CN118714821A - A gas-liquid dual cooling heat dissipation system for radio frequency power supply - Google Patents
A gas-liquid dual cooling heat dissipation system for radio frequency power supply Download PDFInfo
- Publication number
- CN118714821A CN118714821A CN202411031562.2A CN202411031562A CN118714821A CN 118714821 A CN118714821 A CN 118714821A CN 202411031562 A CN202411031562 A CN 202411031562A CN 118714821 A CN118714821 A CN 118714821A
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- Prior art keywords
- cooling
- liquid
- water
- flow channel
- heat dissipation
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a gas-liquid double-cooling type heat dissipation system for a radio frequency power supply, which comprises a water cooling disc arranged on a radio frequency power supply PCB (printed circuit board), a heat exchange module and an air cooling assembly, wherein the heat exchange module comprises a liquid cooling runner and heat dissipation fins; the liquid cooling flow channel is communicated with the water cooling flow channel in the water cooling disc, the liquid cooling flow channel flows through the radiating fins, and the radiating fins radiate heat of liquid flowing through the liquid cooling flow channel; the air cooling assembly is located on the side face of the radiating fin, and an air duct of the air cooling assembly passes through the vicinity of components arranged on the PCB. The invention reasonably utilizes the advantages of larger specific heat capacity of liquid in the water cooling flow channel and rapid water exchange and heat dissipation, increases the heat exchange module, takes away the heat of the liquid in the water cooling flow channel by utilizing the heat dissipation fins of the heat exchange module, and simultaneously adds the air cooling component on the heat dissipation fins, so that the heat dissipation effects of the heat exchange module and the heat dissipation component complement each other, the design space is effectively reduced, and the waste of the design cost is reduced.
Description
Technical Field
The invention relates to the field of equipment heat dissipation, in particular to a heat dissipation system suitable for a radio frequency power supply.
Background
Radio frequency power sources play a critical role in many industrial applications, such as in semiconductor manufacturing, medical devices, and communication systems. However, in the normal operating state of some electronic components such as capacitors and inductors of a common radio frequency power supply, the operating temperature can reach 70-80 ℃, and when the radio frequency power supply is operated, a large amount of heat can be generated inside the radio frequency power supply, and if the heat cannot be effectively dissipated, the performance and stability of the equipment can be negatively affected. Therefore, it is necessary to study the heat dissipation method of the rf power supply.
At present, the effect is better that the substrate is cooled by adopting a water cooling mode, but the cooling effect of the water cooling disc is mainly aimed at the substrate, the obvious effect is that the water cooling disc contacts the surface of the substrate, and welding parts such as a patch part, a capacitor inductor and the like which are positioned right above the PCB cannot be considered, and in the face of the situation, the fan is usually arranged at the windward place to realize air cooling and dissipate heat generated by internal components of the radio frequency power supply, but the effect of the heat dissipation mode is not obvious, and in order to achieve better heat dissipation effect, the problems are solved only by enlarging the fan blade and accelerating the air flow speed, but along with the enlargement of the fan blade, the problems are also very obvious: firstly, the noise is increased, secondly, the design of the internal space of the radio frequency power supply can be influenced, and the design cost and the waste of the design space are caused.
Disclosure of Invention
The invention aims to: aiming at the defects of the prior art, the invention provides a gas-liquid double-cooling type heat dissipation system for a radio frequency power supply, which is based on a liquid cooling mode on the premise of not influencing the arrangement of the internal space of the radio frequency power supply, and an air cooling device is added to conduct targeted heat dissipation, so that the heat dissipation effects of the two are brought out in the best.
In order to achieve the above purpose, the invention provides a gas-liquid double-cooling type heat dissipation system for a radio frequency power supply, which comprises a water cooling disc arranged on a radio frequency power supply PCB board, a heat exchange module and an air cooling assembly, wherein the heat exchange module comprises a liquid cooling runner and a heat dissipation fin;
The liquid cooling flow channel is communicated with the water cooling flow channel in the water cooling disc, the liquid cooling flow channel flows through the radiating fins, and the radiating fins radiate heat of liquid flowing through the liquid cooling flow channel;
The air cooling assembly is located on the side face of the radiating fin, and an air duct of the air cooling assembly passes through the vicinity of components arranged on the PCB.
The further preferable technical scheme of the invention is that the liquid cooling runner is communicated with the water cooling runner at the near water inlet end of the water cooling runner; the radiating fins are positioned at the near water inlet end of the liquid cooling runner.
Preferably, the water cooling flow channel and the air cooling component are respectively positioned at two sides of the heat exchange module.
Preferably, the heat dissipation fins and the air cooling component are integrally designed.
Preferably, the water-cooling disc is made of aluminum alloy, and is welded by silver-based brazing powder; and a pipeline made of red copper is arranged on the water-cooling disc and is used as a water-cooling flow passage, and the water-cooling flow passage is fixed with the water-cooling disc through a fastener.
Preferably, the liquid cooling runner is a pipeline made of red copper.
Preferably, the liquid cooling flow channel is fixed on the radiating fin in a pressing mode.
Preferably, the liquid cooling flow channel is located above the radiating fin, the air cooling assembly is located in the middle of the liquid cooling flow channel, and the air channel passes through the liquid cooling flow channel.
The beneficial effects are that: the invention is faced with the situation that a fan at a specific position is needed to perform air-cooled heat dissipation under the condition that the heating value of a radio frequency power supply high-temperature electronic element is generated, the heat dissipation effect is not obvious and the design space is wasted, the heat exchange module is added on the basis of reasonably utilizing the advantages of larger specific heat capacity of liquid in the water cooling flow channel and rapid water exchange and heat dissipation, the heat dissipation fins of the heat exchange module are utilized to take away the heat of the liquid in the water cooling flow channel, and meanwhile, the air cooling assembly is added on the heat dissipation fins, so that the air flow is led to fill the middle layer of the machine body, and the heat dissipation effect of the two is mutually complement each other by virtue of the advantage of rapid heat dissipation of the water cooling system, so that the design space is effectively reduced and the waste of the design cost is reduced.
According to the gas-liquid double-cooling type heat dissipation system for the radio frequency power supply, the near end of the water inlet of the water cooling disc is welded with the integrated fin and air cooling heat dissipation assembly. The fan and the fins are in cooperative action through the near-end welded connection of the water inlet of the water cooling disc, the water cooling disc can effectively reduce the temperature of the high-temperature electronic device on the surface of the water cooling disc, and meanwhile, the temperature of air quantity provided near the air cooling assembly can be timely dissipated to the greatest extent, so that the heat exchange of the liquid cooling water pipe achieves the effect of dual heat dissipation, the advantage of strong specific heat capacity of liquid is amplified, and the installation position of the air cooling heat dissipation assembly is arranged at the height of the middle layer of the liquid cooling disc, which is not easy to dissipate heat. The air fluidity near the electronic device of the middle layer is increased, and the requirement of circulating heat dissipation is met. The water cooling pipe changes water in a circulating way, so that the heat in the whole machine is greatly reduced, and the heat exchange effect which can be achieved by using a refrigerant is replaced.
Compared with the traditional liquid cooling disc, the aluminum alloy and the red copper are assembled by using the fastening piece and welded by using the silver-based brazing powder, the aluminum alloy which is the material component of the liquid cooling disc occupies the vast majority, and the red copper consumption is reduced and the cost is greatly reduced while the heat dissipation requirement is met; the weight is reduced, the safety is relatively improved, the space is saved at the welding installation position of the heat exchanger fins, and the air cooling effect is better under the promotion of the water cooling disc. The body volume advantage is obvious, the cost is saved, and the product competitiveness is improved.
Drawings
FIG. 1 is a schematic diagram of a gas-liquid dual cooling heat dissipation system for a RF power supply according to the present invention;
FIG. 2 is a schematic diagram of a heat exchange module according to the present invention;
in the figure, a 1-water cooling disc, a 2-heat exchange module, a 3-air cooling assembly, an 11-water cooling runner, a 21-liquid cooling runner and 22-radiating fins are arranged.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions thereof will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments, which should not be construed as limiting the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. In the description of the present invention, it is to be understood that the terminology used is for the purpose of description only and is not to be interpreted as indicating or implying relative importance.
The following describes a gas-liquid double-cooling type heat dissipation system for a radio frequency power supply according to the present invention with reference to fig. 1 to 2.
Examples: the embodiment provides a gas-liquid double-cooling type heat dissipation system for a radio frequency power supply, which comprises a water cooling disc 1, a heat exchange module 2 and an air cooling assembly 3, wherein the water cooling disc 1 is arranged on a radio frequency power supply PCB.
The water cooling disc 1 is made of aluminum alloy, and is welded by silver-based brazing powder; a pipe made of red copper is arranged on the water-cooled disk 1 and is used as a water-cooled runner 11, and the water-cooled runner 11 is fixed with the water-cooled disk 1 through a fastener.
The heat exchange module 2 comprises a liquid cooling runner 21 and radiating fins 22. The liquid cooling flow channel 21 is a pipe made of red copper. The liquid cooling flow channels 21 are fixed to the heat radiating fins 22 by pressing.
The air cooling component 3 is a plurality of fans.
The water cooling flow channel 11 and the air cooling component 3 are respectively positioned at two sides of the heat exchange module. The air duct of the air cooling assembly 3 passes near the components arranged on the PCB. The heat radiating fins 22 are integrally designed with the air cooling module 3. The liquid cooling flow channels 21 are located above the radiating fins 22, the air cooling assembly 3 is located in the middle of the liquid cooling flow channels 21, and the air channels penetrate through the liquid cooling flow channels 21.
The liquid cooling flow channel 21 is communicated with the water cooling flow channel 11 in the water cooling disc 1, the liquid cooling flow channel 21 flows through the radiating fins 22, and the radiating fins 22 radiate heat of the liquid flowing through the liquid cooling flow channel 21; the liquid cooling runner 21 is communicated with the water cooling runner 11 at the water inlet end of the water cooling runner 11; the heat dissipation fin 22 is located at the water inlet end of the liquid cooling channel 21.
The water cooling device is characterized in that ordinary water is used for being connected into a water inlet of the water cooling flow passage 11, after passing through a section of length in the water cooling disc 1, the water enters the heat exchange module 2, a part of heat in a water pipe can be taken away by the heat radiating fins 22 of the heat exchange module 2, meanwhile, the air cooling assembly 3 is also used for radiating heat for an upper device, cooled water enters the water cooling flow passage 11 again through the liquid cooling flow passage 21, and the temperature of a high-heating-value device is taken away, so that the normal work of the high-heating-value device is ensured. The structure reduces the volume of the fan and saves the internal space of the equipment.
As described above, although the present invention has been shown and described with reference to certain preferred embodiments, it is not to be construed as limiting the invention itself. Various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. The gas-liquid double-cooling type heat dissipation system for the radio frequency power supply comprises a water cooling disc arranged on a radio frequency power supply PCB board, and is characterized by further comprising a heat exchange module and an air cooling assembly, wherein the heat exchange module comprises a liquid cooling runner and heat dissipation fins;
The liquid cooling flow channel is communicated with the water cooling flow channel in the water cooling disc, the liquid cooling flow channel flows through the radiating fins, and the radiating fins radiate heat of liquid flowing through the liquid cooling flow channel;
The air cooling assembly is located on the side face of the radiating fin, and an air duct of the air cooling assembly passes through the vicinity of components arranged on the PCB.
2. The dual cooling system of claim 1, wherein the liquid cooling channel is in communication with the water cooling channel at a water inlet end of the water cooling channel; the radiating fins are positioned at the near water inlet end of the liquid cooling runner.
3. The dual cooling system of claim 1, wherein the water cooling channels and the air cooling assembly are respectively located at two sides of the heat exchange module.
4. A dual cooling system for a radio frequency power supply according to claim 3, wherein the heat dissipating fins are integrally designed with the air cooling assembly.
5. The gas-liquid double cooling type heat radiation system for radio frequency power supply according to claim 1, wherein the water cooling disc is made of aluminum alloy, and is welded by silver-based brazing powder; and a pipeline made of red copper is arranged on the water-cooling disc and is used as a water-cooling flow passage, and the water-cooling flow passage is fixed with the water-cooling disc through a fastener.
6. The dual cooling system for a radio frequency power source according to claim 1, wherein the liquid cooling flow channel is a pipe made of red copper.
7. The dual cooling system for a radio frequency power supply according to claim 6, wherein the liquid cooling flow channel is fixed on the heat radiating fin by pressing.
8. The dual cooling system of claim 1, wherein the liquid cooling channels are located above the cooling fins, the air cooling assembly is located in the middle of the liquid cooling channels, and the air duct passes through the liquid cooling channels.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411031562.2A CN118714821A (en) | 2024-07-30 | 2024-07-30 | A gas-liquid dual cooling heat dissipation system for radio frequency power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411031562.2A CN118714821A (en) | 2024-07-30 | 2024-07-30 | A gas-liquid dual cooling heat dissipation system for radio frequency power supply |
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| Publication Number | Publication Date |
|---|---|
| CN118714821A true CN118714821A (en) | 2024-09-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411031562.2A Pending CN118714821A (en) | 2024-07-30 | 2024-07-30 | A gas-liquid dual cooling heat dissipation system for radio frequency power supply |
Country Status (1)
| Country | Link |
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| CN (1) | CN118714821A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120417352A (en) * | 2025-07-07 | 2025-08-01 | 苏州元脑智能科技有限公司 | Dual-mode heat dissipation device and heat dissipation method |
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| CN219329930U (en) * | 2022-10-29 | 2023-07-11 | 深圳市瀚强科技股份有限公司 | Electronic equipment and electric equipment |
| CN219955530U (en) * | 2023-05-15 | 2023-11-03 | 浙江大荣电气有限公司 | Magnetic-retaining semiconductor air conditioner |
| CN117881164A (en) * | 2024-01-29 | 2024-04-12 | 江苏神州半导体科技有限公司 | A method and system for controlling heat dissipation of radio frequency power supply |
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2024
- 2024-07-30 CN CN202411031562.2A patent/CN118714821A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110719718A (en) * | 2019-09-26 | 2020-01-21 | 珠海格力电器股份有限公司 | Heat dissipation system, air conditioner and control method of air conditioner |
| CN213816733U (en) * | 2020-12-31 | 2021-07-27 | 杭州中科极光科技有限公司 | Heat dissipation device and laser light source |
| CN113311929A (en) * | 2021-06-25 | 2021-08-27 | 郑州轻工业大学 | Air-cooling and liquid-cooling integrated CPU radiator and radiating method |
| CN217283820U (en) * | 2021-12-24 | 2022-08-23 | 固赢科技(深圳)有限公司 | Power supply with air cooling and liquid cooling device |
| CN115666086A (en) * | 2022-10-29 | 2023-01-31 | 深圳市瀚强科技股份有限公司 | Heat dissipation device, electronic equipment and electric equipment |
| CN219329930U (en) * | 2022-10-29 | 2023-07-11 | 深圳市瀚强科技股份有限公司 | Electronic equipment and electric equipment |
| CN219955530U (en) * | 2023-05-15 | 2023-11-03 | 浙江大荣电气有限公司 | Magnetic-retaining semiconductor air conditioner |
| CN117881164A (en) * | 2024-01-29 | 2024-04-12 | 江苏神州半导体科技有限公司 | A method and system for controlling heat dissipation of radio frequency power supply |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120417352A (en) * | 2025-07-07 | 2025-08-01 | 苏州元脑智能科技有限公司 | Dual-mode heat dissipation device and heat dissipation method |
| CN120417352B (en) * | 2025-07-07 | 2025-09-16 | 苏州元脑智能科技有限公司 | Dual-mode heat dissipation device and heat dissipation method |
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Application publication date: 20240927 |