clamping block 324 is enlarged, and the silicon wafer is convenient to firstly cross the upper end protruding cambered surface position of the clamping block 324. Then the lifting cylinder 329 drives the connecting block to descend, so that the connecting rod 326 in the connecting claw 327 moves downwards and drives the multi-stage frame 323 to move inwards, and the space enclosed by the clamping block 324 is reduced, so that the silicon wafer can be clamped in the groove in the clamping block 324.
The positioning column 325 is arranged beside the multi-stage frame 323 and fixedly arranged on the mounting plate 322; three positioning columns 325 are sequentially arranged beside each multi-stage frame 323 from inside to outside, and the heights of the three positioning columns 325 are sequentially increased from inside to outside so as to match the heights of the clamping blocks 324 with sequentially increased heights to match silicon wafers with different sizes. The height of the positioning posts 325 matched with the same silicon wafer is uniform, and the height of the positioning posts is the same as the height of the grooves in the corresponding clamping blocks 324.
The lower end surfaces of the positioning columns 325 are fixedly arranged on the multi-stage frames 323, and all the positioning columns 325 are arranged at the same position on the same side of each multi-stage frame 323 so as to ensure the stability of the positioning columns on the silicon wafer support. The up end of the positioning column 325 is a guiding column with a round table structure, which is coaxially arranged with the body of the positioning column 325, and the maximum end of the guiding column is directly connected with the body of the positioning column 325, the diameter of the maximum end of the guiding column is half of the maximum diameter of the positioning column 325, and the bus chamfer of the guiding column is not more than 30 degrees, so that a downward sliding inclined plane is provided for the silicon wafer when the silicon wafer is horizontally placed, so that the silicon wafer can be rapidly and accurately clamped by the groove in the clamping block 324, and the silicon wafer can be stably supported by the up end of the body of the positioning column 325 while being clamped, so that the stability of the silicon wafer clamping is ensured.
As shown in fig. 12, the gas-liquid assembly 33 includes an upper nozzle 331 spraying water or air toward the upper end surface of the silicon wafer and a lower nozzle 332 spraying water or air toward the lower end surface of the silicon wafer, wherein the upper nozzle 331 is controlled by an upper pipe frame 333 to be suspended directly above the lower nozzle 332, the upper pipe frame 333 is in an L-shaped structure, an inner pipe is directly communicated with the upper nozzle 331, the lower end of the upper pipe frame is connected with a swing motor 335 through a coupling, and a vertical section of the upper pipe frame 333 is communicated with an external pure water tank and a water cup. The vertical section of the upper pipe frame 333 is connected with a vertically arranged pipe fixing frame 334 through a connecting block, and can be driven by a swing motor 335 to drive the upper spray head 331 to swing, so that the upper spray head 331 is driven to swing back and forth along the radius range from the circle center of the silicon wafer to the diameter end of the silicon wafer in the flushing process or the spin-drying process.
The lower end surface of the pipe fixing frame 334 is fixedly installed on the installation table 31, a side surface of the pipe fixing frame, which is close to the upper pipe frame 333, is provided with a plurality of connecting blocks which are arranged up and down, and the vertical section of the upper pipe frame 333 passes through the through holes on the connecting blocks and can freely rotate. The swing motor 335 is fixed on the pipe fixing frame 334 through a corner frame; an identifier 336 is provided on the upper end surface of the pipe holder 334, and an identification plate 337 adapted to the identifier 336 is provided on the vertical section of the upper pipe holder 333. A notch is provided on the identification plate 337, and the identifier 336 is a sensor for vertically opposite to identify the rotational position of the upper pipe frame 333, and the swing motor 335 drives the identification plate 337 and the upper pipe frame 333 to synchronously rotate and swing, and identifies the swing angle of the upper pipe frame 333 through the identifier 336.
The swing angle of the upper pipe frame 333 driven by the swing motor 335 is preset in advance, and the initial position of the upper pipe frame 333 is that the horizontal section of the upper pipe frame is located right above the pipe fixing frame 334, so that no interference can occur no matter the silicon wafer is placed or removed. After the silicon wafer is placed stably, the upper spray head 331 is controlled to rotate to the position of the circle center, and when water or air is sprayed, the upper spray head 331 is controlled by the swing motor 335 to swing and rotate, so that water spray dilution or air blowing spin-drying is performed.
As shown in fig. 12, when the swing motor 335 drives the upper pipe frame 333 and drives the upper nozzle 331 to swing to the diameter of the silicon wafer, that is, the upper nozzle 331 is located at the center of the silicon wafer, the notch of the identification disc 337 exactly corresponds to the position of the identifier 336, and at this time, the identifier 336 can identify the signal and determine the position of the upper nozzle 331. When the upper pipe frame 333 drives the upper nozzle 331 to swing to other positions, the identification plate 337 will rotate along with the swing of the upper pipe frame 333, so that the notch will not correspond to the identifier 336, the identifier 336 can not identify the signal, and it can be determined that the upper nozzle 331 is not at the center of the circle, and the swing rotation can be known.
The lower spray head 332 is arranged at the center of the mounting plate 322, and is connected with an external pure water tank and an air pump through a pipeline, the pipeline connected with the lower spray head 332 is fixedly arranged on the central axis of the supporting shaft 321, penetrates through the supporting shaft 321, the connecting block and the connecting claw 327, and is fixedly arranged on the mounting plate 322.
The water spraying and the air spraying of the upper spray head 331 or the lower spray head 332 are carried out by sharing the same pipeline, namely, when the upper spray head 331 sprays water or sprays air, the operation is carried out through the pipeline fixed on the upper pipeline frame 333; the lower spray head 332 operates through a pipe connected thereto when spraying water or air. The lower ends of the two pipelines are provided with a three-way pipe which is respectively communicated with an external pure water tank and an air pump. When the water is sprayed for dilution, the end connected with the air pump is closed, and the end connected with the pure water tank is opened, so that the upper spray head 331 and the lower spray head 332 spray water synchronously; when spin-drying, the end communicated with the pure water tank is closed, and the end communicated with the air pump is opened, so that air injection is performed synchronously. The position of the lower nozzle 332 is different no matter the water or air is sprayed, the upper nozzle 331 always performs rotary water or air spraying, and the rotation speed thereof can be preset in advance, which is not particularly limited herein.
As shown in fig. 13, the guard assembly 34 includes an outer cylinder 341 fixed to the mount 31, an inner cylinder 342 movable up and down, a second cylinder 344 for driving the inner cylinder 342 to move up and down, and a stand 343 for fixing the second cylinder 344. The lower end of the vertical plate frame 343 is fixed on the mounting table 31 and is positioned outside the outer cylinder 341, and the upper and lower ends of the second cylinder 344 are respectively fixed on one side of the vertical plate frame 343 away from the inner cylinder 342 through connecting plates. The second cylinder 344 supports the inner cylinder 342 and controls the inner cylinder 342 to move up and down in the height direction thereof. Part of the inner cylinder 342 is overlapped on the inner side of the outer cylinder 341 and is supported by the second cylinder 344, and part of the inner cylinder 342 is arranged at the upper end of the outer cylinder 341 in a protruding manner. In the present embodiment, when the inner cylinder 342 is located at the lowest position, its height is slightly raised at the end of the outer cylinder 341 and below the mounting plate 322. When the inner cylinder 342 is located at the highest position, the inner cylinder 342 is driven by the second cylinder 344 to rise, and the height of the inner cylinder is higher than that of the clamping block 324, so that the silicon wafer clamped by the clamping block 324 is protected. The purpose is when spin-drying the silicon chip, because there is a lot of water liquid on the silicon chip surface, and during spin-drying, the silicon chip rotational speed is very fast, in order to prevent water liquid from splashing, makes inner tube 342 rise and encloses the silicon chip in the inside of inner tube through cylinder two 344, and water liquid can only flow down along the inner wall of inner tube 342 like this. Meanwhile, a drain pipe 338 for draining water is provided at a single side lower end of the outer cylinder 341 to drain all waste water.
As shown in fig. 14, the transfer mechanism 40 is suspended above the spin-drying mechanism 30 and spans the spin-drying mechanism 30 and the finishing station 50 located at the rear side of the spin-drying mechanism 30. The transfer mechanism 40 includes a suspension beam 41 provided to interconnect with the frame beam, and two sets of transfer units and wet and dry fingers provided on both sides of the suspension beam 41. That is, on one side of the hanging beam 41, a dry and wet finger for transferring a silicon wafer and a transfer assembly for controlling the movement of the dry and wet finger are provided, and the two assemblies work independently of each other. And two finished product tables 50 are arranged on two sides of one end of the suspension beam 41, which is far away from the spin-drying mechanism 30, and are respectively used for bearing the spin-dried silicon wafers. The spin-drying assembly on one side will be described in detail below.
A transfer assembly and wet and dry fingers are arranged on any single side of the hanging beam 41, wherein the transfer assembly comprises a horizontal moving group 43 and a lifting moving group 42; the dry and wet fingers include a T-shaped fixing frame 44 connected to the suspension beam 41 through the lifting group 42, and a dry finger 45 and a wet finger 46 connected to the fixing frame 44, the dry finger 45 and the wet finger 46 being disposed on the fixing frame 44 in opposition to each other and rotated in opposite directions with respect to the fixing frame 44.
Wherein the suspension beam 41 is disposed along the length of the machine body and is positioned on the bobbin in the machine body. The vertical section of the fixing frame 44 is connected with the lifting group 42, the transverse section thereof is positioned at the lower end thereof, and a dry finger 45 for transferring dry silicon wafers and a wet finger 46 for transferring wet silicon wafers are arranged on the transverse section thereof. Wherein the dry finger 45 and the wet finger 46 are fixed on both sides of the fixing frame 44 in the width direction in the same direction. Preferably, the dry finger 45 and the wet finger 46 are disposed in the holder 44 near one side of the spin-drying mechanism 30 in the width direction of the machine body. In order to isolate the working environments of the dry fingers 45 and the wet fingers 46, a transparent structure isolation plate 47 is also arranged on the height direction of the fixing frame 44 and is directly connected with the dry fingers 45 and the wet fingers 46, and the isolation plate 47 can isolate the dry fingers 45 and the wet fingers 46 in two operation spaces without mutual influence, so that the safety and purity of the operation when the dry silicon wafers are transferred are ensured.
As shown in fig. 15, the dry finger 45 and the wet finger 46 are controlled by two small and independently operated finger motors 48, respectively, the finger motors 48 are fixed to the lower end of the holder 44, and the output shaft 49 of the finger motors 48 is extended toward the side close to the dry finger 45 perpendicularly to the holder 44. The dry finger 45 and the wet finger 46 are disposed perpendicular to the rotation shaft 49 and are connected to the rotation shaft 49 through a connection member 410. The dry finger 45 and the wet finger 46 are provided on the upper end surface of the connection member 410, i.e., on a side surface away from the connection surface of the connection member 410 and the rotation shaft 49, and the dry finger 45 and the wet finger 46 are fixed to the connection member 410 through the cover 411.
The cross section of one end of the rotating shaft 49 connected with the wet and dry fingers is constructed into a good arch structure, and the surface of the side chord edge is a flat surface. The connecting member 410 is a rectangular flat plate structure, and the end of the lower side surface thereof is provided with an L-shaped groove which is downward and is adapted to the flat surface of the rotating shaft 49. The connector 410 is snapped into place at the flat surface of the shaft 49 by means of a groove, thereby bringing the wet and dry fingers into contact with the flat surface of the shaft 49. The rotating shaft 49 can drive the dry finger 45 or the wet finger 46 to rotate between the horizontal state and the vertical state through the connecting piece 410. Namely, when the dry finger 45 or the wet finger 46 is in a horizontal state, the dry finger 45 or the wet finger 46 is horizontally arranged, the silicon wafer adsorption surface is upwards arranged, at the moment, the connecting piece 410 is horizontally and transversely arranged like the dry finger 45 or the wet finger 46, the opening of the groove on the connecting piece is downwards arranged, and the flat surface of the rotating shaft 49 connected with the groove is horizontally and transversely arranged; when the silicon wafer is not required to be adsorbed, the finger motor 48 drives the rotating shaft 49 to rotate the dry finger 45 or the wet finger 46 to a vertical state.
Wherein, the dry finger 45 and the wet finger 46 are in a horizontal state when working and in a vertical state when not working, and are respectively driven by two independent motors to turn over and adjust; when the whole body moves horizontally, the horizontal movement group 43 controls the whole body to move horizontally along the length direction of the machine body; when the whole body is lifted and lowered vertically, the lifting and lowering movement is controlled by the lifting and lowering movement group 42 to lift and lower along the height direction of the machine body.
As shown in fig. 16, the dry finger 45 and the wet finger 46 have the same structure, and the working principle and the operation process are the same; the layout of the vacuum air channels 412 on the upper end surface of the adsorption silicon wafer is also the same. The dry finger 45 includes a body with an elongated structure, one end of the body is fixed to the connecting member 410 through the cover 411, and the other end of the body is in a circular structure. Two parallel air passages 412 are arranged along the length center line of the body; along the width direction of the body, a plurality of arc-shaped air passages 412 are arranged at the middle section of the body at intervals, and a plurality of round air passages 412 with the same circle center as the round end are arranged on the suspension end of the body, so that the contact surface between the air passages 412 with different structures and the silicon wafer can be increased, and the overall placement stability of the silicon wafer can be further improved; the safety of contact and close contact between the silicon chip and fingers in the transferring process is improved. These airways 412 are internal to the body and are connected to an external air pump via an air connection.
Two finished product tables 50 are arranged on one side of the spin-drying mechanism 30 away from the temporary storage mechanism 20 and are respectively arranged on two sides of the suspension beam 41. A wafer basket for carrying wafers is also provided on each of the product stations 50, and all wafers are placed horizontally into the wafer basket.
Taking a single-sided cleaning spin-dried wafer as an example, in this process, the wafer on the temporary storage table 21 is a wet wafer, and the wafer needs to be taken by a wet finger 46. Wherein, the wet finger 46 and the dry finger 45 are both in a vertical arrangement when not in operation, and the initial position is between the spin-drying mechanism 30 and the product table 50, and the height is at the upper limit position, i.e. above the clamping assembly 32. The horizontal moving group 43 in the transfer mechanism 40 drives the wet finger 46 to move to the temporary storage table 21, and the opening of the matching groove of the temporary storage table 21 corresponds to the angle when the wet finger 46 is horizontally unfolded. When the wet finger 46 reaches the vicinity of the temporary storage table 21, the horizontal movement is stopped; the lifting and lowering group 42 drives the wet finger 46 to descend to the height of the material taking position, and then the finger motor 48 drives the rotating shaft 49 to drive the wet finger 46 to reversely rotate, so that the wet finger 46 rotates from the vertical state to the horizontal state. The horizontal moving group 43 then drives the wet finger 46 which is horizontally unfolded to gradually approach the temporary storage table 21 until the wet finger 46 is inserted into the matching groove on the temporary storage table 21, then the wet finger 46 is slowly controlled to move upwards and cling to the lower bottom surface of the silicon wafer, and then the air passage on the wet finger 46 is controlled to vacuum adsorb the silicon wafer. When the silicon wafer is stably placed on the wet finger 46, the wet finger 46 is driven by the lifting and lowering group 42 to drive the wet finger 46 to rise to a safe height, and then the wet finger 46 is driven by the horizontal moving group 43 to move towards one side of the spin-drying mechanism 30 until the silicon wafer moves to one side of the spin-drying mechanism 30 close to the finished product table 50 to stop. During this process, the dry finger 45 on the right side of the wet finger 46 is always stationary and in the initial state of the vertical arrangement.
Before the wet finger 46 drives the silicon wafer to be transferred to the spin-drying mechanism 30, the position of the upper spray head 331 needs to be adjusted, the upper pipe frame 333 is driven by the swing motor 335 to rotate 90 degrees, the upper pipe frame moves to the same side as the position of the pipe fixing frame 334, and the transverse section of the upper pipe frame 333 is positioned right above the pipe fixing frame 334, so that enough space is reserved in the position of the clamping assembly 32 to place the silicon wafer. Simultaneously, the second cylinder 344 drives the inner cylinder 342 to move down to its lower limit position.
When the wet finger 46 moves to the position right above the spin-drying mechanism 30 with the wet silicon wafer, the lifting and moving group 42 controls the wet finger 46 to move downwards, so that the silicon wafer is horizontally erected into the space surrounded by four positioning columns 325 matched with the silicon wafer, and the silicon wafer is horizontally placed on top of the positioning columns 325. The lifting cylinder 329 drives the clamping blocks 324 to expand outwards through the connecting claws 327 and the multi-stage frame 323, so that the outer edge of the silicon wafer firstly spans the upper end cambered surface of the matched clamping blocks 324, then the clamping blocks 324 are controlled to shrink inwards, the silicon wafer is completely clamped by the grooves in the clamping blocks 324, and the feeding clamping work of the wet silicon wafer is completed.
Then the upper spray head 331 is controlled to rotate to the working position, namely, to be positioned right above the circle center of the silicon wafer, and is driven by the second rotating motor 328, and the clamping block 324 is driven by the supporting shaft 321 to clamp the silicon wafer for rotation. Then, the upper spray head 331 and the lower spray head 332 are synchronously controlled to spray water to flush the upper surface and the lower surface of the silicon wafer respectively, the lower spray head 332 is controlled to flush the silicon wafer fixedly, and the swing motor 335 is controlled to drive the upper pipeline frame 333 so as to control the upper spray head 331 to swing and flush, namely, the upper spray head 331 is controlled to swing and rotate in a reciprocating manner from the circle center of the silicon wafer to the diameter side of the silicon wafer, and the upper surface of the silicon wafer is continuously flushed until the flushing is finished. In the flushing process, the three-way pipe is directly connected with an external pure water source, and a valve connected with the air pump is closed; after the flushing is finished, the valve of the air pump is opened in the three-way pipe, and then the valve connected with the pure water source is closed, and the pure water source flows unidirectionally. In addition, in order to improve the effect of diluting the pickling solution on the surface of the silicon wafer during the rinsing, the swinging speed of the upper spray head 331 is relatively small during the rinsing, and the rotating speed of the silicon wafer is relatively slow, so that the contact residence time of pure water on the surfaces of two sides of the silicon wafer is increased, and the diluting effect is improved.
After the washing is finished, the silicon wafer needs to be dried by blowing air, so that the surfaces of the two sides of the silicon wafer are quickly dried, and the rotating speed of the silicon wafer and the swinging speed of the upper spray head 331 are both higher because the silicon wafer needs to be quickly dried in the process. Since the water is thrown out from the surfaces of the two sides of the silicon wafer during spin-drying, the water is easy to splash everywhere, at this time, the inner cylinder 342 needs to be lifted to the highest position, so that the silicon wafer is surrounded by the inner cylinder until the spin-drying is finished. In the process, the silicon wafer is driven to rotate by the second rotating motor 328; accordingly, the lower shower head 332 and the upper shower head 331 blow air toward both side surfaces of the silicon wafer; meanwhile, the lower spray head 332 is fixed, the upper spray head 331 positioned above is still controlled by the swing motor 335, and the silicon wafer is subjected to reciprocating swing rotation from the circle center of the silicon wafer to the diameter side of the silicon wafer, so that the upper surface of the silicon wafer is continuously blown until the spin-drying is finished.
After the silicon wafer is dried, the inner cylinder 342 is controlled to move downwards to the lowest position, and the upper spray head 331 is controlled to rotate to the initial position, namely, the position side of the pipeline fixing frame 334. Then the horizontal moving group 43 in the transfer mechanism 40 is controlled to drive the right dry finger 45 to move to one side of the spin-drying mechanism 30 close to the position of the temporary storage mechanism 20, and the dry finger 45 is controlled to move downwards to the descending position through the lifting moving group 42; and then the dry finger 45 is controlled to turn from the vertical state to the horizontal state by the finger motor 48, and the finger is horizontally directed to one side of the silicon wafer. Then the horizontal moving group 43 and the lifting moving group 42 control the dry finger 45 to gradually approach the silicon wafer and tightly support the lower bottom surface of the silicon wafer, and then control the lifting air cylinder 329 to adjust the clamping block 324 to expand outwards so as to loosen the silicon wafer and make the silicon wafer be stably placed on the upper end surface of the dry finger 45.
And then, the dry fingers 45 are cooperatively controlled to drive the dry silicon wafers to be transferred to the finished product table 50 through the cooperation of the lifting and moving group 42 and the horizontal moving group 43, and drive the silicon wafers to be inserted into the empty wafer baskets on the finished product table 50.
The above steps are repeated until the wafer basket on the product table 50 is filled with dry wafers.
The butt joint transfer equipment for removing the edges of the silicon wafers can automatically receive the silicon wafers, can dry and wet classify and take the silicon wafers, can be compatible and clamped in multiple sizes, is reasonable in structural design, accurate in matching of all parts, controllable in placement position, good in compatibility, high in working efficiency and high in transfer speed.
All the mechanisms provided by the application are provided with two processing components which work independently, all the processing components are operated relatively and independently, single-line work can be realized, double-line parallel processing can be performed as required, and the working efficiency and the utilization rate are high.
The foregoing detailed description of the embodiments of the application has been presented only to illustrate the preferred embodiments of the application and should not be taken as limiting the scope of the application. All equivalent changes and modifications within the scope of the present application are intended to be covered by the present application.
Claims (10)
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| CN119650468A (en) * | 2024-12-04 | 2025-03-18 | 西安奕斯伟材料科技股份有限公司 | Silicon wafer edge etching equipment and silicon wafer edge etching method |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000294616A (en) * | 1999-04-06 | 2000-10-20 | Ebara Corp | Alignment mechanism with temporary loading table and polishing device |
| US20010023082A1 (en) * | 2000-03-17 | 2001-09-20 | Krishna Vepa | Grind and single wafer etch process to remove metallic contamination in silicon wafers |
| KR100824776B1 (en) * | 2007-03-19 | 2008-04-24 | (주) 대진유압기계 | Semiconductor Wafer Printing Equipment |
| CN103021809A (en) * | 2012-12-03 | 2013-04-03 | 天津中环领先材料技术有限公司 | Drop type method for removing silicon dioxide on edge of silicon wafer |
| CN204760360U (en) * | 2015-06-30 | 2015-11-11 | 天津中环半导体股份有限公司 | Automatic trimming machine silicon chip device of keeping in |
| CN105609463A (en) * | 2016-01-25 | 2016-05-25 | 中国电子科技集团公司第二十四研究所 | Integrated cleaning fixture capable of automatically fixing silicon wafer during rotation |
| CN209190607U (en) * | 2018-12-26 | 2019-08-02 | 沈阳芯达科技有限公司 | A kind of more wafer size rotation clamping devices |
| CN214705872U (en) * | 2021-02-01 | 2021-11-12 | 中环领先半导体材料有限公司 | Novel temporary storage table of silicon wafer edge removing machine |
| CN114334789A (en) * | 2022-03-14 | 2022-04-12 | 宁波润华全芯微电子设备有限公司 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
| CN218414487U (en) * | 2022-08-05 | 2023-01-31 | 天津环博科技有限责任公司 | Silicon chip monolithic washs mechanism that spin-dries |
| KR20230146205A (en) * | 2022-04-12 | 2023-10-19 | 사이언테크 코포레이션 | Wafer stage |
| CN221632513U (en) * | 2023-08-21 | 2024-08-30 | 争丰半导体科技(苏州)有限公司 | Full-automatic wafer trimmer |
-
2024
- 2024-09-25 CN CN202411336711.6A patent/CN118866792B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000294616A (en) * | 1999-04-06 | 2000-10-20 | Ebara Corp | Alignment mechanism with temporary loading table and polishing device |
| US20010023082A1 (en) * | 2000-03-17 | 2001-09-20 | Krishna Vepa | Grind and single wafer etch process to remove metallic contamination in silicon wafers |
| KR100824776B1 (en) * | 2007-03-19 | 2008-04-24 | (주) 대진유압기계 | Semiconductor Wafer Printing Equipment |
| CN103021809A (en) * | 2012-12-03 | 2013-04-03 | 天津中环领先材料技术有限公司 | Drop type method for removing silicon dioxide on edge of silicon wafer |
| CN204760360U (en) * | 2015-06-30 | 2015-11-11 | 天津中环半导体股份有限公司 | Automatic trimming machine silicon chip device of keeping in |
| CN105609463A (en) * | 2016-01-25 | 2016-05-25 | 中国电子科技集团公司第二十四研究所 | Integrated cleaning fixture capable of automatically fixing silicon wafer during rotation |
| CN209190607U (en) * | 2018-12-26 | 2019-08-02 | 沈阳芯达科技有限公司 | A kind of more wafer size rotation clamping devices |
| CN214705872U (en) * | 2021-02-01 | 2021-11-12 | 中环领先半导体材料有限公司 | Novel temporary storage table of silicon wafer edge removing machine |
| CN114334789A (en) * | 2022-03-14 | 2022-04-12 | 宁波润华全芯微电子设备有限公司 | Fixing chuck, photoresist removing platform, photoresist removing cavity and photoresist removing machine |
| KR20230146205A (en) * | 2022-04-12 | 2023-10-19 | 사이언테크 코포레이션 | Wafer stage |
| CN218414487U (en) * | 2022-08-05 | 2023-01-31 | 天津环博科技有限责任公司 | Silicon chip monolithic washs mechanism that spin-dries |
| CN221632513U (en) * | 2023-08-21 | 2024-08-30 | 争丰半导体科技(苏州)有限公司 | Full-automatic wafer trimmer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN119650468A (en) * | 2024-12-04 | 2025-03-18 | 西安奕斯伟材料科技股份有限公司 | Silicon wafer edge etching equipment and silicon wafer edge etching method |
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