CN118795264A - A single-chip microcomputer built-in crystal oscillator defect detection tool and detection method - Google Patents

Abstract

The invention relates to the technical field of defect detection of a built-in crystal oscillator of a singlechip, in particular to a defect detection tool and a defect detection method of the built-in crystal oscillator of the singlechip, wherein the defect detection tool comprises a cylinder with a downward opening, a limit groove for placing a crystal oscillator body is formed above the cylinder, and a reversing mechanism, a detection mechanism and an extrusion mechanism are arranged on the cylinder; in the design reversing mechanism, the angle between the crystal oscillator body and the crystal oscillator pins can be changed through the mutual matching of the conductive blocks and the conductive components, so that the scene that the crystal oscillator pins and the crystal oscillator body are at different bending angles in the use process of the crystal oscillator can be simulated in the detection process.

Description

A single-chip microcomputer built-in crystal oscillator defect detection tool and detection method

Technical Field

The present application relates to the technical field of single-chip microcomputer built-in crystal oscillator defect detection, and in particular to a single-chip microcomputer built-in crystal oscillator defect detection tool and detection method.

Background Art

The built-in crystal oscillator of the microcontroller is a precision electronic component. Its pins are generally made of metal and are used to connect the crystal oscillator to the circuit board. As the clock source of the microcontroller, it can provide a more stable and accurate clock signal, enabling the microcontroller to accurately execute instructions and control external devices.

The built-in crystal oscillator of the microcontroller has a piezoelectric effect, that is, when a voltage is applied at the two poles of the chip, the crystal will deform. Conversely, if external force deforms the chip, a voltage will be generated at the two poles. The above properties of the built-in crystal oscillator of the microcontroller can be used to detect its defects.

For example, the patent application with publication number CN206411206U provides a crystal oscillator detection carrier and tooling, which includes: an upper plate and a lower plate, the upper plate and the lower plate are fixed together, a recess is provided on the upper plate, the recess is used to place and fix the crystal oscillator to be detected, a first groove is opened in the recess through the upper plate, and a pressing component is also provided on the upper plate to prevent the crystal oscillator to be detected from moving in the recess, and a second groove is provided on the lower plate through the lower plate, the first groove corresponds to the second groove, and the probe connected to the frequency meter passes through the second groove and the first groove to contact the corresponding pin of the crystal oscillator to be detected, and remains stable under the action of the pressing component to complete the detection of the crystal oscillator. The crystal oscillator detection carrier and tooling provided by this prior art can effectively reduce the detection cost, save detection time, and is convenient and fast.

During the installation process of the crystal oscillator, the crystal oscillator is inserted into the hole on the circuit board and installed by soldering. Since the spacing between the holes on the circuit board varies, when the crystal oscillator of the same specification needs to be installed on different circuit boards, the pins of the crystal oscillator need to be bent, that is, the crystal oscillator body and the crystal oscillator pins are not on the same vertical plane to ensure that the pins match the holes on the circuit board. However, the above-mentioned patent application can only detect and process the crystal oscillator when the pins are in a single state. When the crystal oscillator pins are in another state, the crystal oscillator may have flaws or even defects. Furthermore, the above-mentioned patent does not simulate the environment where the pins are in multiple states, resulting in less crystal oscillator detection data and unrepresentative detection.

Furthermore, when welding the crystal oscillator, the worker needs to hold the crystal oscillator body to ensure its stability during welding. Holding the crystal oscillator body may cause the crystal oscillator pins to bend, and the crystal oscillator body and the crystal oscillator pins may not be on the same vertical plane.

Based on this, and according to the above-mentioned viewpoints, the existing technology for detecting the built-in crystal oscillator of the microcontroller still has room for improvement.

Summary of the invention

In order to solve the above technical problems, the present application provides a single-chip microcomputer built-in crystal oscillator defect detection tool and detection method, which adopts the following technical solutions:

In a first aspect, a single-chip microcomputer built-in crystal oscillator defect detection tool comprises a downwardly opening cylinder, a limiting groove for placing the crystal oscillator body is provided on the top of the cylinder, and a reversing mechanism, a detection mechanism and an extrusion mechanism are installed on the cylinder.

The commutation mechanism comprises: two conductive discs symmetrically arranged along the length direction of the limiting groove, and a commutation groove 1 with a cross-shaped structure is opened on one side of the conductive disc close to the cylinder.

The support rod is an inverted L-shaped structure, corresponding to the conductive disc one by one and its vertical section is installed on the cylinder, and the conductive disc is installed at one end of the horizontal section of the support rod away from its vertical section.

The conductive block is limitedly and slidably arranged inside the first commutation slot.

The conductive component is mounted on the conductive block and matches with the crystal oscillator pin.

The detection mechanism determines the deformation of the crystal oscillator body when it is powered on, and the squeezing mechanism squeezes the crystal oscillator body to determine the voltage at the crystal oscillator pin when the crystal oscillator body is squeezed.

Preferably, a voltmeter electrically connected to the conductive disc is mounted on the cylinder, and a knife switch and a power supply for supplying power to the crystal oscillator body are also mounted on the cylinder.

Preferably, the conductive component includes: a clamping block, which cooperates with the crystal oscillator body and is electrically connected to the crystal oscillator body.

The elastic telescopic rod is installed on the clamping block, the conductive block is installed at one end of the elastic telescopic rod away from the clamping block, and the clamping block is electrically connected to the conductive block.

The locking part is installed on the clamping block and is used to fix the clamping block on the crystal oscillator pin.

Preferably, the locking portion comprises: a rubber interlayer, which is arranged inside the clamping block and is used to protect the crystal oscillator body.

A plurality of locking blocks are provided, which are uniformly slidably penetrated on the clamping block in the circumferential direction and matched with the rubber interlayer, and a side away from the clamping block is provided as an inclined slope.

The driving ring is installed on the clamping block by means of threaded connection, and the bottom of the driving ring abuts against the inclined surface.

Preferably, the extrusion mechanism comprises: a fixed frame mounted on the inner wall of the cylinder.

Bidirectional cylinder, installed on a fixed frame through a cylinder base.

The moving plate is installed on the telescopic end of the two-way cylinder, and a pushing rod is installed on the moving plate.

Two extrusion plates are provided and symmetrically distributed along the width direction of the limiting groove, matched with the push rods one by one, and slidably arranged inside the limiting groove.

Preferably, the detection mechanism comprises: a conductive plate, which is symmetrically arranged inside the cylinder and along the length direction of the limiting groove, corresponding one-to-one to the extrusion plate, and a fixed protrusion corresponding one-to-one to the conductive plate is arranged on the inner wall of the cylinder.

The connecting spring rod is installed between the conductive plate and the corresponding fixing protrusion.

The light bulbs are provided with two extrusion plates corresponding to each other, symmetrically arranged along the width direction of the limiting groove, and installed on the cylinder.

The electric wires correspond to the conductive plates one by one and are mounted on the conductive plates. The electric wires on the conductive plates corresponding to the same extruded plates pass through the cylinder and are electrically connected to the light bulbs.

Preferably, the conductive plate and the extruded plate are not in contact with each other, that is, no force is applied between the conductive plate and the extruded plate.

Preferably, a limiting frame which cooperates with the limiting groove and has a downward opening and a 匚-shaped structure is installed on the cylinder.

Preferably, the opposite side of the extrusion plate is located inside the limiting groove, and a guiding inclined surface is provided on the top of the opposite side of the extrusion plate.

In a second aspect, a method for detecting defects in a crystal oscillator built into a single-chip microcomputer is provided, and the method of use thereof comprises the following steps: S1: placement preparation, placing the crystal oscillator body to be detected inside a limiting groove.

S2: Installation process: fix the clamping block on the crystal oscillator body, and then fix the crystal oscillator body on the cylinder through the limit frame.

S3: Power-on test: power on the crystal oscillator, turn the crystal oscillator pins, and observe the lighting of the bulb.

S4: Extrusion test: use the push rod to drive the extrusion plate to squeeze the crystal oscillator body, and observe whether the voltmeter has any reading.

In summary, the present application includes at least one of the following beneficial technical effects:

1. In the commutation mechanism designed in the present invention, the commutation slot can change the angle between the crystal oscillator body and the crystal oscillator pin through the cooperation between the conductive block and the conductive component, so that during the detection process, the scene in which the crystal oscillator pin and the crystal oscillator body are at different bending angles when the crystal oscillator is in use can be simulated. Compared with the technology in which the position of the crystal oscillator pin remains unchanged during the existing detection process, the present invention can increase the amount of data during crystal oscillator detection, making the crystal oscillator detection data more representative.

2. In the locking part designed by the present invention, the driving ring can move downward synchronously during the rotation process, and then the driving ring can drive the locking block to move toward the crystal oscillator pin through the inclined surface. During the movement of the locking block, the rubber interlayer is squeezed to lock the crystal oscillator pin, thereby preventing the crystal oscillator pin from falling off the clamping block when moving inside the commutation slot, thereby improving the electrical connection effect between the crystal oscillator pin and the clamping block.

3. In the conductive assembly designed in the present invention, the conductive block can change the distance between it and the clamping block through the elastic telescopic rod when it moves inside the commutation slot, so that the spacing between the conductive block and the clamping block can be adaptively changed, avoiding the possibility of rigid disconnection between the conductive block and the crystal oscillator pin when the commutation slot moves.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the three-dimensional structure of the present invention.

FIG. 2 is a schematic diagram of the internal three-dimensional structure of the cylinder of the present invention.

FIG. 3 is a schematic diagram of the three-dimensional installation structure between the conductive blocks and the conductive components of the present invention.

FIG. 4 is a partial enlarged view of point B in FIG. 3 of the present invention.

FIG. 5 is a cross-sectional view of the clamping block and the driving ring of the present invention.

FIG6 is a connection circuit diagram among the conductive block, the clamping block, the conductive disk, the crystal oscillator, etc. of the present invention.

FIG. 7 is a partial enlarged view of point A in FIG. 2 of the present invention.

FIG8 is a connection circuit diagram among the light bulb, the conductive plate, the extrusion plate, etc. of the present invention.

FIG. 9 is a connection circuit diagram of the light bulb, the conductive plate, the sliding rheostat, the extrusion plate, etc. of the present invention.

FIG. 10 is a flow chart of a method for detecting defects in a single-chip microcomputer built-in crystal oscillator according to the present invention.

Explanation of the reference numerals: 1. Cylinder; 11. Voltmeter; 12. Switch; 13. Power supply; 14. Limiting frame; 100. Crystal oscillator body; 101. Crystal oscillator pin; 2. Reversing mechanism; 21. Conductive disk; 211. Reversing slot 2; 22. Reversing slot 1; 23. Support rod; 24. Conductive block; 25. Conductive assembly; 251. Snap-on block; 252. Elastic telescopic rod; 253. Locking part; 2531. Rubber interlayer; 2532. Locking block; 2533. Driving ring; 3. Detection mechanism; 31. Conductive plate; 32. Connecting spring rod; 33. Light bulb; 34. Electric wire; 4. Extrusion mechanism; 41. Fixed frame; 42. Bidirectional cylinder; 43. Moving plate; 44. Extrusion plate; 45. Push rod.

DETAILED DESCRIPTION

The present application is further described in detail below in conjunction with Figures 1 to 10.

The embodiment of the present application discloses a tool and method for detecting defects in a crystal oscillator built into a single-chip microcomputer. During the detection process, by changing the angle between the crystal oscillator body and the crystal oscillator pins, the integrity of the crystal oscillator body under different bending conditions of the crystal oscillator pins can be simulated, the amount of detection data is increased, and the detection data is made more representative.

Embodiment 1:

Referring to FIG. 1 , a single-chip microcomputer built-in crystal oscillator defect detection tool comprises a downwardly opening cylinder 1 , a limiting groove for placing a crystal oscillator body 100 is provided on the top of the cylinder 1 , and a reversing mechanism 2 , a detection mechanism 3 and a squeezing mechanism 4 are installed on the cylinder 1 .

2 and 3 , the commutation mechanism 2 includes: a conductive disc 21 made of conductive material, two of which are symmetrically arranged along the length direction of the limiting groove, and a commutation groove 22 with a cross-shaped structure is opened on one side of the conductive disc 21 close to the cylinder 1.

The support rod 23 is an inverted L-shaped structure, corresponding to the conductive disc 21 one by one and its vertical section is installed on the cylinder 1, and the conductive disc 21 is installed at one end of the horizontal section of the support rod 23 away from its vertical section.

The conductive block 24 is slidably disposed inside the commutation slot 1 22 in a limited manner.

The conductive component 25 is mounted on the conductive block 24 and matches with the crystal oscillator pin 101 .

The detection mechanism 3 can determine the deformation of the crystal oscillator body 100 in a power-on state, and the pressing mechanism 4 can press the crystal oscillator body 100 to determine the voltage at the crystal oscillator pin 101 of the crystal oscillator body 100 in the pressed state.

The crystal oscillator mentioned in the present invention is composed of a crystal oscillator body 100 and a crystal oscillator pin 101 .

The commutation slot 22 can change the angle between the crystal oscillator body 100 and the crystal oscillator pin 101 through the cooperation between the conductive block 24 and the conductive component 25, so that during the detection process, it can simulate the scenario in which the crystal oscillator pin 101 and the crystal oscillator body 100 are at different bending angles when the crystal oscillator is in use. Compared with the technology in which the position of the crystal oscillator pin 101 remains unchanged during the existing detection process, the present invention can increase the amount of data during crystal oscillator detection, making the crystal oscillator detection data more representative.

Referring back to FIG. 1 , a voltmeter 11 electrically connected to a conductive disc 21 is mounted on the cylinder 1 for detecting whether there is voltage at the crystal pin 101 when the crystal body 100 is subjected to pressure. A switch 12 and a power supply 13 for supplying power to the crystal body 100 are also mounted on the cylinder 1 .

The positive and negative electrodes of the voltmeter 11 are electrically connected to the two conductive discs 21 respectively.

Continuing to refer to Figure 1, a limit frame 14 is installed on the cylinder 1, which cooperates with the limit groove and has a downward opening in a 匚-shaped structure, wherein the limit frame 14 is a magnetic structure. A magnetic suction block is also installed on the cylinder 1, which cooperates with the two vertical sections of the limit frame 14 and is used to adsorb and fix the limit frame 14.

4 , the conductive component 25 includes a clamping block 251 , which matches with the crystal oscillator body 100 and is electrically connected to the crystal oscillator body 100 .

The elastic telescopic rod 252 is mounted on the clamping block 251 , the conductive block 24 is mounted on one end of the elastic telescopic rod 252 away from the clamping block 251 , and the clamping block 251 is electrically connected to the conductive block 24 .

The locking portion 253 is mounted on the clamping block 251 and is used to fix the clamping block 251 on the crystal oscillator pin 101 .

Before testing, remove the limit frame 14, place the crystal oscillator body 100 inside the limit groove, and then reset the limit frame 14. The limit frame 14 is adsorbed on the magnetic block to limit the crystal oscillator body 100, avoiding the possibility of shaking of the crystal oscillator body 100 when the crystal oscillator pin 101 is subsequently moved, and then the crystal oscillator pin 101 is connected to the clamping block 251.

Referring to Figures 4 and 5, in order to ensure the electrical connection effect between the clamping block 251 and the crystal oscillator pin 101 and avoid the short circuit between the crystal oscillator pin 101 and the clamping block 251, the locking block 2532 provided by the present invention can lock the clamping block 251 and the crystal oscillator pin 101 with each other. Specifically, the locking part 253 includes: a rubber interlayer 2531, which is arranged inside the clamping block 251 to protect the crystal oscillator body 100.

There are multiple locking blocks 2532 , which are uniformly slidably disposed on the clamping block 251 in the circumferential direction and cooperate with the rubber interlayer 2531 , and a side away from the clamping block 251 is disposed as an inclined slope.

The driving ring 2533 is installed on the clamping block 251 by means of a threaded connection, and the bottom of the driving ring 2533 abuts against the inclined surface.

During specific operation, the driving ring 2533 is rotated, and the driving ring 2533 can move downward synchronously during the rotation, and then the driving ring 2533 can drive the locking block 2532 to move toward the crystal oscillator pin 101 through the inclined surface. During the movement of the locking block 2532, the rubber interlayer 2531 is squeezed to lock the crystal oscillator pin 101, thereby increasing the connection effect between the clamping block 251 and the crystal oscillator pin 101, preventing the crystal oscillator pin 101 from falling off the clamping block 251 when moving inside the commutation slot 22, and improving the electrical connection effect between the crystal oscillator pin 101 and the clamping block 251.

6 , the circuit for detecting the deformation of the crystal oscillator body 100 when powered on is as follows: the current flows out through the positive electrode of the power supply 13, through the switch 12, the conductive disc 21, the conductive block 24, the clamping block 251, the crystal oscillator pin 101, the crystal oscillator body 100, another crystal oscillator pin 101, another clamping block 251, another conductive block 24, another conductive disc 21, and then returns to the negative electrode of the power supply 13.

During specific operation, the various components of the above-mentioned circuit (that is, the circuit for detecting the deformation of the crystal oscillator body 100 when it is powered on) are connected through existing wires, and the crystal oscillator pin 101 is manually moved inside the commutation slot 22 and along a section of the limit slot width direction. At this time, the crystal oscillator pin 101 and the crystal oscillator body 100 are inclined at a certain angle, and then the switch 12 is turned, and the above-mentioned circuit is in a closed loop state. At this time, the circuit for detecting the deformation of the crystal oscillator body 100 when it is powered on is energized, that is, the crystal oscillator body 100 is powered on.

When the conductive block 24 moves inside the commutation slot 22, the distance between it and the clamping block 251 can be changed through the elastic telescopic rod 252, and at the same time, it can be ensured that the conductive block 24 and the clamping block 251 are always connected, so that the spacing between the conductive block 24 and the clamping block 251 can be adaptively changed, avoiding the possibility of rigid disconnection between the conductive block 24 and the crystal oscillator pin 101 when the commutation slot 22 moves.

7 , the extrusion mechanism 4 includes: a fixed frame 41 mounted on the inner wall of the cylinder 1 .

The bidirectional cylinder 42 is mounted on the fixed frame 41 via a cylinder seat.

The moving plate 43 is mounted on the telescopic end of the bidirectional cylinder 42 , and a pushing rod 45 is mounted on the moving plate 43 .

There are two squeezing plates 44 symmetrically distributed along the width direction of the limiting groove, matched with the pushing rods 45 one by one, and slidably arranged inside the limiting groove.

The detection mechanism 3 includes: a conductive plate 31 symmetrically arranged inside the cylinder 1 and along the length direction of the limiting groove, corresponding to the extrusion plate 44 one by one, and a fixed protrusion corresponding to the conductive plate 31 is arranged on the inner wall of the cylinder 1.

The connecting spring rod 32 is installed between the conductive plate 31 and the corresponding fixing protrusion to reset the conductive plate 31 .

The light bulbs 33 are provided with two and the pressing plates 44 correspond to each other, are symmetrically arranged along the width direction of the limiting groove, and are installed on the cylinder 1.

The electric wires 34 correspond to the conductive plates 31 one by one and are installed on the conductive plates 31 . The electric wires 34 on the conductive plates 31 corresponding to the same extrusion plates 44 pass through the cylinder 1 and are electrically connected to the light bulbs 33 .

The conductive plate 31 and the pressing plate 44 are not in contact with each other, that is, no force is applied between the conductive plate 31 and the pressing plate 44 , that is, in the initial position, the conductive plate 31 and the pressing plate 44 are not electrically connected.

Referring to FIG. 7 , the opposite side of the extrusion plate 44 is located inside the limiting groove, so that the crystal oscillator body 100 can directly act on the extrusion plate 44 after being energized and deformed, and a guiding slope is provided on the top of the opposite side of the extrusion plate 44 to guide the crystal oscillator body 100 when it is placed, thereby avoiding collision between the crystal oscillator body 100 and the extrusion plate 44 .

Refer to Figure 8, in which the extrusion plate 44 is made of conductive material, and the wires 34 are connected in parallel to the power supply 13 through the existing wires. A circuit is formed between the power supply 13, the bulbs 33, the wires 34, the conductive plate 31 and the extrusion plate 44, that is, the two bulbs 33 are in parallel. At this time, the conductive plate 31 is not connected with the corresponding extrusion plate 44.

After the crystal oscillator body 100 is energized, if the crystal oscillator body 100 is damaged, it will not deform. If the crystal oscillator body 100 is not damaged, the crystal oscillator body 100 will deform. During the deformation of the crystal oscillator body 100, the extrusion plate 44 is displaced. At this time, the extrusion plate 44 is in electrical contact with the conductive plate 31. At this time, the connecting spring rod 32 is in a stretched state, and a closed circuit is formed between the power supply 13, the light bulb 33, the wire 34, the conductive plate 31 and the extrusion plate 44. At this time, the crystal oscillator body 100 is not damaged.

If the light bulb 33 on one side is in the lighted state, it means that the other side of the crystal oscillator body 100 has not been deformed. At this time, the crystal oscillator body 100 is inspected and processed using existing more rigorous detection technology. If the light bulbs 33 on both sides are in the lighted state, the crystal oscillator body 100 is not in intact condition at the position of the crystal oscillator pin 101.

When the above steps are completed, the knife 12 is opened, and the conductive plate 31 is reset under the drive of the connecting spring rod 32. During the resetting process of the conductive plate 31, the squeezing plate 44 is simultaneously driven to reset, and the displacement distance of the squeezing plate 44 due to inertia is slightly larger than the reset distance of the conductive plate 31, thereby ensuring that the conductive plate 31 and the squeezing plate 44 are disconnected, that is, the two are no longer in contact. At this time, the crystal oscillator pin 101 is manually moved again to make it deviate by a certain angle again, and the above steps are repeated to detect the integrity of the crystal oscillator when the crystal oscillator pin 101 is at any position inside a section of the commutation slot 22 along the width direction of the limit slot.

Then change the position of the crystal oscillator pin 101 so that it is at any position inside the commutation slot 22 along the length direction of the limit slot. Repeat the above steps to measure the integrity of the crystal oscillator when the crystal oscillator pin 101 is at any position inside the commutation slot 22 along the length direction of the limit slot.

Furthermore, by testing the crystal oscillator by changing the bending degree of the crystal oscillator pin 101 in different vertical planes, the integrity of the crystal oscillator under different angles between the crystal oscillator pin 101 and the crystal oscillator body 100 can be simulated.

When the above-mentioned crystal oscillator pin 101 is in each position, after the power-on detection step of the crystal oscillator body 100 is completed, the switch 12 is disconnected, and the two-way cylinder 42 is started at this time. The two telescopic ends of the two-way cylinder 42 drive the moving plate 43 to move. During the movement of the moving plate 43, the push rod 45 is synchronously driven to move. During the movement of the push rod 45, pressure is applied to the squeezing plate 44. At this time, the squeezing plate 44 applies pressure to the crystal oscillator body 100. If the voltmeter 11 has an indication, it indicates that the crystal oscillator body 100 is not damaged and is in good condition. Otherwise, the crystal oscillator body 100 is damaged.

Embodiment 2: Looking back at Figure 4, on the basis of Embodiment 1, Embodiment 2, in order to further increase the representativeness of the detection data, the present invention further provides a commutation slot 211 at the lower end of the conductive disk 21, which is a ring structure. During specific operation, after the detection of the crystal oscillator pin 101 at different positions on the same vertical plane is completed, the conductive block 24 is placed inside the commutation slot 211, and the conductive component 25 drives the clamping block 251 to move synchronously. At this time, the crystal oscillator pin 101 also moves synchronously with the clamping block 251. Therefore, as the conductive block 24 moves inside the commutation slot 211, the conductive component 25 and the clamping block 251 cooperate with each other to drive the crystal oscillator pin 101 to rotate circumferentially around the crystal oscillator body 100, and then the steps in Embodiment 1 can be repeated on the crystal oscillator body 100 when the crystal oscillator pin 101 is in different planes, thereby increasing the detection data of the crystal oscillator body 100 and further improving the representativeness of the detection.

Embodiment 3, referring to FIG9, on the basis of embodiment 1, in the closed circuit formed between the power supply 13, the light bulb 33, the wire 34, the conductive plate 31 and the extrusion plate 44, in order to further detect the deformation degree of the crystal oscillator body 100, the present invention further provides a sliding rheostat, two of which are provided and correspond one to one with the extrusion plate 44. At this time, any wire 34 corresponding to the light bulb 33 is divided into two sections, one end of the disconnected wire 34 is installed on the moving contact of the sliding rheostat, and the other end of the disconnected wire 34 is installed on the fixed contact of the sliding rheostat, and the moving contact of the sliding rheostat is connected to the conductive plate 31 on the corresponding side through an insulating sheet, so that the moving contact of the sliding rheostat can be driven to move during the movement of the conductive plate 31, and the resistance of the connected circuit can be changed during the movement of the sliding rheostat, thereby changing the lighting condition of the light bulb 33, that is, the displacement degree of the conductive plate 31 driven by the extrusion plate 44, so that the deformation degree of the crystal oscillator body 100 can be judged, and the practical effect is better.

Finally, referring to FIG. 10 , the present invention further provides a method for detecting defects in a crystal oscillator built in a single chip microcomputer, and the method of use thereof comprises the following steps: S1: preparation for placement, before detection, removing the limit frame 14 , placing the crystal oscillator body 100 inside the limit groove, and then resetting the limit frame 14 .

S2: Installation process, rotating the driving ring 2533, the driving ring 2533 can move downward synchronously during the rotation process, and then the driving ring 2533 can drive the locking block 2532 to move toward the crystal oscillator pin 101 through the inclined surface, and the locking block 2532 squeezes the rubber interlayer 2531 to lock the crystal oscillator pin 101 during the movement.

S3: Power-on detection, the circuit for detecting the deformation of the crystal oscillator body 100 in the power-on state is powered on, and the components are connected through existing wires. The crystal oscillator pin 101 is manually moved inside the commutation slot 22 and along a section of the width direction of the limit slot. At this time, the crystal oscillator pin 101 and the crystal oscillator body 100 are tilted at a certain angle, and then the switch 12 is turned. The above circuit is in a closed loop state. At this time, the circuit for detecting the deformation of the crystal oscillator body 100 in the power-on state is powered on, that is, The crystal oscillator body 100 is energized. If the crystal oscillator body 100 is damaged, it will not be deformed. If the crystal oscillator body 100 is not damaged, the crystal oscillator body 100 will be deformed. During the deformation of the crystal oscillator body 100, the extrusion plate 44 is displaced. At this time, the extrusion plate 44 is in electrical contact with the conductive plate 31. At this time, the connecting spring rod 32 is in a stretched state, and a closed circuit is formed between the power supply 13, the light bulb 33, the wire 34, the conductive plate 31 and the extrusion plate 44. At this time, the crystal oscillator body 100 is not damaged.

S4: Extrusion detection. When the crystal oscillator pin 101 is in each position, after the power-on detection step of the crystal oscillator body 100 is completed, the switch 12 is disconnected, and the two-way cylinder 42 is started. The two telescopic ends of the two-way cylinder 42 drive the moving plate 43 to move. During the movement of the moving plate 43, the push rod 45 is synchronously driven to move. During the movement of the push rod 45, pressure is applied to the extrusion plate 44. At this time, the extrusion plate 44 applies pressure to the crystal oscillator body 100. If the voltmeter 11 has an indication, it indicates that the crystal oscillator body 100 is not damaged and is in good condition. Otherwise, the crystal oscillator body 100 is damaged.

It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims (10)

1. The utility model provides a built-in crystal oscillator defect flaw detection frock of singlechip, includes opening decurrent drum (1), its characterized in that: a limit groove for placing a crystal oscillator body (100) is formed in the upper portion of the cylinder (1), a reversing mechanism (2), a detection mechanism (3) and an extrusion mechanism (4) are arranged on the cylinder (1), and the limit groove is formed in the cylinder (1), wherein:

The reversing mechanism (2) comprises:

The conductive discs (21) are made of conductive materials, two conductive discs are symmetrically arranged along the length direction of the limiting groove, and one side, close to the cylinder (1), of each conductive disc (21) is provided with a reversing groove I (22) with a cross-shaped structure;

The support rods (23) are of inverted L-shaped structures, are in one-to-one correspondence with the conductive discs (21) and are arranged on the cylinder (1) in the vertical section, and the conductive discs (21) are arranged at one end, far away from the vertical section, of the horizontal section of the support rods (23);

the conducting block (24) is arranged in the reversing groove I (22) in a limiting sliding manner;

the conductive component (25) is arranged on the conductive block (24) and matched with the crystal oscillator pins (101);

The detection mechanism (3) determines the deformation condition of the crystal oscillator body (100) in the electrified state, and the extrusion mechanism (4) extrudes the crystal oscillator body (100) to determine the voltage of the crystal oscillator pins (101) of the crystal oscillator body (100) in the extrusion state.

2. The tool for detecting defects of built-in crystal oscillator of single chip microcomputer according to claim 1, wherein the tool is characterized in that: the cylinder (1) is provided with a voltmeter (11) electrically connected with the conductive disc (21), and the cylinder (1) is also provided with a knife switch (12) and a power supply (13) for supplying power to the crystal oscillator body (100).

3. The tool for detecting defects of built-in crystal oscillator of single chip microcomputer according to claim 1, wherein the tool is characterized in that: the conductive assembly (25) includes:

The clamping block (251) is matched with the crystal oscillator body (100) and is electrically connected with the crystal oscillator body (100);

The elastic telescopic rod (252) is arranged on the clamping block (251), the conductive block (24) is arranged at one end, far away from the clamping block (251), of the elastic telescopic rod (252), and the clamping block (251) is electrically connected with the conductive block (24);

and the locking part (253) is arranged on the clamping block (251) and is used for fixing the clamping block (251) on the crystal oscillator pin (101).

4. The tool for detecting defects of built-in crystal oscillator of single-chip microcomputer according to claim 3, wherein the tool is characterized in that: the locking part (253) comprises: the rubber interlayer (2531) is arranged in the clamping block (251) and is used for protecting the crystal oscillator body (100);

The locking blocks (2532) are arranged, circumferentially and uniformly slide and penetrate through the clamping blocks (251) and are matched with the rubber interlayer (2531), and one side, far away from the clamping blocks (251), is provided with an inclined plane;

The driving circular ring (2533) is arranged on the clamping block (251) in a threaded connection mode, and the bottom of the driving circular ring (2533) is abutted against the inclined plane.

5. The tool for detecting defects of built-in crystal oscillator of single chip microcomputer according to claim 1, wherein the tool is characterized in that: the extrusion mechanism (4) comprises:

a fixed frame (41) which is arranged on the inner wall of the cylinder (1);

a bidirectional cylinder (42) mounted on the fixed frame (41) through a cylinder block;

The movable plate (43) is arranged on the telescopic end of the bidirectional air cylinder (42), and a pushing rod (45) is arranged on the movable plate (43);

The extrusion plates (44) are arranged in two and symmetrically distributed along the width direction of the limiting groove, are matched with the pushing rods (45) one by one, and penetrate through the inside of the limiting groove in a sliding mode.

6. The tool for detecting defects of built-in crystal oscillator of single chip microcomputer according to claim 5, wherein the tool is characterized in that: the detection mechanism (3) comprises:

the conductive plates (31) are symmetrically arranged in the cylinder (1) along the length direction of the limiting groove and are in one-to-one correspondence with the extrusion plates (44), and fixing protrusions which are in one-to-one correspondence with the conductive plates (31) are arranged on the inner wall of the cylinder (1);

a connecting spring rod (32) installed between the conductive plate (31) and the corresponding fixing protrusion;

The bulbs (33) are provided with two extrusion plates (44) which are in one-to-one correspondence, are symmetrically arranged along the width direction of the limiting groove, and are arranged on the cylinder (1);

The electric wires (34) are in one-to-one correspondence with the conductive plates (31) and are arranged on the conductive plates (31), and the electric wires (34) on the same extrusion plate (44) corresponding to the conductive plates (31) penetrate through the cylinder (1) and are electrically connected with the electric bulbs (33).

7. The tool for detecting defects of built-in crystal oscillator of single chip microcomputer according to claim 6, wherein the tool is characterized in that: the conducting plate (31) and the extrusion plate (44) are not attached, namely the conducting plate (31) and the extrusion plate (44) are not stressed.

8. The tool for detecting defects of built-in crystal oscillator of single chip microcomputer according to claim 1, wherein the tool is characterized in that: the cylinder (1) is provided with a limit frame (14) which is matched with the limit groove and has a structure with an opening of 匚 type downwards.

9. The tool for detecting defects of built-in crystal oscillator of single chip microcomputer according to claim 5, wherein the tool is characterized in that: the opposite sides of the extrusion plate (44) are positioned in the limiting groove, and guide inclined planes are formed at the tops of the opposite sides of the extrusion plate (44).

10. A method for detecting defects of a built-in crystal oscillator of a single chip microcomputer, which comprises the tool for detecting defects of the built-in crystal oscillator of the single chip microcomputer according to any one of claims 1-9, the application method is characterized by comprising the following steps:

S1: preparing for placement, namely placing a crystal oscillator body (100) to be detected in the limiting groove;

S2: mounting, namely fixing the clamping block (251) on the crystal oscillator body (100), and fixing the crystal oscillator body (100) on the cylinder (1) through the limiting frame (14);

s3: electrifying detection, namely electrifying the crystal oscillator body (100), rotating the crystal oscillator pins (101), and observing the lighting condition of the bulb (33);

S4: extrusion detection, namely driving the extrusion plate (44) to extrude the crystal oscillator body (100) through the push rod (45), and observing whether the voltmeter (11) has an indication.