CN118553654A - Direct-injection circulating flushing device for stripping metal film on surface of wafer - Google Patents
Direct-injection circulating flushing device for stripping metal film on surface of wafer Download PDFInfo
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- CN118553654A CN118553654A CN202411021004.8A CN202411021004A CN118553654A CN 118553654 A CN118553654 A CN 118553654A CN 202411021004 A CN202411021004 A CN 202411021004A CN 118553654 A CN118553654 A CN 118553654A
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- 239000002184 metal Substances 0.000 title claims abstract description 57
- 238000011010 flushing procedure Methods 0.000 title claims abstract description 44
- 238000002347 injection Methods 0.000 title claims description 18
- 239000007924 injection Substances 0.000 title claims description 18
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005192 partition Methods 0.000 claims abstract description 9
- 239000007921 spray Substances 0.000 abstract description 11
- 238000005530 etching Methods 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 30
- 230000000694 effects Effects 0.000 description 12
- 239000000243 solution Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000003814 drug Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本发明公开了一种用于剥离晶圆表面金属薄膜的直喷循环冲洗装置，涉及冲洗技术领域，包括：机箱，所述机箱内壁转动安装有转门，所述机箱表面固定安装有控制器，所述机箱表面转动安装有观测窗，所述机箱内壁设置有过滤隔板；预处理装置，所述预处理装置设置在机箱内部，所述预处理装置包括冲洗喷头、水循环装置、驱动装置、空心箱、放置架、转杆、转板、梯形块、毛刷、滑动杆和密封板，通过滑动杆向靠近放置架的方向移动会接触到梯形块，梯形块会挤压滑动杆向上移动，所述冲洗喷头固定安装在机箱内壁，所述机箱内壁底部固定安装有水循环装置，使空心箱内部的蚀刻液滴落到金属薄膜的表面，从而使其变得松动，方便冲洗。
The invention discloses a direct-spray circulation flushing device for stripping a metal film on a wafer surface, relates to the technical field of flushing, and comprises: a chassis, wherein a revolving door is rotatably mounted on the inner wall of the chassis, a controller is fixedly mounted on the surface of the chassis, an observation window is rotatably mounted on the surface of the chassis, and a filter partition is arranged on the inner wall of the chassis; a pretreatment device, wherein the pretreatment device is arranged inside the chassis, the pretreatment device comprises a flushing nozzle, a water circulation device, a driving device, a hollow box, a placement rack, a rotating rod, a rotating plate, a trapezoidal block, a brush, a sliding rod and a sealing plate, wherein the sliding rod moves toward the placement rack to contact the trapezoidal block, and the trapezoidal block squeezes the sliding rod to move upward, the flushing nozzle is fixedly mounted on the inner wall of the chassis, and a water circulation device is fixedly mounted on the bottom of the inner wall of the chassis, so that the etching liquid inside the hollow box drips onto the surface of the metal film, thereby loosening it for easy flushing.
Description
技术领域Technical Field
本发明涉及冲洗技术领域，具体为一种用于剥离晶圆表面金属薄膜的直喷循环冲洗装置。The invention relates to the technical field of flushing, and in particular to a direct-injection circulating flushing device for stripping a metal film on a wafer surface.
背景技术Background Art
直喷循环冲洗装置是一种用于在半导体制造和相关工艺中处理晶圆表面的设备，主要用于剥离或清洗晶圆表面的金属薄膜。The direct injection circulation rinser is a device used to process the surface of wafers in semiconductor manufacturing and related processes, and is mainly used to strip or clean the metal film on the surface of the wafer.
专利公告号为CN220514864U的专利涉及一种用于剥离金属薄膜的直喷循环冲洗装置，包括箱体、直喷喷嘴、药液循环泵；所述箱体用于承载直喷喷嘴并且与直喷喷嘴相对的位置放置待剥离金属薄膜的晶圆；所述直喷喷嘴活动设置在箱体的一侧的安装孔内，用于放置在箱体相对位置的待剥离金属薄膜的晶圆进行直喷冲洗；所述药液循环泵设置在箱体的外部，并且输入侧与箱体下部的一侧连接，输出侧与直喷喷嘴连接，用于循环药液。该专利通过药液循环泵抽取位于箱体内底部的药液输送至直喷喷嘴，所述直喷喷嘴手动转动角度对待剥离金属薄膜的晶圆进行全方位的直喷冲洗，直至金属薄膜完全剥离，之后拆除剥离后的晶圆重新替换新的待剥离金属薄膜的晶圆，提高剥离金属薄膜效率。The patent with the patent announcement number CN220514864U relates to a direct spray circulation flushing device for stripping metal film, including a box, a direct spray nozzle, and a liquid medicine circulation pump; the box is used to carry the direct spray nozzle and place the wafer of the metal film to be stripped at a position opposite to the direct spray nozzle; the direct spray nozzle is movably arranged in a mounting hole on one side of the box, and is used for direct spray flushing of the wafer of the metal film to be stripped placed at a relative position of the box; the liquid medicine circulation pump is arranged outside the box, and the input side is connected to one side of the lower part of the box, and the output side is connected to the direct spray nozzle, and is used for circulating liquid medicine. The patent uses the liquid medicine circulation pump to extract the liquid medicine at the bottom of the box and transport it to the direct spray nozzle. The direct spray nozzle is manually rotated to perform all-round direct spray flushing on the wafer of the metal film to be stripped until the metal film is completely stripped, and then the stripped wafer is removed and replaced with a new wafer of the metal film to be stripped, thereby improving the efficiency of stripping the metal film.
上述专利中，通过药液循环泵抽取位于箱体内底部的药液输送至直喷喷嘴，所述直喷喷嘴手动转动角度对待剥离金属薄膜的晶圆进行全方位的直喷冲洗，直至金属薄膜完全剥离，之后拆除剥离后的晶圆重新替换新的待剥离金属薄膜的晶圆，提高剥离金属薄膜效率，但金属薄膜直接冲洗难以完全去除，容易导致少量金属薄膜残留在晶圆上，影响后续加工处理。In the above patent, the liquid medicine at the bottom of the box is extracted by a liquid medicine circulation pump and transported to the direct injection nozzle. The direct injection nozzle is manually rotated to perform all-round direct injection flushing on the wafer with the metal film to be peeled off until the metal film is completely peeled off. After that, the peeled wafer is removed and replaced with a new wafer with the metal film to be peeled off, thereby improving the efficiency of peeling the metal film. However, it is difficult to completely remove the metal film by direct flushing, which may easily cause a small amount of metal film to remain on the wafer, affecting subsequent processing.
发明内容Summary of the invention
针对现有技术的不足，本发明提供了一种用于剥离晶圆表面金属薄膜的直喷循环冲洗装置，解决了上述背景技术中提出的问题。In view of the deficiencies in the prior art, the present invention provides a direct injection circulating flushing device for stripping a metal film on a wafer surface, which solves the problems raised in the above-mentioned background technology.
为实现以上目的，本发明通过以下技术方案予以实现：一种用于剥离晶圆表面金属薄膜的直喷循环冲洗装置，包括：机箱，所述机箱内壁转动安装有转门，所述机箱表面固定安装有控制器，所述机箱表面转动安装有观测窗，所述机箱内壁设置有过滤隔板；预处理装置，所述预处理装置设置在机箱内部，所述预处理装置包括冲洗喷头、水循环装置、驱动装置、空心箱、放置架、转杆、转板、梯形块、毛刷、滑动杆和密封板，通过滑动杆向靠近放置架的方向移动会接触到梯形块，梯形块会挤压滑动杆向上移动，滑动杆向上移动会带动密封板向上移动，密封板向上移动会使出液口打开，所述冲洗喷头固定安装在机箱内壁，所述机箱内壁底部固定安装有水循环装置，所述冲洗喷头与水循环装置之间通过水管连通，所述驱动装置固定安装在过滤隔板顶部，所述空心箱固定安装在驱动装置输出端，所述放置架固定安装在过滤隔板顶部，所述转杆转动安装在过滤隔板顶部，所述转板固定安装在转杆顶部，所述毛刷固定安装在空心箱底部，所述滑动杆滑动贯穿空心箱底部，所述密封板固定安装在滑动杆顶部，所述空心箱底部开设有出液孔，空心箱向靠近放置架的方向移动会带动毛刷向靠近放置架的方向移动。To achieve the above objectives, the present invention is implemented through the following technical solutions: a direct injection circulation flushing device for stripping metal film on the surface of wafer, comprising: a chassis, a rotating door is rotatably installed on the inner wall of the chassis, a controller is fixedly installed on the surface of the chassis, an observation window is rotatably installed on the surface of the chassis, and a filter baffle is provided on the inner wall of the chassis; a pretreatment device, the pretreatment device is arranged inside the chassis, the pretreatment device includes a flushing nozzle, a water circulation device, a driving device, a hollow box, a placement rack, a rotating rod, a rotating plate, a trapezoidal block, a brush, a sliding rod and a sealing plate, when the sliding rod moves toward the placement rack, it will contact the trapezoidal block, the trapezoidal block will squeeze the sliding rod to move upward, the sliding rod moving upward will drive the sealing plate to move upward, and the sealing plate will be sealed. The upward movement of the sealing plate will open the liquid outlet, and the flushing nozzle is fixedly mounted on the inner wall of the chassis, and a water circulation device is fixedly mounted on the bottom of the inner wall of the chassis. The flushing nozzle and the water circulation device are connected through a water pipe, and the driving device is fixedly mounted on the top of the filter baffle, and the hollow box is fixedly mounted on the output end of the driving device, and the placement rack is fixedly mounted on the top of the filter baffle, and the rotating rod is rotatably mounted on the top of the filter baffle, and the rotating plate is fixedly mounted on the top of the rotating rod, and the brush is fixedly mounted on the bottom of the hollow box, and the sliding rod slides through the bottom of the hollow box, and the sealing plate is fixedly mounted on the top of the sliding rod. A liquid outlet hole is opened at the bottom of the hollow box, and the movement of the hollow box toward the placement rack will drive the brush to move toward the placement rack.
根据上述技术方案，所述密封板设置在出液孔上方，所述转杆与过滤隔板之间设置有一号扭簧，通过一号扭簧带动转杆复位，所述梯形块设置在滑动杆下方，所述转板顶部设置有防滑橡胶，防止被夹持装置夹持时无法转动。According to the above technical solution, the sealing plate is arranged above the liquid outlet, a No. 1 torsion spring is arranged between the rotating rod and the filter baffle, and the No. 1 torsion spring drives the rotating rod to reset, the trapezoidal block is arranged under the sliding rod, and anti-slip rubber is arranged on the top of the rotating plate to prevent it from being unable to rotate when clamped by the clamping device.
根据上述技术方案，还包括夹持装置和旋转装置，所述夹持装置包括L形杆、转轮、滑板、弹性伸缩板、弧形板和滚轮，通过空心箱向靠近放置架的方向移动带动L形杆向靠近放置架的方向移动，L形杆向靠近放置架的方向移动会带动转轮向靠近放置架的方向移动，所述L形杆固定安装在空心箱表面，所述转轮转动安装在L形杆底部，所述滑板滑动安装在放置架顶部，所述弹性伸缩板固定安装在滑板表面，所述弧形板固定安装在弹性伸缩板自由端，所述滚轮转动安装在弧形板内壁。According to the above technical solution, it also includes a clamping device and a rotating device, wherein the clamping device includes an L-shaped rod, a rotating wheel, a slide plate, an elastic telescopic plate, an arc plate and a roller, and the hollow box moves toward the placement rack to drive the L-shaped rod to move toward the placement rack, and the L-shaped rod moving toward the placement rack will drive the rotating wheel to move toward the placement rack, the L-shaped rod is fixedly mounted on the surface of the hollow box, the rotating wheel is rotatably mounted on the bottom of the L-shaped rod, the slide plate is slidably mounted on the top of the placement rack, the elastic telescopic plate is fixedly mounted on the surface of the slide plate, the arc plate is fixedly mounted on the free end of the elastic telescopic plate, and the roller is rotatably mounted on the inner wall of the arc plate.
根据上述技术方案，所述L形杆表面固定安装有固定板，所述滑板顶部固定安装有凸块，L形杆向靠近放置架的方向移动会带动固定板向靠近放置架的方向移动，固定板向靠近放置架的方向移动会接触到凸块。According to the above technical solution, a fixing plate is fixedly installed on the surface of the L-shaped rod, and a protrusion is fixedly installed on the top of the slide plate. When the L-shaped rod moves toward the placement rack, the fixing plate will move toward the placement rack, and when the fixing plate moves toward the placement rack, it will contact the protrusion.
根据上述技术方案，所述滑板靠近驱动装置的一端设置有斜面，所述固定板设置在凸块上方，所述滑板与放置架之间设置有一号弹簧，通过一号弹簧带动滑板复位。According to the above technical solution, a slope is arranged at one end of the slide plate close to the driving device, the fixing plate is arranged above the protrusion, and a No. 1 spring is arranged between the slide plate and the placement frame, and the slide plate is driven to reset by the No. 1 spring.
根据上述技术方案，所述旋转装置包括连接板和L形板，通过滑板向靠近转板的方向移动带动连接板向靠近转板的方向移动，连接板向靠近转板的方向移动会带动L形板向靠近转板的方向移动，所述连接板固定安装在滑板底部，所述L形板固定安装在连接板底部，所述L形板表面开设有齿槽，所述转杆表面设置有齿块，所述齿槽和齿块表面啮合。According to the above technical solution, the rotating device includes a connecting plate and an L-shaped plate. The connecting plate is driven to move toward the rotating plate by the movement of the sliding plate toward the rotating plate. The movement of the connecting plate toward the rotating plate will drive the L-shaped plate to move toward the rotating plate. The connecting plate is fixedly installed at the bottom of the sliding plate. The L-shaped plate has a tooth groove on its surface. The rotating rod has a tooth block on its surface. The tooth groove and the tooth block surface are meshed.
根据上述技术方案，所述L形板底部固定安装有短板，所述短板底部转动安装有转动板，所述短板表面固定安装有限位块，所述过滤隔板内壁转动安装有转轴，所述转轴顶部固定安装有L形长板，短板向靠近转杆的方向移动会带动转动板向靠近转杆的方向移动，转动板向靠近转杆的方向移动会接触到L形长板，L形长板向下转动会对过滤隔板进行疏通。According to the above technical solution, a short plate is fixedly installed at the bottom of the L-shaped plate, a rotating plate is rotatably installed at the bottom of the short plate, a limiting block is fixedly installed on the surface of the short plate, a rotating shaft is rotatably installed on the inner wall of the filter baffle, and an L-shaped long plate is fixedly installed on the top of the rotating shaft. The movement of the short plate toward the direction close to the rotating rod will drive the rotating plate to move toward the direction close to the rotating rod. The movement of the rotating plate toward the direction close to the rotating rod will contact the L-shaped long plate. The downward rotation of the L-shaped long plate will dredge the filter baffle.
根据上述技术方案，所述短板与转动板之间设置有二号扭簧，通过二号扭簧带动转动板复位，所述限位块与转动板表面接触，所述过滤隔板与转轴之间设置有三号扭簧，通过三号扭簧带动转轴复位。According to the above technical solution, a No. 2 torsion spring is arranged between the short plate and the rotating plate, and the rotating plate is driven to reset by the No. 2 torsion spring. The limit block is in contact with the surface of the rotating plate. A No. 3 torsion spring is arranged between the filter baffle and the rotating shaft, and the rotating shaft is driven to reset by the No. 3 torsion spring.
本发明提供了一种用于剥离晶圆表面金属薄膜的直喷循环冲洗装置。具备以下有益效果：The present invention provides a direct injection circulation flushing device for stripping a metal film on a wafer surface. It has the following beneficial effects:
（1）该发明，通过冲洗喷头对晶圆表面的金属薄膜进行冲洗，将金属薄膜清除干净，防止影响后续覆膜，同时空心箱内部的蚀刻液滴落到金属薄膜的表面，从而使其变得松动，方便冲洗，同时空心箱向靠近放置架的方向移动会带动毛刷向靠近放置架的方向移动，毛刷会将滴在金属薄膜上的蚀刻液抹平，使蚀刻液分布的更加均匀，提高剥离金属薄膜的效果。(1) The invention uses a flushing nozzle to flush the metal film on the surface of the wafer to clean the metal film and prevent it from affecting the subsequent coating. At the same time, the etching liquid inside the hollow box drips onto the surface of the metal film, thereby loosening it and facilitating flushing. At the same time, the movement of the hollow box toward the placement rack will drive the brush to move toward the placement rack. The brush will smooth the etching liquid dripped on the metal film, making the etching liquid more evenly distributed and improving the effect of stripping the metal film.
（2）该发明，通过弹性伸缩板向靠近转板的方向移动会带动弧形板向靠近转板的方向移动，弧形板向靠近转板的方向移动会带动滚轮向靠近转板的方向移动，通过滚轮对晶圆进行夹持，防止冲洗或毛刷抹平时，推动晶圆移动，导致晶圆远离冲洗喷头的冲洗范围和剥离金属薄膜效率降低，同时通过固定板与凸块接触产生细微振动，可以一定程度上削弱金属薄膜与晶圆的结合，提高剥离金属薄膜的效果。(2) In the present invention, the movement of the elastic retractable plate toward the rotating plate drives the arc plate toward the rotating plate, and the movement of the arc plate toward the rotating plate drives the roller toward the rotating plate. The wafer is clamped by the roller to prevent the wafer from being pushed to move when being rinsed or smoothed with a brush, causing the wafer to move away from the rinsing range of the rinsing nozzle and reducing the efficiency of stripping the metal film. At the same time, the contact between the fixed plate and the bump generates slight vibration, which can weaken the bonding between the metal film and the wafer to a certain extent, thereby improving the effect of stripping the metal film.
（3）该发明，通过L形板向靠近转板的方向移动会带动转杆转动，转杆转动会带动转板转动，通过转板转动调整被夹持的位置，防止夹持的部分有部分金属薄膜沾附，导致冲洗喷头无法冲洗到，影响剥离效果，同时L形长板向下转动会对过滤隔板进行疏通，防止金属薄膜卡在过滤隔板之间，影响排水效果。(3) In the present invention, the L-shaped plate moves toward the rotating plate to drive the rotating rod to rotate, and the rotating rod drives the rotating plate to rotate. The clamped position is adjusted by rotating the rotating plate to prevent the metal film from being attached to the clamped part, which would cause the flushing nozzle to fail to flush and affect the stripping effect. At the same time, the downward rotation of the L-shaped long plate would clear the filter partitions to prevent the metal film from being stuck between the filter partitions and affecting the drainage effect.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本发明整体结构示意图；Fig. 1 is a schematic diagram of the overall structure of the present invention;
图2为本发明整体剖面结构示意图；FIG2 is a schematic diagram of the overall cross-sectional structure of the present invention;
图3为本发明预处理装置结构示意图；FIG3 is a schematic diagram of the structure of the pretreatment device of the present invention;
图4为本发明空心框剖面结构示意图；FIG4 is a schematic diagram of a cross-sectional structure of a hollow frame according to the present invention;
图5为本发明夹持装置结构示意图；FIG5 is a schematic diagram of the structure of the clamping device of the present invention;
图6为本发明机箱剖面结构示意图；FIG6 is a schematic diagram of a cross-sectional structure of a chassis of the present invention;
图7为本发明图6中A部分结构放大示意图。FIG. 7 is an enlarged schematic diagram of the structure of part A in FIG. 6 of the present invention.
图中：1、机箱；2、转门；3、控制器；4、观测窗；5、冲洗喷头；6、水循环装置；7、驱动装置；8、空心箱；9、放置架；10、转杆；11、转板；12、梯形块；13、毛刷；14、滑动杆；15、密封板；161、L形杆；162、转轮；163、滑板；164、弹性伸缩板；165、弧形板；166、滚轮；167、固定板；168、凸块；171、连接板；172、L形板；173、短板；174、转动板；175、限位块；176、转轴；177、L形长板。In the figure: 1, chassis; 2, revolving door; 3, controller; 4, observation window; 5, flushing nozzle; 6, water circulation device; 7, driving device; 8, hollow box; 9, placement rack; 10, rotating rod; 11, rotating plate; 12, trapezoidal block; 13, brush; 14, sliding rod; 15, sealing plate; 161, L-shaped rod; 162, rotating wheel; 163, sliding plate; 164, elastic telescopic plate; 165, arc plate; 166, roller; 167, fixed plate; 168, protrusion; 171, connecting plate; 172, L-shaped plate; 173, short plate; 174, rotating plate; 175, limit block; 176, rotating shaft; 177, L-shaped long plate.
具体实施方式DETAILED DESCRIPTION
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
请参阅图1-图7，本发明的一个实施例为：一种用于剥离晶圆表面金属薄膜的直喷循环冲洗装置，包括：机箱1，机箱1内壁转动安装有转门2，机箱1表面固定安装有控制器3，机箱1表面转动安装有观测窗4，机箱1内壁设置有过滤隔板；预处理装置，预处理装置设置在机箱1内部，预处理装置包括冲洗喷头5、水循环装置6、驱动装置7、空心箱8、放置架9、转杆10、转板11、梯形块12、毛刷13、滑动杆14和密封板15，使空心箱8内部的蚀刻液滴落到金属薄膜的表面，从而使其变得松动，方便冲洗，冲洗喷头5固定安装在机箱1内壁，水循环装置6固定安装在机箱1内壁底部，冲洗喷头5与水循环装置6之间通过水管连通，驱动装置7固定安装在过滤隔板顶部，空心箱8固定安装在驱动装置7输出端，放置架9固定安装在过滤隔板顶部，转杆10转动安装在过滤隔板顶部，转板11固定安装在转杆10顶部，毛刷13固定安装在空心箱8底部，滑动杆14滑动贯穿空心箱8底部，密封板15固定安装在滑动杆14顶部，空心箱8底部开设有出液孔，通过毛刷13会将滴在金属薄膜上的蚀刻液抹平，使蚀刻液分布的更加均匀，提高剥离金属薄膜的效果。Please refer to Figures 1 to 7. One embodiment of the present invention is: a direct injection circulation flushing device for stripping a metal film on the surface of a wafer, comprising: a chassis 1, a rotating door 2 is rotatably installed on the inner wall of the chassis 1, a controller 3 is fixedly installed on the surface of the chassis 1, an observation window 4 is rotatably installed on the surface of the chassis 1, and a filter partition is provided on the inner wall of the chassis 1; a pretreatment device, the pretreatment device is arranged inside the chassis 1, the pretreatment device includes a flushing nozzle 5, a water circulation device 6, a driving device 7, a hollow box 8, a placement rack 9, a rotating rod 10, a rotating plate 11, a trapezoidal block 12, a brush 13, a sliding rod 14 and a sealing plate 15, so that the etching liquid inside the hollow box 8 drips onto the surface of the metal film, thereby loosening it for easy flushing, and the flushing nozzle 5 is fixed It is installed on the inner wall of the chassis 1, the water circulation device 6 is fixedly installed on the bottom of the inner wall of the chassis 1, the flushing nozzle 5 is connected to the water circulation device 6 through a water pipe, the driving device 7 is fixedly installed on the top of the filter partition, the hollow box 8 is fixedly installed on the output end of the driving device 7, the placement rack 9 is fixedly installed on the top of the filter partition, the rotating rod 10 is rotatably installed on the top of the filter partition, the rotating plate 11 is fixedly installed on the top of the rotating rod 10, the brush 13 is fixedly installed on the bottom of the hollow box 8, the sliding rod 14 slides through the bottom of the hollow box 8, the sealing plate 15 is fixedly installed on the top of the sliding rod 14, and a liquid outlet is opened at the bottom of the hollow box 8. The etching liquid dripping on the metal film will be smoothed by the brush 13, so that the etching liquid is distributed more evenly, thereby improving the effect of stripping the metal film.
密封板15设置在出液孔上方，转杆10与过滤隔板之间设置有一号扭簧，通过一号扭簧带动转杆10复位，梯形块12设置在滑动杆14下方，转板11顶部设置有防滑橡胶，防止被夹持装置夹持时无法转动。The sealing plate 15 is arranged above the liquid outlet, and a No. 1 torsion spring is arranged between the rotating rod 10 and the filter partition, and the rotating rod 10 is driven to reset by the No. 1 torsion spring. The trapezoidal block 12 is arranged below the sliding rod 14, and an anti-slip rubber is arranged on the top of the rotating plate 11 to prevent it from being unable to rotate when clamped by the clamping device.
请参阅图1-图4，本实施例工作时，通过冲洗喷头5对晶圆表面的金属薄膜进行冲洗，将金属薄膜清除干净，防止影响后续覆膜，同时在冲洗之前，启动驱动装置7，驱动装置7会带动空心箱8向靠近放置架9的方向移动，空心箱8向靠近放置架9的方向移动会带动滑动杆14向靠近放置架9的方向移动，滑动杆14向靠近放置架9的方向移动会接触到梯形块12，梯形块12会挤压滑动杆14向上移动，滑动杆14向上移动会带动密封板15向上移动，密封板15向上移动会使出液口打开，使空心箱8内部的蚀刻液滴落到金属薄膜的表面，从而使其变得松动，方便冲洗，同时空心箱8向靠近放置架9的方向移动会带动毛刷13向靠近放置架9的方向移动，毛刷13会将滴在金属薄膜上的蚀刻液抹平，使蚀刻液分布的更加均匀，提高剥离金属薄膜的效果。Please refer to Figures 1 to 4. When this embodiment is working, the metal film on the surface of the wafer is rinsed by the rinse nozzle 5 to clean the metal film to prevent it from affecting the subsequent coating. At the same time, before rinsing, the driving device 7 is started. The driving device 7 will drive the hollow box 8 to move in the direction close to the placement rack 9. The movement of the hollow box 8 in the direction close to the placement rack 9 will drive the sliding rod 14 to move in the direction close to the placement rack 9. The movement of the sliding rod 14 in the direction close to the placement rack 9 will contact the trapezoidal block 12. The trapezoidal block 12 will squeeze the sliding rod 14 to move upward. The upward movement of the sliding rod 14 will drive the sealing plate 15 to move upward. The upward movement of the sealing plate 15 will open the liquid outlet, so that the etching liquid inside the hollow box 8 will drip onto the surface of the metal film, thereby loosening it and facilitating rinsing. At the same time, the movement of the hollow box 8 in the direction close to the placement rack 9 will drive the brush 13 to move in the direction close to the placement rack 9. The brush 13 will smooth the etching liquid dripped on the metal film, so that the etching liquid is more evenly distributed, thereby improving the effect of stripping the metal film.
请参阅图1-图7，在上述实施例的基础上，本发明的另一实施例中，还包括夹持装置和旋转装置，夹持装置包括L形杆161、转轮162、滑板163、弹性伸缩板164、弧形板165和滚轮166，L形杆161固定安装在空心箱8表面，转轮162转动安装在L形杆161底部，滑板163滑动安装在放置架9顶部，弹性伸缩板164固定安装在滑板163表面，弧形板165固定安装在弹性伸缩板164自由端，滚轮166转动安装在弧形板165内壁，通过滚轮166对晶圆进行夹持，防止冲洗或毛刷13抹平时，推动晶圆移动，导致晶圆远离冲洗喷头5的冲洗范围。Please refer to Figures 1 to 7. Based on the above embodiments, another embodiment of the present invention further includes a clamping device and a rotating device. The clamping device includes an L-shaped rod 161, a rotating wheel 162, a slide 163, an elastic telescopic plate 164, an arc plate 165 and a roller 166. The L-shaped rod 161 is fixedly mounted on the surface of the hollow box 8, the rotating wheel 162 is rotatably mounted on the bottom of the L-shaped rod 161, the slide 163 is slidably mounted on the top of the placement rack 9, the elastic telescopic plate 164 is fixedly mounted on the surface of the slide 163, the arc plate 165 is fixedly mounted on the free end of the elastic telescopic plate 164, and the roller 166 is rotatably mounted on the inner wall of the arc plate 165. The wafer is clamped by the roller 166 to prevent the wafer from being pushed to move during flushing or smoothing with the brush 13, causing the wafer to be away from the flushing range of the flushing nozzle 5.
L形杆161表面固定安装有固定板167，滑板163顶部固定安装有凸块168，通过固定板167与凸块168接触产生细微振动，可以一定程度上削弱金属薄膜与晶圆的结合，提高剥离金属薄膜的效果。A fixing plate 167 is fixedly installed on the surface of the L-shaped rod 161, and a bump 168 is fixedly installed on the top of the slide plate 163. The contact between the fixing plate 167 and the bump 168 generates slight vibration, which can weaken the bonding between the metal film and the wafer to a certain extent and improve the effect of peeling off the metal film.
滑板163靠近驱动装置7的一端设置有斜面，固定板167设置在凸块168上方，滑板163与放置架9之间设置有一号弹簧，通过一号弹簧带动滑板163复位。An inclined surface is arranged at one end of the slide plate 163 close to the driving device 7, a fixing plate 167 is arranged above the protrusion 168, and a No. 1 spring is arranged between the slide plate 163 and the placement frame 9, and the slide plate 163 is driven to reset by the No. 1 spring.
请参阅图3-图7，旋转装置包括连接板171和L形板172，连接板171固定安装在滑板163底部，L形板172固定安装在连接板171底部，L形板172表面开设有齿槽，转杆10表面设置有齿块，齿槽和齿块表面啮合，通过转板11转动调整被夹持的位置，防止夹持的部分有部分金属薄膜沾附，导致冲洗喷头5无法冲洗到，影响剥离效果。Please refer to Figures 3 to 7. The rotating device includes a connecting plate 171 and an L-shaped plate 172. The connecting plate 171 is fixedly installed at the bottom of the slide plate 163, and the L-shaped plate 172 is fixedly installed at the bottom of the connecting plate 171. A tooth groove is provided on the surface of the L-shaped plate 172, and a tooth block is provided on the surface of the rotating rod 10. The tooth groove and the tooth block surface are meshed. The clamped position is adjusted by rotating the rotating plate 11 to prevent part of the metal film from being attached to the clamped part, which makes the flushing nozzle 5 unable to flush and affects the stripping effect.
L形板172底部固定安装有短板173，短板173底部转动安装有转动板174，短板173表面固定安装有限位块175，过滤隔板内壁转动安装有转轴176，转轴176顶部固定安装有L形长板177，防止金属薄膜卡在过滤隔板之间，影响排水效果，同时短板173带动转动板174复位时，转动板174接触到L形长板177时会向上转动，不会形成阻碍，提高设备使用寿命。A short plate 173 is fixedly installed at the bottom of the L-shaped plate 172, and a rotating plate 174 is rotatably installed at the bottom of the short plate 173. A limiting block 175 is fixedly installed on the surface of the short plate 173. A rotating shaft 176 is rotatably installed on the inner wall of the filter baffle, and an L-shaped long plate 177 is fixedly installed on the top of the rotating shaft 176 to prevent the metal film from being stuck between the filter baffles and affecting the drainage effect. At the same time, when the short plate 173 drives the rotating plate 174 to reset, the rotating plate 174 will rotate upward when it contacts the L-shaped long plate 177, and will not form an obstacle, thereby increasing the service life of the equipment.
短板173与转动板174之间设置有二号扭簧，通过二号扭簧带动转动板174复位，限位块175与转动板174表面接触，过滤隔板与转轴176之间设置有三号扭簧，通过三号扭簧带动转轴176复位。A No. 2 torsion spring is arranged between the short plate 173 and the rotating plate 174, and the rotating plate 174 is reset by the No. 2 torsion spring. The limit block 175 is in contact with the surface of the rotating plate 174. A No. 3 torsion spring is arranged between the filter baffle and the rotating shaft 176, and the rotating shaft 176 is reset by the No. 3 torsion spring.
请参阅图5-图7，本实施例工作时，通过空心箱8向靠近放置架9的方向移动带动L形杆161向靠近放置架9的方向移动，L形杆161向靠近放置架9的方向移动会带动转轮162向靠近放置架9的方向移动，转轮162向靠近放置架9的方向移动会接触到滑板163的斜面，转轮162会推动滑板163向靠近转板11的方向移动，滑板163向靠近转板11的方向移动会带动弹性伸缩板164向靠近转板11的方向移动，弹性伸缩板164向靠近转板11的方向移动会带动弧形板165向靠近转板11的方向移动，弧形板165向靠近转板11的方向移动会带动滚轮166向靠近转板11的方向移动，通过滚轮166对晶圆进行夹持，防止冲洗或毛刷13抹平时，推动晶圆移动，导致晶圆远离冲洗喷头5的冲洗范围，导致剥离金属薄膜效率降低，同时当L形杆161向靠近放置架9的方向移动会带动固定板167向靠近放置架9的方向移动，固定板167向靠近放置架9的方向移动会接触到凸块168，通过固定板167与凸块168接触产生细微振动，可以一定程度上削弱金属薄膜与晶圆的结合，提高剥离金属薄膜的效果。Please refer to Figures 5 to 7. When the present embodiment is working, the hollow box 8 moves toward the direction close to the placement rack 9, driving the L-shaped rod 161 to move toward the direction close to the placement rack 9. The L-shaped rod 161 moves toward the direction close to the placement rack 9, which drives the rotating wheel 162 to move toward the direction close to the placement rack 9. The rotating wheel 162 moves toward the direction close to the placement rack 9 and contacts the inclined surface of the slide plate 163. The rotating wheel 162 pushes the slide plate 163 to move toward the direction close to the rotating plate 11. The slide plate 163 moves toward the direction close to the rotating plate 11, which drives the elastic retractable plate 164 to move toward the direction close to the rotating plate 11. The elastic retractable plate 164 moves toward the direction close to the rotating plate 11, which drives the arc plate 165 to move toward the direction close to the rotating plate 11. The movement of the arc plate 165 toward the rotating plate 11 will drive the roller 166 to move toward the rotating plate 11, and the wafer will be clamped by the roller 166 to prevent the wafer from being pushed to move when being rinsed or smoothed by the brush 13, causing the wafer to be away from the rinse range of the rinse nozzle 5, resulting in reduced efficiency in stripping the metal film. At the same time, when the L-shaped rod 161 moves toward the placement rack 9, it will drive the fixed plate 167 to move toward the placement rack 9. The movement of the fixed plate 167 toward the placement rack 9 will contact the protrusion 168, and the contact between the fixed plate 167 and the protrusion 168 will generate slight vibration, which can weaken the combination of the metal film and the wafer to a certain extent, thereby improving the effect of stripping the metal film.
请参阅图6-图7，通过滑板163向靠近转板11的方向移动带动连接板171向靠近转板11的方向移动，连接板171向靠近转板11的方向移动会带动L形板172向靠近转板11的方向移动，L形板172向靠近转板11的方向移动会带动转杆10转动，转杆10转动会带动转板11转动，通过转板11转动调整被夹持的位置，防止夹持的部分有部分金属薄膜沾附，导致冲洗喷头5无法冲洗到，影响剥离效果，同时L形板172向靠近转杆10的方向移动会带动短板173向靠近转杆10的方向移动，短板173向靠近转杆10的方向移动会带动转动板174向靠近转杆10的方向移动，转动板174向靠近转杆10的方向移动会接触到L形长板177，转动板174受到限位块175的限位，在接触到L形长板177时会推动L形长板177向下转动，L形长板177向下转动会对过滤隔板进行疏通，防止金属薄膜卡在过滤隔板之间，影响排水效果，同时短板173带动转动板174复位时，转动板174接触到L形长板177时会向上转动，不会形成阻碍，提高设备使用寿命。Please refer to Figures 6 and 7. The sliding plate 163 moves toward the direction close to the rotating plate 11 to drive the connecting plate 171 to move toward the direction close to the rotating plate 11. The connecting plate 171 moves toward the direction close to the rotating plate 11 to drive the L-shaped plate 172 to move toward the direction close to the rotating plate 11. The L-shaped plate 172 moves toward the direction close to the rotating plate 11 to drive the rotating rod 10 to rotate. The rotation of the rotating rod 10 drives the rotating plate 11 to rotate. The clamped position is adjusted by rotating the rotating plate 11 to prevent part of the metal film from being attached to the clamped part, which makes the flushing nozzle 5 unable to flush and affects the stripping effect. At the same time, the L-shaped plate 172 moves toward the direction close to the rotating rod 10 to drive the short plate 173 to move toward the rotating rod 10 When the rotating plate 174 moves in the direction close to the rotating rod 10, the short plate 173 moves in the direction close to the rotating rod 10, and the rotating plate 174 moves in the direction close to the rotating rod 10 and contacts the L-shaped long plate 177. The rotating plate 174 is limited by the limit block 175, and when it contacts the L-shaped long plate 177, it pushes the L-shaped long plate 177 to rotate downward. The downward rotation of the L-shaped long plate 177 can dredge the filter baffles to prevent the metal film from being stuck between the filter baffles and affecting the drainage effect. At the same time, when the short plate 173 drives the rotating plate 174 to reset, the rotating plate 174 will rotate upward when it contacts the L-shaped long plate 177, without forming an obstacle, thereby improving the service life of the equipment.
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变形，本发明的范围由所附权利要求及其等同物限定。Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
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| CN117276132A (en) * | 2023-10-11 | 2023-12-22 | 深圳市恒诺半导体科技有限公司 | Omnibearing cleaning machine for semiconductor wafer |
| CN118039548A (en) * | 2023-12-15 | 2024-05-14 | 江苏中科晶元信息材料有限公司 | Automatic cleaning equipment for gallium arsenide wafer processing |
| CN118263166A (en) * | 2024-04-10 | 2024-06-28 | 上海微松工业自动化有限公司 | An intelligent and adaptive wafer debonding and stripping machine |
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