CN118367264A - A battery pack structure for energy storage - Google Patents
A battery pack structure for energy storage Download PDFInfo
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- CN118367264A CN118367264A CN202410643332.5A CN202410643332A CN118367264A CN 118367264 A CN118367264 A CN 118367264A CN 202410643332 A CN202410643332 A CN 202410643332A CN 118367264 A CN118367264 A CN 118367264A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/613—Cooling or keeping cold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/61—Types of temperature control
- H01M10/615—Heating or keeping warm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/655—Solid structures for heat exchange or heat conduction
- H01M10/6554—Rods or plates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
Description
技术领域Technical Field
本发明涉及电学领域,特别是涉及一种储能用电池包结构。The present invention relates to the field of electricity, and in particular to a battery pack structure for energy storage.
背景技术Background technique
目前电池包液冷系统管理方式主要有风冷和液冷两种方式。对比风冷技术,其中电池包液冷系统的换热密度大,占地面积小,可保障电芯温度更低、温度均匀性更好。而风冷系统,由于受到环境温度和风速等因素的影响,风冷技术控制难度相对较大,散热效率较低。不过,相较于液冷系统的构建,风冷式热管理系统不需要外部空气循环系统来提供冷却空气。也正因为如此,液冷循环系统的成本相对较高、重量相对较大且结构更为复杂。At present, there are two main ways to manage the battery pack liquid cooling system: air cooling and liquid cooling. Compared with air cooling technology, the battery pack liquid cooling system has a high heat exchange density and occupies a small area, which can ensure a lower battery cell temperature and better temperature uniformity. However, due to the influence of factors such as ambient temperature and wind speed, the air cooling system is relatively difficult to control and has low heat dissipation efficiency. However, compared with the construction of a liquid cooling system, the air-cooled thermal management system does not require an external air circulation system to provide cooling air. Because of this, the cost of the liquid cooling circulation system is relatively high, the weight is relatively large, and the structure is more complex.
现在的制冷结构通常是采用半导体制冷片,如发明专利CN201920491333.7是使用半导体制冷片直接对电芯进行冷却或加热。但是其制作的就仅仅能选择其中一种方式,此外,此外半导体制冷片升降温过快,加热时容易升温过快导致电芯烧坏,制冷时也容易降温过快影响电池使用效率。The current refrigeration structure usually uses semiconductor refrigeration chips, such as the invention patent CN201920491333.7, which uses semiconductor refrigeration chips to directly cool or heat the battery cells. However, the production can only choose one of the methods. In addition, the semiconductor refrigeration chip heats up and down too quickly, which may cause the battery cells to burn out when heated, and may also cause the battery cells to cool down too quickly when cooled, affecting the battery efficiency.
发明专利CN202310518122.9是在电池包壳体的外围安装半导体制冷片,通过控制半导体制冷片来调控电池包的温度。发明专利CN202122346070.0是将多个电池模组与多个半导体制冷组件间隔排列设置在所述底壳内部,其中半导体制冷组件连通形成主动式散热通道,对单个电池模组进行散热工作,使电池包的温度保持在一个较为恒定的安全温度范围。但是这两种方式仅仅能对电池进行制冷,但是在寒冷天气下还需要对电池加热保温,以保证其工作的稳定性,导致其不能适应寒冷的气候。Invention patent CN202310518122.9 is to install a semiconductor refrigeration sheet on the periphery of the battery pack shell, and control the temperature of the battery pack by controlling the semiconductor refrigeration sheet. Invention patent CN202122346070.0 is to arrange multiple battery modules and multiple semiconductor refrigeration components at intervals inside the bottom shell, wherein the semiconductor refrigeration components are connected to form an active heat dissipation channel to dissipate heat for a single battery module, so that the temperature of the battery pack is maintained in a relatively constant safe temperature range. However, these two methods can only cool the battery, but in cold weather, the battery also needs to be heated and kept warm to ensure its working stability, which makes it unable to adapt to cold climates.
发明内容Summary of the invention
为解决上述技术问题,本发明提出了一种储能用电池包结构。In order to solve the above technical problems, the present invention proposes a battery pack structure for energy storage.
本发明的目的通过以下技术方案实现:The purpose of the present invention is achieved through the following technical solutions:
一种储能用电池包结构,包括包体,所述包体内安装有若干电芯形成的电芯组;所述电芯组下方安装有换热板,换热板内部填充有换热液;所述换热板下方安装有紧贴安装有半导体制冷片;所述半导体制冷片分别通过第一闭合电路和第二闭合电路电连接有直流电源;其中,第一闭合电路和第二闭合电路分别导通时使得半导体制冷片内的电流方向相反。A battery pack structure for energy storage, comprising a pack body, wherein a battery cell group formed by a plurality of battery cells is installed in the pack body; a heat exchange plate is installed below the battery cell group, and the interior of the heat exchange plate is filled with heat exchange fluid; a semiconductor cooling sheet is installed closely below the heat exchange plate; the semiconductor cooling sheet is electrically connected to a DC power supply through a first closed circuit and a second closed circuit respectively; wherein, when the first closed circuit and the second closed circuit are respectively turned on, the current directions in the semiconductor cooling sheet are opposite.
进一步的改进,所述第一闭合电路包括第一导电线和第二导电线;第一导电线一端电连接半导体制冷片的正极,另一端电连接直流电源的正极;所述第二导电线一端电连接半导体制冷片的负极另一端电连接直流电源的负极;第一导电线或第二导电线上安装有第一开关;A further improvement is that the first closed circuit includes a first conductive wire and a second conductive wire; one end of the first conductive wire is electrically connected to the positive electrode of the semiconductor refrigeration chip, and the other end is electrically connected to the positive electrode of the DC power supply; one end of the second conductive wire is electrically connected to the negative electrode of the semiconductor refrigeration chip, and the other end is electrically connected to the negative electrode of the DC power supply; a first switch is installed on the first conductive wire or the second conductive wire;
所述第二闭合电路包括第三导电线和第四导电线,第三导电线一端电连接半导体制冷片的正极,另一端电连接直流电源的负极,第四导电线一端电连接半导体制冷片的负极,另一端电连接直流电源的正极;第三导电线或第四导电线上安装有第二开关。The second closed circuit includes a third conductive wire and a fourth conductive wire, one end of the third conductive wire is electrically connected to the positive electrode of the semiconductor refrigeration plate, and the other end is electrically connected to the negative electrode of the DC power supply, one end of the fourth conductive wire is electrically connected to the negative electrode of the semiconductor refrigeration plate, and the other end is electrically connected to the positive electrode of the DC power supply; a second switch is installed on the third conductive wire or the fourth conductive wire.
进一步的改进,所述换热板包括上板和下板,下板上形成有换热液回路,换热液回路两端分别连通内循环泵的进液口和出液口。As a further improvement, the heat exchange plate comprises an upper plate and a lower plate, a heat exchange liquid loop is formed on the lower plate, and two ends of the heat exchange liquid loop are respectively connected to a liquid inlet and a liquid outlet of an internal circulation pump.
进一步的改进,所述上板上形成有安装内循环泵的对接孔Further improvement, the upper plate is formed with a docking hole for installing the internal circulation pump
进一步的改进,所述包体包括下箱体,下箱体上盖设有上盖。As a further improvement, the package body comprises a lower box body, and an upper cover is provided on the upper cover of the lower box body.
进一步的改进,所述下箱体底面与半导体制冷片之间形成有空腔;配合空腔,下箱体上形成有安装风机的风机安装孔和用于出风的出风口。As a further improvement, a cavity is formed between the bottom surface of the lower box body and the semiconductor refrigeration plate; in coordination with the cavity, a fan mounting hole for mounting a fan and an air outlet for exhausting air are formed on the lower box body.
本发明的有益效果在于:The beneficial effects of the present invention are:
1.可以根据需要实现对电芯的加热或制冷,且仅仅采用半导体制冷片作为冷源或热源,结构简单成本较低。1. The battery cell can be heated or cooled as needed, and only semiconductor refrigeration sheets are used as cold sources or heat sources, with a simple structure and low cost.
2.通过换热板对电芯加热或制冷,利用换热液进行缓冲蓄热,从而保持对电芯加热或制冷的稳定性。2. The battery cells are heated or cooled by heat exchange plates, and the heat exchange fluid is used for buffering and heat storage, thereby maintaining the stability of heating or cooling the battery cells.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
利用附图对本发明做进一步说明,但附图中的内容不构成对本发明的任何限制。The present invention is further described with reference to the accompanying drawings, but the contents in the accompanying drawings do not constitute any limitation to the present invention.
图1为本发明的结构示意图;Fig. 1 is a schematic diagram of the structure of the present invention;
图2为本发明的爆炸图;Fig. 2 is an exploded view of the present invention;
图3为直流电源与半导体制冷片的电路连接示意图。FIG. 3 is a schematic diagram of the circuit connection between a DC power supply and a semiconductor cooling sheet.
具体实施方式Detailed ways
为了使发明的目的、技术方案及优点更加清楚明白,以下结合附图及实例,对本发明进行进一步的详细说明。In order to make the purpose, technical solutions and advantages of the invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and examples.
实施例1Example 1
如图1和图2所示一种储能用电池包结构,包括包体,包体包括下箱体2,下箱体2上盖设有上盖1。下箱体2底部形成安装风机的风机安装孔10和用于出风的出风口11。下箱体2内安装有半导体制冷片9,半导体制冷片9与下箱体2底面之间形成腔体。半导体制冷片9上方安装有换热板,换热板上方为多个电芯4形成的电芯组。As shown in Figures 1 and 2, a battery pack structure for energy storage includes a pack body, which includes a lower box body 2, and an upper cover 1 is provided on the upper cover of the lower box body 2. A fan installation hole 10 for installing a fan and an air outlet 11 for exhausting air are formed at the bottom of the lower box body 2. A semiconductor cooling sheet 9 is installed in the lower box body 2, and a cavity is formed between the semiconductor cooling sheet 9 and the bottom surface of the lower box body 2. A heat exchange plate is installed above the semiconductor cooling sheet 9, and a battery cell group formed by multiple battery cells 4 is above the heat exchange plate.
其中,半导体制冷片9分别通过第一闭合电路13和第二闭合电路14电连接有直流电源12。其中第一闭合电路13导通时和第二闭合电路14导通时,半导体制冷片9内的电流流向相反,从而使得半导体制冷片9的制冷面和制热面颠倒。The semiconductor cooling sheet 9 is electrically connected to the DC power supply 12 through the first closed circuit 13 and the second closed circuit 14. When the first closed circuit 13 and the second closed circuit 14 are turned on, the current in the semiconductor cooling sheet 9 flows in opposite directions, so that the cooling surface and the heating surface of the semiconductor cooling sheet 9 are reversed.
具体如图3所示,第一闭合电路13包括第一导电线131和第二导电线132;第一导电线131一端电连接半导体制冷片9的正极,另一端电连接直流电源12的正极;所述第二导电线132一端电连接半导体制冷片9的负极另一端电连接直流电源12的负极;第一导电线131或第二导电线132上安装有第一开关133。Specifically as shown in Figure 3, the first closed circuit 13 includes a first conductive wire 131 and a second conductive wire 132; one end of the first conductive wire 131 is electrically connected to the positive electrode of the semiconductor refrigeration plate 9, and the other end is electrically connected to the positive electrode of the DC power supply 12; one end of the second conductive wire 132 is electrically connected to the negative electrode of the semiconductor refrigeration plate 9, and the other end is electrically connected to the negative electrode of the DC power supply 12; a first switch 133 is installed on the first conductive wire 131 or the second conductive wire 132.
第二闭合电路14包括第三导电线141和第四导电线142,第三导电线141一端电连接半导体制冷片9的正极,另一端电连接直流电源12的负极,第四导电线142一端电连接半导体制冷片9的负极,另一端电连接直流电源12的正极;第三导电线141或第四导电线142上安装有第二开关14。The second closed circuit 14 includes a third conductive wire 141 and a fourth conductive wire 142. One end of the third conductive wire 141 is electrically connected to the positive electrode of the semiconductor refrigeration plate 9, and the other end is electrically connected to the negative electrode of the DC power supply 12. One end of the fourth conductive wire 142 is electrically connected to the negative electrode of the semiconductor refrigeration plate 9, and the other end is electrically connected to the positive electrode of the DC power supply 12. A second switch 14 is installed on the third conductive wire 141 or the fourth conductive wire 142.
这样,在高温环境中,电芯需要散热时,第一闭合电路13的第一开关133闭合,使得第一闭合电路13导通,此时半导体制冷片9的顶面为制冷面,底面为制热面,从而通过制冷面经过换热板吸收电芯散发的热量,对电芯降温。而在低温环境下,第一开关133打开,第一闭合电路13关闭;第二闭合电路14的第二开关14闭合,此时由于半导体制冷片的电流方向与高温环境时相反,因此顶面为制热面,底面为制冷面,从而可以通过换热板对电芯进行加热。In this way, in a high temperature environment, when the battery cell needs to dissipate heat, the first switch 133 of the first closed circuit 13 is closed, so that the first closed circuit 13 is turned on. At this time, the top surface of the semiconductor cooling plate 9 is the cooling surface, and the bottom surface is the heating surface, so that the heat emitted by the battery cell is absorbed by the cooling surface through the heat exchange plate to cool the battery cell. In a low temperature environment, the first switch 133 is opened, the first closed circuit 13 is closed; the second switch 14 of the second closed circuit 14 is closed. At this time, since the current direction of the semiconductor cooling plate is opposite to that in a high temperature environment, the top surface is the heating surface, and the bottom surface is the cooling surface, so that the battery cell can be heated through the heat exchange plate.
其中,进一步的改进,所述换热板包括上板6和下板8,下板8上形成有换热液回路,换热液回路两端分别连通内循环泵5的进液口和出液口。这样通过循环泵5使得换热液流动,从而使得换热液的温度更加均匀,防止出现温度积聚现象。Among them, as a further improvement, the heat exchange plate includes an upper plate 6 and a lower plate 8, a heat exchange liquid circuit is formed on the lower plate 8, and both ends of the heat exchange liquid circuit are respectively connected to the liquid inlet and the liquid outlet of the internal circulation pump 5. In this way, the heat exchange liquid flows through the circulation pump 5, so that the temperature of the heat exchange liquid is more uniform, and the temperature accumulation phenomenon is prevented.
上板6上形成有安装内循环泵5的对接孔7The upper plate 6 is provided with a docking hole 7 for mounting the internal circulation pump 5.
最后应当说明的是,以上实施例仅用于说明本发明的技术方案而非对本发明保护范围的限制,尽管参照较佳实施例对本发明作了详细说明,本领域的普通技术人员应当了解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的实质和范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.
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