CN118559893A - Fully automatic chip splitting device for diode chip production - Google Patents

Fully automatic chip splitting device for diode chip production Download PDF

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Publication number
CN118559893A
CN118559893A CN202410742793.8A CN202410742793A CN118559893A CN 118559893 A CN118559893 A CN 118559893A CN 202410742793 A CN202410742793 A CN 202410742793A CN 118559893 A CN118559893 A CN 118559893A
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CN
China
Prior art keywords
plate
vertical
seat
diode chip
transverse
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Granted
Application number
CN202410742793.8A
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Chinese (zh)
Other versions
CN118559893B (en
Inventor
李�浩
魏兴政
高飞
杨守岗
石秀花
刘川立
王鹏
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Jinan Lanxing Electronics Co ltd
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Jinan Lanxing Electronics Co ltd
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Priority to CN202410742793.8A priority Critical patent/CN118559893B/en
Publication of CN118559893A publication Critical patent/CN118559893A/en
Application granted granted Critical
Publication of CN118559893B publication Critical patent/CN118559893B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention belongs to the technical field of diode chip production and processing, and particularly relates to a full-automatic splitting device for diode chip production, which comprises a box body, wherein a feeding mechanism, a loading mechanism, a splitting mechanism and a connection mechanism are sequentially arranged above the box body along the advancing direction of a diode chip, a cutting mechanism is arranged below the loading mechanism, the splitting mechanism comprises a fixed plate connected with a support rod, a fixed seat is arranged on the periphery of the lower part of the support rod, a lower base is arranged on the fixed seat, a support seat is arranged on the lower base, a longitudinal sliding block is arranged on a longitudinal sliding strip assembly, a lifting cylinder is arranged below the longitudinal sliding block, a concave seat is arranged at the output end of the lifting cylinder, and a clamping mechanism is arranged in the concave seat. The invention has reasonable design and simple structure, can replace manual work to complete the splitting action of the chip, saves labor cost, improves the working process, ensures the yield of core particle finished products and meets the use requirement.

Description

Full-automatic splitting device for diode chip production
Technical Field
The invention belongs to the technical field of diode chip production and processing, and particularly relates to a full-automatic splitting device for diode chip production.
Background
The diode chip is a semiconductor device chip formed by a PN junction and is mainly used for rectifying, voltage stabilizing, switching, amplifying and other functions in an electronic circuit. The diode chip has wide application, can be used in power supplies, motors, voltage regulators, electronic measuring equipment, switching power supplies, inverters, amplifiers, modulators, demodulators and other equipment, and is an indispensable key technology in the design and manufacture of electronic equipment. Diode chips play an important role in the design and manufacture of electronic devices due to their small size, high performance and low power consumption.
At present, in the production and processing work of diode chips, especially in the splitting process, the laser cutting equipment is used for cutting and forming a cutting channel on a large finished product, adjacent core particles cannot be completely separated, then the large finished product is manually split, the conventional operation mode is to hold a workpiece left and right, the split diode chips are given with acting force in a breaking mode, then the split chips can be completed, and then the split chips are collected together and conveyed to the next processing procedure.
Disclosure of Invention
Aiming at the technical problems, the invention provides the full-automatic splitting device for producing the diode chip, which has the advantages of reasonable design, simple structure, convenient processing and capability of replacing manual completion of the splitting process of the chip workpiece, on one hand, the labor cost can be effectively saved, the manual labor intensity is reduced, the working process is improved, on the other hand, the relative unification of the force in the splitting process is ensured, the possibility of falling and flying the core particles is reduced, the yield of the core particles can be ensured, and the use of the functionality is ensured.
In order to achieve the above purpose, the technical scheme adopted by the invention is that the full-automatic splitting device for diode chip production comprises a box body, a supporting plate is arranged above the box body, a supporting rod is arranged at the outer side corner of the supporting plate, a feeding mechanism, a loading mechanism, a splitting mechanism and a connection mechanism are sequentially arranged above the box body along the advancing direction of the diode chip, a cutting mechanism is arranged below the loading mechanism, the cutting mechanism comprises a vertical plate which is in a concave shape, a first sliding rod is arranged in the vertical plate, a moving block is arranged on the first sliding rod, a concave plate which can be adjusted by transverse movement is arranged on one side of the moving block, a second sliding rod is arranged in the concave plate, a lifting block is arranged on one side of the lifting block, the splitting mechanism comprises a fixing plate connected with the supporting rod, a lifting plate is arranged below the fixing seat, a splitting blade seat is arranged below the lifting plate, the periphery of the supporting rod is provided with a concave plate, a vertical seat is arranged on the periphery of the fixing seat, a vertical seat is arranged below the lifting seat is arranged on the fixing seat, a vertical seat is arranged in the vertical seat, and a vertical seat is arranged in the vertical seat is arranged on the vertical seat, and a vertical seat is arranged on the vertical seat.
Preferably, the clamping mechanism comprises a top moving cylinder, cross bars are arranged at corners of two sides of the concave seat, T-shaped blocks are arranged at the ends of the cross bars, limiting plates are arranged at the upper ends of the T-shaped blocks, through holes are formed in the T-shaped blocks, rotating frames which are Z-shaped are arranged at the lower ends of the T-shaped blocks, ball hinges are arranged at the output ends of the top moving cylinder, the other ends of the top moving cylinder are connected with the rotating frames, clamping plates are arranged above the corners of the rotating frames, and expansion springs are arranged between the outer sides of the concave seat and the rotating frames.
Preferably, the feeding mechanism comprises a mounting plate, a vertical plate which is in L-shaped design is arranged below the rear side of the mounting plate, a vertical slide bar is arranged on the front side of the vertical plate, a vertical slide block is arranged on the vertical slide bar, a first linear driving assembly which is used for driving the vertical slide block to vertically lift and move is arranged on the rear side of the vertical plate, a mounting seat is arranged on one side of the vertical slide block, a transverse plate is arranged on the mounting seat, guide columns are arranged above the two ends of the transverse plate, a linear bearing seat is arranged below the mounting plate and connected with the guide columns, a discharging plate is arranged at the upper end of the guide columns, a bin plate which is respectively in transverse and longitudinal arrangement is arranged above the mounting plate, and screw adjusting assemblies which can synchronously adjust the positions of the bin plates are arranged below the bin plates.
Preferably, the feeding mechanism comprises a transverse moving assembly connected with the supporting plate, a transverse sliding plate is arranged at the moving end of the transverse moving assembly, a feeding cylinder is arranged below the transverse sliding plate, a sorting plate is arranged at the lower end of the feeding cylinder, and a plurality of vacuum suction cups are uniformly distributed in the sorting plate.
Preferably, the material loading mechanism comprises a supporting bottom plate, a transverse sliding bar is arranged above the supporting bottom plate, a transverse sliding block is arranged on the transverse sliding bar, a second linear driving assembly is arranged below the transverse sliding bar, a feeding plate is arranged on the transverse sliding block, and a material containing assembly is arranged on the feeding plate.
Preferably, the material containing assembly comprises a moving plate in an L-shaped design, limiting slide bars are arranged on two sides of the moving plate, and adjusting plates in a concave shape design are arranged on the outer sides of the limiting slide bars.
Preferably, the connection mechanism comprises a supporting plate frame, a supporting plate body is arranged between the two supporting plate frames, roller shafts are arranged on two sides of the supporting plate body, rotating rollers which are arranged in a triangular shape are arranged between the supporting plate frames below the supporting plate body, and belts are wound on the roller shafts and the rotating rollers.
Compared with the prior art, the invention has the advantages and positive effects that,
1. According to the full-automatic splitting device for diode chip production, provided by the invention, through the matching use of the arranged feeding mechanism, the loading mechanism, the splitting mechanism and the connecting mechanism, the workpiece feeding, conveying, cutting, splitting and outputting functions are integrated, the use functionality of the device is fully ensured, the degree of automation is high, and the production, processing and use requirements can be effectively met; through the clamping mechanism, the manual breaking of the workpiece can be effectively simulated to realize the working process of splitting, so that the labor cost is saved, the labor intensity is reduced, the working process is ensured, and the production, processing and use requirements are met; the device has reasonable design, simple structure and convenient processing, can replace manual work to complete the splitting process of the chip workpiece, can effectively save labor cost, reduce manual labor intensity, improve the working process, ensure the relative unification of force in the splitting process, reduce the possibility that core particles fall off and fly, and can also ensure the yield of finished products of the core particles and ensure the use functionality.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.
FIG. 1 is a schematic diagram of a fully automatic splinter device for diode chip production;
FIG. 2 is a front view of a fully automatic splinter device for diode chip production;
FIG. 3 is a schematic structural view of a feeding mechanism;
Fig. 4 is a schematic structural plan view of the feeding mechanism;
FIG. 5 is a schematic view of a loading mechanism;
FIG. 6 is a schematic view of a cutting mechanism;
FIG. 7 is a schematic view of a cutting mechanism from another perspective;
FIG. 8 is a schematic view of a portion of the construction of the splinter mechanism;
FIG. 9 is a schematic view of a portion of the splinter mechanism from another perspective;
FIG. 10 is a schematic view of a clamping mechanism;
FIG. 11 is a schematic view of the clamping mechanism from the bottom;
In the above figures, 1, a box body; 2. a support plate; 3. a support rod; 4. a feeding mechanism; 41. a mounting plate; 42. a vertical slide bar; 43. a vertical sliding block; 44. a first linear drive assembly; 45. a mounting base; 46. a cross plate; 47. a guide post; 48. a linear bearing seat; 49. a discharging plate; 410. a bin plate; 411. a screw adjustment assembly; 5. a feeding mechanism; 51. a lateral movement assembly; 52. a lateral sliding plate; 53. a feeding cylinder; 54. a sorting plate; 55. a vacuum chuck; 6. a loading mechanism; 61. a support base plate; 62. a transverse slide; 63. a transverse slide block; 64. a second linear drive assembly; 65. a feeding plate; 66. a material containing component; 661. a moving plate; 662. a limit slide bar; 663. an adjustment plate; 7. a splinter mechanism; 71. a fixing plate; 72. a lifting plate; 721. a split blade holder; 73. a fixing seat; 74. a lower base; 75. a support base; 751. an adaptation groove; 76. a collection cover; 761. a pushing plate; 77. a longitudinally moving assembly; 771. a longitudinal slide assembly; 772. a longitudinal slide block; 773. a lifting cylinder; 774. a concave seat; 8. a connection mechanism; 81. supporting plate frame; 82. a pallet body; 83. a roller shaft; 84. a rotating roller; 85. a belt; 9. a cutting mechanism; 91. a riser; 92. a first slide bar; 93. a moving block; 94. a concave plate; 95. a second slide bar; 96. a lifting block; 97. a laser cutting assembly; 10. a clamping mechanism; 101. a jacking cylinder; 102. a cross bar; 103. a T-shaped block; 1031. a through hole; 104. a limiting plate; 105. a rotating frame; 106. a ball-hinge; 107. a clamping plate; 108. and a telescopic spring.
Detailed Description
In order that the above objects, features and advantages of the application will be more clearly understood, a further description of the application will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present application and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced otherwise than as described herein, and therefore the present invention is not limited to the specific embodiments of the disclosure that follow.
1-11, A full-automatic splitting device for diode chip production comprises a box body 1, wherein a supporting plate 2 is arranged above the box body 1, a supporting rod 3 is arranged at the outer side corner of the supporting plate 2, a feeding mechanism 4, a feeding mechanism 5, a loading mechanism 6, a splitting mechanism 7 and a connection mechanism 8 are sequentially arranged above the box body 1 along the advancing direction of a diode chip, the matching use of all device components integrates the functions of workpiece feeding, conveying, cutting, splitting and outputting, the use functionality of device equipment is fully ensured, the degree of automation is high, and the production, processing and use requirements can be effectively met; Further, the method comprises the following steps: the below of carrying mechanism 6 is provided with cutting mechanism 9, and cutting mechanism 9 is including being the riser 91 of spill form design, is provided with first slide bar 92 in the riser 91, is provided with movable block 93 on the first slide bar 92, and one side of movable block 93 is provided with the concave plate 94 that can lateral shifting adjusted, is provided with second slide bar 95 in the concave plate 94, is provided with lifter 96 on the second slide bar 95, and one side of lifter 96 is provided with laser cutting subassembly 97, and the concrete description is: what needs to be further explained is: a cylinder for driving the moving block 93 to move relative to the first slide bar 92 is arranged at one side of the vertical plate 91, One side of the moving block 93 is provided with a cylinder for driving the concave plate 94 to move and adjust in the transverse direction and a cylinder for driving the lifting block 96 to move and adjust in the vertical direction relative to the second sliding rod 95, and the cylinders are mutually matched, so that the laser cutting assembly 97 can be driven to move and adjust in multiple directions, and particularly, workpieces on the loading mechanism 6 can be cut, thereby providing preconditions for realizing subsequent splitting work, greatly improving the use functionality of device equipment and meeting the use requirements; In order to effectively complete the splitting work of the workpiece, the splitting mechanism 7 comprises a fixed plate 71 connected with a supporting rod 3, a lifting plate 72 is arranged below the fixed plate 71, a splitting blade holder 721 is arranged below the lifting plate 72, a fixed seat 73 is arranged on the periphery of the lower part of the supporting rod 3, a lower base 74 is arranged on the fixed seat 73, a supporting seat 75 is arranged on the lower base 74, a collecting cover 76 is arranged in the supporting seat 75, wherein one side lower part of the collecting cover 76 is in a U-shaped design and is close to a connection mechanism 8, a pushing plate 761 is arranged behind the collecting cover 76, and of course, a cylinder for driving the pushing plate 761 to move and adjust is also arranged on one side of the fixed seat 73, So as to intensively lead out the core particles in the collecting cover 76 on the connection mechanism 8, ensure the smooth production work, an adapting groove 751 is arranged in a supporting seat 75 positioned at one side of the collecting cover 76, plays a role in placing the corresponding actions made by the clamping mechanism 10 to avoid interference, a longitudinal moving assembly 77 is arranged in a fixed seat 73 at one side of the lower base 74, the longitudinal moving assembly 77 comprises a longitudinal sliding strip assembly 771, a longitudinal sliding block 772 is arranged on the longitudinal sliding strip assembly 771, a lifting cylinder 773 is arranged below the longitudinal sliding block 772, a concave seat 774 is arranged at the output end of the lifting cylinder 773, The concave seat 774 is provided therein with a clamping mechanism 10, specifically described as: a cylinder (not shown) for driving the lifting plate 72 to freely lift and adjust vertically is arranged above the fixed plate 71, the output end of the cylinder penetrates through the fixed plate 71 and is connected with the upper part of the lifting plate 72, when a workpiece is cut, the workpiece is put on the supporting seat 75 by the loading mechanism 6, two sides of the workpiece are clamped by the clamping mechanism 10, the split blade holder 721 moves downwards while the split blade is broken by the clamping mechanism 10, downward pressure is applied to the workpiece, smooth split work is ensured, and meanwhile, the possibility of scattering core particles is reduced, Thus, the cracked workpieces are intensively dropped into the collecting cover 76, thereby providing convenience for the subsequent output work and meeting the use requirement;
In the above process: through the cooperation of the feeding mechanism 4, the feeding mechanism 5, the carrying mechanism 6, the splitting mechanism 7 and the connection mechanism 8, the workpiece feeding, conveying, cutting, splitting and outputting functions are integrated, the use functionality of the device is fully ensured, the automation degree is high, and the production and processing use requirements can be effectively met; through the clamping mechanism 10, the manual breaking of the workpiece can be effectively simulated to realize the working process of splitting, so that the labor cost is saved, the labor intensity is reduced, the working process is ensured, and the production, processing and use requirements are met; the device has reasonable design, simple structure and convenient processing, can replace manual work to complete the splitting process of the chip workpiece, can effectively save labor cost, reduce manual labor intensity, improve the working process, ensure the relative unification of force in the splitting process, reduce the possibility that core particles fall off and fly, and can also ensure the yield of finished products of the core particles and ensure the use functionality.
In order to facilitate the completion of the clamping of the workpiece to simulate the breaking work of the workpiece, the clamping mechanism 10 comprises a pushing cylinder 101, two side corners of a concave seat 774 are provided with a cross bar 102, the end part of the cross bar 102 is provided with a T-shaped block 103, the upper end of the T-shaped block 103 is provided with a limiting plate 104, the stability of the position of the T-shaped block 103 is ensured by utilizing the established cross bar 102 and the limiting plate 104, a through hole is formed in the T-shaped block 103, the lower end of the T-shaped block 103 is provided with a rotating frame 105 in a Z-shaped design, the output end of the pushing cylinder 101 is provided with a ball hinge 106, the other end of the ball hinge is connected with the rotating frame 105, a clamping plate 107 is arranged above the corner of the rotating frame 105, the position of the clamping plate 107 is particularly arranged according to the thickness of the workpiece, and of course, the clamping plate 107 can be provided with a moving part with an automatic adjusting function, and the position of the clamping cylinder can be replaced to ensure the effective completion of the workpiece clamping action, and a telescopic spring 108 is arranged between the outer side of the concave seat 774 and the rotating frame 105, which is specifically described as follows: the output end of the jacking cylinder 101 is led out through a through hole, the through hole is set up to avoid the occurrence of motion interference, when a workpiece needs to be clamped, the jacking cylinder 101 is used for adjusting the upper end of the rotating frame 105 to be horizontal, the gap alignment between the clamping plate 107 and the rotating frame 105 is ensured, and then the longitudinal moving component 77 is used for adjusting the position of the clamping mechanism 10, in particular, the clamping plate 107 clamps the workpiece, after the workpiece is clamped, the workpiece is just above the collecting cover 76, the jacking cylinder 101 stretches to act on the ball hinge 106 in the process of simulating the breaking action to realize the breaking action, the rotating frame 105 rotates relative to the T-shaped block 103 to realize the trend of downward pressing action of the workpiece, and meanwhile, the lifting cylinder 773 also needs to drive the clamping mechanism 10 to be finely adjusted in the vertical direction to adapt to the smooth completion of the downward pressing action, so that the use requirement is met.
In order to effectively complete the feeding of a workpiece to be processed and improve the use functionality of device equipment, the feeding mechanism 4 comprises a mounting plate 41, a vertical plate 412 which is in an L-shaped design is arranged below the rear side of the mounting plate 41, a vertical slide bar 42 is arranged on the front side of the vertical plate 412, a vertical slide block 43 is arranged on the vertical slide bar 42, a first linear driving assembly 44 for driving the vertical slide block 43 to vertically lift and move is arranged on the rear side of the vertical slide bar 42, a mounting seat 45 is arranged on one side of the vertical slide block 43, a transverse plate 46 is arranged on the mounting seat 45, guide posts 47 are arranged above two ends of the transverse plate 46, a linear bearing seat 48 is arranged below the mounting plate 41 and connected with the guide posts 47, a discharging plate 49 is arranged at the upper end of the guide posts 47, a feed bin plate 410 which is horizontally and longitudinally arranged respectively is also arranged above the mounting plate 41, and a screw adjusting assembly 411 which can synchronously adjust the positions of the feed bin plates which are arranged is arranged below the two feed bin plates 410, and is specifically described as follows: firstly, for the first linear driving assembly 44, it usually includes two sets of rotating wheels, and then a synchronous belt is wound on the two rotating wheels, the end of the synchronous belt is respectively connected with two sides of the vertical sliding block 43, and the rotation of one rotating wheel can drive the synchronous belt to operate, and then acts on the vertical sliding block 43 to make it move vertically, so as to drive the guide rod to lift and adjust vertically relative to the linear bearing seat 48, thus, the discharging plate 49 can move and lift vertically, so as to realize lifting workpieces to be processed one by one, and provide convenience for the suction of the subsequent feeding mechanism 5; further, the method comprises the following steps: the mounting plate 41 is internally provided with grooves which are transversely and longitudinally arranged, so as to provide convenience for movement adjustment of each bin plate 410, for the screw adjusting assembly 411 which is arranged, for screw components at two ends of one screw adjusting assembly 411 which are in the same direction, the screw components are connected with the geometric center of the mounting plate 41 in a rotating way, so that the stability of the screw components is ensured, and meanwhile, the outermost end of the screw adjusting assembly 411 is provided with an adjusting handle, and by adjusting the position of each bin plate 410, the adaptation of workpieces with different specifications and sizes can be realized, the use functions of device equipment are greatly improved, and different use requirements are met; further, before the splitting work starts, a certain number of workpieces can be placed in the area formed by the bin plate 410, the workpieces are received by the discharging plate 49, and by means of the vertical movement of the workpieces, the workpieces are conveniently ejected, so that convenience is provided for the development of the follow-up work, of course, a protective film is generally arranged on the diode chip in the prior art, the upper end face of the discharging plate 49 is attached with the protective film, and when the workpieces are placed, one face with the film is placed upwards, so that convenience is provided for the follow-up cutting work.
In order to be convenient for carry the work piece of feed mechanism 4 department to next machining work area, feed mechanism 5 includes the lateral shifting subassembly 51 that is connected with backup pad 2, is provided with lateral sliding plate 52 on the mobile end of lateral shifting subassembly 51, and the below of lateral sliding plate 52 sets up the feeding cylinder 53, and the lower extreme of feeding cylinder 53 is provided with sorting board 54, and the equipartition is provided with a plurality of vacuum chuck 55 in the sorting board 54, specifically describes: an air cylinder (not shown in the figure) for driving the transverse sliding plate 52 to move and adjust is further arranged above the set supporting plate 2, and the transverse sliding plate 52 can drive the feeding air cylinder 53 and the sorting plate 54 to move through the movement and adjustment, and during operation, the position of the vacuum chuck 55 is adjusted by especially utilizing the vertical expansion and contraction of the feeding air cylinder 53, so that the workpiece can be stably sucked, and then the workpiece is conveyed to the loading mechanism 6, so that the working process is ensured.
In order to effectively complete feeding work on a workpiece, the loading mechanism 6 comprises a supporting bottom plate 61, a transverse sliding bar 62 is arranged above the supporting bottom plate 61, a transverse sliding block 63 is arranged on the transverse sliding bar 62, a second linear driving assembly 64 is arranged below the transverse sliding bar 62, a feeding plate 65 is arranged on the transverse sliding block 63, a material containing assembly 66 is arranged on the feeding plate 65, and the specific description is as follows: the second linear driving assembly 64 and the first linear driving assembly 44 are set up in the same manner, and the function of the second linear driving assembly is to provide driving power for movement adjustment of the transverse sliding block 63, that is, the feeding mechanism 5 takes out the workpiece from the feeding mechanism 4 and places the workpiece towards the loading assembly, and after the workpiece is placed, the second linear driving assembly 64 is utilized to drive the workpiece to move towards the splitting mechanism 7, so that the workpiece is ensured to complete corresponding feeding work, and the working process is ensured.
In order to further improve the use functionality of the device, the material containing assembly 66 comprises a moving plate 661 with an L-shaped design, two sides of the moving plate 661 are provided with limiting sliding rods 662, and an adjusting plate 663 with a concave design is arranged on the outer side of the limiting sliding rods 662, which is specifically described as follows: the spacing slide bar 662 is established in the movable plate 661, and the both sides cover of adjusting plate 663 is established on spacing slide bar 662, and can slide relative spacing slide bar 662 to there is certain damping sense, and its effect is that the work piece of adaptable different specifications is accepted, simultaneously, when placing the work piece in lobe of a leaf mechanism 7 department, can adjust adjusting plate 663's the position of locating, in order to make the work piece by the centre gripping again, the completion that can be convenient carries out the work piece smoothly, satisfy the user demand, in addition, it is to further explain: the inner side corners of the adjusting plate 663 and the moving plate 661, which are opposite, are designed in an inclined manner, so that the stability of the workpiece placement is ensured, the rationality of the device equipment is improved, and the use functionality is strong; in consideration of the degree of automation of the device, for the adjustment of the position of the adjusting plate 663 relative to the moving plate 661, an electric push rod may be set on the moving plate 661 to drive the adjusting plate 663 to complete the adjustment of the position, and of course, for the setting up and installing of the device components, it is a mature technology in the prior art, and those skilled in the art can effectively know the position and will not be repeated.
In order to effectively complete output of chip workpieces after splitting, the connection mechanism 8 comprises a supporting plate frame 81, a supporting plate body 82 is arranged between the two supporting plate frames 81, roller shafts 83 are arranged on two sides of the supporting plate body 82, rotating rollers 84 which are arranged in a triangular shape are arranged between the supporting plate frames 81 below the supporting plate body 82, and belts 85 are wound on the roller shafts 83 and the rotating rollers 84, and the connection mechanism is specifically described as follows: the belt 85 is located above the supporting plate 82 and wound on the periphery of the roller shaft 83, then is wound on the rotating roller 84 below and above the supporting plate 82, then is wound below the rotating roller 84 at the lowest position, the belt 85 forms a closed loop, the effective carrying out of the conveying work is ensured, the rotating roller 84 at the lowest position is a driving roller and is provided with driving power by a motor, the effective carrying out of the conveying work is ensured, and further, one end of the belt 85 receives materials pushed by the pushing plate and then is conveyed to the next production process in a concentrated manner, so that the smooth carrying out of the production and processing work is ensured.
The present invention is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present invention without departing from the technical content of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims (7)

1. The utility model provides a full-automatic lobe of a leaf device is used in diode chip production, includes the box, the top of box is provided with the backup pad, the outside corner of backup pad is provided with the bracing piece, its characterized in that, along diode chip advancing direction the box top has set gradually feed mechanism, feeding mechanism, loading mechanism, lobe of a leaf mechanism and mechanism of plugging into, loading mechanism's below is provided with cutting mechanism, cutting mechanism is including being the riser that the concave form was designed, be provided with first slide bar in the riser, be provided with the movable block on the first slide bar, one side of movable block is provided with the concave plate that lateral shifting was adjusted, be provided with the second slide bar in the concave plate, be provided with the lifter on the second slide bar, one side of lifter is provided with laser cutting subassembly, lobe of leaf mechanism includes the fixed plate that is connected with the bracing piece, the below of fixed plate is provided with the lifter plate, the below of lifter plate is provided with lobe of leaf blade holder, the below periphery of bracing piece is provided with the riser, be provided with the vertical base down, be provided with the cylinder cap down in the vertical movement, the vertical cylinder cap down is provided with the vertical seat down, the vertical movement is provided with the cylinder cap down, vertical movement is provided with the vertical seat down, vertical seat is provided with the vertical seat down.
2. The full-automatic splitting device for diode chip production according to claim 1, wherein the clamping mechanism comprises a top moving cylinder, cross bars are arranged at corners of two sides of the concave seat, T-shaped blocks are arranged at the ends of the cross bars, limiting plates are arranged at the upper ends of the T-shaped blocks, through holes are formed in the T-shaped blocks, a rotating frame in a Z-shaped design is arranged at the lower end of the T-shaped blocks, a ball hinge is arranged at the output end of the top moving cylinder, the other end of the top moving cylinder is connected with the rotating frame, clamping plates are arranged above corners of the rotating frame, and a telescopic spring is arranged between the outer side of the concave seat and the rotating frame.
3. The full-automatic splitting device for diode chip production according to claim 2, wherein the feeding mechanism comprises a mounting plate, a vertical plate which is in an L-shaped design is arranged below the rear side of the mounting plate, a vertical sliding bar is arranged on the front side of the vertical plate, a vertical sliding block is arranged on the vertical sliding bar, a first linear driving component for driving the vertical sliding block to vertically lift and move is arranged on the rear side of the vertical sliding bar, a mounting seat is arranged on one side of the vertical sliding block, a transverse plate is arranged on the mounting seat, guide posts are arranged above two ends of the transverse plate, a linear bearing seat is arranged below the mounting plate and connected with the guide posts, a discharging plate is arranged at the upper end of the guide posts, a bin plate which is horizontally and longitudinally arranged respectively is further arranged above the mounting plate, and screw adjusting components capable of synchronously adjusting positions of the bin plates are arranged below the bin plates which are horizontally arranged.
4. The full-automatic splitting device for diode chip production according to claim 3, wherein the feeding mechanism comprises a transverse moving assembly connected with the supporting plate, a transverse sliding plate is arranged at the moving end of the transverse moving assembly, a feeding air cylinder is arranged below the transverse sliding plate, a sorting plate is arranged at the lower end of the feeding air cylinder, and a plurality of vacuum suction cups are uniformly distributed in the sorting plate.
5. The full-automatic splitting device for diode chip production according to claim 4, wherein the material loading mechanism comprises a supporting bottom plate, a transverse sliding bar is arranged above the supporting bottom plate, a transverse sliding block is arranged on the transverse sliding bar, a second linear driving assembly is arranged below the transverse sliding bar, a material loading plate is arranged on the transverse sliding block, and a material loading assembly is arranged on the material loading plate.
6. The full-automatic splitting device for diode chip production according to claim 5, wherein the material containing component comprises a moving plate in an L-shaped design, limiting sliding rods are arranged on two sides of the moving plate, and adjusting plates in a concave shape are arranged on the outer sides of the limiting sliding rods.
7. The full-automatic splitting device for diode chip production according to claim 6, wherein the connection mechanism comprises a supporting plate frame, a supporting plate body is arranged between the two supporting plate frames, roller shafts are arranged on two sides of the supporting plate body, rotating rollers arranged in a triangular shape are arranged between the supporting plate frames below the supporting plate body, and belts are wound on the roller shafts and the rotating rollers.
CN202410742793.8A 2024-06-11 2024-06-11 Fully automatic chip splitting device for diode chip production Active CN118559893B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119017551A (en) * 2024-10-17 2024-11-26 江苏富乐华半导体科技股份有限公司 A device for automatically breaking the edge of copper-clad ceramic substrate

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104766821A (en) * 2014-01-02 2015-07-08 大族激光科技产业集团股份有限公司 Cell splitting device and cell splitting method
CN111834263A (en) * 2020-08-14 2020-10-27 昆山康达斯机械设备有限公司 Automatic crystal grain splitting machine
CN112620924A (en) * 2020-12-18 2021-04-09 苏州辰正太阳能设备有限公司 Solar cell piece material loading scribing split and handling device
CN215712620U (en) * 2021-09-02 2022-02-01 蓝思智能机器人(长沙)有限公司 Splitting machine
CN114851411A (en) * 2022-06-02 2022-08-05 深圳市光道激光技术有限公司 Brittle plate splitting machine and splitting process
CN217459248U (en) * 2022-01-24 2022-09-20 大族激光科技产业集团股份有限公司 Laser cutting and lobe of a leaf equipment
CN219637097U (en) * 2023-05-05 2023-09-05 立濠光电科技(南通)有限公司 A fully automatic cutting lobes equipment and processing system
CN117936422A (en) * 2024-01-24 2024-04-26 广东明洲精工有限公司 Sorting module and lobe of a leaf production line

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104766821A (en) * 2014-01-02 2015-07-08 大族激光科技产业集团股份有限公司 Cell splitting device and cell splitting method
CN111834263A (en) * 2020-08-14 2020-10-27 昆山康达斯机械设备有限公司 Automatic crystal grain splitting machine
CN112620924A (en) * 2020-12-18 2021-04-09 苏州辰正太阳能设备有限公司 Solar cell piece material loading scribing split and handling device
CN215712620U (en) * 2021-09-02 2022-02-01 蓝思智能机器人(长沙)有限公司 Splitting machine
CN217459248U (en) * 2022-01-24 2022-09-20 大族激光科技产业集团股份有限公司 Laser cutting and lobe of a leaf equipment
CN114851411A (en) * 2022-06-02 2022-08-05 深圳市光道激光技术有限公司 Brittle plate splitting machine and splitting process
CN219637097U (en) * 2023-05-05 2023-09-05 立濠光电科技(南通)有限公司 A fully automatic cutting lobes equipment and processing system
CN117936422A (en) * 2024-01-24 2024-04-26 广东明洲精工有限公司 Sorting module and lobe of a leaf production line

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119017551A (en) * 2024-10-17 2024-11-26 江苏富乐华半导体科技股份有限公司 A device for automatically breaking the edge of copper-clad ceramic substrate
CN119017551B (en) * 2024-10-17 2025-02-11 江苏富乐华半导体科技股份有限公司 A device for automatically breaking the edge of copper-clad ceramic substrate

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