CN118720696A - A COVER and an electronic chip efficient assembly production device - Google Patents

A COVER and an electronic chip efficient assembly production device Download PDF

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Publication number
CN118720696A
CN118720696A CN202410892831.8A CN202410892831A CN118720696A CN 118720696 A CN118720696 A CN 118720696A CN 202410892831 A CN202410892831 A CN 202410892831A CN 118720696 A CN118720696 A CN 118720696A
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positioning
shell
positioning frame
cover
production device
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CN118720696B (en
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朱琪
刘思超
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Jiaxing Liankong New Energy Technology Co ltd
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Jiaxing Liankong New Energy Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/02Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same
    • B23P19/027Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same using hydraulic or pneumatic means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING
    • B25B11/00Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/02Assembly jigs

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明公开了芯片装配技术领域的一种COVER与电子芯片高效装配生产装置,包括加工台、壳体及芯片主体,所述加工台由底座、支撑柱和顶板组成,所述底座和顶板通过支撑柱连接;所述壳体内固定安装有卡扣;所述底座上设置有用于壳体定位的定位机构,所述顶板上设置有用于将芯片主体安装到壳体内的装配机构;本发明可以使芯片主体更好的装配到壳体内。

The present invention discloses a COVER and an efficient assembly production device for electronic chips in the field of chip assembly technology, comprising a processing table, a shell and a chip body, wherein the processing table is composed of a base, a support column and a top plate, and the base and the top plate are connected by the support column; a buckle is fixedly installed in the shell; a positioning mechanism for positioning the shell is arranged on the base, and an assembly mechanism for installing the chip body into the shell is arranged on the top plate; the present invention can make the chip body better assembled into the shell.

Description

一种COVER与电子芯片高效装配生产装置A COVER and an electronic chip efficient assembly production device

技术领域Technical Field

本发明涉及芯片装配技术领域,具体为一种COVER与电子芯片高效装配生产装置。The present invention relates to the technical field of chip assembly, in particular to a COVER and an electronic chip efficient assembly production device.

背景技术Background Art

COVER其实就是执行器的塑料外壳,这个外壳是一个嵌件注塑的产品,里面镶嵌了motor和connetor的端子,用于信号的连接。COVER is actually the plastic shell of the actuator. This shell is an insert-molded product, inlaid with motor and connector terminals for signal connection.

现有技术中COVER与电子芯片的连接方式有通过螺丝固定或通过卡扣固定两种方式;通过螺丝固定,工作人员需要将螺丝一个个拧紧,效率较低;而通过卡扣的方式固定通常需要工作人员将芯片按压到卡扣内,由于执行器在工作时,电子芯片不能晃动,因此卡扣通过需要对电子芯片施加预紧力,在按压电子芯片时,如果出现倾斜的状态,会导致电子芯片翘起的一端需要施加较大的力才能完全卡入卡扣内,这就容易导致电子芯片出现损坏的情况。In the prior art, there are two ways to connect the COVER and the electronic chip: fixing with screws or fixing with buckles. When fixing with screws, the staff needs to tighten the screws one by one, which is inefficient. Fixing with buckles usually requires the staff to press the chip into the buckles. Since the electronic chip cannot shake when the actuator is working, the buckle needs to apply a pre-tightening force to the electronic chip. When pressing the electronic chip, if it is tilted, the raised end of the electronic chip will need to apply a larger force to completely fit into the buckle, which can easily cause damage to the electronic chip.

基于此,本发明设计了一种COVER与电子芯片高效装配生产装置,以解决上述问题。Based on this, the present invention designs a COVER and an electronic chip efficient assembly production device to solve the above problems.

发明内容Summary of the invention

本发明的目的在于提供一种COVER与电子芯片高效装配生产装置,以解决上述背景技术中提出的问题。The object of the present invention is to provide a COVER and an electronic chip efficient assembly production device to solve the problems raised in the above background technology.

为实现上述目的,本发明提供如下技术方案:一种COVER与电子芯片高效装配生产装置,包括加工台、壳体及芯片主体,所述加工台由底座、支撑柱和顶板组成,所述底座和顶板通过支撑柱连接;所述壳体内固定安装有卡扣;所述底座上设置有用于壳体定位的定位机构,所述顶板上设置有用于将芯片主体安装到壳体内的装配机构。To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a COVER and electronic chip efficient assembly production device, comprising a processing table, a shell and a chip body, the processing table is composed of a base, a support column and a top plate, the base and the top plate are connected by the support column; a buckle is fixedly installed in the shell; a positioning mechanism for positioning the shell is provided on the base, and an assembly mechanism for installing the chip body into the shell is provided on the top plate.

作为本发明的进一步方案,所述定位机构包括两个定位杆,两个所述定位杆均转动安装在加工台的顶部,所述定位杆的转动轴上均传动连接有电机;所述定位杆内侧设置有挡块,所述挡块与加工台固定连接。As a further solution of the present invention, the positioning mechanism includes two positioning rods, both of which are rotatably installed on the top of the processing table, and the rotating shafts of the positioning rods are transmission-connected to the motor; a stopper is arranged on the inner side of the positioning rod, and the stopper is fixedly connected to the processing table.

作为本发明的进一步方案,所述装配机构包括定位框,所述定位框内弹性滑动安装有两个呈对称布置的限位块,所述限位块侧边设置有用于驱动其向外侧移动的楔形推杆,所述楔形推杆与定位框在竖直方向上滑动连接;所述定位框外侧壁上固定连接有支撑板;所述定位框上方设置有用于驱动其上下移动的第一气缸;所述第一气缸固定安装在顶板底部;所述定位框上还设置有按压机构,所述按压机构用于驱动芯片主体。As a further solution of the present invention, the assembly mechanism includes a positioning frame, in which two symmetrically arranged limit blocks are elastically and slidably installed, and the side of the limit block is provided with a wedge-shaped push rod for driving it to move outward, and the wedge push rod is slidably connected to the positioning frame in the vertical direction; a support plate is fixedly connected to the outer wall of the positioning frame; a first cylinder for driving it to move up and down is arranged above the positioning frame; the first cylinder is fixedly installed on the bottom of the top plate; a pressing mechanism is also provided on the positioning frame, and the pressing mechanism is used to drive the chip body.

作为本发明的进一步方案,所述按压机构包括压板和第二气缸,所述第二气缸安装在定位框的顶部,所述压板固定安装在第二气缸的输出端上。As a further solution of the present invention, the pressing mechanism includes a pressing plate and a second cylinder, the second cylinder is installed on the top of the positioning frame, and the pressing plate is fixedly installed on the output end of the second cylinder.

作为本发明的进一步方案,所述定位框侧壁上滑动连接有夹紧块,所述夹紧块上固定连接有用于其复位的弹簧,所述夹紧块上固定连接有牵引绳,所述牵引绳远离夹紧块一端固定连接有滑杆,所述滑杆与支撑板在竖直方向上滑动连接。As a further solution of the present invention, a clamping block is slidably connected to the side wall of the positioning frame, a spring for resetting the clamping block is fixedly connected to the clamping block, a traction rope is fixedly connected to the clamping block, a sliding rod is fixedly connected to one end of the traction rope away from the clamping block, and the sliding rod is slidably connected to the support plate in the vertical direction.

作为本发明的进一步方案,所述定位框的内壁上转动安装有托板,所述托板的转动轴上套装有扭簧,所述托板位于限位块上方且能够被限位块限位。As a further solution of the present invention, a support plate is rotatably mounted on the inner wall of the positioning frame, a torsion spring is mounted on the rotating shaft of the support plate, and the support plate is located above the limiting block and can be limited by the limiting block.

作为本发明的进一步方案,所述卡扣的顶部开设有卡槽,所述卡槽位于楔形推杆的正下方。As a further solution of the present invention, a slot is provided on the top of the buckle, and the slot is located directly below the wedge-shaped push rod.

作为本发明的进一步方案,所述定位杆上开设有插槽,所述插槽为圆台形,所述插槽上方设置有能够与其对接的插块,所述插块与支撑板固定连接。As a further solution of the present invention, a slot is provided on the positioning rod, and the slot is truncated cone-shaped. An insert block capable of docking with the slot is provided above the slot, and the insert block is fixedly connected to the support plate.

与现有技术相比,本发明的有益效果是:Compared with the prior art, the present invention has the following beneficial effects:

1.本发明通过定位机构的设置,定位机构可以稳定的对壳体进行定位;同时通过装配机构的设置,装配机构可以使芯片主体始终与壳体保持平行状态,可以使芯片主体在按压时不会倾斜,可以使芯片主体更好、更快的装配到壳体内。1. The present invention can stably position the shell by setting the positioning mechanism; at the same time, by setting the assembly mechanism, the assembly mechanism can keep the chip body parallel to the shell at all times, so that the chip body will not tilt when pressed, and the chip body can be assembled into the shell better and faster.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1为本发明总体结构示意图;Fig. 1 is a schematic diagram of the overall structure of the present invention;

图2为本发明总体结构示意图(隐藏了顶板和支撑柱);FIG2 is a schematic diagram of the overall structure of the present invention (with the top plate and support columns hidden);

图3为本发明芯片主体装配示意图;FIG3 is a schematic diagram of the chip assembly of the present invention;

图4为图3中A处局部放大图;FIG4 is a partial enlarged view of point A in FIG3 ;

图5为本发明装配机构结构示意图。FIG. 5 is a schematic diagram of the assembly mechanism structure of the present invention.

附图中,各标号所代表的部件列表如下:In the accompanying drawings, the components represented by the reference numerals are listed as follows:

加工台1、壳体2、芯片主体3、卡扣4、定位杆5、电机6、定位框7、限位块8、楔形推杆9、支撑板10、第一气缸11、压板12、第二气缸13、夹紧块14、弹簧15、牵引绳16、滑杆17、托板18、卡槽19、插槽20、插块21、底座22、支撑柱23、顶板24、挡块25。Processing table 1, shell 2, chip body 3, buckle 4, positioning rod 5, motor 6, positioning frame 7, limit block 8, wedge push rod 9, support plate 10, first cylinder 11, pressure plate 12, second cylinder 13, clamping block 14, spring 15, traction rope 16, slide bar 17, support plate 18, slot 19, slot 20, insert block 21, base 22, support column 23, top plate 24, stop block 25.

具体实施方式DETAILED DESCRIPTION

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

请参阅图1-图5,本发明提供一种技术方案:一种COVER与电子芯片高效装配生产装置,包括加工台1、壳体2及芯片主体3,所述加工台1由底座22、支撑柱23和顶板24组成,所述底座22和顶板24通过支撑柱23连接;所述壳体2内固定安装有卡扣4;所述底座22上设置有用于壳体2定位的定位机构,所述顶板24上设置有用于将芯片主体3安装到壳体2内的装配机构。Please refer to Figures 1 to 5. The present invention provides a technical solution: a COVER and electronic chip efficient assembly production device, including a processing table 1, a shell 2 and a chip body 3, the processing table 1 is composed of a base 22, a support column 23 and a top plate 24, the base 22 and the top plate 24 are connected by the support column 23; a buckle 4 is fixedly installed in the shell 2; a positioning mechanism for positioning the shell 2 is provided on the base 22, and an assembly mechanism for installing the chip body 3 into the shell 2 is provided on the top plate 24.

所述定位机构包括两个定位杆5,两个所述定位杆5均转动安装在加工台1的顶部,所述定位杆5的转动轴上均传动连接有电机6;所述定位杆5内侧设置有挡块25,所述挡块25与加工台1固定连接。The positioning mechanism includes two positioning rods 5, both of which are rotatably mounted on the top of the processing table 1, and the rotating shafts of the positioning rods 5 are transmission-connected to the motor 6; a stopper 25 is provided on the inner side of the positioning rod 5, and the stopper 25 is fixedly connected to the processing table 1.

所述装配机构包括定位框7,所述定位框7内弹性滑动安装有两个呈对称布置的限位块8,所述限位块8侧边设置有用于驱动其向外侧移动的楔形推杆9,所述楔形推杆9与定位框7在竖直方向上滑动连接;所述定位框7外侧壁上固定连接有支撑板10;所述定位框7上方设置有用于驱动其上下移动的第一气缸11;所述第一气缸11固定安装在顶板24底部;所述定位框7上还设置有按压机构,所述按压机构用于驱动芯片主体3。The assembly mechanism includes a positioning frame 7, in which two symmetrically arranged limit blocks 8 are elastically and slidably installed, and the side of the limit block 8 is provided with a wedge-shaped push rod 9 for driving it to move outward, and the wedge push rod 9 is slidably connected to the positioning frame 7 in the vertical direction; a support plate 10 is fixedly connected to the outer wall of the positioning frame 7; a first cylinder 11 for driving it to move up and down is arranged above the positioning frame 7; the first cylinder 11 is fixedly installed at the bottom of the top plate 24; a pressing mechanism is also provided on the positioning frame 7, and the pressing mechanism is used to drive the chip body 3.

工作时,如图1所示,工作人员将壳体2放置到加工台1的底座22上,使壳体2处于两个定位杆5之间;壳体2放置到位时,壳体2两侧的侧壁与两个定位杆5的内侧壁贴合;两个定位杆5处于非平行状态,壳体2与定位杆5贴合时位置固定;然后工作人员再将芯片主体3放置到定位框7内,限位块8可以对芯片主体3起到支撑作用,使芯片主体3暂时不会下坠;然后第一气缸11启动,第一气缸11会驱动定位框7带动芯片主体3同步向下移动,定位框7会带动楔形推杆9同步向下移动,当楔形推杆9向下移动到与卡扣4顶面接触后,定位框7继续向下移动会使楔形推杆9相对于定位框7向上移动;如图4所示,楔形推杆9会驱动限位块8向左移动,直到限位块8移动到芯片主体3的左侧,此时芯片主体移动到安装位置,并且支撑板10向下移动到与壳体2的顶面贴合,然后第一气缸11停止工作;支撑板10可以使定位框7稳定停止在卡扣4的正上方;然后按压机构启动,按压机构向芯片主体3的中间部位施加压力,将芯片主体3沿着定位框7的内壁向下按压,芯片主体3可以保持与壳体2平行的状态向下移动,直到芯片主体3卡入到两个卡扣4内进行固定,完成芯片主体3的装配;然后按压机构复位,第一气缸11再驱动定位框7向上移动到初始位置;然后电机6可以驱动定位杆5向外侧转动,工作人员即可将壳体2从加工台1上取下,然后电机6再驱动定位杆5转动回初始位置,定位杆5转动到与挡块25接触后电机6停止工作;本发明通过定位机构的设置,定位机构可以稳定的对壳体2进行定位;同时通过装配机构的设置,装配机构可以使芯片主体始终与壳体2保持平行状态,可以使芯片主体3在按压时不会倾斜,可以使芯片主体3更好、更快的装配到壳体2内。During operation, as shown in FIG1 , the staff places the shell 2 on the base 22 of the processing table 1 so that the shell 2 is between the two positioning rods 5; when the shell 2 is in place, the side walls on both sides of the shell 2 fit with the inner side walls of the two positioning rods 5; the two positioning rods 5 are in a non-parallel state, and the position of the shell 2 and the positioning rods 5 is fixed when they fit; then the staff places the chip body 3 into the positioning frame 7, and the limit block 8 can support the chip body 3 so that the chip body 3 will not fall temporarily; then the first cylinder 11 is started, and the first air cylinder 11 is turned on. The cylinder 11 will drive the positioning frame 7 to drive the chip body 3 to move downward synchronously, and the positioning frame 7 will drive the wedge push rod 9 to move downward synchronously. When the wedge push rod 9 moves downward to contact the top surface of the buckle 4, the positioning frame 7 continues to move downward to cause the wedge push rod 9 to move upward relative to the positioning frame 7; as shown in Figure 4, the wedge push rod 9 will drive the limit block 8 to move to the left until the limit block 8 moves to the left side of the chip body 3. At this time, the chip body moves to the installation position, and the support plate 10 moves downward to fit the top surface of the shell 2, and then the first cylinder 1 1 stops working; the support plate 10 can make the positioning frame 7 stop stably just above the buckle 4; then the pressing mechanism is started, and the pressing mechanism applies pressure to the middle part of the chip body 3, pressing the chip body 3 downward along the inner wall of the positioning frame 7, and the chip body 3 can keep moving downward in a state parallel to the shell 2 until the chip body 3 is snapped into the two buckles 4 for fixing, and the assembly of the chip body 3 is completed; then the pressing mechanism is reset, and the first cylinder 11 drives the positioning frame 7 to move upward to the initial position; then the motor 6 can drive the positioning rod 5 to rotate outward, and the staff can remove the shell 2 from the processing table 1, and then the motor 6 drives the positioning rod 5 to rotate back to the initial position, and the motor 6 stops working after the positioning rod 5 rotates to contact the stopper 25; the present invention is provided with a positioning mechanism, and the positioning mechanism can stably position the shell 2; at the same time, through the setting of the assembly mechanism, the assembly mechanism can keep the chip body parallel to the shell 2 at all times, so that the chip body 3 will not tilt when pressed, and the chip body 3 can be better and faster assembled into the shell 2.

作为本发明的进一步方案,所述按压机构包括压板12和第二气缸13,所述第二气缸13安装在定位框7的顶部,所述压板12固定安装在第二气缸13的输出端上。As a further solution of the present invention, the pressing mechanism includes a pressing plate 12 and a second cylinder 13 . The second cylinder 13 is installed on the top of the positioning frame 7 , and the pressing plate 12 is fixedly installed on the output end of the second cylinder 13 .

工作时,如图3所示,第二气缸13可以驱动压板12向下移动,压板12位于芯片主体3的正上方,压板12可以将芯片主体3按压到卡扣4内。During operation, as shown in FIG. 3 , the second cylinder 13 can drive the pressing plate 12 to move downward, and the pressing plate 12 is located directly above the chip body 3 . The pressing plate 12 can press the chip body 3 into the buckle 4 .

作为本发明的进一步方案,所述定位框7侧壁上滑动连接有夹紧块14,所述夹紧块14上固定连接有用于其复位的弹簧15,所述夹紧块14上固定连接有牵引绳16,所述牵引绳16远离夹紧块14一端固定连接有滑杆17,所述滑杆17与支撑板10在竖直方向上滑动连接。As a further solution of the present invention, a clamping block 14 is slidably connected to the side wall of the positioning frame 7, a spring 15 for resetting the clamping block 14 is fixedly connected to the clamping block 14, a traction rope 16 is fixedly connected to the clamping block 14, and a sliding rod 17 is fixedly connected to one end of the traction rope 16 away from the clamping block 14, and the sliding rod 17 is slidably connected to the support plate 10 in the vertical direction.

工作时,如图2和图5所示,定位框7向下移动时支撑板10会带动滑杆17同步向下移动,当滑杆17的底端移动到与底座22的顶面接触后,滑杆17会相对于支撑板10向上移动,滑杆17会带动牵引绳16的一端同步向上移动,牵引绳16的另一端会带动夹紧块14向靠近芯片主体3一侧移动;夹紧块14靠近芯片主体3一端设置为斜面,夹紧块14可以对芯片主体3的位置进行调整,使芯片主体3完全位于定位框7内侧,可以保证芯片主体3的位置在按压时一定处于正确的位置。During operation, as shown in Figures 2 and 5, when the positioning frame 7 moves downward, the support plate 10 will drive the slide bar 17 to move downward synchronously. When the bottom end of the slide bar 17 moves to contact with the top surface of the base 22, the slide bar 17 will move upward relative to the support plate 10, and the slide bar 17 will drive one end of the traction rope 16 to move upward synchronously, and the other end of the traction rope 16 will drive the clamping block 14 to move toward the side close to the chip body 3; the clamping block 14 is set as an inclined surface at one end close to the chip body 3, and the clamping block 14 can adjust the position of the chip body 3 so that the chip body 3 is completely located inside the positioning frame 7, which can ensure that the position of the chip body 3 is in the correct position when pressed.

作为本发明的进一步方案,所述定位框7的内壁上转动安装有托板18,所述托板18的转动轴上套装有扭簧,所述托板18位于限位块8上方且能够被限位块8限位。As a further solution of the present invention, a support plate 18 is rotatably mounted on the inner wall of the positioning frame 7 , a torsion spring is mounted on the rotating shaft of the support plate 18 , and the support plate 18 is located above the limit block 8 and can be limited by the limit block 8 .

工作时,如图4所示,通过托板18的设置,托板18可以代替限位块8对芯片主体3起到支撑作用,限位块8的右端位于托板18的下方时,托板18无法转动;当限位块8在楔形推杆9的作用下向左移动到托板18的左侧后,托板18可以在扭簧的作用下继续对芯片主体3起到支撑作用,可以避免芯片主体突然坠落,然后当压板12向下按压芯片主体3时,芯片主体3可以驱动托板18向下翻转,此时扭簧可以起到缓冲作用,可以使芯片主体3缓慢的向下移动,可以使芯片主体3更稳定的卡入到卡扣4内。During operation, as shown in Figure 4, through the setting of the support plate 18, the support plate 18 can replace the limit block 8 to support the chip body 3. When the right end of the limit block 8 is located below the support plate 18, the support plate 18 cannot rotate; when the limit block 8 moves to the left to the left side of the support plate 18 under the action of the wedge-shaped push rod 9, the support plate 18 can continue to support the chip body 3 under the action of the torsion spring, so as to prevent the chip body from falling suddenly. Then, when the pressure plate 12 presses the chip body 3 downward, the chip body 3 can drive the support plate 18 to flip downward. At this time, the torsion spring can play a buffering role, so that the chip body 3 can move slowly downward, and the chip body 3 can be more stably inserted into the buckle 4.

作为本发明的进一步方案,所述卡扣4的顶部开设有卡槽19,所述卡槽19位于楔形推杆9的正下方。As a further solution of the present invention, a slot 19 is provided on the top of the buckle 4 , and the slot 19 is located directly below the wedge-shaped push rod 9 .

工作时,如图4所示,楔形推杆9向下移动时会插入到卡槽19内,然后楔形推杆9可以在卡槽19的作用下相对于定位框7向上移动,当楔形推杆9向上移动到最高点后,定位框7继续向下移动会使楔形推杆9驱动卡扣4的顶端向外侧弯曲,可以使卡扣4的顶端向外打开,芯片主体3可以更方便的按压到卡扣4内侧。During operation, as shown in Figure 4, the wedge push rod 9 will be inserted into the slot 19 when it moves downward, and then the wedge push rod 9 can move upward relative to the positioning frame 7 under the action of the slot 19. When the wedge push rod 9 moves upward to the highest point, the positioning frame 7 continues to move downward, causing the wedge push rod 9 to drive the top of the buckle 4 to bend outward, so that the top of the buckle 4 can be opened outward, and the chip body 3 can be more conveniently pressed to the inside of the buckle 4.

作为本发明的进一步方案,所述定位杆5上开设有插槽20,所述插槽20为圆台形,所述插槽20上方设置有能够与其对接的插块21,所述插块21与支撑板10固定连接。As a further solution of the present invention, a slot 20 is provided on the positioning rod 5 , and the slot 20 is truncated cone-shaped. An insert block 21 capable of docking with the slot 20 is provided above the slot 20 , and the insert block 21 is fixedly connected to the support plate 10 .

工作时,如图2和图3所示,当支撑板10向下移动到与壳体2的顶面接触时,插块21可以插入到插槽20内,并且插块21与插槽20完全匹配,插块21与插槽20可以对定位框7和定位杆5的位置相互调整,使定位框7和定位杆5相对固定,可以保证壳体2和芯片主体3在装配前位置完全固定,可以使壳体2和芯片主体3更好的进行装配。During operation, as shown in Figures 2 and 3, when the support plate 10 moves downward to contact the top surface of the shell 2, the plug block 21 can be inserted into the slot 20, and the plug block 21 is completely matched with the slot 20. The plug block 21 and the slot 20 can adjust the positions of the positioning frame 7 and the positioning rod 5 to each other, so that the positioning frame 7 and the positioning rod 5 are relatively fixed, which can ensure that the shell 2 and the chip body 3 are completely fixed in position before assembly, so that the shell 2 and the chip body 3 can be better assembled.

工作原理:如图1所示,工作人员将壳体2放置到加工台1的底座22上,使壳体2处于两个定位杆5之间;壳体2放置到位时,壳体2两侧的侧壁与两个定位杆5的内侧壁贴合;两个定位杆5处于非平行状态,壳体2与定位杆5贴合时位置固定;然后工作人员再将芯片主体3放置到定位框7内,限位块8可以对芯片主体3起到支撑作用,使芯片主体3暂时不会下坠;然后第一气缸11启动,第一气缸11会驱动定位框7带动芯片主体3同步向下移动,定位框7会带动楔形推杆9同步向下移动,当楔形推杆9向下移动到与卡扣4顶面接触后,定位框7继续向下移动会使楔形推杆9相对于定位框7向上移动;如图4所示,楔形推杆9会驱动限位块8向左移动,直到限位块8移动到芯片主体3的左侧,此时芯片主体移动到安装位置,并且支撑板10向下移动到与壳体2的顶面贴合,然后第一气缸11停止工作;支撑板10可以使定位框7稳定停止在卡扣4的正上方;然后按压机构启动,按压机构向芯片主体3的中间部位施加压力,将芯片主体3沿着定位框7的内壁向下按压,芯片主体3可以保持与壳体2平行的状态向下移动,直到芯片主体3卡入到两个卡扣4内进行固定,完成芯片主体3的装配;然后按压机构复位,第一气缸11再驱动定位框7向上移动到初始位置;然后电机6可以驱动定位杆5向外侧转动,工作人员即可将壳体2从加工台1上取下,然后电机6再驱动定位杆5转动回初始位置,定位杆5转动到与挡块25接触后电机6停止工作;本发明通过定位机构的设置,定位机构可以稳定的对壳体2进行定位;同时通过装配机构的设置,装配机构可以使芯片主体始终与壳体2保持平行状态,可以使芯片主体3在按压时不会倾斜,可以使芯片主体3更好、更快的装配到壳体2内。Working principle: As shown in FIG1 , the staff places the shell 2 on the base 22 of the processing table 1 so that the shell 2 is between the two positioning rods 5; when the shell 2 is in place, the side walls of the shell 2 fit with the inner side walls of the two positioning rods 5; the two positioning rods 5 are in a non-parallel state, and the position of the shell 2 and the positioning rods 5 is fixed when they fit; then the staff places the chip body 3 into the positioning frame 7, and the limit block 8 can support the chip body 3 so that the chip body 3 will not fall temporarily; then the first cylinder 11 is started, and the first air cylinder 11 is turned on. The cylinder 11 will drive the positioning frame 7 to drive the chip body 3 to move downward synchronously, and the positioning frame 7 will drive the wedge push rod 9 to move downward synchronously. When the wedge push rod 9 moves downward to contact the top surface of the buckle 4, the positioning frame 7 continues to move downward to cause the wedge push rod 9 to move upward relative to the positioning frame 7; as shown in Figure 4, the wedge push rod 9 will drive the limit block 8 to move to the left until the limit block 8 moves to the left side of the chip body 3. At this time, the chip body moves to the installation position, and the support plate 10 moves downward to fit the top surface of the shell 2, and then the first cylinder 1 1 stops working; the support plate 10 can make the positioning frame 7 stop stably just above the buckle 4; then the pressing mechanism is started, and the pressing mechanism applies pressure to the middle part of the chip body 3, pressing the chip body 3 downward along the inner wall of the positioning frame 7, and the chip body 3 can keep moving downward in a state parallel to the shell 2 until the chip body 3 is snapped into the two buckles 4 for fixing, and the assembly of the chip body 3 is completed; then the pressing mechanism is reset, and the first cylinder 11 drives the positioning frame 7 to move upward to the initial position; then the motor 6 can drive the positioning rod 5 to rotate outward, and the staff can remove the shell 2 from the processing table 1, and then the motor 6 drives the positioning rod 5 to rotate back to the initial position, and the motor 6 stops working after the positioning rod 5 rotates to contact the stopper 25; the present invention is provided with a positioning mechanism, and the positioning mechanism can stably position the shell 2; at the same time, through the setting of the assembly mechanism, the assembly mechanism can keep the chip body parallel to the shell 2 at all times, so that the chip body 3 will not tilt when pressed, and the chip body 3 can be better and faster assembled into the shell 2.

需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型,本发明的范围由所附权利要求及其等同物限定。Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims (8)

1.一种COVER与电子芯片高效装配生产装置,包括加工台(1)、壳体(2)及芯片主体(3),所述加工台(1)由底座(22)、支撑柱(23)和顶板(24)组成,所述底座(22)和顶板(24)通过支撑柱(23)连接;所述壳体(2)内固定安装有卡扣(4);其特征在于:所述底座(22)上设置有用于壳体(2)定位的定位机构,所述顶板(24)上设置有用于将芯片主体(3)安装到壳体(2)内的装配机构。1. A COVER and electronic chip efficient assembly production device, comprising a processing table (1), a shell (2) and a chip body (3), wherein the processing table (1) is composed of a base (22), a support column (23) and a top plate (24), wherein the base (22) and the top plate (24) are connected via the support column (23); a buckle (4) is fixedly installed in the shell (2); and the characteristic is that: a positioning mechanism for positioning the shell (2) is provided on the base (22), and an assembly mechanism for installing the chip body (3) into the shell (2) is provided on the top plate (24). 2.根据权利要求1所述的一种COVER与电子芯片高效装配生产装置,其特征在于:所述定位机构包括两个定位杆(5),两个所述定位杆(5)均转动安装在加工台(1)的顶部,所述定位杆(5)的转动轴上均传动连接有电机(6);所述定位杆(5)内侧设置有挡块(25),所述挡块(25)与加工台(1)固定连接。2. A COVER and electronic chip efficient assembly production device according to claim 1, characterized in that: the positioning mechanism includes two positioning rods (5), both of which are rotatably installed on the top of the processing table (1), and the rotating shafts of the positioning rods (5) are transmission-connected to a motor (6); a stopper (25) is provided on the inner side of the positioning rod (5), and the stopper (25) is fixedly connected to the processing table (1). 3.根据权利要求2所述的一种COVER与电子芯片高效装配生产装置,其特征在于:所述装配机构包括定位框(7),所述定位框(7)内弹性滑动安装有两个呈对称布置的限位块(8),所述限位块(8)侧边设置有用于驱动其向外侧移动的楔形推杆(9),所述楔形推杆(9)与定位框(7)在竖直方向上滑动连接;所述定位框(7)外侧壁上固定连接有支撑板(10);所述定位框(7)上方设置有用于驱动其上下移动的第一气缸(11);所述第一气缸(11)固定安装在顶板(24)底部;所述定位框(7)上还设置有按压机构,所述按压机构用于驱动芯片主体(3)。3. A COVER and electronic chip efficient assembly production device according to claim 2, characterized in that: the assembly mechanism includes a positioning frame (7), two symmetrically arranged limit blocks (8) are elastically and slidably installed in the positioning frame (7), and the side of the limit block (8) is provided with a wedge-shaped push rod (9) for driving it to move outward, and the wedge-shaped push rod (9) is slidably connected to the positioning frame (7) in the vertical direction; a support plate (10) is fixedly connected to the outer wall of the positioning frame (7); a first cylinder (11) for driving it to move up and down is arranged above the positioning frame (7); the first cylinder (11) is fixedly installed at the bottom of the top plate (24); a pressing mechanism is also arranged on the positioning frame (7), and the pressing mechanism is used to drive the chip body (3). 4.根据权利要求3所述的一种COVER与电子芯片高效装配生产装置,其特征在于:所述按压机构包括压板(12)和第二气缸(13),所述第二气缸(13)安装在定位框(7)的顶部,所述压板(12)固定安装在第二气缸(13)的输出端上。4. A COVER and electronic chip efficient assembly production device according to claim 3, characterized in that: the pressing mechanism includes a pressing plate (12) and a second cylinder (13), the second cylinder (13) is installed on the top of the positioning frame (7), and the pressing plate (12) is fixedly installed on the output end of the second cylinder (13). 5.根据权利要求3所述的一种COVER与电子芯片高效装配生产装置,其特征在于:所述定位框(7)侧壁上滑动连接有夹紧块(14),所述夹紧块(14)上固定连接有用于其复位的弹簧(15),所述夹紧块(14)上固定连接有牵引绳(16),所述牵引绳(16)远离夹紧块(14)一端固定连接有滑杆(17),所述滑杆(17)与支撑板(10)在竖直方向上滑动连接。5. A COVER and electronic chip efficient assembly production device according to claim 3, characterized in that: a clamping block (14) is slidably connected to the side wall of the positioning frame (7), a spring (15) for resetting the clamping block (14) is fixedly connected to the clamping block (14), a traction rope (16) is fixedly connected to the clamping block (14), a sliding rod (17) is fixedly connected to one end of the traction rope (16) away from the clamping block (14), and the sliding rod (17) is slidably connected to the support plate (10) in the vertical direction. 6.根据权利要求3所述的一种COVER与电子芯片高效装配生产装置,其特征在于:所述定位框(7)的内壁上转动安装有托板(18),所述托板(18)的转动轴上套装有扭簧,所述托板(18)位于限位块(8)上方且能够被限位块(8)限位。6. A COVER and electronic chip efficient assembly production device according to claim 3, characterized in that: a support plate (18) is rotatably mounted on the inner wall of the positioning frame (7), a torsion spring is mounted on the rotating shaft of the support plate (18), and the support plate (18) is located above the limit block (8) and can be limited by the limit block (8). 7.根据权利要求3所述的一种COVER与电子芯片高效装配生产装置,其特征在于:所述卡扣(4)的顶部开设有卡槽(19),所述卡槽(19)位于楔形推杆(9)的正下方。7. A COVER and electronic chip efficient assembly production device according to claim 3, characterized in that: a card slot (19) is opened on the top of the buckle (4), and the card slot (19) is located directly below the wedge-shaped push rod (9). 8.根据权利要求3所述的一种COVER与电子芯片高效装配生产装置,其特征在于:所述定位杆(5)上开设有插槽(20),所述插槽(20)为圆台形,所述插槽(20)上方设置有能够与其对接的插块(21),所述插块(21)与支撑板(10)固定连接。8. A COVER and electronic chip efficient assembly production device according to claim 3, characterized in that: a slot (20) is provided on the positioning rod (5), the slot (20) is truncated cone-shaped, and an insert block (21) capable of docking with the slot (20) is provided above the slot (20), and the insert block (21) is fixedly connected to the support plate (10).
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646435A (en) * 1985-10-04 1987-03-03 Raychem Corporation Chip carrier alignment device and alignment method
CN112505530A (en) * 2020-12-17 2021-03-16 西安科恩特精密机械有限公司 Self-aligning power semiconductor chip test fixture
CN215393643U (en) * 2021-08-18 2022-01-04 冯想金 Shell pressing device for electronic product production
CN114300367A (en) * 2021-11-29 2022-04-08 桂林芯飞光电子科技有限公司 Chip mounting equipment and chip mounting method
CN216541758U (en) * 2021-12-20 2022-05-17 泰州欣康生物技术有限公司 Device for assembling chip
CN216748775U (en) * 2021-10-27 2022-06-14 嘉兴联控汽车部件有限公司 COVER and electronic chip integral type integrated configuration
CN220222279U (en) * 2023-05-22 2023-12-22 苏州旭钢电子科技有限公司 Automatic feeding device for terminal element
CN220341166U (en) * 2023-07-14 2024-01-12 重庆海宏信科技有限公司 Packaging machine for chip processing
CN117484162A (en) * 2023-12-29 2024-02-02 深圳市群星浩达科技有限公司 Intelligent LED module shaping machine
CN220761694U (en) * 2023-09-08 2024-04-12 新疆工业职业技术学院(新疆钢铁高级技工学校) A fixing fixture for machining

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646435A (en) * 1985-10-04 1987-03-03 Raychem Corporation Chip carrier alignment device and alignment method
CN112505530A (en) * 2020-12-17 2021-03-16 西安科恩特精密机械有限公司 Self-aligning power semiconductor chip test fixture
CN215393643U (en) * 2021-08-18 2022-01-04 冯想金 Shell pressing device for electronic product production
CN216748775U (en) * 2021-10-27 2022-06-14 嘉兴联控汽车部件有限公司 COVER and electronic chip integral type integrated configuration
CN114300367A (en) * 2021-11-29 2022-04-08 桂林芯飞光电子科技有限公司 Chip mounting equipment and chip mounting method
CN216541758U (en) * 2021-12-20 2022-05-17 泰州欣康生物技术有限公司 Device for assembling chip
CN220222279U (en) * 2023-05-22 2023-12-22 苏州旭钢电子科技有限公司 Automatic feeding device for terminal element
CN220341166U (en) * 2023-07-14 2024-01-12 重庆海宏信科技有限公司 Packaging machine for chip processing
CN220761694U (en) * 2023-09-08 2024-04-12 新疆工业职业技术学院(新疆钢铁高级技工学校) A fixing fixture for machining
CN117484162A (en) * 2023-12-29 2024-02-02 深圳市群星浩达科技有限公司 Intelligent LED module shaping machine

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