CN118398528A - Etching machine with spraying device - Google Patents
Etching machine with spraying device Download PDFInfo
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- CN118398528A CN118398528A CN202410659749.0A CN202410659749A CN118398528A CN 118398528 A CN118398528 A CN 118398528A CN 202410659749 A CN202410659749 A CN 202410659749A CN 118398528 A CN118398528 A CN 118398528A
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- 238000005530 etching Methods 0.000 title claims description 24
- 238000005507 spraying Methods 0.000 title abstract description 14
- 230000001681 protective effect Effects 0.000 claims abstract description 25
- 239000007921 spray Substances 0.000 claims description 20
- 239000002904 solvent Substances 0.000 abstract description 17
- 239000013078 crystal Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 7
- 230000003749 cleanliness Effects 0.000 abstract description 4
- 239000000126 substance Substances 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
本发明提供一种具有喷淋装置的刻蚀机,涉及刻蚀机技术领域,包括刻蚀机本体与激光射频模组,所述刻蚀机本体内壁的底端固定安装有底座,所述底座的内部转动安装有套筒,所述套筒的顶端固定安装有顶板,所述套筒的底端固定安装有齿轮环,所述底座的表面滑动安装有防护环,通过让固定块带动防护环向上移动,防护环沿着底座的表面向上滑动,同时在支撑板的顶端向上滑动,固定块拉动伸缩杆的顶端,让伸缩杆向上进行拉伸,通过伸缩杆保证防护环移动的稳定性,通过将防护环向上进行推动,对底座顶端的电路晶板进行限位固定,同时两侧上升凸起的防护环,保证在喷淋的过程中,溶剂不会溅出底座的表面,保证刻蚀机本体内部的整洁。
The present invention provides an etcher with a spraying device, which relates to the technical field of etcher, and comprises an etcher body and a laser radio frequency module, wherein a base is fixedly installed at the bottom end of the inner wall of the etcher body, a sleeve is rotatably installed inside the base, a top plate is fixedly installed at the top end of the sleeve, a gear ring is fixedly installed at the bottom end of the sleeve, a protective ring is slidably installed on the surface of the base, the protective ring is driven to move upward by a fixed block, the protective ring slides upward along the surface of the base, and slides upward on the top end of a support plate at the same time, the fixed block pulls the top end of a telescopic rod to stretch the telescopic rod upward, the stability of the movement of the protective ring is ensured by the telescopic rod, the circuit crystal plate on the top end of the base is limited and fixed by pushing the protective ring upward, and the raised protective rings on both sides ensure that during the spraying process, the solvent will not splash out of the surface of the base, thereby ensuring the cleanliness of the interior of the etcher body.
Description
技术领域Technical Field
本发明属于刻蚀机技术领域,更具体地说,特别涉及一种具有喷淋装置的刻蚀机。The present invention belongs to the technical field of etching machines, and more specifically, particularly relates to an etching machine with a spraying device.
背景技术Background technique
刻蚀是利用化学或者物理的方法将晶圆表面附着的不必要的材质进行去除的过程,刻蚀工艺顺序位于镀膜和光刻之后,即在晶圆上先将用于刻画电路的材料进行薄膜沉积,其上沉积光刻胶,然后根据掩膜版的电路设计,通过光照对晶圆进行光刻,受光刺激的光刻胶留存,其他地方则将需要刻蚀的材料暴露在外,该步骤称作显影。Etching is the process of removing unnecessary materials attached to the surface of the wafer by chemical or physical methods. The etching process sequence is after coating and photolithography. That is, a thin film of the material used to engrave the circuit is first deposited on the wafer, and then photoresist is deposited on it. Then, according to the circuit design of the mask, the wafer is photolithographically exposed to light. The photoresist stimulated by light is retained, and the material to be etched is exposed in other places. This step is called development.
1、在对晶圆板进行刻蚀工艺,需要提前进行镀膜,以及喷涂光刻胶,在刻蚀后,还需要对晶圆板的表面进行化学溶剂的溶解清洁,需要喷淋不同的化学溶剂,通常分为两个步骤进行操作,生产流程较多,同时喷淋装置在设备的内部是固定位置的,对不同大小的晶圆板进行喷淋,容易存在喷淋的死角区域,影响后续的刻蚀加工。1. When etching the wafer, it is necessary to coat the wafer in advance and spray photoresist. After etching, the surface of the wafer needs to be dissolved and cleaned with chemical solvents. Different chemical solvents need to be sprayed. It is usually divided into two steps. There are many production processes. At the same time, the spray device is in a fixed position inside the equipment. When spraying wafers of different sizes, there are prone to dead corners in the spraying, which affects the subsequent etching process.
2、在对晶圆板进行喷淋时,通过喷头直接向晶圆板的顶端喷淋化学溶剂,化学溶剂向下喷溅与晶圆板的表面相互的接触,由于化学溶剂向下喷溅带有一定的加速度,与晶圆板的表面接触,容易导致部分的化学溶剂向外侧飞溅,离开晶圆板的表面,残留到设备的内部,影响设备整洁度的同时,化学溶剂与刻蚀机内部的零部件接触,容易腐蚀零部件,影响零部件的使用寿命。2. When spraying the wafer, the chemical solvent is sprayed directly to the top of the wafer through the nozzle. The chemical solvent splashes downward and contacts the surface of the wafer. Since the chemical solvent splashes downward with a certain acceleration and contacts the surface of the wafer, it is easy for part of the chemical solvent to splash outward, leave the surface of the wafer, and remain inside the equipment, affecting the cleanliness of the equipment. At the same time, the chemical solvent contacts the parts inside the etcher, which is easy to corrode the parts and affect the service life of the parts.
发明内容Summary of the invention
为了解决上述技术问题,本发明提供一种具有喷淋装置的刻蚀机,以解决上述的问题。In order to solve the above technical problems, the present invention provides an etching machine with a spray device to solve the above problems.
一种具有喷淋装置的刻蚀机,包括刻蚀机本体与激光射频模组,所述刻蚀机本体内壁的底端固定安装有底座,所述底座的内部转动安装有套筒,所述套筒的顶端固定安装有顶板,所述套筒的底端固定安装有齿轮环,所述底座的表面滑动安装有防护环,所述防护环的表面固定安装有两个固定块,每个所述固定块的底端均固定安装有两个伸缩杆,所述刻蚀机本体的两个内侧壁均固定安装有固定架,所述固定架的底端均固定安装有支撑板,每个所述固定架的侧端部均转动安装有连接板,每个所述连接板的顶端均固定安装有喷溅模块。An etcher with a spray device comprises an etcher body and a laser radio frequency module, a base is fixedly installed on the bottom end of the inner wall of the etcher body, a sleeve is rotatably installed inside the base, a top plate is fixedly installed on the top of the sleeve, a gear ring is fixedly installed on the bottom end of the sleeve, a protective ring is slidably installed on the surface of the base, two fixed blocks are fixedly installed on the surface of the protective ring, two telescopic rods are fixedly installed on the bottom end of each of the fixed blocks, fixed frames are fixedly installed on the two inner side walls of the etcher body, support plates are fixedly installed on the bottom ends of the fixed frames, connecting plates are rotatably installed on the side ends of each of the fixing frames, and a splashing module is fixedly installed on the top end of each of the connecting plates.
优选的,所述固定架的内部固定安装有两个驱动杆,每个所述驱动杆的顶端均固定安装有第一连接座,每个所述第一连接座的顶端均转动安装有第一推杆,两个所述第一连接座的侧端部均转动安装有同一个第二推杆,所述固定架的内部固定安装有两个连接管,所述支撑板的顶端固定安装有两个固定管。Preferably, two driving rods are fixedly installed inside the fixing frame, a first connecting seat is fixedly installed on the top of each driving rod, a first push rod is rotatably installed on the top of each first connecting seat, the side ends of the two first connecting seats are rotatably installed with the same second push rod, two connecting tubes are fixedly installed inside the fixing frame, and two fixing tubes are fixedly installed on the top of the support plate.
优选的,每个所述固定管的侧端部均滑动安装有调节套,每个所述调节套的底端均转动安装有拉杆,每个所述支撑板的顶端均转动安装有转板,每个所述转板的两个侧端部均滑动安装有定向滑杆,每个所述定向滑杆的末端均固定安装有复位杆,每个所述复位杆的顶端均转动安装有第二连接座,每个所述第二连接座的侧端部均转动安装有第三推杆,每个所述第三推杆的末端均转动安装有齿条,所述底座的底端固定安装有两个引流管。Preferably, an adjustment sleeve is slidably installed on the side end of each fixed tube, a pull rod is rotatably installed on the bottom end of each adjustment sleeve, a rotating plate is rotatably installed on the top end of each support plate, a directional sliding rod is slidably installed on the two side ends of each rotating plate, a reset rod is fixedly installed on the end of each directional sliding rod, a second connecting seat is rotatably installed on the top end of each reset rod, a third push rod is rotatably installed on the side end of each second connecting seat, a rack is rotatably installed on the end of each third push rod, and two drainage tubes are fixedly installed on the bottom end of the base.
与现有技术相比,本发明具有如下有益效果:Compared with the prior art, the present invention has the following beneficial effects:
本发明中,通过推动第一推杆在第一连接座的顶端进行偏转,第一推杆的顶端与连接板的底端转动连接,对连接板的一侧施加推力,让连接板围绕顶端转动偏转,连接板带动喷溅模块向底座的顶端偏转,同时通过控制驱动杆控制第一连接座的移动距离,可以对喷溅模块的喷淋角度进行调节,增加使用的灵活性。In the present invention, the first push rod is pushed to deflect at the top end of the first connecting seat, and the top end of the first push rod is rotatably connected to the bottom end of the connecting plate, and a thrust is applied to one side of the connecting plate to make the connecting plate rotate and deflect around the top end. The connecting plate drives the splash module to deflect toward the top end of the base, and at the same time, the moving distance of the first connecting seat is controlled by controlling the driving rod, so that the spray angle of the splash module can be adjusted to increase the flexibility of use.
本发明中,通过让固定块带动防护环向上移动,防护环沿着底座的表面向上滑动,同时在支撑板的顶端向上滑动,固定块拉动伸缩杆的顶端,让伸缩杆向上进行拉伸,通过伸缩杆保证防护环移动的稳定性,通过将防护环向上进行推动,对底座顶端的电路晶板进行限位固定,同时两侧上升凸起的防护环,保证在喷淋的过程中,溶剂不会溅出底座的表面,保证刻蚀机本体内部的整洁。In the present invention, the fixed block drives the protective ring to move upward, the protective ring slides upward along the surface of the base and at the same time slides upward on the top of the support plate, the fixed block pulls the top of the telescopic rod to stretch the telescopic rod upward, the stability of the movement of the protective ring is ensured by the telescopic rod, and the protective ring is pushed upward to limit and fix the circuit crystal plate on the top of the base. At the same time, the raised protective rings on both sides ensure that the solvent will not splash out of the surface of the base during the spraying process, thereby ensuring the cleanliness of the inside of the etcher body.
本发明中,通过连接管与固定管相互的贯通,让喷溅模块对刻蚀结束的电路晶板表面喷淋清洁溶液,对电路晶板的表面进行清洁,同时清洁溶液通过顶板顶端的凹槽,向留流动,与底座内部开设的另外一个排泄口流出,通过两个排泄口,在喷淋不同的化学溶液时,调整排泄口的闭合,让不同的喷淋废液对应进行回收。In the present invention, the connecting tube and the fixed tube are interconnected, so that the splashing module can spray the cleaning solution on the surface of the circuit crystal board after etching to clean the surface of the circuit crystal board. At the same time, the cleaning solution flows toward the retention through the groove on the top of the top plate and flows out from another drain port opened inside the base. When spraying different chemical solutions through the two drain ports, the closure of the drain ports is adjusted to allow different spray waste liquids to be recovered accordingly.
本发明中,通过将电路晶板放在底座的顶端,通过驱动驱动杆在固定架的内部进行伸缩,驱动杆的顶端带动第一连接座向进行垂直的滑动,第一连接座的顶端与第一推杆的末端转动连接,推动第一推杆在第一连接座的顶端进行偏转,第一推杆的顶端与连接板的底端转动连接,对连接板的一侧施加推力,让连接板围绕顶端转动偏转,连接板带动喷溅模块向底座的顶端偏转,可以让连接板带动喷溅模块向固定架的侧端部偏转,进行收纳,扩大内部空间,便于后期对激光射频模组进行维护。In the present invention, the circuit crystal plate is placed on the top of the base, and the driving rod is driven to extend and retract inside the fixed frame. The top of the driving rod drives the first connecting seat to slide vertically, and the top of the first connecting seat is rotationally connected to the end of the first push rod, which pushes the first push rod to deflect at the top of the first connecting seat. The top of the first push rod is rotationally connected to the bottom end of the connecting plate, and a thrust is applied to one side of the connecting plate to rotate and deflect around the top end. The connecting plate drives the splashing module to deflect toward the top of the base, and the connecting plate can drive the splashing module to deflect toward the side end of the fixed frame for storage, thereby expanding the internal space and facilitating the later maintenance of the laser RF module.
本发明中,通过让转板底端的固定轴正向旋转,带动转板发生偏转,转板的两端相互的反向运动,转板带动拉杆移动,在调节套的底端偏转,让调节套在固定管的侧端部滑动,将调节套内部的阀门打开,同时调节套的运动对第三推杆施加作用力,让第三推杆调动齿条进行水平的滑动,第三推杆带动第二连接座在定向滑杆的侧端部旋转,保证第三推杆紧贴支撑板的外侧滑动,通过第三推杆推动齿条进行滑动,不仅可以控制调节套的闭合,同时控制齿条,驱动套筒旋转。In the present invention, the fixed shaft at the bottom end of the rotating plate is rotated in the forward direction to drive the rotating plate to deflect, and the two ends of the rotating plate move in opposite directions. The rotating plate drives the pull rod to move and deflect at the bottom end of the adjusting sleeve, so that the adjusting sleeve is allowed to slide on the side end of the fixed pipe to open the valve inside the adjusting sleeve. At the same time, the movement of the adjusting sleeve applies a force to the third push rod, so that the third push rod mobilizes the rack to slide horizontally. The third push rod drives the second connecting seat to rotate on the side end of the directional sliding rod to ensure that the third push rod slides closely against the outer side of the support plate. By pushing the rack to slide by the third push rod, not only the closing of the adjusting sleeve can be controlled, but also the rack can be controlled to drive the sleeve to rotate.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明刻蚀机本体结构示意图;FIG1 is a schematic diagram of the structure of the etching machine body of the present invention;
图2是本发明底座结构示意图;FIG2 is a schematic diagram of the base structure of the present invention;
图3是本发明防护环结构示意图;FIG3 is a schematic diagram of the structure of the protection ring of the present invention;
图4是本发明固定架结构示意图;FIG4 is a schematic diagram of the structure of the fixing frame of the present invention;
图5是本发明喷溅模块结构示意图;FIG5 is a schematic diagram of the structure of the splash module of the present invention;
图6是本发明调节套结构示意图。FIG. 6 is a schematic diagram of the structure of the adjustment sleeve of the present invention.
图中,部件名称与附图编号的对应关系为:1、刻蚀机本体;11、激光射频模组;12、底座;13、固定架;14、支撑板;15、齿条;16、第一推杆;17、连接板;18、喷溅模块;21、引流管;22、齿轮环;23、套筒;24、顶板;25、防护环;26、固定块;27、伸缩杆;28、驱动杆;29、第一连接座;31、第二推杆;32、连接管;33、固定管;34、调节套;35、拉杆;36、转板;37、复位杆;38、定向滑杆;39、第二连接座;41、第三推杆。In the figure, the correspondence between the component names and the figure numbers is: 1. etcher body; 11. laser RF module; 12. base; 13. fixing frame; 14. support plate; 15. rack; 16. first push rod; 17. connecting plate; 18. splash module; 21. drainage tube; 22. gear ring; 23. sleeve; 24. top plate; 25. protective ring; 26. fixing block; 27. telescopic rod; 28. driving rod; 29. first connecting seat; 31. second push rod; 32. connecting pipe; 33. fixing pipe; 34. adjusting sleeve; 35. pull rod; 36. rotating plate; 37. reset rod; 38. directional slide rod; 39. second connecting seat; 41. third push rod.
具体实施方式Detailed ways
下面结合附图和实施例对本发明的实施方式作进一步详细描述。以下实施例用于说明本发明,但不能用来限制本发明的范围。The following embodiments of the present invention are described in further detail in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
请参阅图1-图6,本发明提供一种具有喷淋装置的刻蚀机,包括刻蚀机本体1与激光射频模组11,刻蚀机本体1内壁的底端固定安装有底座12,底座12的内部转动安装有套筒23,套筒23带动顶板24在底座12顶端的凹槽内部旋转,让顶板24顶端的凹槽与底座12内部的凹槽对齐,通过固定管33向连接管32内部输出化学溶剂,通过喷溅模块18将化学溶剂喷淋到电路晶板的表面,套筒23的顶端固定安装有顶板24,套筒23的底端固定安装有齿轮环22,底座12的表面滑动安装有防护环25,防护环25的表面固定安装有两个固定块26,每个固定块26的底端均固定安装有两个伸缩杆27,刻蚀机本体1的两个内侧壁均固定安装有固定架13,固定架13的底端均固定安装有支撑板14,每个固定架13的侧端部均转动安装有连接板17,每个连接板17的顶端均固定安装有喷溅模块18。Please refer to Figures 1 to 6. The present invention provides an etcher with a spraying device, including an etcher body 1 and a laser radio frequency module 11. A base 12 is fixedly installed at the bottom end of the inner wall of the etcher body 1. A sleeve 23 is rotatably installed inside the base 12. The sleeve 23 drives a top plate 24 to rotate inside a groove at the top of the base 12, so that the groove at the top of the top plate 24 is aligned with the groove inside the base 12. A chemical solvent is output to the inside of a connecting tube 32 through a fixed tube 33, and the chemical solvent is sprayed onto the surface of a circuit crystal plate through a splashing module 18. The sleeve 23 A top plate 24 is fixedly installed on the top, a gear ring 22 is fixedly installed on the bottom end of the sleeve 23, a protective ring 25 is slidably installed on the surface of the base 12, two fixed blocks 26 are fixedly installed on the surface of the protective ring 25, and two telescopic rods 27 are fixedly installed on the bottom end of each fixed block 26. Fixed frames 13 are fixedly installed on the two inner side walls of the etcher body 1, and support plates 14 are fixedly installed on the bottom ends of the fixed frames 13. A connecting plate 17 is rotatably installed on the side ends of each fixing frame 13, and a splash module 18 is fixedly installed on the top of each connecting plate 17.
固定架13的内部固定安装有两个驱动杆28,每个驱动杆28的顶端均固定安装有第一连接座29,通过继续推动第一连接座29,让第一连接座29向上移动,第一连接座29带动第二推杆31的末端向上进行滑动,让第二推杆31向上移动,对固定块26的顶端施加拉力,让固定块26带动防护环25向上移动,防护环25沿着底座12的表面向上滑动,同时在支撑板14的顶端向上滑动,每个第一连接座29的顶端均转动安装有第一推杆16,两个第一连接座29的侧端部均转动安装有同一个第二推杆31,固定架13的内部固定安装有两个连接管32,支撑板14的顶端固定安装有两个固定管33。Two driving rods 28 are fixedly installed inside the fixed frame 13, and a first connecting seat 29 is fixedly installed on the top of each driving rod 28. By continuing to push the first connecting seat 29, the first connecting seat 29 is moved upward, and the first connecting seat 29 drives the end of the second push rod 31 to slide upward, so that the second push rod 31 moves upward, and a pulling force is applied to the top of the fixed block 26, so that the fixed block 26 drives the protective ring 25 to move upward, and the protective ring 25 slides upward along the surface of the base 12 and slides upward on the top of the support plate 14 at the same time. The top of each first connecting seat 29 is rotatably installed with a first push rod 16, and the side ends of the two first connecting seats 29 are rotatably installed with the same second push rod 31. Two connecting pipes 32 are fixedly installed inside the fixed frame 13, and two fixed pipes 33 are fixedly installed on the top of the support plate 14.
每个固定管33的侧端部均滑动安装有调节套34,每个调节套34的底端均转动安装有拉杆35,每个支撑板14的顶端均转动安装有转板36,每个转板36的两个侧端部均滑动安装有定向滑杆38,让定向滑杆38在转板36的侧端部滑动,同时定向滑杆38带动两个第三推杆41反向的运动复位,第三推杆41的末端拉动齿条15滑动,齿条15与齿轮环22相互的摩擦,导致套筒23在底座12的内部反向旋转,顶板24带动顶端的凹槽与底座12内部另外一个排泄口对齐,每个定向滑杆38的末端均固定安装有复位杆37,每个复位杆37的顶端均转动安装有第二连接座39,每个第二连接座39的侧端部均转动安装有第三推杆41,每个第三推杆41的末端均转动安装有齿条15,底座12的底端固定安装有两个引流管21。The side end of each fixed tube 33 is slidably installed with an adjusting sleeve 34, and the bottom end of each adjusting sleeve 34 is rotatably installed with a pull rod 35. The top end of each support plate 14 is rotatably installed with a rotating plate 36, and the two side ends of each rotating plate 36 are slidably installed with a directional sliding rod 38, so that the directional sliding rod 38 slides on the side end of the rotating plate 36, and at the same time, the directional sliding rod 38 drives the two third push rods 41 to move in the opposite direction to reset, and the end of the third push rod 41 pulls the rack 15 to slide, and the rack 15 and the gear ring 22 rub against each other, causing the sleeve 23 to rotate in the opposite direction inside the base 12, and the top plate 24 drives the groove at the top to align with another discharge port inside the base 12, and the end of each directional sliding rod 38 is fixedly installed with a reset rod 37, and the top end of each reset rod 37 is rotatably installed with a second connecting seat 39, and the side end of each second connecting seat 39 is rotatably installed with a third push rod 41, and the end of each third push rod 41 is rotatably installed with a rack 15, and the bottom end of the base 12 is fixedly installed with two drainage tubes 21.
工作原理:working principle:
第一步,通过将电路晶板放在底座12的顶端,通过驱动驱动杆28在固定架13的内部进行伸缩,驱动杆28的顶端带动第一连接座29向进行垂直的滑动,第一连接座29的顶端与第一推杆16的末端转动连接,推动第一推杆16在第一连接座29的顶端进行偏转,第一推杆16的顶端与连接板17的底端转动连接,对连接板17的一侧施加推力,让连接板17围绕顶端转动偏转,连接板17带动喷溅模块18向底座12的顶端偏转,同时通过控制驱动杆28控制第一连接座29的移动距离,可以对喷溅模块18的喷淋角度进行调节,增加使用的灵活性,通过继续推动第一连接座29,让第一连接座29向上移动,第一连接座29带动第二推杆31的末端向上进行滑动,让第二推杆31向上移动,对固定块26的顶端施加拉力,让固定块26带动防护环25向上移动,防护环25沿着底座12的表面向上滑动,同时在支撑板14的顶端向上滑动,固定块26拉动伸缩杆27的顶端,让伸缩杆27向上进行拉伸,通过伸缩杆27保证防护环25移动的稳定性,通过将防护环25向上进行推动,对底座12顶端的电路晶板进行限位固定。In the first step, the circuit crystal board is placed on the top of the base 12, and the driving rod 28 is driven to extend and retract inside the fixing frame 13. The top of the driving rod 28 drives the first connecting seat 29 to slide vertically. The top of the first connecting seat 29 is rotatably connected to the end of the first push rod 16, and the first push rod 16 is pushed to deflect at the top of the first connecting seat 29. The top of the first push rod 16 is rotatably connected to the bottom end of the connecting plate 17, and a thrust is applied to one side of the connecting plate 17 to rotate and deflect the connecting plate 17 around the top. The connecting plate 17 drives the splash module 18 to deflect toward the top of the base 12. At the same time, the moving distance of the first connecting seat 29 is controlled by controlling the driving rod 28, so that the spray of the splash module 18 can be controlled. The shower angle can be adjusted to increase the flexibility of use. By continuing to push the first connecting seat 29, the first connecting seat 29 is moved upward. The first connecting seat 29 drives the end of the second push rod 31 to slide upward, and the second push rod 31 is moved upward. A pulling force is applied to the top of the fixed block 26, so that the fixed block 26 drives the protective ring 25 to move upward. The protective ring 25 slides upward along the surface of the base 12 and slides upward on the top of the support plate 14. The fixed block 26 pulls the top of the telescopic rod 27 to stretch the telescopic rod 27 upward. The stability of the movement of the protective ring 25 is ensured by the telescopic rod 27. By pushing the protective ring 25 upward, the circuit crystal plate at the top of the base 12 is limited and fixed.
通过电机驱动,让转板36底端的固定轴正向旋转,带动转板36发生偏转,转板36的两端相互的反向运动,转板36带动拉杆35移动,在调节套34的底端偏转,让调节套34在固定管33的侧端部滑动,将调节套34内部的阀门打开,反之,另外一个支撑板14反向运动,同时调节套34的运动对第三推杆41施加作用力,让第三推杆41调动齿条15进行水平的滑动,第三推杆41带动第二连接座39在定向滑杆38的侧端部旋转,保证第三推杆41紧贴支撑板14的外侧滑动,同时定向滑杆38在转板36的侧端部滑动,定向滑杆38拉动复位杆37进行伸缩,通过第三推杆41推动齿条15进行滑动,齿条15的内侧与齿轮环22相互的契合,推动套筒23在底座12的内部进行转动,套筒23带动顶板24在底座12顶端的凹槽内部旋转,让顶板24顶端的凹槽与底座12内部的凹槽对齐,通过固定管33向连接管32内部输出化学溶剂,通过喷溅模块18将化学溶剂喷淋到电路晶板的表面,喷涂一层光刻胶,然后根据掩膜版的电路设计,通过激光射频模组11对电路晶板进行光刻,受光刺激的光刻胶留存,其他地方则将需要刻蚀的材料暴露在外,完成刻蚀的操作,同时在喷淋化学溶剂时,通过两侧上升凸起的防护环25,保证在喷淋的过程中,溶剂不会溅出底座12的表面,保证刻蚀机本体1内部的整洁,同时溶剂在电路晶板的表面流动后,溶剂通过顶板24表面的凹槽向下流通,便于对喷淋产生的废液进行收集回收。The swivel plate 36 is driven by a motor to rotate the fixed shaft at the bottom end of the rotating plate 36 in the positive direction, driving the rotating plate 36 to deflect, and the two ends of the rotating plate 36 move in opposite directions. The rotating plate 36 drives the pull rod 35 to move and deflect at the bottom end of the adjusting sleeve 34, allowing the adjusting sleeve 34 to slide on the side end of the fixed tube 33 to open the valve inside the adjusting sleeve 34. Conversely, the other support plate 14 moves in the opposite direction. At the same time, the movement of the adjusting sleeve 34 applies a force to the third push rod 41, allowing the third push rod 41 to mobilize the rack 15 to slide horizontally. The third push rod 41 drives the second connecting seat 39 to rotate on the side end of the directional slide rod 38 to ensure that the third push rod 41 slides close to the outer side of the support plate 14. At the same time, the directional slide rod 38 slides on the side end of the rotating plate 36. The directional slide rod 38 pulls the reset rod 37 to retract and retract, and the rack 15 is pushed to slide by the third push rod 41. The inner side of the rack 15 fits with the gear ring 22 to push the sleeve 23 The sleeve 23 rotates inside the base 12, and the top plate 24 rotates inside the groove at the top of the base 12, so that the groove at the top of the top plate 24 is aligned with the groove inside the base 12, and the chemical solvent is output to the inside of the connecting tube 32 through the fixed tube 33, and the chemical solvent is sprayed onto the surface of the circuit crystal plate through the splashing module 18, and a layer of photoresist is sprayed. Then, according to the circuit design of the mask plate, the circuit crystal plate is photoetched through the laser radio frequency module 11, and the photoresist stimulated by light is retained. The materials to be etched are exposed in other places to complete the etching operation. At the same time, when spraying the chemical solvent, the protective rings 25 with rising protrusions on both sides are used to ensure that the solvent will not splash out of the surface of the base 12 during the spraying process, thereby ensuring the cleanliness of the inside of the etcher body 1. At the same time, after the solvent flows on the surface of the circuit crystal plate, the solvent flows downward through the groove on the surface of the top plate 24, which is convenient for collecting and recycling the waste liquid generated by the spraying.
第二步,使用时,通过激光射频模组11对底座12顶端的电路晶板进行刻蚀后,通过反向转动转板36,让转板36在支撑板14的顶端反向的转动,转板36偏转,推动两个拉杆35,让拉杆35相互的反向运动,推动两个调节套34在转板36的侧端部相互的反向运动,将其中一个固定管33闭合,另外一个固定管33打开,闭合输出光刻胶的管道,通过另外一个固定管33向连接管32的内部输出清洁溶液,同时转板36带动复位杆37反向运动,让定向滑杆38在转板36的侧端部滑动,同时定向滑杆38带动两个第三推杆41反向的运动复位,第三推杆41的末端拉动齿条15滑动,齿条15与齿轮环22相互的摩擦,导致套筒23在底座12的内部反向旋转,顶板24带动顶端的凹槽与底座12内部另外一个排泄口对齐,通过连接管32与固定管33相互的贯通,让喷溅模块18对刻蚀结束的电路晶板表面喷淋清洁溶液,对电路晶板的表面进行清洁,同时清洁溶液通过顶板24顶端的凹槽,向留流动,与底座12内部开设的另外一个排泄口流出,通过两个排泄口,在喷淋不同的化学溶液时,调整排泄口的闭合,让不同的喷淋废液对应进行回收。The second step is that when in use, after the laser radio frequency module 11 etches the circuit crystal plate on the top of the base 12, the rotating plate 36 is rotated in the opposite direction to rotate the rotating plate 36 in the opposite direction at the top of the support plate 14. The rotating plate 36 deflects and pushes the two pull rods 35 to move in the opposite direction to each other, and pushes the two adjustment sleeves 34 to move in the opposite direction to each other at the side ends of the rotating plate 36. One of the fixed tubes 33 is closed and the other fixed tube 33 is opened to close the pipeline for outputting the photoresist, and the cleaning solution is output to the inside of the connecting tube 32 through the other fixed tube 33. At the same time, the rotating plate 36 drives the reset rod 37 to move in the opposite direction, and the directional slide rod 38 slides on the side ends of the rotating plate 36. At the same time, the directional slide rod 38 drives the two third push rods 37 to move in the opposite direction. The rod 41 is reset by reverse movement, and the end of the third push rod 41 pulls the rack 15 to slide. The friction between the rack 15 and the gear ring 22 causes the sleeve 23 to rotate in the opposite direction inside the base 12, and the top plate 24 drives the groove at the top to align with another drain port inside the base 12. The connecting tube 32 and the fixed tube 33 are connected to each other, so that the splash module 18 sprays the cleaning solution on the surface of the circuit crystal board after etching to clean the surface of the circuit crystal board. At the same time, the cleaning solution flows through the groove at the top of the top plate 24 to the left and flows out of another drain port opened inside the base 12. When spraying different chemical solutions, the closure of the drain port is adjusted to allow different spray waste liquids to be recovered accordingly.
本发明的实施例是为了示例和描述起见而给出的,而并不是无遗漏的或者将本发明限于所公开的形式。很多修改和变化对于本领域的普通技术人员而言是显而易见的。选择和描述实施例是为了更好说明本发明的原理和实际应用,并且使本领域的普通技术人员能够理解本发明从而设计适于特定用途的带有各种修改的各种实施例。The embodiments of the present invention are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.
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