CN118495031B - Wafer transportation system with capacity pressure slow-release function - Google Patents

Abstract

The invention relates to the technical field of wafer transportation, in particular to a wafer transportation system with a function of slowly releasing transportation pressure, which comprises: a working machine tool; the synchronous wheels are provided with two groups and are arranged at the top end of the working machine tool through a bracket, and the outer sides of the synchronous wheels are sleeved with driving belts; the wafer placing pieces are uniformly arranged on the outer surface of the transmission belt, and detachable and replaceable wafer placing plates are arranged on the wafer placing pieces; the synchronous holding assembly is arranged on one side of the top end of the working machine tool, and an L-shaped holding plate, a push rod motor and a sliding ring which can be reset and adjusted are arranged on the synchronous holding assembly. The invention can effectively realize the homing requirement of the wafer in the process of transmitting the wafer, can realize the specification inspection of the wafer and the clamping temporary storage of redundant wafers, realize the slow release of the transport capacity, can also ensure the stable transmission of the wafer, reduce the collision, realize the synchronous operation of equipment, and has low equipment maintenance cost, convenient maintenance and further ensure the follow-up long-term effective transmission and transportation operation.

Description

A wafer transportation system with the function of alleviating transportation pressure

Technical Field

The present invention relates to the field of wafer transportation technology, and in particular to a wafer transportation system with the function of relieving transportation pressure.

Background Art

Wafer refers to a round silicon slice used to manufacture semiconductor devices, also known as a semiconductor chip. Wafers are usually made of single-crystal silicon material, and their surface has been polished and chemically treated many times to obtain a highly flat and defect-free surface. The diameter of a wafer is usually between 2 inches and 12 inches. The larger the diameter, the higher the manufacturing cost.

During the wafer production and transportation process, products usually need to be transported, packaged, or tested, etc. However, wafers need to reduce collisions during transportation to ensure the effectiveness of subsequent use. However, in the traditional transportation and delivery process, due to the disordered placement of objects, wafers are easily stacked during transmission. On the one hand, wafers are prone to collisions during transportation, causing damage. On the other hand, stacked products are prone to increase subsequent transportation pressure, affecting healthy transportation capacity. If a sophisticated transportation system is used for transportation during conventional transportation, it usually needs to be programmed and operated. The overall transportation process is easily controlled by the system and requires careful maintenance to ensure operation, resulting in high maintenance costs. For this reason, we propose a wafer transportation system with the function of relieving transportation pressure.

Summary of the invention

The purpose of the present invention is to solve the shortcomings of the prior art and to propose a wafer transportation system with the function of relieving transportation pressure.

In order to achieve the above object, the present invention adopts the following technical solutions:

A wafer transportation system with the function of relieving transportation pressure, comprising:

Machine tools;

There are two sets of synchronous wheels, which are installed on the top of the working machine tool through a bracket, and the outer side of the synchronous wheels is provided with a transmission belt to realize the transportation of wafers;

The wafer placement pieces are evenly arranged on the outer surface of the transmission belt. The wafer placement pieces are provided with detachable and replaceable wafer placement plates, which facilitate the transmission of wafers of different specifications and provide stable limit guarantees.

The synchronous receiving assembly is arranged on one side of the top of the working machine tool, and is used to receive the wafers transmitted on the wafer placement member, so as to ensure the stable and orderly transmission of the wafers. The synchronous receiving assembly is provided with an L-shaped receiving plate, a push rod motor and a sliding ring that can be reset and adjusted, so as to facilitate the stable receiving of the wafers on the wafer placement member that are continuously transported;

The synchronous adjustment mechanism is installed at the axis of a group of synchronous wheels close to the synchronous receiving assembly, and is used to adjust the synchronous receiving assembly to operate, so as to facilitate the synchronous operation of the components on the synchronous receiving assembly and the corresponding wafer placement components, thereby ensuring the stable operation of the transmission operation;

The capacity release mechanism is installed on the top of the working machine tool and placed on the side of the transmission belt. It is used to return the wafers above the wafer placement parts and clamp and temporarily store the excess wafers, thereby releasing the actual capacity and ensuring that the transmission process is stable and orderly.

As a preferred technical solution of the present application, the synchronous adjustment mechanism includes a synchronous pile coaxially connected to the synchronous wheel, a groove pointing to the center of the circle is opened on the curved surface of the synchronous pile, and a toggle rod is inserted in the groove, and one end of the toggle rod located inside the groove is connected to a spring I bonded to the inner wall of the synchronous pile to ensure that the toggle rod can be effectively reset. Through the setting of spring I, the toggle rod can be effectively extended, providing a stable guarantee for the subsequent cooperation operation of the synchronous receiving assembly.

As a preferred technical solution of the present application, an L-shaped L-shaped fixing frame is installed on the top of the working machine tool through a support rod, and a synchronous receiving assembly is installed on the bottom end of the L-shaped fixing frame, and the synchronous receiving assembly includes an arc-shaped slide bar fixedly connected to the bottom end of the L-shaped fixing frame, the arc-shaped slide bar is in a 90° arc shape, the center of the arc segment of the arc-shaped slide bar is located on the axis line of the synchronous adjustment mechanism, and the bottom end is connected to a bottom trigger assembly fixedly connected to the top of the working machine tool, and a sliding ring is sleeved on the outer side of the arc-shaped slide bar, and the initial position of the sliding ring is a position on the arc-shaped slide bar at the same height as the axis of the synchronous adjustment mechanism;

A circular guide piece is provided on one side of the arc-shaped slide bar and is connected to the bottom end of the L-shaped fixed frame through a bracket. The circular guide piece coincides with the axis of the synchronous adjustment mechanism, and an annular slide groove is provided on one side of the circular guide piece, and a partially raised adjustment section groove is provided at the bottom end of the annular slide groove. An adjustment rod is slidably provided on the circular guide piece in the annular slide groove, and the adjustment rod is fixedly installed on the side of the toggle rod. Then, through the setting of the annular groove and the adjustment section groove, it is ensured that the toggle rod is stably adjusted, thereby providing convenience for subsequent regulation operations;

The outer curved surface of the circular guide is provided with an annular groove, and a rotating ring is sleeved on the annular groove. A connecting bent rod is fixedly connected between the rotating ring and the sliding ring. A resisting rod is connected to the side of the connecting bent rod, and the resisting rod is located below the toggle rod, so that the synchronous adjustment mechanism is effectively driven by the toggle rod to deflect the resisting rod, the connecting bent rod, the sliding ring, etc. during the rotation process to achieve position adjustment;

In the above process, since the arc segment of the arc-shaped sliding rod and the axial center lines of the circular guide and the synchronous adjustment mechanism coincide with each other, and then the synchronous adjustment mechanism rotates with the synchronous wheel, the toggle rod drives the contact rod to drive the sliding ring and the connecting bent rod and the rotating ring to rotate stably, and the overall process effectively avoids the occurrence of motion interference. When the toggle rod moves to the bottom, the adjusting rod is affected by the groove of the adjusting segment on the circular guide, causing the toggle rod to contract and extend again, thereby releasing the contact relationship with the contact rod, providing a guarantee for the subsequent periodic contact with the contact rod.

The L-shaped receiving plate is in a vertical position and is in a position to prevent the wafer from falling.

The bottom trigger assembly includes an L-shaped trigger frame. A pressure sensor is installed on the upper part of the side wall where the L-shaped trigger frame is connected to the arc-shaped slide rod, which is used to trigger the L-shaped receiving plate after it slides down in cooperation with the wafer placement member. A pneumatic push rod is installed on the other side of the L-shaped trigger frame. The pressure sensor is electrically connected to the push rod motor and the pneumatic push rod. The output shaft of the pneumatic push rod penetrates deep into the inner side of the L-shaped trigger frame and is coaxially connected to a push plate, so that after the L-shaped receiving plate triggers the pressure sensor, the push rod motor drives the L-shaped receiving plate to retract. At the same time, the pneumatic push rod drives the push plate to push The wafer on the L-shaped receiving plate is pushed out to realize the transmission operation, and a transmission ramp is provided on one side of the bottom trigger assembly at the top of the working machine tool to facilitate the stable sliding of the wafer pushed out. In the actual transportation and transmission process of the wafer, in order to ensure its effective use in the later stage, it is necessary to wrap the surface of the wafer with a film to make it anti-static, dust-proof, scratch-proof and moisture-proof. Therefore, during the transmission of the wafer on the transmission ramp, there is no damage to the wafer itself, thereby ensuring lossless transmission of the wafer;

The upper outer side of the arc-shaped slide rod is sleeved with a spring II bonded to the slide ring, which effectively facilitates the subsequent release of the contact relationship between the toggle rod and the resistance rod. The slide ring drives the L-shaped receiving plate, the push rod motor and the rotating ring to reset, providing a reset guarantee for the next transmission operation.

As a preferred technical solution of the present application, the wafer placement component includes a fixed frame plate installed on a transmission belt, a wafer placement plate for limiting the wafer is provided above the fixed frame plate, a plurality of mounting through holes are opened on the surface of the wafer placement plate, and mounting screws connected to the fixed frame plate are installed in the mounting through holes, thereby effectively realizing the fixation of the wafer placement plate and subsequent replacement, and facilitating the limited transmission of wafers of different specifications.

As a preferred technical solution of the present application, the transport slow-release mechanism includes a servo motor installed on the top of the working machine tool, the output shaft of the servo motor is coaxially connected to a rotating rod, and a plurality of groups of adjusting clamping components are fixedly installed in an array on the outer side of the top of the rotating rod, which are used to return the wafer on the wafer placement piece and clamp and temporarily store the excess wafers;

The adjustment clamping assembly includes a fixing bar, one side of the fixing bar is provided with a groove, and a bidirectional screw is provided at the groove, the outer side of the bidirectional screw is symmetrically provided with two sets of threaded sleeves, one side of the threaded sleeve is provided with a plug-in rod, and two sets of clamping homing parts are plugged, and one end of the fixing bar is installed with a driving motor II for driving the bidirectional screw to rotate, thereby effectively realizing the approach and separation of the clamping homing parts, providing convenience for the subsequent wafer homing on the wafer placement part and the clamping of excess stacked wafers;

The clamping and returning parts include two groups of clamping and returning plates. The inner side of the clamping and returning plates is a semicircular opening consistent with the placement groove on the wafer placement plate, which is convenient for effectively realizing the return and clamping of the wafer after closing. One end of the fixing bar is connected to a plug-in block, and a slot adapted to the plug-in rod is opened on the plug-in block, and a locking screw for locking and fixing is passed through the slot, thereby facilitating the subsequent replacement of the overall clamping and returning parts, facilitating the cooperation with the wafer placement plate, and facilitating the return and clamping temporary storage of wafers of different specifications.

As a preferred technical solution of the present application, a support ring is fixedly installed on the outer side of the rotating rod, and a plurality of groups of support rods fixedly connected to the top of the working machine tool are evenly installed on the side of the support ring to ensure the stability of the support ring and the rotating rod, and to ensure the stability of the overall capacity release mechanism during use.

As a preferred technical solution of the present application, a bracket is installed on the side of the working machine tool away from the synchronous receiving assembly, and a driving motor I for driving the synchronous wheel is installed on the bracket, which facilitates and effectively ensures the overall transportation operation.

The beneficial effects of the present invention are:

1. By adjusting the clamping assembly on the transport capacity release mechanism and coordinating the wafer placement plate on the wafer placement member, the equipment can effectively meet the needs of wafer transmission of different specifications during wafer transmission, and can stably return the wafers to their original positions. It can also clamp and temporarily store excess stacked wafers to achieve transport capacity release. During the return process, it can also detect wafer specifications, which is convenient for practical use.

2. Through the synchronous holding component upper push rod motor with synchronous adjustment mechanism and wafer placement plate setting, the wafer can be stably closed and limited at the end of the transmission belt to prevent the occurrence of falling during the transmission process, and realize wafer transfer with less collision in the subsequent transmission process. The internal components of the entire synchronous holding component can be effectively reset and operate synchronously with the transmission belt, providing stability guarantee for the subsequent orderly operation of wafer transfer. The overall transmission process does not require additional programming, the overall maintenance cost is low, and it is easy to operate and use.

In summary, the present application can effectively meet the wafer return requirements during the wafer transmission process, and can realize the wafer specification inspection and temporary clamping and storage of excess wafers, thereby achieving the slow release of transportation capacity, and can also ensure stable wafer transmission, reduce collisions, and achieve synchronous operation of equipment. The equipment has low maintenance costs and is easy to maintain, thereby ensuring subsequent long-term effective transfer and transportation operations.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic diagram of the structure of the present invention;

FIG2 is a schematic structural diagram of a synchronous receiving assembly of the present invention;

FIG3 is a schematic structural diagram of a bottom trigger assembly of the present invention;

FIG4 is a schematic structural diagram of a transport capacity release mechanism of the present invention;

FIG5 is a schematic structural diagram of an adjustable clamping assembly of the present invention;

FIG6 is a schematic structural diagram of a clamping and homing member of the present invention;

FIG7 is a schematic cross-sectional view of the synchronous adjustment mechanism of the present invention;

FIG. 8 is a schematic structural diagram of a wafer placement member of the present invention.

In the figure: 1. working machine tool; 2. synchronous receiving assembly; 21. arc slide bar; 22. spring II; 23. sliding ring; 24. connecting bent rod; 25. circular guide; 26. rotating ring; 27. contact rod; 28. L-shaped receiving plate; 29. push rod motor; 210. bottom trigger assembly; 2101. L-shaped trigger frame; 2102. pressure sensor; 2103. push plate; 2104. pneumatic push rod; 3. transmission belt; 4. transport capacity release mechanism; 41. servo motor; 42. rotating rod; 43. support rod ; 44. Support ring; 45. Adjustment clamping assembly; 451. Fixing bar; 452. Bidirectional screw; 453. Drive motor II; 454. Clamping return piece; 4541. Clamping return plate; 4542. Plug-in block; 4543. Locking screw; 5. Synchronous wheel; 6. Drive motor I; 7. Synchronous adjustment mechanism; 71. Synchronous pile; 72. Toggle rod; 73. Spring I; 74. Adjustment rod; 8. Transmission ramp; 9. Wafer placement piece; 91. Fixed frame plate; 92. Wafer placement plate; 10. L-shaped fixed frame.

DETAILED DESCRIPTION

The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

1 to 8 , a wafer transport system having the function of relieving transport pressure includes:

Working machine tool 1;

The synchronous wheels 5 are provided with two sets, which are installed on the top of the working machine tool 1 through a bracket, and the outer side of the synchronous wheels 5 is provided with a transmission belt 3 to realize the transportation of the wafer;

The wafer placement members 9 are evenly arranged on the outer surface of the transmission belt 3. The wafer placement members 9 are provided with a detachable and replaceable wafer placement plate 92, which is convenient for providing a stable limit guarantee for the transmission of wafers of different specifications;

The synchronous receiving assembly 2 is arranged on one side of the top of the working machine tool 1, and is used to receive the wafers transmitted on the wafer placement member 9, so as to ensure the stable and orderly transmission of the wafers. The synchronous receiving assembly 2 is provided with an L-shaped receiving plate 28, a push rod motor 29 and a sliding ring 23 that can be reset and adjusted, so as to facilitate the stable receiving of the wafers on the wafer placement member 9 that are continuously transported;

The synchronous adjustment mechanism 7 is installed at the axis of a group of synchronous wheels 5 close to the synchronous receiving assembly 2, and is used to adjust the synchronous receiving assembly 2 to operate, so as to facilitate the synchronous operation of the components on the synchronous receiving assembly 2 and the corresponding wafer placement components 9, thereby ensuring the stable operation of the transmission operation;

The transport capacity release mechanism 4 is installed on the top of the working machine tool 1 and placed on the side of the transmission belt 3, and is used to return the wafers above the wafer placement member 9 and clamp and temporarily store the excess wafers, so as to release the actual transport capacity and ensure that the transmission process is stable and orderly;

A bracket is installed on the side of the working machine tool 1 away from the synchronous receiving assembly 2, and a driving motor Ⅰ6 for driving the synchronous wheel 5 is installed on the bracket, which is convenient and effective to ensure the overall transportation operation.

7 , the synchronous adjustment mechanism 7 includes a synchronous pile 71 coaxially connected to the synchronous wheel 5, a groove pointing to the center of the circle is opened on the curved surface of the synchronous pile 71, and a toggle rod 72 is inserted in the groove, and one end of the toggle rod 72 located inside the groove is connected to a spring Ⅰ73 bonded to the inner wall of the synchronous pile 71 to ensure that the toggle rod 72 can be effectively reset. Through the setting of the spring Ⅰ73, the toggle rod 72 can be effectively extended, providing a stable guarantee for the subsequent cooperation operation of the synchronous receiving assembly 2.

Referring to Figures 1, 2 and 7, an L-shaped L-shaped fixing frame 10 is installed on the top of the working machine tool 1 through a support rod, and a synchronous receiving assembly 2 is installed on the bottom end of the L-shaped fixing frame 10. The synchronous receiving assembly 2 includes an arc-shaped slide bar 21 fixedly connected to the bottom end of the L-shaped fixing frame 10, and the arc-shaped slide bar 21 is in a 90° arc shape. The center of the arc segment of the arc-shaped slide bar 21 is located on the axis of the synchronous adjustment mechanism 7, and the bottom end is connected to a bottom trigger assembly 210 fixedly connected to the top of the working machine tool 1. A sliding ring 23 is sleeved on the outer side of the arc-shaped slide bar 21, and the initial position of the sliding ring 23 is a position on the arc-shaped slide bar 21 at the same height as the axis of the synchronous adjustment mechanism 7;

A circular guide 25 connected to the bottom of the L-shaped fixing frame 10 through a bracket is provided on one side of the arc-shaped slide bar 21. The circular guide 25 coincides with the axis of the synchronous adjustment mechanism 7, and an annular groove is provided on one side of the circular guide 25, and a partially raised adjustment section groove is provided at the bottom end of the annular groove. An adjustment rod 74 is slidably provided in the annular groove of the circular guide 25. The adjustment rod 74 is fixedly installed on the side of the toggle rod 72, and then the toggle rod 72 is stably adjusted through the setting of the annular groove and the adjustment section groove, thereby facilitating the subsequent regulation operation.

The outer curved surface of the circular guide 25 is provided with an annular groove, and a rotating ring 26 is sleeved on the annular groove. A connecting bent rod 24 is fixedly connected between the rotating ring 26 and the sliding ring 23. A resisting rod 27 is connected to the side of the connecting bent rod 24, and the resisting rod 27 is located below the toggle rod 72, so that the synchronous adjustment mechanism 7 is effectively driven by the toggle rod 72 during the rotation process to deflect the resisting rod 27, the connecting bent rod 24, the sliding ring 23, etc., to achieve position adjustment;

In the above process, since the arc segment of the arc-shaped sliding rod 21 and the axial center lines of the circular guide 25 and the synchronous adjustment mechanism 7 coincide, and then the synchronous adjustment mechanism 7 rotates following the synchronous wheel 5, the toggle rod 72 to toggle the contact rod 27 to drive the sliding ring 23 and the connecting bent rod 24 and the rotating ring 26 to rotate stably, and the overall process effectively avoids the occurrence of motion interference. When the toggle rod 72 moves to the bottom, the adjusting rod 74 is affected by the groove of the adjusting segment on the circular guide 25, causing the toggle rod 72 to contract and extend again, thereby releasing the contact relationship with the contact rod 27, providing a guarantee for the subsequent periodic contact with the contact rod 27.

A push rod motor 29 is installed on one side of the sliding ring 23, and the end of the output shaft of the push rod motor 29 is fixedly connected to an L-shaped receiving plate 28 adapted to the wafer placement piece 9, so that the transmission belt 3 can drive the wafer placement piece 9 to deflect during the transmission process so that it can fit with the L-shaped receiving plate 28, ensuring that the wafer inside the wafer placement piece 9 is effectively protected and limited to avoid falling. When the sliding ring 23 is in the initial state, the L-shaped receiving plate 28 is in a vertically set waiting for contact state. Due to the initial position of the sliding ring 23 and the synchronous adjustment mechanism 7, the L-shaped receiving plate 28 is in a vertical state of waiting for contact, and the wafer placement member 9 is in the process of following the transmission belt 3 to be transported in the counterclockwise direction in FIG. 1, even if the wafer placement member 9 is tilted, the wafer placement member 9 is still tilted upward, thereby effectively ensuring that the wafer on the upper part will not fall, and when it moves to the vertical state, it contacts with the L-shaped receiving plate 28 to form a closed space, thereby providing a stable closed protection space for the subsequent transmission of the wafer, and preventing the phenomenon of falling;

2-3, the bottom trigger assembly 210 includes an L-shaped trigger frame 2101, and a pressure sensor 2102 is installed on the upper part of the side wall where the L-shaped trigger frame 2101 is connected to the arc-shaped slide bar 21, which is used for triggering after the L-shaped receiving plate 28 and the wafer placement member 9 slide down in cooperation, and a pneumatic push rod 2104 is installed on the other side of the L-shaped trigger frame 2101, and the pressure sensor 2102 is electrically connected to the push rod motor 29 and the pneumatic push rod 2104, and the output shaft of the pneumatic push rod 2104 penetrates deep into the inner side of the L-shaped trigger frame 2101 and is coaxially connected to the push plate 2103, so that after the L-shaped receiving plate 28 triggers the pressure sensor 2102, the push rod motor 29 is driven The movable L-shaped receiving plate 28 retracts, and at the same time, the pneumatic push rod 2104 drives the push plate 2103 to push, so that the wafer located on the L-shaped receiving plate 28 is pushed out to realize the transmission operation, and the top of the working machine tool 1 is provided with a transmission ramp 8 on one side of the bottom trigger component 210, which is convenient for the stable sliding of the pushed out wafer. In the actual transportation and transmission process of the wafer, in order to ensure its effective use in the later stage, it is necessary to wrap the surface of the wafer with a film to make it anti-static, dust-proof, scratch-proof and moisture-proof. Therefore, in the process of the wafer being transmitted on the transmission ramp 8, there is no damage to the wafer itself, thereby ensuring the lossless transmission of the wafer;

The upper outer side of the arc-shaped slide rod 21 is sleeved with a spring II 22 bonded to the slide ring 23, which effectively facilitates the subsequent release of the contact relationship between the toggle rod 72 and the resistance rod 27. The slide ring 23 drives the L-shaped receiving plate 28, the push rod motor 29 and the rotating ring 26 to reset, providing a reset guarantee for the next transmission operation.

Referring to Figure 8, the wafer placement member 9 includes a fixed frame plate 91 installed on the transmission belt 3, and a wafer placement plate 92 for limiting the wafer is provided above the fixed frame plate 91. A plurality of mounting through holes are opened on the surface of the wafer placement plate 92, and mounting screws connected to the fixed frame plate 91 are installed in the mounting through holes, thereby effectively realizing the fixation of the wafer placement plate 92 and the subsequent replacement, and facilitating the limited transmission of wafers of different specifications.

4 to 6, the transport slow-release mechanism 4 includes a servo motor 41 installed at the top of the working machine tool 1, the output shaft of the servo motor 41 is coaxially connected to a rotating rod 42, and a plurality of groups of adjusting clamping assemblies 45 are fixedly installed in an array on the outer side of the top of the rotating rod 42, which are used to return the wafers on the wafer placement member 9 and clamp and temporarily store the excess wafers;

The adjusting clamping assembly 45 includes a fixing bar 451, one side of which is provided with a groove, and a bidirectional screw rod 452 is provided at the groove, and two groups of threaded sleeves are symmetrically provided on the outer side of the bidirectional screw rod 452, and a plug-in rod is provided on one side of the threaded sleeve, and two groups of clamping homing parts 454 are plugged in, and a driving motor II 453 for driving the bidirectional screw rod 452 to rotate is installed at one end of the fixing bar 451, thereby effectively realizing the approach and separation of the clamping homing parts 454, providing convenience for the subsequent wafer homing on the wafer placement part 9 and the clamping of excess stacked wafers;

The clamping return member 454 includes two groups of clamping return plates 4541. The inner side of the clamping return plate 4541 is a semicircular opening consistent with the placement groove on the wafer placement plate 92, which is convenient for effectively realizing the return and clamping of the wafer after closing. One end of the fixing bar 451 is connected to a plug-in block 4542, and a slot adapted to the plug-in rod is provided on the plug-in block 4542, and a locking screw 4543 for locking and fixing is passed through the slot, thereby facilitating the subsequent replacement of the overall clamping return member 454, cooperating with the wafer placement plate 92, and facilitating the return and clamping temporary storage of wafers of different specifications.

A supporting ring 44 is fixedly installed on the outer side of the rotating rod 42, and a plurality of groups of supporting rods 43 fixedly connected to the top of the working machine tool 1 are evenly installed on the side of the supporting ring 44 to ensure the stability of the supporting ring 44 and the rotating rod 42, and to ensure the stability of the overall transport capacity release mechanism 4 when in use.

Working process: First, when the wafer is placed on the upper part of the wafer placement part 9 and moves along with the transmission belt 3, and moves to the transport release mechanism 4, the servo motor 41 on the transport release mechanism 4 is started, so that the corresponding adjustment clamping assembly 45 moves to the corresponding position of the wafer placement part 9, and then the drive motor II 453 is started to realize the rotation of the bidirectional screw rod 452, driving the clamping return parts 454 on both sides to approach each other. At this time, the clamping return plate 4541 allows the wafer to fall into the limiting groove of the lower wafer placement plate 92 through the circular through hole of the two groups of semicircular openings, thereby realizing the effective return of the wafer. If there are extra wafers on the stack, they will not fall into the limiting grooves, but will be clamped by the two sets of clamping return plates 4541, and then the clamping return member 454 will rotate under the action of the servo motor 41, so as to realize the removal of extra wafers and reduce the transportation capacity during the transmission process. In the subsequent process, the clamped wafers can be placed in the subsequent vacant wafer placement plate 92 through regulation, so as to achieve the effect of temporary storage and transportation, and effectively realize the slow release of transportation capacity. In addition, during the closing and clamping process of the clamping return member 454, if the size of the wafer inside exceeds the standard, it will not fall and will be clamped, so it can also effectively achieve the purpose of screening.

When the wafer follows the wafer placement member 9 to move to the synchronous receiving assembly 2, as the transmission belt 3 continues to operate, the wafer placement member 9 contacts the L-shaped receiving plate 28. At this time, the wafer is clamped between the wafer placement member 9 and the L-shaped receiving plate 28, and in the subsequent operation process, the toggle rod 72 contacts the resistance rod 27, so that the connecting bending rod 24 drives the rotating ring 26 and the sliding ring 23 and the push rod motor 29, the L-shaped receiving plate 28, etc. to follow the rotation until the L-shaped receiving plate 28 touches the bottom trigger assembly 210 below. At this time, the pressure sensor 2102 is touched, so that the push rod motor 29 and the pneumatic push rod 2104 work to realize the retraction of the L-shaped receiving plate 28, thereby adjusting the wafer placement plate The wafer inside 92 is received and released from the wafer placement plate 92. At the same time, the pneumatic push rod 2104 drives the push plate 2103 to push the wafer to the transmission ramp 8 to complete a single transmission operation. The empty wafer placement piece 9 is in an inverted state and continues to move with the transmission belt 3. In this process, the adjustment rod 74 moves to the raised adjustment section groove on the circular guide 25, so that the adjustment rod 74 drives the toggle rod 72 to retract, and the contact and resistance rod 27 are released, and then reset under the action of spring I 73. At the same time, under the action of spring II 22, the sliding ring 23 drives the components connected thereto to reset, providing convenience for the next transmission operation.

Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims (3)

1. A wafer transport system with the function of relieving transport pressure, characterized by comprising: Machine tools (1); Two sets of synchronous wheels (5) are installed on the top of the working machine tool (1) through a bracket, and a transmission belt (3) is sleeved on the outer side of the synchronous wheels (5); Wafer placement members (9) are evenly arranged on the outer surface of the transmission belt (3), and a detachable and replaceable wafer placement plate (92) is provided on the wafer placement members (9); A synchronous receiving assembly (2) is arranged on one side of the top end of the working machine tool (1), and the synchronous receiving assembly (2) is provided with an L-shaped receiving plate (28) capable of being reset and adjusted, a push rod motor (29) and a sliding ring (23); A synchronous adjustment mechanism (7) is installed at the axis of a set of synchronous wheels (5) close to the synchronous receiving assembly (2); A transport capacity release mechanism (4) is installed on the top of the working machine tool (1) and is placed on the side of the transmission belt (3); The synchronous adjustment mechanism (7) comprises a synchronous pile (71) coaxially connected to the synchronous wheel (5); a groove pointing to the center of the circle is provided on the curved surface of the synchronous pile (71); a toggle rod (72) is inserted into the groove; and a spring I (73) bonded to the inner wall of the synchronous pile (71) is connected to one end of the toggle rod (72) located inside the groove; The top of the working machine tool (1) is equipped with an L-shaped L-shaped fixing frame (10) through a support rod, and the bottom of the L-shaped fixing frame (10) is equipped with a synchronous receiving assembly (2), and the synchronous receiving assembly (2) includes an arc-shaped slide bar (21) fixedly connected to the bottom of the L-shaped fixing frame (10), the arc-shaped slide bar (21) is in a 90° arc shape, the arc segment center of the arc-shaped slide bar (21) is located on the axis of the synchronous adjustment mechanism (7), and the bottom end is connected to a bottom trigger assembly (210) fixedly connected to the top of the working machine tool (1), and the outer side of the arc-shaped slide bar (21) is sleeved with a sliding ring (23), and the initial position of the sliding ring (23) is a position on the arc-shaped slide bar (21) at the same height as the axis of the synchronous adjustment mechanism (7); A circular guide member (25) is provided on one side of the arc-shaped slide bar (21) and is connected to the bottom end of the L-shaped fixed frame (10) through a bracket. The circular guide member (25) coincides with the axis of the synchronous adjustment mechanism (7). An annular slide groove is provided on one side of the circular guide member (25), and a partially raised adjustment section groove is provided at the bottom end of the annular slide groove. The circular guide member (25) is slidably provided with an adjustment rod (74) in the annular slide groove. The adjustment rod (74) is fixedly mounted on the side of the toggle rod (72); An annular groove is provided on the outer curved surface of the circular guide member (25), and a rotating ring (26) is sleeved on the annular groove. A connecting bent rod (24) is fixedly connected between the rotating ring (26) and the sliding ring (23). A resisting rod (27) is connected to the side of the connecting bent rod (24), and the resisting rod (27) is located below the toggle rod (72); A push rod motor (29) is installed on one side of the sliding ring (23); an L-shaped receiving plate (28) adapted to the wafer placement member (9) is fixedly connected to the end of the output shaft of the push rod motor (29); the L-shaped receiving plate (28) is in a vertically arranged waiting-for-contact state when the sliding ring (23) is in an initial state; The bottom trigger assembly (210) comprises an L-shaped trigger frame (2101), a pressure sensor (2102) is installed on the upper part of the side wall of the L-shaped trigger frame (2101) connected to the arc-shaped slide bar (21), and a pneumatic push rod (2104) is installed on the other side of the L-shaped trigger frame (2101), the pressure sensor (2102) is electrically connected to the push rod motor (29) and the pneumatic push rod (2104), the output shaft of the pneumatic push rod (2104) penetrates deep into the inner side of the L-shaped trigger frame (2101) and is coaxially connected to a push plate (2103), and a transmission ramp (8) is provided on one side of the bottom trigger assembly (210) at the top of the working machine tool (1); A spring II (22) bonded to a sliding ring (23) is sleeved on the outer upper portion of the arc-shaped sliding rod (21); The transport capacity release mechanism (4) comprises a servo motor (41) mounted on the top of the working machine tool (1); the output shaft of the servo motor (41) is coaxially connected to a rotating rod (42); and a plurality of groups of adjusting clamping components (45) are fixedly mounted in an array on the outer side of the top of the rotating rod (42); The adjusting clamping assembly (45) comprises a fixing bar (451), one side of the fixing bar (451) is provided with a groove, and a bidirectional screw rod (452) is provided at the groove, the outer side of the bidirectional screw rod (452) is symmetrically threaded with two groups of threaded sleeves, one side of the threaded sleeve is provided with a plug-in rod, and two groups of clamping return parts (454) are plugged, and one end of the fixing bar (451) is installed with a driving motor II (453) for driving the bidirectional screw rod (452) to rotate; The clamping return member (454) includes two sets of clamping return plates (4541), the inner side of the clamping return plates (4541) is a semicircular opening that is consistent with the placement groove on the wafer placement plate (92), so as to facilitate the effective return and clamping of the wafer after closing, and one end of the fixing strip (451) is connected to a plug-in block (4542), and the plug-in block (4542) is provided with a slot that is compatible with the plug-in rod, and a locking screw (4543) for locking and fixing is passed through the slot; A supporting ring (44) is fixedly mounted on the outer side of the rotating rod (42), and a plurality of groups of supporting rods (43) fixedly connected to the top of the working machine tool (1) are evenly mounted on the side of the supporting ring (44). 2. According to claim 1, a wafer transportation system with the function of relieving transportation pressure is characterized in that the wafer placement member (9) includes a fixed frame plate (91) installed on the transmission belt (3), and a wafer placement plate (92) for limiting the wafer is provided above the fixed frame plate (91), and a plurality of mounting through holes are opened on the surface of the wafer placement plate (92), and mounting screws connected to the fixed frame plate (91) are installed in the mounting through holes. 3. A wafer transport system with a function of relieving transport pressure according to claim 1, characterized in that a bracket is installed on the side of the working machine tool (1) away from the synchronous receiving assembly (2), and a driving motor I (6) for driving the synchronous wheel (5) is installed on the bracket.