CN118559968A - Connector forming die - Google Patents

Abstract

The invention relates to the technical field of injection molds, in particular to a connector forming mold, which comprises a first mold, a second mold and a regulating and controlling module, wherein the second temperature controlling module can control the temperature of a contact pin and prevent the situation that the inner core in a molten state is locally solidified when the inner core is contacted with the contact pin; the inner core is placed in the first mould, the shell raw material in a molten state is injected into the first mould, the third temperature control module in the first mould can regulate and control the temperature of the contact pin, the first temperature control module on the first mould controls the temperature in the first mould, under the action of the regulation and control module, the regulation and control module can control the first temperature control module to cool the contact pin in the first mould after being cooled by the third temperature control module, the inner core is extruded by utilizing the expansion and contraction principle of the shell, the contact pin is ensured to be stably connected together by the inner core, and the unstable connection condition of the contact pin and the inner core is prevented.

Description

Connector forming mold

Technical Field

The invention relates to the technical field of injection molds, and in particular to a connector molding mold.

Background Art

In the connector field of modern electronic equipment, VGA connector, as a common interface, plays an important role. VGA connector mainly consists of components such as shell, inner core and pin. The shell and inner core are prepared by injection molding. There are two commonly used methods for preparing VGA connector. One method is to injection mold the inner core, then punch a hole in the inner core, and insert the pin into the hole of the inner core with external force. However, this installation method is prone to punching errors, resulting in unstable connection between the pin and the inner core. Another method is to set the pin in the mold and connect it with the pin during the injection molding of the inner core. However, when the inner core is injected, the inner core is in a molten high temperature state, and the pin is prone to expand in volume when heated. After the inner core is cooled, the volume of the pin decreases, and the pin is prone to disconnection from the inner core. The above two methods of preparing VGA connectors are prone to unstable connection between the pin and the inner core.

Summary of the invention

The invention provides a connector forming die to solve the problem that the existing method for preparing a VGA connector easily leads to unstable connection between a pin and an inner core.

A connector forming mold of the present invention adopts the following technical solution:

A connector molding die comprises a first die, a second die and a regulating module.

The first mold is used for injection molding the outer shell of the VGA connector. The first mold is provided with a first temperature control module, which can control the temperature inside the first mold; the second mold is used for injection molding the inner core of the VGA connector. The second mold has a positioning module, which can position the pins. The second mold is provided with a second temperature control module, which can control the temperature of the pins; the inner core molded by the second mold can be placed in the first mold; the first mold is provided with a third temperature control module for controlling the temperature of the pins; the control module can control the first temperature control module, the second temperature control module and the third temperature control module.

Furthermore, the second temperature control module can preheat the pins when the inner core is being injection molded, and the preheating temperature of the pins by the second temperature control module is consistent with the temperature of the inner core in a molten state.

Furthermore, a hardness detector is provided in the second mold, and the hardness detector can detect the hardness of the inner core surface. When the hardness of the inner core surface is greater than a first preset value and less than a second preset value, the inner core is separated from the second mold and placed in the first mold.

Furthermore, the control module is configured as follows:

When the inner core enters the first mold, the regulating module controls the third temperature control module to maintain the preheating temperature of the pin.

Furthermore, the control module is also configured as:

When the housing is injection molded into the first mold, the control module controls the third temperature control module to cool the pins;

When the temperature of the pin drops to a third preset value, the regulating module controls the first temperature control module to cool the first mold.

Furthermore, the first temperature control module includes a first heating unit and a first cooling unit, both of which are arranged on the side wall of the first mold, and the control module can selectively control the first heating unit and the first cooling unit.

Furthermore, the second temperature control module includes a second heating unit, which is arranged on the second mold and is used to heat the pins; the third temperature control module includes a third heating unit and a second cooling unit, which are both arranged inside the first mold, and the control module can selectively control the third heating unit and the second cooling unit.

Further, the temperature of the outer shell in a molten state is lower than the temperature of the inner core in a molten state.

Furthermore, when the first cooling unit cools the first mold, the outer shell can squeeze the inner core.

Furthermore, both the first mold and the second mold are provided with an oscillation module, and the oscillation module can oscillate the first mold and the second mold.

The beneficial effects of the present invention are as follows: a connector molding mold provided by the present invention comprises a first mold, a second mold and a regulating module. When producing a VGA connector, the raw materials for preparing the inner core of the VGA connector are first melted, and the molten raw materials for the inner core are injected into the second mold. A positioning module is arranged in the second mold, and the positioning module positions the pin. When the molten inner core is injected into the second mold, one end of the pin is connected to the inner core. A second temperature control module is arranged inside the second mold, and the second temperature control module can control the temperature of the pin to prevent the inner core from being partially solidified when the molten inner core contacts the pin. situation; when the inner core can be separated from the second mold, the inner core is placed in the first mold, and then the molten shell raw material is injected into the first mold, and the shell can cover the outside of the inner core, wherein the third temperature control module in the first mold can regulate the temperature of the pin, and the first temperature control module on the first mold controls the temperature in the first mold. Under the action of the regulation module, the regulation module can control the first temperature control module to cool down the first mold after the pin is cooled by the third temperature control module, and use the thermal expansion and contraction principle of the shell to extrude the inner core to ensure that the inner core stably connects the pins together to prevent the unstable connection between the pins and the inner core.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

FIG. 1 is a schematic structural diagram of a VGA connector produced by a connector molding die provided by an embodiment of the present invention.

In the figure: 110, outer shell; 120, inner core; 130, plug pin.

DETAILED DESCRIPTION

In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and/or processor devices and/or microcontroller devices.

In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, or it can be an electrical, mechanical or other form of connection.

As shown in FIG. 1 , a connector molding die provided by an embodiment of the present invention includes a first die, a second die and a control module.

The first mold is used for injection molding the housing 110 of the VGA connector. The first mold is provided with a first temperature control module, and the first temperature control module can control the temperature in the first mold.

Specifically, the first mold is used for injection molding the shell 110 of the VGA connector. The first mold is hollow inside, and the raw material of the shell 110 in a molten state can be injected into the first mold. After cooling, the raw material of the shell 110 in a molten state can form the shell 110 in the first mold. A first temperature control module is provided on the first mold, and the first temperature control module can control the temperature in the first mold. Under the action of the first temperature control module, the temperature in the first mold can be controlled, and the solidification speed of the raw material of the shell 110 in a molten state in the first mold can be controlled.

The second mold is used for injection molding the inner core 120 of the VGA connector. The second mold is provided with a positioning module, which can position the pin 130. The second mold is provided with a second temperature control module, which can control the temperature of the pin 130. The inner core 120 molded by the second mold can be placed in the first mold. The first mold is provided with a third temperature control module for controlling the temperature of the pin 130.

Specifically, the second mold is hollow inside, and the internal space of the second mold is smaller than the internal space of the first mold. The raw material of the inner core 120 in a molten state can be injected into the second mold. After cooling, the raw material of the inner core 120 in a molten state can form the inner core 120 in the second mold. The second mold has a positioning module, which can position the plug pin 130. When the raw material of the inner core 120 in a molten state is injected into the second mold, the plug pin 130 can stay on the inner core 120 stably, so that one end of the plug pin 130 is connected to the inner core 120. The second mold is provided with a second temperature control module, which can control the temperature of the plug pin 130. When the raw material of the inner core 120 in a molten state is injected into the second mold, the second temperature control module controls the temperature of the plug pin 130 to be consistent with the temperature of the raw material of the inner core 120 in a molten state, so as to prevent the phenomenon of local solidification of the raw material of the inner core 120 in a molten state from contacting the cooled plug pin 130. After the inner core 120 in the second mold solidifies to a certain extent, the inner core 120 can be taken out of the second mold and placed in the first mold. When the raw material of the outer shell 110 in a molten state is injected into the first mold, the outer shell 110 can cover the outer side of the inner core 120, thereby ensuring the stability of the connection between the outer shell 110 and the inner core 120. A third temperature control module for controlling the temperature of the plug pin 130 is provided in the first mold. Through the setting of the third temperature control module, it is ensured that the temperature change of the plug pin 130 in the first mold can be adjusted to avoid the situation where the plug pin 130 is separated from the inner core 120 after natural cooling.

The regulating module can regulate the first temperature control module, the second temperature control module and the third temperature control module.

Specifically, during the process of injecting the molten raw material of the inner core 120 into the second mold, the control module controls the second temperature control module to heat the temperature of the pin 130 to be consistent with the temperature of the molten raw material of the inner core 120, so as to prevent the local solidification of the molten raw material of the inner core 120 from contacting the cooled pin 130. During the process of injecting the molten raw material of the outer shell 110 into the first mold, the control module controls the first temperature control module to control the temperature inside the first mold, thereby controlling the solidification speed of the outer shell 110. When the inner core 120 is placed inside the first mold, the control module controls the third temperature control module to control the temperature of the pin 130 and the cooling speed of the pin 130. The control module achieves a stable connection between the pin 130 and the inner core 120 by regulating the first temperature control module, the second temperature control module and the third temperature control module.

The present invention provides a connector molding mold. When producing a VGA connector, the raw materials for preparing the inner core 120 of the VGA connector are first melted, and the raw materials of the inner core 120 in a molten state are injected into the interior of a second mold. A positioning module is provided in the second mold, and the positioning module positions the plug pin 130. When the molten inner core 120 is injected into the second mold, one end of the plug pin 130 is connected to the inner core 120. A second temperature control module is provided in the second mold, and the second temperature control module can control the temperature of the plug pin 130 to prevent the inner core 120 from being partially solidified when the molten inner core 120 contacts the plug pin 130. When the inner core 120 can be separated from the second mold, , place the inner core 120 in the first mold, and then inject the molten raw material of the outer shell 110 into the first mold. The outer shell 110 can cover the outside of the inner core 120, wherein the third temperature control module in the first mold can regulate the temperature of the pin 130, and the first temperature control module on the first mold controls the temperature in the first mold. Under the action of the regulation module, the regulation module can control the first temperature control module to cool down the first mold after the pin 130 is cooled by the third temperature control module, and use the thermal expansion and contraction principle of the outer shell 110 to extrude the inner core 120 to ensure that the inner core 120 stably connects the pin 130 together to prevent the unstable connection between the pin 130 and the inner core 120.

In one embodiment, the second temperature control module can preheat the pin 130 when the inner core 120 is injected, and the preheating temperature of the pin 130 by the second temperature control module is consistent with the temperature of the inner core 120 in a molten state.

Specifically, by preheating the pin 130, during the process of injecting the molten raw material of the inner core 120 into the second mold, the second temperature control module controls the temperature of the pin 130 to be consistent with the temperature of the molten raw material of the inner core 120, thereby preventing local solidification of the molten raw material of the inner core 120 when it contacts the cooled pin 130.

Furthermore, when the inner core 120 has not been separated from the second mold, the control module can control the second temperature control module to maintain the heating state of the plug pin 130. Since the plug pin 130 is made of metal, the plug pin 130 has slight thermal expansion and contraction. When the plug pin 130 is in a heated state, the volume of the plug pin 130 is in an expanded state. In this state, the inner core 120 is in a non-solidified state at the position where the plug pin 130 contacts the inner core 120. When the outer peripheral wall of the inner core 120 can support demolding, the inner core 120 is placed in the first mold. Except for the position where the inner core 120 contacts the plug pin 130, other areas of the outer surface of the inner core 120 are hardened, so that the plug pin 130 can still maintain a stable state.

In one embodiment, a hardness detector is provided in the second mold, and the hardness detector can detect the hardness of the surface of the inner core 120. When the hardness of the surface of the inner core 120 is greater than a first preset value and when the hardness of the surface of the inner core 120 is less than a second preset value, the inner core 120 is separated from the second mold and placed in the first mold.

Specifically, the first preset value and the second preset value are both artificially set parameters, wherein the size of the first preset value is smaller than the size of the second preset value, when the hardness of the surface of the inner core 120 reaches the first preset value, there is still molten raw material inside the inner core 120, when the hardness of the surface of the inner core 120 reaches the second preset value, there is no molten raw material inside the inner core 120, when the hardness of the surface of the inner core 120 is greater than the first preset value and the hardness of the surface of the inner core 120 is less than the second preset value, the inner core 120 is separated from the second mold and the inner core 120 is placed in the first mold, so that when the outer shell 110 is injection molded, the molten raw material of the outer shell 110 will not damage the outer wall of the inner core 120.

In one of the embodiments, the control module is configured as follows: when the inner core 120 enters the first mold, the control module controls the third temperature control module to maintain the preheating temperature of the insertion pin 130 .

Specifically, when the inner core 120 enters the first mold, the molten raw material of the outer shell 110 begins to be injected into the first mold. To facilitate the subsequent adjustment of the pin 130 on the inner core 120, the regulation module controls the third temperature control module to maintain the preheating temperature of the pin 130. Accordingly, the position where the inner core 120 contacts the pin 130 is still in a molten state.

In one of the embodiments, the regulation module is further configured as follows: when the shell 110 is injected into the first mold, the regulation module controls the third temperature control module to cool the pin 130; when the temperature of the pin 130 drops to a third preset value, the regulation module controls the first temperature control module to cool the first mold.

Specifically, when the outer shell 110 is injected into the first mold, the raw material of the outer shell 110 in a molten state covers the outer side of the inner core 120 , and the raw material of the outer shell 110 in a molten state can slow down the cooling of the inner core 120 . At this time, the regulation module controls the third temperature control module to cool down the pin 130. After the temperature of the pin 130 is reduced, the volume of the pin 130 is reduced. When the temperature of the pin 130 is reduced to a third preset value, wherein the third preset value is room temperature, or the third preset value is a temperature lower than room temperature, the volume of the pin 130 is reduced to a normal state. At this time, a gap may be generated between the pin 130 and the inner core 120. However, the contact position between the inner core 120 and the pin 130 is still in a molten state. The regulation module controls the first temperature control module to cool down the first mold. After the first mold is cooled, the raw material of the outer shell 110 in a molten state can shrink. The outer shell 110 can squeeze the inner core 120 when shrinking. After the inner core 120 is squeezed by external force, the gap between the inner core 120 and the pin 130 can be reduced, thereby making the inner core 120 and the pin 130 stably connected.

In one embodiment, the first temperature control module includes a first heating unit and a first cooling unit, both of which are arranged on the side wall of the first mold, and the control module can selectively control the first heating unit and the first cooling unit.

In one embodiment, the first heating unit is a first heating wire, which is filled inside the side wall of the first mold. The first heating wire can generate heat after being energized, so that the inside of the first mold is in a heated state. When the shell 110 raw material in a molten state is ready to be filled into the first mold, the control module can first control the first heating wire to preheat the inside of the first mold to prevent the molten shell 110 raw material from being partially solidified when it contacts the cooled inner side wall of the first mold. The first cooling unit includes a first cooling tube and a radiator. The first cooling tube is arranged inside the side wall of the first mold. The radiator can connect the first cooling tube to a closed loop, and the control module can control the conduction state of the first cooling tube and the radiator. A refrigerant is arranged inside the first cooling tube, and the refrigerant can circulate in the first cooling tube. When the molten shell 110 raw material needs to be cooled, the radiator is started, and the control module controls the first cooling tube to be connected to the radiator, so that the heat in the first mold can exchange heat with the refrigerant. The control module can selectively control the first heating unit and the first cooling unit. It can be understood that the first heating unit and the first cooling unit cannot operate at the same time to avoid energy loss.

In one embodiment, the second temperature control module includes a second heating unit, which is arranged on the second mold and is used to heat the pin 130; the third temperature control module includes a third heating unit and a second cooling unit, which are both arranged inside the first mold, and the control module can selectively control the third heating unit and the second cooling unit.

Specifically, the second heating unit is a second heating wire, which is disposed on the second mold and can be in direct contact with the plug pin 130, so the heat of the second heating wire can be transferred to the plug pin 130, and the control module can control the power supply to the second heating wire, so the control module can control the temperature of the plug pin 130. The third heating unit is a third heating wire, which is disposed on the first mold and can be in direct contact with the plug pin 130, so the heat of the third heating wire can be transferred to the plug pin 130, and the control module can control the power supply to the third heating wire, so the control module can control the temperature of the plug pin 130. The second cooling unit includes a second cooling tube, which can be in direct contact with the pin 130 in the first mold, and is connected to the radiator. A refrigerant is arranged in the second cooling tube. The second cooling tube and the first cooling tube are not connected to each other. The control module can control the conduction state between the second cooling tube and the radiator. When the pin 130 needs to be cooled, the radiator is started, and the control module controls the conduction between the second cooling tube and the radiator, so that the heat energy carried by the pin 130 in the first mold can exchange heat with the refrigerant, thereby cooling the pin 130. The control module can selectively control the third heating unit and the second cooling unit. It can be understood that the third heating unit and the second cooling unit cannot be operated at the same time to avoid energy loss.

In one embodiment, the temperature of the outer shell 110 in a molten state is lower than the temperature of the inner core 120 in a molten state.

Specifically, by controlling the material of the outer shell 110 and the material of the inner core 120, it is ensured that the temperature of the outer shell 110 in the molten state is lower than the temperature of the inner core 120 in the molten state, thereby ensuring that when the molten raw material of the outer shell 110 is injected into the first mold, the molten raw material of the outer shell 110 will not cause the inner core 120 to melt again.

In one embodiment, when the first cooling unit cools down the first mold, the outer shell 110 can press the inner core 120 .

Specifically, when the first cooling unit cools the first mold, the raw material of the outer shell 110 in the first mold in a molten state solidifies rapidly. When the outer shell 110 is rapidly cooled from a high temperature state, the volume of the outer shell 110 shrinks inwardly. When shrinking inwardly, the outer shell 110 can squeeze the inner core 120.

In one embodiment, both the first mold and the second mold are provided with an oscillation module, and the oscillation module can oscillate the first mold and the second mold.

Specifically, an oscillation module is arranged on the first mold and the second mold, wherein when the raw material of the inner core 120 in a molten state is injected into the second mold, the control module controls the oscillation module on the second mold to start, and by arranging the vibration module on the second mold, it is possible to prevent bubbles from being generated when the raw material of the inner core 120 in a molten state is injected into the second mold; when the raw material of the outer shell 110 in a molten state is injected into the first mold, the control module controls the oscillation module on the first mold to start, and by arranging the vibration module on the first mold, it is possible to prevent bubbles from being generated when the raw material of the outer shell 110 in a molten state is injected into the first mold.

The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims (10)

1. A connector forming die, comprising:

The first die is used for injection molding of the shell of the VGA connector, a first temperature control module is arranged on the first die, and the first temperature control module can control the temperature in the first die;

The second die is used for injection molding of the inner core of the VGA connector, a positioning module is arranged in the second die, the positioning module can position the contact pin, a second temperature control module is arranged on the second die, and the second temperature control module can control the temperature of the contact pin; the inner core injection molded by the second mold can be placed in the first mold; a third temperature control module for controlling the temperature of the contact pin is arranged in the first die;

the regulation and control module can regulate and control the first temperature control module, the second temperature control module and the third temperature control module.

2. The connector molding die of claim 1, wherein the second temperature control module is capable of preheating the pins during injection molding of the core, the preheating temperature of the pins by the second temperature control module being consistent with the core temperature in a molten state.

3. The connector molding die of claim 1, wherein a hardness detector is disposed in the second die, the hardness detector being capable of detecting the hardness of the surface of the inner core, and wherein the inner core is released from the second die and placed in the first die when the hardness of the surface of the inner core is greater than a first predetermined value and the hardness of the surface of the inner core is less than a second predetermined value.

4. A connector forming die as claimed in claim 3, wherein the control module is configured to:

when the inner core enters the first die, the regulation and control module controls the third temperature control module to keep the preheating temperature for the pins.

5. The connector forming die of claim 4, wherein the conditioning module is further configured to:

When the shell is injected into the first die, the regulation and control module controls the third temperature control module to cool the contact pin;

When the temperature of the contact pin is reduced to a third preset value, the regulation and control module controls the first temperature control module to cool the first die.

6. The connector forming die of claim 1, wherein the first temperature control module comprises a first heating unit and a first cooling unit, the first heating unit and the first cooling unit are both arranged on the side wall of the first die, and the regulation and control module can selectively control the first heating unit and the first cooling unit.

7. The connector molding die of claim 1, wherein the second temperature control module comprises a second heating unit, the second heating unit is disposed on the second mold, and the second heating unit is used for heating the pins; the third temperature control module comprises a third heating unit and a second cooling unit, the third heating unit and the second cooling unit are arranged inside the first die, and the regulation and control module can selectively control the third heating unit and the second cooling unit.

8. The connector forming die of claim 1, wherein the temperature of the molten state of the outer shell is lower than the temperature of the molten state of the inner core.

9. The connector forming die of claim 6, wherein the outer shell can squeeze the inner core when the first cooling unit cools the first die.

10. The connector forming die of claim 1, wherein the first die and the second die are provided with oscillation modules, and the oscillation modules are capable of oscillating the first die and the second die.