CN118322541A - A board-mounted tape attachment mechanism and a chip packaging carrier processing equipment - Google Patents

A board-mounted tape attachment mechanism and a chip packaging carrier processing equipment Download PDF

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Publication number
CN118322541A
CN118322541A CN202410748645.7A CN202410748645A CN118322541A CN 118322541 A CN118322541 A CN 118322541A CN 202410748645 A CN202410748645 A CN 202410748645A CN 118322541 A CN118322541 A CN 118322541A
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plate
cylinder
guide plate
pulling
tape
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CN202410748645.7A
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CN118322541B (en
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余志轩
李科序
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Kunshan Hongshida Intelligent Technology Co ltd
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Kunshan Hongshida Intelligent Technology Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333Trays for chips
    • H01L21/67336Trays for chips characterized by a material, a roughness, a coating or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B29C31/04Feeding of the material to be moulded, e.g. into a mould cavity
    • B29C31/08Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Package Closures (AREA)

Abstract

The invention provides a plate body adhesive tape sticking mechanism, which comprises a base, an adhesive tape sticking unit, a base, a supporting vertical plate, an adhesive tape tray, an adhesive tape passing roller, a tension roller, a material guide plate, a material pulling component, a cutting component, an adhesive pressing roller and a counter pulling cylinder, wherein the adhesive tape sticking unit is provided with the adhesive tape passing roller, the tension roller is rotatably connected to the left lower part of the material guide plate, the adhesive tape pulled by the material pulling component extends leftwards and downwards after bypassing the adhesive pressing roller, the adhesive tape end is positioned at the left lower part of the adhesive pressing roller, the upper end part of the supporting vertical plate is connected with the base in a vertically sliding way, the upper end part of the material guide plate is rotatably connected with the supporting vertical plate, the cylinder body of the counter pulling cylinder is rotatably connected with the supporting vertical plate, the cylinder rod of the counter pulling cylinder extends rightwards and is rotatably connected with the upper surface of the material guide plate, and the counter pulling cylinder can be matched with the upper and lower movement of the supporting vertical plate through the action of the counter pulling cylinder when adhesive tape sticking operation is carried out, the adhesive tape end is rolled for one time and positive two times, and the adhesive tape end is firmly stuck with the edge of the plate body; the chip packaging loader processing equipment provided by the invention has high production yield.

Description

一种板体贴胶带机构及一种芯片封装载具加工设备A board tape attachment mechanism and a chip packaging carrier processing equipment

技术领域Technical Field

本发明属于芯片封装载具加工技术领域,具体涉及一种芯片封装载具板体贴胶带机构及一种芯片封装载具加工设备。The present invention belongs to the technical field of chip packaging carrier processing, and in particular relates to a chip packaging carrier plate body tape sticking mechanism and a chip packaging carrier processing equipment.

背景技术Background technique

在半导体制程或封装制程中,芯片需要通过特殊的载具进行转运,这类载具通常包括由硬质材料制成的板体以及贴合在板体一侧表面的胶带,板体上开设有通孔,胶带覆盖在通孔上,芯片置于通孔内并粘接在胶带上进行转运,如中国专利CN100555591C就公开了这样一种芯片封装载具结构。In the semiconductor process or packaging process, chips need to be transported through special carriers. Such carriers usually include a plate made of hard material and a tape attached to one side of the plate. The plate is provided with a through hole, and the tape covers the through hole. The chip is placed in the through hole and adhered to the tape for transportation. For example, Chinese patent CN100555591C discloses such a chip packaging carrier structure.

由于胶带需要整面黏贴在板体上,且板体四周较窄,采用现有的贴胶带机构(如中国专利CN117401499A公开的贴胶带机构)黏贴胶带时,经常出现胶带端头黏贴不牢的现象,导致胶带后续放料歪斜,使得胶带黏贴在板体四周的部分相对较少,受外力作用时,容易导致胶带边缘脱离板体,影响芯片转运,也影响芯片封装载具的生产良率。Since the tape needs to be adhered to the entire surface of the board and the board is relatively narrow around, when the existing tape sticking mechanism (such as the tape sticking mechanism disclosed in Chinese patent CN117401499A) is used to stick the tape, the end of the tape is often not firmly adhered, resulting in the subsequent unloading of the tape being skewed, so that the portion of the tape adhered around the board is relatively small. When subjected to external force, the edge of the tape is easily separated from the board, affecting the chip transportation and the production yield of the chip packaging carrier.

发明内容Summary of the invention

本发明的目的是为了克服现有技术中的缺点,提供一种能够使胶带端头与板体边缘黏贴牢固的芯片封装载具板体贴胶带机构及一种生产良率高的芯片封装载具加工设备。The purpose of the present invention is to overcome the shortcomings of the prior art and to provide a chip packaging carrier plate body tape sticking mechanism capable of firmly adhering the tape end to the edge of the plate body and a chip packaging carrier processing equipment with high production yield.

为达到上述目的,本发明采用的技术方案是,板体贴胶带机构,包括:In order to achieve the above object, the technical solution adopted by the present invention is that the plate body adhesive tape sticking mechanism comprises:

基座,所述基座可前后、左右、上下移动的设置在芯片封装载具板体的上方;A base, which is movable forward, backward, left, right, and up and down and is disposed above the chip packaging carrier plate;

贴胶带单元,所述贴胶带单元包括支撑竖板、胶带料盘、胶带过辊、张力辊、导料板、拉料组件、切断组件和压胶辊,所述支撑竖板沿左右方向竖直延伸,所述支撑竖板的上端部连接在所述基座上,所述胶带料盘、所述胶带过辊、所述张力辊可转动地连接在所述支撑竖板的前表面,所述导料板垂直于所述支撑竖板,所述导料板的上端部与所述支撑竖板相连接,所述导料板的下端部向左下方倾斜延伸,所述导料板的下表面设有若干吸附孔,自所述胶带料盘放出的胶带绕过所述胶带过辊、所述张力辊后被所述吸附孔吸附在所述导料板的下表面,所述拉料组件用于沿所述导料板的下表面向左下方拉动所述胶带,所述切断组件用于切断吸附在所述导料板下表面的所述胶带;The adhesive tape unit comprises a supporting vertical plate, a tape material tray, a tape passing roller, a tension roller, a material guide plate, a material pulling component, a cutting component and a glue pressing roller, the supporting vertical plate extends vertically in the left and right directions, the upper end of the supporting vertical plate is connected to the base, the tape material tray, the tape passing roller and the tension roller are rotatably connected to the front surface of the supporting vertical plate, the material guide plate is perpendicular to the supporting vertical plate, the upper end of the material guide plate is connected to the supporting vertical plate, the lower end of the material guide plate extends obliquely to the left and lower sides, the lower surface of the material guide plate is provided with a plurality of adsorption holes, the adhesive tape released from the tape material tray passes around the tape passing roller and the tension roller and is adsorbed on the lower surface of the material guide plate by the adsorption holes, the material pulling component is used to pull the adhesive tape to the left and lower sides along the lower surface of the material guide plate, and the cutting component is used to cut the adhesive tape adsorbed on the lower surface of the material guide plate;

所述压胶辊可转动地连接在所述导料板的下端并悬于所述导料板的左下方,所述压胶辊的外圆周面与所述导料板的下表面相切,经所述拉料组件拉动的所述胶带绕过所述压胶辊后向左下方延伸,使所述胶带的端头位于所述压胶辊的左侧,所述支撑竖板的上端部与所述基座可上下滑动的连接,所述导料板的上端部与所述支撑竖板转动连接;The rubber pressing roller is rotatably connected to the lower end of the material guide plate and is suspended at the lower left side of the material guide plate. The outer circumferential surface of the rubber pressing roller is tangent to the lower surface of the material guide plate. The adhesive tape pulled by the material pulling assembly passes over the rubber pressing roller and then extends to the lower left side, so that the end of the adhesive tape is located on the left side of the rubber pressing roller. The upper end of the supporting vertical plate is connected to the base in an upward and downward sliding manner, and the upper end of the material guide plate is rotatably connected to the supporting vertical plate.

所述贴胶带单元还包括设于所述导料板左侧的反拉气缸,所述反拉气缸的缸体与所述支撑竖板转动连接,所述反拉气缸的气缸杆向右下方倾斜延伸,所述气缸杆的端部与所述导料板的上表面转动连接;The adhesive tape unit further comprises a back-pull cylinder disposed on the left side of the guide plate, the cylinder body of the back-pull cylinder being rotatably connected to the support vertical plate, the cylinder rod of the back-pull cylinder extending obliquely to the lower right, and the end of the cylinder rod being rotatably connected to the upper surface of the guide plate;

在所述基座向下移动使所述支撑竖板相对于所述基座向上移动至极限位置时,所述压胶辊将绕过其自身的所述胶带贴合在所述板体上,在所述反拉气缸的气缸杆缩回时,所述导料板的下端部沿顺势针方向向上转动,所述支撑竖板在重力作用下相对于所述基座向下移动,使所述压胶辊向左水平滚动,将所述胶带的所述端头压贴在所述板体的边缘,实现一次辊压,在所述反拉气缸的气缸杆伸出时,所述导料板的下端部沿逆时针方向向下转动,所述压胶辊向右滚动,再次将所述胶带的所述端头压贴在所述板体的边缘,实现二次辊压,并将所述支撑竖板相对于所述基座向上顶起至极限位置,在二次辊压完成后,所述基座向右移动,所述压胶辊配合所述切断组件动作将所述胶带的另一端头压贴至所述板体上,完成贴胶带作业。When the base moves downward and the supporting vertical plate moves upward to the limit position relative to the base, the glue pressing roller will bypass its own tape and stick it to the plate body. When the cylinder rod of the reverse pulling cylinder retracts, the lower end of the guide plate rotates upward along the clockwise direction. Under the action of gravity, the supporting vertical plate moves downward relative to the base, causing the glue pressing roller to roll horizontally to the left, pressing the end of the tape against the edge of the plate body to achieve a first rolling press. When the cylinder rod of the reverse pulling cylinder extends, the lower end of the guide plate rotates downward in the counterclockwise direction, and the glue pressing roller rolls to the right, pressing the end of the tape against the edge of the plate body again to achieve a second rolling press and lift the supporting vertical plate upward to the limit position relative to the base. After the second rolling press is completed, the base moves to the right, and the glue pressing roller cooperates with the cutting assembly to press the other end of the tape against the plate body to complete the tape sticking operation.

优选地,所述基座上连接有滑套,所述支撑竖板上设有竖直杆座,所述竖直杆座内锁紧有向上延伸的竖直杆,所述竖直杆的上端部可上下滑动地穿设在所述滑套内,所述竖直杆的上端设有直径变大的环状凸缘,所述环状凸缘位于所述滑套的上方。Preferably, a sliding sleeve is connected to the base, a vertical rod seat is provided on the supporting vertical plate, a vertical rod extending upward is locked in the vertical rod seat, the upper end of the vertical rod can be slid up and down in the sliding sleeve, and an annular flange with an enlarged diameter is provided at the upper end of the vertical rod, and the annular flange is located above the sliding sleeve.

进一步优选地,所述竖直杆上套设有弹簧,所述弹簧位于所述滑套的下方,所述弹簧的两端部分别抵紧所述滑套和所述竖直杆座,所述弹簧具有驱使所述竖直杆相对于所述滑套向下滑动的趋势。Further preferably, a spring is sleeved on the vertical rod, and the spring is located below the sliding sleeve. Two ends of the spring respectively press against the sliding sleeve and the vertical rod seat, and the spring has a tendency to drive the vertical rod to slide downward relative to the sliding sleeve.

优选地,所述气缸杆的端部通过延长杆与所述导料板的上表面转动连接,所述延长杆与所述气缸杆同轴,所述延长杆与所述导料板之间的夹角为50至70度。Preferably, the end of the cylinder rod is rotatably connected to the upper surface of the guide plate via an extension rod, the extension rod is coaxial with the cylinder rod, and the angle between the extension rod and the guide plate is 50 to 70 degrees.

优选地,所述拉料组件包括拉料座、移动气缸、拉料板、转动气缸,所述拉料座通过所述移动气缸可移动地连接在所述导料板的下方,所述拉料座的移动方向平行于所述导料板的下表面,所述拉料板通过所述转动气缸可转动地连接在所述拉料座的侧壁并位于所述导料板的下方,所述拉料板朝向所述导料板的侧面设有压胶凸台,所述压胶凸台位于所述拉料板转动轴心线的下方,所述拉料板具有第一工作位置和第二工作位置,在所述拉料板处于第一工作位置时,所述拉料板向靠近所述导料板的方向转动,使所述压胶凸台压紧吸附在所述导料板下表面的所述胶带,在所述拉料板处于第二工作位置时,所述拉料板向远离所述导料板的方向转动,使所述压胶凸台与所述导料板下表面吸附的所述胶带相脱离。Preferably, the material pulling assembly includes a material pulling seat, a movable cylinder, a material pulling plate, and a rotating cylinder. The material pulling seat is movably connected to the bottom of the material guide plate through the movable cylinder, and the moving direction of the material pulling seat is parallel to the lower surface of the material guide plate. The material pulling plate is rotatably connected to the side wall of the material pulling seat through the rotating cylinder and is located below the material guide plate. The material pulling plate is provided with a glue pressing boss on the side facing the material guide plate, and the glue pressing boss is located below the rotation axis of the material pulling plate. The material pulling plate has a first working position and a second working position. When the material pulling plate is in the first working position, the material pulling plate rotates in a direction close to the material guide plate so that the glue pressing boss presses the tape adsorbed on the lower surface of the material guide plate. When the material pulling plate is in the second working position, the material pulling plate rotates in a direction away from the material guide plate so that the glue pressing boss is separated from the tape adsorbed on the lower surface of the material guide plate.

进一步优选地,所述拉料板具有沿平行于所述导料板下表面的方向延伸的基板和垂直连接在所述基板上并向右下方延伸的延伸部,所述基板的上端部可转动地连接在所述拉料座的侧壁上,所述延伸部的下端与所述转动气缸的气缸杆转动连接,所述转动气缸的缸体转动连接在所述拉料座上。Further preferably, the pulling plate has a base plate extending in a direction parallel to the lower surface of the guide plate and an extension portion vertically connected to the base plate and extending to the lower right; the upper end portion of the base plate is rotatably connected to the side wall of the pulling seat; the lower end of the extension portion is rotatably connected to the cylinder rod of the rotating cylinder; and the cylinder body of the rotating cylinder is rotatably connected to the pulling seat.

进一步优选地,所述压胶凸台至少有两个并间隔设置,所述压胶凸台的表面为弧形面,在所述拉料板处于第一工作位置时,所述压胶凸台与所述胶带的带胶面线接触。Further preferably, there are at least two glue pressing bosses which are spaced apart from each other, and the surface of the glue pressing boss is an arc-shaped surface. When the pulling plate is in the first working position, the glue pressing boss is in linear contact with the glue surface of the tape.

进一步优选地,所述拉料组件还包括连接在所述拉料板远离所述导料板一侧的热风管,所述热风管自右上方向左下方倾斜延伸,在所述拉料座向左下方移动至极限位置时,所述热风管的下端部对准绕过所述压胶辊的胶带的端头。Further preferably, the material pulling assembly also includes a hot air duct connected to the side of the material pulling plate away from the material guide plate, and the hot air duct extends obliquely from the upper right to the lower left. When the material pulling seat moves to the lower left to the extreme position, the lower end of the hot air duct is aligned with the end of the tape bypassing the glue roller.

优选地,所述切断组件包括切刀和切刀气缸,所述切刀可移动地设置在所述导料板上开设的切刀槽内,所述切刀气缸连接在所述导料板的上表面用于驱动所述切刀沿所述切刀槽移动,所述切刀气缸为无杆气缸,所述切刀气缸上罩设有围板,所述反拉气缸的气缸杆端部与所述围板转动连接。Preferably, the cutting assembly includes a cutter and a cutter cylinder, the cutter is movably arranged in a cutter groove opened on the material guide plate, the cutter cylinder is connected to the upper surface of the material guide plate to drive the cutter to move along the cutter groove, the cutter cylinder is a rodless cylinder, a surrounding plate is provided on the cutter cylinder, and the cylinder rod end of the back-pull cylinder is rotatably connected to the surrounding plate.

为达到上述目的,本发明采用的技术方案是,芯片封装载具加工设备,包括:In order to achieve the above object, the technical solution adopted by the present invention is that the chip packaging carrier processing equipment comprises:

板体输送线,所述板体输送线用于自左向右水平输送芯片封装载具的板体;A plate conveying line, which is used to convey the plate of the chip packaging carrier horizontally from left to right;

贴胶台,所述贴胶台设置在所述板体输送线的右侧;A gluing station, which is arranged on the right side of the plate conveying line;

夹送组件,所述夹送组件设于所述板体输送线的一侧,所述夹送组件用于夹持所述板体输送线上的所述板体并将其移动至所述贴胶台上;A clamping and conveying assembly, the clamping and conveying assembly is arranged on one side of the plate conveying line, and the clamping and conveying assembly is used to clamp the plate on the plate conveying line and move it to the glue sticking table;

所述芯片封装载具加工设备还包括所述的板体贴胶带机构,所述板体贴胶带机构设于所述贴胶台的上方。The chip packaging carrier processing equipment also includes the board taping mechanism, and the board taping mechanism is arranged above the taping platform.

优选地,所述板体输送线包括两条平行设置的皮带线,和设于这两条所述皮带线之间的顶升组件,在所述板体输送到设定位置时,所述顶升组件将所述板体顶起,以方便所述夹送组件夹持;所述夹送组件包括可上下、左右移动的旋转台,及连接在所述旋转台上可左右开合的夹爪,在所述夹爪夹持住所述板体时,能够通过所述旋转台的转动使所述板体翻面。Preferably, the plate conveyor line includes two parallel belt lines, and a lifting assembly arranged between the two belt lines. When the plate is conveyed to a set position, the lifting assembly lifts the plate to facilitate clamping by the clamping assembly. The clamping assembly includes a rotating table that can move up and down and left and right, and a clamp connected to the rotating table that can open and close left and right. When the clamp clamps the plate, the plate can be turned over by rotating the rotating table.

优选地,所述贴胶台包括底座、承载板、定位块、抵紧块,所述承载板沿左右方向水平延伸,所述承载板的右端部可转动地连接在所述底座上,所述承载板用于放置所述板体,所述承载板上设有若干用于吸附所述板体的负压孔,所述定位块设置在所述承载板的上表面并靠近所述承载板的右端部,所述抵紧块可左右移动地连接在所述底座上并位于所述承载板的左侧。Preferably, the glue laminating table includes a base, a carrying plate, a positioning block, and a clamping block. The carrying plate extends horizontally in the left-right direction, and the right end of the carrying plate is rotatably connected to the base. The carrying plate is used to place the plate body, and the carrying plate is provided with a plurality of negative pressure holes for adsorbing the plate body. The positioning block is arranged on the upper surface of the carrying plate and close to the right end of the carrying plate. The clamping block is connected to the base so as to be movably left and right and is located on the left side of the carrying plate.

进一步优选地,所述芯片封装载具加工设备还包括产品输送线,所述产品输送线位于所述贴胶台的右侧,所述承载板的转动角度大于等于180度,当所述承载板转动至极限位置时,所述承载板能够将其上放置的所述板体翻转至所述产品输送线上。Further preferably, the chip packaging carrier processing equipment also includes a product conveyor line, which is located on the right side of the glue laminating station, and the rotation angle of the carrier plate is greater than or equal to 180 degrees. When the carrier plate is rotated to the extreme position, the carrier plate can flip the board placed thereon onto the product conveyor line.

由于上述技术方案运用,本发明与现有技术相比具有下列优点:Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

本发明提供的板体贴胶带机构,通过使压胶辊可转动地连接在导料板的下端并悬于导料板的左下方,使压胶辊的外圆周面与导料板的下表面相切,使拉料组件拉动的胶带绕过压胶辊后向左下方延伸,使胶带的端头位于压胶辊的左下方,使支撑竖板的上端部与基座可上下滑动的连接,使导料板的上端部与支撑竖板转动连接;在进行贴胶带作业时,可通过反拉气缸动作配合支撑竖板的上下移动,使压胶辊对胶带端头实现一反一正两次滚压,使胶带端头与板体边缘黏贴牢固,避免后续胶带放料时出现歪斜。The plate body adhesive tape sticking mechanism provided by the present invention makes the adhesive pressure roller rotatably connected to the lower end of the material guide plate and suspended at the lower left of the material guide plate, so that the outer circumferential surface of the adhesive pressure roller is tangent to the lower surface of the material guide plate, and the adhesive tape pulled by the pulling component bypasses the adhesive pressure roller and extends to the lower left, so that the end of the adhesive tape is located at the lower left of the adhesive pressure roller, and the upper end of the supporting vertical plate is connected to the base in a sliding manner up and down, and the upper end of the material guide plate is rotatably connected to the supporting vertical plate; when performing the adhesive tape sticking operation, the adhesive pressure roller can roll the adhesive tape end twice, one reverse and one forward, through the action of the reverse pulling cylinder to cooperate with the up and down movement of the supporting vertical plate, so that the adhesive tape end is firmly adhered to the edge of the plate body, and the subsequent tape is prevented from being skewed when the adhesive tape is discharged.

其贴胶带过程具体如下:The specific process of applying tape is as follows:

在基座向下移动使支撑竖板相对于基座向上移动至极限位置时,压胶辊将绕过其自身的胶带贴合在板体上;在反拉气缸的气缸杆缩回时,导料板的下端部沿顺势针方向向上转动,支撑竖板在重力作用下相对于基座向下移动,使压胶辊向左水平滚动,将胶带的端头压贴在板体的边缘,实现一次辊压;在反拉气缸的气缸杆伸出时,导料板的下端部沿逆时针方向向下转动,压胶辊向右滚动,再次将胶带的端头压贴在板体的边缘,实现二次辊压,并将支撑竖板相对于基座向上顶起至极限位置;在二次辊压完成后,基座向右移动,压胶辊配合切断组件动作将胶带的另一端头压贴至板体上,完成贴胶带作业;当然,在二次辊压完成后,也可通过反拉气缸的多次动作,实现多次滚压,确保胶带端头与板体边缘黏贴的牢固程度。When the base moves downward and the supporting vertical plate moves upward to the limit position relative to the base, the glue pressing roller will bypass its own tape and stick it to the plate body; when the cylinder rod of the reverse pulling cylinder is retracted, the lower end of the guide plate rotates upward in the clockwise direction, and the supporting vertical plate moves downward relative to the base under the action of gravity, so that the glue pressing roller rolls horizontally to the left, pressing the end of the tape against the edge of the plate body to achieve a first rolling press; when the cylinder rod of the reverse pulling cylinder is extended, the lower end of the guide plate rotates downward in the counterclockwise direction, and the glue pressing roller rolls to the right, pressing the end of the tape against the edge of the plate body again to achieve a second rolling press, and the supporting vertical plate is lifted upward to the limit position relative to the base; after the second rolling press is completed, the base moves to the right, and the glue pressing roller cooperates with the cutting assembly to press the other end of the tape against the plate body to complete the taping operation; of course, after the second rolling press is completed, multiple rolling presses can also be achieved through multiple actions of the reverse pulling cylinder to ensure the firmness of the tape end and the edge of the plate body.

本发明提供的芯片封装载具加工设备,包括上述板体贴胶带机构,在贴胶带时,能够使胶带端头与板体边缘黏贴牢固,从而提高芯片封装载具的生产良率。The chip packaging carrier processing equipment provided by the present invention includes the above-mentioned board tape sticking mechanism. When sticking the tape, the end of the tape can be firmly adhered to the edge of the board, thereby improving the production yield of the chip packaging carrier.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1是本发明中芯片封装载具加工设备优选实施例的主视示意图。FIG. 1 is a front view schematic diagram of a preferred embodiment of a chip packaging carrier processing device in the present invention.

图2是图1的立体示意图。FIG. 2 is a perspective schematic diagram of FIG. 1 .

图3是图1中板体输送线、贴胶台及产品输送线处的立体示意图。FIG. 3 is a three-dimensional schematic diagram of the plate conveyor line, the glue sticking station and the product conveyor line in FIG. 1 .

图4是图3中顶升组件的立体放大示意图。FIG. 4 is an enlarged perspective schematic diagram of the lifting assembly in FIG. 3 .

图5是图3中贴胶台的立体放大示意图。FIG. 5 is an enlarged perspective schematic diagram of the glue laminating station in FIG. 3 .

图6是图1中夹送组件的立体示意图,此时,夹爪夹持有板体。FIG. 6 is a perspective schematic diagram of the clamping assembly in FIG. 1 , where the clamping claws clamp the plate.

图7是图1中板体贴胶带单元左上方向的立体示意图。FIG. 7 is a three-dimensional schematic diagram of the upper left direction of the plate body tape unit in FIG. 1 .

图8是图1中板体贴胶带单元右下方向的立体示意图。FIG. 8 is a three-dimensional schematic diagram of the lower right direction of the plate body tape unit in FIG. 1 .

图9是图1中板体贴胶带机构贴胶带时的示意图,此时,基座尚未向下移动。FIG. 9 is a schematic diagram of the board body taping mechanism in FIG. 1 when taping, at which time, the base has not yet moved downward.

图10是图9中基座向下移动,使支撑竖板相对于基座向上移动至极限位置时的示意图。FIG. 10 is a schematic diagram of the case where the base in FIG. 9 moves downward, causing the support vertical plate to move upward to an extreme position relative to the base.

图11是图10中反拉气缸的气缸杆缩回时的示意图。FIG. 11 is a schematic diagram of the cylinder rod of the back-pull cylinder in FIG. 10 when it is retracted.

图12是图11中反拉气缸的气缸杆伸出时的示意图。FIG. 12 is a schematic diagram of the cylinder rod of the back-pull cylinder in FIG. 11 when it is extended.

图13是本发明中板体贴胶带机构另一实施例的主视示意图。FIG. 13 is a front view schematic diagram of another embodiment of the plate body tape sticking mechanism of the present invention.

其中:1.板体;2.定位孔;3.胶带;4.端头;10.板体输送线;11.第一皮带线;12.顶升组件;121.顶升座;122.顶升板;123.顶升气缸;124.顶升定位柱;13.传感器;20.贴胶台;21.底座;22.承载板;23.定位块;24.抵紧块;25.抵紧气缸;30.夹送组件;31.旋转台;32.夹爪;33.双头气缸;40.板体贴胶带机构;41.基座;411.滑套;42.贴胶带单元;421.支撑竖板;4211.竖直杆座;4212.竖直杆;4213.环状凸缘;4214.弹簧;422.胶带料盘;423.胶带过辊;424.张力辊;4241.张力辊框架;4242.张力气缸;425.导料板;4251.切刀槽;426.拉料组件;4261.拉料座;4262.移动气缸;4263.拉料板;4264.转动气缸;4265.压胶凸台;4266.基板;4267.延伸部;4268.热风管;427.切断组件;4271.切刀;4272.切刀气缸;4273.围板;428.压胶辊;429.反拉气缸;4291.缸体;4292.气缸杆;4293.延长杆;50.产品输送线;51.第二皮带线。Wherein: 1. plate; 2. positioning hole; 3. tape; 4. end; 10. plate conveyor line; 11. first belt line; 12. lifting assembly; 121. lifting seat; 122. lifting plate; 123. lifting cylinder; 124. lifting positioning column; 13. sensor; 20. glue sticking table; 21. base; 22. bearing plate; 23. positioning block; 24. pressing block; 25. pressing cylinder; 30. clamping assembly; 31. rotating table; 32. clamping claw; 33. double-headed cylinder; 40. plate body glue sticking mechanism; 41. base; 411. sliding sleeve; 42. glue sticking unit; 421. supporting vertical plate; 4211. vertical rod seat; 4212. vertical rod; 4213. annular flange; 4214. spring; 422. tape tray; 423. tape roller; 424. tension roller; 4241. tension roller frame; 4242. tension cylinder; 425. material guide plate; 4251. cutter groove; 426. material pulling assembly; 4261. material pulling seat; 4262. moving cylinder; 4263. material pulling plate; 4264. rotating cylinder; 4265. glue pressing boss; 4266. base plate; 4267. extension; 4268. hot air pipe; 427. cutting assembly; 4271. cutter; 4272. cutter cylinder; 4273. enclosure; 428. glue pressing roller; 429. reverse pulling cylinder; 4291. cylinder body; 4292. cylinder rod; 4293. extension rod; 50. product conveyor line; 51. second belt line.

具体实施方式Detailed ways

本发明中描述的左右、上下、前后方向为图1中的左右、上下、外里方向。The left-right, up-down, and front-back directions described in the present invention are the left-right, up-down, and outside-inside directions in FIG. 1 .

如图1至图12所示,本发明提供的芯片封装载具加工设备,包括:板体输送线10、贴胶台20、夹送组件30、板体贴胶带机构40、产品输送线50,其中,板体输送线10用于自左向右水平输送芯片封装载具的板体1,板体输送线10包括两条平行设置的第一皮带线11、设于这两条第一皮带线11之间的顶升组件12,以及用于检测板体1位置及正反面的传感器13,顶升组件12包括顶升座121、可上下移动地设置在顶升座121上的顶升板122,以及用于驱动顶升板122上下移动的顶升气缸123,顶升板122上表面的前后侧设有顶升定位柱124,顶升定位柱124呈上小下大的圆锥形,顶升定位柱124的尺寸与板体1上定位孔2的尺寸相匹配,传感器13连接在第一皮带线11的支撑体上,并位于顶升组件12的右侧,在传感器13检测到板体1移动至设定位置时,顶升气缸123动作,通过顶升板122将架设在两条第一皮带线11上的板体1向上顶起,以方便夹送组件30的夹持作业;贴胶台20设置在板体输送线10的右侧,贴胶台20包括底座21、承载板22、定位块23、抵紧块24,底座21位于板体输送线10的正右方,承载板22沿左右方向水平延伸,承载板22的右端部可转动地连接在底座21上,承载板22用于放置板体1,承载板22上设有若干用于吸附板体1的负压孔(图中未示出),定位块23设置在承载板22的上表面并靠近承载板22的右端部,在板体1放置在承载板22上时,定位块23用于限定板体1右边沿的位置,抵紧块24可左右移动地连接在底座21上并位于承载板22的左侧,底座21上还连接有用于驱动抵紧块24左右移动的抵紧气缸25,在抵紧块24向右移动至极限位置时,抵紧块24能够抵紧放置在承载板22上的板体1的左边沿,使板体1的位置保持固定,以提升后续贴胶带作业的稳定性和准确性;夹送组件30设于板体输送线10的后侧,夹送组件30用于夹持板体输送线10上的板体1并将其移动至贴胶台20上,具体地,夹送组件30包括可上下、左右移动的旋转台31,及连接在旋转台31上可左右开合的夹爪32,旋转台31上还连接有用于驱动夹爪32左右开合的双头气缸33,在旋转台31向下移动至设定位置时,能够通过双头气缸33的动作,使夹爪32能够从左右方向夹紧被顶升板122顶起的板体1,再根据传感器13检测出的正反面结果,确定旋转台31是否需要旋转180度,在需要旋转时,旋转台31先向上移动形成转动空间,再旋转180度,使板体1翻面,也就是说,在夹爪32夹持住板体1时,能够通过旋转台31的上移及转动使板体1翻面,以确保板体1上的二维码等标识件处于贴胶面或非贴胶面,在确保板体1正反面正确的前提下,通过旋转台31上下移动及左右移动的配合,即可将板体1移动至承载板22上,再松开夹爪32,即可完成板体1的放置作业,旋转台31的上下及左右移动可通过电缸、伺服电机+丝杆副等方式实现,旋转台31的转动可通过旋转气缸实现;在板体1放置在承载板22上后,抵紧气缸25动作,使抵紧块24向右移动,将板体1抵紧,从而锁定板体1与承载板22的相对位置,此时,即可通过设于贴胶台20上方板的体贴胶带机构40将胶带3贴覆在板体1上。As shown in FIGS. 1 to 12 , the chip packaging carrier processing equipment provided by the present invention includes: a plate conveyor line 10, a glue sticking table 20, a clamping and conveying assembly 30, a plate body tape sticking mechanism 40, and a product conveyor line 50, wherein the plate conveyor line 10 is used to horizontally convey the plate body 1 of the chip packaging carrier from left to right, and the plate conveyor line 10 includes two parallel first belt lines 11, a lifting assembly 12 arranged between the two first belt lines 11, and a sensor for detecting the position and front and back sides of the plate body 1. The jacking assembly 12 includes a jacking seat 121, a jacking plate 122 movably arranged on the jacking seat 121, and a jacking cylinder 123 for driving the jacking plate 122 to move up and down. The front and rear sides of the upper surface of the jacking plate 122 are provided with a jacking positioning column 124, and the jacking positioning column 124 is in a conical shape with a small upper part and a large lower part. The size of the jacking positioning column 124 matches the size of the positioning hole 2 on the plate body 1. The sensor 13 is connected to the support body of the first belt line 11 and is located in the jacking assembly. On the right side of the plate conveyor line 10, when the sensor 13 detects that the plate body 1 moves to the set position, the lifting cylinder 123 is actuated, and the plate body 1 mounted on the two first belt lines 11 is lifted upward by the lifting plate 122 to facilitate the clamping operation of the clamping and conveying assembly 30; the glue sticking table 20 is arranged on the right side of the plate conveyor line 10, and the glue sticking table 20 includes a base 21, a bearing plate 22, a positioning block 23, and a tightening block 24. The base 21 is located on the right side of the plate conveyor line 10, and the bearing plate 22 extends horizontally in the left and right directions. The right end of the carrying plate 22 is rotatably connected to the base 21. The carrying plate 22 is used to place the plate body 1. The carrying plate 22 is provided with a plurality of negative pressure holes (not shown in the figure) for adsorbing the plate body 1. The positioning block 23 is arranged on the upper surface of the carrying plate 22 and is close to the right end of the carrying plate 22. When the plate body 1 is placed on the carrying plate 22, the positioning block 23 is used to limit the position of the right edge of the plate body 1. The pressing block 24 is connected to the base 21 and is located on the left side of the carrying plate 22 so as to be movable left and right. The base 2 1 is also connected to a pressing cylinder 25 for driving the pressing block 24 to move left and right. When the pressing block 24 moves to the right to the limit position, the pressing block 24 can press against the left edge of the plate body 1 placed on the carrier plate 22, so that the position of the plate body 1 remains fixed, so as to improve the stability and accuracy of the subsequent adhesive tape sticking operation; the clamping assembly 30 is arranged at the rear side of the plate body conveying line 10, and the clamping assembly 30 is used to clamp the plate body 1 on the plate body conveying line 10 and move it to the adhesive tape sticking table 20. Specifically, the clamping assembly 30 includes a rotating platform 31 that can move up and down and left and right, and a clamping claw 32 connected to the rotating platform 31 that can open and close left and right. The rotating platform 31 is also connected to a double-headed cylinder 33 for driving the clamping claw 32 to open and close left and right. When the rotating platform 31 moves downward to a set position, the double-headed cylinder 33 can be used to enable the clamping claw 32 to clamp the plate body 1 lifted by the lifting plate 122 from the left and right directions, and then determine whether the rotating platform 31 needs to be rotated 180 degrees according to the front and back results detected by the sensor 13. When rotation is required, the rotating table 31 first moves upward to form a rotation space, and then rotates 180 degrees to turn the plate 1 over. That is to say, when the clamping claw 32 clamps the plate 1, the plate 1 can be turned over by moving the rotating table 31 upward and rotating to ensure that the identification parts such as the QR code on the plate 1 are on the adhesive surface or the non-adhesive surface. Under the premise of ensuring that the front and back sides of the plate 1 are correct, the plate 1 can be moved to the carrier plate 22 by moving the rotating table 31 up and down and left and right, and then the clamping claw 3 is released. 2, the placement operation of the plate body 1 can be completed, the up and down and left and right movements of the rotating table 31 can be realized by means of electric cylinders, servo motors + screw pairs, etc., and the rotation of the rotating table 31 can be realized by a rotating cylinder; after the plate body 1 is placed on the supporting plate 22, the pressing cylinder 25 is actuated to move the pressing block 24 to the right, pressing the plate body 1, thereby locking the relative position of the plate body 1 and the supporting plate 22. At this time, the tape 3 can be applied to the plate body 1 through the body tape applying mechanism 40 provided on the upper plate of the glue applying table 20.

在本实施例中,板体贴胶带机构40包括基座41和贴胶带单元42,其中,基座41可前后、左右、上下移动的设置在芯片封装载具的板体1(放置在承载板22上)的上方,基座41的前后、左右、上下移动可通过电缸、伺服电机+丝杆副等方式实现;贴胶带单元42包括支撑竖板421、胶带料盘422、胶带过辊423、张力辊424、导料板425、拉料组件426、切断组件427、压胶辊428和反拉气缸429;具体地,支撑竖板421沿左右方向竖直延伸,支撑竖板421的上端部连接在基座41上,支撑竖板421的上端部与基座41可上下滑动的连接;胶带料盘422、胶带过辊423、张力辊424可转动地连接在支撑竖板421的前表面,胶带料盘422、胶带过辊423、张力辊424的转动轴心线沿前后方向水平延伸;进一步地,张力辊424可转动地设置在张力辊框架4241上,张力辊框架4241通过张力气缸4242连接在支撑竖板421的前表面,在张力气缸4242动作时,能够带动张力辊框架4241左右移动,从而带动张力辊424左右移动,实现张力调节;导料板425垂直于支撑竖板421,导料板425的上端部与支撑竖板421转动连接,导料板425的转动轴心线沿前后方向水平延伸,导料板425的下端部向左下方倾斜延伸,导料板425的下表面(朝向右下方的表面)设有若干吸附孔(图中未示出),自胶带料盘422放出的胶带3绕过胶带过辊423、张力辊424(不限定顺序)后被吸附孔吸附在导料板425的下表面(胶带3的不带胶面朝向导料板425的下表面);拉料组件426用于沿导料板425的下表面向左下方拉动胶带3,实现胶带3的放料;切断组件427用于切断吸附在导料板425下表面的胶带3,使贴覆在板体1上的胶带3保持设定长度;压胶辊428可转动地连接在导料板425的下端并悬于导料板425的左下方,压胶辊428的转动轴心线沿前后方向水平延伸,压胶辊428的外圆周面与导料板425下表面所在的平面相切,经拉料组件426拉动的胶带3绕过压胶辊428后向左下方延伸,使胶带3的端头4位于压胶辊428的左侧;反拉气缸429设于导料板425的左侧,反拉气缸429的缸体4291与支撑竖板421转动连接,反拉气缸429的气缸杆4292向右下方倾斜延伸,气缸杆4292的端部与导料板425的上表面转动连接,缸体4291及气缸杆4292的转动轴心线均沿前后方向水平延伸;在基座41向下移动使支撑竖板421相对于基座41向上移动至极限位置时,压胶辊428将绕过其自身的胶带3贴合在板体1上;在反拉气缸429的气缸杆4292缩回时,导料板425的下端部能够沿顺势针方向向上转动,同时,支撑竖板421在重力作用下相对于基座41向下移动,消除压胶辊428斜向移动时的上下移动分量,使压胶辊428实现向左的水平滚动,从而将胶带3的端头4压贴在板体1的边缘,实现一次辊压(反向);在反拉气缸429的气缸杆4292伸出时,导料板425的下端部能够沿逆时针方向向下转动,将支撑竖板421相对于基座41向上顶起至极限位置,消除压胶辊428斜向移动时的上下移动分量,使压胶辊428实现向右的水平滚动,再次将胶带3的端头4压贴在板体1的边缘,实现二次辊压(正向);在二次辊压完成后,基座41向右移动,压胶辊428即可配合切断组件427动作将胶带3的另一端头压贴至板体1上,完成贴胶带作业。In this embodiment, the plate body tape sticking mechanism 40 includes a base 41 and a tape sticking unit 42, wherein the base 41 is arranged above the plate body 1 (placed on the carrier plate 22) of the chip packaging carrier and can move forward and backward, left and right, and up and down, and the forward and backward, left and right, and up and down movements of the base 41 can be achieved by means of an electric cylinder, a servo motor + a screw pair, etc.; the tape sticking unit 42 includes a support vertical plate 421, a tape material tray 422, a tape roller 423, a tension roller 424, a material guide plate 425, a material pulling component 426, and a cutting component 42 7. The adhesive pressing roller 428 and the reverse pulling cylinder 429; Specifically, the support vertical plate 421 extends vertically in the left-right direction, the upper end of the support vertical plate 421 is connected to the base 41, and the upper end of the support vertical plate 421 is connected to the base 41 so as to be slidable up and down; the tape material disc 422, the tape passing roller 423, and the tension roller 424 are rotatably connected to the front surface of the support vertical plate 421, and the rotation axis of the tape material disc 422, the tape passing roller 423, and the tension roller 424 extends horizontally in the front-back direction; further, the tension roller 424 can The tension roller frame 4241 is rotatably arranged on the tension roller frame 4241, and the tension roller frame 4241 is connected to the front surface of the support vertical plate 421 through the tension cylinder 4242. When the tension cylinder 4242 is actuated, it can drive the tension roller frame 4241 to move left and right, thereby driving the tension roller 424 to move left and right to achieve tension adjustment; the guide plate 425 is perpendicular to the support vertical plate 421, and the upper end of the guide plate 425 is rotatably connected to the support vertical plate 421. The rotation axis of the guide plate 425 extends horizontally in the front-to-back direction, and the lower end of the guide plate 425 is connected to the support vertical plate 421. The end portion extends obliquely to the lower left, and the lower surface of the guide plate 425 (the surface facing the lower right) is provided with a plurality of adsorption holes (not shown in the figure). The adhesive tape 3 released from the tape material tray 422 passes over the adhesive tape roller 423 and the tension roller 424 (in no particular order) and is adsorbed on the lower surface of the guide plate 425 by the adsorption holes (the non-adhesive surface of the adhesive tape 3 faces the lower surface of the guide plate 425); the pulling component 426 is used to pull the adhesive tape 3 toward the lower left along the lower surface of the guide plate 425 to discharge the adhesive tape 3; the cutting component 427 is used to cut the adsorption holes. The adhesive tape 3 attached to the lower surface of the guide plate 425 keeps the adhesive tape 3 attached to the plate body 1 at a set length; the adhesive roller 428 is rotatably connected to the lower end of the guide plate 425 and suspended at the lower left of the guide plate 425, and the rotation axis of the adhesive roller 428 extends horizontally in the front-to-back direction, and the outer circumferential surface of the adhesive roller 428 is tangent to the plane where the lower surface of the guide plate 425 is located. The adhesive tape 3 pulled by the pulling component 426 bypasses the adhesive roller 428 and extends to the lower left, so that the end 4 of the adhesive tape 3 is located on the left side of the adhesive roller 428; The cylinder 429 is arranged on the left side of the guide plate 425, the cylinder body 4291 of the reverse pull cylinder 429 is rotatably connected with the support vertical plate 421, the cylinder rod 4292 of the reverse pull cylinder 429 extends obliquely to the lower right, the end of the cylinder rod 4292 is rotatably connected with the upper surface of the guide plate 425, and the rotation axis of the cylinder body 4291 and the cylinder rod 4292 extends horizontally in the front-rear direction; when the base 41 moves downward to make the support vertical plate 421 move upward to the extreme position relative to the base 41, the glue pressing roller 428 will bypass its own glue The tape 3 is attached to the plate body 1; when the cylinder rod 4292 of the reverse pull cylinder 429 is retracted, the lower end of the guide plate 425 can rotate upward in the clockwise direction. At the same time, the support vertical plate 421 moves downward relative to the base 41 under the action of gravity, eliminating the up and down movement component of the glue pressing roller 428 when it moves obliquely, so that the glue pressing roller 428 can achieve horizontal rolling to the left, thereby pressing the end 4 of the tape 3 against the edge of the plate body 1 to achieve one-time rolling (reverse); when the cylinder rod 4292 of the reverse pull cylinder 429 is extended, the guide plate 4 The lower end of 25 can be rotated downward in the counterclockwise direction to lift the supporting vertical plate 421 upward to the limit position relative to the base 41, eliminating the up and down movement component of the glue pressing roller 428 when it moves obliquely, so that the glue pressing roller 428 can achieve horizontal rolling to the right, and press the end 4 of the tape 3 against the edge of the plate body 1 again to achieve secondary rolling (positive); after the secondary rolling is completed, the base 41 moves to the right, and the glue pressing roller 428 can cooperate with the cutting component 427 to press the other end of the tape 3 against the plate body 1 to complete the tape sticking operation.

这样设置的好处在于:The advantages of this setting are:

在进行贴胶带作业时,可通过反拉气缸429的动作,配合支撑竖板421的上下移动,使压胶辊428对胶带3的端头4实现一反一正两次滚压,从而确保胶带3的端头4与板体1边缘黏贴的牢固程度,避免后续胶带3放料时出现歪斜,提高芯片封装载具的生产良率。When the tape is applied, the action of the reverse-pull cylinder 429 and the up-and-down movement of the support vertical plate 421 can be coordinated to enable the glue pressing roller 428 to roll the end 4 of the tape 3 twice, one in reverse and one in forward direction, thereby ensuring the firmness of the adhesion between the end 4 of the tape 3 and the edge of the plate 1, avoiding the subsequent skewness of the tape 3 during unloading, and improving the production yield of the chip packaging carrier.

在本实施例中,产品输送线50位于贴胶台20的右侧,产品输送线50包括两条平行设置的第二皮带线51,承载板22的转动角度等于180度,当承载板22转动至极限位置时,承载板22能够将其上放置的已贴好胶带3的板体1(芯片封装载具)翻转至产品输送线50上,使已贴好胶带3的板体1翻转后架设在两条第二皮带线51上,方便运输,并使胶带3的带胶面从板体1上的通孔露出,方便后续芯片的粘贴作业;需要说明的是,在承载板22翻转时,抵紧块24必然向左移动避免干涉,因而,翻转过程中,承载板22上的负压孔需要保持负压,避免板体1与承载板22出现相对移动,同时,在板体1放置在承载板22上且抵紧块24未抵紧时,也需要使负压孔保持负压,将板体1吸附在承载板22的表面。In this embodiment, the product conveyor line 50 is located on the right side of the glue sticking station 20. The product conveyor line 50 includes two parallel second belt lines 51. The rotation angle of the carrier plate 22 is equal to 180 degrees. When the carrier plate 22 rotates to the extreme position, the carrier plate 22 can flip the board body 1 (chip packaging carrier) with the tape 3 placed thereon to the product conveyor line 50, so that the board body 1 with the tape 3 is flipped and mounted on the two second belt lines 51 for convenient transportation, and the adhesive surface of the tape 3 is exposed from the through hole on the board body 1, which is convenient for the subsequent chip pasting operation; it should be noted that when the carrier plate 22 is flipped, the pressing block 24 must move to the left to avoid interference. Therefore, during the flipping process, the negative pressure hole on the carrier plate 22 needs to maintain negative pressure to avoid relative movement between the board body 1 and the carrier plate 22. At the same time, when the board body 1 is placed on the carrier plate 22 and the pressing block 24 is not pressed tightly, it is also necessary to keep the negative pressure hole at negative pressure to adsorb the board body 1 on the surface of the carrier plate 22.

为实现支撑竖板421与滑座41的滑动连接,在本实施例中,基座41上连接有滑套411,支撑竖板421上设有竖直杆座4211,竖直杆座4211内锁紧有向上延伸的竖直杆4212,竖直杆4212的上端部可上下滑动地穿设在滑套411内(可通过竖直杆外壁凸棱与滑套内壁滑槽的配合,使竖直杆与滑套只能上下滑动),竖直杆4212的上端设有直径变大的环状凸缘4213,环状凸缘4213位于滑套411的上方,这样设置还可通过环状凸缘4213及竖直杆座4211与滑套411上下端面的抵紧,限定支撑竖板421相对于滑座41上下滑动的极限位置,结构简单,使用效果好。In order to realize the sliding connection between the support vertical plate 421 and the sliding seat 41, in the present embodiment, a sliding sleeve 411 is connected to the base 41, and a vertical rod seat 4211 is provided on the support vertical plate 421, and a vertical rod 4212 extending upward is locked in the vertical rod seat 4211, and the upper end of the vertical rod 4212 can be slidably arranged in the sliding sleeve 411 (the vertical rod outer wall convex ridge and the sliding groove of the inner wall of the sliding sleeve can cooperate to make the vertical rod and the sliding sleeve only slide up and down), and the upper end of the vertical rod 4212 is provided with an annular flange 4213 with an enlarged diameter, and the annular flange 4213 is located above the sliding sleeve 411. Such an arrangement can also limit the extreme position of the support vertical plate 421 sliding up and down relative to the sliding seat 41 through the abutment between the annular flange 4213 and the vertical rod seat 4211 and the upper and lower end surfaces of the sliding sleeve 411, and the structure is simple and the use effect is good.

优选地,气缸杆4292的端部通过延长杆4293与导料板425的上表面转动连接,延长杆4293与气缸杆4292同轴,延长杆4293与导料板425之间的夹角为50至70度,以实现反拉气缸429行程与反拉距离的兼顾,在本实施例中,该夹角为62度(反拉气缸429的气缸杆4292处于伸出状态下)。Preferably, the end of the cylinder rod 4292 is rotatably connected to the upper surface of the guide plate 425 through an extension rod 4293, the extension rod 4293 is coaxial with the cylinder rod 4292, and the angle between the extension rod 4293 and the guide plate 425 is 50 to 70 degrees, so as to achieve a balance between the stroke and the back-pull distance of the back-pull cylinder 429. In the present embodiment, the angle is 62 degrees (the cylinder rod 4292 of the back-pull cylinder 429 is in an extended state).

在本实施例中,拉料组件426包括拉料座4261、移动气缸4262、拉料板4263、转动气缸4264,拉料座4261通过移动气缸4262可移动地连接在导料板425的下方,拉料座4261的移动方向平行于导料板425的下表面,拉料板4263通过转动气缸4264可转动地连接在拉料座4261的侧壁并位于导料板425的下方,拉料板4263朝向导料板425的侧面设有压胶凸台4265,压胶凸台4265位于拉料板4263转动轴心线的下方,拉料板4263具有第一工作位置和第二工作位置,在拉料板4263处于第一工作位置时,拉料板4263向靠近导料板425的方向转动,使压胶凸台4265压紧吸附在导料板425下表面的胶带3的带胶面,此时,配合移动气缸4262动作,即可通过拉料座4261向左下方的移动,将胶带3沿导料板5的下表面向左下方拉动,实现送料,在拉料板4263处于第二工作位置时,拉料板4263向远离导料板425的方向转动,使压胶凸台4265与导料板425下表面吸附的胶带3相脱离,此时,配合移动气缸4262动作,即可通过拉料座4261向右上方的移动,实现复位。In this embodiment, the material pulling assembly 426 includes a material pulling seat 4261, a movable cylinder 4262, a material pulling plate 4263, and a rotating cylinder 4264. The material pulling seat 4261 is movably connected to the bottom of the material guide plate 425 through the movable cylinder 4262. The moving direction of the material pulling seat 4261 is parallel to the lower surface of the material guide plate 425. The material pulling plate 4263 is rotatably connected to the side wall of the material pulling seat 4261 through the rotating cylinder 4264 and is located below the material guide plate 425. The material pulling plate 4263 is provided with a glue pressing boss 4265 on the side facing the material guide plate 425. The glue pressing boss 4265 is located below the rotation axis of the material pulling plate 4263. The material pulling plate 4263 has a first working position and a second working position. When plate 4263 is in the first working position, the pulling plate 4263 rotates in the direction close to the guide plate 425, so that the glue pressing boss 4265 presses the adhesive surface of the tape 3 adsorbed on the lower surface of the guide plate 425. At this time, in conjunction with the action of the moving cylinder 4262, the pulling seat 4261 can be moved to the lower left to pull the tape 3 along the lower surface of the guide plate 5 to the lower left to achieve feeding. When the pulling plate 4263 is in the second working position, the pulling plate 4263 rotates in the direction away from the guide plate 425, so that the glue pressing boss 4265 is separated from the tape 3 adsorbed on the lower surface of the guide plate 425. At this time, in conjunction with the action of the moving cylinder 4262, the pulling seat 4261 can be moved to the upper right to achieve resetting.

为优化结构,减小在导料板425下方占用的空间,拉料板4263具有沿平行于导料板425下表面的方向延伸的基板4266和垂直连接在基板4266上并向右下方延伸的延伸部4267,基板4266的上端部可转动地连接在拉料座4261的侧壁上,基板4266的转动轴心线位于延伸部4267的上方,延伸部4267的下端与转动气缸4264的气缸杆转动连接,转动气缸4264的缸体转动连接在拉料座4261上,转动气缸4264缸体的转动轴心线位于拉料板4263的上方。In order to optimize the structure and reduce the space occupied under the material guide plate 425, the pulling plate 4263 has a base plate 4266 extending in a direction parallel to the lower surface of the material guide plate 425 and an extension portion 4267 vertically connected to the base plate 4266 and extending to the lower right. The upper end of the base plate 4266 is rotatably connected to the side wall of the pulling seat 4261, and the rotation axis of the base plate 4266 is located above the extension portion 4267. The lower end of the extension portion 4267 is rotatably connected to the cylinder rod of the rotating cylinder 4264. The cylinder body of the rotating cylinder 4264 is rotatably connected to the pulling seat 4261, and the rotation axis of the cylinder body of the rotating cylinder 4264 is located above the pulling plate 4263.

为实现平整拉料、避免褶皱,在本实施例中,压胶凸台4265沿前后方向水平延伸,压胶凸台4265有两个并间隔设置,压胶凸台4265朝向导料板425表面为弧形面,在拉料板4263处于第一工作位置时,压胶凸台4265与导料板425上胶带3的带胶面线接触。In order to achieve smooth material pulling and avoid wrinkles, in the present embodiment, the glue pressing boss 4265 extends horizontally in the front-to-back direction, and there are two glue pressing bosses 4265 which are arranged at intervals. The glue pressing boss 4265 is an arc-shaped surface facing the surface of the material guide plate 425. When the material pulling plate 4263 is in the first working position, the glue pressing boss 4265 is in contact with the glue surface line of the tape 3 on the material guide plate 425.

进一步地,拉料组件426还包括连接在拉料板4263远离导料板425一侧的热风管4268,热风管4268自右上方向左下方倾斜延伸,热风管4268平行于基板4266,在拉料座4261向左下方移动至极限位置时,热风管4268的下端部对准绕过压胶辊428的胶带3的端头4并吹热风,使端头4飘起,避免贴胶带时,端头4出现反折现象,并活化胶带3的带胶面。Furthermore, the material pulling component 426 also includes a hot air pipe 4268 connected to the side of the material pulling plate 4263 away from the material guide plate 425. The hot air pipe 4268 extends obliquely from the upper right to the lower left. The hot air pipe 4268 is parallel to the base plate 4266. When the material pulling seat 4261 moves to the lower left to the extreme position, the lower end of the hot air pipe 4268 is aligned with the end 4 of the tape 3 bypassing the glue pressing roller 428 and blows hot air to make the end 4 float, thereby avoiding the end 4 from being folded back when the tape is applied, and activating the adhesive surface of the tape 3.

在本实施例中,切断组件427包括切刀4271和切刀气缸4272,切刀4271可移动地设置在导料板425上开设的切刀槽4251内,切刀气缸4272连接在导料板425的上表面用于驱动切刀4271沿切刀槽4251移动,切刀气缸4272为无杆气缸,切刀气缸4272上罩设有围板4273,反拉气缸429气缸杆4292上连接的延长杆4293的端部与围板4273转动连接。In this embodiment, the cutting assembly 427 includes a cutter 4271 and a cutter cylinder 4272. The cutter 4271 is movably arranged in a cutter groove 4251 opened on the guide plate 425. The cutter cylinder 4272 is connected to the upper surface of the guide plate 425 and is used to drive the cutter 4271 to move along the cutter groove 4251. The cutter cylinder 4272 is a rodless cylinder. A surrounding plate 4273 is provided on the cutter cylinder 4272. The end of the extension rod 4293 connected to the cylinder rod 4292 of the reverse pull cylinder 429 is rotatably connected to the surrounding plate 4273.

在本实施例中,板体输送线10、贴胶台20、夹送组件30、产品输送线50均有两组并沿前后方向间隔设置,板体贴胶带机构40仅有一组,通过基座41的前后移动,实现在两组贴胶台20上的贴胶带作业。In this embodiment, there are two groups of plate conveyor lines 10, glue sticking tables 20, clamping and conveying components 30, and product conveyor lines 50, which are spaced apart in the front-to-back direction. There is only one group of plate tape sticking mechanisms 40, and the tape sticking operation is realized on the two groups of glue sticking tables 20 by moving the base 41 forward and backward.

如图13所示,在另一实施例中,板体贴胶带机构40的竖直杆4212上还套设有弹簧4214,弹簧4214位于滑套411的下方,弹簧4214的两端部分别抵紧滑套411和竖直杆座4211,弹簧4213具有驱使竖直杆4212相对于滑套411向下滑动的趋势,这样设置的好处在于,能够通过弹簧4214提升压胶辊428的滚压力,并确保支撑竖板421相对于基座41的向下滑动。As shown in Figure 13, in another embodiment, a spring 4214 is also provided on the vertical rod 4212 of the plate body tape sticking mechanism 40, and the spring 4214 is located below the sliding sleeve 411. The two ends of the spring 4214 are respectively pressed against the sliding sleeve 411 and the vertical rod seat 4211. The spring 4213 has a tendency to drive the vertical rod 4212 to slide downward relative to the sliding sleeve 411. The advantage of such a setting is that the rolling pressure of the glue pressing roller 428 can be increased by the spring 4214, and the downward sliding of the supporting vertical plate 421 relative to the base 41 can be ensured.

上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人士能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围,凡根据本发明精神实质所作的等效变化或修饰,都应涵盖在本发明的保护范围之内。The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the contents of the present invention and implement them accordingly. They cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims (12)

1.一种板体贴胶带机构,包括:1. A board tape sticking mechanism, comprising: 基座,所述基座可前后、左右、上下移动的设置在芯片封装载具板体的上方;A base, which is movable forward, backward, left, right, and up and down and is disposed above the chip packaging carrier plate; 贴胶带单元,所述贴胶带单元包括支撑竖板、胶带料盘、胶带过辊、张力辊、导料板、拉料组件、切断组件和压胶辊,所述支撑竖板沿左右方向竖直延伸,所述支撑竖板的上端部连接在所述基座上,所述胶带料盘、所述胶带过辊、所述张力辊可转动地连接在所述支撑竖板的前表面,所述导料板垂直于所述支撑竖板,所述导料板的上端部与所述支撑竖板相连接,所述导料板的下端部向左下方倾斜延伸,所述导料板的下表面设有若干吸附孔,自所述胶带料盘放出的胶带绕过所述胶带过辊、所述张力辊后被所述吸附孔吸附在所述导料板的下表面,所述拉料组件用于沿所述导料板的下表面向左下方拉动所述胶带,所述切断组件用于切断吸附在所述导料板下表面的所述胶带;The adhesive tape unit comprises a supporting vertical plate, a tape material tray, a tape passing roller, a tension roller, a material guide plate, a material pulling component, a cutting component and a glue pressing roller, the supporting vertical plate extends vertically in the left and right directions, the upper end of the supporting vertical plate is connected to the base, the tape material tray, the tape passing roller and the tension roller are rotatably connected to the front surface of the supporting vertical plate, the material guide plate is perpendicular to the supporting vertical plate, the upper end of the material guide plate is connected to the supporting vertical plate, the lower end of the material guide plate extends obliquely to the left and lower sides, the lower surface of the material guide plate is provided with a plurality of adsorption holes, the adhesive tape released from the tape material tray passes around the tape passing roller and the tension roller and is adsorbed on the lower surface of the material guide plate by the adsorption holes, the material pulling component is used to pull the adhesive tape to the left and lower sides along the lower surface of the material guide plate, and the cutting component is used to cut the adhesive tape adsorbed on the lower surface of the material guide plate; 其特征在于:Features: 所述压胶辊可转动地连接在所述导料板的下端并悬于所述导料板的左下方,所述压胶辊的外圆周面与所述导料板的下表面相切,经所述拉料组件拉动的所述胶带绕过所述压胶辊后向左下方延伸,使所述胶带的端头位于所述压胶辊的左侧,所述支撑竖板的上端部与所述基座可上下滑动的连接,所述导料板的上端部与所述支撑竖板转动连接;The rubber pressing roller is rotatably connected to the lower end of the material guide plate and is suspended at the lower left side of the material guide plate. The outer circumferential surface of the rubber pressing roller is tangent to the lower surface of the material guide plate. The adhesive tape pulled by the material pulling assembly passes over the rubber pressing roller and then extends to the lower left side, so that the end of the adhesive tape is located on the left side of the rubber pressing roller. The upper end of the supporting vertical plate is connected to the base in an upward and downward sliding manner, and the upper end of the material guide plate is rotatably connected to the supporting vertical plate. 所述贴胶带单元还包括设于所述导料板左侧的反拉气缸,所述反拉气缸的缸体与所述支撑竖板转动连接,所述反拉气缸的气缸杆向右下方倾斜延伸,所述气缸杆的端部与所述导料板的上表面转动连接;The adhesive tape unit further comprises a back-pull cylinder disposed on the left side of the guide plate, the cylinder body of the back-pull cylinder being rotatably connected to the support vertical plate, the cylinder rod of the back-pull cylinder extending obliquely to the lower right, and the end of the cylinder rod being rotatably connected to the upper surface of the guide plate; 在所述基座向下移动使所述支撑竖板相对于所述基座向上移动至极限位置时,所述压胶辊将绕过其自身的所述胶带贴合在所述板体上,在所述反拉气缸的气缸杆缩回时,所述导料板的下端部沿顺势针方向向上转动,所述支撑竖板在重力作用下相对于所述基座向下移动,使所述压胶辊向左水平滚动,将所述胶带的所述端头压贴在所述板体的边缘,实现一次辊压,在所述反拉气缸的气缸杆伸出时,所述导料板的下端部沿逆时针方向向下转动,所述压胶辊向右滚动,再次将所述胶带的所述端头压贴在所述板体的边缘,实现二次辊压,并将所述支撑竖板相对于所述基座向上顶起至极限位置,在二次辊压完成后,所述基座向右移动,所述压胶辊配合所述切断组件动作将所述胶带的另一端头压贴至所述板体上,完成贴胶带作业。When the base moves downward and the supporting vertical plate moves upward to the limit position relative to the base, the glue pressing roller will bypass its own tape and stick it to the plate body. When the cylinder rod of the reverse pulling cylinder retracts, the lower end of the guide plate rotates upward along the clockwise direction. Under the action of gravity, the supporting vertical plate moves downward relative to the base, causing the glue pressing roller to roll horizontally to the left, pressing the end of the tape against the edge of the plate body to achieve a first rolling press. When the cylinder rod of the reverse pulling cylinder extends, the lower end of the guide plate rotates downward in the counterclockwise direction, and the glue pressing roller rolls to the right, pressing the end of the tape against the edge of the plate body again to achieve a second rolling press and lift the supporting vertical plate upward to the limit position relative to the base. After the second rolling press is completed, the base moves to the right, and the glue pressing roller cooperates with the cutting assembly to press the other end of the tape against the plate body to complete the tape sticking operation. 2.根据权利要求1所述的板体贴胶带机构,其特征在于:所述基座上连接有滑套,所述支撑竖板上设有竖直杆座,所述竖直杆座内锁紧有向上延伸的竖直杆,所述竖直杆的上端部可上下滑动地穿设在所述滑套内,所述竖直杆的上端设有直径变大的环状凸缘,所述环状凸缘位于所述滑套的上方。2. The plate tape sticking mechanism according to claim 1 is characterized in that: a sliding sleeve is connected to the base, a vertical rod seat is provided on the supporting vertical plate, a vertical rod extending upward is locked in the vertical rod seat, the upper end of the vertical rod can be slid up and down in the sliding sleeve, and an annular flange with an enlarged diameter is provided at the upper end of the vertical rod, and the annular flange is located above the sliding sleeve. 3.根据权利要求2所述的板体贴胶带机构,其特征在于:所述竖直杆上套设有弹簧,所述弹簧位于所述滑套的下方,所述弹簧的两端部分别抵紧所述滑套和所述竖直杆座,所述弹簧具有驱使所述竖直杆相对于所述滑套向下滑动的趋势。3. The plate tape sticking mechanism according to claim 2 is characterized in that: a spring is provided on the vertical rod, and the spring is located below the sliding sleeve, and the two ends of the spring are respectively pressed against the sliding sleeve and the vertical rod seat, and the spring has a tendency to drive the vertical rod to slide downward relative to the sliding sleeve. 4.根据权利要求1所述的板体贴胶带机构,其特征在于:所述气缸杆的端部通过延长杆与所述导料板的上表面转动连接,所述延长杆与所述气缸杆同轴,所述延长杆与所述导料板之间的夹角为50至70度。4. The plate tape sticking mechanism according to claim 1 is characterized in that: the end of the cylinder rod is rotatably connected to the upper surface of the guide plate through an extension rod, the extension rod is coaxial with the cylinder rod, and the angle between the extension rod and the guide plate is 50 to 70 degrees. 5.根据权利要求1所述的板体贴胶带机构,其特征在于:所述拉料组件包括拉料座、移动气缸、拉料板、转动气缸,所述拉料座通过所述移动气缸可移动地连接在所述导料板的下方,所述拉料座的移动方向平行于所述导料板的下表面,所述拉料板通过所述转动气缸可转动地连接在所述拉料座的侧壁并位于所述导料板的下方,所述拉料板朝向所述导料板的侧面设有压胶凸台,所述压胶凸台位于所述拉料板转动轴心线的下方,所述拉料板具有第一工作位置和第二工作位置,在所述拉料板处于第一工作位置时,所述拉料板向靠近所述导料板的方向转动,使所述压胶凸台压紧吸附在所述导料板下表面的所述胶带,在所述拉料板处于第二工作位置时,所述拉料板向远离所述导料板的方向转动,使所述压胶凸台与所述导料板下表面吸附的所述胶带相脱离。5. The plate body adhesive tape sticking mechanism according to claim 1 is characterized in that: the pulling material assembly comprises a pulling material seat, a movable cylinder, a pulling plate, and a rotating cylinder, the pulling material seat is movably connected to the bottom of the material guide plate by the movable cylinder, and the moving direction of the pulling material seat is parallel to the lower surface of the material guide plate, and the pulling material plate is rotatably connected to the side wall of the pulling material seat by the rotating cylinder and is located under the material guide plate, and the pulling plate is provided with a glue pressing boss on the side of the pulling plate facing the material guide plate, and the glue pressing boss is located below the rotation axis of the pulling plate, and the pulling plate has a first working position and a second working position. When the pulling plate is in the first working position, the pulling plate rotates in a direction close to the material guide plate so that the glue pressing boss presses the adhesive tape adsorbed on the lower surface of the material guide plate; when the pulling plate is in the second working position, the pulling plate rotates in a direction away from the material guide plate so that the glue pressing boss is separated from the adhesive tape adsorbed on the lower surface of the material guide plate. 6.根据权利要求5所述的板体贴胶带机构,其特征在于:所述拉料板具有沿平行于所述导料板下表面的方向延伸的基板和垂直连接在所述基板上并向右下方延伸的延伸部,所述基板的上端部可转动地连接在所述拉料座的侧壁上,所述延伸部的下端与所述转动气缸的气缸杆转动连接,所述转动气缸的缸体转动连接在所述拉料座上。6. The plate tape sticking mechanism according to claim 5 is characterized in that: the pulling plate has a base plate extending in a direction parallel to the lower surface of the guide plate and an extension portion vertically connected to the base plate and extending to the lower right; the upper end portion of the base plate is rotatably connected to the side wall of the pulling seat; the lower end of the extension portion is rotatably connected to the cylinder rod of the rotating cylinder; and the cylinder body of the rotating cylinder is rotatably connected to the pulling seat. 7.根据权利要求5所述的板体贴胶带机构,其特征在于:所述压胶凸台至少有两个并间隔设置,所述压胶凸台的表面为弧形面,在所述拉料板处于第一工作位置时,所述压胶凸台与所述胶带的带胶面线接触。7. The plate body tape sticking mechanism according to claim 5 is characterized in that: there are at least two glue pressing bosses and they are arranged at intervals, the surface of the glue pressing boss is an arc-shaped surface, and when the pulling plate is in the first working position, the glue pressing boss is in linear contact with the glue surface of the tape. 8.根据权利要求5所述的板体贴胶带机构,其特征在于:所述拉料组件还包括连接在所述拉料板远离所述导料板一侧的热风管,所述热风管自右上方向左下方倾斜延伸,在所述拉料座向左下方移动至极限位置时,所述热风管的下端部对准绕过所述压胶辊的胶带的端头。8. The plate body tape sticking mechanism according to claim 5 is characterized in that: the pulling component also includes a hot air duct connected to the side of the pulling plate away from the material guide plate, the hot air duct extends obliquely from the upper right to the lower left, and when the pulling seat moves to the lower left to the extreme position, the lower end of the hot air duct is aligned with the end of the tape bypassing the glue roller. 9.根据权利要求1所述的板体贴胶带机构,其特征在于:所述切断组件包括切刀和切刀气缸,所述切刀可移动地设置在所述导料板上开设的切刀槽内,所述切刀气缸连接在所述导料板的上表面用于驱动所述切刀沿所述切刀槽移动,所述切刀气缸为无杆气缸,所述切刀气缸上罩设有围板,所述反拉气缸的气缸杆端部与所述围板转动连接。9. The plate-body tape sticking mechanism according to claim 1 is characterized in that: the cutting assembly includes a cutter and a cutter cylinder, the cutter is movably arranged in a cutter groove opened on the material guide plate, the cutter cylinder is connected to the upper surface of the material guide plate to drive the cutter to move along the cutter groove, the cutter cylinder is a rodless cylinder, a surrounding plate is provided on the cutter cylinder, and the cylinder rod end of the back-pull cylinder is rotatably connected to the surrounding plate. 10.一种芯片封装载具加工设备,包括:10. A chip packaging carrier processing device, comprising: 板体输送线,所述板体输送线用于自左向右水平输送芯片封装载具的板体;A plate conveying line, which is used to convey the plate of the chip packaging carrier horizontally from left to right; 贴胶台,所述贴胶台设置在所述板体输送线的右侧;A gluing station, which is arranged on the right side of the plate conveying line; 夹送组件,所述夹送组件设于所述板体输送线的一侧,所述夹送组件用于夹持所述板体输送线上的所述板体并将其移动至所述贴胶台上;A clamping and conveying assembly, the clamping and conveying assembly is arranged on one side of the plate conveying line, and the clamping and conveying assembly is used to clamp the plate on the plate conveying line and move it to the glue sticking table; 其特征在于:Features: 所述芯片封装载具加工设备还包括权利要求1至9中任意一项所述的板体贴胶带机构,所述板体贴胶带机构设于所述贴胶台的上方。The chip packaging carrier processing equipment also includes the board taping mechanism described in any one of claims 1 to 9, and the board taping mechanism is arranged above the taping platform. 11.根据权利要求10所述的芯片封装载具加工设备,其特征在于:所述板体输送线包括两条平行设置的皮带线,和设于这两条所述皮带线之间的顶升组件,在所述板体输送到设定位置时,所述顶升组件将所述板体顶起,以方便所述夹送组件夹持;所述夹送组件包括可上下、左右移动的旋转台,及连接在所述旋转台上可左右开合的夹爪,在所述夹爪夹持住所述板体时,能够通过所述旋转台的转动使所述板体翻面。11. The chip packaging carrier processing equipment according to claim 10 is characterized in that: the plate conveying line includes two parallel belt lines, and a lifting assembly arranged between the two belt lines, when the plate is conveyed to a set position, the lifting assembly lifts the plate to facilitate clamping by the clamping assembly; the clamping assembly includes a rotating table that can move up and down and left and right, and a clamp connected to the rotating table that can open and close left and right, when the clamp clamps the plate, the plate can be turned over by rotating the rotating table. 12.根据权利要求10所述的芯片封装载具加工设备,其特征在于:所述贴胶台包括底座、承载板、定位块、抵紧块,所述承载板沿左右方向水平延伸,所述承载板的右端部可转动地连接在所述底座上,所述承载板用于放置所述板体,所述承载板上设有若干用于吸附所述板体的负压孔,所述定位块设置在所述承载板的上表面并靠近所述承载板的右端部,所述抵紧块可左右移动地连接在所述底座上并位于所述承载板的左侧。12. The chip packaging carrier processing equipment according to claim 10 is characterized in that: the glue sticking table includes a base, a carrying plate, a positioning block, and a tightening block, the carrying plate extends horizontally in the left and right directions, the right end of the carrying plate is rotatably connected to the base, the carrying plate is used to place the plate body, and the carrying plate is provided with a plurality of negative pressure holes for adsorbing the plate body, the positioning block is arranged on the upper surface of the carrying plate and close to the right end of the carrying plate, and the tightening block is connected to the base so as to be movably left and right and is located on the left side of the carrying plate.
CN202410748645.7A 2024-06-12 2024-06-12 Board adhesive tape sticking mechanism and chip packaging loader processing equipment Active CN118322541B (en)

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CN210650790U (en) * 2019-07-11 2020-06-02 无锡先导智能装备股份有限公司 Adhesive tape sticking device for ending adhesive tape
CN113013473A (en) * 2021-02-24 2021-06-22 珠海华实医疗设备有限公司 Battery tab bending, insulating sheet pasting and adhesive tape pasting all-in-one machine and working method thereof
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