CN118788671A - Epitaxial wafer surface pretreatment device and treatment method - Google Patents
Epitaxial wafer surface pretreatment device and treatment method Download PDFInfo
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- CN118788671A CN118788671A CN202411251898.XA CN202411251898A CN118788671A CN 118788671 A CN118788671 A CN 118788671A CN 202411251898 A CN202411251898 A CN 202411251898A CN 118788671 A CN118788671 A CN 118788671A
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- H10P72/0416—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
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- H10P70/20—
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本发明公开了外延片表面预处理装置及处理方法，涉及到外延片生产设备技术领域，包括主体，所述主体的顶部依次开设有一级清洗池、二级清洗池和三级清洗池，还包括：放置架，其能够收纳放置多个外延片并通过机械臂将外延片依次放入一级清洗池、二级清洗池和三级清洗池内进行清洗。本发明还公开了外延片表面预处理方法，包括以下步骤：一级清洗、二级清洗、三级清洗和干燥。本发明通过浮漂在浮力作用下带动压板压在外延片圆周上，避免了外延片在浸泡过程中发生漂浮的问题，通过喷淋孔处于靠近对应外延片圆周的位置处，去离子水通过第一斜孔和第二斜孔以倾斜的方式向外延片两侧喷淋，增加对外延片的喷淋覆盖面，提高对外延片的清洗效果。
The present invention discloses an epitaxial wafer surface pretreatment device and a treatment method, which relates to the technical field of epitaxial wafer production equipment, and includes a main body, wherein a primary cleaning pool, a secondary cleaning pool, and a tertiary cleaning pool are sequentially opened on the top of the main body, and further includes: a placement rack, which can accommodate and place multiple epitaxial wafers and sequentially place the epitaxial wafers into the primary cleaning pool, the secondary cleaning pool, and the tertiary cleaning pool for cleaning through a mechanical arm. The present invention also discloses an epitaxial wafer surface pretreatment method, which includes the following steps: primary cleaning, secondary cleaning, tertiary cleaning, and drying. The present invention drives a pressure plate to press on the circumference of the epitaxial wafer under the action of buoyancy by a float, thereby avoiding the problem of the epitaxial wafer floating during the soaking process. By placing the spray hole close to the corresponding epitaxial wafer circumference, deionized water is sprayed on both sides of the epitaxial wafer in an inclined manner through the first inclined hole and the second inclined hole, thereby increasing the spray coverage of the epitaxial wafer and improving the cleaning effect of the epitaxial wafer.
Description
Technical Field
The invention relates to the technical field of epitaxial wafer production equipment, in particular to an epitaxial wafer surface pretreatment device and a treatment method.
Background
In the semiconductor industry, epitaxial growth is an important link, and the crystal quality of an epitaxial wafer is one of key factors affecting the performance of a device. The epitaxial wafer is used as a key material in the semiconductor process, and the quality of the surface quality of the epitaxial wafer is directly related to the performance and stability of subsequent devices. Therefore, it is important to clean the surface of the epitaxial wafer.
The utility model discloses an epitaxial wafer belt cleaning device of publication number CN113245275B, including wasing pond, the balladeur train, wiper mechanism, rotary mechanism and drying mechanism, wasing the pond and being equipped with the baffle and separating into primary washing district and fine washing district with wasing the pond, wasing both sides top and being equipped with the lead screw, be equipped with on the lead screw and can be on wasing the pond gliding balladeur train, the balladeur train both ends are equipped with the slider of placing on the lead screw, and the slider bottom surface processing is threaded, and the balladeur train top is equipped with wiper mechanism, and the balladeur train below is equipped with rotary mechanism, and the primary washing district one end is kept away from in the fine washing district is equipped with drying mechanism. Above-mentioned scheme is through setting up the lead screw on wasing the pond to place the balladeur train on the lead screw, utilize pivoted lead screw to drive the balladeur train and remove, wash the epitaxial wafer of placing on the balladeur train through installing the belt cleaning device on wasing the pond simultaneously, cooperation rotary mechanism drives the epitaxial wafer simultaneously and rotates on the balladeur train, thereby reduces clean dead angle, guarantees cleaning quality, and cooperation drying device can in time clear away the water stain of remaining on the epitaxial wafer simultaneously, so as to prevent recontamination.
The patent only can spray on a large scale, but can not spray and clean each epitaxial wafer, spray dead angles still appear, so that the cleaning effect is poor, and meanwhile, slipping can occur between the epitaxial wafer and the rotating mechanism, so that the rotating effect of the epitaxial wafer on the sliding frame is poor; in addition, in the conventional epitaxial wafer cleaning operation, the epitaxial wafer is usually placed in a placing rack, and then the placing rack is placed in a pool filled with cleaning liquid for ultrasonic cleaning and soaking cleaning, and the epitaxial wafer floats under the action of liquid buoyancy due to the lack of effective limiting of the epitaxial wafer, so that stable placement of the epitaxial wafer in the cleaning process is not facilitated.
Therefore, it is necessary to solve the above problems by inventing an epitaxial wafer surface pretreatment apparatus and a treatment method.
Disclosure of Invention
The invention aims to provide an epitaxial wafer surface pretreatment device and a treatment method, which are used for solving the problems in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: epitaxial wafer surface preprocessing device, including the main part, first order washs pond, second grade washs pond and tertiary washs pond have been seted up in proper order to the top of main part, still includes: the placing rack can be used for accommodating and placing a plurality of epitaxial wafers and sequentially placing the epitaxial wafers into the primary cleaning tank, the secondary cleaning tank and the tertiary cleaning tank for cleaning through the mechanical arm; the pressing assemblies are rotatably arranged on two sides of the top of the placing frame, and can limit the epitaxial wafer to the inside of the placing frame; the spraying components are fixedly arranged on two sides of the top of the rack, and are matched with the compaction components on the same side, so that the lateral surfaces of the epitaxial wafer can be comprehensively sprayed; the driving assembly is arranged in the main body and penetrates into the three-stage cleaning pool, and the driving assembly can drive the epitaxial wafer to rotate in the rack; the circulating pool is arranged in the main body and is positioned below the three-stage cleaning pool, and the circulating pool is used for containing liquid discharged from the three-stage cleaning pool; the pump liquid component is arranged in the circulating pool and is communicated with the two groups of spraying components, and liquid can be supplied to the two groups of spraying components.
Preferably, the rack comprises: a frame body; the placing grooves are uniformly formed in the middle of the frame body and can be used for accommodating the epitaxial wafers; the through grooves are arranged on two sides of the frame body in a penetrating manner; the support roller is rotatably arranged in the middle of the frame body, and the support roller can support the bottom of the epitaxial wafer placed in the frame body.
Preferably, the rack further comprises: the bottom frame is fixedly arranged at the outer side of the bottom end of the frame body; the connecting parts are symmetrically and fixedly arranged at two ends of the top of the bottom frame, and are matched with the mechanical arms to move the placing frame.
Preferably, the pressing assembly includes: the middle part of the rotating frame is rotatably arranged at the top end of the frame body and can rotate around the joint of the rotating frame and the frame body; the pressing plate is fixedly arranged at the top end of the rotating frame and can compress the epitaxial wafer in the placing frame; a flexible portion fixedly provided at a tip end of the platen; the mounting rod is fixedly arranged at the bottom end of the rotating frame; the buoy is fixedly arranged on the mounting rod, and the buoy is driven to rotate by buoyancy provided by liquid.
Preferably, the spray assembly comprises: the liquid guide box is fixedly arranged at the top end of the frame body; the liquid channel is arranged in the frame body, one end of the liquid channel penetrates through the bottom end of the frame body, and the other end of the liquid channel penetrates through the top end of the frame body; the first liquid guide tube is communicated between the liquid guide box and the liquid channel; the liquid outlet hole penetrates through the side face of the liquid guide box; the liquid collecting cavity is arranged in the pressing plate, and a second liquid guide tube is communicated between the liquid collecting cavity and the liquid outlet hole; the spraying holes are arranged in a plurality of groups and penetrate through one side of the pressing plate, and each group of spraying holes corresponds to two side surfaces of one epitaxial wafer respectively; the rotating rod is fixedly arranged in the middle of the rotating frame and penetrates through the liquid guide box; the water blocking plate is fixedly arranged in the middle of the rotating rod, is rotatably arranged in the liquid guide box, and is always kept sealed with the inner wall of the liquid guide box in the rotating process; the elastic piece is fixedly arranged between the top of the water blocking plate and the inner side wall of the liquid guide box.
Preferably, the spraying holes comprise a first inclined hole and a second inclined hole, and the spraying directions of the first inclined hole and the second inclined hole are close to each other.
Preferably, the driving assembly includes: a power chamber which is provided on the rear side of the main body; the driving motor is fixedly arranged in the power chamber, and the output end of the driving motor is fixedly provided with a driving shaft; the transmission shaft is rotationally arranged in the three-stage cleaning pool, one end of the transmission shaft is in transmission connection with the driving shaft through a bevel gear group, and the transmission shaft can drive the epitaxial wafer to rotate in the placing frame; and the box cover is detachably arranged on the rear side of the power chamber.
Preferably, the pump assembly comprises: the water pump is fixedly arranged in the circulating tank, and the water pumping end of the water pump extends to the bottom of the circulating tank; the liquid pumping pipe is communicated with the water outlet end of the water pump; the inserting grooves are uniformly formed in the bottom of the three-stage cleaning tank, and can limit the bottom end of the frame body placed in the three-stage cleaning tank; the butt joint is fixedly arranged at the bottom of the three-stage cleaning tank, the number and the positions of the butt joint are corresponding to those of the plugging grooves, and after the frame body is placed in the three-stage cleaning tank, the top end of the butt joint is communicated with the bottom end of the liquid channel; and one end of the manifold is communicated with the butt joint, and the other end of the manifold is communicated with the liquid pumping pipe.
Preferably, the drying assembly is further included, the drying assembly including: the two air ducts are symmetrically and slidably arranged on two sides of the inner wall of the three-stage cleaning pool, and one ends of the two air ducts penetrate into the power chamber; the gas nozzle is communicated with the gas guide pipe; the cross rod is fixedly arranged between the two air guide pipes and positioned in the power chamber; one end of the return spring is fixedly connected with the cross rod, and the other end of the return spring is abutted against the box cover; a cam fixedly provided on the drive shaft; and the lug is fixedly arranged on one side of the cross rod, and when the cam rotates, the cross rod can be intermittently forced to move through the lug.
The epitaxial wafer surface pretreatment method comprises the following steps:
Firstly, primary cleaning, namely immersing a rack with epitaxial wafers into a primary cleaning pool through a mechanical arm for ultrasonic cleaning to remove pollutants attached to the surfaces of the epitaxial wafers;
step two, secondary cleaning, namely immersing the epitaxial wafer subjected to primary cleaning into a secondary cleaning tank filled with acetone for cleaning, and removing photoresist and organic matter residues on the surface of the epitaxial wafer;
step three, three-stage cleaning, namely placing the epitaxial wafer subjected to the two-stage cleaning into a three-stage cleaning tank filled with deionized water for soaking and spraying, and thoroughly removing chemical substances remained on the surface of the epitaxial wafer;
And step four, drying, namely blowing air to the epitaxial wafer through the drying assembly to remove residual moisture on the surface of the epitaxial wafer.
The invention has the technical effects and advantages that:
1. According to the invention, through the cooperation of the rotating frame, the pressing plate and the buoy, the buoy moves upwards under the action of the liquid buoyancy, so that the rotating frame drives the pressing plate to move downwards and press the circumference of the epitaxial wafer, the problem that the epitaxial wafer floats due to buoyancy in the soaking process is effectively avoided, and the epitaxial wafer is ensured to be always and stably positioned in the placing frame.
2. According to the invention, through the cooperation of the pressing assembly, the spraying assembly and the liquid pumping assembly, in the spraying process, the plurality of groups of spraying holes are positioned at positions close to the circumferences of the corresponding epitaxial wafers, deionized water sprays to two sides of the corresponding epitaxial wafers in an inclined manner through the first inclined holes and the second inclined holes, so that the spraying coverage of the epitaxial wafers is increased, and the spraying cleaning effect of the epitaxial wafers is improved.
3. According to the invention, the driving assembly is arranged, so that the epitaxial wafer is always in a rotating state in the soaking, spraying and drying processes, the side surfaces of the epitaxial wafer are guaranteed to be cleaned and dried everywhere, the dead angles of cleaning and drying are prevented, and the cleaning and drying effects of the epitaxial wafer are improved.
4. According to the invention, the compression assembly is arranged, so that the epitaxial wafer can be tightly abutted against the transmission shaft all the time, slipping between the epitaxial wafer and the transmission shaft is avoided, and the transmission efficiency between the epitaxial wafer and the transmission shaft is ensured.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the present invention.
Fig. 2 is a schematic view showing a state of placement of the epitaxial wafer of the present invention.
Fig. 3 is a schematic structural view of the rack of the present invention.
Fig. 4 is a schematic structural view of the compressing assembly of the present invention.
Fig. 5 is a schematic cross-sectional view of the frame of the present invention.
Fig. 6 is an enlarged schematic view of the structure of fig. 5a according to the present invention.
Fig. 7 is a schematic cross-sectional view of a spray assembly of the present invention.
FIG. 8 is a schematic cross-sectional view of a three-stage cleaning tank according to the present invention.
Fig. 9 is an enlarged schematic view of the structure of fig. 8B according to the present invention.
Fig. 10 is a schematic cross-sectional structure of the main body of the present invention.
FIG. 11 is a schematic view of the position of the plugging slot according to the present invention.
Fig. 12 is a schematic view of the location of the power chamber of the present invention.
Fig. 13 is an enlarged schematic view of the structure of fig. 12C according to the present invention.
In the figure: 1. a main body; 2. a first-stage cleaning pool; 3. a secondary cleaning pool; 4. a third-stage cleaning pool; 5. a placing rack; 6. an epitaxial wafer; 7. a compression assembly; 8. a spray assembly; 9. a drive assembly; 10. a circulation tank; 11. a pump fluid assembly; 12. a drying assembly; 501. a frame body; 502. a placement groove; 503. a through groove; 504. a support roller; 505. a bottom frame; 506. a joint portion; 701. a rotating frame; 702. a pressing plate; 703. a flexible portion; 704. a mounting rod; 705. a float; 801. a liquid guide box; 802. a liquid channel; 803. a first catheter; 804. a liquid outlet hole; 805. a liquid collection cavity; 806. a second catheter; 807. spraying holes; 8071. a first inclined hole; 8072. a second inclined hole; 808. a rotating rod; 809. a water blocking plate; 810. an elastic member; 901. a power chamber; 902. a driving motor; 903. a drive shaft; 904. a transmission shaft; 905. a case cover; 1101. a water pump; 1102. a liquid pumping pipe; 1103. a plug-in groove; 1104. butt joint; 1105. a manifold; 1201. an air duct; 1202. a gas shower; 1203. a cross bar; 1204. a return spring; 1205. a cam; 1206. and a bump.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The first embodiment of the invention provides an epitaxial wafer surface pretreatment device as shown in fig. 1 to 13, which comprises a main body 1, wherein a first-stage cleaning tank 2, a second-stage cleaning tank 3 and a third-stage cleaning tank 4 are sequentially arranged at the top of the main body 1, the first-stage cleaning tank 2 is an ultrasonic cleaning tank and is used for ultrasonic cleaning an epitaxial wafer 6 so as to remove pollutants attached to the surface of the epitaxial wafer 6, the ultrasonic cleaning is the prior art, an acetone solvent is not repeated here, the second-stage cleaning tank 3 is filled with the acetone solvent and can be used for preheating the acetone solvent so as to remove photoresist and organic residues on the surface of the epitaxial wafer 6, meanwhile, an ultrasonic cleaning function can be added in the second-stage cleaning tank 3 so as to further improve the cleaning effect on the epitaxial wafer 6, deionized water is filled in the third-stage cleaning tank 4, and the deionized water is used for soaking and spraying the epitaxial wafer 6 so as to thoroughly remove chemical substances remained on the surface of the epitaxial wafer 6.
Still include rack 5, it can accomodate and place a plurality of epitaxial wafer 6 and put into one-level washing pond 2, second grade washing pond 3 and tertiary washing pond 4 in proper order through the arm with epitaxial wafer 6 and wash.
Specifically, the placement frame 5 includes a frame body 501; the placing grooves 502 are uniformly formed in the middle of the frame body 501, the placing grooves 502 can accommodate the epitaxial wafers 6, and the placing grooves 502 are slightly larger than the thickness of the epitaxial wafers 6, so that the epitaxial wafers 6 can be limited, the two sides of the epitaxial wafers 6 cannot be clamped completely, and the epitaxial wafers 6 can be guaranteed to rotate freely in the placing grooves 502; the through grooves 503 are formed on two sides of the frame 501 in a penetrating manner, and the through grooves 503 can facilitate the circulation of liquid in the frame 501; a support roller 504 rotatably provided in the middle of the frame 501, the support roller 504 being capable of supporting the bottom of the epitaxial wafer 6 placed in the frame 501 and preventing the epitaxial wafer 6 from slipping off the bottom of the frame 501; through putting into a plurality of standing grooves 502 a plurality of epitaxial wafer 6 in proper order, the backing roll 504 supports the bottom of epitaxial wafer 6 simultaneously, realizes holding epitaxial wafer 6 to follow-up washing to epitaxial wafer 6.
More specifically, the placement frame 5 further includes a bottom frame 505, which is fixedly disposed at the outer side of the bottom end of the frame 501, and the bottom frame 505 and the frame 501 can be fixed and detached by a connecting piece; the connecting parts 506 are symmetrically and fixedly arranged at two ends of the top of the bottom frame 505, and the connecting parts 506 are matched with the mechanical arms and can move the placement frame 5; through setting up underframe 505 in order to increase the area of contact between the bottom of the pool of support body 501 and wash pond to this stability that improves rack 5 in the cleaning process, when removing rack 5, the arm can snatch linking portion 506, with this realization removes rack 5.
The pressing component 7 is rotatably arranged on two sides of the top of the placing frame 5, and the pressing component 7 can limit the epitaxial wafer 6 in the placing frame 5.
Specifically, the pressing component 7 includes a rotating frame 701, the middle of which is rotatably disposed at the top end of the frame 501 and can rotate around the connection position with the frame 501; a pressing plate 702 fixedly provided on the top end of the turret 701, the pressing plate 702 being capable of pressing the epitaxial wafer 6 in the placement frame 5; a flexible portion 703 fixedly provided on the top end of the platen 702, the flexible portion 703 being capable of avoiding the platen 702 from being crushed by the external sheet 6; a mounting rod 704 fixedly provided at the bottom end of the rotating frame 701; a float 705 fixedly arranged on the mounting rod 704, wherein the float 705 drives the rotating frame 701 to rotate after receiving buoyancy provided by the liquid; the float 705 floats upwards through the buoyancy of the liquid, and the float 705 drives the rotating frame 701 to rotate around the joint of the rotating frame and the frame body 501, so that the pressing plate 702 downwards abuts against the circumference of the epitaxial wafer 6, and the epitaxial wafer 6 is prevented from floating due to the buoyancy of the liquid.
More specifically, a limiting pin is fixedly arranged on one side of the rotating frame 701, which is close to the buoy 705, and when the buoy 705 is not subjected to buoyancy, the limiting pin is propped against the side surface of the frame body 501, so that the rotating frame 701 is in an inclined downward state, and the rotating frame 701 is driven to rotate after the buoy 705 is subjected to buoyancy.
The spraying components 8 are fixedly arranged on two sides of the top of the placing frame 5, and the spraying components 8 are matched with the pressing components 7 on the same side, so that the side faces of the epitaxial wafer 6 can be comprehensively sprayed.
Specifically, the spray assembly 8 includes a liquid guiding box 801 fixedly disposed at the top end of the frame 501; a liquid channel 802 which is opened inside the frame 501 and has one end penetrating to the bottom end of the frame 501 and the other end penetrating to the top end of the frame 501; a first liquid guide tube 803 which is provided in communication between the liquid guide box 801 and the liquid channel 802; the liquid outlet hole 804 is arranged on the side surface of the liquid guide box 801 in a penetrating way; the liquid collecting cavity 805 is arranged in the pressure plate 702, and a second liquid guide tube 806 is communicated between the liquid collecting cavity 805 and the liquid outlet hole 804; a plurality of groups of spray holes 807 are arranged and penetrate through one side of the pressing plate 702, and each group of spray holes 807 corresponds to two side surfaces of one epitaxial wafer 6; a rotating rod 808 fixedly arranged in the middle of the rotating frame 701, wherein the rotating rod 808 penetrates through the liquid guide box 801, and the connection part between the rotating rod 808 and the liquid guide box 801 is kept sealed; the water blocking plate 809 is fixedly arranged in the middle of the rotating rod 808 and is rotatably arranged in the liquid guide box 801, and the water blocking plate 809 is always kept sealed with the inner wall of the liquid guide box 801 in the rotating process; the elastic piece 810 is fixedly arranged between the top of the water blocking plate 809 and the inner side wall of the liquid guide box 801, the elastic piece 810 can enable the water blocking plate 809 to automatically recover to a horizontal state when the water blocking plate 809 is not affected by external force, namely, the rotating frame 701 is in an inclined downward state, and the pressing assembly 7 is in a mutually far-away state at the moment, so that the epitaxial wafer 6 can be conveniently taken into the storage rack 5.
Through liquid entering the liquid guide box 801 from the liquid channel 802 and the first liquid guide pipe 803, the water blocking plate 809 rotates in the liquid guide box 801, the water blocking plate 809 drives the rotating frame 701 to rotate through the rotating rod 808, the pressing plate 702 is propped against the circumference of the epitaxial wafer 6 downwards, in the process, the water blocking plate 809 rotates to pass through the liquid outlet hole 804, the liquid enters the liquid collecting cavity 805 through the liquid outlet hole 804 and the second liquid guide pipe 806, and the side surface of the epitaxial wafer 6 is sprayed through the spraying hole 807.
More specifically, the spray holes 807 include a first inclined hole 8071 and a second inclined hole 8072, and the spray directions of the first inclined hole 8071 and the second inclined hole 8072 are close; by arranging the first inclined holes 8071 and the second inclined holes 8072 with the spraying directions close to each other, each group of spraying holes 807 can spray liquid to two sides of the corresponding epitaxial wafer 6 in an inclined manner, so that the spraying coverage of the epitaxial wafer 6 is increased.
The driving component 9 is arranged in the main body 1 and penetrates into the three-stage cleaning tank 4, and the driving component 9 can drive the epitaxial wafer 6 to rotate in the rack 5.
Specifically, the driving assembly 9 includes a power chamber 901, which is opened at the rear side of the main body 1; a drive motor 902 fixedly provided in the power chamber 901, and having an output end fixedly provided with a drive shaft 903; the transmission shaft 904 is rotatably arranged in the three-stage cleaning tank 4, one end of the transmission shaft 904 is in transmission connection with the driving shaft 903 through a bevel gear set, and the transmission shaft 904 can drive the epitaxial wafer 6 to rotate in the placing frame 5; a cover 905 detachably mounted to the rear side of the power chamber 901; the driving motor 902 drives the driving shaft 903 to rotate, and the driving shaft 903 drives the driving shaft 904 to rotate through the bevel gear set, so that the driving shaft 904 can drive the epitaxial wafer 6 contacted with the driving shaft to rotate.
A circulation tank 10 provided inside the main body 1 and located below the three-stage washing tank 4, the circulation tank 10 being for accommodating liquid discharged from the three-stage washing tank 4; the bottom of the three-stage cleaning tank 4 is provided with a drain valve communicated to the circulating tank 10, and the drain valve can be provided in plurality so as to quickly drain the liquid in the three-stage cleaning tank 4 into the circulating tank 10.
The pump liquid component 11 is arranged in the circulation tank 10 and is communicated with the two groups of spraying components 8, and can supply liquid to the two groups of spraying components 8.
Specifically, the pump assembly 11 includes a water pump 1101 fixedly disposed inside the circulation tank 10, and a water pumping end thereof extends to a bottom of the circulation tank 10; a pump liquid pipe 1102 which communicates with the water outlet end of the water pump 1101; the inserting grooves 1103 are uniformly formed in the bottom of the three-stage cleaning tank 4, the inserting grooves 1103 can limit the bottom end of the frame 501 placed in the three-stage cleaning tank 4, and after the frame 501 is placed in place in the three-stage cleaning tank 4, the bottom of the frame 501 is inserted into the inserting grooves 1103 and keeps sealing with the inserting grooves 1103; the butt joint 1104 is fixedly arranged at the bottom of the three-stage cleaning tank 4, the number and the positions of the butt joint 1104 are corresponding to those of the plug-in grooves 1103, the top ends of the butt joint 1104 are communicated with the bottom ends of the liquid channels 802 after the frame 501 is put into the three-stage cleaning tank 4; a manifold 1105 having one end in communication with the docking head 1104 and the other end in communication with the pump fluid tube 1102; the water in the circulating tank 10 is pumped into the butt joint 1104 through the pump liquid pipe 1102 by the water pump 1101, and then enters the liquid channel 802 through the butt joint 1104, so that the liquid is supplied to the spray assembly 8.
And a drying unit 12, wherein the drying unit 12 is capable of blowing air to the epitaxial wafer 6, thereby drying the cleaned epitaxial wafer 6.
Specifically, the drying assembly 12 includes two air ducts 1201, which are symmetrically and slidably disposed on two sides of the inner wall of the three-stage cleaning tank 4, one end of each of the two air ducts 1201 penetrates into the power chamber 901, the air ducts 1201 are connected with an external air pump, the air pump is not shown in the drawings, and the drying gas can be inert gas such as nitrogen; a gas shower head 1202 provided in communication with the gas duct 1201; a cross bar 1203 fixedly provided between the two air ducts 1201 and located inside the power chamber 901; a return spring 1204, one end of which is fixedly connected to the cross bar 1203, and the other end of which abuts against the cover 905; a cam 1205 fixedly provided on the drive shaft 903; a bump 1206 fixedly provided on one side of the cross bar 1203, and cooperating with the return spring 1204 when the cam 1205 rotates, the bump 1206 being capable of intermittently forcing the cross bar 1203 to move; the air is pumped into the air duct 1201 by an external air pump, and the air is blown to the epitaxial wafer 6 by the air shower head 1202, thereby drying the epitaxial wafer 6.
In summary, when the device is used, the placing frame 5 provided with the epitaxial wafer 6 is soaked into the first-stage cleaning tank 2 and the second-stage cleaning tank 3 in sequence through the mechanical arm to clean, so that pollutants, photoresist and organic residues attached to the surface of the epitaxial wafer 6 are removed, then the placing frame 5 is soaked into the third-stage cleaning tank 4 provided with deionized water, in the process that the placing frame 5 is placed down into the third-stage cleaning tank 4, the deionized water can generate upward buoyancy to the buoy 705, the buoy 705 drives the rotating frame 701 to rotate, the pressing plate 702 is pressed on the circumference of the epitaxial wafer 6, and the epitaxial wafer 6 is prevented from slipping from the placing frame 5 due to upward floatation in the soaking process; after the rack 5 is placed in place, the bottom of the circumference of the epitaxial wafer 6 will be abutted against the transmission shaft 904, and as the driving motor 902 drives the transmission shaft 904 to rotate, the epitaxial wafer 6 will rotate along with the transmission shaft 904 under the action of friction force, and since the pressing plate 702 always applies downward pressure to the epitaxial wafer 6, the epitaxial wafer 6 can be always in a tight abutted state with the transmission shaft 904, and slipping between the epitaxial wafer 6 and the transmission shaft 904 is avoided.
After the soaking duration is reached, the deionized water in the three-stage cleaning pool 4 is discharged into the circulating pool 10 through the drain valve, at the moment, the floats 705 are not subjected to buoyancy any more, the rotating frame 701 is restored to the initial position, the pressure plate 702 is not limited to the epitaxial wafer 6 any more, the spray assembly 8 is supplied with liquid through the liquid pumping assembly 11, the deionized water enters the liquid guide box 801 and pushes the water blocking plate 809 to rotate, the rotating frame 701 drives the pressure plate 702 to be pressed on the circumference of the epitaxial wafer 6 again, the epitaxial wafer 6 is limited again, and meanwhile, the side surface of the epitaxial wafer 6 is sprayed by the deionized water through the spray holes 807.
After the spraying is finished, the epitaxial wafer 6 is blown and dried by using the drying component 12, in the process, the driving shaft 903 drives the cam 1205 to rotate continuously, the cam 1205 forces the cross rod 1203 to move through the protruding block 1206, and under the cooperation of the reset spring 1204, the cross rod 1203 drives the air duct 1201 and the air nozzle 1202 to translate repeatedly, so that the blowing range is more comprehensive, and the drying effect is improved.
It should be noted that, the driving assembly 9 is in a working state in the processes of soaking, spraying and drying, so that the epitaxial wafer 6 is always in a state of rotating in the placing frame 5, and therefore all sides of the epitaxial wafer 6 are cleaned and dried, and cleaning and drying effects on the epitaxial wafer 6 are improved.
Through the cooperation of the pressing component 7, the spraying component 8 and the liquid pumping component 11, the pressing plate 702 can be always pressed on the circumference of the epitaxial wafer 6 in the soaking and cleaning process, so that the problem that the epitaxial wafer 6 floats due to buoyancy in the soaking process is effectively avoided, and the epitaxial wafer 6 is ensured to be always and stably positioned in the placing frame 5; in the spraying process, the pressing component 7 presses the circumference of the epitaxial wafer 6 under the action of the spraying component 8, and at the moment, the plurality of groups of spraying holes 807 are all positioned at positions close to the circumference of the corresponding epitaxial wafer 6, deionized water is sprayed to two sides of the corresponding epitaxial wafer 6 in an inclined mode through the first inclined holes 8071 and the second inclined holes 8072, so that the spraying coverage of the epitaxial wafer 6 is increased, and the spraying cleaning effect of the epitaxial wafer 6 is improved.
Through setting up drive assembly 9 for epitaxial wafer 6 is in the state of rotating in rack 5 all the time in soaking, spraying and drying process, so that the side of epitaxial wafer 6 everywhere all obtains wasing and drying, prevents to appear wasing and drying dead angle, improves wasing and drying effect to epitaxial wafer 6.
Through setting up and compressing tightly subassembly 7, clamp plate 702 exerts decurrent pressure to epitaxial wafer 6 all the time for epitaxial wafer 6 can be all the time with transmission shaft 904 inseparable butt, with this takes place to skid between epitaxial wafer 6 and the transmission shaft 904, guarantees the transmission efficiency between epitaxial wafer 6 and the transmission shaft 904.
The invention also provides a surface pretreatment method of the epitaxial wafer, which comprises the following steps:
Step one, primary cleaning, namely sequentially placing a plurality of epitaxial wafers 6 to be cleaned into a placing frame 5, soaking the placing frame 5 with the epitaxial wafers 6 into a primary cleaning pool 2 through a mechanical arm for ultrasonic cleaning, and removing pollutants attached to the surfaces of the epitaxial wafers 6;
step two, secondary cleaning, namely immersing the epitaxial wafer 6 subjected to primary cleaning into a secondary cleaning tank 3 filled with preheated acetone for cleaning, removing photoresist and organic matter residues on the surface of the epitaxial wafer 6, wherein an ultrasonic vibration device can be added in the secondary cleaning tank 3 so as to improve the immersing cleaning effect;
Step three, three-stage cleaning, namely placing the epitaxial wafer 6 subjected to the two-stage cleaning into a three-stage cleaning tank 4 filled with deionized water for soaking cleaning, and after soaking for a specified time, spraying and cleaning the epitaxial wafer 6 to thoroughly remove chemical substances remained on the surface of the epitaxial wafer 6;
and step four, drying, namely blowing air to the epitaxial wafer 6 through the drying assembly 12 to remove residual moisture on the surface of the epitaxial wafer 6, wherein inert gases such as high-temperature nitrogen can be adopted as the gas used for drying.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present invention, and although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present invention.
Claims (10)
1. Epitaxial wafer surface preprocessing device, including main part (1), first order washs pond (2), second grade washs pond (3) and tertiary washs pond (4) have been seted up in proper order at the top of main part (1), its characterized in that still includes:
The placing rack (5) can be used for accommodating and placing a plurality of epitaxial wafers (6) and sequentially placing the epitaxial wafers (6) into the primary cleaning tank (2), the secondary cleaning tank (3) and the tertiary cleaning tank (4) for cleaning through the mechanical arm;
The pressing assemblies (7) are rotatably arranged on two sides of the top of the placing frame (5), and the pressing assemblies (7) can limit the epitaxial wafer (6) to the inside of the placing frame (5);
the spraying components (8) are fixedly arranged on two sides of the top of the placing frame (5), and the spraying components (8) are matched with the pressing components (7) on the same side, so that the lateral surfaces of the epitaxial wafer (6) can be comprehensively sprayed;
The driving assembly (9) is arranged in the main body (1) and penetrates into the three-stage cleaning tank (4), and the driving assembly (9) can drive the epitaxial wafer (6) to rotate in the rack (5);
The circulating tank (10) is arranged in the main body (1) and is positioned below the three-stage cleaning tank (4), and the circulating tank (10) is used for accommodating liquid discharged from the three-stage cleaning tank (4);
the pump liquid component (11) is arranged in the circulating pool (10) and is communicated with the two groups of spraying components (8), and can supply liquid to the two groups of spraying components (8).
2. The epitaxial wafer surface pretreatment device according to claim 1, wherein: the rack (5) comprises:
A frame (501);
The placing grooves (502) are uniformly formed in the middle of the frame body (501), and the placing grooves (502) can be used for accommodating epitaxial wafers (6);
a through groove (503) which is arranged on two sides of the frame body (501) in a penetrating way;
And a support roller (504) rotatably provided in the middle of the frame (501), wherein the support roller (504) can support the bottom of the epitaxial wafer (6) placed in the frame (501).
3. The epitaxial wafer surface pretreatment apparatus according to claim 2, wherein: the rack (5) further comprises:
A bottom frame (505) fixedly arranged outside the bottom end of the frame body (501);
The connecting parts (506) are symmetrically and fixedly arranged at two ends of the top of the bottom frame (505), and the connecting parts (506) are matched with the mechanical arms and can move the placing frame (5).
4. The epitaxial wafer surface pretreatment apparatus according to claim 2, wherein: the hold-down assembly (7) comprises:
the middle part of the rotating frame (701) is rotatably arranged at the top end of the frame body (501) and can rotate around the joint of the rotating frame and the frame body (501);
A pressing plate (702) fixedly arranged at the top end of the rotating frame (701), wherein the pressing plate (702) can press the epitaxial wafer (6) in the placing frame (5);
A flexible portion (703) fixedly provided on the distal end of the platen (702);
a mounting rod (704) fixedly arranged at the bottom end of the rotating frame (701);
the buoy (705) is fixedly arranged on the mounting rod (704), and the buoy (705) drives the rotating frame (701) to rotate after being subjected to buoyancy provided by liquid.
5. The epitaxial wafer surface pretreatment device according to claim 4, wherein: the spray assembly (8) comprises:
a liquid guiding box (801) fixedly arranged at the top end of the frame body (501);
a liquid channel (802) which is provided inside the frame body (501) and has one end penetrating to the bottom end of the frame body (501) and the other end penetrating to the top end of the frame body (501);
a first liquid guide tube (803) which is provided in communication between the liquid guide box (801) and the liquid channel (802);
a liquid outlet hole (804) which penetrates through the side surface of the liquid guide box (801);
the liquid collecting cavity (805) is arranged in the pressing plate (702), and a second liquid guide tube (806) is communicated between the liquid collecting cavity (805) and the liquid outlet hole (804);
The spraying holes (807) are arranged in a plurality of groups and penetrate through one side of the pressing plate (702), and each group of spraying holes (807) corresponds to two side surfaces of one epitaxial wafer (6) respectively;
the rotating rod (808) is fixedly arranged in the middle of the rotating frame (701), and the rotating rod (808) penetrates through the liquid guide box (801);
the water blocking plate (809) is fixedly arranged in the middle of the rotating rod (808) and rotatably arranged in the liquid guide box (801), and the water blocking plate (809) is always kept sealed with the inner wall of the liquid guide box (801) in the rotating process;
And the elastic piece (810) is fixedly arranged between the top of the water blocking plate (809) and the inner side wall of the liquid guide box (801).
6. The epitaxial wafer surface pretreatment apparatus according to claim 5, wherein: the spray holes (807) comprise a first inclined hole (8071) and a second inclined hole (8072), and the spray directions of the first inclined hole (8071) and the second inclined hole (8072) are close to each other.
7. The epitaxial wafer surface pretreatment device according to claim 1, wherein: the drive assembly (9) comprises:
a power chamber (901) which is provided on the rear side of the main body (1);
a drive motor (902) fixedly arranged in the power chamber (901), and the output end of the drive motor is fixedly provided with a drive shaft (903);
The transmission shaft (904) is rotatably arranged in the three-stage cleaning pool (4), one end of the transmission shaft is in transmission connection with the driving shaft (903) through a bevel gear set, and the transmission shaft (904) can drive the epitaxial wafer (6) to rotate in the placing frame (5);
and a cover 905 detachably attached to the rear side of the power chamber 901.
8. The epitaxial wafer surface pretreatment apparatus according to claim 5, wherein: the pump assembly (11) comprises:
The water pump (1101) is fixedly arranged in the circulating tank (10), and the water pumping end of the water pump extends to the bottom of the circulating tank (10);
A pump liquid pipe (1102) which is communicated with the water outlet end of the water pump (1101);
The inserting grooves (1103) are uniformly formed in the bottom of the three-stage cleaning tank (4), and the inserting grooves (1103) can limit the bottom end of the frame body (501) placed in the three-stage cleaning tank (4);
The butt joint (1104) is fixedly arranged at the bottom of the three-stage cleaning tank (4), the number and the positions of the butt joint are corresponding to those of the plug grooves (1103), and after the frame body (501) is placed in the three-stage cleaning tank (4), the top end of the butt joint (1104) is communicated with the bottom end of the liquid channel (802);
a manifold (1105) having one end in communication with the docking head (1104) and the other end in communication with the pump fluid tube (1102).
9. The epitaxial wafer surface pretreatment device according to claim 7, wherein: further comprising a drying assembly (12), the drying assembly (12) comprising:
The two air ducts (1201) are symmetrically and slidably arranged on two sides of the inner wall of the three-stage cleaning tank (4), and one ends of the two air ducts (1201) penetrate into the power chamber (901);
a gas shower head (1202) which is provided in communication with the gas duct (1201);
a cross bar (1203) fixedly arranged between the two air ducts (1201) and positioned inside the power chamber (901);
a return spring (1204) having one end fixedly connected to the cross bar (1203) and the other end abutting against the cover (905);
A cam (1205) fixedly provided on the drive shaft (903);
and a projection (1206) fixedly provided on one side of the cross bar (1203), and the cam (1205) can intermittently force the cross bar (1203) to move by the projection (1206) when rotating.
10. The epitaxial wafer surface pretreatment method applied to the epitaxial wafer surface pretreatment device of claim 9 is characterized by comprising the following steps:
firstly, primary cleaning, namely immersing a rack (5) provided with epitaxial wafers (6) into a primary cleaning pool (2) through a mechanical arm for ultrasonic cleaning, and removing pollutants attached to the surfaces of the epitaxial wafers (6);
step two, secondary cleaning, namely immersing the epitaxial wafer (6) subjected to primary cleaning into a secondary cleaning tank (3) filled with acetone for cleaning, and removing photoresist and organic residues on the surface of the epitaxial wafer (6);
Step three, three-stage cleaning, namely placing the epitaxial wafer (6) subjected to the two-stage cleaning into a three-stage cleaning tank (4) filled with deionized water for soaking and spraying, and thoroughly removing chemical substances remained on the surface of the epitaxial wafer (6);
And fourthly, drying, namely blowing air to the epitaxial wafer (6) through the drying assembly (12), and removing residual moisture on the surface of the epitaxial wafer (6).
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