CN118770930A - Photonic chip detection mechanism and detection machine - Google Patents

Photonic chip detection mechanism and detection machine Download PDF

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Publication number
CN118770930A
CN118770930A CN202410874690.7A CN202410874690A CN118770930A CN 118770930 A CN118770930 A CN 118770930A CN 202410874690 A CN202410874690 A CN 202410874690A CN 118770930 A CN118770930 A CN 118770930A
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frame
positioning lifting
detection
lifting frame
transfer seat
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CN118770930B (en
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王一东
彭世云
王凯
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Chuzhou Aiwofu Photoelectric Technology Co ltd
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Chuzhou Aiwofu Photoelectric Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G35/00Mechanical conveyors not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22Devices influencing the relative position or the attitude of articles during transit by conveyors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02Articles
    • B65G2201/0235Containers
    • B65G2201/0258Trays, totes or bins

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

本发明公开了一种光子芯片检测机构及检测机,涉及芯片检测技术领域,还包括移送座,所述移送座安装于检测台的台面上,且移送座内竖直滑动安装有承托板,所述承托板顶部嵌设有芯片放置盘,所述承托板与芯片放置盘之间安装有调节夹具,机架,其固定于检测台顶部,且机架内安装有驱动件和与驱动件单向传动的定位升降架,机架顶部安装有检测头。本发明通过设置移送座来将承托板移送至机架处,当承托板位于定位升降架上并推动定位升降架后,迫使定位升降架与驱动件传动连接,利用驱动件带动定位升降架平缓升起,升起的过程中调节夹具将芯片放置盘和承托盘牢牢固定,避免芯片放置盘晃动松脱,检测头对芯片表面进行检测。

The present invention discloses a photon chip detection mechanism and a detection machine, which relates to the field of chip detection technology, and also includes a transfer seat, the transfer seat is installed on the table of the detection table, and a support plate is vertically slidably installed in the transfer seat, a chip placement tray is embedded on the top of the support plate, and an adjustment fixture is installed between the support plate and the chip placement tray, a frame is fixed to the top of the detection table, and a driving member and a positioning lifting frame that is unidirectionally transmitted with the driving member are installed in the frame, and a detection head is installed on the top of the frame. The present invention transfers the support plate to the frame by setting a transfer seat. When the support plate is located on the positioning lifting frame and pushes the positioning lifting frame, the positioning lifting frame is forced to be connected to the driving member in transmission, and the driving member is used to drive the positioning lifting frame to rise smoothly. During the rising process, the adjustment fixture firmly fixes the chip placement tray and the support tray to prevent the chip placement tray from shaking and loosening, and the detection head detects the chip surface.

Description

一种光子芯片检测机构及检测机Photonic chip detection mechanism and detection machine

技术领域Technical Field

本发明涉及芯片检测技术领域,具体为一种光子芯片检测机构及检测机。The present invention relates to the technical field of chip detection, and in particular to a photon chip detection mechanism and a detection machine.

背景技术Background Art

光子芯片采用光波(电磁波)来作为信息传输或数据运算的载体,一般依托于集成光学或硅基光电子学中介质光波导来传输导模光信号,将光信号和电信号的调制、传输、解调等集成在同一块衬底或芯片上,光子芯片在出厂前需要经过多重复杂的检测,其中一步就是通过观察芯片的物理特征,判断芯片的质量和性能是否符合要求,主要的物理检测方法包括光学显微镜检测、扫描电子显微镜检测、原子力显微镜检测、X射线衍射检测等,这些检测方法用于观察芯片表面的形貌、结构、缺陷。Photonic chips use light waves (electromagnetic waves) as a carrier for information transmission or data calculation. They generally rely on dielectric optical waveguides in integrated optics or silicon-based optoelectronics to transmit guided-mode optical signals, integrating the modulation, transmission, and demodulation of optical and electrical signals on the same substrate or chip. Photonic chips need to undergo multiple complex tests before leaving the factory. One step is to observe the physical characteristics of the chip to determine whether the quality and performance of the chip meet the requirements. The main physical detection methods include optical microscopy, scanning electron microscopy, atomic force microscopy, X-ray diffraction, etc. These detection methods are used to observe the morphology, structure, and defects of the chip surface.

现有的专利申请的专利公开号为:CN112114247B,公开日为2024年03月29日,该专利的名称为“一种芯片检测装置”,该专利包括底座和放置座,所述底座的内部安装有定位板,且定位板的上方安置有工作台,所述工作台的底部焊接有支撑块,且支撑块的左右两侧表面设置有卡槽,所述卡槽的外侧设置有定位杆,且定位杆的外侧滑动连接有卡座,所述卡座的上方设置有防尘罩,所述工作台的左右两侧均安装有转盘,该芯片检测装置设置有定位板,定位板与支撑块之间相互配合使用,能够对支撑块的移动方向进行定位引导,皮带与转轴之间的设置,能够借助两者之间的转动关系,通过拉动皮带,来移动支撑块,这样便于将工作台从防尘罩中取出,从而拿出被检测的芯片,有利于防止灰尘落入防尘罩的内部。The patent publication number of the existing patent application is: CN112114247B, and the publication date is March 29, 2024. The name of the patent is "A chip detection device". The patent includes a base and a placement seat. A positioning plate is installed inside the base, and a workbench is placed above the positioning plate. A support block is welded to the bottom of the workbench, and a card slot is provided on the left and right surfaces of the support block. A positioning rod is provided on the outside of the card slot, and a card seat is slidably connected to the outside of the positioning rod. A dust cover is provided above the card seat, and a turntable is installed on both sides of the left and right sides of the workbench. The chip detection device is provided with a positioning plate, and the positioning plate and the support block cooperate with each other to position and guide the moving direction of the support block. The setting between the belt and the rotating shaft can use the rotational relationship between the two to move the support block by pulling the belt, so that it is convenient to take the workbench out of the dust cover, thereby taking out the chip to be tested, which is beneficial to prevent dust from falling into the inside of the dust cover.

上述申请具有不足之处,在一般检测过程中,需要将芯片的高度抬升至显微镜能够检测的高度,一般都是通过驱动件来驱动其升降,其升降的速度相同,若速度过快,则无法保证抬升时检测的准确性,而若速度过慢,则下降复位的时间较长,影响整体检测效果,并且一般都需要工作人员来将芯片放置盘进行固定,不然无法保证其升降过程中的稳定。The above application has shortcomings. In the general detection process, the chip needs to be raised to a height that can be detected by a microscope. Generally, the lifting and lowering are driven by a driving member, and the lifting and lowering speeds are the same. If the speed is too fast, the accuracy of the detection during the lifting cannot be guaranteed. If the speed is too slow, the time for descending and resetting is longer, affecting the overall detection effect. In addition, staff are generally required to fix the chip placement plate, otherwise its stability during the lifting process cannot be guaranteed.

发明内容Summary of the invention

本发明的目的是提供一种光子芯片检测机构及检测机,以解决上述现有技术中的不足之处。The purpose of the present invention is to provide a photonic chip detection mechanism and a detection machine to solve the deficiencies in the above-mentioned prior art.

为了实现上述目的,本发明提供如下技术方案:In order to achieve the above object, the present invention provides the following technical solutions:

一种光子芯片检测机构,包括检测台,还包括移送座,所述移送座安装于检测台的台面上,且移送座内竖直滑动安装有承托板,所述承托板顶部嵌设有芯片放置盘,所述承托板与芯片放置盘之间安装有调节夹具,机架,其固定于检测台顶部,且机架内安装有驱动件和与驱动件单向传动的定位升降架,机架顶部安装有检测头,当所述移送座带着承托板推移定位升降架后,所述驱动件带动定位升降架抬升,并使调节夹具将芯片放置盘固定于承托板上,当所述定位升降架抬至检测高度后,其在重力作用下复位,并使调节夹具松开芯片放置盘。A photon chip detection mechanism comprises a detection platform and a transfer seat, wherein the transfer seat is installed on the table surface of the detection platform, and a supporting plate is vertically slidably installed in the transfer seat, a chip placement tray is embedded in the top of the supporting plate, an adjustment fixture is installed between the supporting plate and the chip placement tray, and a frame is fixed to the top of the detection platform, and a driving member and a positioning lifting frame that is unidirectionally transmitted with the driving member are installed in the frame, and a detection head is installed on the top of the frame. When the transfer seat pushes the positioning lifting frame with the supporting plate, the driving member drives the positioning lifting frame to rise, and the adjusting fixture fixes the chip placement tray on the supporting plate. When the positioning lifting frame is lifted to the detection height, it is reset under the action of gravity, and the adjusting fixture releases the chip placement tray.

优选的,所述移送座与检测台之间安装有线性电机,所述承托板两侧均固定连接有插杆,所述移送座两侧均竖直开设有与插杆相匹配的通槽。Preferably, a linear motor is installed between the transfer seat and the detection platform, plug rods are fixedly connected to both sides of the support plate, and through grooves matching the plug rods are vertically opened on both sides of the transfer seat.

优选的,所述承托板顶面开设有与芯片放置盘相匹配的容纳槽,所述容纳槽内壁两侧均开设有开口,且开口与容纳槽相连通。Preferably, a receiving groove matching the chip placement plate is formed on the top surface of the supporting plate, and openings are formed on both sides of the inner wall of the receiving groove, and the openings are communicated with the receiving groove.

优选的,所述调节夹具包括弹性安装于开口内侧的卡接架,所述移送座内侧壁于卡接架的下方固定连接有抵接架,所述抵接架与卡接架倾斜相抵。Preferably, the adjustment fixture comprises a clamping frame elastically mounted on the inner side of the opening, and an abutting frame is fixedly connected to the inner side wall of the transfer seat below the clamping frame, and the abutting frame is inclined against the clamping frame.

优选的,所述驱动件包括滑动安装于机架顶部的连接架,所述机架内转动安装有与连接架螺纹连接的丝杆,所述连接架内转动安装有电动轴杆,所述电动轴杆上对称安装有驱动齿轮,所述机架内对称安装有导向板,所述导向板上开设有供电动轴杆平移的导向槽。Preferably, the driving member includes a connecting frame slidably installed on the top of the frame, a screw rod threadably connected to the connecting frame is rotatably installed in the frame, an electric shaft rod is rotatably installed in the connecting frame, driving gears are symmetrically installed on the electric shaft rod, and a guide plate is symmetrically installed in the frame, and a guide groove for the electric shaft rod to translate is opened on the guide plate.

优选的,所述定位升降架外侧竖直开设有滑槽,所述滑槽内滑动安装有插接滑块,所述导向板上水平开设有与插接滑块相匹配的导轨,所述导轨内壁一侧与插接滑块之间固定连接有顶簧,所述定位升降架一侧固定连接有与驱动齿轮相适配的传动齿条,所述丝杆外固定套设有第一凸轮,所述定位升降架顶部与第一凸轮凸起部抵接配合。Preferably, a slide groove is vertically opened on the outer side of the positioning lifting frame, a plug-in slider is slidably installed in the slide groove, a guide rail matching the plug-in slider is horizontally opened on the guide plate, a top spring is fixedly connected between one side of the inner wall of the guide rail and the plug-in slider, a transmission rack matching the driving gear is fixedly connected to one side of the positioning lifting frame, a first cam is provided on the outer fixed sleeve of the screw rod, and the top of the positioning lifting frame abuts and cooperates with the protrusion of the first cam.

优选的,所述所述丝杆外固定套设有第二凸轮,且第二凸轮的凸起部与第一凸轮的凸起部方向相反,所述导向板外侧竖直滑动安装有顶杆,所述插接滑块端部固定连接有楔形抵块,所述顶杆底部与楔形抵块相抵,顶部与第二凸轮的凸起部相抵。Preferably, the outer fixed sleeve of the screw rod is provided with a second cam, and the raised portion of the second cam is in the opposite direction to the raised portion of the first cam, a push rod is vertically slidably installed on the outer side of the guide plate, a wedge-shaped stop block is fixedly connected to the end of the plug-in slider, the bottom of the push rod is against the wedge-shaped stop block, and the top is against the raised portion of the second cam.

优选的,所述机架内部滑动安装有一对防尘罩,所述检测头位于一对防尘罩之间,所述检测头外转动套接有调节齿环,两个所述防尘罩上分别固定有与调节齿环啮合的调节齿条,其中一所述防尘罩的底部固定连接有连接支架,所述连接支架分别与两个定位升降架滑动连接。Preferably, a pair of dust covers are slidably installed inside the frame, the detection head is located between the pair of dust covers, an adjusting gear ring is rotatably sleeved outside the detection head, and the two dust covers are respectively fixed with adjusting racks that mesh with the adjusting gear rings, and a connecting bracket is fixedly connected to the bottom of one of the dust covers, and the connecting bracket is slidably connected to the two positioning lifting frames.

优选的,所述定位升降架内壁底部固定连接有挡块,所述挡块中开设有与插杆相适配的卡槽。Preferably, a stopper is fixedly connected to the bottom of the inner wall of the positioning lifting frame, and a slot matching the insertion rod is provided in the stopper.

一种检测机,包括上述的光子芯片检测机构。A detection machine comprises the above-mentioned photonic chip detection mechanism.

在上述技术方案中,通过设置移送座来将承托板移送至机架处,当承托板位于定位升降架上并推动定位升降架后,迫使定位升降架与驱动件传动连接,利用驱动件带动定位升降架平缓升起,升起的过程中调节夹具将芯片放置盘和承托盘牢牢固定,避免芯片放置盘晃动松脱,接着在定位升降架带着承托板抬升到检测头能够检测的高度后,检测头对芯片表面进行检测,同时定位升降架在检测高度后会让驱动件与其断开传动,使定位升降架的复位下降依靠自身重力,从而实现快速复位,并在完全复位后调节夹具也会松开芯片放置盘,当移送座将承托板送出机架后,方便对芯片放置盘进行抓取,提高检测的效率。In the above technical scheme, a transfer seat is provided to transfer the support plate to the rack. When the support plate is located on the positioning lifting frame and the positioning lifting frame is pushed, the positioning lifting frame is forced to be connected to the driving member for transmission. The driving member is used to drive the positioning lifting frame to rise smoothly. During the rising process, the clamp is adjusted to firmly fix the chip placement tray and the support tray to prevent the chip placement tray from shaking and loosening. Then, after the positioning lifting frame lifts the support plate to a height that the detection head can detect, the detection head detects the surface of the chip. At the same time, the positioning lifting frame will disconnect the transmission of the driving member from it after reaching the detection height, so that the reset and descent of the positioning lifting frame depends on its own gravity, thereby realizing rapid reset. After the complete reset, the adjustment clamp will also release the chip placement tray. When the transfer seat sends the support plate out of the rack, it is convenient to grab the chip placement tray, thereby improving the efficiency of detection.

应当理解,前面的一般描述和以下详细描述都仅是示例性和说明性的,而不是用于限制本公开。It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

本申请文件提供本公开中描述的技术的各种实现或示例的概述,并不是所公开技术的全部范围或所有特征的全面公开。This application document provides an overview of various implementations or examples of the technology described in the present disclosure, and is not a comprehensive disclosure of the entire scope or all features of the disclosed technology.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明中记载的一些实施例,对于本领域普通技术人员来讲,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

图1为本发明一种光子芯片检测机构的整体结构示意图;FIG1 is a schematic diagram of the overall structure of a photon chip detection mechanism of the present invention;

图2为本发明一种光子芯片检测机构的整体结构仰视图;FIG2 is a bottom view of the overall structure of a photon chip detection mechanism of the present invention;

图3为本发明一种光子芯片检测机构的侧剖视图;FIG3 is a side sectional view of a photonic chip detection mechanism of the present invention;

图4为本发明一种光子芯片检测机构的A处放大图;FIG4 is an enlarged view of point A of a photonic chip detection mechanism of the present invention;

图5为本发明一种光子芯片检测机构中机架内部结构示意图;FIG5 is a schematic diagram of the internal structure of a frame in a photon chip detection mechanism of the present invention;

图6为本发明一种光子芯片检测机构中承托板和芯片放置盘的结构示意图;FIG6 is a schematic structural diagram of a supporting plate and a chip placement plate in a photon chip detection mechanism of the present invention;

图7为本发明一种光子芯片检测机构中调节组件中移送座和承托板的内部结构示意图;FIG7 is a schematic diagram of the internal structure of a transfer seat and a support plate in an adjustment assembly in a photon chip detection mechanism of the present invention;

图8为本发明一种光子芯片检测机构的B处放大图;FIG8 is an enlarged view of point B of a photon chip detection mechanism of the present invention;

图9为本发明一种光子芯片检测机构中驱动件的结构示意图。FIG. 9 is a schematic diagram of the structure of a driving component in a photonic chip detection mechanism of the present invention.

附图标记说明:Description of reference numerals:

1、检测台;101、线性电机;2、移送座;201、承托板;202、芯片放置盘;203、插杆;204、通槽;205、容纳槽;206、开口;3、调节夹具;301、卡接架;302、抵接架;303、定位杆;304、压簧;4、机架;401、导向板;402、导向槽;403、导轨;404、顶簧;405、顶杆;406、导杆;5、驱动件;501、连接架;502、丝杆;503、电动轴杆;504、驱动齿轮;505、第一凸轮;506、第二凸轮;6、定位升降架;601、滑槽;602、插接滑块;603、传动齿条;604、楔形抵块;605、挡块;606、卡槽;7、检测头;701、调节齿环;8、防尘罩;801、调节齿条;802、连接支架。1. Test table; 101. Linear motor; 2. Transfer seat; 201. Support plate; 202. Chip placement plate; 203. Insertion rod; 204. Through slot; 205. Accommodation slot; 206. Opening; 3. Adjustment fixture; 301. Card holder; 302. Abutment frame; 303. Positioning rod; 304. Compression spring; 4. Frame; 401. Guide plate; 402. Guide slot; 403. Guide rail; 404. Top spring; 405. Top rod; 406. Guide Rod; 5. Driving member; 501. Connecting frame; 502. Screw rod; 503. Electric shaft rod; 504. Driving gear; 505. First cam; 506. Second cam; 6. Positioning lifting frame; 601. Slide groove; 602. Plug-in slider; 603. Transmission rack; 604. Wedge-shaped block; 605. Block; 606. Slot; 7. Detection head; 701. Adjusting gear ring; 8. Dust cover; 801. Adjusting rack; 802. Connecting bracket.

具体实施方式DETAILED DESCRIPTION

为使得本公开实施例的目的、技术方案和优点更加清楚,下面将结合本公开实施例的附图,对本公开实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本公开的一部分实施例,而不是全部的实施例。基于所描述的本公开的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本公开保护的范围。In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

请参阅图1-9,本发明实施例提供的一种光子芯片检测机构,包括检测台1,还包括移送座2,移送座2安装于检测台1的台面上,且移送座2内竖直滑动安装有承托板201,承托板201顶部嵌设有芯片放置盘202,承托板201与芯片放置盘202之间安装有调节夹具3,机架4,其固定于检测台1顶部,且机架4内安装有驱动件5和与驱动件5单向传动的定位升降架6,机架4顶部安装有检测头7,当移送座2带着承托板201推移定位升降架6后,驱动件5带动定位升降架6抬升,并使调节夹具3将芯片放置盘202固定于承托板201上,当定位升降架6抬至检测高度后,其在重力作用下复位,并使调节夹具3松开芯片放置盘202。Please refer to Figures 1-9. A photonic chip detection mechanism provided by an embodiment of the present invention includes a detection platform 1 and a transfer seat 2. The transfer seat 2 is installed on the table top of the detection platform 1, and a supporting plate 201 is vertically slidably installed in the transfer seat 2. A chip placement tray 202 is embedded on the top of the supporting plate 201. An adjustment fixture 3 and a frame 4 are installed between the supporting plate 201 and the chip placement tray 202. The frame 4 is fixed to the top of the detection platform 1, and a driving member 5 and a positioning lifting frame 6 that is unidirectionally driven by the driving member 5 are installed in the frame 4. A detection head 7 is installed on the top of the frame 4. When the transfer seat 2 pushes the positioning lifting frame 6 with the supporting plate 201, the driving member 5 drives the positioning lifting frame 6 to lift, and the adjusting fixture 3 fixes the chip placement tray 202 on the supporting plate 201. When the positioning lifting frame 6 is lifted to the detection height, it is reset under the action of gravity, and the adjusting fixture 3 releases the chip placement tray 202.

具体的,移送座2在检测台1上来回移动,用来将承托板201上的芯片放置盘202送入机架4中,以方便检测头7对芯片放置盘202上的芯片进行检测,多个芯片分别固定在芯片放置盘202中,芯片放置盘202再嵌在承托板201上,承托板201能够在移送座2内上下活动,当承托板201处在该上下活动区间的最底部时,调节夹具3松开芯片放置盘202,这时芯片放置盘202能够轻易的放置在承托板201上或者从承托板201上取下,而当承托板201离开该上下活动区间中的最底部后,调节夹具3又会将芯片放置盘202牢牢固定在承托板201上,由于承托板201能够上下活动,故当移送座2带着承托板201进入机架4后,移送座2的位置不会再次调整,将定位升降架6始终压向驱动件5,让驱动件5和定位升降架6之间进行传动,再利用驱动件5带动定位升降架6缓缓垂直抬起,通过定位升降架6的抬升使承托板201在移送座2中上移,并使调节夹具3始终将承托板201上的芯片放置盘202夹紧,避免承托板201在抬升或下降过程中芯片放置盘202松脱晃动,当定位升降架6带着芯片到达检测高度,检测头7检测完之后,让驱动件5和定位升降架6之间取消传动,使定位升降架6在自身重力以及承托板201的重力作用下快速下移复位,同时在承托板201完全复位到之前的高度后,调节夹具3又会松开芯片放置盘202,接着移送座2将承托板201重新送回机架4外部,方便进行下一步工序。Specifically, the transfer seat 2 moves back and forth on the detection table 1 to send the chip placement tray 202 on the supporting plate 201 into the rack 4, so as to facilitate the detection head 7 to detect the chips on the chip placement tray 202. Multiple chips are respectively fixed in the chip placement tray 202, and the chip placement tray 202 is embedded in the supporting plate 201. The supporting plate 201 can move up and down in the transfer seat 2. When the supporting plate 201 is at the bottom of the up and down movable range, the adjustment clamp 3 releases the chip placement tray 202. At this time, the chip placement tray 202 can be easily placed on the supporting plate 201 or removed from the supporting plate 201. When the supporting plate 201 leaves the bottom of the up and down movable range, the adjustment clamp 3 will firmly fix the chip placement tray 202 on the supporting plate 201. Since the supporting plate 201 can move up and down, when the transfer seat 2 enters the rack 4 with the supporting plate 201, the position of the transfer seat 2 is not changed. The positioning lifting frame 6 will be adjusted again to always press the positioning lifting frame 6 against the driving member 5, so that transmission is carried out between the driving member 5 and the positioning lifting frame 6, and then the driving member 5 is used to drive the positioning lifting frame 6 to slowly lift vertically, and the supporting plate 201 is moved up in the transfer seat 2 by lifting the positioning lifting frame 6, and the adjusting fixture 3 is always clamped on the chip placement disk 202 on the supporting plate 201 to prevent the chip placement disk 202 from loosening and shaking during the lifting or lowering process of the supporting plate 201. When the positioning lifting frame 6 reaches the detection height with the chip, after the detection head 7 has completed the detection, the transmission between the driving member 5 and the positioning lifting frame 6 is cancelled, so that the positioning lifting frame 6 is quickly moved down and reset under the action of its own gravity and the gravity of the supporting plate 201. At the same time, after the supporting plate 201 is completely reset to the previous height, the adjusting fixture 3 will release the chip placement disk 202 again, and then the transfer seat 2 will send the supporting plate 201 back to the outside of the frame 4 to facilitate the next step.

与现有技术相比,本发明实施例通过设置移送座2来将承托板201移送至机架4处,当承托板201位于定位升降架6上并推动定位升降架6后,迫使定位升降架6与驱动件5传动连接,利用驱动件5带动定位升降架6平缓升起,升起的过程中调节夹具3将芯片放置盘202和承托盘牢牢固定,避免芯片放置盘202晃动松脱,接着在定位升降架6带着承托板201抬升到检测头7能够检测的高度后,检测头7对芯片表面进行检测,同时定位升降架6在检测高度后会让驱动件5与其断开传动,使定位升降架6的复位下降依靠自身重力,从而实现快速复位,并在完全复位后调节夹具3也会松开芯片放置盘202,当移送座2将承托板201送出机架4后,方便对芯片放置盘202进行抓取,提高检测的效率。The positioning lifting frame 6 is driven by the driving member 5 to smoothly rise up, and during the rising process, the adjusting fixture 3 firmly fixes the chip placement tray 202 and the supporting tray to prevent the chip placement tray 202 from shaking and loosening. Then, after the positioning lifting frame 6 lifts the supporting plate 201 to a height that the detection head 7 can detect, the detection head 7 detects the surface of the chip. At the same time, after the positioning lifting frame 6 reaches the detection height, the driving member 5 disconnects the transmission from the positioning lifting frame 6, so that the positioning lifting frame 6 can be reset and descended by its own gravity, thereby realizing rapid reset. After the complete reset, the adjusting fixture 3 will also release the chip placement tray 202. When the transfer seat 2 sends the supporting plate 201 out of the rack 4, it is convenient to grab the chip placement tray 202, thereby improving the detection efficiency.

本发明进一步的实施例中,移送座2与检测台1之间安装有线性电机101,承托板201两侧均固定连接有插杆203,移送座2两侧均竖直开设有与插杆203相匹配的通槽204,具体的,移送座2受线性电机101的驱动在机架4内外往复移动,快速平稳的带着承托板201到达相应位置,虽然这时承托板201上的插杆203搭在通槽204最下方的槽口处,调节夹具3未夹紧芯片放置盘202,但是移送座2的移动方向是水平的,只要芯片放置盘202正常嵌在承托板201上就不会发生脱落晃动的现象,由于移送座2上具有限制插杆203左右移动的通槽204,当定位升降架6抬起承托板201后,只要移送座2的位置不发生改变,承托板201就能够垂直上移,避免出现芯片位置偏移的现象。In a further embodiment of the present invention, a linear motor 101 is installed between the transfer seat 2 and the detection table 1, and a plug rod 203 is fixedly connected to both sides of the support plate 201. A through slot 204 matching the plug rod 203 is vertically opened on both sides of the transfer seat 2. Specifically, the transfer seat 2 is driven by the linear motor 101 to move back and forth in and out of the frame 4, and quickly and smoothly brings the support plate 201 to the corresponding position. Although the plug rod 203 on the support plate 201 is placed at the bottom of the through slot 204 at this time, the adjustment fixture 3 does not clamp the chip placement plate 202, but the movement direction of the transfer seat 2 is horizontal. As long as the chip placement plate 202 is normally embedded in the support plate 201, it will not fall off or shake. Since the transfer seat 2 has a through slot 204 for limiting the left and right movement of the plug rod 203, when the positioning lifting frame 6 lifts the support plate 201, as long as the position of the transfer seat 2 does not change, the support plate 201 can move vertically upward to avoid the chip position offset.

本发明进一步的实施例中,承托板201顶面开设有与芯片放置盘202相匹配的容纳槽205,容纳槽205内壁两侧均开设有开口206,且开口206与容纳槽205相连通,开口206的一侧延伸至芯片放置盘202的下方,具体的,在进行检测前,将装好芯片的芯片放置盘202放在承托板201上的容纳槽205内,容纳槽205两侧预留的开口206放方便工作人员拿取芯片放置盘202。In a further embodiment of the present invention, a receiving groove 205 matching the chip placement tray 202 is provided on the top surface of the support plate 201, and openings 206 are provided on both sides of the inner wall of the receiving groove 205, and the opening 206 is connected to the receiving groove 205, and one side of the opening 206 extends to the bottom of the chip placement tray 202. Specifically, before testing, the chip placement tray 202 with the chip installed is placed in the receiving groove 205 on the support plate 201, and the openings 206 reserved on both sides of the receiving groove 205 are provided to facilitate the staff to take the chip placement tray 202.

本发明进一步的实施例中,调节夹具3包括弹性安装于开口206内侧的卡接架301,卡接架301一侧固定连接有贯穿承托板201的定位杆303,该定位杆303外套接有压簧304,移送座2内侧壁于卡接架301的下方固定连接有抵接架302,抵接架302与卡接架301倾斜相抵,具体的,当承托板201未被抬起的情况下,卡接架301被移动座内的抵接架302顶走,使卡接架301与芯片放置盘202之间的间距变大,这时卡接架301对芯片放置盘202未起到夹紧固定的作用,芯片放置盘202能够轻易的取放,而当承托板201被提起后,因为抵接架302的高度无法跟其一起调整,使卡接架301不再受到抵接架302的阻挡,让卡接架301在压簧304的作用力下卡住芯片放置盘202,使芯片放置盘202和承托板201之间连接更加牢靠。In a further embodiment of the present invention, the adjusting fixture 3 includes a clamping frame 301 elastically mounted on the inner side of the opening 206, a positioning rod 303 penetrating the supporting plate 201 is fixedly connected to one side of the clamping frame 301, a compression spring 304 is connected to the outer surface of the positioning rod 303, an abutment frame 302 is fixedly connected to the inner side wall of the transfer seat 2 below the clamping frame 301, and the abutment frame 302 is inclined against the clamping frame 301. Specifically, when the supporting plate 201 is not lifted, the clamping frame 301 is pushed away by the abutment frame 302 in the moving seat, so that The distance between the clamping frame 301 and the chip placement tray 202 becomes larger. At this time, the clamping frame 301 does not clamp and fix the chip placement tray 202, and the chip placement tray 202 can be easily taken and placed. When the supporting plate 201 is lifted, the height of the abutting frame 302 cannot be adjusted together with it, so that the clamping frame 301 is no longer blocked by the abutting frame 302, and the clamping frame 301 clamps the chip placement tray 202 under the action of the compression spring 304, so that the connection between the chip placement tray 202 and the supporting plate 201 is more secure.

本发明进一步的实施例中,驱动件5包括滑动安装于机架4顶部的连接架501,机架4内转动安装有与连接架501螺纹连接的丝杆502,机架4内还安装有与连接架501贯穿连接的导杆406,连接架501内转动安装有电动轴杆503,电动轴杆503上对称安装有驱动齿轮504,机架4内对称安装有导向板401,导向板401上开设有供电动轴杆503平移的导向槽402,具体的,电动轴杆503由电机驱动其转动,当定位升降架6和电动轴杆503上的驱动齿轮504进行传动后,通过电动轴杆503的转动来驱使定位升降架6平缓上移,还可以通过转动丝杆502来调整连接架501的位置,以使定位升降架6在被抬升到相应高度后,通过驱动齿轮504位置的调整让其与定位升降架6之间取消传动配合,让定位升降架6能够自行下降。In a further embodiment of the present invention, the driving member 5 includes a connecting frame 501 slidably mounted on the top of the frame 4, a screw rod 502 threadedly connected to the connecting frame 501 is rotatably mounted in the frame 4, a guide rod 406 penetratingly connected to the connecting frame 501 is also mounted in the frame 4, an electric shaft 503 is rotatably mounted in the connecting frame 501, a driving gear 504 is symmetrically mounted on the electric shaft 503, a guide plate 401 is symmetrically mounted in the frame 4, and a guide groove for the electric shaft 503 to translate is provided on the guide plate 401 402, specifically, the electric shaft 503 is driven to rotate by the motor. After the positioning lifting frame 6 and the driving gear 504 on the electric shaft 503 are transmitted, the positioning lifting frame 6 is driven to move up smoothly by the rotation of the electric shaft 503. The position of the connecting frame 501 can also be adjusted by rotating the screw rod 502, so that after the positioning lifting frame 6 is lifted to a corresponding height, the position of the driving gear 504 is adjusted to cancel the transmission coordination with the positioning lifting frame 6, so that the positioning lifting frame 6 can descend by itself.

本发明进一步的实施例中,定位升降架6外侧竖直开设有滑槽601,滑槽601内滑动安装有插接滑块602,导向板401上水平开设有与插接滑块602相匹配的导轨403,导轨403内壁一侧与插接滑块602之间固定连接有顶簧404,定位升降架6一侧固定连接有与驱动齿轮504相适配的传动齿条603,丝杆502外固定套设有第一凸轮505,定位升降架6顶部与第一凸轮505凸起部抵接配合,具体的,插接滑块602分别插在定位升降架6的滑槽601和导向板401上的导轨403中,使移送座2带着承托板201挤压定位升降架6时,定位升降架6能够水平移动,当电动轴杆503上的驱动齿轮504和定位升降架6上的传动齿条603啮合后,定位升降架6又能够垂直上升,并且当定位升降架6上移到合适高度完成对芯片检测之后,其顶部也会顶起丝杆502上的第一凸轮505,使丝杆502转动合适的角度,让连接架501朝着远离定位升降架6的位置移动,使电动轴杆503上的驱动齿轮504和定位升降架6上的传动齿条603分开,定位升降架6在没有外部传动源后,在重力作用下快速下降,在即将下降复位完成时,卡接架301再和抵接架302之间进行抵接,让卡接架301松开芯片放置板,最后让移送座2将承托板201以及承托板201上放置的芯片放置板送出机架4,由于芯片放置板和承托板201之间的调节夹具3已经松开,让工作人员能够很轻松的取下芯片放置板来进行下一工序,使用更放方便,无需人工固定或解除固定,当移送座2移出后,顶簧404会朝移送座2外移的方向顶推插接滑块602,让定位升降架6在机架4中移动到之前所在的位置。In a further embodiment of the present invention, a slide groove 601 is vertically provided on the outer side of the positioning lifting frame 6, a plug-in slider 602 is slidably installed in the slide groove 601, a guide rail 403 matching the plug-in slider 602 is horizontally provided on the guide plate 401, a top spring 404 is fixedly connected between one side of the inner wall of the guide rail 403 and the plug-in slider 602, a transmission rack 603 matching the driving gear 504 is fixedly connected to one side of the positioning lifting frame 6, a first cam 505 is fixedly provided on the outer fixed sleeve of the screw rod 502, and the top of the positioning lifting frame 6 The first cam 505 is abutted against the protruding part of the first cam 505. Specifically, the plug-in slider 602 is respectively inserted into the slide groove 601 of the positioning lifting frame 6 and the guide rail 403 on the guide plate 401, so that when the transfer seat 2 carries the supporting plate 201 to squeeze the positioning lifting frame 6, the positioning lifting frame 6 can move horizontally. When the driving gear 504 on the electric shaft 503 and the transmission rack 603 on the positioning lifting frame 6 are engaged, the positioning lifting frame 6 can rise vertically, and when the positioning lifting frame 6 moves up to a suitable height, the chip detection is completed. Afterwards, its top will also push up the first cam 505 on the screw rod 502, so that the screw rod 502 rotates at a suitable angle, allowing the connecting frame 501 to move away from the positioning lifting frame 6, so that the driving gear 504 on the electric shaft 503 and the transmission rack 603 on the positioning lifting frame 6 are separated. After there is no external transmission source, the positioning lifting frame 6 quickly descends under the action of gravity. When it is about to descend and reset, the clamping frame 301 abuts against the abutting frame 302 again, allowing the clamping frame 301 to release the chip. The plate is placed, and finally the transfer seat 2 sends the supporting plate 201 and the chip placing plate placed on the supporting plate 201 out of the rack 4. Since the adjustment clamp 3 between the chip placing plate and the supporting plate 201 has been loosened, the staff can easily remove the chip placing plate to proceed to the next process. It is more convenient to use and does not require manual fixing or releasing. When the transfer seat 2 is moved out, the top spring 404 will push the plug-in slider 602 in the direction of the transfer seat 2 moving outward, so that the positioning lifting frame 6 moves to its previous position in the rack 4.

本发明进一步的实施例中,丝杆502外固定套设有第二凸轮506,且第二凸轮506的凸起部与第一凸轮505的凸起部方向相反,导向板401外侧竖直滑动安装有顶杆405,插接滑块602端部固定连接有楔形抵块604,顶杆405底部与楔形抵块604相抵,顶部与第二凸轮506的凸起部相抵,具体的,当定位升降架6下降复位后,插接滑块602在被顶簧404顶推的过程中,让楔形抵块604顶起顶杆405,在通过顶杆405顶起第二凸轮506的凸起部分,让丝杆502朝着另一方向转动相同的角度,使连接架501带着电动轴杆503复位,待下一芯片放置盘202放在承托板201上之后,定位升降架6被推移到相同位置依旧能够和驱动件5进行传动,以实现连续检测,提高检测的连续性。In a further embodiment of the present invention, a second cam 506 is fixedly sleeved outside the screw rod 502, and the raised portion of the second cam 506 is in the opposite direction to the raised portion of the first cam 505. A push rod 405 is vertically slidably installed on the outer side of the guide plate 401, and a wedge-shaped stop block 604 is fixedly connected to the end of the plug-in slider 602. The bottom of the push rod 405 abuts against the wedge-shaped stop block 604, and the top abuts against the raised portion of the second cam 506. Specifically, when the positioning lifting frame 6 is lowered and reset, the plug-in slider 60 In the process of being pushed by the push spring 404, the wedge-shaped stopper 604 pushes up the push rod 405, and the push rod 405 pushes up the raised part of the second cam 506, so that the lead screw 502 rotates in the other direction by the same angle, so that the connecting frame 501 and the electric shaft 503 are reset, and after the next chip placement tray 202 is placed on the supporting plate 201, the positioning lifting frame 6 is pushed to the same position and can still transmit with the driving member 5, so as to realize continuous detection and improve the continuity of detection.

本发明进一步的实施例中,机架4内部滑动安装有一对防尘罩8,检测头7位于一对防尘罩8之间,检测头7外转动套接有调节齿环701,两个防尘罩8上分别固定有与调节齿环701啮合的调节齿条801,其中一防尘罩8的底部固定连接有连接支架802,连接支架802分别与两个定位升降架6滑动连接,具体的,当定位升降架6被向内推移时,定位升降架6又会推动连接支架802,让和该连接支架802相连的防尘罩8一同移动,该防尘罩8通过调节齿条801来带动调节齿环701转动,使另一防尘罩8同步外移,让两个防尘罩8打开,使检测头7能够在芯片放置盘202进入机架4后正常工作,而当定位升降架6复位后,其中一防尘罩8带着另一防尘罩8相互靠拢,使检测头7的镜头被保护包围,减少灰尘聚集。In a further embodiment of the present invention, a pair of dust covers 8 are slidably installed inside the frame 4, and the detection head 7 is located between the pair of dust covers 8. An adjusting tooth ring 701 is rotatably sleeved on the outside of the detection head 7, and an adjusting rack 801 meshing with the adjusting tooth ring 701 is fixed on the two dust covers 8, respectively. A connecting bracket 802 is fixedly connected to the bottom of one of the dust covers 8, and the connecting bracket 802 is slidably connected to the two positioning lifting frames 6, respectively. Specifically, when the positioning lifting frame 6 is pushed inward, the positioning lifting frame 6 will push the connecting bracket 802, so that the dust cover 8 connected to the connecting bracket 802 moves together, and the dust cover 8 drives the adjusting tooth ring 701 to rotate through the adjusting rack 801, so that the other dust cover 8 moves outward synchronously, so that the two dust covers 8 are opened, so that the detection head 7 can work normally after the chip placement tray 202 enters the frame 4, and when the positioning lifting frame 6 is reset, one of the dust covers 8 brings the other dust cover 8 close to each other, so that the lens of the detection head 7 is protected and surrounded, reducing dust accumulation.

本发明进一步的实施例中,定位升降架6内壁底部固定连接有挡块605,挡块605中开设有与插杆203相适配的卡槽606,具体的,当移送座2带着承托板201进入机架4后,承托板201两侧的插杆203会分别卡入挡块605中的卡槽606内,这时承托板201的高度便被定位升降架6所限制,不像之前可以自由抬升,让定位升降架6在抬升承托板201时保证承托板201的稳定性。In a further embodiment of the present invention, a stopper 605 is fixedly connected to the bottom of the inner wall of the positioning lifting frame 6, and a slot 606 compatible with the insertion rod 203 is opened in the stopper 605. Specifically, when the transfer seat 2 brings the support plate 201 into the frame 4, the insertion rods 203 on both sides of the support plate 201 will be respectively inserted into the slots 606 in the stopper 605. At this time, the height of the support plate 201 is limited by the positioning lifting frame 6, unlike before when it can be lifted freely, so that the positioning lifting frame 6 can ensure the stability of the support plate 201 when lifting the support plate 201.

一种检测机,包括上述的光子芯片检测机构。A detection machine comprises the above-mentioned photonic chip detection mechanism.

以上只通过说明的方式描述了本发明的某些示范性实施例,毋庸置疑,对于本领域的普通技术人员,在不偏离本发明的精神和范围的情况下,可以用各种不同的方式对所描述的实施例进行修正。因此,上述附图和描述在本质上是说明性的,不应理解为对本发明权利要求保护范围的限制。The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims (10)

1.一种光子芯片检测机构,包括检测台(1),其特征在于,还包括:1. A photonic chip detection mechanism, comprising a detection platform (1), characterized in that it also includes: 移送座(2),所述移送座(2)安装于检测台(1)的台面上,且移送座(2)内竖直滑动安装有承托板(201),所述承托板(201)顶部嵌设有芯片放置盘(202),所述承托板(201)与芯片放置盘(202)之间安装有调节夹具(3);A transfer seat (2), the transfer seat (2) being mounted on the table surface of the detection table (1), and a support plate (201) being vertically slidably mounted inside the transfer seat (2), a chip placement plate (202) being embedded on the top of the support plate (201), and an adjustment fixture (3) being mounted between the support plate (201) and the chip placement plate (202); 机架(4),其固定于检测台(1)顶部,且机架(4)内安装有驱动件(5)和与驱动件(5)单向传动的定位升降架(6),机架(4)顶部安装有检测头(7);A frame (4) is fixed on the top of the detection platform (1), and a driving member (5) and a positioning lifting frame (6) that transmits one-way transmission to the driving member (5) are installed in the frame (4), and a detection head (7) is installed on the top of the frame (4); 当所述移送座(2)带着承托板(201)推移定位升降架(6)后,所述驱动件(5)带动定位升降架(6)抬升,并使调节夹具(3)将芯片放置盘(202)固定于承托板(201)上,当所述定位升降架(6)抬至检测高度后,其在重力作用下复位,并使调节夹具(3)松开芯片放置盘(202)。When the transfer seat (2) pushes the positioning lifting frame (6) with the supporting plate (201), the driving member (5) drives the positioning lifting frame (6) to rise, and enables the adjusting fixture (3) to fix the chip placement plate (202) on the supporting plate (201); when the positioning lifting frame (6) is lifted to the detection height, it is reset under the action of gravity, and enables the adjusting fixture (3) to release the chip placement plate (202). 2.根据权利要求1所述的一种光子芯片检测机构,其特征在于,所述移送座(2)与检测台(1)之间安装有线性电机(101),所述承托板(201)两侧均固定连接有插杆(203),所述移送座(2)两侧均竖直开设有与插杆(203)相匹配的通槽(204)。2. A photonic chip detection mechanism according to claim 1, characterized in that a linear motor (101) is installed between the transfer seat (2) and the detection platform (1), both sides of the support plate (201) are fixedly connected with an insertion rod (203), and both sides of the transfer seat (2) are vertically provided with a through groove (204) matching the insertion rod (203). 3.根据权利要求1所述的一种光子芯片检测机构,其特征在于,所述承托板(201)顶面开设有与芯片放置盘(202)相匹配的容纳槽(205),所述容纳槽(205)内壁两侧均开设有开口(206),且开口(206)与容纳槽(205)相连通。3. A photonic chip detection mechanism according to claim 1, characterized in that a receiving groove (205) matching the chip placement plate (202) is provided on the top surface of the supporting plate (201), and openings (206) are provided on both sides of the inner wall of the receiving groove (205), and the openings (206) are connected to the receiving groove (205). 4.根据权利要求3所述的一种光子芯片检测机构,其特征在于,所述调节夹具(3)包括弹性安装于开口(206)内侧的卡接架(301),所述移送座(2)内侧壁于卡接架(301)的下方固定连接有抵接架(302),所述抵接架(302)与卡接架(301)倾斜相抵。4. A photonic chip detection mechanism according to claim 3, characterized in that the adjustment fixture (3) includes a clamping frame (301) elastically mounted on the inner side of the opening (206), and the inner wall of the transfer seat (2) is fixedly connected with an abutment frame (302) below the clamping frame (301), and the abutment frame (302) is inclined against the clamping frame (301). 5.根据权利要求1所述的一种光子芯片检测机构,其特征在于,所述驱动件(5)包括滑动安装于机架(4)顶部的连接架(501),所述机架(4)内转动安装有与连接架(501)螺纹连接的丝杆(502),所述连接架(501)内转动安装有电动轴杆(503),所述电动轴杆(503)上对称安装有驱动齿轮(504),所述机架(4)内对称安装有导向板(401),所述导向板(401)上开设有供电动轴杆(503)平移的导向槽(402)。5. A photonic chip detection mechanism according to claim 1, characterized in that the driving member (5) includes a connecting frame (501) slidably mounted on the top of a frame (4), a screw (502) threadedly connected to the connecting frame (501) is rotatably mounted in the frame (4), an electric shaft (503) is rotatably mounted in the connecting frame (501), a driving gear (504) is symmetrically mounted on the electric shaft (503), a guide plate (401) is symmetrically mounted in the frame (4), and a guide groove (402) is provided on the guide plate (401) for the electric shaft (503) to translate. 6.根据权利要求5所述的一种光子芯片检测机构,其特征在于,所述定位升降架(6)外侧竖直开设有滑槽(601),所述滑槽(601)内滑动安装有插接滑块(602),所述导向板(401)上水平开设有与插接滑块(602)相匹配的导轨(403),所述导轨(403)内壁一侧与插接滑块(602)之间固定连接有顶簧(404),所述定位升降架(6)一侧固定连接有与驱动齿轮(504)相适配的传动齿条(603),所述丝杆(502)外固定套设有第一凸轮(505),所述定位升降架(6)顶部与第一凸轮(505)凸起部抵接配合。6. A photonic chip detection mechanism according to claim 5, characterized in that a slide groove (601) is vertically opened on the outer side of the positioning lifting frame (6), a plug-in slider (602) is slidably installed in the slide groove (601), a guide rail (403) matching the plug-in slider (602) is horizontally opened on the guide plate (401), a top spring (404) is fixedly connected between one side of the inner wall of the guide rail (403) and the plug-in slider (602), a transmission rack (603) matched with the driving gear (504) is fixedly connected to one side of the positioning lifting frame (6), a first cam (505) is fixedly provided on the outer fixed sleeve of the screw rod (502), and the top of the positioning lifting frame (6) is abutted and matched with the raised part of the first cam (505). 7.根据权利要求6所述的一种光子芯片检测机构,其特征在于,所述所述丝杆(502)外固定套设有第二凸轮(506),且第二凸轮(506)的凸起部与第一凸轮(505)的凸起部方向相反,所述导向板(401)外侧竖直滑动安装有顶杆(405),所述插接滑块(602)端部固定连接有楔形抵块(604),所述顶杆(405)底部与楔形抵块(604)相抵,顶部与第二凸轮(506)的凸起部相抵。7. A photonic chip detection mechanism according to claim 6, characterized in that a second cam (506) is provided on the outer fixed sleeve of the screw rod (502), and the raised portion of the second cam (506) is in the opposite direction to the raised portion of the first cam (505), a push rod (405) is vertically slidably installed on the outer side of the guide plate (401), a wedge-shaped stop block (604) is fixedly connected to the end of the plug-in slider (602), the bottom of the push rod (405) is against the wedge-shaped stop block (604), and the top is against the raised portion of the second cam (506). 8.根据权利要求1所述的一种光子芯片检测机构,其特征在于,所述机架(4)内部滑动安装有一对防尘罩(8),所述检测头(7)位于一对防尘罩(8)之间,所述检测头(7)外转动套接有调节齿环(701),两个所述防尘罩(8)上分别固定有与调节齿环(701)啮合的调节齿条(801),其中一所述防尘罩(8)的底部固定连接有连接支架(802),所述连接支架(802)分别与两个定位升降架(6)滑动连接。8. A photonic chip detection mechanism according to claim 1, characterized in that a pair of dust covers (8) are slidably installed inside the frame (4), the detection head (7) is located between the pair of dust covers (8), and an adjusting tooth ring (701) is rotatably sleeved outside the detection head (7), and adjustment racks (801) meshing with the adjusting tooth rings (701) are respectively fixed on the two dust covers (8), and a connecting bracket (802) is fixedly connected to the bottom of one of the dust covers (8), and the connecting bracket (802) is slidably connected to the two positioning lifting frames (6) respectively. 9.根据权利要求2所述的一种光子芯片检测机构,其特征在于,所述定位升降架(6)内壁底部固定连接有挡块(605),所述挡块(605)中开设有与插杆(203)相适配的卡槽(606)。9. A photonic chip detection mechanism according to claim 2, characterized in that a stopper (605) is fixedly connected to the bottom of the inner wall of the positioning lifting frame (6), and a slot (606) adapted to the insertion rod (203) is provided in the stopper (605). 10.一种检测机,其特征在于,包括权利要求1-9任一项所述的光子芯片检测机构。10. A detection machine, characterized in that it comprises the photonic chip detection mechanism according to any one of claims 1 to 9.
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Publication number Priority date Publication date Assignee Title
CN119795076A (en) * 2025-01-13 2025-04-11 滁州爱沃富光电科技有限公司 Quick positioning mechanism for detecting photon chip
CN119795076B (en) * 2025-01-13 2025-07-11 滁州爱沃富光电科技有限公司 Quick positioning mechanism for detecting photon chip

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