CN118866767A - Silicon wafer sorting equipment and control system thereof - Google Patents

Silicon wafer sorting equipment and control system thereof Download PDF

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Publication number
CN118866767A
CN118866767A CN202411014751.9A CN202411014751A CN118866767A CN 118866767 A CN118866767 A CN 118866767A CN 202411014751 A CN202411014751 A CN 202411014751A CN 118866767 A CN118866767 A CN 118866767A
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CN
China
Prior art keywords
assembly
box
paper
silicon wafer
module
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Granted
Application number
CN202411014751.9A
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Chinese (zh)
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CN118866767B (en
Inventor
陈春芙
苏金财
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Changzhou Kelongwei Intelligent Technology Co ltd
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Changzhou Kelongwei Intelligent Technology Co ltd
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Priority to CN202411014751.9A priority Critical patent/CN118866767B/en
Publication of CN118866767A publication Critical patent/CN118866767A/en
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Publication of CN118866767B publication Critical patent/CN118866767B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G35/00—Mechanical conveyors not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G57/00—Stacking of articles
    • B65G57/005—Stacking of articles by using insertions or spacers between the stacked layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • B65G65/30—Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
    • B65G65/32—Filling devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了一种硅片分选设备及其控制系统,小车组件上方设置有固定在机架组件上的支撑条，支撑条上安装有对称设置在同步带组件两侧的料盒，行走臂底部连接有与料盒对应的吸盘组件，同步带组件的输入端通过转盘机构与输送组件连接，同步带组件输入端侧面设置有上纸料盒组件，上纸料盒组件中提供隔离纸用于分离料盒中的硅片。本发明双导轨同步带组件输送硅片，以及双行走臂结构去送硅片装盒，极大地提升硅片装盒效率，同时新增的上纸料盒组件在每片硅片表面放置隔离纸，避免料盒中硅片粘连，通过小车组件实现满料盒与空料盒的回收，实现与整个设备形成流片、装盒、满料盒移载、空料盒回流的连续化生产。

The present invention discloses a silicon wafer sorting device and its control system. A support bar fixed on a frame assembly is arranged above the trolley assembly. The support bar is equipped with material boxes symmetrically arranged on both sides of the synchronous belt assembly. A suction cup assembly corresponding to the material box is connected to the bottom of the walking arm. The input end of the synchronous belt assembly is connected to the conveying assembly through a turntable mechanism. An upper paper material box assembly is arranged on the side of the input end of the synchronous belt assembly. The upper paper material box assembly provides isolation paper for separating silicon wafers in the material box. The double-guide rail synchronous belt assembly of the present invention conveys silicon wafers, and the double walking arm structure is used to deliver silicon wafers for boxing, which greatly improves the efficiency of silicon wafer boxing. At the same time, the newly added upper paper material box assembly places isolation paper on the surface of each silicon wafer to avoid adhesion of silicon wafers in the material box. The full and empty material boxes are recycled through the trolley assembly, realizing continuous production of wafer flow, boxing, full material box transfer, and empty material box reflow with the entire equipment.

Description

Silicon wafer sorting equipment and control system thereof
Technical Field
The invention relates to the technical field of silicon chip sorting, in particular to silicon chip sorting equipment and a control system thereof.
Background
Silicon wafers are widely used as important industrial raw materials in the production and manufacture of solar cells, circuit boards and other products. Therefore, the quality of the silicon wafer needs to be strictly controlled before the silicon wafer is produced and delivered, so as to ensure the quality of products such as solar cells, circuit boards and the like manufactured by the silicon wafer.
The traditional silicon wafer sorting machine can only finish single-column conveying generally, automatic continuous operation is not formed between conveying and detecting links, production efficiency is low, in the prior art, an automatic alternating double-rail silicon wafer sorting and feeding machine is provided in Chinese patent literature with publication number CN115565922A, two parallel single-rail conveyor belts are adopted on an operation table, one ends of the two single-rail conveyor belts are respectively provided with a group of main feeding frames and auxiliary feeding frames with opposite positions, flower baskets for loading silicon wafers are respectively arranged in the main feeding frames and the auxiliary feeding frames, and a turnover assembly for driving the two groups of main feeding frames and the auxiliary feeding frames to independently rotate is further arranged on the operation table. However, in the actual production process, compared with the inserting piece type silicon wafer material box, the stacking type silicon wafer material box has higher efficiency, the efficiency is influenced by the need of positioning in the inserting piece type silicon wafer material box process, and the material box after the box is packaged is recovered in a troublesome manner, so that continuous production of flowing pieces, box packaging, full material box transferring and empty material box backflow can not be formed with the whole equipment.
Disclosure of Invention
According to the technical problem to be solved, the silicon wafer sorting equipment and the control system thereof are provided, the silicon wafers subjected to solar simulation test are automatically fed according to grades, all mechanical movement structures of the whole machine are driven by a motor or an electric cylinder controlled by a PLC and a circuit system, and all actions are orderly and stable, accurate and rapid, simple and easy to operate, safe and stable.
In order to achieve the above purpose, the invention discloses silicon wafer sorting equipment which comprises two synchronous belt assemblies arranged in a frame assembly in parallel, wherein traveling arms and trolley assemblies are respectively arranged on the upper side and the lower side of the synchronous belt assemblies, supporting bars fixed on the frame assembly are arranged above the trolley assemblies, material boxes symmetrically arranged on the two sides of the synchronous belt assemblies are arranged on the supporting bars, the bottoms of the traveling arms are connected with sucking disc assemblies corresponding to the material boxes, the input end of the synchronous belt assemblies is connected with a conveying assembly through a turntable mechanism, the side surface of the input end of the synchronous belt assemblies is provided with a paper feeding material box assembly, isolation paper is provided in the paper feeding material box assembly for separating silicon wafers in the material boxes, a paper taking module assembly arranged on the frame assembly is correspondingly arranged above the paper feeding material box assembly, and a material box transfer machine is arranged at the tail end of the synchronous belt assembly.
Further, the input end of conveying assembly is provided with rotating assembly, and conveying assembly comprises the double guide rail that sets up side by side and all is used for carrying the silicon chip, and single double guide rail comprises at least three group's long guide rail respectively, and every group long guide rail is driven by independent step motor, and conveying assembly center is provided with the splint support of installing on rack assembly, and the photoelectric assembly is installed to splint support top correspondence double guide rail, and splint support below is provided with the splint fixed column that is located long guide rail both sides.
Still further, go up paper magazine subassembly and constitute by three at least group's magazine jacking subassembly, the magazine jacking subassembly includes the drawer type blowing magazine that the subassembly set up on the hold-in range and sets up the elevating platform at drawer type blowing magazine top, two sets of paper outlets have been seted up at drawer type blowing magazine top, the elevating platform is including installing the bottom plate on drawer type blowing magazine, the position that the bottom plate corresponds the paper outlet is provided with the carton, go up the carton and cup joint on the gag lever post of perpendicular to bottom plate, go up the carton all around and all be provided with the blend stop subassembly, blend stop subassembly surface is provided with the wear-resisting sticky tape, go up the blowing mouth towards last carton center is installed respectively to the carton corner position, the magazine jacking subassembly bottom is provided with servo motor driven electric jar.
Still further, go up paper feed box subassembly and set up three groups at least, every group goes up paper feed box subassembly top and all corresponds to be provided with gets paper module subassembly, gets paper module subassembly and just sets up the paper module of getting in last paper feed box subassembly top including perpendicular to hold-in range subassembly, gets paper module side swing joint and has the paper module of getting that corresponds the paper box setting, gets paper module and includes two connecting plates of being connected with the cylinder output, installs four vacuum organ suction nozzles on every connecting plate, and the gas blowing pipe buffer bracket is installed to vacuum organ suction nozzle side.
Furthermore, guide wheels are arranged on the side face and the top of the belt of the synchronous belt assembly, and a clamping block structure for placing silicon wafers is arranged on the surface of the belt of the synchronous belt assembly.
Still further, the dolly subassembly is including being located the X axle module that synchronous belt assembly syntropy set up of frame subassembly bottom, X axle module side-mounting has X axle tow chain, X axle module top is provided with the Y axle module with X axle module vertically, Y axle tow chain and Y axle guide rail are installed respectively to Y axle module both sides, Y axle module side is connected with X axle tow chain expansion end, Z axle module is installed at Y axle module top, Z axle module top install with X axle module parallel arrangement's conveying bottom plate, the magazine has been placed on the conveying bottom plate.
Still further, the walking arm includes the material module of getting that sets up perpendicularly with the hold-in range subassembly, and two sets of hold-in ranges are vertically installed to get in the material module, are provided with the slide rail subassembly between the belt of hold-in range and are connected with first walking arm subassembly, second walking arm subassembly respectively, and first walking arm subassembly and second walking arm subassembly top are connected with the expansion end that sets up two parallel drag chains at getting material module top respectively through the drag chain fixed plate, and the slide rail subassembly bottom is installed through belt clamp plate and hold-in range cooperation, and the slide rail subassembly side is connected with the sucking disc subassembly through the fixed plate.
The invention also discloses a control system of the silicon wafer sorting equipment, which comprises the following steps:
S1, carrying out sheet flowing by a conveying assembly, adsorbing a silicon wafer by a rotating assembly to finish reversing action, triggering double-guide-rail movement and a board-requiring signal of the conveying assembly, resetting the board-requiring signal after the double-guide-rail movement is finished, and finishing sheet flowing;
s2, detecting the position of the silicon wafer by a photoelectric assembly at the supporting position of the clamping plate, triggering the clamping plate fixing column to center the silicon wafer in an open state, and conveying the silicon wafer forwards by the double guide rails and moving the silicon wafer onto the synchronous belt assembly through the turntable mechanism;
S3, a sensor at a sucker at the bottom of the walking arm simultaneously detects whether a silicon wafer and a material box on the synchronous belt assembly are in place or not, the walking arm is triggered to adsorb the silicon wafer after the requirement is met, the silicon wafer is moved to the position above a designated material box, the sucker breaks vacuum, the material box is counted, if the material box is full, the material box is marked, and the walking arm is triggered to reset;
S4, after the trolley component detects the full-box marking signal, the full-box is moved to the appointed full-box coordinate position through the X-axis module and the Y-axis module, the Z-axis module is lifted, the full-box is taken down after the full-box is in place, the full-box is moved to the waiting position and is emptied, the X-axis module and the Y-axis module of the trolley component are triggered to move to the butt joint position of the box transfer machine after the action is completed, the full-box is fed into the box transfer machine by the conveying bottom plate, and the empty-box is returned to the conveying bottom plate after the silicon wafer in the full-box is taken.
Compared with the prior art, the invention has the beneficial effects that: the invention discloses silicon wafer sorting equipment and a control system thereof, wherein a double-guide-rail synchronous belt assembly is used for conveying silicon wafers, a double-walking-arm structure is used for conveying the silicon wafers to be boxed, so that silicon wafer boxing efficiency is greatly improved, meanwhile, a newly added upper paper magazine assembly is used for placing isolation paper on the surface of each silicon wafer, silicon wafer adhesion in a magazine is avoided, recovery of a full magazine and an empty magazine is realized through a trolley assembly, and continuous production of wafer flowing, boxing, full magazine transferring and empty magazine backflow with the whole equipment is realized.
Drawings
The invention will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic view of the overall structure of the frame assembly of the present invention.
Fig. 2 is a schematic view of a conveyor assembly according to the present invention.
Fig. 3 is a schematic view of the splint support according to the present invention.
Fig. 4 is a schematic diagram of a timing belt assembly of the present invention.
Fig. 5 is a schematic view of the installation positions of the paper feeding box assembly and the paper taking module assembly according to the present invention.
Fig. 6 is a schematic view of the upper paper magazine assembly of the present invention.
Fig. 7 is a schematic view of a paper fetching assembly according to the present invention.
Fig. 8 is a schematic view of a walking arm of the present invention.
Fig. 9 is a schematic view of a cart assembly of the present invention.
Fig. 10 is a schematic view of a cartridge of the present invention.
FIG. 11 is a flow chart of a control system of the present invention.
Fig. 12 is a flow chart of the streaming sheet operation of the present invention.
Fig. 13 is a flowchart of the splinting operation of the present invention.
Fig. 14 is a flow chart of the traveling arm operation of the present invention.
Fig. 15 is a flowchart of the operation of the cart according to the present invention.
In the figure: 1 is a conveying component; 11 is a rotating assembly; 12 is a double guide rail; 13 is a splint support; 131 is a splint fixing column; 14 is an optoelectronic component; 2 is a turntable mechanism; 3 is a synchronous belt assembly; 31 is a guide wheel; 32 is a clamping block structure; 4 is an upper paper box component; 41 is a drawer type paper discharging material box; 42 is a bottom plate; 43 is an upper paper box; 44 is a stop bar; 45 is a barrier strip assembly; 46 is an air tap; 47 is an electric cylinder; 5 is a paper taking module component; 51 is a paper taking module; 52 is a paper take-out assembly; 521 is a cylinder; 522 is a connecting plate; 523 is a vacuum organ nozzle; 524 is a cushion bracket of the air blowing pipe; 6 is a walking arm; 61 is a material taking module; 62 is a synchronous belt; 63 is a slide rail assembly; 64 is a first walking arm assembly; a second walking arm assembly 65; 66 is a drag chain; 67 is a suction cup assembly; 7 is a trolley component; 71 is an X-axis module; 72 is an X-axis drag chain; 73 is a Y-axis module; 74 is a Y-axis drag chain; 75 is a Z-axis module; 76 is a transfer floor; 8 is a supporting bar; 9 is a material box; 91 is a cartridge body; 92 is an inner liner.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In one embodiment of the application, as shown in fig. 1 and 11, a supporting bar 8 fixed on a frame component is arranged above a trolley component 7, a material box 9 symmetrically arranged at two sides of a synchronous belt component 3 is arranged on the supporting bar 8, the bottom of a traveling arm 6 is connected with a sucker component 67 corresponding to the material box 9, the input end of the synchronous belt component 3 is connected with a conveying component 1 through a turntable mechanism 2, the turntable mechanism 2 sucks and conveys silicon wafers on a double guide rail 12 of the conveying component 1 onto a clamping block structure 32 of the synchronous belt component 3 in a rotating way, the efficiency is improved, an upper paper material box component 4 is arranged at the side surface of the input end of the synchronous belt component 3, isolation paper is provided in the upper paper material box component 4 for separating the silicon wafers in the material box 9, a material box taking module 5 arranged above the upper paper material box component 4 correspondingly, a material box machine is arranged at the tail end of the synchronous belt component 3, as a preferred embodiment of the application, the traveling arm 6 is provided with 20 groups, three material box 9 are respectively arranged at two sides of the synchronous belt component 3, the equipment can simultaneously lift the box 120, the material box is fully loaded with the silicon wafers in the box, and the material box is fully loaded in the empty box, and the material box is fully loaded on the surface of the silicon wafer box, and the material box is fully loaded on the empty, and the material box is fully loaded on the surface of the silicon wafer box is continuously, and the material box is fully loaded and unloaded.
As shown in fig. 2, the input end of the conveying component 1 is provided with a rotating component 11, the conveying component 1 is composed of double guide rails 12 which are arranged in parallel and is used for conveying silicon wafers, a single double guide rail 12 is respectively composed of at least three groups of long guide rails, each group of long guide rails is driven by a separate stepping motor, a clamping plate support 13 which is arranged on the rack component is arranged at the center of the conveying component 1, a photoelectric component 14 is arranged at the top of the clamping plate support 13 corresponding to the double guide rails 12, as shown in fig. 12, in the wafer flowing process, whether the silicon wafers exist between the upstream side and the conveying component 1 is judged by a control system, the uniqueness of the current silicon wafer ID is judged by a sucker of the rotating component, the silicon wafers are placed on the double guide rails 12 after being shifted, meanwhile, the belt pulley of the conveying component 1 is triggered to move and a plate signal is required, the silicon wafers are continuously conveyed to the conveying component by the upstream side, the belt shaft is reset after the movement is completed, the plate signal is required to complete the wafer flowing action is completed, as shown in fig. 3, clamping plate fixing columns 131 which are arranged at the bottom of the clamping plate fixing columns 131 which are arranged at two sides of the long guide rails, damage caused in the positioning process is avoided, as shown in fig. 12, the positioning process is judged, if the position of the silicon wafers are not to be centered by the clamping plate fixing columns 131 is manually, and the position is not triggered by the two sides of the fixing columns which are manually.
As shown in fig. 5 and 6, the upper paper box assembly 4 is composed of at least three groups of box jacking assemblies, the box jacking assemblies comprise drawer type paper box 41 which is perpendicular to the synchronous belt assembly 3 and lifting platforms which are arranged at the tops of the drawer type paper box 41, two groups of paper outlet openings are formed in the tops of the drawer type paper box 41, the lifting platforms comprise a bottom plate 42 which is arranged on the drawer type paper box 41, the positions of the bottom plate 42 corresponding to the paper outlet openings are provided with an upper paper box 43, the two groups of paper outlet openings correspond to the two groups of upper paper boxes 43, two silicon wafers on the synchronous belt assembly 3 can be simultaneously subjected to paper isolation placing operation, the upper paper box 43 is sleeved on a limiting rod 44 which is perpendicularly fixed on the bottom plate 42, barrier strip assemblies 45 are arranged around the upper paper box 43, wear-resistant adhesive tapes are arranged on the surfaces of the barrier strip assemblies 45, air blowing nozzles 46 which face the centers of the upper paper box 43 are respectively arranged at corner positions, the bottom of the box jacking assemblies are prevented from being adhered together, servo motor driven electric cylinders 47 are arranged at the bottoms of the box jacking assemblies, the side face of each box jacking assembly is provided with a light sensing structure, and the light sensing structure is used for detecting whether the light sensing paper is detected at the side of a specific light sensing paper, and the side is detected, and the light sensing paper is detected at the side, and the light sensing structure is detected when the light sensing to be detected, and the light sensing to be detected at the side, and the light sensing position is detected.
As shown in fig. 1 and 7, at least three groups of upper paper box assemblies 4 are arranged, the top of each group of upper paper box assemblies 4 is correspondingly provided with a paper taking module assembly 5, each paper taking module assembly 5 comprises a paper taking module 51 which is perpendicular to the synchronous belt assembly 3 and is arranged above the upper paper box assemblies 4, a synchronous belt and a sliding rail on the inner side of the synchronous belt are arranged in the paper taking module assembly 51, a sliding block meshed with the inner side belt teeth of the synchronous belt is arranged on the sliding rail, the movement of the paper taking module in the horizontal direction is realized through rotation of the synchronous belt, the side surface of the paper taking module 51 is movably connected with a paper taking module 52 which is arranged corresponding to the upper paper box 43, the paper taking module 5 comprises two connecting plates 522 which are connected with the output end of a cylinder 521, four vacuum organ suction nozzles 523 are arranged on each connecting plate 522, and a gas blowing pipe buffer bracket 524 is arranged on the side surface of the vacuum organ suction nozzles 523 to adsorb and place isolation paper in the upper paper box 43 on the surface of a silicon wafer corresponding to the synchronous belt assembly 3, so that the silicon wafer in the material box 9 in subsequent operation is ensured not to be adhered together.
As shown in fig. 4, guide wheels 31 are mounted on the side and top of the belt of the synchronous belt assembly 3, the belt of the synchronous belt assembly 3 is clamped, vertical jumping and left-right deviation are prevented, a clamping block structure 32 for placing silicon wafers is arranged on the surface of the belt of the synchronous belt assembly 3, and the silicon wafers and isolation paper are limited in the clamping block structure.
As shown in fig. 8, the walking arm 6 includes a material taking module 61 vertically arranged with the synchronous belt assembly 3, two groups of synchronous belts 62 are vertically installed in the material taking module 61, a sliding rail assembly 63 is arranged between belts of the synchronous belts 62 and is respectively connected with a first walking arm assembly 64 and a second walking arm assembly 65, tops of the first walking arm assembly 64 and the second walking arm assembly 65 are respectively connected with movable ends of two parallel drag chains 66 arranged at the top of the material taking module 61 through drag chain fixing plates, bottoms of the sliding rail assembly 63 are cooperatively installed with the synchronous belts 62 through belt pressing plates, sides of the sliding rail assembly 63 are connected with a sucking disc assembly 67 through fixing plates, the sucking disc assembly 67 adopts a non-contact bernoulli sucking disc structure, the sides of the sucking disc assembly 67 are further provided with a box sensor for detecting the position of the material box, the two groups of the walking arms are respectively boxing the material boxes 9 at two sides of the synchronous belt assembly 3, and the lifting efficiency is improved, as shown in fig. 14, a control system judges whether silicon wafers are stored on the synchronous belt assemblies 3 corresponding to the walking arms and whether the walking arms are in accordance with the current grade, if the conditions are satisfied and the number of the silicon wafers are not in the state of the same with the number of the silicon wafers, the silicon wafers are not in the state of the silicon wafers, the silicon wafers are completely matched with the silicon wafers, and the silicon wafers are continuously moved to the silicon wafer box-loading system to the silicon wafer loading level, if the silicon wafer loading boxes are completely and the silicon wafer loading boxes are continuously moved to the silicon wafer boxes, and the silicon boxes and the silicon wafer loading boxes are continuously, and the silicon boxes are continuously.
As shown in fig. 9, the trolley assembly 7 comprises an X-axis module 71 which is arranged at the bottom of the frame assembly and is in the same direction as the synchronous belt assembly 3, an X-axis drag chain 72 is arranged on the side surface of the X-axis module 71, a Y-axis module 73 which is perpendicular to the X-axis module 71 is arranged at the top of the X-axis module 71, a Y-axis drag chain 74 and a Y-axis guide rail are respectively arranged on two sides of the Y-axis module 73, the side surface of the Y-axis module 73 is connected with the movable end of the X-axis drag chain 72, a Z-axis module 75 is arranged at the top of the Y-axis module 73, a conveying bottom plate 76 which is arranged in parallel with the X-axis module 71 is arranged at the top of the Z-axis module 75, a material box 9 is placed on the conveying bottom plate 76, a baffle is arranged on the left side of the conveying bottom plate 76, a material box waiting position is used for full material box, as shown in fig. 15, when a material box at the upper supporting bar 8 position is marked by the material box, a control system recognizes the signal, the trolley moves to a designated position through the XY module, the Z-axis module lifts, a material box chip is triggered to descend after the material box data is written into the Z-axis module, the material box falls down, the material box is dropped onto the conveying bottom plate, the material box is made to move to the empty position, the material box is transferred to the empty position by the empty carrier, and the material box is transferred to the empty position by the empty carrier silicon wafer carrier.
As shown in fig. 10, the cartridge 9 includes a cartridge body 91 and an inner liner 92 disposed in the cartridge body 91, so as to prevent the silicon wafer from being damaged during the packaging, and fool-proof marks are disposed on the inner liner 92 and the cartridge body 91.
The points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed; second, relational terms such as first and second, and the like may be used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.
The above examples are merely illustrative of the present invention and are not meant to limit the scope of the present invention, and all designs that are the same or similar to the present invention are within the scope of the present invention.

Claims (8)

1. The utility model provides a silicon chip sorting equipment, includes two hold-in range subassemblies (3) that set up side by side in the frame subassembly, and both sides are provided with walking arm (6) and dolly subassembly (7) respectively about hold-in range subassembly (3), its characterized in that, dolly subassembly (7) top is provided with support bar (8) of fixing on the frame subassembly, installs on support bar (8) symmetry setting up magazine (9) in hold-in range subassembly (3) both sides, and walking arm (6) bottom is connected with sucking disc subassembly (67) that correspond with magazine (9), and the input of hold-in range subassembly (3) is connected with conveying assembly (1) through carousel mechanism (2), and hold-in range subassembly (3) input side is provided with paper magazine subassembly (4), provides the spacer paper in the paper magazine subassembly (4) and is arranged in separating the silicon chip in magazine (9), and paper magazine subassembly (4) top is provided with the paper module subassembly (5) of getting of installing on the frame subassembly correspondingly, and hold-in range subassembly (3) end is provided with the magazine transfer machine.
2. A silicon wafer sorting device according to claim 1, characterized in that the input end of the conveying component (1) is provided with a rotating component (11), the conveying component (1) consists of parallel double guide rails (12) which are all used for conveying silicon wafers, a single double guide rail (12) consists of at least three groups of long guide rails respectively, each group of long guide rails is driven by a separate stepping motor, the center of the conveying component (1) is provided with a clamping plate support (13) arranged on the frame component, the top of the clamping plate support (13) is provided with a photoelectric component (14) corresponding to the double guide rails (12), and clamping plate fixing columns (131) positioned on two sides of the long guide rails are arranged below the clamping plate support (13).
3. The silicon wafer sorting equipment according to claim 1, wherein the upper paper box assembly (4) is composed of at least three groups of box jacking assemblies, each box jacking assembly comprises a drawer type paper discharging box (41) which is perpendicular to the synchronous belt assembly (3) and a lifting table which is arranged at the top of the drawer type paper discharging box (41), two groups of paper outlets are formed in the top of the drawer type paper discharging box (41), each lifting table comprises a bottom plate (42) which is arranged on the drawer type paper discharging box (41), an upper paper box (43) is arranged at the position, corresponding to the paper outlet, of the bottom plate (42), each upper paper box (43) is sleeved on a limiting rod (44) which is perpendicularly fixed to the bottom plate (42), barrier strip assemblies (45) are arranged around the upper paper box (43), wear-resistant adhesive tapes are arranged on the surfaces of the barrier strip assemblies (45), air blowing nozzles (46) which face the center of the upper paper boxes (43) are respectively arranged at corner positions, and servo motor driven electric cylinders (47) are arranged at the bottoms of the box jacking assemblies.
4. A silicon wafer sorting device according to claim 3, characterized in that the upper paper box assemblies (4) are at least provided with three groups, the top of each group of upper paper box assemblies (4) is correspondingly provided with a paper taking module assembly (5), the paper taking module assembly (5) comprises a paper taking module (51) which is perpendicular to the synchronous belt assembly and is arranged above the upper paper box assemblies (4), the side face of the paper taking module (51) is movably connected with a paper taking module (52) which is arranged corresponding to the upper paper box (43), the paper taking module (52) comprises two connecting plates (522) which are connected with the output end of the air cylinder (521), each connecting plate (522) is provided with four vacuum organ suction nozzles (523), and the side face of each vacuum organ suction nozzle (523) is provided with an air blowing pipe buffering bracket (524).
5. A silicon wafer sorting apparatus according to claim 1, characterized in that the belt side and top of the timing belt assembly (3) is provided with guide wheels (31), and the belt surface of the timing belt assembly (3) is provided with a clamping block structure (32) for placing silicon wafers.
6. The silicon wafer sorting equipment according to claim 1, wherein the trolley assembly (7) comprises an X-axis module (71) which is arranged at the bottom of the frame assembly and is arranged in the same direction as the synchronous belt assembly (3), an X-axis drag chain (72) is arranged on the side face of the X-axis module (71), a Y-axis module (73) which is perpendicular to the X-axis module (71) is arranged at the top of the X-axis module (71), a Y-axis drag chain (74) and a Y-axis guide rail are respectively arranged at two sides of the Y-axis module (73), the side face of the Y-axis module (73) is connected with the movable end of the X-axis drag chain (72), a Z-axis module (75) is arranged at the top of the Y-axis module (73), a conveying bottom plate (76) which is arranged in parallel to the X-axis module (71) is arranged at the top of the Z-axis module (75), and a material box (9) is arranged on the conveying bottom plate (76).
7. The silicon wafer sorting equipment according to claim 1, characterized in that the travelling arm (6) comprises a material taking module (61) which is perpendicular to the synchronous belt assembly (3), two groups of synchronous belts (62) are vertically arranged in the material taking module (61), a sliding rail assembly (63) is arranged between belts of the synchronous belts (62) and is respectively connected with the first travelling arm assembly (64) and the second travelling arm assembly (65), tops of the first travelling arm assembly (64) and the second travelling arm assembly (65) are respectively connected with movable ends of two parallel drag chains (66) arranged at the top of the material taking module (61) through drag chain fixing plates, bottoms of the sliding rail assemblies (63) are matched and installed with the synchronous belts (62) through belt pressing plates, and side surfaces of the sliding rail assemblies (63) are connected with the sucker assemblies (67) through fixing plates.
8. The control system of the silicon wafer sorting equipment is characterized by comprising the following steps:
S1, carrying out sheet flowing by a conveying assembly, adsorbing a silicon wafer by a rotating assembly to finish reversing action, triggering double-guide-rail movement and a board-requiring signal of the conveying assembly, resetting the board-requiring signal after the double-guide-rail movement is finished, and finishing sheet flowing;
s2, detecting the position of the silicon wafer by a photoelectric assembly at the supporting position of the clamping plate, triggering the clamping plate fixing column to center the silicon wafer in an open state, and conveying the silicon wafer forwards by the double guide rails and moving the silicon wafer onto the synchronous belt assembly through the turntable mechanism;
S3, a sensor at a sucker at the bottom of the walking arm simultaneously detects whether a silicon wafer and a material box on the synchronous belt assembly are in place or not, the walking arm is triggered to adsorb the silicon wafer after the requirement is met, the silicon wafer is moved to the position above a designated material box, the sucker breaks vacuum, the material box is counted, if the material box is full, the material box is marked, and the walking arm is triggered to reset;
S4, after the trolley component detects the full-box marking signal, the full-box is moved to the appointed full-box coordinate position through the X-axis module and the Y-axis module, the Z-axis module is lifted, the full-box is taken down after the full-box is in place, the full-box is moved to the waiting position and is emptied, the X-axis module and the Y-axis module of the trolley component are triggered to move to the butt joint position of the box transfer machine after the action is completed, the full-box is fed into the box transfer machine by the conveying bottom plate, and the empty-box is returned to the conveying bottom plate after the silicon wafer in the full-box is taken.
CN202411014751.9A 2024-07-26 2024-07-26 Silicon wafer sorting equipment and control system thereof Active CN118866767B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119796897A (en) * 2025-01-10 2025-04-11 苏州黑田智能科技有限公司 A flexible conveying device for battery cells

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Publication number Priority date Publication date Assignee Title
CN114843217A (en) * 2022-05-09 2022-08-02 常州科隆威智能技术有限公司 A separate paper board separator for silicon chip is selected separately
WO2023216736A1 (en) * 2022-05-09 2023-11-16 苏州天准科技股份有限公司 Intelligent silicon wafer sorting system and method
CN220920081U (en) * 2023-09-26 2024-05-10 广东科隆威智能装备股份有限公司 Sorter of high-efficient separation crystalline silicon photovoltaic solar wafer

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Publication number Priority date Publication date Assignee Title
CN114843217A (en) * 2022-05-09 2022-08-02 常州科隆威智能技术有限公司 A separate paper board separator for silicon chip is selected separately
WO2023216736A1 (en) * 2022-05-09 2023-11-16 苏州天准科技股份有限公司 Intelligent silicon wafer sorting system and method
CN220920081U (en) * 2023-09-26 2024-05-10 广东科隆威智能装备股份有限公司 Sorter of high-efficient separation crystalline silicon photovoltaic solar wafer

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119796897A (en) * 2025-01-10 2025-04-11 苏州黑田智能科技有限公司 A flexible conveying device for battery cells
CN119796897B (en) * 2025-01-10 2026-03-10 苏州黑田智能科技有限公司 Flexible conveying device for battery cells

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