CN118699221A - An electronic diode component pin bending and forming device - Google Patents

Abstract

The invention relates to the field of diode processing, in particular to pin bending forming equipment for electronic diode components, which comprises a mounting shell, wherein a lower fixing mechanism is arranged at the bottom of an inner cavity of the mounting shell, an upper fixing mechanism which is identical to the lower fixing mechanism in structure and is arranged in an up-down symmetrical manner is arranged above the lower fixing mechanism, a driving mechanism for driving the upper fixing mechanism to move is arranged at the top of the inner cavity of the mounting shell, and rotary alignment mechanisms are arranged on the left outer wall and the right outer wall of the mounting shell. According to the invention, the upper fixing mechanism is pushed to move forwards and downwards by the electric telescopic rod of the single driving source to be matched with the lower fixing mechanism to fix the diode, and the lower pressing assembly can drive the rotating assembly to drive the aligning assembly to rotate downwards by the rack when the upper fixing mechanism moves downwards, so that the aligning assembly can squeeze and align pins at two ends of the diode, the time spent on fixing, aligning and bending the diode is shortened, and the bending efficiency of the pins of the diode is improved.

Description

An electronic diode component pin bending and forming device

Technical Field

The invention relates to the technical field of diode processing, in particular to a device for bending and forming pins of electronic diode components.

Background Art

A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). When a forward voltage is applied between the two poles of the diode, the diode is turned on, and when a reverse voltage is applied, the diode is turned off. The conduction and cutoff of a diode are equivalent to the on and off of a switch. A diode is a common semiconductor component. The bending of the pins of a diode component is to facilitate installation, reduce errors, save space, and improve the mechanical strength and stability of the component. It is a common production practice that is conducive to the application and fixation of electronic components on circuit boards.

When the existing diode pin bending equipment is working, the diode is generally placed in the fixing box first, and the pins at both ends of the diode are exposed outside the fixing box. Then, the pins at both ends of the diode are aligned, the box cover of the fixing box is closed to press the diode, and then the fixing box is sent into the pin bending equipment. Finally, the pins of the diode are bent by controlling the bending equipment to push the pin pressing block downward. The above-mentioned diode pin bending steps have the following shortcomings: 1. It is necessary to manually install the diode into the fixing box first, and then install the fixing box into the bending equipment, and finally operate the bending equipment to bend the pins of the diode. The pressing and fixing of the fixing box require manual control, which affects the efficiency of the pin bending; 2. After the existing fixing box fixes the diode, the exposed length of the pins at both ends of the diode is fixed, so only pins of a specific length can be bent. When the pins need to be bent to different lengths, different fixing boxes need to be replaced, which increases the cost of pin bending.

Summary of the invention

In order to solve the above problems, the present invention provides an electronic diode component pin bending and forming device, including a mounting shell, a lower fixing mechanism is installed at the bottom of the inner cavity of the mounting shell, an upper fixing mechanism with the same structure as the lower fixing mechanism and symmetrically arranged up and down is arranged above the lower fixing mechanism, a driving mechanism for driving the upper fixing mechanism to move is installed on the top of the inner cavity of the mounting shell, bending mechanisms are installed on the left and right sides of the upper fixing mechanism for sliding up and down, and a rotating alignment mechanism is installed on the left and right outer walls of the mounting shell.

The lower fixing mechanism comprises a fixing assembly installed at the bottom of the inner cavity of the mounting shell, a plurality of telescopic assemblies are installed in the fixing assembly, and a width adjustment assembly is fixedly connected to one end of the telescopic assembly away from the fixing assembly.

The driving mechanism comprises a buffer assembly fixedly connected to the top of the upper fixing mechanism, an electric telescopic rod is fixedly installed inside the mounting shell, and a pressing assembly for driving the buffer assembly to move forward and downward is installed on the output shaft of the electric telescopic rod.

The rotation alignment mechanism comprises an alignment component rotatably mounted on the outer wall of the mounting shell, a rotation component for driving the alignment component is rotatably mounted inside the mounting shell, and racks for driving the rotation component are symmetrically mounted on the left and right sides of the pressing component.

In a possible implementation, horizontal grooves are symmetrically provided on the left and right side walls of the mounting shell, a retaining bar located at the front end of the horizontal groove is fixedly connected to the inner wall of the mounting shell, and windows are provided at the front end and left and right sides of the mounting shell.

In one possible implementation, the fixing assembly includes a fixing block fixedly installed at the bottom of the inner cavity of the mounting shell, the top of the fixing block is provided with a plurality of placement grooves equidistantly distributed front and back, and the top of the fixing block is provided with a pin groove symmetrically distributed on the left and right sides of the placement groove.

In one possible implementation, the telescopic assembly includes left and right spiral screws rotatably mounted inside a fixed block, the left and right ends of the left and right spiral screws are threaded with telescopic sleeves, the telescopic sleeves are slidably mounted left and right inside the fixed block, the middle parts of the left and right spiral screws are fixedly sleeved with a worm wheel, the bottom of the worm wheel is meshed with a worm, the worm is rotatably mounted inside a mounting shell, and the front end of the worm passes through the front end of the fixed block and is fixedly connected to a knob.

In one possible implementation, the width adjustment assembly includes an adjustment plate fixedly connected to the telescopic sleeve, the adjustment plate is symmetrically distributed about the fixed block, and a plurality of equally spaced pin grooves 2 are provided on the top of the adjustment plate, and the positions of the pin grooves 2 and the pin grooves 1 correspond one-to-one.

In one possible implementation, the buffer assembly includes a top plate slidably mounted inside the mounting shell, the bottom of the top plate is fixedly connected to a plurality of elastic telescopic rods, and the bottom ends of the elastic telescopic rods are fixedly mounted on the top of the corresponding fixed blocks of the upper fixing mechanism.

In one possible implementation, the pressing assembly includes a fixing plate fixedly mounted on the top of the top plate and symmetrically distributed on the left and right sides, a plurality of guide grooves are opened inside the fixing plate, the front ends of the guide grooves are inclined upward, the telescopic end of the electric telescopic rod is fixedly connected with a plurality of guide rods, the guide rods are slidably mounted inside the guide grooves, the front end of the telescopic end of the electric telescopic rod is fixedly connected with an elastic telescopic rod 2, the top of the top plate is fixedly connected with a vertical slide, the front end of the elastic telescopic rod 2 is slidably mounted inside the vertical slide, and the end of the guide rod away from the electric telescopic rod is slidably mounted inside the horizontal groove.

In one possible implementation, the bending mechanism includes a slide groove opened inside the upper fixing mechanism corresponding to the adjustment plate, a slider is installed inside the slide groove for sliding up and down, a return spring is fixedly connected between the bottom surface of the slider and the bottom wall of the slide groove, and a bending plate is fixedly connected to the side of the slider away from the adjustment plate.

In one possible implementation, the alignment assembly includes an L-shaped rotating rod that is rotatably mounted on the outer wall of the mounting shell through a round rod, and an alignment plate is fixedly connected to one end of the rotating rod away from the mounting shell. When the rotating rod is rotated downward by ninety degrees, the alignment plate moves to the same height as the second pin groove on the lower fixing mechanism.

In one possible implementation, the rotating assembly includes a rotating shaft rotatably mounted inside a mounting shell, a gear is fixedly sleeved on the outside of the rotating shaft, the gear is located below the baffle bar, the rotating shaft is transmission-connected to a round rod via a bevel gear set, a rack is meshed on the top of the gear, and the rack is fixedly connected to one end of the guide rod away from the electric telescopic rod.

The beneficial effects of the present invention are as follows: 1. The present invention uses a single driving source, the electric telescopic rod, to push the upper fixing mechanism forward and downward to cooperate with the lower fixing mechanism to fix the diode. While the upper fixing mechanism moves downward, the lower pressing component can also drive the rotating component to drive the alignment component to rotate downward through the rack, so that the alignment component can squeeze and align the pins at both ends of the diode. After the upper fixing mechanism presses the diode, the electric telescopic rod can also push the buffer component to continue moving downward and push the bending mechanism to move downward to bend the pins of the diode, thereby shortening the time required for fixing, aligning and bending the diode and improving the efficiency of bending the diode pins.

2. The present invention uses a driving mechanism and a rotating alignment mechanism in coordination, and utilizes an alignment component to flatten and align the pins at both ends of the diode, so that all the diodes can be placed in the center, and the pins at both ends of the diode can be kept at the same length, so that the pins at both ends of the diode can be bent to the same length, thereby improving the accuracy of the bending of the diode pins.

3. The present invention uses a telescopic component and a width adjustment component in coordination. The telescopic component that moves telescopically pushes the width adjustment component to move in a direction away from the fixed component. The distance between the width adjustment component and the fixed component can be adjusted, thereby supporting different positions of the pins. The bending mechanism can bend the pins at different lengths to meet the bending needs of diode pins of different lengths. There is no need to replace different fixing boxes, which is beneficial to reducing the cost of diode bending.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of the three-dimensional structure of the present invention.

FIG. 2 is a schematic diagram of the planar structure of the front elevation of the present invention.

FIG. 3 is a schematic diagram of the three-dimensional structure of the diode of the present invention when it is placed on the lower fixing mechanism.

FIG. 4 is a schematic diagram of a three-dimensional structure of a partial cross-section of the lower fixing mechanism of the present invention.

FIG. 5 is a schematic diagram of the three-dimensional structure of the mounting frame of the present invention when it is cut open.

FIG. 6 is a schematic diagram of the three-dimensional structure of the driving mechanism of the present invention.

FIG. 7 is a schematic diagram of the planar structure of the bending mechanism of the present invention.

FIG. 8 is a schematic diagram of the three-dimensional structure of the rotating assembly of the present invention.

In the figure: 1, mounting shell; 11, horizontal groove; 12, stop bar; 2, lower fixing mechanism; 21, fixing assembly; 211, fixing block; 212, placement groove; 213, pin groove one; 22, telescopic assembly; 221, left and right spiral screws; 222, telescopic sleeve; 223, worm gear; 224, worm; 225, knob; 23, width adjustment assembly; 231, adjustment plate; 232, pin groove two; 3, upper fixing mechanism; 4, driving mechanism; 41, buffer assembly; 411, top plate; 41 2. Elastic telescopic rod 1; 42. Electric telescopic rod; 43. Pressing assembly; 431. Fixed plate; 432. Guide groove; 433. Guide rod; 434. Elastic telescopic rod 2; 435. Vertical slide; 5. Bending mechanism; 51. Slide groove; 52. Sliding block; 53. Return spring; 54. Bending plate; 6. Rotating alignment mechanism; 61. Alignment assembly; 611. Rotating rod; 612. Alignment plate; 62. Rotating assembly; 621. Rotating shaft; 622. Gear; 63. Rack; 7. Diode.

DETAILED DESCRIPTION

In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described below, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

Please refer to Figures 1 and 2, an electronic diode component pin bending and forming device includes a mounting shell 1, a lower fixing mechanism 2 is installed at the bottom of the inner cavity of the mounting shell 1, an upper fixing mechanism 3 with the same structure and symmetrically arranged above and below is arranged above the lower fixing mechanism 2, a driving mechanism 4 for driving the upper fixing mechanism 3 to move is installed at the top of the inner cavity of the mounting shell 1, bending mechanisms 5 are installed on the left and right sides of the upper fixing mechanism 3 for sliding up and down, and a rotating alignment mechanism 6 is installed on the left and right outer walls of the mounting shell 1.

Please refer to Figures 1 and 3. The lower fixing mechanism 2 includes a fixing component 21 installed at the bottom of the inner cavity of the mounting shell 1. A plurality of telescopic components 22 are installed in the fixing component 21. One end of the telescopic component 22 away from the fixing component 21 is fixedly connected to a width adjustment component 23.

Please refer to Figures 1, 5 and 6. The driving mechanism 4 includes a buffer assembly 41 fixedly connected to the top of the upper fixing mechanism 3, an electric telescopic rod 42 is fixedly installed inside the mounting shell 1, and a pressing assembly 43 for driving the buffer assembly 41 to move forward and downward is installed on the output shaft of the electric telescopic rod 42.

Please refer to Figures 1, 5 and 8. The rotational alignment mechanism 6 includes an alignment component 61 rotatably mounted on the outer wall of the mounting shell 1, a rotation component 62 for driving the alignment component 61 is rotatably mounted inside the mounting shell 1, and racks 63 for driving the rotation component 62 are symmetrically mounted on the left and right sides of the pressing component 43.

1, 2 and 5, the left and right side walls of the installation shell 1 are symmetrically provided with horizontal grooves 11, the inner wall of the installation shell 1 is fixedly connected with a blocking bar 12 located at the front end of the horizontal groove 11, and the front end and left and right sides of the installation shell 1 are provided with windows.

The horizontal groove 11 guides and supports the pressing assembly 43 , facilitating the movement of the pressing assembly 43 ; the diode 7 is conveniently placed on the lower fixing mechanism 2 through the windows opened on the left and right sides of the mounting shell 1 .

Please refer to Figures 1, 3 and 4. The fixing component 21 includes a fixing block 211 fixedly installed at the bottom of the inner cavity of the mounting shell 1. The top of the fixing block 211 is provided with a plurality of placement grooves 212 equidistantly distributed front and back. The top of the fixing block 211 is provided with a pin groove 213 symmetrically distributed on the left and right sides of the placement groove 212.

The placement groove 212 is used to hold the diode 7 and limit the position of the diode 7. The pins at both ends of the diode 7 are exposed to the outside of the fixing block 211 from the pin groove 1 213.

Please refer to Figures 1, 3 and 4. The telescopic assembly 22 includes left and right spiral screws 221 rotatably installed inside the fixed block 211. The left and right ends of the left and right spiral screws 221 are threaded with telescopic sleeves 222. The telescopic sleeves 222 are slidably installed inside the fixed block 211. The middle part of the left and right spiral screws 221 is fixedly sleeved with a worm wheel 223. The bottom of the worm wheel 223 is meshed with a worm 224. The worm 224 is rotatably installed inside the mounting shell 1. The front end of the worm 224 passes through the front end of the fixed block 211 and is fixedly connected to a knob 225.

Please refer to Figures 1, 3 and 4. The width adjustment component 23 includes an adjustment plate 231 fixedly connected to the telescopic sleeve 222. The adjustment plate 231 is symmetrically distributed about the fixed block 211. A plurality of equally spaced pin grooves 232 are provided on the top of the adjustment plate 231. The pin grooves 232 correspond to the pin grooves 1 213 in one-to-one position.

The adjusting plate 231 supports the pin of the diode 7. The worm 224 can be driven to rotate by rotating the knob 225, and the worm 224 drives the worm wheel 223 and the left and right spiral screws 221 to rotate, so that the telescopic sleeve 222 can move outward along the left and right spiral screws 221, thereby pushing the adjusting plate 231 away from the fixing block 211, and adjusting the distance between the adjusting plate 231 and the fixing block 211, thereby adjusting the length of the pin of the diode 7 exposed outside the adjusting plate 231. Similarly, the upper fixing mechanism 3 can be adjusted to facilitate bending the pin of the diode 7 to different lengths.

Please refer to Figures 1, 2 and 7. The buffer assembly 41 includes a top plate 411 slidably mounted inside the mounting shell 1, and a plurality of elastic telescopic rods 412 are fixedly connected to the bottom of the top plate 411. The bottom ends of the elastic telescopic rods 412 are fixedly mounted on the top of the corresponding fixed blocks 211 of the upper fixing mechanism 3.

Please refer to Figures 1, 5, 6 and 8. The pressing assembly 43 includes a fixing plate 431 which is fixedly mounted on the top of the top plate 411 and is symmetrically distributed on the left and right sides. A plurality of guide grooves 432 are opened inside the fixing plate 431. The front ends of the guide grooves 432 are inclined upward. The telescopic ends of the electric telescopic rods 42 are fixedly connected with a plurality of guide rods 433. The guide rods 433 are slidably mounted inside the guide grooves 432. The front ends of the telescopic ends of the electric telescopic rods 42 are fixedly connected with elastic telescopic rod 2 434. A vertical slide 435 is fixedly connected to the top of the top plate 411. The front ends of the elastic telescopic rod 2 434 are slidably mounted inside the vertical slide 435. The end of the guide rod 433 away from the electric telescopic rod 42 is slidably mounted inside the horizontal groove 11.

The guide rod 433 is pushed forward by the electric telescopic rod 42. Due to the elastic obstruction of the elastic telescopic rod 434, the electric telescopic rod 42 will push the pressing assembly 43 and the buffer assembly 41 to move forward together, and move the upper fixing mechanism 3 from the rear to just above the lower fixing mechanism 2. When the fixing plate 431 touches the baffle bar 12, the buffer assembly 41 cannot continue to move forward. At this time, the electric telescopic rod 42 will push the guide rod 433 to continue to move forward and compress the elastic telescopic rod 434, so that the guide rod 433 moves along the guide groove 432. The buffer assembly 41 and the upper fixing mechanism 3 are pushed downward by the guidance of the guide groove 432, so that the upper fixing mechanism 3 can be pressed against the top of the lower fixing mechanism 2 to press and fix the diode 7. After that, the top plate 411 continues to move downward and compresses the elastic telescopic rod 1 412. At this time, the top plate 411 will push the bending mechanism 5 to move downward to bend the pin of the diode 7.

Please refer to Figures 1, 2 and 7. The bending mechanism 5 includes a slide groove 51 opened inside the upper fixing mechanism 3 corresponding to the adjustment plate 231, a slider 52 is installed inside the slide groove 51 for sliding up and down, a return spring 53 is fixedly connected between the bottom surface of the slider 52 and the bottom wall of the slide groove 51, and a bending plate 54 is fixedly connected to the side of the slider 52 away from the adjustment plate 231.

The height of the top of the bending plate 54 is higher than the height of the top of the upper fixing mechanism 3, and a spacing equal to the diameter of the pin of the diode 7 is reserved between the bending plate 54 and the adjusting plate 231; the reset spring 53 gives the slider 52 an upward elastic force, so that the initial position of the slider 52 can be maintained at the top of the slide groove 51, and an oblique angle is set on the side of the bottom of the bending plate 54 close to the adjusting plate 231, which is conducive to gradually bending the pin of the diode 7 when the bending plate 54 moves downward. Before the bending plate 54 moves downward, the bottom of the bending plate 54 is higher than the second pin groove 232, which facilitates the pin of the diode 7 to be exposed from the second pin groove 232.

Please refer to Figures 1, 2 and 8. The alignment component 61 includes an L-shaped rotating rod 611 that is rotatably mounted on the outer wall of the mounting shell 1 through a round rod. The end of the rotating rod 611 away from the mounting shell 1 is fixedly connected to an alignment plate 612. When the rotating rod 611 is rotated downward by ninety degrees, the alignment plate 612 moves to the same height as the pin groove 232 on the lower fixing mechanism 2.

Please refer to Figures 1 and 8. The rotating assembly 62 includes a rotating shaft 621 rotatably installed inside the mounting shell 1. A gear 622 is fixedly sleeved on the outside of the rotating shaft 621. The gear 622 is located below the baffle bar 12. The rotating shaft 621 is connected to the round rod through a bevel gear set. A rack 63 is meshed on the top of the gear 622. The rack 63 is fixedly connected to one end of the guide rod 433 away from the electric telescopic rod 42.

When the guide rod 433 moves forward, it will drive the rack 63 to move together. When the rack 63 is engaged with the gear 622, it will drive the rotating shaft 621 to rotate. Then the rotating shaft 621 drives the round rod to rotate through the bevel gear set, so that the rotating rod 611 and the alignment plate 612 rotate downward ninety degrees around the round rod. The diode 7 is centered and leveled using the alignment plate 612. The distance between the left and right alignment plates 612 is just equal to the length of the diode 7, so that all diodes 7 can be bent to the same length.

When in use, step one: adjust the spacing between the fixed block 211 and the adjustment plate 231 according to the need for bending the pin of the diode 7, rotate the knob 225 to drive the worm 224 to rotate, and then the worm 224 drives the worm wheel 223 and the left and right spiral screws 221 to rotate, so that the telescopic sleeve 222 pushes the adjustment plate 231 along the left and right spiral screws 221 to move away from the fixed block 211, so that the length of the pin of the diode 7 that can be exposed outside the adjustment plate 231 is equal to the length that needs to be bent. After adjusting the lower fixing mechanism 2, the upper fixing mechanism 3 is adjusted in the same way.

Step 2: Place the diode 7 into the placement groove 212 , so that the pins at both ends of the diode 7 are exposed from the pin groove 1 213 and the pin groove 232 to the outside of the adjustment plate 231 .

Step three: Push the guide rod 433 forward through the electric telescopic rod 42. Due to the elastic obstruction of the elastic telescopic rod 434, the guide rod 433 will push the fixed plate 431 and the top plate 411 to move forward together. When the fixed plate 431 touches the baffle bar 12, the top plate 411 cannot move forward any further. At this time, the electric telescopic rod 42 will push the guide rod 433 to continue moving forward and compress the elastic telescopic rod 434, so that the guide rod 433 moves along the guide groove 432. The guide groove 432 guides the buffer assembly 41 and the upper fixing mechanism 3 to move downward, so that the upper fixing mechanism 3 can be pressed against the top of the lower fixing mechanism 2 to press and fix the diode 7.

Step 4: While the guide rod 433 pushes the fixed plate 431 to move downward, the guide rod 433 drives the rack 63 to engage with the gear 622, and the gear 622 drives the gear 622 and the rotating shaft 621 to rotate. The rotating shaft 621 drives the round rod to rotate through the bevel gear set, so that the rotating rod 611 and the alignment plate 612 can rotate downward to level the two ends of the diode 7 pin.

Step 5: The top plate 411 continues to move downward and compresses the elastic telescopic rod 412. At this time, the top plate 411 contacts the top of the bending plate 54 and pushes the bending plate 54 to move downward, so that the bottom of the bending plate 54 bends the pin of the diode 7.

Step 6: After the bending is completed, the electric telescopic rod 42 pulls the guide rod 433 to move backward, and then the guide rod 433 drives the fixing plate 431 to move upward. At this time, the top plate 411 first releases the pressure on the bending plate 54, and the bending plate 54 moves upward and resets under the action of the reset spring 53. Then the top plate 411 drives the upper fixing mechanism 3 to move upward to release the fixation of the diode 7. During the upward movement of the upper fixing mechanism 3, the rack 63 drives the gear 622 to rotate in the opposite direction, so that the alignment assembly 61 rotates upward. When the guide rod 433 moves to the rear end of the guide groove 432, the guide rod 433 will drive the fixing plate 431 to move backward together, move the upper fixing mechanism 3 to the rear of the lower fixing mechanism 2, and finally take out the bent diode 7.

In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "connect", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, or a sliding connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. An electronic diode component pin bending and forming device, comprising a mounting shell (1), characterized in that: a lower fixing mechanism (2) is installed at the bottom of the inner cavity of the mounting shell (1), an upper fixing mechanism (3) having the same structure as the lower fixing mechanism (2) and symmetrically arranged up and down is arranged above the lower fixing mechanism (2), a driving mechanism (4) for driving the upper fixing mechanism (3) to move is installed at the top of the inner cavity of the mounting shell (1), bending mechanisms (5) are installed on both the left and right sides of the upper fixing mechanism (3) in an upward and downward sliding manner, and a rotating alignment mechanism (6) is installed on both the left and right outer walls of the mounting shell (1); The lower fixing mechanism (2) comprises a fixing component (21) installed at the bottom of the inner cavity of the mounting shell (1), a plurality of telescopic components (22) being installed in the fixing component (21), and a width adjustment component (23) being fixedly connected to one end of the telescopic component (22) away from the fixing component (21); The driving mechanism (4) comprises a buffer assembly (41) fixedly connected to the top of the upper fixing mechanism (3); an electric telescopic rod (42) is fixedly installed inside the mounting shell (1); and a pressing assembly (43) for driving the buffer assembly (41) to move forward and downward is installed on the output shaft of the electric telescopic rod (42); The rotary alignment mechanism (6) comprises an alignment component (61) rotatably mounted on the outer wall of the mounting shell (1), a rotating component (62) for driving the alignment component (61) is rotatably mounted inside the mounting shell (1), and racks (63) for driving the rotating component (62) are symmetrically mounted on the left and right sides of the pressing component (43). 2. An electronic diode component pin bending and forming device according to claim 1, characterized in that: the left and right side walls of the mounting shell (1) are symmetrically provided with horizontal grooves (11), a retaining bar (12) located at the front end of the horizontal groove (11) is fixedly connected to the inner wall of the mounting shell (1), and windows are provided at the front end and left and right sides of the mounting shell (1). 3. An electronic diode component pin bending and forming device according to claim 2, characterized in that: the fixing assembly (21) includes a fixing block (211) fixedly mounted on the bottom of the inner cavity of the mounting shell (1), the top of the fixing block (211) is provided with a plurality of placement grooves (212) equidistantly distributed front and back, and the top of the fixing block (211) is provided with a pin groove 1 (213) symmetrically distributed on the left and right sides of the placement groove (212). 4. An electronic diode component pin bending and forming device according to claim 3, characterized in that: the telescopic assembly (22) comprises left and right spiral screws (221) rotatably mounted inside the fixed block (211), the left and right ends of the left and right spiral screws (221) are threaded with telescopic sleeves (222), the telescopic sleeves (222) are slidably mounted inside the fixed block (211), the middle parts of the left and right spiral screws (221) are fixedly sleeved with a worm wheel (223), the bottom of the worm wheel (223) is meshed with a worm (224), the worm (224) is rotatably mounted inside the mounting shell (1), and the front end of the worm (224) passes through the front end of the fixed block (211) and is fixedly connected to a knob (225). 5. The electronic diode component pin bending and forming equipment according to claim 4, characterized in that: the width adjustment component (23) comprises an adjustment plate (231) fixedly connected to the telescopic sleeve (222), the adjustment plate (231) is symmetrically distributed about the fixed block (211), and a plurality of equally spaced pin grooves (232) are formed on the top of the adjustment plate (231), and the positions of the pin grooves (232) and the pin grooves (213) correspond one to one. 6. An electronic diode component pin bending and forming device according to claim 3, characterized in that: the buffer assembly (41) includes a top plate (411) slidably mounted inside the mounting shell (1), the bottom of the top plate (411) is fixedly connected to a plurality of elastic telescopic rods (412), and the bottom ends of the elastic telescopic rods (412) are fixedly mounted on the top of the corresponding fixed block (211) of the upper fixing mechanism (3). 7. An electronic diode component pin bending and forming device according to claim 6, characterized in that: the pressing assembly (43) comprises a fixing plate (431) fixedly mounted on the top of the top plate (411) and symmetrically distributed on the left and right sides, a plurality of guide grooves (432) are provided inside the fixing plate (431), the front ends of the guide grooves (432) are inclined upward, the telescopic end of the electric telescopic rod (42) is fixedly connected to a plurality of guide rods (433), the guide rods (433) are slidably mounted inside the guide grooves (432), the front end of the telescopic end of the electric telescopic rod (42) is fixedly connected to an elastic telescopic rod 2 (434), the top of the top plate (411) is fixedly connected to a vertical slideway (435), the front end of the elastic telescopic rod 2 (434) is slidably mounted inside the vertical slideway (435), and the end of the guide rod (433) away from the electric telescopic rod (42) is slidably mounted inside the horizontal groove (11). 8. An electronic diode component pin bending and forming device according to claim 5, characterized in that: the bending mechanism (5) includes a slide groove (51) opened inside the upper fixing mechanism (3) corresponding to the adjustment plate (231), a slider (52) is installed inside the slide groove (51) for sliding up and down, a return spring (53) is fixedly connected between the bottom surface of the slider (52) and the bottom wall of the slide groove (51), and a bending plate (54) is fixedly connected to the side of the slider (52) away from the adjustment plate (231). 9. An electronic diode component pin bending and forming device according to claim 5, characterized in that: the alignment component (61) comprises an L-shaped rotating rod (611) rotatably mounted on the outer wall of the mounting shell (1) through a round rod, and an alignment plate (612) is fixedly connected to one end of the rotating rod (611) away from the mounting shell (1), and when the rotating rod (611) is rotated downward by ninety degrees, the alignment plate (612) moves to the same height as the second pin groove (232) on the lower fixing mechanism (2). 10. An electronic diode component pin bending and forming device according to claim 9, characterized in that: the rotating assembly (62) includes a rotating shaft (621) rotatably mounted inside the mounting shell (1), a gear (622) is fixedly sleeved on the outside of the rotating shaft (621), the gear (622) is located below the blocking bar (12), the rotating shaft (621) is transmission-connected to the round rod through a bevel gear set, a rack (63) is meshed on the top of the gear (622), and the rack (63) is fixedly connected to one end of the guide rod (433) away from the electric telescopic rod (42).