CN118508723A - TPAK double-tube double-row integrated power module - Google Patents
TPAK double-tube double-row integrated power module Download PDFInfo
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- CN118508723A CN118508723A CN202410953882.7A CN202410953882A CN118508723A CN 118508723 A CN118508723 A CN 118508723A CN 202410953882 A CN202410953882 A CN 202410953882A CN 118508723 A CN118508723 A CN 118508723A
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- tpak
- copper bar
- module
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 64
- 239000010949 copper Substances 0.000 claims abstract description 64
- 230000017525 heat dissipation Effects 0.000 claims abstract description 45
- 239000003990 capacitor Substances 0.000 claims abstract description 28
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 34
- 239000012212 insulator Substances 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000000306 component Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/639—Additional means for holding or locking coupling parts together, after engagement, e.g. separate keylock, retainer strap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Inverter Devices (AREA)
Abstract
A TPAK double-tube double-row integrated power module comprises a heat dissipation assembly, a chip assembly, a detection assembly and a circuit board assembly. The chip assembly comprises a capacitor, a laminated busbar, a single-tube module, a connecting copper bar, a negative copper bar, a first insulating piece, a second insulating piece and an output terminal. The connecting copper bars are strip-shaped and are provided with copper bars with Pin needles. The Pin extends out of the circuit board assembly, and the Pin is used for directly detecting input voltage so as to obtain a key parameter Vce of the system. The first insulating member and the second insulating member serve as an insulator and support to avoid affecting the current. The position of the infrared temperature measuring port corresponds to the position of the single-tube module, and the single-tube module can be directly measured through an external infrared temperature measuring device, so that the module temperature testing system has certain expansibility.
Description
Technical Field
The invention relates to the technical field of power modules, in particular to a TPAK double-tube double-row integrated power module.
Background
The power module is a key component integrated with the power electronic technology, mainly comprises a control circuit and a power driving circuit, and is commonly used in the fields of motor control, lighting control, battery management systems and the like. The core function of the power module is to control an electric drive system of the power equipment so as to realize efficient operation. The electric drive system is a heart of an electric power system, and the integration and the light weight of the electric drive system are always important directions of development of the electric drive system whether the electric drive system is used in the automobile industry or the photovoltaic industry. For a complete electric drive system, the inverter system occupies an important position in terms of both volume and complexity. Although the inverter system has been advanced toward higher integration, this inevitably brings about a problem of systematicness such as a bottleneck in heat dissipation and an increase in noise.
The power module in the prior art is as disclosed in patent number CN202122230375.5, and comprises a substrate and a bonding assembly. The bonding assembly includes a plurality of chips, bonding members, and terminals. The chips are arranged on the substrate and electrically connected with the substrate. The bonding parts are respectively connected with the chips. The terminal is electrically connected with the bonding member. In this embodiment, the power module includes a substrate and a bonding assembly. The bonding assembly is arranged on the substrate, and the substrate can be a substrate with better heat dissipation performance and conductivity. When the power module works, current flows into the power module from the terminal, flows onto the chips through the bonding part and then flows onto the substrate. However, the power module in the prior art generally has a plurality of layers of copper bars, and no insulation exists between metals, so that the overall noise of the system is high. While lacking a direct and efficient temperature monitoring and highly integrated current sensing system.
Disclosure of Invention
In view of the above, the present invention provides a TPAK dual-tube dual-row integrated power module to solve the above technical problems.
A TPAK double-tube double-row integrated power module comprises a heat dissipation assembly, a chip assembly arranged on the heat dissipation assembly, a detection assembly arranged on the chip assembly and a circuit board assembly arranged on the chip assembly. The chip assembly comprises a plurality of capacitors, a laminated busbar arranged on the capacitors, a plurality of single-tube modules arranged on the heat dissipation assembly, a copper bar connected with the single-tube modules and the laminated busbar, a negative copper bar connected with the single-tube modules and the laminated busbar, a first insulating piece arranged on the single-tube modules, a second insulating piece arranged on the negative copper bar, and an output terminal arranged on the second insulating piece. The single tube module both ends have respectively and stretch out input and output, the female row of stromatolite is provided with a plurality of first ports and a plurality of second ports. The connecting copper bars are strip-shaped and are provided with copper bars with Pin needles. The connecting copper bar is connected with the first port and the input end of the single-tube module, and the Pin needle extends out of the circuit board assembly. And one end of the negative copper bar is connected with the output end of the single tube module, and the other end of the negative copper bar is connected with the second port. The first insulating piece is located a plurality of single tube module junction with between the negative pole copper bar, the second insulating piece is located output terminal with between the negative pole copper bar. The detection assembly comprises a temperature sensor arranged on the single tube module, a plurality of infrared temperature measuring ports arranged on the negative copper bar, and a plurality of current sensors arranged on the output terminal. The position of the infrared temperature measuring port corresponds to the position of the single tube module, and the current sensor is provided with a pin connected with the circuit board assembly.
Further, the heat dissipation assembly comprises a base, a capacitor accommodating groove arranged on the base, a runner arranged on the base, a spoiler arranged on the runner, at least two inlets and outlets arranged on the base, a heat dissipation substrate arranged on the base, and a plurality of heat dissipation columns arranged on the heat dissipation substrate.
Further, the capacitor accommodating groove and the flow channel are located on the end face, facing the heat dissipation substrate, of the base, the capacitor accommodating groove is used for accommodating a plurality of capacitors, two ends of the flow channel are communicated with the inlet and the outlet, and the spoiler is located at the bottom of the flow channel.
Further, two ends of the turbulence block and the side wall of the flow channel, which is provided with the inlet and the outlet, are arranged at intervals.
Further, at least one dividing rod is arranged on the end face, facing the heat dissipation substrate, of the spoiler, and the dividing rod is attached to the end face of the heat dissipation substrate.
Further, the laminated busbar is composed of a first busbar and a second busbar stacked on the first busbar, a plurality of first ports are arranged at one end, close to the single-tube module, of the first busbar, and a plurality of second ports are arranged at one end, close to the single-tube module, of the second busbar.
Further, the single-tube modules are Tpak modules and are arranged in an array, each four single-tube modules form a half-bridge inverter circuit as one phase in the three-phase inverter circuit, twelve Tpak modules form a three-phase full-bridge inverter circuit, and one ends of the single-tube modules in opposite directions are mutually connected.
Further, a plurality of supporting bars are further arranged between the single-tube module and the heat dissipation substrate, and the supporting bars are located at the connecting positions of the single-tube modules and the connecting copper bars.
Further, the distance between the Pin needle and the input end of the single tube module is less than 0.5 mm.
Further, a plurality of first avoidance openings are formed in the negative electrode copper bar, the first insulation member is provided with a plurality of second avoidance openings corresponding to the first avoidance openings, one end of the output terminal extends out of the second insulation member, and the other end of the output terminal penetrates through the first avoidance openings and the second avoidance openings and is connected with the output end of the single-tube module.
Compared with the prior art, the connection copper bar of the TPAK double-tube double-row integrated power module is connected with the first port and the input end of the single-tube module, and the connection can be realized at one time through the connection copper bar, so that the power module is suitable for the situation of different numbers of arrangement. The heat dissipation device is characterized in that a plurality of support bars are further arranged between the single tube module and the heat dissipation substrate, the support bars are located at the joints of the single tube module and the connection copper bars, and the input end and the output end are supported by the support bars, so that the stability of connection is improved, the connection can be clamped after the first insulating piece is covered, and the stability is further improved. The first insulating piece is located a plurality of single tube module junction with between the negative pole copper bar, and it is used for insulating and separates single tube module with the negative pole copper bar. The second insulating piece is located between the output terminal and the negative copper bar and is used for insulating the output terminal and the negative copper bar, avoiding influencing current and simultaneously being used for supporting and setting the output terminal and the detection component.
Drawings
Fig. 1 is a schematic structural diagram of a TPAK double-tube double-row integrated power module provided by the invention.
Fig. 2 is an exploded structure schematic diagram of the TPAK double-row integrated power module of fig. 1.
Fig. 3 is a schematic structural diagram of a stacked busbar of the TPAK dual-row integrated power module of fig. 1.
Fig. 4 is a cross-sectional view of the TPAK double-row integrated power module of fig. 1.
Fig. 5 is an enlarged schematic diagram of the TPAK double-row integrated power module a of fig. 4.
Detailed Description
Specific embodiments of the present invention are described in further detail below. It should be understood that the description herein of the embodiments of the invention is not intended to limit the scope of the invention.
Fig. 1 to 5 are schematic structural diagrams of a TPAK double-tube double-row integrated power module provided by the invention. The TPAK double-tube double-row integrated power module comprises a heat dissipation assembly 10, a chip assembly 20 arranged on the heat dissipation assembly 10, a detection assembly 30 arranged on the chip assembly 20, and a circuit board assembly 40 arranged on the chip assembly 20. It is conceivable that the TPAK double-pipe double-row integrated power module further includes other functional modules, such as a connection assembly, a mounting assembly, etc., which are known to those skilled in the art, and will not be described herein.
The heat dissipation assembly 10 includes a base 11, a capacitor accommodating groove 12 disposed on the base 11, a flow channel 13 disposed on the base 11, a spoiler 14 disposed on the flow channel 13, at least two inlets and outlets 15 disposed on the base 11, a heat dissipation substrate 16 disposed on the base 11, and a plurality of heat dissipation columns 17 disposed on the heat dissipation substrate 16.
The base 11 is used for carrying the above functional modules, the capacitor accommodating groove 12 and the runner 13 are located on an end face of the base 11 facing the heat dissipation substrate 16, and the capacitor accommodating groove 12 is used for accommodating a plurality of capacitors. The flow channel 13 is used for flowing cooling liquid, and two ends of the flow channel 13 are communicated with the inlet and outlet 15.
The bottom of the flow channel 13 extends towards the direction of the heat dissipation substrate 16, two ends of the spoiler 14 are arranged at intervals with the side wall of the inlet and outlet 15 of the flow channel 13, and the other two ends of the spoiler 14 are connected with the side wall of the flow channel 13, so that cooling liquid can collide with the side wall of the spoiler 14 when entering, and the flow speed is reduced. The spoiler 14 is provided with at least one dividing rod 18 on the end face facing the heat dissipation substrate 16, the dividing rod 18 is attached to the end face of the heat dissipation substrate 16, and two ends of the dividing rod 18 are respectively aligned with two ends of the spoiler 14, so that a channel formed between the runner 13 and the heat dissipation substrate 16 is divided. One end of the inlet and outlet 15 is communicated with the side wall of the base 11, the other end of the inlet and outlet 15 is communicated with the runner 13, and the two inlet and outlet 15 are respectively used as a water outlet and a water inlet. The heat dissipation substrate 16 is fixed to the base 11 by a fastener and covers the flow channel 13, and a gap between the flow channel 13 and the heat dissipation substrate 16 is sealed by a seal ring or the like to form a sealed passage through which the cooling liquid flows. The heat dissipation columns 17 are located on the end face of the heat dissipation substrate 16 facing the base 11, and a plurality of heat dissipation columns 17 are arranged in an array, and can exchange heat with the heat dissipation columns 17 when the cooling liquid flows, so that cooling is performed. The heat dissipation post 17 is circular, diamond or oval in shape.
The chip assembly 20 includes a plurality of capacitors 21 disposed in the capacitor accommodating grooves 12, a stacked busbar 22 disposed on the capacitors 21, a plurality of single tube modules 23 disposed on the heat sink assembly 10, a connection copper bar 24 connecting the single tube modules 23 and the stacked busbar 22, a negative electrode copper bar 25 connecting the single tube modules 23 and the stacked busbar 22, a first insulating member 26 disposed on the single tube modules 23, a second insulating member 27 disposed on the negative electrode copper bar 25, and an output terminal 28 disposed on the second insulating member 27.
In this embodiment, the capacitor 21 is a standard thin film capacitor and is formed by connecting five capacitors in parallel, so that a lot of cost for customizing the capacitor is saved. Meanwhile, the standard capacitor is quite regular in shape, so that the busbar capacitors are quite simple in arrangement and replaceable. The laminated busbar 22 is composed of a first busbar 221 and a second busbar 222 stacked on the first busbar 221, wherein a plurality of first ports 223 are formed at one end of the first busbar 221 near the single-tube module 23, and a plurality of second ports 224 are formed at one end of the second busbar 222 near the single-tube module 23.
The single tube modules 23 are Tpak modules using the Clip technology and are arranged in an array, in this embodiment, the number of the single tube modules 23 is 12, each four single tube modules are grouped into a half-bridge inverter circuit as one phase in the three-phase inverter circuit, twelve Tpak modules form a three-phase full-bridge inverter circuit, and the single tube modules 23 are fixed on the heat dissipation substrate 16 by means of reflow soldering. The opposite ends of the plurality of rows of single-tube modules 23 are connected to each other. The two ends of the single tube module 23 are respectively provided with an extended input end and an extended output end, one end, close to the capacitor 21, of the single tube module 23 is an input end, the input end of the single tube module 23 is connected with the first port 223 of the first busbar 221 through the connecting copper bar 24, one end, far away from the capacitor 21, of the single tube module 23 is an output end, and the single tube module 23 is connected with the second port 224 of the second busbar 222 through the negative copper bar 25, so that a circuit is led back to the capacitor. The heat dissipation device is characterized in that a plurality of supporting bars 29 are further arranged between the single-tube module 23 and the heat dissipation substrate 16, the supporting bars 29 are positioned at the joints of the single-tube module 23 and the connection copper bars 24, and as the input end and the output end of the single-tube module 23 are provided with a plurality of bending bottoms, a certain suspension space exists, the input end and the output end are supported by the supporting bars 29, so that the stability of connection is improved, the connection can be clamped after the first insulating piece 26 is covered, and the stability is further improved.
The connection copper bar 24 is a strip copper bar with Pin needles 241. The connection copper bar 24 is connected with the first port 223 and the input end of the single-tube module 23 through laser welding. Since the number and positions of the single-tube modules 23 in a row are different from those of the first ports 223, it is difficult to achieve one-to-one correspondence, and thus the connection can be achieved at one time through the connection copper bars 24, which is suitable for the case of different number arrangements. The Pin needle 241 extends out of the circuit board assembly 40, the Pin needle 241 is used for directly detecting an input voltage, and further obtaining a key parameter Vce of the system, in order to ensure accuracy of a result, a distance between the Pin needle 241 and an input end of the single-tube module 23 is smaller than 0.5mm, and meanwhile, the Pin needle 241 is directly integrated on the connection copper bar 24, so that unnecessary physical connection in a circuit is reduced.
One end of the negative copper bar 25 is connected to the output end of the single tube module 23, and the other end is connected to the second port 224. The negative electrode copper bar 25 is provided with a plurality of first avoiding openings 251. The first avoiding port 251 is configured to avoid connection between the output terminal 28 and the single-tube module 23 and to avoid extension of a pin of the single-tube module 23.
The first insulating member 26 is located between the joints of the single-tube modules 23 and the negative copper bars 25, and is used for insulating and separating the single-tube modules 23 from the negative copper bars 25, so that current is prevented from being affected, and simultaneously, the first insulating member and the support bars 29 can clamp the joints of the single-tube modules 23 to play a supporting role. The first insulating member 26 has a plurality of second relief openings 261 corresponding to the first relief openings 252.
The second insulating member 27 is located between the output terminal 28 and the negative copper bar 25, and is used for insulating the output terminal 28 and the negative copper bar 25 from affecting current, and is also used for supporting and disposing the output terminal 28 and the detection assembly 30.
One end of the output terminal 28 extends out of the second insulating member 27, the other end of the output terminal passes through the first avoidance port 252 and the second avoidance port 261 to be connected with the output end of the single-tube module 23, and the output terminal 28 is used for leading out three-phase electricity of the module.
The detecting assembly 30 includes a temperature sensor 31 provided on the single tube module 23, a plurality of infrared temperature measuring ports 32 provided on the negative copper bar 25, and a plurality of current sensors 33 provided on the output terminal 28.
The temperature sensor 31 is arranged on the single tube module 23, and because of the plurality of single tube modules 23, it is conceivable that the temperature of the cooling liquid gradually rises along with the heat exchange process of flowing, so that the cooling effect is relatively poor when the cooling liquid approaches to the outlet, and the temperature sensor 31 is preferably arranged on the single tube module 23 closest to one side of the inlet and outlet 15, so that the temperature sensor 31 is arranged right above the single tube module 23 closest to the cooling liquid outlet of the module, and the single tube module with the highest temperature is taken as detection data to ensure that the detection error is avoided. It is conceivable that the negative copper bar 25 and the second insulator 27 are provided with through holes for avoiding the temperature sensor 31, respectively. The position of the infrared temperature measuring port 32 corresponds to the position of the single tube module 23, and the single tube module 23 can be directly measured by an external infrared temperature measuring device, so that the module temperature testing system has certain expansibility.
Compared with the traditional current sensor integrated on the PCB, in this embodiment, the current sensor 33 employs a high-precision micro coreless magnetic current sensor, which improves the precision, sensitivity and stability of current detection, and meanwhile, the sensor can be directly fixed to the output terminal 28 and connected to the circuit board assembly 40 through Pin, thereby reducing the space occupation of the PCB and improving the overall integration level of the module.
The circuit board assembly 40 is a PCB board, and the circuit board assembly 40 is an infrastructure of the electronic device. The circuit board is a core component in the electronic device, and is used for supporting electronic components and providing electrical connection, so that each component can smoothly perform communication and power transmission, and the circuit board is the prior art and will not be described in detail.
Compared with the prior art, the connection copper bar 24 of the TPAK double-tube double-row integrated power module provided by the invention is connected with the first port 223 and the input end of the single-tube module 23, and the connection can be realized once through the connection copper bar 24, so that the power module is suitable for the situation of different numbers of arrangement. A plurality of supporting bars 29 are further arranged between the single tube module 23 and the heat dissipation substrate 16, the supporting bars 29 are located at the connection positions of the single tube module 23 and the connection copper bars 24, and the input ends and the output ends are supported by the supporting bars 29, so that the stability of connection is improved, the connection can be clamped after the first insulating piece 26 is covered, and the stability is further improved. The first insulating member 26 is located between the connection of the plurality of single-tube modules 23 and the negative copper bar 25, and is used for insulating and separating the single-tube modules 23 from the negative copper bar 25. The second insulating member 27 is located between the output terminal 28 and the negative copper bar 25, and is used for insulating the output terminal 28 and the negative copper bar 25 from affecting current, and is also used for supporting and disposing the output terminal 28 and the detection assembly 30.
The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions or improvements within the spirit of the present invention are intended to be covered by the claims of the present invention.
Claims (10)
1. A TPAK double-barrelled double-row integrated power module which characterized in that: the TPAK double-tube double-row integrated power module comprises a heat dissipation assembly, a chip assembly arranged on the heat dissipation assembly, a detection assembly arranged on the chip assembly, and a circuit board assembly arranged on the chip assembly, wherein the chip assembly comprises a plurality of capacitors, a laminated busbar arranged on the capacitors, a plurality of single tube modules arranged on the heat dissipation assembly, a connecting copper bar for connecting the single tube modules and the laminated busbar, a negative copper bar for connecting the single tube modules and the laminated busbar, a first insulating piece arranged on the single tube modules, a second insulating piece arranged on the negative copper bar, and an output terminal arranged on the second insulating piece, two ends of the single tube modules are respectively provided with an extended input end and an extended output end, the laminated busbar is provided with a plurality of first ports and a plurality of second ports, the connecting copper bar is strip-shaped and is provided with a copper bar with Pin needles, the connecting copper bar is connected with the first ports and the input end of the single-tube module, the Pin needles extend out of the circuit board assembly, one end of the negative copper bar is connected with the output end of the single-tube module, the other end of the negative copper bar is connected with the second ports, the first insulating piece is positioned between the connecting parts of the single-tube modules and the negative copper bar, the second insulating piece is positioned between the output terminals and the negative copper bar, the detection assembly comprises a temperature sensor arranged on the single-tube module, a plurality of infrared temperature measuring ports arranged on the negative copper bar, and a plurality of current sensors arranged on the output terminals, the positions of the infrared temperature measuring ports correspond to the positions of the single-tube module, and the current sensor is provided with a pin connected with the circuit board assembly.
2. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the heat dissipation assembly comprises a base, a capacitor accommodating groove arranged on the base, a runner arranged on the base, a spoiler arranged on the runner, at least two inlets and outlets arranged on the base, a heat dissipation substrate arranged on the base and a plurality of heat dissipation columns arranged on the heat dissipation substrate.
3. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the capacitor accommodating groove is used for accommodating a plurality of capacitors, two ends of the runner are communicated with the inlet and the outlet, and the spoiler is positioned at the bottom of the runner.
4. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the two ends of the spoiler are arranged at intervals with the side wall of the runner, which is provided with the inlet and the outlet.
5. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the spoiler is provided with at least one division rod on the end face of the radiating substrate facing the radiating substrate, and the division rod is attached to the end face of the radiating substrate.
6. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the laminated busbar is composed of a first busbar and a second busbar stacked on the first busbar, a plurality of first ports are arranged at one end, close to the single-tube module, of the first busbar, and a plurality of second ports are arranged at one end, close to the single-tube module, of the second busbar.
7. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the single-tube modules are Tpak modules and are arranged in an array, each four single-tube modules form a half-bridge inverter circuit as one phase in the three-phase inverter circuit, twelve Tpak modules form a three-phase full-bridge inverter circuit, and multiple rows of opposite ends of the single-tube modules are connected with each other.
8. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: and a plurality of supporting bars are further arranged between the single-tube module and the radiating substrate, and the supporting bars are positioned at the joints of the single-tube modules and the connecting copper bars.
9. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the distance between the Pin needle and the input end of the single tube module is smaller than 0.5 mm.
10. The TPAK double-tube double-row integrated power module as claimed in claim 1, wherein: the negative electrode copper bar is provided with a plurality of first avoidance openings, the first insulating piece is provided with a plurality of second avoidance openings corresponding to the first avoidance openings, one end of the output terminal extends out of the second insulating piece, and the other end of the output terminal penetrates through the first avoidance openings and the second avoidance openings and is connected with the output end of the single-tube module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410953882.7A CN118508723B (en) | 2024-07-17 | 2024-07-17 | TPAK double-tube double-row integrated power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410953882.7A CN118508723B (en) | 2024-07-17 | 2024-07-17 | TPAK double-tube double-row integrated power module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN118508723A true CN118508723A (en) | 2024-08-16 |
| CN118508723B CN118508723B (en) | 2024-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410953882.7A Active CN118508723B (en) | 2024-07-17 | 2024-07-17 | TPAK double-tube double-row integrated power module |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112490000A (en) * | 2020-10-19 | 2021-03-12 | 东风汽车集团有限公司 | Film bus capacitor |
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| CN112490000A (en) * | 2020-10-19 | 2021-03-12 | 东风汽车集团有限公司 | Film bus capacitor |
| CN214506879U (en) * | 2020-12-28 | 2021-10-26 | 中车永济电机有限公司 | Modular composite busbar for highly integrated charger device |
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| CN117878077A (en) * | 2024-01-19 | 2024-04-12 | 浙江翠展微电子有限公司 | A single-row TPAK and microchannel double-sided heat dissipation power module device |
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