CN118354243A - Temperature self-adaptive headset - Google Patents

Abstract

The present application relates to the technical field of headphones, and specifically to a temperature-adaptive head-mounted headphone, comprising an arc-shaped connecting rod, a sound-emitting component and a cooling device, wherein the sound-emitting components are fixedly connected at both ends of the arc-shaped connecting rod, and the two sound-emitting components are relatively fixedly connected to the arc-shaped connecting rod, and the cooling device is fixedly connected to the sides of the two sound-emitting components that are away from each other. When a user wears the head-mounted headphone on his head, the cooling device can be started, and the cooling device operates to transfer the low temperature to the sound-emitting component, so that the temperature of the sound-emitting component is reduced, so that the user will not feel stuffy when wearing the headphone for a long time, and the output is very cool in summer, thereby achieving the purpose of improving the user's use experience, and solving the technical problem in the prior art that the user will feel very stuffy after wearing the headphone for a long time due to the high temperature in summer and the sound-emitting part covers the user's ear and is not breathable.

Description

A temperature-adaptive headphone

Technical Field

The present application relates to the technical field of headphones, and in particular to a temperature-adaptive headphone.

Background technique

Headphones, as the name implies, are worn on the head, not inserted into the ear canal, and are different from in-ear earplugs. They consist of two parts, a signal transmitter and headphones (usually dynamic) with a signal receiving and amplifying device.

In the prior art, in order to make the headphones more comfortable to wear in winter, a circle of cotton pads is set outside the two sound-emitting parts of the headphones, so that the headphones can not only keep warm but also be comfortable to wear in winter.

However, if the user wants to use headphones in summer, the cotton pad will make the user feel very stuffy. Therefore, the user will take off the cotton pad in summer and then use the headphones. Even if the cotton pad is taken off, the user will still feel very stuffy after wearing the headphones for a long time due to the high temperature in summer and the sound-producing part covering the user's ears and not breathable. Therefore, a temperature-adaptive headphone is needed to solve this technical problem.

Summary of the invention

In view of the shortcomings of the prior art, the purpose of this application is to provide a temperature-adaptive headset to solve the technical problem in the prior art that after wearing the headset for a long time, the user will feel very stuffy due to the high temperature in summer, and the sound-emitting part covers the user's ears and is not breathable.

The above-mentioned purpose of the present application is achieved through the following technical scheme: a temperature-adaptive headset, comprising an arc-shaped connecting rod, a sound-emitting component and a cooling device, wherein the two ends of the arc-shaped connecting rod are fixedly connected to the sound-emitting component, the two sound-emitting components are relatively fixedly connected to the arc-shaped connecting rod, and the cooling device is fixedly connected to a side of the two sound-emitting components that are away from each other.

By adopting the above technical solution, when the user wears the headphones on his head, the cooling device can be started, and the cooling device can be operated to transfer the low temperature to the sound-emitting component, so that the temperature of the sound-emitting component is reduced, so that the user will not feel stuffy when wearing the headphones for a long time, and it is very cool and comfortable to wear in summer, thereby achieving the purpose of improving the user's usage experience and solving the technical problem in the prior art that the user will feel very stuffy after wearing the headphones for a long time due to the high temperature in summer and the sound-emitting part covers the user's ear and is not breathable.

Furthermore, the cooling device includes an outer shell, a heat-conducting copper sheet, a semiconductor refrigeration sheet and a cover plate. The outer shell has the same shape as the sound-emitting component and has openings at both ends. The heat-conducting copper sheet is fixedly connected to the side of the two sound-emitting components away from each other. The semiconductor refrigeration sheet is fixedly connected to the side of the heat-conducting copper sheet away from the sound-emitting component. One end of the outer shell is fixedly connected to the sound-emitting component, and the other end is covered by the cover plate. The cover plate is fixedly connected to the outer shell.

By adopting the above technical scheme, the sound-emitting component is cooled down by starting the semiconductor refrigeration sheet. The semiconductor refrigeration sheet uses the Peltier effect of its own semiconductor material. When direct current passes through a thermocouple composed of two different semiconductor materials connected in series, heat can be absorbed and released at both ends of the thermocouple respectively, thereby achieving the purpose of cooling. The semiconductor refrigeration sheet transfers the low temperature to the thermally conductive copper sheet, and the thermally conductive copper sheet transfers the low temperature to the sound-emitting component through a fixed connection with the sound-emitting component, thereby achieving the purpose of lowering the temperature of the sound-emitting component.

Furthermore, the cooling device also includes a cooling fan, which is installed on the cover plate with a gap between the cooling fan and the semiconductor cooling plate. The cover plate is provided with a vent, and the blowing surface of the cooling fan is directed toward the semiconductor cooling plate.

By adopting the above technical solution, we found during the experiment that the speed at which the semiconductor refrigeration sheet transfers temperature to the sound-generating component through the heat-conducting copper sheet is still too slow, resulting in the user having to wait for a long time before feeling the temperature of the sound-generating component drop during use. The setting of the cold fan solves this problem. The cold fan is started at the same time as the semiconductor refrigeration sheet. The cold fan blows air to the semiconductor refrigeration sheet to accelerate the transfer of temperature from the semiconductor refrigeration sheet to the heat-conducting copper sheet. This can accelerate the cooling of the sound-generating component by the cooling device, thereby achieving the purpose of improving the cooling efficiency of the cooling device.

Furthermore, support devices for supporting the arc-shaped connecting rod are provided at both ends of the arc-shaped connecting rod close to the sound-emitting component, and the support device is located on one side of the arc-shaped connecting rod between the sound-emitting component and the cooling device.

By adopting the above technical scheme, some users who wear headphones are not accustomed to wearing the headphones vertically on their heads, because wearing the headphones vertically on the head will cause the two sound-emitting components to drag the arc-shaped connecting rod to press on the user's head. Therefore, some users are accustomed to wearing the arc-shaped connecting rod of the headphones at an angle at the back of the head so that the users will feel more comfortable. However, because the present invention provides a cooling device on the sound-emitting component, the overall weight of the sound-emitting component becomes heavier, resulting in the sound-emitting component being very easy to slide down to the user's shoulder when the user wears the arc-shaped connecting rod of the headphones at an angle at the back of the head, so that the user often needs to adjust the position of the sound-emitting component, and the user experience is very poor. The provision of the supporting device solves this technical problem. When the user wants to wear the arc-shaped connecting rod of the headphones at an angle at the back of the head, the supporting device can be used to support the user's shoulders and provide a supporting force to the sound-emitting component so that the sound-emitting component will not slide down.

Furthermore, connecting grooves are provided at both ends of the arc-shaped connecting rod close to the sound-emitting component and on one side of the sound-emitting component and the cooling device. The supporting device includes a rotating column, a supporting rod and an arc claw. The rotating column is located in the connecting groove and is rotatably connected to the arc-shaped connecting rod. One end of the support rod is fixedly connected to the rotating column, and the other end is connected to the arc claw.

By adopting the above technical solution, supporting force is provided to the sound-emitting component. When the user wears the arc-shaped connecting rod of the headset at an angle on the back of the head, the support rod is rotated so that the arc claws buckle the user's shoulders. In this way, the support rod, the arc-shaped connecting rod and the sound-emitting component form a triangle to support each other, thereby preventing the sound-emitting component from slipping.

Furthermore, the support rod includes a connecting rod, a rotating rod and a connecting spring, one end of the rotating rod is fixedly connected to the rotating column, and the other end is fixedly connected to one end of the connecting spring, one end of the connecting rod is connected to the arc claw, and the other end is provided with an opening, the interior of the connecting rod is hollow and the cross-section is larger than the cross-section of the rotating rod, the opening of the connecting rod is larger than the cross-section of the rotating rod, and the end of the connecting spring away from the rotating rod extends into the connecting rod through the opening and is fixedly connected to the connecting rod.

By adopting the above technical solution, although the setting of the support rod and the arc claw can prevent the sound-emitting component from slipping, the shoulders of the user are not static when using the headphones. Sometimes when the user moves his shoulders so that the heights of the shoulders on both sides of the user are different, the shoulder on the higher side may push the sound-emitting component upward through the support rod, which causes the user to adjust the position of the sound-emitting component again, resulting in a very poor user experience. The setting of the connecting spring solves this technical problem. By connecting the connecting rod and the rotating rod through the connecting spring, it is achieved that when the user moves his shoulders so that the heights of the shoulders on both sides of the user are different, the shoulder on the higher side will push the connecting rod closer to the rotating rod. Because of the setting of the connecting spring and the opening of the connecting rod, the connecting rod will not push the rotating rod but will cover the rotating rod, so that the sound-emitting component will not be pushed and moved upward, and when the user's shoulders are parallel again, the connecting spring will bounce the connecting rod back without affecting normal use. The setting of the connecting spring also has an advantage that the support device can adapt to the distance from the shoulder to the ear of different people.

Furthermore, the elastic coefficient of the connecting spring does not exceed the weight of the sound-generating component plus the cooling device.

By adopting the above technical solution, if the elastic coefficient of the connecting spring exceeds the weight of the sound-emitting component and the cooling device, it will cause the higher side to be bounced away when the user's shoulders are at different heights. Therefore, the elastic coefficient of the connecting spring cannot exceed the weight of the sound-emitting component and the cooling device.

Furthermore, a connecting column is provided between the arc claw and the connecting rod, one end of the connecting column is fixedly connected to the arc claw, and the other end is rotatably connected to the connecting rod, and a damping ring is provided at the place where the connecting column is rotatably connected to the connecting rod.

By adopting the above technical solution, the arc claw is rotatably connected to the connecting rod through the connecting column, so that the supporting device can be folded and stored in cooperation with the rotating rod, thereby achieving the purpose of easy storage, and the damping ring can prevent the arc claw from rotating at will.

Furthermore, the upper ends of the arc-shaped connecting rods on both sides close to the sound-generating component are provided with fixing devices for fixing the supporting devices.

By adopting the above technical solution, some users are accustomed to wearing the headphones at an angle, and some users are accustomed to wearing the headphones vertically on their heads. This results in the users who are accustomed to wearing the headphones vertically on their heads being hindered by the supporting device and being very inconvenient to use. The fixing device solves this technical problem by rotating the arc claw to be horizontal, and then rotating the rotating rod to fold the supporting device on the arc connecting rod, and then fixing the supporting device with the fixing device, so that users who are accustomed to wearing the headphones vertically on their heads can use them very conveniently.

Furthermore, the fixing device includes a plug-in column, a top spring and a top column, the plug-in column is fixedly connected to the side of the rotating rod close to the arc-shaped connecting rod, the side of the arc-shaped connecting rod close to the rotating rod is provided with a slot, and one side of the slot is provided with a telescopic slot, one end of the top spring is fixedly connected to the inner wall of the telescopic slot away from the slot, and the other end is fixedly connected to one end of the top column, the top column is located in the telescopic slot and the end away from the top spring extends out of the telescopic slot, and the end of the top column extending out of the telescopic slot is provided with a hemisphere.

By adopting the above technical solution, the rotating rod is rotated to make the plug-in column move closer to the slot, and then the plug-in column is plugged into the slot. Due to the setting of the hemisphere, the plug-in column can slide over the curved surface of the hemisphere and continue to extend into the slot. At this time, the top column is pressed into the telescopic slot by the plug-in column, but a top spring is provided in the telescopic slot. The top column pressed into the telescopic slot will be pushed by the compressed top spring to compress the plug-in column, so that the support device is folded on the arc connecting rod and fixed, thereby achieving the purpose of fixing the support device on the arc connecting rod.

In summary, the present application includes at least one of the following beneficial technical effects.

By setting up the cooling device, it is possible to start the semiconductor refrigeration sheet and the cooling fan at the same time. The semiconductor refrigeration sheet uses the Peltier effect of its own semiconductor material. When direct current passes through a thermocouple composed of two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, thereby achieving the purpose of cooling. The cooling fan blows air to the semiconductor refrigeration sheet to accelerate the transfer of heat from the semiconductor refrigeration sheet to the heat-conducting copper sheet, thereby accelerating the cooling of the sound-generating component by the cooling device, thereby achieving the purpose of improving the cooling efficiency of the cooling device.

By setting the supporting device, when a user who is accustomed to wearing the arc-shaped connecting rod of the headset at an angle on the back of the head uses it, the supporting rod can be rotated so that the arc claws buckle the user's shoulders. In this way, the supporting rod, the arc-shaped connecting rod and the sound-emitting component will form a triangle to support each other, so that the sound-emitting component will not slip, thereby improving the user experience.

By setting the fixing device, it is achieved that when the user who is accustomed to wearing the headset vertically on the head uses it, before wearing it, the rotating rod is rotated to make the plug-in post move closer to the slot, and then the plug-in post is plugged into the slot. The plug-in post can slide over the curved surface of the hemisphere and continue to extend into the slot. At this time, the top post is pressed into the telescopic groove by the plug-in post, but a top spring is provided in the telescopic groove. The top post pressed into the telescopic groove will be pushed by the compressed top spring to compress the plug-in post, so that the support device is folded on the arc connecting rod and fixed, and then the headset is worn on the head, which improves the applicability of the present invention and improves the user experience as a whole.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is an overall structural diagram of an embodiment;

FIG2 is an exploded view of a cooling device in an embodiment;

Fig. 3 is a cross-sectional view along line A-A in Fig. 1;

Fig. 4 is an enlarged view of part A in Fig. 3;

FIG5 is an enlarged view of portion B in FIG3 ;

Fig. 6 is an enlarged view of portion C in Fig. 1;

FIG. 7 is an enlarged view of portion D in FIG. 5 .

Figure numerals: 1. arc-shaped connecting rod; 10. connecting groove; 11. slot; 12. telescopic groove; 2. sound-generating component; 3. cooling device; 30. outer shell; 31. heat-conducting copper sheet; 32. semiconductor refrigeration; 33. cover plate; 34. cold fan; 35. vent; 4. supporting device; 40. rotating column; 41. supporting rod; 410. connecting rod; 411. rotating rod; 412. connecting spring; 42. arc claw; 43. connecting column; 44. damping ring; 5. plug-in column; 6. top column.

Detailed ways

The present application is further described in detail below with reference to the accompanying drawings.

Embodiment, referring to Fig. 1 and Fig. 2, a temperature-adaptive headset comprises an arc-shaped connecting rod 1, a sound-emitting component 2 and a cooling device 3, wherein the two ends of the arc-shaped connecting rod 1 are fixedly connected to the sound-emitting component 2, and the two sound-emitting components 2 are relatively fixedly connected to the arc-shaped connecting rod 1, and the cooling device 3 is fixedly connected to the side of the two sound-emitting components 2 away from each other, and the cooling device 3 comprises a shell 30, a heat-conducting copper sheet 31, a semiconductor refrigeration 32 sheet and a cover plate 33, wherein the shell 30 has the same shape as the sound-emitting component 2 and has openings at both ends, the heat-conducting copper sheet 31 is fixedly connected to the side of the two sound-emitting components 2 away from each other, the semiconductor refrigeration 32 sheet is fixedly connected to the side of the heat-conducting copper sheet 31 away from the sound-emitting component 2, one end of the shell 30 is fixedly connected to the sound-emitting component 2, and the other end of the shell 30 is fixedly connected to the sound-emitting component 2. The end is covered by a cover plate 33, and the cover plate 33 is fixedly connected to the shell 30. When the user wears the headphones on the head, the semiconductor refrigeration 32 is started. The semiconductor refrigeration 32 uses the Peltier effect of its own semiconductor material. When direct current passes through the thermocouple composed of two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, thereby achieving the purpose of cooling. The semiconductor refrigeration 32 transfers the low temperature to the heat-conducting copper sheet 31, and the heat-conducting copper sheet 31 transfers the low temperature to the sound-emitting component 2 through a fixed connection with the sound-emitting component 2, thereby reducing the temperature of the sound-emitting component 2, so that the user will not feel stuffy when wearing the headphones for a long time, and has a very cool output in summer, thereby achieving the purpose of improving the user's usage experience.

During the experiment, we found that the speed at which the semiconductor refrigeration 32 alone transfers the temperature to the sound-emitting component 2 through the heat-conducting copper sheet 31 is still too slow, resulting in the user having to wait for a long time before feeling the temperature of the sound-emitting component 2 becoming lower during use. In order to solve this technical problem, in this embodiment, a cold fan 34 is provided on the cooling device 3. The cold fan 34 is installed on the cover plate 33 and a gap is left between the cold fan 34 and the semiconductor refrigeration 32. A vent 35 is provided on the cover plate 33. The blowing surface of the cold fan 34 is directed toward the semiconductor refrigeration 32. When the semiconductor refrigeration 32 is started, the cold fan 34 is started at the same time. The cold fan 34 blows air toward the semiconductor refrigeration 32 to accelerate the transfer of the semiconductor refrigeration 32 to the heat-conducting copper sheet 31. In this way, the cooling of the sound-emitting component 2 by the cooling device 3 can be accelerated, thereby achieving the purpose of improving the cooling efficiency of the cooling device 3.

Some users are not used to wearing the headphones vertically on their heads, because wearing the headphones vertically on the head will cause the two sound-emitting components 2 to drag the arc-shaped connecting rod 1 to press on the user's head. Therefore, some users are used to wearing the arc-shaped connecting rod 1 of the headphones at an angle on the back of the head so that the users will feel more comfortable. However, because the cooling device 3 is provided on the sound-emitting component 2 in this embodiment, the overall weight of the sound-emitting component 2 becomes heavier, resulting in the sound-emitting component 2 being very easy to slide down to the user's shoulder when the user wears the arc-shaped connecting rod 1 of the headphones at an angle on the back of the head, so that the user often needs to adjust the position of the sound-emitting component 2, and the user experience is very poor. In order to solve this technical problem, referring to Figures 3, 4, and 5, in this embodiment, the arc-shaped connecting rod 1 of the headphones is The connecting rod 1 is provided with connecting grooves 10 at both ends close to the sound-emitting component 2, located on one side of the sound-emitting component 2 and the cooling device 3; the arc-shaped connecting rod 1 is provided with a supporting device 4 at both ends close to the sound-emitting component 2, located on one side of the sound-emitting component 2 and the cooling device 3; the supporting device 4 includes a rotating column 40, a supporting rod 41 and an arc claw 42; the rotating column 40 is located in the connecting groove 10 and is rotatably connected to the arc-shaped connecting rod 1; one end of the supporting rod 41 is fixedly connected to the rotating column 40, and the other end is connected to the arc claw 42; when the user wears the arc-shaped connecting rod 1 of the headset at an angle on the back of the head, the support rod 41 is rotated to make the arc claw 42 buckle the user's shoulder, so that the support rod 41, the arc-shaped connecting rod 1 and the sound-emitting component 2 form a triangle to support each other, thereby preventing the sound-emitting component 2 from slipping off.

Although the setting of the support rod 41 and the arc claw 42 can prevent the sound-emitting component 2 from slipping, the shoulders of the user are not static when using the headphone. Sometimes when the user moves his shoulders so that the heights of the shoulders on both sides of the user are different, the shoulder on the higher side may push the sound-emitting component 2 upward through the support rod 41, which causes the user to adjust the position of the sound-emitting component 2 again, resulting in a very poor user experience. In order to solve this technical problem, in this embodiment, the support rod 41 is configured to include a connecting rod 410, a rotating rod 411 and a connecting spring 412, one end of the rotating rod 411 is fixedly connected to the rotating column 40, and the other end is fixedly connected to one end of the connecting spring 412, one end of the connecting rod 410 is connected to the arc claw 42, and the other end is provided with an opening, the interior of the connecting rod 410 is hollow and the cross-section is larger than the cross-section of the rotating rod 411, the opening of the connecting rod 410 is larger than the cross-section of the rotating rod 411, and the end of the connecting spring 412 away from the rotating rod 411 extends into the connecting rod 410 through the opening. It is internally fixedly connected to the connecting rod 410, and the elastic coefficient of the connecting spring 412 does not exceed the weight of the sound-emitting component 2 plus the cooling device 3. When the user moves his shoulders so that the heights of the shoulders on both sides of the user are different, the shoulder on the higher side will push the connecting rod 410 closer to the rotating rod 411. Because of the setting of the connecting spring 412 and the opening of the connecting rod 410, the connecting rod 410 will not push the rotating rod 411 but will cover the rotating rod 411, so that the sound-emitting component 2 will not be pushed and move upward, and when the user's shoulders are parallel again, the connecting spring 412 will bounce the connecting rod 410 back without affecting normal use. Another advantage of the setting of the connecting spring 412 is that it can make the supporting device 4 adapt to the distance from the shoulder to the ear of different people. If the elastic coefficient of the connecting spring 412 exceeds the weight of the sound-emitting component 2 plus the cooling device 3, it will cause the higher side to bounce away when the heights of the shoulders on both sides of the user are different. Therefore, the elastic coefficient of the connecting spring 412 cannot exceed the weight of the sound-emitting component 2 plus the cooling device 3.

Although the setting of the supporting device 4 solves the problem that the sound-emitting component 2 may slip, it also brings inconvenience to the storage of the entire earphone. In order to solve this technical problem, referring to Figure 6, in this embodiment, a connecting column 43 is provided between the arc claw 42 and the connecting rod 410. One end of the connecting column 43 is fixedly connected to the arc claw 42, and the other end is rotatably connected to the connecting rod 410. A damping ring 44 is provided at the connecting column 43 where it is rotatably connected to the connecting rod 410. The arc claw 42 is rotated to be horizontal, and then the rotating rod 411 is rotated to fold the supporting device 4 on the arc connecting rod 1, so that storage is convenient. The damping ring 44 can prevent the arc claw 42 from rotating at will and affecting normal use.

Some users are accustomed to wearing the headphones at an angle, while some users are accustomed to wearing the headphones vertically on their heads. This results in that the users who are accustomed to wearing the headphones vertically on their heads are hindered by the supporting device 4, which makes it very inconvenient to use. In order to solve this technical problem, referring to Figure 7, in this embodiment, a fixing device is provided at the upper ends of both sides of the arc-shaped connecting rod close to the sound-emitting component 2, and the fixing device includes a plug-in column 5, a top spring and a top column 6. The plug-in column 5 is fixedly connected to one side of the rotating rod 411 close to the sound-emitting component 2, and a groove 11 is provided on one side of the rotating rod 411 close to both ends of the arc-shaped connecting rod 1 close to the sound-emitting component 2, and a telescopic groove 12 is provided on one side of the groove 11. One end of the top spring is fixedly connected to the inner wall of the telescopic groove 12 away from the groove 11, and the other end is fixed The top column 6 is fixedly connected to one end of the top column 6, which is located in the telescopic slot 12 and extends out of the telescopic slot 12 at one end away from the top spring. A hemisphere is provided at the end of the top column 6 extending out of the telescopic slot 12. The rotating rod 411 is rotated to make the plug-in column 5 move closer to the slot 11, and then the plug-in column 5 is plugged into the slot 11. Due to the setting of the hemisphere, the plug-in column 5 can slide over the curved surface of the hemisphere and continue to extend into the slot 11. At this time, the top column 6 is pressed into the telescopic slot 12 by the plug-in column 5, but a top spring is provided in the telescopic slot 12. The top column 6 pressed into the telescopic slot 12 will be pushed by the compressed top spring to press the plug-in column 5, so that the support device 4 is folded on the arc connecting rod 1 and fixed. In this way, users who are accustomed to wearing the headphones vertically on their heads can use them very conveniently.

Specific implementation process: In summer, when users who are accustomed to wearing the arc-shaped connecting rod 1 of the headset at an angle at the back of the head use it, they rotate the support rod 41 to make the arc claw 42 buckle the user's shoulder, so that the support rod 41, the arc-shaped connecting rod 1 and the sound-emitting component 2 will form a triangle to support each other, and then start the semiconductor refrigeration 32 and the cold fan 34 at the same time. The cold fan 34 blows air to the semiconductor refrigeration 32 to accelerate the transfer of the semiconductor refrigeration 32 to the heat-conducting copper sheet 31, so that the sound-emitting component 2 quickly cools down.

In summer, when users who are accustomed to wearing the headphones vertically on their heads use the headphones, before wearing them, they rotate the rotating rod 411 to make the plug-in column 5 move closer to the slot 11, and then plug the plug-in column 5 into the slot 11. The plug-in column 5 can slide over the curved surface of the hemisphere and continue to extend into the slot 11. At this time, the top column 6 is pressed into the telescopic groove 12 by the plug-in column 5, but a top spring is provided in the telescopic groove 12. The top column 6 pressed into the telescopic groove 12 will be pushed by the compressed top spring to press the plug-in column 5, so that the support device 4 is folded on the arc connecting rod 1 and fixed. Then the headphones are put on the head, and the semiconductor refrigeration 32 plates are started while the cold fan 34 is started. The cold fan 34 blows air to the semiconductor refrigeration 32 plates to accelerate the transfer of the semiconductor refrigeration 32 plates to the heat-conducting copper plate 31, so that the sound-emitting component 2 quickly cools down.

The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims (10)

1. A temperature-adaptive headset, characterized in that it comprises an arc-shaped connecting rod (1), a sound-emitting component (2) and a cooling device (3), wherein the two ends of the arc-shaped connecting rod (1) are fixedly connected to the sound-emitting component (2), the two sound-emitting components (2) are fixedly connected to the arc-shaped connecting rod (1) in a relative manner, and the cooling device (3) is fixedly connected to the sides of the two sound-emitting components (2) that are away from each other. 2. A temperature-adaptive headset according to claim 1, characterized in that the cooling device (3) comprises a shell (30), a heat-conducting copper sheet (31), a semiconductor refrigeration sheet (32) and a cover plate (33), the shell (30) having the same shape as the sound-emitting component (2) and having openings at both ends, the heat-conducting copper sheet (31) being fixedly connected to a side of the two sound-emitting components (2) away from each other, the semiconductor refrigeration sheet (32) being fixedly connected to a side of the heat-conducting copper sheet (31) away from the sound-emitting component (2), one end of the shell (30) being fixedly connected to the sound-emitting component (2), and the other end being covered by the cover plate (33), and the cover plate (33) being fixedly connected to the shell (30). 3. According to claim 2, a temperature-adaptive headset is characterized in that the cooling device (3) also includes a cooling fan (34), the cooling fan (34) is installed on the cover plate (33) and there is a gap between the cooling fan (34) and the semiconductor refrigeration (32) sheet, and a vent (35) is provided on the cover plate (33), and the blowing surface of the cooling fan (34) is directed toward the semiconductor refrigeration (32) sheet. 4. According to claim 1, a temperature-adaptive headset is characterized in that support devices (4) for supporting the arc-shaped connecting rod (1) are provided at both ends of the arc-shaped connecting rod (1) close to the sound-emitting component (2), and the support device (4) is located on one side of the arc-shaped connecting rod (1) between the sound-emitting component (2) and the cooling device (3). 5. According to claim 4, a temperature-adaptive headset is characterized in that the arc-shaped connecting rod (1) is provided with connecting grooves (10) at both ends close to the sound-emitting component (2) and on one side of the sound-emitting component (2) and the cooling device (3), and the supporting device (4) includes a rotating column (40), a supporting rod (41) and an arc claw (42), the rotating column (40) is located in the connecting groove (10) and is rotatably connected to the arc-shaped connecting rod (1), one end of the support rod (41) is fixedly connected to the rotating column (40), and the other end is connected to the arc claw (42). 6. According to claim 5, a temperature-adaptive headset is characterized in that the support rod (41) includes a connecting rod (410), a rotating rod (411) and a connecting spring (412), one end of the rotating rod (411) is fixedly connected to the rotating column (40), and the other end is fixedly connected to one end of the connecting spring (412), one end of the connecting rod (410) is connected to the arc claw (42), and the other end is provided with an opening, the interior of the connecting rod (410) is hollow and the cross-section is larger than the cross-section of the rotating rod (411), the opening of the connecting rod (410) is larger than the cross-section of the rotating rod (411), and the end of the connecting spring (412) away from the rotating rod (411) extends into the connecting rod (410) through the opening and is fixedly connected to the connecting rod (410). 7. A temperature-adaptive headset according to claim 6, characterized in that the elastic coefficient of the connecting spring (412) does not exceed the weight of the sound-generating component (2) plus the cooling device (3). 8. According to claim 5, a temperature-adaptive headset is characterized in that a connecting column (43) is provided between the arc claw (42) and the connecting rod (410), one end of the connecting column (43) is fixedly connected to the arc claw (42), and the other end is rotatably connected to the connecting rod (410), and a damping ring (44) is provided at the place where the connecting column (43) is rotatably connected to the connecting rod (410). 9. A temperature-adaptive headset according to claim 6, characterized in that fixing devices for fixing the supporting device (4) are provided at the upper ends of both sides of the arc-shaped connecting rod (1) close to the sound-emitting component (2). 10. A temperature-adaptive headset according to claim 9, characterized in that the fixing device comprises a plug-in column (5), a top spring and a top column (6), the plug-in column (5) is fixedly connected to the side of the rotating rod (411) close to the arc-shaped connecting rod (1), the side of the arc-shaped connecting rod (1) close to the rotating rod (411) is provided with a slot (11), one side of the slot (11) is provided with a telescopic slot (12), one end of the top spring is fixedly connected to the inner wall of the telescopic slot (12) away from the slot (11), and the other end is fixedly connected to one end of the top column (6), the top column (6) is located in the telescopic slot (12) and the end away from the top spring protrudes out of the telescopic slot (12), and the end of the top column (6) protruding out of the telescopic slot (12) is provided with a hemisphere.