CN118566240A - Semi-automatic wafer surface inspection machine and wafer inspection method - Google Patents
Semi-automatic wafer surface inspection machine and wafer inspection method Download PDFInfo
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- 238000007689 inspection Methods 0.000 title claims abstract description 211
- 238000000034 method Methods 0.000 title claims abstract description 39
- 230000000007 visual effect Effects 0.000 claims abstract description 91
- 238000001514 detection method Methods 0.000 claims abstract description 28
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 239000002313 adhesive film Substances 0.000 claims description 6
- 210000004400 mucous membrane Anatomy 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 238000011179 visual inspection Methods 0.000 abstract description 14
- 235000012431 wafers Nutrition 0.000 description 92
- 230000007547 defect Effects 0.000 description 12
- 229940095676 wafer product Drugs 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 210000004877 mucosa Anatomy 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004579 marble Substances 0.000 description 2
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- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 210000002489 tectorial membrane Anatomy 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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Abstract
The application relates to the technical field of wafer inspection, and particularly discloses a semi-automatic wafer surface inspection machine and a wafer inspection method. The semi-automatic wafer surface inspection machine comprises a frame, a straight-edge product box, a straight-edge product positioning module, a round product box, an edge inspection alignment module, a manipulator, a visual macroscopic inspection module and a visual microscopic inspection module which are arranged on the frame. The straight-edge product positioning module comprises a straight-edge product supporting mechanism, a left positioning piece and a right positioning piece. The left locating piece and the right locating piece are arranged on two sides of the straight-edge product supporting mechanism. The left positioning piece and the right positioning piece are driven to be close to each other so as to push the product to a set position, and can also be driven to be far away from each other so as to release the product. The manipulator can carry products to move among the straight-edge product box, the straight-edge product positioning module, the round product box, the edge inspection alignment module, the visual macroscopic inspection module and the visual microscopic inspection module. The inspection machine can improve the conditions of low automation degree and low detection efficiency of manual visual inspection.
Description
Technical Field
The application relates to the technical field of wafer inspection, in particular to a semi-automatic wafer surface inspection machine and a wafer inspection method.
Background
In the multi-process production process, the wafer needs to be subjected to flaw detection, otherwise scratches, rotation defects, exposure problems, particle pollution, hot spots, wafer edge defects and the like possibly generated in the production process can influence the final performance of the chip. The wafer defect inspection mainly comprises manual visual inspection and automatic visual inspection by adopting a professional wafer defect inspection lamp, and the advantages and disadvantages of the manual visual inspection and the automatic visual inspection are mainly as follows:
the automatic visual inspection uses a light source to inspect the flaws, and then the inspected camera is used for magnifying the flaws to inspect the tiny flaws, which are microscopic inspection. The automatic visual inspection is fast in inspection speed, but high in equipment cost, and is mainly used for batch inspection of the middle section and the rear section.
The manual visual inspection utilizes a high-brightness high-precision inspection lamp to find small flaws of the wafer, is a macroscopic inspection, has low equipment cost, but has low inspection speed, and is applied to front-end processing. Non-batch inspection such as spot inspection of each stage of the process is more suitable for using manual visual inspection, so that the manual visual inspection still has an irreplaceable effect at present.
At present, manual visual inspection is generally to manually place a product in a material box under a light source for visual macroscopic inspection, and manually place the product in the material box under a microscope for microscopic repeated judgment, and the inspection mode has low automation degree and low inspection efficiency.
Disclosure of Invention
In view of the low detection efficiency caused by the low degree of automation of the existing manual visual detection, the application provides a semi-automatic wafer surface inspection machine and a wafer inspection method, which can obviously improve the low detection efficiency caused by the low degree of automation of the existing manual visual detection. Therefore, the application adopts the following technical scheme.
In a first aspect, the present application provides a semi-automatic wafer surface inspection machine, and adopts the following technical scheme.
A semi-automatic wafer surface inspection machine comprises a frame, and a straight-edge product box, a straight-edge product positioning module, a round product box, an edge inspection alignment module, a manipulator, a visual macroscopic inspection module and a visual microscopic inspection module which are arranged on the frame. The straight-edge product box is provided with a mounting position for placing a straight-edge product box; the straight-edge product positioning module comprises a straight-edge product supporting mechanism, a left positioning piece and a right positioning piece; the left locating piece and the right locating piece are arranged on two sides of the straight-edge product supporting mechanism; the left positioning piece is provided with a left straight surface; the right positioning piece is provided with a right straight surface; the left straight surface and the right straight surface are opposite and parallel to each other; the left locating piece and the right locating piece are driven to be close to each other so as to push the straight-edge products on the straight-edge product supporting mechanism to a set position, and can also be driven to be far away from each other so as to release the straight-edge products. The manipulator is configured to move a carried product among the straight-edge product box, the straight-edge product positioning module, the visual macro-inspection module and the visual micro-inspection module; the manipulator is further configured to be capable of carrying products moving between the circular product box, the edge inspection alignment module, the visual macro inspection module and the visual micro inspection module.
Through adopting above-mentioned technical scheme, the manipulator can carry the wafer product voluntarily, including transporting straight flange product to straight flange product location module among the magazine of straight flange product case, carry straight flange product on the straight flange product location module voluntarily to visual macroscopic inspection module, carry the straight flange product on the visual macroscopic inspection module voluntarily to visual microscopic inspection module, and including taking out the wafer voluntarily among the magazine among the circular product case and putting on patrolling the limit alignment module, take off the wafer of patrolling on the limit alignment module voluntarily and place and look macroscopic inspection module, will look visual macroscopic inspection module the wafer automatic handling to visual microscopic inspection module on the macroscopic inspection module. The inspection machine can remarkably improve the condition of low automation degree and low detection efficiency of the existing manual visual inspection.
It should be noted that the straight-edge product is a product with two parallel opposite straight edges, for example, an iron ring wafer, a mucosa is stuck in the iron ring, the wafer is fixed on the mucosa, two parallel straight edges are formed after two sides of the periphery of the iron ring are cut, the iron ring wafer belongs to a straight-edge product, and the inner periphery of the iron ring can be round. The straight-edge product material box is used for being matched with the material box for loading the straight-edge products and is provided with a plurality of layers of parallel two-side loading beams for loading the two sides of the straight-edge products. The round product may be smif wafer product or wafer product.
The semi-automatic wafer surface inspection machine has the preferable scheme that the visual macro inspection module comprises a horizontal rotating platform, a lifting assembly, an angle turner and a product fixing jig; the horizontal rotating platform and the lifting assembly are arranged on the frame; the angle turner is arranged at the output end of the lifting assembly; the product fixing jig is arranged on an output shaft of the angle turner; the output shaft of the angle turner is perpendicular to the output direction of the lifting assembly, and the product fixing jig fixes a planar product to be parallel to the output shaft of the angle turner.
Through adopting above-mentioned technical scheme, lifting unit not only makes things convenient for the manipulator to get and puts the product, adjusts to suitable height when still adaptable different height personnel inspect the product. The angle turner drives the product to rotate 360 degrees along the center of the product, and the product can be adjusted to any angle position so as to be beneficial to the appearance of different flaws at different angles. Part of products need to be checked in different angles by rotation, and can be checked by turning the angle turner after the horizontal rotating platform rotates.
The semi-automatic wafer surface inspection machine has the preferable scheme that the product fixing jig comprises a hollow arc bar and a plurality of hollow extension rods; the plurality of hollow extension rods are distributed on the inner side of the circular arc strip, and each extension rod is seamlessly communicated with the circular arc strip; each extension rod is provided with a vacuum suction nozzle, and each vacuum suction nozzle faces the plane of the product; the arc strip is communicated with a vacuum source.
By adopting the technical scheme, the product fixing jig fixes the product through vacuum adsorption.
One preferred embodiment of the semi-automatic wafer surface inspection machine is that all vacuum nozzles are located on the same circumference.
By adopting the technical scheme, the vacuum suction nozzle positioned on the same circumference can be adapted to adsorb circular products, including straight-edge products with circular inner circumferences.
One preferred embodiment of the semi-automatic wafer surface inspection machine is, the semi-automatic wafer surface inspection machine comprises a plurality of product fixing jigs; each product fixing jig can be connected with the output shaft of the angle turner in an adapting, disassembling and assembling manner. The vacuum suction nozzles of different product fixing jigs are connected to form a circumference with different diameters, wherein one product fixing jig can be adapted to adsorb the frame of the straight-edge product, and the other product fixing jig can be adapted to adsorb the round product.
By adopting the technical scheme, the product fixing jig is changed and installed, and products with different sizes and shapes can be adaptively fixed, including products with the dimensions of 6/8/12 inch before cutting (round) and after cutting (straight edge).
The semi-automatic wafer surface inspection machine has the preferable scheme that the straight-edge product comprises a planar iron ring, a mucous membrane and a wafer; the iron ring is provided with opposite straight edges, the adhesive film covers the inner periphery of the iron ring, and the wafer is fixed on the adhesive film; on the product fixing jig, a plurality of electromagnets are respectively arranged on the surfaces of the extension rods, the electromagnets are aligned with the plane of the iron ring, and the vacuum suction nozzles are aligned with the plane of the wafer.
By adopting the technical scheme, the straight-edge product and the round product can be adsorbed by one product fixing jig without switching jigs.
The preferable scheme of the semi-automatic wafer surface inspection machine is that a plurality of vacuum suction nozzles align with the plane of a six-inch wafer.
By adopting the technical scheme, the inner periphery of the iron ring can generally accommodate twelve inch wafers, and then one product fixing jig can be compatible with and absorb straight-edge products and round products of 6/8/12 inch, and the jig does not need to be switched.
The optimal scheme of the semi-automatic wafer surface inspection machine is that the straight-edge product box, the straight-edge product positioning module, the round product box, the edge inspection alignment module, the visual macroscopic inspection module and the visual microscopic inspection module enclose the manipulator in the middle. The machine frame is provided with an L-shaped mounting table, and the visual microscopic detection module are respectively positioned on two sides of the L-shaped mounting table.
Through adopting above-mentioned technical scheme, the transport product that the manipulator can be convenient rotates between each part, makes things convenient for one to carry out macroscopic inspection and microscopic inspection.
In a second aspect, the present application further provides a wafer surface inspection method, and the following technical scheme is adopted.
A wafer surface inspection method for inspecting a wafer using the above-mentioned semi-automatic wafer surface inspection machine including a plurality of product fixing jigs, the wafer surface inspection method comprising:
The output shaft of the angle turner is provided with the product fixing jig which can be matched with the frame of the adsorption straight-edge product: the manipulator obtains the straight-edge products in the straight-edge product box, and then transfers the straight-edge products to the straight-edge product positioning module, so that the opposite parallel straight edges of the straight-edge products face the left straight surface and the right straight surface respectively, and after being clamped by the left positioning piece and the right positioning piece, the straight-edge products are pushed to a set position; then, the manipulator lifts the straight-edge product on the straight-edge product positioning module, places the straight-edge product on a horizontal rotating platform and rotates the straight-edge product to a required direction; then, the angle turner rotates to the horizontal direction, the lifting assembly adjusts the height of the angle turner, the mechanical arm places the straight-edge product on a plurality of vacuum suction nozzles of the angle turner, the straight-edge product is sucked and fixed in vacuum, the angle turner drives the product fixing jig to rotate, the straight-edge product rotates in a vertical plane, and visual macroscopic inspection is carried out on the straight-edge product in the rotating process; finally, the mechanical arm transfers the straight-edge product to a visual microscopic detection module, and microscopic detection and re-judgment are carried out on the defects detected by the macroscopic detection;
The output shaft of the angle turner is switched and installed with the product fixing jig capable of being matched with the product adsorbing round product: the manipulator acquires a round product in the round product box, then transfers the round product to the inspection alignment module, and after automatic positioning, the manipulator lifts the round product to be placed on a horizontal rotating platform and rotates to a required direction; then, the angle turner rotates to the horizontal direction, the lifting assembly adjusts the height of the angle turner, the mechanical arm places round products on a plurality of vacuum suction nozzles of the angle turner, the round products are sucked and fixed, the angle turner drives the product fixing jig to rotate, the round products rotate in a vertical plane, and visual macroscopic inspection is carried out on the round products in the rotating process; and finally, transferring the round product to a visual microscopic detection module by the manipulator, and performing microscopic detection and repeated judgment on the macroscopic defects.
Through adopting above-mentioned technical scheme, adopt this inspection machine can the automatic handling product, personnel can carry out visual macroscopic inspection and microscopic inspection, through changing the fixed tool of product, can fix not unidimensional straight flange product or circular product, satisfy the inspection demand of multiple product.
In a third aspect, the present application further provides another wafer surface inspection method, and the following technical scheme is adopted.
A wafer surface inspection method for inspecting a wafer using the semi-automatic wafer surface inspection machine using only one product fixture, the wafer surface inspection method comprising:
The manipulator obtains the straight-edge products in the straight-edge product box, and then transfers the straight-edge products to the straight-edge product positioning module, so that the opposite parallel straight edges of the straight-edge products face the left straight surface and the right straight surface respectively, and after being clamped by the left positioning piece and the right positioning piece, the straight-edge products are pushed to a set position; then, the manipulator lifts the straight-edge product on the straight-edge product positioning module, places the straight-edge product on a horizontal rotating platform and rotates the straight-edge product to a required direction; then, the angle turner rotates to the horizontal direction, the lifting assembly adjusts the height of the angle turner, the mechanical arm places straight-edge products on a plurality of electromagnets and a plurality of vacuum suction nozzles of the angle turner, the electromagnets are connected with a power supply and electrified, and the electromagnets attract iron rings; the angle turner drives the product fixing jig to rotate, so that the straight-edge product rotates in a vertical plane, and visual macroscopic inspection is carried out on the straight-edge product in the rotating process; finally, the mechanical arm transfers the straight-edge product to a visual microscopic detection module, and microscopic detection and re-judgment are carried out on the defects detected by the macroscopic detection;
The manipulator acquires a round product in the round product box, then transfers the round product to the inspection alignment module, and after automatic positioning, the manipulator lifts the round product to be placed on a horizontal rotating platform and rotates to a required direction; then, the angle turner rotates to the horizontal direction, the lifting assembly adjusts the height of the angle turner, the mechanical arm places round products on a plurality of vacuum suction nozzles of the angle turner, the round products are sucked and fixed, the angle turner drives the product fixing jig to rotate, the round products rotate in a vertical plane, and visual macroscopic inspection is carried out on the round products in the rotating process; and finally, transferring the round product to a visual microscopic detection module by the manipulator, and performing microscopic detection and repeated judgment on the macroscopic defects.
Through adopting above-mentioned technical scheme, only with a product fixed jig can fix straight flange product and circular product of multiple size, convenient to use, inspection efficiency is high.
In summary, the semi-automatic wafer surface inspection machine and the wafer inspection method of the present application have the following advantages:
The inspection machine and the inspection method are used for macroscopic and microscopic inspection of the surface of the wafer. The inspection machine can automatically feed and discharge materials, can perform semi-automatic visual macroscopic inspection and microscopic inspection by means of a microscope, and is wide in applicable product range and high in equipment cost performance. The inspection machine is applicable to the product range including the inspection of the front and back surfaces of 6/8/12 inch wafers, the inspection of various tectorial membranes, the inspection of the edge quality of the product, and the like. The inspection machine is suitable for cut iron ring products, smif products and wafer products. The checking step may be: personnel or crown block loading box, mechanical arm taking out the wafer, visual macroscopic inspection, visual microscopic inspection and judgment, and mechanical arm replacing the wafer in the box.
Drawings
Fig. 1 is an external structural view of a semi-automatic wafer surface inspection machine.
Fig. 2 is a rear side view angle block diagram of fig. 1.
Fig. 3 is an internal structural view of the semi-automatic wafer surface inspection machine of fig. 1 with the housing and the highlight surface light source hidden.
Fig. 4 is a schematic structural view of a straight-sided product.
Fig. 5 is a block diagram of the straight edge product positioning module in fig. 3 for positioning straight edge products.
Fig. 6 is a block diagram of the structure of fig. 3 with the circular product bin hidden.
Fig. 7 is another view of the structure of fig. 6 after restoration of the display of the highlight area light source.
Fig. 8 is an enlarged view of the visual macro inspection module of fig. 7.
Fig. 9 is a structural diagram of a product with a straight edge fixed by the product fixing jig in fig. 8.
Fig. 10 is a schematic view of a product fixture for fixing a round product.
Fig. 11 is a schematic structural view of another product fixing jig for fixing straight-edge products.
Fig. 12 is a flow chart of a wafer inspection method.
Reference numerals: a frame 1; a straight-edge product box 2; a straight-edge product positioning module 3; a circular product box 4; an edge inspection alignment module 5; a manipulator 6; a visual macro inspection module 7; a visual microscopic inspection module 8; a straight-sided product cartridge 9; a round product cartridge 10; an iron ring 11; a mucous membrane 12; a wafer 13; a straight-sided product support mechanism 301; a left positioning member 302; a right positioning member 303; left straight face 3021; right straight face 3031; a horizontal rotation platform 701; a lifting assembly 702; an angle inverter 703; a product fixing jig 704; a highlight area light source 705; marble Dan Ji 801; an XY linear motor 802; a microscopic inspection stage 803; a visual microscope set 804; arc bar 7041; extension rod 7042; a vacuum nozzle 7043; an electromagnet 7044.
Detailed Description
Hereinafter, a semi-automatic wafer surface inspection machine and a wafer inspection method will be described in detail with reference to the accompanying drawings.
Referring to fig. 1 and 2, a semi-automatic wafer surface inspection machine includes a frame 1, referring to fig. 3, the semi-automatic wafer surface inspection machine further includes a straight edge product box 2, a straight edge product positioning module 3, a circular product box 4, an inspection edge alignment module 5, a manipulator 6, a visual macro inspection module 7 and a visual micro inspection module 8, which are installed on the frame 1.
The straight edge product bin 2 has a mounting location for the straight edge product magazine 9.
It should be noted that, referring to fig. 4, the straight-edge product is a product with two parallel opposite straight edges, for example, a wafer 13 of an iron ring 11, a mucosa 12 is adhered in the iron ring 11, the wafer 13 is fixed on the mucosa 12, two parallel straight edges are formed after two sides of the periphery of the iron ring 11 are cut, and the wafer 13 of the iron ring 11 belongs to a straight-edge product, which may also be called as a cut product. The inner circumference of the iron ring 11 may be circular. The straight edge product magazine 9 is a magazine for adapting to load straight edge products, having multiple layers of parallel two-sided loading beams for loading both sides of straight edge products.
Referring to fig. 5, the straight edge product positioning module 3 includes a straight edge product supporting mechanism 301, a left positioning member 302 and a right positioning member 303. The left positioning member 302 and the right positioning member 303 are provided on both sides of the straight-sided product supporting mechanism 301. The left positioner 302 has a left straight face 3021. The right keeper 303 has a right straight face 3031. The left straight face 3021 and the right straight face 3031 are opposite and parallel to each other. The left positioning member 302 and the right positioning member 303 are driven by a motor to move closer to each other to push the straight-edge product on the straight-edge product supporting mechanism 301 to a set position, and can also be driven to move away from each other to release the straight-edge product. The set position may be a middle position of the left straight face 3021 and the right straight face 3031. The straight-edge product supporting mechanism 301 may be a plurality of supporting rods, the upper ends of the supporting rods are on the same plane, and the product can be placed on the supporting rods by the manipulator 6, so that the product is convenient to take and place.
The robot 6 is configured to move the handled products between the straight edge product bin 2, the straight edge product positioning module 3, the visual macro inspection module 7, and the visual micro inspection module 8. The robot 6 is further configured to move the handled products between the circular product bin 4, the inspection alignment module 5, the visual macro inspection module 7, and the visual micro inspection module 8.
In the semi-automatic wafer surface inspection machine with the structure, the manipulator 6 can automatically convey the wafer 13 products, the straight-edge products are conveyed from the material boxes of the straight-edge product box 2 to the straight-edge product positioning module 3, the straight-edge products on the straight-edge product positioning module 3 are automatically conveyed to the visual microscopic inspection module 7, the straight-edge products on the visual microscopic inspection module 7 are automatically conveyed to the visual microscopic inspection module 8, the wafer 13 is automatically taken out from the material boxes of the round product box 4 and placed on the inspection edge alignment module 5, the wafer 13 on the inspection edge alignment module 5 is automatically taken down and placed on the visual microscopic inspection module 8, and the wafer 13 on the visual microscopic inspection module 7 is automatically conveyed to the visual microscopic inspection module 8. The inspection machine can remarkably improve the condition of low automation degree and low detection efficiency of the existing manual visual inspection.
Referring to fig. 6, the interior of the circular product bin 4 may be adapted to receive a circular product cartridge 10. The round product magazine 10 is used for placing round products. The round product may be smif wafer product or wafer product, which may be referred to as a pre-dicing product. The interior of the round product magazine 10 may be provided with opposing parallel carrying edges of multiple layers, each carrying two sides of a wafer 13.
Because the straight-edge product material box 9 and the round product material box 10 leave a certain gap when carrying products, the products have a certain movable space in the material box, and the products are accurately transported to the visual macro-detection module 7 through the manipulator 6 to be accurately fixed, so that the positions of the products are accurately confirmed first, and the straight-edge product positioning module 3 and the edge inspection alignment module 5 are set to accurately confirm the positions of the products.
The working principle of the inspection alignment module 5 is as follows: the surface of the wafer 13 is irradiated by a light source, reflected light signals are received by a photoelectric sensor, and the position of the wafer 13 is determined by analyzing and processing by a counterpoint algorithm.
The manipulator 6 may be a single arm or two arms, each arm has a plurality of rotating segments, and the end of each arm may be provided with a V-shaped fork for inserting under the product, then lifting the product upwards, then folding the arm to take out the product, and then transferring the product to the next functional module. The functional module is generally provided with a lifting column in a bearing table for bearing products, the mechanical arm 6 places the products on the lifting column, the mechanical arm 6 descends and moves out, and then the lifting column descends to enable the products to fall on the bearing table of the functional module, so that related functional operations of the functional module are performed. Wherein, both arms efficiency is higher, can be when carrying the product, and one arm takes out the product in a module, takes out the back, and another arm places another product in this module and carries out the functional operation of this module, promotes the operating efficiency.
Referring to fig. 7 and 8, in the semi-automatic wafer surface inspection machine, a preferred structure of the visual macro inspection module 7 is that the visual macro inspection module 7 includes a horizontal rotation platform 701, a lifting assembly 702, an angle turner 703, a product fixing fixture 704, and a highlight surface light source 705. A horizontal rotation platform 701 and a lifting assembly 702 are mounted on the frame 1. The horizontal rotary table 701 is driven by a motor to rotate along a horizontal plane, and a product is placed thereon to rotate therewith. The lifting assembly 702 may be a lifting cylinder that performs lifting driving in a vertical direction. An angle inverter 703 is mounted on the output of the lifting assembly 702. The angle inverter 703 may be a motor. The product fixing jig 704 is mounted on the output shaft of the angle inverter 703. The output shaft of the angle inverter 703 is perpendicular to the output direction of the lifting assembly 702, and the product fixing jig 704 fixes a planar product to be parallel to the output shaft of the angle inverter 703, i.e., the output shaft of the angle inverter 703 is parallel to the surface of the product, and the extension line of the output shaft may be parallel to pass through the center of the product. The highlight area light source 705 is provided above the product fixing jig 704. The high-brightness area light source 705 adopts a large area (more than four times of the product area) of the high-brightness area light source 705, thereby being convenient for personnel to observe various flaws.
The visual macro inspection module 7 with the structure is convenient for the manipulator 6 to take and put products, and the lifting assembly 702 can be adjusted to a proper height when people with different heights check the products. The angle turner 703 drives the product to rotate 360 degrees along the center of the product, and can be adjusted to any angle position so as to be beneficial to the appearance of different flaws at different angles. Some products need to be inspected in different angles, and can be inspected by turning over the angle turner 703 after the horizontal rotating platform 701 rotates.
Referring to fig. 6, in the semi-automatic wafer surface inspection machine, an optional structure of the visual microscopic inspection module 8 is that the visual microscopic inspection module 8 includes a marble Dan Ji, an XY linear motor 802, a microscopic inspection platform 803, and a visual microscopic group 804. Microscopic inspection stage 803 may vacuum adsorb the product. One of the functions of the visual microscopic examination module 8 is to macroscopically detect the repeated judgment of the flaw: through the macroscopic visual inspection of the front channel, if flaws are found, a microscopic inspection platform 803 is placed on the product, a person manually moves the platform to the flaw position, and the flaw type is judged through observation of a high-power microscope. The visual microscopic inspection module 8 is used for performing selective inspection on the surface quality condition of the wafer 13 at the fixed position for each product. After the product is placed on the platform, the product automatically moves to a set point, and the personnel observe the surface quality of the set point through a microscope. The multiplying power of 5x, 10x, 20x and 50x can be switched.
Referring to fig. 9, in the semi-automatic wafer surface inspection machine, a product fixture 704 includes a hollow arc bar 7041 and a plurality of hollow extension bars 7042. A plurality of hollow extension bars 7042 are distributed on the inner side of the circular arc bar 7041, and each extension bar 7042 is in seamless communication with the circular arc bar 7041. Each extension bar 7042 has a vacuum nozzle 7043 disposed thereon, each vacuum nozzle 7043 facing the plane of the product, either front or back. The circular arc 7041 communicates with a vacuum source. The product fixing jig 704 fixes the product by vacuum suction. Preferably, all of the vacuum nozzles 7043 are located on the same circumference, and the vacuum nozzles 7043 located on the same circumference can be adapted to attract round products, including straight-sided products with rounded inner circumferences.
For the product fixture 704, one way is that the semi-automatic wafer surface inspection machine includes a plurality of product fixtures 704. Each product fixing jig 704 can be detachably connected with the output shaft of the angle turner 703. The diameters of the circumferences of the vacuum nozzles 7043 of different product fixing jigs 704 are different. Referring to fig. 9, one product fixing jig 704 is adapted to adsorb the frame of the straight-edge product; referring to fig. 10, there is another product fixture 704 capable of adapting to absorb round products. The inspection machine with the structure can adaptively fix products with different sizes and shapes by replacing and installing different product fixing jigs 704, including products with 6/8/12 inch before cutting (round) and products with straight edges after cutting.
Wherein the straight-sided product comprises a planar iron ring 11, a mucous membrane 12 and a wafer 13. The iron ring 11 has opposite straight sides, the adhesive film 12 is covered on the inner periphery of the iron ring 11, and the wafer 13 is fixed on the adhesive film 12. Referring to fig. 11, for a product fixing jig 704, another way of the semi-automatic wafer surface inspection machine is that the semi-automatic wafer surface inspection machine includes a product fixing jig 704, on the product fixing jig 704, the surface of a plurality of extension rods 7042 is respectively provided with an electromagnet 7044, a plurality of electromagnets 7044 align with the plane of the iron ring 11, a plurality of vacuum suction nozzles 7043 align with the plane of the wafer 13, and then one product fixing jig 704 can realize the adsorption of straight-edge products and round products without the need of switching jigs.
The inner periphery of the iron ring 11 is generally capable of receiving twelve inch wafers 13. For the product fixture 704 provided with the electromagnet 7044, a more preferable structure is that a plurality of vacuum suction nozzles 7043 align with the plane of the six-inch wafer 13. One product fixture 704 can be compatible with adsorbing 6/8/12 inch straight-edge products and round products without switching the fixtures.
In order to facilitate the handling of the product by the manipulator 6, the manipulator 6 is surrounded in the middle by the straight-edge product box 2, the straight-edge product positioning module 3, the round product box 4, the edge inspection alignment module 5, the visual macro inspection module 7 and the visual micro inspection module 8. In order to facilitate the macro inspection and the micro inspection of a person, the machine frame 1 is provided with an L-shaped mounting table, and the visual macro inspection module 7 and the visual micro inspection module 8 are respectively positioned on two sides of the L-shaped mounting table.
Referring to fig. 12, the present embodiment provides a wafer surface inspection method for inspecting a wafer 13 by using the semi-automatic wafer surface inspection machine including a plurality of product fixing jigs 704, the wafer surface inspection method includes:
product fixing jig 704 capable of being matched with a frame for adsorbing straight-edge products is arranged on an output shaft of angle turner 703: the manipulator 6 obtains the straight-edge products in the straight-edge product box 2, and then transfers the straight-edge products to the straight-edge product positioning module 3, so that the opposite parallel straight edges of the straight-edge products face the left straight surface 3021 and the right straight surface 3031 respectively, and after being clamped by the left positioning piece 302 and the right positioning piece 303, the straight-edge products are pushed to the set positions; then, the manipulator 6 lifts the straight-edge product on the straight-edge product positioning module 3, places the straight-edge product on the horizontal rotating platform 701 and rotates to a required direction; then, the angle turner 703 rotates to the horizontal direction, the lifting assembly 702 adjusts the height of the angle turner 703, the mechanical arm 6 places the straight-edge product on the plurality of vacuum suction nozzles 7043 of the angle turner 703, the straight-edge product is sucked and fixed in vacuum, the angle turner 703 drives the product fixing jig 704 to rotate, the straight-edge product rotates in the vertical plane, and visual macroscopic inspection is carried out on the straight-edge product in the rotating process; finally, the mechanical arm 6 transfers the straight-edge product to the visual microscopic examination module 8, and microscopic examination and re-judgment are carried out on the defects detected by macroscopic examination;
Product fixing jig 704 capable of being matched and adsorbing circular products is switched and installed on an output shaft of angle turner 703: the manipulator 6 obtains the round products in the round product box 4, then transfers the round products to the edge inspection alignment module 5, and after automatic positioning, the manipulator 6 lifts the round products to be placed on the horizontal rotation platform 701 and rotates to a required direction; then, the angle turner 703 rotates to the horizontal direction, the lifting assembly 702 adjusts the height of the angle turner 703, the mechanical arm 6 places the round product on the plurality of vacuum suction nozzles 7043 of the angle turner 703, the round product is sucked and fixed, the angle turner 703 drives the product fixing jig 704 to rotate, the round product rotates in the vertical plane, and visual macro inspection is carried out on the round product in the rotating process; finally, the manipulator 6 transfers the round product to the visual microscopic examination module 8, and microscopic examination and re-judgment are carried out on the defects detected by macroscopic examination.
Among the above inspection methods, the inspection machine can automatically carry products, personnel can perform visual macro inspection and microscopic inspection, and straight-edge products or round products with different sizes can be fixed by replacing the product fixing jig 704, so that the inspection requirements of various products are met.
The present embodiment also proposes another wafer surface inspection method for inspecting a wafer 13 using a semi-automatic wafer surface inspection machine using only one product fixture 704, the wafer surface inspection method comprising:
The manipulator 6 obtains the straight-edge products in the straight-edge product box 2, and then transfers the straight-edge products to the straight-edge product positioning module 3, so that the opposite parallel straight edges of the straight-edge products face the left straight surface 3021 and the right straight surface 3031 respectively, and after being clamped by the left positioning piece 302 and the right positioning piece 303, the straight-edge products are pushed to the set positions; then, the manipulator 6 lifts the straight-edge product on the straight-edge product positioning module 3, places the straight-edge product on the horizontal rotating platform 701 and rotates to a required direction; then, the angle turner 703 rotates to the horizontal direction, the lifting assembly 702 adjusts the height of the angle turner 703, the mechanical arm 6 places the straight-edge product on a plurality of electromagnets 7044 and a plurality of vacuum suction nozzles 7043 of the angle turner 703, the plurality of electromagnets 7044 are connected with a power supply, and the plurality of electromagnets 7044 attract the iron ring 11; the angle turner 703 drives the product fixing jig 704 to rotate, so that the straight-edge product rotates in a vertical plane, and visual macro inspection is carried out on the straight-edge product in the rotating process; finally, the mechanical arm 6 transfers the straight-edge product to the visual microscopic examination module 8, and microscopic examination and re-judgment are carried out on the defects detected by macroscopic examination;
The manipulator 6 obtains the round products in the round product box 4, then transfers the round products to the edge inspection alignment module 5, and after automatic positioning, the manipulator 6 lifts the round products to be placed on the horizontal rotation platform 701 and rotates to a required direction; then, the angle turner 703 rotates to the horizontal direction, the lifting assembly 702 adjusts the height of the angle turner 703, the mechanical arm 6 places the round product on the plurality of vacuum suction nozzles 7043 of the angle turner 703, the round product is sucked and fixed, the angle turner 703 drives the product fixing jig 704 to rotate, the round product rotates in the vertical plane, and visual macro inspection is carried out on the round product in the rotating process; finally, the manipulator 6 transfers the round product to the visual microscopic examination module 8, and microscopic examination and re-judgment are carried out on the defects detected by macroscopic examination.
The above inspection method can be used for fixing straight-edge products and round products with various sizes by only using one product fixing jig 704, and is convenient to use and high in inspection efficiency.
The inspection machine of the embodiment is used for macroscopic inspection and microscopic repeated judgment of the surface of the wafer 13, and can realize full-automatic feeding and discharging and semi-automatic inspection. The application range of the product is wide, and the application range of the product comprises the front and back inspection of the 6/8/12 inch wafer 13, various film coating inspection, product edge quality inspection and the like. The products that the inspection machine of this embodiment can inspect include cut iron ring 11 products, smif products, and wafer products.
The above embodiments are merely examples of the present application, and the protection scope of the present application is not limited to the above embodiments, and it should be obvious to those skilled in the art that several modifications and variations are possible without departing from the inventive concept.
Claims (10)
1. The semi-automatic wafer surface inspection machine is characterized by comprising a frame (1), and a straight-edge product box (2), a straight-edge product positioning module (3), a round product box (4), an edge inspection alignment module (5), a manipulator (6), a visual macroscopic inspection module (7) and a visual microscopic inspection module (8) which are arranged on the frame (1);
The straight-edge product box (2) is provided with a mounting position for placing a straight-edge product material box (9); the straight-edge product positioning module (3) comprises a straight-edge product supporting mechanism (301), a left positioning piece (302) and a right positioning piece (303); the left positioning piece (302) and the right positioning piece (303) are arranged on two sides of the straight-edge product supporting mechanism (301); the left positioner (302) has a left straight face (3021); the right positioning piece (303) is provided with a right straight surface (3031); -said left straight face (3021) and said right straight face (3031) are opposite and parallel to each other; the left positioning piece (302) and the right positioning piece (303) are driven to be close to each other so as to push the straight-edge product on the straight-edge product supporting mechanism (301) to a set position, and can also be driven to be far away from each other so as to release the straight-edge product;
The manipulator (6) is configured to be capable of moving a product between the straight-edge product box (2), the straight-edge product positioning module (3), the visual microscopic detection module (7) and the visual microscopic detection module (8); the manipulator (6) is further configured to be capable of carrying products to move between the circular product box (4), the edge inspection alignment module (5), the visual microscopic inspection module (7) and the visual microscopic inspection module (8).
2. The semi-automatic wafer surface inspection machine of claim 1, wherein the visual macro inspection module (7) comprises a horizontal rotation platform (701), a lifting assembly (702), an angle inverter (703) and a product fixture (704); the horizontal rotating platform (701) and the lifting assembly (702) are arranged on the frame (1); the angle turner (703) is arranged on the output end of the lifting assembly (702); the product fixing jig (704) is arranged on an output shaft of the angle turner (703); the output shaft of the angle turner (703) is perpendicular to the output direction of the lifting assembly (702), and the product fixing jig (704) fixes a planar product to be parallel to the output shaft of the angle turner (703).
3. The semi-automatic wafer surface inspection machine of claim 2, wherein the product fixture (704) comprises a hollow circular arc bar (7041) and a plurality of hollow extension bars (7042); the plurality of hollow extension rods (7042) are distributed on the inner side of the circular arc strip (7041), and each extension rod (7042) is in seamless communication with the circular arc strip (7041); each extension rod (7042) is provided with a vacuum suction nozzle (7043), and each vacuum suction nozzle (7043) faces the plane of the product; the arc strip (7041) is communicated with a vacuum source.
4. A semi-automatic wafer surface inspection machine according to claim 3, characterized in that all vacuum nozzles (7043) are located on the same circumference.
5. The semi-automatic wafer surface inspection machine of claim 4, comprising a plurality of said product fixture fixtures (704); each product fixing jig (704) can be connected with an output shaft of the angle turner (703) in an adapting, dismounting and mounting manner;
The diameters of the circumferences formed by the vacuum suction nozzles (7043) of different product fixing jigs (704) are different, one product fixing jig (704) can be matched with the frame for adsorbing straight-edge products, and the other product fixing jig (704) can be matched with the circular products.
6. Semi-automatic wafer surface inspection machine according to claim 3 or 4, characterized in that said straight-sided product comprises a planar iron ring (11), a mucous membrane (12) and a wafer (13); the iron ring (11) has opposite straight edges, the adhesive film (12) covers the inner periphery of the iron ring (11), and the wafer (13) is fixed on the adhesive film (12); on the product fixing jig (704), a plurality of electromagnets (7044) are respectively arranged on the surfaces of the extension rods (7042), the electromagnets (7044) are aligned with the plane of the iron ring (11), and the vacuum suction nozzles (7043) are aligned with the plane of the wafer (13).
7. The semi-automatic wafer surface inspection machine of claim 6, wherein a plurality of said vacuum suction nozzles (7043) align with the plane of a six inch wafer (13).
8. The semi-automatic wafer surface inspection machine according to claim 1, wherein the straight-sided product box (2), the straight-sided product positioning module (3), the circular product box (4), the inspection alignment module (5), the visual macro inspection module (7) and the visual micro inspection module (8) enclose the manipulator (6) in the middle;
the machine frame (1) is provided with an L-shaped mounting table, and the visual macro-detection module (7) and the visual micro-detection module (8) are respectively positioned on two sides of the L-shaped mounting table.
9. A wafer surface inspection method, characterized in that a semi-automatic wafer surface inspection machine according to claim 5 is used for inspecting a wafer (13), the wafer surface inspection method comprising:
The output shaft of the angle turner (703) is provided with the product fixing jig (704) which can be matched and used for adsorbing the frame of the straight-edge product: the manipulator (6) obtains straight-edge products in the straight-edge product box (2), and then transfers the straight-edge products to the straight-edge product positioning module (3) so that opposite parallel straight edges of the straight-edge products face the left straight surface (3021) and the right straight surface (3031) respectively, and after being clamped by the left positioning piece (302) and the right positioning piece (303), the straight-edge products are pushed to a set position; then, the manipulator (6) lifts the straight-edge product on the straight-edge product positioning module (3), places the straight-edge product on a horizontal rotating platform (701) and rotates the straight-edge product to a required direction; then, the angle turner (703) rotates to the horizontal direction, the lifting assembly (702) adjusts the height of the angle turner (703), the mechanical arm (6) places the straight-edge product on the vacuum suction nozzles (7043) of the angle turner (703) to suck and fix the straight-edge product in vacuum, and the angle turner (703) drives the product fixing jig (704) to rotate so that the straight-edge product rotates in a vertical plane and visual macroscopic inspection is carried out on the straight-edge product in the rotating process; finally, the mechanical arm (6) transfers the straight-edge product to a visual microscopic detection module (8) to carry out microscopic detection and repeated judgment on the macroscopic detected flaws;
The output shaft of the angle turner (703) is switched and provided with the product fixing jig (704) which can be matched and used for adsorbing the round product: the manipulator (6) obtains the round products in the round product box (4), then transfers the round products to the edge inspection alignment module (5), and after automatic positioning, the manipulator (6) lifts the round products to be placed on a horizontal rotation platform (701) and rotates to a required direction; then, the angle turner (703) rotates to the horizontal direction, the lifting assembly (702) adjusts the height of the angle turner (703), the mechanical arm (6) places a round product on the plurality of vacuum suction nozzles (7043) of the angle turner (703) to suck and fix the round product, the angle turner (703) drives the product fixing jig (704) to rotate, so that the round product rotates in a vertical plane, and visual macroscopic inspection is carried out on the round product in the rotating process; finally, the manipulator (6) transfers the round product to the visual microscopic examination module (8), and microscopic examination and repeated judgment are carried out on the macroscopic flaws.
10. A wafer surface inspection method, characterized in that a semi-automatic wafer surface inspection machine according to claim 6 or 7 is used for inspecting a wafer (13), the wafer surface inspection method comprising:
The manipulator (6) obtains straight-edge products in the straight-edge product box (2), and then transfers the straight-edge products to the straight-edge product positioning module (3) so that opposite parallel straight edges of the straight-edge products face the left straight surface (3021) and the right straight surface (3031) respectively, and after being clamped by the left positioning piece (302) and the right positioning piece (303), the straight-edge products are pushed to a set position; then, the manipulator (6) lifts the straight-edge product on the straight-edge product positioning module (3), places the straight-edge product on a horizontal rotating platform (701) and rotates the straight-edge product to a required direction; then, the angle turner (703) rotates to the horizontal direction, the lifting assembly (702) adjusts the height of the angle turner (703), the mechanical arm (6) places the straight-edge product on a plurality of electromagnets (7044) and a plurality of vacuum suction nozzles (7043) of the angle turner (703), the electromagnets (7044) are connected with a power supply and electrified, and the electromagnets (7044) attract the iron ring (11); the angle turner (703) drives the product fixing jig (704) to rotate, so that the straight-edge product rotates in a vertical plane, and visual macro-inspection is carried out on the straight-edge product in the rotating process; finally, the mechanical arm (6) transfers the straight-edge product to a visual microscopic detection module (8) to carry out microscopic detection and repeated judgment on the macroscopic detected flaws;
The manipulator (6) obtains the round products in the round product box (4), then transfers the round products to the edge inspection alignment module (5), and after automatic positioning, the manipulator (6) lifts the round products to be placed on a horizontal rotation platform (701) and rotates to a required direction; then, the angle turner (703) rotates to the horizontal direction, the lifting assembly (702) adjusts the height of the angle turner (703), the mechanical arm (6) places a round product on the plurality of vacuum suction nozzles (7043) of the angle turner (703) to suck and fix the round product, the angle turner (703) drives the product fixing jig (704) to rotate, so that the round product rotates in a vertical plane, and visual macroscopic inspection is carried out on the round product in the rotating process; finally, the manipulator (6) transfers the round product to the visual microscopic examination module (8), and microscopic examination and repeated judgment are carried out on the macroscopic flaws.
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