CN118409189A - A hardware testing device for electronic information engineering - Google Patents
A hardware testing device for electronic information engineering Download PDFInfo
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- CN118409189A CN118409189A CN202410573300.2A CN202410573300A CN118409189A CN 118409189 A CN118409189 A CN 118409189A CN 202410573300 A CN202410573300 A CN 202410573300A CN 118409189 A CN118409189 A CN 118409189A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Tests Of Electronic Circuits (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
Description
技术领域Technical Field
本发明涉及硬件检测技术领域,具体说是一种电子信息工程用硬件检测设备。The invention relates to the technical field of hardware detection, in particular to a hardware detection device for electronic information engineering.
背景技术Background technique
电路板是硬件的重要组成部分。在故障排查维修过程中会对电路板进行检测,在检测前,操作人员会将待检测的电路板放置到检测台上表面,并对电路板完成固定后,启动检测设备带动测试端下移并与电路板接触,从而完成电路板的检测过程。Circuit boards are an important part of hardware. During the troubleshooting and maintenance process, the circuit boards will be tested. Before the test, the operator will place the circuit board to be tested on the surface of the test table, and after the circuit board is fixed, the test equipment will be started to drive the test end to move down and contact the circuit board, thus completing the circuit board test process.
故障排查维修的电路板一般都经过一段时间的使用的,使得电路板表面或多或少附着着一些灰尘颗粒,灰尘的存在可能会影响测试端与电路板引脚之间的电气接触,导致信号的传输不畅或接触不良,从而影响检测的准确性和可靠性,即使经过电路板表面的清扫,在电路板转移至检测台表面的过程中也会由于周围人员的操作或走动造成灰尘重新附着,仍会影响检测结果。Circuit boards that are repaired for troubleshooting have generally been used for a period of time, so that some dust particles are more or less attached to the surface of the circuit board. The presence of dust may affect the electrical contact between the test end and the circuit board pins, resulting in poor signal transmission or poor contact, thereby affecting the accuracy and reliability of the test. Even after the surface of the circuit board is cleaned, the dust may re-attach during the process of transferring the circuit board to the surface of the test bench due to the operation or movement of surrounding personnel, which will still affect the test results.
鉴于此,为了克服上述技术问题,本发明提出了一种电子信息工程用硬件检测设备,解决了上述技术问题。In view of this, in order to overcome the above technical problems, the present invention proposes a hardware detection device for electronic information engineering, which solves the above technical problems.
发明内容Summary of the invention
为了弥补现有技术的不足,本发明提出了一种电子信息工程用硬件检测设备,本发明通过在针板外壁套设套筒,从而使得针板带动触针检测电路板前,控制针板在套筒内上下活动,从而使得电路板上的尘埃被吹起后被转移,进而避免电路板上的杂质影响电路板检测的稳定性;相比较现有的电路板在清理灰尘后再进行放置电路板检测而言,本申请避免电路板在转移放置过程中灰尘的重新附着,进而提高检测精度。In order to make up for the shortcomings of the prior art, the present invention proposes a hardware detection device for electronic information engineering. The present invention arranges a sleeve on the outer wall of the needle plate, so that before the needle plate drives the contact needle to detect the circuit board, the needle plate is controlled to move up and down in the sleeve, so that the dust on the circuit board is blown up and then transferred, thereby avoiding the impurities on the circuit board from affecting the stability of the circuit board detection; compared with the existing circuit board that is cleaned of dust and then placed for circuit board detection, the present application avoids the re-adhesion of dust on the circuit board during the transfer and placement process, thereby improving the detection accuracy.
本发明解决其技术问题所采用的技术方案是:本发明所述的一种电子信息工程用硬件检测设备,包括检测台以及所述检测台上方的触针;所述触针固连在针板的下表面;所述检测台下表面固连着支腿;所述检测台上表面位于针板正下方设置有放置槽;所述放置槽用于放置电路板;所述针板上表面中心固连着气缸的输出轴;竖直的所述气缸通过支架固连在检测台上表面;The technical solution adopted by the present invention to solve the technical problem is as follows: the hardware detection equipment for electronic information engineering described in the present invention comprises a detection platform and a stylus on the detection platform; the stylus is fixedly connected to the lower surface of the needle plate; the lower surface of the detection platform is fixedly connected to the legs; the upper surface of the detection platform is provided with a placement groove directly below the needle plate; the placement groove is used to place the circuit board; the center of the upper surface of the needle plate is fixedly connected to the output shaft of the cylinder; the vertical cylinder is fixedly connected to the upper surface of the detection platform through a bracket;
所述针板外壁套设且活动密封连接着套筒;所述套筒的开口朝下;所述套筒的底部与气缸输出轴活动密封连接;所述套筒内底壁与针板上表面之间通过拉簧连接;所述套筒内底壁贯穿设置有单向出气孔;所述针板上下贯穿设置有单向进气孔。The outer wall of the needle plate is sleeved and movably sealed to the sleeve; the opening of the sleeve faces downward; the bottom of the sleeve is movably sealed to the cylinder output shaft; the inner bottom wall of the sleeve and the upper surface of the needle plate are connected by a tension spring; a one-way air outlet is penetrated through the inner bottom wall of the sleeve; and one-way air inlet is penetrated from top to bottom of the needle plate.
优选的,所述套筒内壁以及针板外壁截面均为圆形;所述套筒内壁设置有螺旋槽;所述螺旋槽内活动密封连接着活动块;所述活动块与所述针板外壁固连;所述套筒内壁靠下位置贯穿设置有侧孔;所述侧孔能够随着针板在套筒内壁上下活动过程中绕着套筒中心转动。Preferably, the cross-sections of the inner wall of the sleeve and the outer wall of the needle plate are both circular; the inner wall of the sleeve is provided with a spiral groove; the movable block is connected to the movable seal in the spiral groove; the movable block is fixedly connected to the outer wall of the needle plate; a side hole is provided through the lower position of the inner wall of the sleeve; the side hole can rotate around the center of the sleeve as the needle plate moves up and down on the inner wall of the sleeve.
优选的,所述套筒内底壁同心设置有环形的转槽;所述转槽内转动连接着转环;所述拉簧靠上一端固连在所述转环下表面,靠下一端固连在针板上表面。Preferably, an annular rotating groove is coaxially arranged on the inner bottom wall of the sleeve; a rotating ring is rotatably connected in the rotating groove; the upper end of the tension spring is fixedly connected to the lower surface of the rotating ring, and the lower end is fixedly connected to the upper surface of the needle plate.
优选的,所述检测台上表面设置有环形槽;所述环形槽将放置槽包围,且位于套筒正下方;所述环形槽靠内直径与套筒内径相适应;所述环形槽靠外直径与套筒外径相适应;所述套筒下端口与环形槽活动密封配合。Preferably, an annular groove is provided on the upper surface of the detection table; the annular groove surrounds the placement groove and is located directly below the sleeve; the inner diameter of the annular groove is adapted to the inner diameter of the sleeve; the outer diameter of the annular groove is adapted to the outer diameter of the sleeve; the lower port of the sleeve is movably sealed with the annular groove.
优选的,所述环形槽的槽底为波纹形;所述套筒内外壁靠下位置设置有缺槽;所述缺槽贯穿套筒下端口;所述缺槽靠上内壁设置有回位槽;所述回位槽内滑动连接着回位块;所述侧孔贯穿回位块;所述回位块与缺槽内壁滑动密封连接;所述回位块靠上一端与回位槽槽底之间通过弹簧连接;所述回位块靠下一端受到环形槽的槽底挤压能够上移。Preferably, the bottom of the annular groove is corrugated; a notch is provided at the lower position of the inner and outer walls of the sleeve; the notch passes through the lower port of the sleeve; a return groove is provided on the upper inner wall of the notch; a return block is slidably connected in the return groove; the side hole passes through the return block; the return block is slidably and sealingly connected to the inner wall of the notch; the upper end of the return block is connected to the bottom of the return groove by a spring; the lower end of the return block is squeezed by the bottom of the annular groove and can move upward.
优选的,所述套筒内壁固连着填充囊;所述填充囊由弹性材料制成;所述套筒外壁与填充囊内壁连通设置有通孔;所述通孔孔径大于侧孔孔径。Preferably, the inner wall of the sleeve is fixedly connected to the filling bag; the filling bag is made of elastic material; the outer wall of the sleeve is connected to the inner wall of the filling bag and is provided with a through hole; the aperture of the through hole is larger than the aperture of the side hole.
优选的,所述填充囊沿着螺旋槽的螺旋线设置;所述填充囊内侧在进入气体后呈螺旋式鼓起;所述填充囊在螺旋方向靠上一端延伸至套筒内底壁,靠下一端延伸至套筒下端口;所述套筒内壁与填充囊对应位置设置有避让槽;所述填充囊固连在避让槽内;所述避让槽形状与干瘪后的填充囊相适配;所述避让槽深度与填充囊厚度相适应。Preferably, the filling bag is arranged along the spiral line of the spiral groove; the inner side of the filling bag bulges spirally after the gas enters; the filling bag extends to the inner bottom wall of the sleeve at the upper end in the spiral direction, and extends to the lower port of the sleeve at the lower end; the inner wall of the sleeve and the filling bag are provided with avoidance grooves at positions corresponding to the filling bag; the filling bag is fixedly connected in the avoidance groove; the shape of the avoidance groove is adapted to the filling bag after it is deflated; the depth of the avoidance groove is adapted to the thickness of the filling bag.
优选的,所述通孔数量为多个;多个所述通孔沿着填充囊的螺旋方向设置。Preferably, there are a plurality of through holes, and the plurality of through holes are arranged along the spiral direction of the filling capsule.
本发明的有益效果如下:The beneficial effects of the present invention are as follows:
1.本发明通过在针板外壁套设套筒,从而使得针板带动触针检测电路板前,控制针板在套筒内上下活动,从而使得电路板上的尘埃被吹起后被转移,进而避免电路板上的杂质影响电路板检测的稳定性;相比较现有的电路板在清理灰尘后再进行放置电路板检测而言,本申请避免电路板在转移放置过程中灰尘的重新附着,进而提高检测精度。1. The present invention arranges a sleeve on the outer wall of the needle plate, so that before the needle plate drives the contact needle to detect the circuit board, the needle plate is controlled to move up and down in the sleeve, so that the dust on the circuit board is blown up and then transferred, thereby preventing the impurities on the circuit board from affecting the stability of circuit board detection; compared with the existing circuit board that is cleaned of dust before placing the circuit board for detection, the present application avoids the re-attachment of dust on the circuit board during the transfer and placement process, thereby improving the detection accuracy.
本发明通过套筒带动侧孔周向运动以及活动块带动侧孔上下活动,从而使得外界气体能够沿着侧孔集中且更加范围的对电路板上的元件进行冲击,使得电路板上元件附着的尘埃能够更加彻底的被吹起,并被抽走,更进一步提高后续检测准确性。The present invention drives the side hole to move circumferentially by the sleeve and drives the side hole to move up and down by the movable block, so that the external gas can be concentrated along the side holes and impact the components on the circuit board in a wider range, so that the dust attached to the components on the circuit board can be blown up and removed more thoroughly, and the accuracy of subsequent detection is further improved.
本发明通过针板在套筒内侧上移的过程中带动填充囊螺旋式鼓起,并在套筒带动填充囊转动相配合,使得沿着侧孔冲击到电路板上的浮尘能够在填充囊扰动下自下而上流动,如此使得浮尘更易浮起并更靠近单向进气孔,一方面使得下腔内的电路板浮尘更加彻底的被清理,另一方面降低针板在套筒内上下活动次数,而提高检测效率。The present invention drives the filling bag to spirally bulge when the needle plate moves upward on the inner side of the sleeve, and cooperates with the sleeve to drive the filling bag to rotate, so that the floating dust that impacts the circuit board along the side hole can flow from bottom to top under the disturbance of the filling bag, so that the floating dust is easier to float and closer to the one-way air inlet hole. On the one hand, the floating dust on the circuit board in the lower cavity can be cleaned more thoroughly, and on the other hand, the number of times the needle plate moves up and down in the sleeve is reduced, thereby improving the detection efficiency.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
下面结合附图和实施方式对本发明进一步说明。The present invention is further described below in conjunction with the accompanying drawings and implementation modes.
图1是本发明的立体图;Fig. 1 is a perspective view of the present invention;
图2是图1中A处的放大图;Fig. 2 is an enlarged view of point A in Fig. 1;
图3是本发明环形槽的结构图;FIG3 is a structural diagram of the annular groove of the present invention;
图4是图3中B处的放大图;FIG4 is an enlarged view of point B in FIG3 ;
图5是本发明中支架、气缸以及套筒的立体图;FIG5 is a perspective view of the bracket, cylinder and sleeve in the present invention;
图6是本发明中气缸以及套筒的立体图;FIG6 is a perspective view of a cylinder and a sleeve in the present invention;
图7是本发明中套筒的剖视图;FIG7 is a cross-sectional view of the sleeve of the present invention;
图8是图7中C处的放大图;FIG8 is an enlarged view of point C in FIG7;
图9是图7中D处的放大图;FIG9 is an enlarged view of point D in FIG7;
图10是图9中填充囊膨胀状态图;FIG10 is a diagram showing the expanded state of the filling sac in FIG9;
图11是本发明活动块与针板的连接立体图。11 is a three-dimensional diagram of the connection between the movable block and the needle plate of the present invention.
图中:检测台1、支腿11、放置槽12、环形槽13、针板2、触针21、气缸22、支架23、单向进气孔24、活动块25、套筒3、拉簧31、单向出气孔32、螺旋槽33、转槽34、转环35、缺槽36、回位槽37、通孔38、避让槽39、回位块4、侧孔41、弹簧42、填充囊5。In the figure: testing table 1, supporting leg 11, placement groove 12, annular groove 13, needle plate 2, contact pin 21, cylinder 22, bracket 23, one-way air inlet 24, movable block 25, sleeve 3, tension spring 31, one-way air outlet 32, spiral groove 33, rotating groove 34, swivel 35, missing groove 36, return groove 37, through hole 38, avoidance groove 39, return block 4, side hole 41, spring 42, filling bag 5.
具体实施方式Detailed ways
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体实施方式,进一步阐述本发明。In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.
如图1至图11所示,本发明包括以下实施例:As shown in Figures 1 to 11, the present invention includes the following embodiments:
实施例1:Embodiment 1:
一种电子信息工程用硬件检测设备,包括检测台1以及所述检测台1上方的触针21;所述触针21固连在针板2的下表面;所述检测台1下表面固连着支腿11;所述检测台1上表面位于针板2正下方设置有放置槽12;所述放置槽12用于放置电路板;所述针板2上表面中心固连着气缸22的输出轴;竖直的所述气缸22通过支架23固连在检测台1上表面;A hardware testing device for electronic information engineering, comprising a testing platform 1 and a stylus 21 above the testing platform 1; the stylus 21 is fixedly connected to the lower surface of a needle plate 2; the lower surface of the testing platform 1 is fixedly connected to a leg 11; a placement groove 12 is provided on the upper surface of the testing platform 1 directly below the needle plate 2; the placement groove 12 is used to place a circuit board; the center of the upper surface of the needle plate 2 is fixedly connected to the output shaft of a cylinder 22; the vertical cylinder 22 is fixedly connected to the upper surface of the testing platform 1 through a bracket 23;
所述针板2外壁套设且活动密封连接着套筒3;所述套筒3的开口朝下;所述套筒3的底部与气缸22输出轴活动密封连接;所述套筒3内底壁与针板2上表面之间通过拉簧31连接;所述套筒3内底壁贯穿设置有单向出气孔32;所述针板2上下贯穿设置有单向进气孔24。The outer wall of the needle plate 2 is sleeved and movably sealed with the sleeve 3; the opening of the sleeve 3 faces downward; the bottom of the sleeve 3 is movably sealed and connected to the output shaft of the cylinder 22; the inner bottom wall of the sleeve 3 and the upper surface of the needle plate 2 are connected by a tension spring 31; a one-way air outlet 32 is penetrated through the inner bottom wall of the sleeve 3; and the needle plate 2 is penetrated with a one-way air inlet 24 from top to bottom.
工作时,故障排查维修的电路板一般都经过一段时间的使用的,使得电路板表面或多或少附着着一些灰尘颗粒,灰尘的存在可能会影响测试端与电路板引脚之间的电气接触,导致信号的传输不畅或接触不良,从而影响检测的准确性和可靠性,即使经过电路板表面的清扫,在电路板转移至检测台1表面的过程中也会由于周围人员的操作或走动造成灰尘重新附着,仍会影响检测结果;During operation, the circuit boards to be repaired and troubleshooted have generally been used for a period of time, so that some dust particles are more or less attached to the surface of the circuit boards. The presence of dust may affect the electrical contact between the test end and the pins of the circuit boards, resulting in poor signal transmission or poor contact, thereby affecting the accuracy and reliability of the test. Even after the surface of the circuit boards is cleaned, the dust may reattach due to the operation or movement of surrounding personnel during the process of transferring the circuit boards to the surface of the test table 1, which will still affect the test results.
因此本发明检测人员在需要进行硬件,例如硬件中的电路板进行检测的情况下,会将电路板放置到放置槽12内,并在调整好触针21的位置后,启动控制器控制检测设备工作,检测设备会带动气缸22伸长,气缸22会带动针板2下移,针板2会通过拉簧31带动套筒3下移,套筒3的下端开口大于放置槽12以及电路板的规格,如此随着针板2以及套筒3的下移,套筒3会将电路板以及放置槽12罩住,套筒3下端口会与检测台1上表面接触,使得套筒3下端口无法继续下移,随着气缸22继续伸长,气缸22输出轴会带动针板2在套筒3内侧下移,针板2将套筒3内部空间分隔成靠上位置的上腔以及靠下位置的下腔,上腔在针板2下移过程中增大,下腔在针板2下移过程中减小,上腔空间增大过程中会形成负压,从而使得下腔内的气体会在负压作用下沿着单向进气孔24进入上腔,下腔内的气体进入上腔的过程中会带动电路板上附着的灰尘流动,使得电路板上的灰尘被带走,气缸22伸长带动针板2下移过程中,针板2会拉扯拉簧31,从而使得拉簧31将拉力传递至套筒3,使得套筒3下端口牢牢抵在检测台1上表面,而为了进一步对电路板上附着的灰尘进行吸附,气缸22会在拉簧31保持被拉扯的状态下控制针板2上移,使得上腔的空间变小,上腔内的气体受到挤压会沿着单向出气孔32排出,注意的是,为了避免单向出气孔32出气的气体重新回到电路板上,会将单向出气孔32的上孔口连接着气管,将气管另一端放置到远离检测台1的位置,或者将气管另一端连接着净化组件,在针板2上移过程中,外界气体会沿着套筒3下端口与检测台1上表面之间的缝隙进入至套筒3内侧,并对放置槽12内的电路板进行冲击,从而使得电路板上的杂质飘起,随着气缸22带动针板2再次下移,上腔的空间变大再次形成负压,下腔内浮起的尘埃会随着单向进气孔24进入至上腔内,如此反复控制针板2上下活动,实现对电路板的清理,针板2的上移和下移实现对电路板上附着灰尘清理的过程中,触针21与电路板是具有一定距离的,在最后一次针板2下移的过程中,针板2会带动触针21与电路板的触点接触,完成硬件也就是电路板的检测过程;在完成电路板的检测后,气缸22会上移带动针板2以及套筒3上移,使得放置槽12内的电路板露出,拉簧31会拉动套筒3在针板2外壁上活动,使得上腔空间被压缩,操作人员将放置槽12内的电路板取下即可;Therefore, when the inspection personnel of the present invention need to inspect hardware, such as the circuit board in the hardware, they will place the circuit board into the placement groove 12, and after adjusting the position of the contact pin 21, start the controller to control the inspection equipment to work, and the inspection equipment will drive the cylinder 22 to extend, and the cylinder 22 will drive the needle plate 2 to move downward, and the needle plate 2 will drive the sleeve 3 to move downward through the tension spring 31, and the lower end opening of the sleeve 3 is larger than the specifications of the placement groove 12 and the circuit board. In this way, as the needle plate 2 and the sleeve 3 move downward, the sleeve 3 will cover the circuit board and the placement groove 12, and the lower end of the sleeve 3 will contact the upper surface of the inspection table 1, so that the lower end of the sleeve 3 cannot continue to move downward, and as the cylinder 22 continues to extend, the output shaft of the cylinder 22 will drive the needle plate 2 in the sleeve 3 The inner side moves downward, and the needle plate 2 divides the internal space of the sleeve 3 into an upper chamber at the upper position and a lower chamber at the lower position. The upper chamber increases in size during the downward movement of the needle plate 2, and the lower chamber decreases in size during the downward movement of the needle plate 2. Negative pressure is formed in the process of increasing the space of the upper chamber, so that the gas in the lower chamber enters the upper chamber along the one-way air inlet hole 24 under the action of the negative pressure. In the process of the gas in the lower chamber entering the upper chamber, the dust attached to the circuit board is driven to flow, so that the dust on the circuit board is taken away. In the process of the cylinder 22 extending to drive the needle plate 2 to move downward, the needle plate 2 will pull the tension spring 31, so that the tension spring 31 transmits the tension to the sleeve 3, so that the lower end of the sleeve 3 is firmly against the upper surface of the detection table 1, and in order to further adsorb the dust attached to the circuit board, the cylinder 22 The needle plate 2 will be controlled to move upward while the tension spring 31 remains pulled, so that the space in the upper cavity becomes smaller, and the gas in the upper cavity is squeezed and discharged along the one-way air outlet 32. It should be noted that in order to prevent the gas discharged from the one-way air outlet 32 from returning to the circuit board, the upper hole of the one-way air outlet 32 will be connected to the air pipe, and the other end of the air pipe will be placed at a position far away from the detection table 1, or the other end of the air pipe will be connected to the purification component. During the upward movement of the needle plate 2, the external gas will enter the inner side of the sleeve 3 along the gap between the lower end of the sleeve 3 and the upper surface of the detection table 1, and impact the circuit board in the placement groove 12, so that the impurities on the circuit board float up, and as the cylinder 22 drives the needle plate 2 to move downward again, the space in the upper cavity becomes larger and forms again. Negative pressure, dust floating in the lower chamber will enter the upper chamber through the one-way air inlet 24, and the needle plate 2 will be repeatedly controlled to move up and down to clean the circuit board. In the process of cleaning the dust attached to the circuit board by moving the needle plate 2 up and down, the contact pin 21 is at a certain distance from the circuit board. During the last downward movement of the needle plate 2, the needle plate 2 will drive the contact pin 21 to contact the contact point of the circuit board, completing the hardware, that is, the circuit board detection process; after completing the circuit board detection, the cylinder 22 will move up to drive the needle plate 2 and the sleeve 3 to move up, so that the circuit board in the placement slot 12 is exposed, and the tension spring 31 will pull the sleeve 3 to move on the outer wall of the needle plate 2, so that the space in the upper chamber is compressed, and the operator can remove the circuit board in the placement slot 12;
本发明通过在针板2外壁套设套筒3,从而使得针板2带动触针21检测电路板前,控制针板2在套筒3内上下活动,从而使得电路板上的尘埃被吹起后被转移,进而避免电路板上的杂质影响电路板检测的稳定性;相比较现有的电路板在清理灰尘后再进行放置电路板检测而言,本申请避免电路板在转移放置过程中灰尘的重新附着,进而提高检测精度。The present invention arranges a sleeve 3 on the outer wall of the needle plate 2, so that before the needle plate 2 drives the contact pin 21 to detect the circuit board, the needle plate 2 is controlled to move up and down in the sleeve 3, so that the dust on the circuit board is blown up and then transferred, thereby preventing the impurities on the circuit board from affecting the stability of the circuit board detection; compared with the existing circuit board that is cleaned of dust before placing the circuit board for detection, the present application avoids the re-attachment of dust on the circuit board during the transfer and placement process, thereby improving the detection accuracy.
实施例2:Embodiment 2:
所述套筒3内壁以及针板2外壁截面均为圆形;所述套筒3内壁设置有螺旋槽33;所述螺旋槽33内活动密封连接着活动块25;所述活动块25与所述针板2外壁固连;所述套筒3内壁靠下位置贯穿设置有侧孔41;所述侧孔41能够随着针板2在套筒3内壁上下活动过程中绕着套筒3中心转动。The cross-sections of the inner wall of the sleeve 3 and the outer wall of the needle plate 2 are both circular; a spiral groove 33 is provided on the inner wall of the sleeve 3; a movable block 25 is movably sealed in the spiral groove 33; the movable block 25 is fixedly connected to the outer wall of the needle plate 2; a side hole 41 is provided through the lower position of the inner wall of the sleeve 3; the side hole 41 can rotate around the center of the sleeve 3 as the needle plate 2 moves up and down on the inner wall of the sleeve 3.
本实施例中,所述套筒3内底壁同心设置有环形的转槽34;所述转槽34内转动连接着转环35;所述拉簧31靠上一端固连在所述转环35下表面,靠下一端固连在针板2上表面。In this embodiment, the inner bottom wall of the sleeve 3 is concentrically provided with an annular rotation groove 34; a rotating ring 35 is rotatably connected in the rotation groove 34; the upper end of the tension spring 31 is fixedly connected to the lower surface of the rotating ring 35, and the lower end is fixedly connected to the upper surface of the needle plate 2.
本实施例中,所述检测台1上表面设置有环形槽13;所述环形槽13将放置槽12包围,且位于套筒3正下方;所述环形槽13靠内直径与套筒3内径相适应;所述环形槽13靠外直径与套筒3外径相适应;所述套筒3下端口与环形槽13活动密封配合。In this embodiment, an annular groove 13 is provided on the upper surface of the detection platform 1; the annular groove 13 surrounds the placement groove 12 and is located directly below the sleeve 3; the inner diameter of the annular groove 13 is adapted to the inner diameter of the sleeve 3; the outer diameter of the annular groove 13 is adapted to the outer diameter of the sleeve 3; the lower port of the sleeve 3 is movably sealed with the annular groove 13.
本实施例中,所述环形槽13的槽底为波纹形;所述套筒3内外壁靠下位置设置有缺槽36;所述缺槽36贯穿套筒3下端口;所述缺槽36靠上内壁设置有回位槽37;所述回位槽37内滑动连接着回位块4;所述侧孔41贯穿回位块4;所述回位块4与缺槽36内壁滑动密封连接;所述回位块4靠上一端与回位槽37槽底之间通过弹簧42连接;所述回位块4靠下一端受到环形槽13的槽底挤压能够上移。In this embodiment, the bottom of the annular groove 13 is corrugated; a notch 36 is provided at the lower position of the inner and outer walls of the sleeve 3; the notch 36 passes through the lower port of the sleeve 3; a return groove 37 is provided on the upper inner wall of the notch 36; the return block 4 is slidably connected to the return groove 37; the side hole 41 passes through the return block 4; the return block 4 is slidably and sealedly connected to the inner wall of the notch 36; the upper end of the return block 4 is connected to the bottom of the return groove 37 by a spring 42; the lower end of the return block 4 is squeezed by the bottom of the annular groove 13 and can move upward.
工作时,在电路板放置到放置槽12内后,控制器控制器气缸22伸长带动针板2以及套筒3下移,套筒3下端口在下移过程中会进入环形槽13内,由于套筒3下端口与环形槽13活动密封配合,使得套筒3下端口进一步被密封,随着针板2持续下移,针板2会带动外壁的活动块25下移,活动块25下移过程中会在螺旋槽33内活动,从而使得套筒3在活动块25与螺旋槽33的配合下进行转动,由于拉簧31靠上一端固连在转环35下表面,靠下一端固连着针板2上表面,故拉簧31的设置并不会影响套筒3的转动,使得套筒3能够顺利转动,套筒3下端口也在环形槽13内顺利转动,下腔的气体会沿着单向进气孔24进入上腔,随后气缸22会带动针板2上移,上移的针板2会在套筒3受到朝下拉簧31拉力情况下在套筒3内侧活动,针板2上移过程中会再次带动活动块25在螺旋槽33内活动,从而使得套筒3反向转动,上腔内的气体被针板2上移而挤走,下腔内的空间在针板2上移过程中形成负压,套筒3下端口与环形槽13活动密封配合,故外界气体会沿着侧孔41更加集中进入下腔,提高气体进入下腔的冲击力,侧孔41随着套筒3的转动而转动,从而改变侧孔41的进气方向,使得外界气体沿着侧孔41在不同方向上进入下腔,使得电路板在不同方向上都能够集中进行气流冲击,提高气流冲击范围和效果,使得电路板上的杂质更加彻底的被吹起来,另外由于环形槽13的槽底为波纹状,弹簧42会给于回位块4一个朝下的力,使得回位块4靠下一端在弹簧42作用下抵在环形槽13槽底位置,随着套筒3下端口与环形槽13产生相对转动,使得回位块4靠下一端与环形槽13槽底抵接的位置发生改变,如此在回位块4靠下一端抵在环形槽13槽底的波谷到波峰阶段下,环形槽13槽底会挤压回位块4上移,若回位块4靠下一端抵在环形槽13槽底波峰到波谷阶段下,弹簧42会带动回位块4下移,随着套筒3的转动,回位块4会在缺槽36内上下活动,侧孔41也会随着回位块4上下活动的同时随之运动,如此改变侧孔41充入下腔内侧气体的高度,如此能够针对电路板上不同高度元件进行冲击,使得电路板上的灰尘被冲击的更加彻底;随着针板2的再次下移,下腔内浮起的灰尘随着气流沿着单向进气孔24进入上腔,如此反复,使得电路板上附着的灰尘在吹起后被彻底抽走,更进一步提高后续检测准确性;During operation, after the circuit board is placed in the placement groove 12, the controller cylinder 22 extends to drive the needle plate 2 and the sleeve 3 to move downward, and the lower end of the sleeve 3 will enter the annular groove 13 during the downward movement. Since the lower end of the sleeve 3 and the annular groove 13 are movably sealed, the lower end of the sleeve 3 is further sealed. As the needle plate 2 continues to move downward, the needle plate 2 will drive the movable block 25 of the outer wall to move downward. During the downward movement of the movable block 25, it will move in the spiral groove 33, so that the sleeve 3 rotates under the cooperation of the movable block 25 and the spiral groove 33. Since the upper end of the tension spring 31 is fixedly connected to the lower surface of the swivel 35, and the lower end is fixedly connected to the upper surface of the needle plate 2, the setting of the tension spring 31 does not affect the rotation of the sleeve 3, so that the sleeve 3 The sleeve 3 can rotate smoothly, and the lower port of the sleeve 3 also rotates smoothly in the annular groove 13. The gas in the lower chamber will enter the upper chamber along the one-way air inlet 24, and then the cylinder 22 will drive the needle plate 2 to move upward. The upward needle plate 2 will move inside the sleeve 3 when the sleeve 3 is pulled by the downward tension spring 31. During the upward movement of the needle plate 2, the movable block 25 will be driven to move in the spiral groove 33 again, so that the sleeve 3 rotates in the opposite direction, and the gas in the upper chamber is squeezed away by the upward movement of the needle plate 2. The space in the lower chamber forms a negative pressure during the upward movement of the needle plate 2. The lower port of the sleeve 3 is movably sealed with the annular groove 13, so the external gas will enter the lower chamber more concentratedly along the side hole 41, thereby increasing the impact force of the gas entering the lower chamber. The side hole 41 rotates with the rotation of the sleeve 3. Thereby changing the air intake direction of the side hole 41, allowing the external air to enter the lower cavity along the side hole 41 in different directions, so that the circuit board can be concentratedly impacted by airflow in different directions, thereby improving the airflow impact range and effect, and making the impurities on the circuit board be blown up more thoroughly. In addition, since the bottom of the annular groove 13 is corrugated, the spring 42 will give a downward force to the return block 4, so that the lower end of the return block 4 is against the bottom of the annular groove 13 under the action of the spring 42. As the lower end of the sleeve 3 and the annular groove 13 rotate relative to each other, the position where the lower end of the return block 4 abuts against the bottom of the annular groove 13 changes. In this way, when the lower end of the return block 4 abuts against the bottom of the annular groove 13 at the trough to peak stage, the annular groove 1 The bottom of the groove 3 will squeeze the return block 4 to move upward. If the return block 4 is against the bottom of the annular groove 13 at the stage from the peak to the trough, the spring 42 will drive the return block 4 to move downward. As the sleeve 3 rotates, the return block 4 will move up and down in the missing groove 36, and the side hole 41 will also move with the return block 4 while moving up and down, thus changing the height of the gas filled into the lower cavity by the side hole 41, so that components of different heights on the circuit board can be impacted, so that the dust on the circuit board is impacted more thoroughly; as the needle plate 2 moves downward again, the dust floating in the lower cavity follows the air flow along the one-way air inlet 24 into the upper cavity, and this is repeated, so that the dust attached to the circuit board is completely sucked away after being blown up, further improving the accuracy of subsequent detection;
本发明通过套筒3带动侧孔41周向运动以及活动块25带动侧孔41上下活动,从而使得外界气体能够沿着侧孔41集中且更加范围的对电路板上的元件进行冲击,使得电路板上元件附着的尘埃能够更加彻底的被吹起,并被抽走,更进一步提高后续检测准确性。The present invention drives the side hole 41 to move circumferentially by the sleeve 3 and drives the side hole 41 to move up and down by the movable block 25, so that the external gas can be concentrated along the side hole 41 and impact the components on the circuit board in a wider range, so that the dust attached to the components on the circuit board can be blown up more thoroughly and removed, further improving the accuracy of subsequent detection.
实施例3:Embodiment 3:
所述套筒3内壁固连着填充囊5;所述填充囊5由弹性材料制成;所述套筒3外壁与填充囊5内壁连通设置有通孔38;所述通孔38孔径大于侧孔41孔径。The inner wall of the sleeve 3 is fixedly connected to the filling bag 5; the filling bag 5 is made of elastic material; the outer wall of the sleeve 3 is connected to the inner wall of the filling bag 5 and a through hole 38 is provided; the aperture of the through hole 38 is larger than the aperture of the side hole 41.
本实施例中,所述填充囊5沿着螺旋槽33的螺旋线设置;所述填充囊5内侧在进入气体后呈螺旋式鼓起;所述填充囊5在螺旋方向靠上一端延伸至套筒3内底壁,靠下一端延伸至套筒3下端口;所述套筒3内壁与填充囊5对应位置设置有避让槽39;所述填充囊5固连在避让槽39内;所述避让槽39形状与干瘪后的填充囊5相适配;所述避让槽39深度与填充囊5厚度相适应。In this embodiment, the filling bag 5 is arranged along the spiral line of the spiral groove 33; the inner side of the filling bag 5 bulges in a spiral manner after the gas enters; the filling bag 5 extends to the inner bottom wall of the sleeve 3 at the upper end in the spiral direction, and extends to the lower end of the sleeve 3; an avoidance groove 39 is provided at a position corresponding to the inner wall of the sleeve 3 and the filling bag 5; the filling bag 5 is fixedly connected in the avoidance groove 39; the shape of the avoidance groove 39 is adapted to the filling bag 5 after it is deflated; the depth of the avoidance groove 39 is adapted to the thickness of the filling bag 5.
本实施例中,所述通孔38数量为多个;多个所述通孔38沿着填充囊5的螺旋方向设置。In this embodiment, there are multiple through holes 38 ; the multiple through holes 38 are arranged along the spiral direction of the filling capsule 5 .
工作时,套筒3下端口在拉簧31作用下抵在环形槽13内的过程中,气缸22会带动针板2在套筒3内侧上移,从而使得上腔气体受压沿着单向出气孔32排出,下腔空间变大形成负压,通孔38孔径大于侧孔41孔径,外界气体沿着通孔38进入填充囊5的速度高于外界气体沿着侧孔41进入下腔的速度,如此使得填充囊5在针板2上移过程中能够顺利鼓起,另外,由于通孔38数量为多个,多个通孔38沿着填充囊5螺旋方向设置,故随着针板2的上移,使得外界气体能够沿着更多的通孔38进入填充囊5,使得填充囊5快速鼓起,注意的是填充囊5鼓起的程度有限,并不会对电路板上表面的元件造成干涉,填充囊5沿着螺旋槽33的螺旋线方向设置,使得填充囊5会进行螺旋式鼓起,鼓起的填充囊5会随着套筒3的转动而在套筒3内侧活动,螺旋式的填充囊5可以理解为螺旋挤出机的绞龙,鼓起的填充囊5能够对套筒3内侧的气体自下而上进行扰动,外界气体沿着侧孔41进入下腔对电路板进行冲击形成的浮尘会随着填充囊5的扰动而上移运动,使得浮尘更易浮起并更靠近单向进气孔24,随着针板2的下移,针板2会挤压鼓起的填充囊5,填充囊5内侧气体被挤压后沿着通孔38排出,填充囊5厚度与避让槽39厚度相适应,且填充囊5干瘪后置于避让槽39内,使得填充囊5干瘪后能够一方面对避让槽39与针板2外壁之间的间隙进行填充,另一方面气体难以越过针板2朝着针板2上方的填充囊5部分流动,使得填充囊5被针板2越过的部分保持干瘪,使得填充囊5内部气体沿着通孔38被挤出,下移的针板2会使得上腔形成负压,使得下腔内浮起的尘埃随着气流快速沿着单向进气孔24进入上腔;干瘪后的填充囊5也不会影响后续触针21的检测;During operation, when the lower end of the sleeve 3 is pressed against the annular groove 13 by the tension spring 31, the cylinder 22 drives the needle plate 2 to move upward inside the sleeve 3, so that the gas in the upper chamber is pressurized and discharged along the one-way air outlet 32, and the space in the lower chamber becomes larger to form a negative pressure. The aperture of the through hole 38 is larger than the aperture of the side hole 41, and the speed at which the external gas enters the filling bag 5 along the through hole 38 is higher than the speed at which the external gas enters the lower chamber along the side hole 41, so that the filling bag 5 can be smoothly inflated during the upward movement of the needle plate 2. In addition, since there are multiple through holes 38 , multiple through holes 38 are arranged along the spiral direction of the filling capsule 5, so as the needle plate 2 moves upward, the external gas can enter the filling capsule 5 along more through holes 38, so that the filling capsule 5 swells quickly. It should be noted that the degree of swelling of the filling capsule 5 is limited and will not interfere with the components on the upper surface of the circuit board. The filling capsule 5 is arranged along the spiral line direction of the spiral groove 33, so that the filling capsule 5 will swell in a spiral manner. The swollen filling capsule 5 will move inside the sleeve 3 as the sleeve 3 rotates. The spiral filling capsule 5 can be understood as a spiral The auger of the extruder and the bulging filling capsule 5 can disturb the gas inside the sleeve 3 from bottom to top. The floating dust formed by the external gas entering the lower cavity along the side hole 41 and impacting the circuit board will move upward with the disturbance of the filling capsule 5, making the floating dust easier to float and closer to the one-way air inlet 24. As the needle plate 2 moves downward, the needle plate 2 will squeeze the bulging filling capsule 5, and the gas inside the filling capsule 5 will be discharged along the through hole 38 after being squeezed. The thickness of the filling capsule 5 is adapted to the thickness of the avoidance groove 39, and the filling capsule 5 is placed in the avoidance groove 39 after being deflated. , so that the filling capsule 5 can fill the gap between the avoidance groove 39 and the outer wall of the needle plate 2 after it is deflated, and on the other hand, it is difficult for the gas to pass through the needle plate 2 and flow toward the part of the filling capsule 5 above the needle plate 2, so that the part of the filling capsule 5 passed by the needle plate 2 remains deflated, so that the gas inside the filling capsule 5 is squeezed out along the through hole 38, and the downward moving needle plate 2 will form a negative pressure in the upper cavity, so that the dust floating in the lower cavity quickly enters the upper cavity along the one-way air inlet 24 with the air flow; the deflated filling capsule 5 will not affect the subsequent detection of the stylus 21;
本发明通过针板2在套筒3内侧上移的过程中带动填充囊5螺旋式鼓起,并在套筒3带动填充囊5转动相配合,使得沿着侧孔41冲击到电路板上的浮尘能够在填充囊5扰动下自下而上流动,如此使得浮尘更易浮起并更靠近单向进气孔24,一方面使得下腔内的电路板浮尘更加彻底的被清理,另一方面降低针板2在套筒3内上下活动次数,而提高检测效率。The present invention drives the filling capsule 5 to spirally bulge during the process of the needle plate 2 moving upward on the inner side of the sleeve 3, and cooperates with the sleeve 3 to drive the filling capsule 5 to rotate, so that the floating dust that impacts the circuit board along the side hole 41 can flow from bottom to top under the disturbance of the filling capsule 5, so that the floating dust is easier to float and closer to the one-way air inlet 24. On the one hand, the floating dust on the circuit board in the lower cavity is cleaned more thoroughly, and on the other hand, the number of times the needle plate 2 moves up and down in the sleeve 3 is reduced, thereby improving the detection efficiency.
实施例4:Embodiment 4:
所述侧孔41连通着软管;所述软管连接着净化组件,例如过滤件;从单向出气孔32出来的气体沿着气管进入净化组件,净化组件固连在套筒3外壁,随着气体被净化组件净化,净化后的气体会沿着软管进入侧孔41,避免套筒3周围带有浮尘的气体沿着侧孔41进入下腔,避免产生二次污染;侧孔41与软管可拆卸连接,可以选择连接和断开。The side hole 41 is connected to a hose; the hose is connected to a purification component, such as a filter; the gas coming out of the one-way air outlet 32 enters the purification component along the air pipe, and the purification component is fixedly connected to the outer wall of the sleeve 3. As the gas is purified by the purification component, the purified gas will enter the side hole 41 along the hose, preventing the gas with floating dust around the sleeve 3 from entering the lower cavity along the side hole 41, thereby avoiding secondary pollution; the side hole 41 is detachably connected to the hose, and can be connected and disconnected selectively.
在本发明的描述中,需要说明的是,术语“中心”、“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图1所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明保护范围的限制,此外,术语“第一”、“第二”、“第三”等仅用于区分描述,而不能理解为指示或暗示相对重要性。In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in FIG1 , and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present invention; in addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
以上显示和描述了本发明的基本原理、主要特征和优点。本行业的技术人员应该了解,本发明不受上述实施例的限制,上述实施例和说明书中描述的只是说明本发明的原理,在不脱离本发明精神和范围的前提下,本发明还会有各种变化和改进,这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。The basic principles, main features and advantages of the present invention are shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.
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