CN118431135A - A small-format LED transfer and die bonding equipment - Google Patents
A small-format LED transfer and die bonding equipment Download PDFInfo
- Publication number
- CN118431135A CN118431135A CN202410579121.XA CN202410579121A CN118431135A CN 118431135 A CN118431135 A CN 118431135A CN 202410579121 A CN202410579121 A CN 202410579121A CN 118431135 A CN118431135 A CN 118431135A
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- led
- needling
- seat
- base
- positioning camera
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
- H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
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- Die Bonding (AREA)
Abstract
The invention discloses small-format LED transferring and die-fixing equipment which is used for transferring a micro-miniature LED to a target substrate and comprises a base, wherein a working platform used for bearing the target substrate, a clamping assembly used for bearing the micro-miniature LED, a feeding and discharging device used for transmitting the micro-miniature LED to the clamping assembly and a needling device used for transferring the micro-miniature LED borne by the clamping assembly to the target substrate borne on the working platform are arranged on the base; the workbench and the clamping assembly have the X-Y-Z axial adjusting function at the same time, and the base is also provided with a needling positioning camera assembly. The working platform for bearing the target substrate has the X-Y-Z axial adjustment function, and the clamping assembly for bearing the miniature LED also has the X-Y-Z axial adjustment function, and the miniature LED and the target substrate can be precisely aligned by combining the needling positioning camera assembly, so that the transfer precision is improved.
Description
Technical Field
The invention belongs to the technical field of chip patch manufacturing equipment, and particularly relates to small-format LED transfer die bonding equipment.
Background
Along with the development of technology, the LED is more and more miniaturized, and the microminiature LED such as MiniLED (chip size about 100-300 μm) and Micro LED (chip size about 50-100 μm) is also appeared, so that the display made of the microminiature LED becomes the development direction of the future display technology with smaller pixels and higher quality pictures. In the prior art, the micro-miniature LEDs are generally manufactured by a wafer process, wherein the LEDs are firstly manufactured on a wafer, then the wafer is cut into a large number of individual micro-miniature LED chips, and then the micro-miniature LEDs are transferred to target substrates such as a circuit board, a wafer tape, a blue film, a white film and the like.
Because of the small size and huge number of the microminiature LEDs, the traditional process adopts a mode of sucking the microminiature LEDs one by vacuum suction nozzles for transferring, however, the transferring efficiency of the process is very low, and in order to improve the transferring efficiency, a plurality of vacuum suction nozzles are combined for sucking and transferring, and although the efficiency is improved, the size of the transferring equipment is obviously increased, and the operation difficulty is increased.
In recent years, in order to improve the defects of the conventional process, a needling type transfer method has been developed, in which cut micro-LEDs are firstly adhered to a base material having a certain viscosity, then the LEDs are separated from the base material one by one and contacted with a target base material in a needling type, and the target base material is also a material having a certain viscosity, so that the LEDs can be transferred to the target base material by adhesion, and in the needling type transfer method, the movement distance of a needling needle is very small, so that a very high reciprocating frequency can be achieved, as described in a needling type die bonder in the prior art "CN 202110750360.3". However, the prior art still has the defects of large whole volume, low laminating precision, low flexibility and the like.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The invention aims to provide small-format LED transfer die bonding equipment so as to overcome the defects in the prior art.
In order to achieve the above purpose, the invention provides a small-format LED transferring and die-bonding device for transferring a micro-miniature LED onto a target substrate, which comprises a base, wherein a working platform for bearing the target substrate, a clamping assembly for bearing the micro-miniature LED, a feeding and discharging device for transmitting the micro-miniature LED to the clamping assembly and a needling device for transferring the micro-miniature LED borne by the clamping assembly onto the target substrate borne on the working platform are arranged on the base;
the workbench and the clamping assembly have the X-Y-Z axial adjusting function at the same time, and the base is also provided with a needling positioning camera assembly.
Further, preferably, the working platform includes a platform adjusting seat capable of moving in an X-axis direction and an adsorption platform capable of moving in a Y-axis direction, which is disposed on the base, and the adsorption platform has a Z-axis lifting function;
The clamping assembly comprises a first clamping seat which is arranged on the base and can be lifted in the Z axial direction, a second clamping seat which is arranged on the first clamping seat and can be moved in the X axial direction, and an LED clamp which is arranged on the second clamping seat and can be moved in the Y axial direction;
The LED clamp is suspended above the adsorption platform;
The feeding and discharging device comprises an LED bin arranged on the base and a material changing device for taking and placing materials from the LED bin, and the material changing device is suspended above the base;
the needling device comprises a bearing frame arranged on the base, a first needling seat arranged on the bearing frame, a second needling seat arranged on the first needling seat and capable of moving in the X axial direction, and a needling needle arranged on the second needling seat and capable of moving in the Z axial direction.
Further, as an optimization, the LED fixture comprises a fixture main body which is arranged on the second clamping seat and can move in the Y axial direction, a needling area is arranged on the fixture main body, and a fixture which can be finely adjusted in the Z axial direction is arranged below the needling area.
Further, preferably, the clamp and the clamp body are detachably connected.
Further, preferably, the needling positioning camera assembly includes a substrate positioning camera, an LED positioning camera and a lancet positioning camera disposed on the carrier and located on two sides of the first needling seat.
Further, preferably, the substrate positioning camera, the LED positioning camera, and the lancet positioning camera each have an angle adjusting function.
Further, preferably, the lancet has a needle shaft and a needle, and the needle is detachably connected to the needle shaft.
Further, preferably, an elastic element for limiting the axial displacement of the lancet Z is further provided on the second lancing seat.
Further, preferably, the elastic element is a telescopic spring or an air spring.
Further, as the preference, go up unloader still includes first backup pad and second backup pad, the LED feed bin sets up on the base through first backup pad, the second backup pad is connected with first backup pad and carrier, reloading unit sets up in the second backup pad.
Compared with the prior art, the invention has the following beneficial effects:
The workbench for bearing the target substrate has the X-Y-Z axial adjustment function, and the clamping assembly for bearing the miniature LED also has the X-Y-Z axial adjustment function, and the miniature LED and the target substrate can be finely aligned by combining the needling positioning camera assembly, so that the transfer precision is improved;
the working platform and the clamping assembly have the Z-axis adjusting function, so that the distance between the microminiature LED and the target substrate is adjustable, and the requirements of the pressure and the height under transferring of microminiature LEDs with different sizes can be met;
the positioning camera assembly comprises the substrate positioning camera, the LED positioning camera and the puncture needle positioning camera, and vision auxiliary alignment is carried out through different cameras, so that the positioning precision can be improved, and the transfer precision is improved;
the invention aims at microminiature LED transfer processing of a small-size panel, has compact structure, and can reduce the size of equipment, thereby improving the precision and the utilization rate of the equipment.
Drawings
FIG. 1 is an overall schematic diagram of a small-format LED transfer die bonding apparatus of the present invention;
FIG. 2 is an exploded schematic view of a small-format LED transfer die bonding apparatus of the present invention;
FIG. 3 is an enlarged schematic view of a working platform of a small-format LED transfer die bonding apparatus of the present invention;
FIG. 4 is an enlarged schematic view of a platform adjustment seat of a small-format LED transfer die bonding apparatus of the present invention;
FIG. 5 is an enlarged schematic view of an adsorption platform of a small-format LED transfer die bonding apparatus of the present invention;
FIG. 6 is an enlarged schematic view of a clamping assembly of a small format LED transfer die bonding apparatus of the present invention;
fig. 7 and 8 are enlarged schematic views of part of the structure of a clamping assembly of a small-format LED transfer die bonding apparatus according to the present invention;
FIG. 9 is an enlarged schematic diagram of a loading and unloading device of a small-format LED transfer die bonding device of the invention;
FIG. 10 is an enlarged schematic view of a needling apparatus of a small-format LED transfer die bonding apparatus of the present invention;
Fig. 11 and fig. 12 are enlarged schematic views of part of the structure of a needling device of a small-format LED transfer die bonding apparatus according to the present invention;
fig. 13 is a schematic diagram of the working principle of a small-format LED transfer die bonding apparatus according to the present invention;
Fig. 14 is a schematic diagram of a visual alignment principle of a small-format LED transfer die bonder according to the present invention;
Reference numerals: 1-base, 2-first horizontal guide rail, 3-mounting notch, 10-working platform, 101-platform adjusting seat, 102-adsorbing platform, 103-first vertical guide rail, 104-adsorbing panel, 11-clamping component, 111-first clamping seat, 112-second clamping seat, 113-LED clamp, 1131-clamp body, 1132-needling zone, 1133-clamp, 1134-micro linear drive motor, 114-supporting base, 115-second horizontal guide rail, 116-second vertical guide rail, 12-loading and unloading device, 121-LED bin, 122-material changing device, 123-first supporting plate, 124-second supporting plate, 125-clamping jaw, 13-needling device, 131-carrier, 132-first needling seat, 133-second needling seat, 134-needling needle, 1341-needle bar, 1342-needle, 135-third horizontal guide rail, 136-needling Z axial guide rail, 137-elastic element, 14-needling positioning component, 141-substrate positioning camera, 142-LED positioning camera.
Detailed Description
The following detailed description of specific embodiments of the invention is, but it should be understood that the invention is not limited to specific embodiments.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
As shown in fig. 1 and fig. 2, a small-format LED transferring die bonding device is used for transferring a micro LED to a target substrate, and comprises a base 1, wherein a working platform 10 for bearing the target substrate, a clamping assembly 11 for bearing the micro LED, a loading and unloading device 12 for transferring the micro LED to the clamping assembly 11, and a needling device 13 for transferring the micro LED borne by the clamping assembly 11 to the target substrate borne on the working platform 10 are arranged on the base 1;
The working platform 10 and the clamping assembly 11 have the function of adjusting the X-Y-Z axial direction at the same time, and the base 1 is also provided with a needling positioning camera assembly 14.
In this embodiment, as shown in fig. 3 to 5, as a specific solution, the working platform 10 includes a platform adjusting seat 101 disposed on the base 1 and capable of moving in the X-axis direction, and an adsorption platform 102 disposed on the platform adjusting seat 101 and capable of moving in the Y-axis direction, where the adsorption platform 102 has a Z-axis lifting function at the same time;
More specifically, a first horizontal guide rail 2 is arranged on the base 1, and the platform adjusting seat 101 is arranged on the first horizontal guide rail 2, so that the platform adjusting seat 101 can move on the base 1 in the X axial direction, and the platform adjusting seat 101 can control the movement of the platform adjusting seat in the X axial direction on the first horizontal guide rail 2 through a linear driving motor (the linear driving belongs to the prior art and is not marked in the figure); the first vertical guide rail 103 is arranged on the platform adjusting seat 101, the adsorption platform 102 is arranged on the first vertical guide rail 103, so that the adsorption platform 102 can move on the platform adjusting seat 101 in the Y-axis direction, and the same adsorption platform 102 can control the movement of the adsorption platform 102 on the first vertical guide rail 103 in the Y-axis direction through a linear driving motor (the linear driving belongs to the prior art and is not marked in the figure); the adsorption platform 102 is provided with an adsorption panel 104, the adsorption panel 104 can adsorb a target substrate by connecting vacuum, and the movement of the adsorption panel 104 in the Z-axis direction can be controlled by arranging a linear driving motor at the bottom of the adsorption panel 104 (the same linear driving belongs to the prior art, and redundant description is omitted here).
In this embodiment, as shown in fig. 6 to 8, the clamping assembly 11 includes a first clamping seat 111 disposed on the base 1 and capable of lifting in the Z-axis direction, a second clamping seat 112 disposed on the first clamping seat 111 and capable of moving in the X-axis direction, and an LED fixture 113 disposed on the second clamping seat 112 and capable of moving in the Y-axis direction;
More specifically, a mounting notch 3 is left on the base 1, a Z-axis guide rail (not shown in the figure) is arranged at the mounting notch 3, the first clamping seat 111 is arranged at the mounting notch 3 and is positioned on the Z-axis guide rail, and the first clamping seat 111 is controlled to move along the Z-axis guide rail at the mounting notch 3 by a linear driving motor (the linear driving belongs to the prior art and is not shown in the figure); a supporting base 114 is arranged at the top of the first clamping seat 111, a second horizontal guide rail 115 is arranged on the supporting base 114, and the second clamping seat 112 is arranged on the second horizontal guide rail 115, so that the second clamping seat 112 can move axially on the supporting base 114 in the X direction, and the second clamping seat 112 can control the movement of the second clamping seat in the X direction on the second horizontal guide rail 115 by a linear driving motor (the linear driving belongs to the prior art and is not marked in the drawing); the second vertical guide rail 116 is arranged on the second clamping seat 112, the LED clamp 113 is arranged on the second vertical guide rail 116, so that the LED clamp 113 can move on the second clamping seat 112 in the Y-axis direction, and the LED clamp 113 can also control the movement of the LED clamp on the second vertical guide rail 116 in the Y-axis direction through a linear driving motor (the linear driving belongs to the prior art and is not shown in the figure); whereby the LED fixture 113 is suspended above the suction platform 102.
More specifically, the LED fixture 113 includes a fixture body 1131 disposed on the second clamping seat 112 and capable of moving in the Y-axis direction, a needling area 1132 is disposed on the fixture body 1131, and a fixture 1133 capable of being finely tuned in the Z-axis direction is disposed below the needling area 1132 on the fixture body 1132; similarly, a micro linear driving motor 1134 may be disposed below the clamp body 1131, and the micro linear driving motor 1134 drives the clamp 1133 to finely adjust in the Z-axis direction.
More specifically, the clamp 1133 and the clamp body 1131 are detachably connected; the clamps 1133 of different specifications can be replaced in this way to accommodate different specifications of LED transfers.
In this embodiment, as a specific scheme, as shown in fig. 9, the loading and unloading device 12 includes an LED bin 121 disposed on the base 1, and a material changing device 122 configured to take material from the LED bin 121, where the material changing device 122 is suspended above the base 1;
More specifically, the loading and unloading device 12 further includes a first support plate 123 and a second support plate 124, the LED bin 121 is disposed on the base 1 through the first support plate 123, the second support plate 124 is connected to the first support plate 124, and the material changing device 122 is disposed on the second support plate 124;
More specifically, the LED bin 121 may move in the Z-axis direction on the first support plate 123, the material changer 122 is provided with a retractable clamping jaw 125, and the retractable clamping jaw 125 may extend into the LED bin 121 to clamp the material out, and then move to the lower portion of the retractable clamping jaw 125 by the LED clamp 113 to receive the material.
In this embodiment, as shown in fig. 10-12, the needling apparatus 13 includes a carrier 131 disposed on the base 1, a first needling seat 132 disposed on the carrier 131, a second needling seat 133 disposed on the first needling seat 132 and capable of moving in the X-axis direction, and a lancet 134 disposed on the second needling seat 133 and capable of moving in the Z-axis direction.
More specifically, the first needling seat 132 is provided with a third horizontal guide rail 135, and the second needling seat 133 is disposed on the third horizontal guide rail 135, so that the second needling seat 133 can move axially along the X direction on the first needling seat 132, and the second needling seat 133 can control the movement of the second needling seat along the X direction on the third horizontal guide rail 135 by a linear driving motor (the linear driving is not shown in the figure); the second needling seat 133 is provided with a lancet Z-axial guide 136, and the lancet 134 is disposed on the lancet Z-axial guide 136, so that the lancet 134 can move in the Z-axial direction on the second needling seat 133, so that the lancet 134 can be controlled to move in the Z-axial direction on the lancet Z-axial guide 136 by a linear driving motor (the linear driving is not shown in the drawings).
More specifically, the lancet 134 has a needle 1341 and a needle 1342, the needle 1342 being detachably connected to the needle 1341. This facilitates replacement of the needle 1342, on the one hand, replacement of the appropriate needle according to the transfer of LEDs of different specifications, and on the other hand, maintenance of the needle.
In this embodiment, preferably, the second needling holder 133 is further provided with an elastic member 137 for limiting displacement of the lancet 134 in the Z-axis direction. Thus, the excessive pressing displacement of the puncture needle 134 can be avoided, and a certain limiting and protecting effect can be achieved on the pressing action of the puncture needle; the elastic member 137 may be a telescopic spring or an air spring.
In this embodiment, as a specific solution, the needling positioning camera assembly 14 includes a substrate positioning camera 141, an LED positioning camera 142, and a lancet positioning camera 143 disposed on the base 1 and disposed on the carrier 13 and on both sides of the first needling stand 132;
More specifically, the lancet positioning camera 143 is arranged at the gap of the first horizontal guide rail 2 on the base 1, and the height of the lancet positioning camera 143 is higher than the plane of the base 1 but lower than the base of the platform adjusting seat 101, so that the movement of the platform adjusting seat 101 on the first horizontal guide rail 2 is not influenced, and the platform adjusting seat 101 moves beside the lancet positioning camera 143, so that the visual positioning of a lancet is not influenced (the lancet positioning camera 143 is adjusted to a proper angle during positioning);
More specifically, the substrate positioning camera 141, the LED positioning camera 142, and the lancet positioning camera 143 all have an angle adjusting function.
The working principle of the invention is as follows:
As shown in fig. 1 to 14, the LED to be transferred, which is adhered to the substrate with certain viscosity, is put into the LED bin 121 from the previous process, the LED bin 121 is adjusted to a height suitable for the material changing device 122, and the clamping jaw 125 of the material changing device 122 extends into the LED bin 121 to take out the LED material adhered to the LED to be transferred;
the second clamping seat 112 of the clamping assembly 11 moves along the X axial direction, the LED clamp 113 moves along the Y axial direction, when the LED clamp 113 moves below the clamping jaw 125 of the material changing device 122, the first clamping seat 111 moves along the Z axial direction so that the LED clamp 113 is matched with the material changing device 122 in height, and the clamping jaw stretches out to send the LED material to be transferred to the clamp 1133 of the LED clamp 113 after the material changing device 122 rotates for a certain angle; the clamping assembly 11 repeats the above-described X-Y-Z axial movement such that the needling zone 1132 of the LED fixture 113 is below the lancet 134;
In addition, the clamp 1133 may also fine tune the Z-axis displacement via the micro linear drive motor 1134 to make it more height-fit with the refueling device 122.
The target substrate is sent to the adsorption platform 102 of the working platform 10 from the previous working procedure, the platform adjusting seat 101 moves on the base 1 along the X axial direction, and the adsorption platform 102 moves on the platform adjusting seat 101 along the Y axial direction so as to adjust the adsorption platform 102 to a proper position to bear the target substrate of the previous working procedure; the adsorption platform 102 carrying the target substrate sucks the target substrate tightly under the vacuum action, simultaneously, the target substrate is conveyed to the position right below the LED clamp 113 by repeating the X-Y axial moving process, the adsorption panel 104 moves along the Z axial direction again so as to adjust the height between the target substrate and the LED to be transferred, and the height of the clamp 1133 can be finely adjusted through the micro linear driving motor 1134 so as to enable the height between the target substrate and the LED to be transferred to be more adaptive; when the target substrate and the LEDs to be transferred are in place, the puncture needle 134 is pressed down to enable the LEDs to be transferred to fall off from the substrate adhered with the LEDs and be transferred to the target substrate below, and as the second puncture needle seat 133 of the needling device 13 can move along the X axial direction, the puncture needle 134 can work within the X axial direction, so that a plurality of microminiature LEDs adhered on the substrate are transferred; the elastic element 137 is arranged, so that the force and the displacement of the pressing down of the puncture needle 134 can be limited to a certain extent, and the damage to the LED can be avoided;
In the above process, the moving position of the target substrate may be monitored by the substrate positioning camera 141 in real time, the position of the LED to be transferred may be monitored by the LED positioning camera 142 in real time, and the position of the lancet 134 may be monitored by the lancet positioning camera 143 in real time.
The workbench 10 for bearing the target substrate has the X-Y-Z axial adjustment function, the clamping assembly 11 for bearing the miniature LED also has the X-Y-Z axial adjustment function, and the camera assembly 14 is combined with needling positioning, so that the miniature LED and the target substrate can be aligned finely, and the transfer precision is improved; the working platform and the clamping assembly have the Z-axis adjusting function at the same time, so that the distance between the microminiature LED and the target substrate is adjustable, and the requirements of the pressure and the height under the transfer of microminiature LEDs with different sizes can be met; in addition, the positioning camera assembly comprises a substrate positioning camera, an LED positioning camera and a puncture needle positioning camera, vision auxiliary alignment is carried out through different cameras, and positioning accuracy can be improved, so that transfer accuracy is improved.
The foregoing descriptions of specific exemplary embodiments of the present invention are presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application to thereby enable one skilled in the art to make and utilize the invention in various exemplary embodiments and with various modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (10)
1. The utility model provides a solid brilliant equipment of small breadth LED transfer for transfer microminiature LED to target base plate on, its characterized in that:
The micro-LED packaging machine comprises a base, wherein a working platform for bearing a target substrate, a clamping assembly for bearing a micro-LED, a feeding and discharging device for transmitting the micro-LED to the clamping assembly and a needling device for transferring the micro-LED borne by the clamping assembly to the target substrate borne on the working platform are arranged on the base;
the workbench and the clamping assembly have the X-Y-Z axial adjusting function at the same time, and the base is also provided with a needling positioning camera assembly.
2. The small-format LED transfer die bonding apparatus of claim 1, wherein:
the working platform comprises a platform adjusting seat which is arranged on the base and can move in the X-axis direction and an adsorption platform which is arranged on the platform adjusting seat and can move in the Y-axis direction, and the adsorption platform simultaneously has a Z-axis lifting function;
The clamping assembly comprises a first clamping seat which is arranged on the base and can be lifted in the Z axial direction, a second clamping seat which is arranged on the first clamping seat and can be moved in the X axial direction, and an LED clamp which is arranged on the second clamping seat and can be moved in the Y axial direction;
The LED clamp is suspended above the adsorption platform;
The feeding and discharging device comprises an LED bin arranged on the base and a material changing device for taking and placing materials from the LED bin, and the material changing device is suspended above the base;
the needling device comprises a bearing frame arranged on the base, a first needling seat arranged on the bearing frame, a second needling seat arranged on the first needling seat and capable of moving in the X axial direction, and a needling needle arranged on the second needling seat and capable of moving in the Z axial direction.
3. The small-format LED transfer die bonding apparatus of claim 2, wherein:
The LED clamp comprises a clamp main body which is arranged on the second clamping seat and can move in the Y axial direction, a needling area is formed in the clamp main body, and a clamp which can be finely adjusted in the Z axial direction is arranged below the needling area.
4. A small format LED transfer die bonding apparatus according to claim 3, wherein:
the clamp and the clamp main body are detachably connected.
5. The small-format LED transfer die bonding apparatus of claim 2, wherein:
the needling positioning camera assembly comprises a substrate positioning camera, an LED positioning camera and a needling positioning camera, wherein the substrate positioning camera, the LED positioning camera and the needling positioning camera are arranged on the bearing frame and positioned on two sides of the first needling seat.
6. The small-format LED transfer die bonding apparatus of claim 5, wherein:
the substrate positioning camera, the LED positioning camera and the puncture needle positioning camera all have the angle adjusting function.
7. The small-format LED transfer die bonding apparatus of claim 2, wherein:
The puncture needle is provided with a needle rod and a needle head, and the needle head is detachably connected with the needle rod.
8. The small-format LED transfer die bonding apparatus of claim 2, wherein:
The second needling seat is also provided with an elastic element for limiting the Z axial displacement of the needling needle.
9. The small-format LED transfer die bonding apparatus of claim 8, wherein:
The elastic element is a telescopic spring or an air spring.
10. The small-format LED transfer die bonding apparatus of claim 1, wherein:
The feeding and discharging device further comprises a first supporting plate and a second supporting plate, the LED bin is arranged on the base through the first supporting plate, the second supporting plate is connected with the first supporting plate and the bearing frame, and the material changing device is arranged on the second supporting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410579121.XA CN118431135A (en) | 2024-05-11 | 2024-05-11 | A small-format LED transfer and die bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410579121.XA CN118431135A (en) | 2024-05-11 | 2024-05-11 | A small-format LED transfer and die bonding equipment |
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| CN118431135A true CN118431135A (en) | 2024-08-02 |
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| CN202410579121.XA Pending CN118431135A (en) | 2024-05-11 | 2024-05-11 | A small-format LED transfer and die bonding equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119890094A (en) * | 2025-01-21 | 2025-04-25 | 广州诺顶智能科技有限公司 | Movable material taking platform and die bonder |
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| US20180122673A1 (en) * | 2016-11-03 | 2018-05-03 | Rohinni, LLC | Compliant Needle for Direct Transfer of Semiconductor Devices |
| CN113539935A (en) * | 2021-07-02 | 2021-10-22 | 深圳市卓兴半导体科技有限公司 | Needle-punching type die bonder |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN119890094A (en) * | 2025-01-21 | 2025-04-25 | 广州诺顶智能科技有限公司 | Movable material taking platform and die bonder |
| CN119890094B (en) * | 2025-01-21 | 2025-08-22 | 广州诺顶智能科技有限公司 | A mobile material taking platform and crystal bonding machine |
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